APX9150 [ANPEC]
Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor;
| 型号： | APX9150 |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor |
| 文件： | 总16页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APX9150
Single-Phase Full-Wave Motor Driver with Built-in Hall Sensor
Features
General Description
The APX9150 is an integrated Hall Effect Sensor IC de-
signed for electric commutation of single-phase DC
•
•
•
•
•
•
•
•
•
•
•
On-chip Hall Sensor
PWM Soft Switch
brushless motor applications. The device is built-in lock
protection. When fan is locked, the device will enter the
lock protection mode. It is also with thermal shutdown
function. The APX9150 is available in a low cost TSOT23-
6F package.
High Sensitivity Hall Effect Sensor IC: ±10G(typ.)
Built-in Lock Protection and Auto Restart Function
Built-In Quick Start Function
Speed Controllable by PWM Input Signal
Built-In 50% Duty Force Start Function
FG (Rotation Speed Detection) Output
Built-in Thermal Protection Circuit
6 Pin TSOT23-6F Package
Lead Free and Green Devices Available
(RoHS Compliant)
Applications
•
•
Brushless DC Fans
Brushless DC Motors
Pin Configuration
APX9150
FG 1
GND 2
OUT1 3
6 VDD
5 PWM
4 OUT2
TSOT-23-6F
(TOP VIEW)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright
ANPEC Electronics Corp.
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Rev. A.3 - Nov., 2017
APX9150
Ordering and Marking I nform ation
APX9150
Package Code
CE : TSOT-23-6F
Assembly Material
Handling Code
Temperature Range
Package Code
Operating Ambient Temperature Range
I : -40 to 105 ℃
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APX9150 CE :
X50X
The last X is referred as Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maxim um Ratings (Note 1)
Symbol
Parameter
Rating
-0.3 to 7
-0.3 to 7
Unit
V
VDD
VDD Pin Supply Voltage (VDD to GND)
VOUT
Output Pin (OUT1, OUT2) Output Voltage
V
Output Pin (OUT1, OUT2) Maximum Output Current –Continuous
500
1000
IOUT
mA
Hold
IFG/RD
FG/RD Pin Output Sink Current
FG/RD Pin Output Voltage
20
-0.3 to 7
150
mA
V
TJ
Maximum Junction Temperature
Storage Temperature
oC
oC
oC
TSTG
TSOR
-65 to 150
260
Maximum Lead Soldering Temperature, 10 Seconds
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Therm al Characteristics
Symbol
Parameter
Typical Value
Unit
Thermal Resistance-Junction to Am bient (Note 2)
240
oC/W
θJA
TSOT-23-6F
TSOT-23-6F
Power Dissipation, TA = 25°C
PD
520
mW
Note 2 : The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD =(TJ – TA) / θJA; TJ = 150°C.
Exceeding the maximum allowable power dissipation will result in excessive die temperature.
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Rev. A.3 - Nov., 2017
APX9150
Recom m ended Operation Conditions
Symbol
Parameter
Range
1.8 to 6
Unit
V
VDD
VDD Supply Voltage
TA
Operating Ambient Temperature
Junction Temperature
-40 to 105
-40 to 125
oC
TJ
oC
Electrical Characteristics (TA=25°C, VDD=5V, unless otherwise noted)
APX9150
Typ.
Symbol
Parameter
Test Conditions
Unit
Min.
Max.
VDD > V DDH
,
High Voltage 50% Duty Start Up trigger
Level
-
-
3.8
V
Output Start Up Duty 50%(typ.)
VDDH
Hysteresis of VDDH
Operating Current
VDD Falling
Rotation Mode
PWM = 0
-
-
-
0.3
5
-
8
V
IDD1
IDD2
mA
μA
Standby Supply Current
90
120
IOUT=250mA,
Upper and Lower total
VO
Output Driver Saturation Voltage
FG/RD Pin Low Voltage
-
-
-
0.18
0.2
0.36
0.4
1
V
V
VFG/RD
IFGL/RDL
IFG =5mA
VFG =7V
FG/RD Pin Off Leakage Current
<0.1
μA
Pulse Mode PWM Input High Level
Voltage
Pulse Mode PWM Input Low Level
Voltage
VPWMH
VPWML
0.5xVDD
0
-
-
VDD+0.5
0.2xV DD
V
V
IPWML
TON
PWM Pin Low Input Current
Lock Detection On Time
VPWM=0
-
0.35
3.5
-
-25
0.5
5
-40
0.65
6.5
90
50
9
μA
sec
sec
ms
kHz
%
TOFF
TQS
Lock Detection Off Time
Quick Start Enable Tim e
66.5
-
FPWM
DST
PWM Input Frequency
0.2
6
Start Up PWM input Duty
-
OTS
Over Temperature Shutdown Threshold
Over Temperature Shutdown Hysteresis
-
165
30
-
oC
-
-
oC
(Note 3)
Magnetic Characteristics (TA=25°C, VDD=5V, unless otherwise noted)
APX9150
Typ.
10
Symbol
Parameter
Test Conditions
Unit
Min.
Max.
20
-0
Bop
Brp
Magnetic Operation Point
Magnetic Release Point
Magnetic Hysteresis
0
-20
-
Gauss
Gauss
Gauss
-10
Bhys
20
-
Note3 : For start up only.
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Rev. A.3 - Nov., 2017
APX9150
Typical Operating Characteristics
VDD Supply Current vs. VDD Supply Voltage
VDD Supply Current vs. VDD Supply Voltage
6.0
0.11
Operation Mode
Standby Mode
0.1
5.0
4.0
3.0
2.0
1.0
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VDD Supply Voltage(V)
1.8 2.4
3
3.6 4.2 4.8 5.4
6
VDD Supply Voltage(V)
Magnetic Switching Points vs.
VDD Supply Voltage
Magnetic Switching Points vs.
Junction Temperature
12
12
10
8
VDD = 5V
10
Bop
8
Bop
6
4
6
4
2
2
0
0
-2
-4
-2
-4
-6
-8
-10
-12
Brp
Brp
-6
-8
-10
-12
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
-50
0
50
100
150
VDD Supply Voltage(V)
Junction Temperature(oC)
Output Saturation Voltage vs.
Output Current
FG Pin Low Voltage vs. Sink Current
450
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD = 5V
400
350
300
250
200
150
100
50
Upper Side
VDD = 1.8V
VDD = 2V
V DD = 5V
Lower Side
0
0
200
400
600
800
1000
0
1
2
3
4
5
6
7
8
9
10
Output Current(mA)
FG Pin Sink Current(mA)
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Rev. A.3 - Nov., 2017
APX9150
Typical Operating Characteristics
Maximum Power Dissipation vs.
Ambient Temperature
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ambient Temperature(oC)
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Rev. A.3 - Nov., 2017
APX9150
Pin Description
TSOT-23-6F
PIN
FUNCTION
NO.
1
NAME
FG
Rotation Speed Output. This is an open-drain output.
2
GND
Ground of the IC.
H-bridge output connection. The output stage is a H-bridge formed by four transistors and four-protection
diode for switching applications.
3
4
OUT1
OUT2
H-bridge output connection. The output stage is a H-bridge formed by four transistors and four-protection
diode for switching applications.
5
6
PWM
VDD
PWM Signal Input Terminal.
Supply Voltage Input.
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Rev. A.3 - Nov., 2017
APX9150
Typical Application Circuit
PWM Signal
D1
VIN
6
5
4
C1 :
>1µF
VDD PWM OUT2
APX9150
FG
1
GND OUT1
2
3
10KΩ
RFG
Pull High
Voltage
Note: D1 is protect IC when reverse power input, and recommend to use schottky diode with lower Vth for low-voltage operation.
Note: The C1 value is adjusted by motor characteristic.
Block Diagram
VDD
PWM
VDD
PWM Control
Circuit
Voltage
Regulator
OUT2
OUT1
Hall
Plane
Logic Control
Citcuit
FG
Oscillator
GND
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Rev. A.3 - Nov., 2017
APX9150
Function Description
Output Switch Principle
The APX9150 built in a Hall-effect sensor plane to sense
the vertical magnetic flux density (B). There are two out-
put drivers in APX9150 to drive single-phase DC
brushless motor. When the N pole magnetic field close
to the IC marking surface and the magnetic flux density
higher than operate point (Bop), the OUT1 pin output will
turn to LOW and the OUT2 pin output will turn to HIGH.
When the N pole magnetic field far away the IC marking
surface and S pole magnetic field close to the IC marking
surface until the magnetic flux density higher than re-
lease point (Brp), the OUT1 pin output will turn HIGH and
the OUT2 pin output will turn LOW.
B=0
TOFF
TOFF
OUT2
TON
OUT1
FG
Brp
Bop
Lock Lock
Detection
Release Reset
S
N
N
S
Marking Surface
(TSOT-23-6)
Marking Surface
(TSOT-23-6)
Speed Control by Direct PWM Input Signal
Applying PWM pulses to the PWM pin directly, the duty
cycle of PWM pulses will control the output driver ON duty
directly. In PWM control, the high level of pulse signal
should be higher than 0.5 x VDD and the low level should
be lower than 0.2 x VDD. When the PWM pin is floating, the
output driver of APX9150 will be full duty to drive the motor.
VOUT1
VOUT1
B
B
Brp
Bop
Brp
Bop
Bhys
Bhys
VOUT2
VOUT2
B
B
Brp
Bop
Brp
Bop
Lockup Protection and Automatic Restart
The APX9150 detects the rotation of the motor by internal
hall sensor signal, and adjusts lock detection ON time
(TON) and lock detection OFF time (TOFF) by internal counter.
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Rev. A.3 - Nov., 2017
APX9150
Function Description ( Cont.)
PWM Soft-Switch Function
The APX9150 built in PWM soft-switch output control cir-
cuit to improve the vibration and noise of fan motor
operation. At start-up operation, If the voltage higher than
3.8V or at PWM mode, the APX9150 drive the output driver
by 50% duty square wave to force the fan motor start to
rotate. After several 50% duty square wave outputs, the
internal PWM soft-switch control circuit will be enable to
drive fan motor to improve vibration and noise.
Bop
B=0
Brp
OUT1
OUT2
FG
PWM Soft-Stwitch
Start-up operation
operation
Quick Start and Standby Mode
This IC would enter standby mode when the PWM input
keeps low level for then 66.5m(typ.). In standby mode, it
will shutdown amplifier and FG. In standby mode, the
lock protection function doesn’t work, therefore, starting
fan is unobstructed when releasing standby mode.
PWM
66.5ms
(typ.)
Lock protect
enable (internal)
enable
disable
enable
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Rev. A.3 - Nov., 2017
APX9150
Truth Table
Input
Output
Mode
B
PWM
H
OUT1
OUT2
FG
OFF
L
Bop
Brp
Bop
Brp
Bop
Brp
-
L
H
H
L
Operation Mode
L
L
OFF
L
L
L
L
L
L
OFF
OFF
OFF
-
Lock Mode
L
L
L
OFF
OFF
Standby Mode
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ANPEC Electronics Corp.
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Rev. A.3 - Nov., 2017
APX9150
Package I nform ation
TSOT-23-6F
D
c
e
e1
6
5
4
Sensor Location
1
2
3
1.02mm
b
Top view : Marking side
TSOT-23-6F
S
Y
M
B
O
L
MILLIMETERS
MAX.
INCHES
MIN.
0.70
0.30
0.08
2.80
3.70
1.50
MIN.
MAX.
0.031
0.020
0.009
0.118
0.154
0.067
A2
0.028
0.012
0.003
0.110
0.146
0.059
0.775
0.50
0.22
3.00
3.90
1.70
b
c
D
E
E1
e
0.95 BSC
1.90 BSC
0.037 BSC
0.075 BSC
e1
Note : 1. Dimension D and E1 do not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
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Rev. A.3 - Nov., 2017
APX9150
Carrier Tape & Reel Dim ensions
P0
P2
P1
OD0
A
K0
A0
A
OD1
B
B
SECTION A-A
SECTION B-B
d
T1
Application
TSOT-23-6F
A
H
T1
16.4+2.00 13.0+0.50
-0.00 -0.20
P2 D0
C
d
D
W
E1
F
5.5 ±0.10
K0
178.0±2.00
P0
50 MIN.
P1
1.5 MIN.
D1
20.2 MIN. 12.0 ±0.30 1.75±0.10
T
A0
B0
1.5+0.10
-0.00
0.6+0.00
-0.40
4.0±0.10
4.0 ±0.10
2.0±0.05
1.0 MIN.
3.10±0.20 4.00±0.20 1.15±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
3000
TSOT-23-6F
Tape & Reel
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Rev. A.3 - Nov., 2017
APX9150
Taping Direction I nform ation
TSOT-23-6F
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
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Rev. A.3 - Nov., 2017
APX9150
Classification Profile
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Rev. A.3 - Nov., 2017
APX9150
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Temperature min (Tsmin
)
Temperature max (Tsmax
Time (Tsmin to Tsmax) (ts)
)
Average ramp-up rate
(Tsmax to TP)
3 °C/second max.
3 °C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body Temperature
(Tp)*
See Classification Temp in table 1
20** seconds
See Classification Temp in table 2
30** seconds
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax
)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Volume mm3
≥350
Package
Thickness
<2.5 mm
Volume mm3
<350
235 °C
220 °C
≥2.5 mm
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mm3
Volume mm3
350-2000
260 °C
Volume mm3
<350
>2000
260 °C
245 °C
245 °C
260 °C
260 °C
250 °C
1.6 mm – 2.5 mm
≥2.5 mm
250 °C
245 °C
Reliability Test Program
Test item
Method
JESD-22, B102
JESD-22, A108
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
SOLDERABILITY
HOLT
PCT
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
TCT
HBM
VMM≧200V
MM
10ms, 1tr≧100mA
Latch-Up
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Rev. A.3 - Nov., 2017
APX9150
Custom er Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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Rev. A.3 - Nov., 2017
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