AON4807 [AOS]

30V Dual P-Channel MOSFET; 双路30V P沟道MOSFET
AON4807
型号: AON4807
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

30V Dual P-Channel MOSFET
双路30V P沟道MOSFET

文件: 总5页 (文件大小:308K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AON4807  
30V Dual P-Channel MOSFET  
General Description  
Product Summary  
VDS  
-30V  
The AON4807 combines advanced trench MOSFET  
technology with a low resistance package to provide  
extremely low RDS(ON). This device is ideal for load switch  
and battery protection applications.  
ID (at VGS=-10V)  
RDS(ON) (at VGS=-10V)  
RDS(ON) (at VGS =-4.5V)  
-4A  
< 68m  
< 105mΩ  
DFN 3x2A  
D1  
D2  
Top View  
Bottom View  
Top View  
S1  
G1  
S2  
1
2
3
4
8
7
6
5
D1  
D1  
D2  
D2  
G2  
G2  
G1  
S2  
S1  
Pin 1  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
VDS  
-30  
V
Gate-Source Voltage  
VGS  
±20  
-4  
V
A
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
ID  
-3  
Pulsed Drain Current C  
IDM  
PD  
-18  
TA=25°C  
TA=70°C  
1.9  
W
°C  
Power Dissipation B  
1.2  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
Max  
65  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Lead  
t
10s  
51.5  
82  
37  
RθJA  
Steady-State  
Steady-State  
100  
50  
RθJL  
Rev 1: July 2012  
www.aosmd.com  
Page 1 of 5  
AON4807  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=-250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
-30  
V
VDS=-30V, VGS=0V  
-1  
µA  
-5  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
VDS=0V, VGS=±20V  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
-2.3  
nA  
V
VGS(th)  
ID(ON)  
VDS=VGSID=-250µA  
-1.3  
-18  
-1.8  
VGS=-10V, VDS=-5V  
VGS=-10V, ID=-4A  
A
54  
76  
68  
95  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
VGS=-4.5V, ID=-3A  
80  
105  
mΩ  
S
VDS=-5V, ID=-4A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
8
IS=-1A,VGS=0V  
-0.78  
-1  
V
Maximum Body-Diode Continuous Current  
-2.5  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
290  
60  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
40  
VGS=0V, VDS=0V, f=1MHz  
16  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
5.8  
2.8  
1.1  
1.3  
6
10  
6
nC  
nC  
nC  
nC  
ns  
Qg(4.5V) Total Gate Charge  
VGS=-10V, VDS=-15V, ID=-4A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
VGS=-10V, VDS=-15V,  
5
ns  
RL=3.75, RGEN=3Ω  
tD(off)  
tf  
21  
9
ns  
ns  
trr  
IF=-4A, dI/dt=100A/µs  
IF=-4A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
10  
20  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
value in any given application depends on the user's specific board design.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using 10s junction-to-ambient thermal resistance.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep  
initialTJ=25°C.  
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with  
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 1: July 2012  
www.aosmd.com  
Page 2 of 5  
AON4807  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
20  
15  
10  
5
10  
8
-10V  
-6V  
VDS=-5V  
-4.5V  
-4V  
6
4
125°C  
-3.5V  
2
25°C  
VGS=-3V  
4
0
0
0
1
2
3
4
5
0
1
2
3
5
-VGS(Volts)  
Figure 2: Transfer Characteristics (Note E)  
-VDS (Volts)  
Fig 1: On-Region Characteristics (Note E)  
110  
100  
90  
1.6  
VGS=-10V  
ID=-4A  
1.4  
1.2  
1
VGS=-4.5V  
80  
70  
VGS=-4.5V  
ID=-3A  
60  
50  
VGS=-10V  
0.8  
40  
0
25  
50  
75  
100  
125  
150  
175  
0
2
4
6
8
-ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
220  
180  
140  
100  
60  
1.0E+01  
ID=-4A  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
125°C  
125°C  
25°C  
25°C  
20  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
-VGS (Volts)  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 1: July 2012  
www.aosmd.com  
Page 3 of 5  
AON4807  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
400  
VDS=-15V  
ID=-4A  
350  
300  
250  
200  
150  
100  
50  
Ciss  
8
6
4
Coss  
2
Crss  
0
0
0
1
2
3
4
5
6
0
5
10  
15  
20  
25  
30  
-VDS (Volts)  
Figure 8: Capacitance Characteristics  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
10000  
1000  
100  
10  
100.0  
10.0  
1.0  
TA=25°C  
10µs  
RDS(ON)  
limited  
100µs  
1ms  
10ms  
0.1  
TJ(Max)=150°C  
TA=25°C  
10s  
DC  
1
0.0  
0.00001  
0.001  
0.1  
10  
1000  
0.01  
0.1  
1
10  
100  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=100°C/W  
1
0.1  
PD  
Single Pulse  
0.001  
0.01  
0.001  
Ton  
T
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 1: July 2012  
www.aosmd.com  
Page 4 of 5  
AON4807  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDC  
Qgs  
Qgd  
+
Vds  
VDC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
td(off)  
td(on)  
t
r
f
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
EAR= 1/2 LIA2R  
L
Vds  
Id  
Vgs  
Vds  
BVDSS  
Vgs  
Vdd  
+
VDC  
Id  
Rg  
I AR  
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Rev 1: July 2012  
www.aosmd.com  
Page 5 of 5  

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