AOI5N40 [AOS]

400V,4.2A N-Channel MOSFET; 400V , 4.2A N沟道MOSFET
AOI5N40
型号: AOI5N40
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

400V,4.2A N-Channel MOSFET
400V , 4.2A N沟道MOSFET

文件: 总6页 (文件大小:478K)
中文:  中文翻译
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AOD5N40/AOI5N40  
400V,4.2A N-Channel MOSFET  
General Description  
Product Summary  
The AOD5N40 & AOI5N40 have been fabricated using an  
advanced high voltage MOSFET process that is designed  
to deliver high levels of performance and robustness in  
popular AC-DC applications.  
By providing low RDS(on), Ciss and Crss along with  
guaranteed avalanche capability these parts can be  
adopted quickly into new and existing offline power supply  
designs.  
VDS  
500V@150  
4.2A  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
< 1.6  
100% UIS Tested!  
100% Rg Tested!  
TO252  
DPAK  
TO251A  
IPAK  
D
Top View  
Bottom View  
Top View  
Bottom View  
D
D
G
G
S
G
S
S
D
D
S
S
G
G
AOI5N40  
AOD5N40  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
400  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
±30  
TC=25°C  
4.2  
Continuous Drain  
CurrentB  
ID  
TC=100°C  
2.8  
A
Pulsed Drain Current C  
IDM  
10  
Avalanche Current C  
IAR  
1.7  
A
Repetitive avalanche energy C  
EAR  
EAS  
dv/dt  
43  
mJ  
Single pulsed avalanche energy H  
Peak diode recovery dv/dt  
TC=25°C  
86  
5
mJ  
V/ns  
W
W/ oC  
78  
PD  
Power Dissipation B  
Derate above 25oC  
0.63  
Junction and Storage Temperature Range  
TJ, TSTG  
-50 to 150  
°C  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds  
TL  
300  
°C  
Thermal Characteristics  
Parameter  
Symbol  
RθJA  
Typical  
Maximum  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A,G  
38  
-
55  
0.5  
1.6  
Maximum Case-to-sink A  
Maximum Junction-to-CaseD,F  
RθCS  
RθJC  
1.33  
Rev1: Jan 2012  
www.aosmd.com  
Page 1 of 6  
AOD5N40/AOI5N40  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250A, VGS=0V, TJ=25°C  
ID=250A, VGS=0V, TJ=150°C  
400  
BVDSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Zero Gate Voltage Drain Current  
500  
0.4  
V
BVDSS  
/TJ  
V/ oC  
ID=250A, VGS=0V  
VDS=400V, VGS=0V  
VDS=320V, TJ=125°C  
VDS=0V, VGS=±30V  
VDS=5V ID=250µA  
VGS=10V, ID=1A  
VDS=40V, ID=1A  
1
IDSS  
µA  
10  
IGSS  
VGS(th)  
RDS(ON)  
gFS  
Gate-Body leakage current  
Gate Threshold Voltage  
±100  
4.5  
nΑ  
V
3.4  
4
Static Drain-Source On-Resistance  
Forward Transconductance  
Diode Forward Voltage  
1.25  
5
1.6  
S
IS=1A,VGS=0V  
VSD  
0.77  
1
V
IS  
Maximum Body-Diode Continuous Current  
Maximum Body-Diode Pulsed Current  
4.2  
10  
A
ISM  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
260  
25  
1.5  
2
331  
42  
3
400  
60  
5.5  
6
pF  
pF  
pF  
V
GS=0V, VDS=25V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
4
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
5.5  
1.5  
1
6.9  
2.0  
8.5  
2.5  
3.5  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=320V, ID=4.2A  
Gate Source Charge  
Gate Drain Charge  
2.3  
Turn-On DelayTime  
16.5  
15  
VGS=10V, VDS=200V, ID=4.2A,  
Turn-On Rise Time  
RG=25Ω  
tD(off)  
tf  
Turn-Off DelayTime  
24  
Turn-Off Fall Time  
11.5  
160  
0.93  
trr  
IF=4.2A,dI/dt=100A/µs,VDS=100V  
IF=4.2A,dI/dt=100A/µs,VDS=100V  
125  
0.7  
200  
1.2  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
µC  
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=150°C in a TO252 package, using junction-to-case thermal resistance, and is more useful in  
setting the upper dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=150°C.  
G.These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
H. L=60mH, IAS=1.7A, VDD=150V, RG=10, Starting TJ=25°C  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev1: Jan 2012  
www.aosmd.com  
Page 2 of 6  
AOD5N40/AOI5N40  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
8
6
4
2
0
100  
10V  
VDS=40V  
-55°C  
7V  
10  
125°C  
6V  
1
0.1  
0.01  
25°C  
VGS=5.5V  
25  
0
5
10  
15  
20  
30  
2
4
6
8
10  
VDS (Volts)  
Fig 1: On-Region Characteristics  
VGS(Volts)  
Figure 2: Transfer Characteristics  
2.5  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
VGS=10V  
ID=1A  
2
1.5  
1
VGS=10V  
0.5  
0
0
2
4
6
8
10  
-100  
-50  
0
50  
100  
150  
200  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and Ga
Voltage  
1.2  
1.0E+01  
1.0E+00  
125°C  
1.1  
1
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
25°C  
0.9  
0.8  
-100  
-50  
0
50  
TJ (oC)  
Figure 5: Break Down vs. Junction Temperature  
100  
150  
200  
0.2  
0.4  
0.6  
0.8  
1.0  
VSD (Volts)  
Figure 6: Body-Diode Characteristics  
Rev1: Jan 2012  
www.aosmd.com  
Page 3 of 6  
AOD5N40/AOI5N40  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
1000  
100  
10  
Ciss  
VDS=320V  
ID=4.2A  
Coss  
6
Crss  
3
0
1
0
2
4
6
8
10  
0.1  
1
10  
100  
VDS (Volts)  
Qg (nC)  
Figure 8: Capacitance Characteristics  
Figure 7: Gate-Charge Characteristics  
100  
800  
600  
400  
200  
0
10  
1
TJ(Max)=150°C  
TC=25°C  
10µs  
RDS(ON)  
limited  
100µs  
1ms  
DC  
10ms  
0.1s  
0.1  
0.01  
TJ(Max)=150°C  
TC=25°C  
1
10  
100  
1000  
0.0001  
0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJC=1.6°C/W  
1
0.1  
PD  
0.01  
0.001  
Single Pulse  
Ton  
T
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev1: Jan 2012  
www.aosmd.com  
Page 4 of 6  
AOD5N40/AOI5N40  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
80  
70  
60  
50  
40  
30  
20  
10  
0
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
TCASE (°C)  
TCASE (°C)  
Figure 12: Power De-rating (Note B)  
Figure 13: Current De-rating (Note B)  
1000  
800  
600  
400  
200  
0
TJ(Max)=150°C  
TA=25°C  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=55°C/W  
0.1  
PD  
0.01  
Ton  
T
Single Pulse  
0.001  
0.001  
1E-05  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)  
Rev1: Jan 2012  
www.aosmd.com  
Page 5 of 6  
AOD5N40/AOI5N40  
Gate Charge Test Circuit &Waveform  
Vgss  
Qgg  
10V  
+
VDC  
+
Vdds  
Q
g
s
Qggd  
VDCC  
-
-
DUTT  
Vgss  
Igg  
Chharge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vdds  
Vdds  
90%  
10%  
+
Vddd  
DUUT  
Vgss  
VDCC  
Rgg  
-
Vgss  
Vgss  
t d(on)  
t
r
t d(off)  
t
f
t on  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
2
EAR=1/2 LI  
AR  
BVDSS  
Vds  
Id  
Vds  
+
Vgs  
Vdd  
IAR  
Vgs  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode RecoveryTestCircuit &Waveforms  
Qrr=- Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
Isd  
trr  
L
IF  
Isd  
dI/dt  
+
IRM  
Vdd  
Vgs  
VDC  
Vdd  
-
Vds  
Rev1: Jan 2012  
www.aosmd.com  
Page 6 of 6  

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