AOP806 [AOS]

Dual N-Channel Enhancement Mode Field Effect Transistor; 双N沟道增强型场效应晶体管
AOP806
型号: AOP806
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

Dual N-Channel Enhancement Mode Field Effect Transistor
双N沟道增强型场效应晶体管

晶体 晶体管 场效应晶体管
文件: 总4页 (文件大小:110K)
中文:  中文翻译
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AOP806  
Dual N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOP806 uses advanced trench technology to  
provide excellent RDS(ON) and low gate charge.  
This device is suitable for use as a load switch or  
in PWM applications.  
Standard Product AOP806 is Pb-free (meets  
ROHS & Sony 259 specifications).  
VDS (V) = 75V  
ID = 3.4A (VGS = 10V)  
R
DS(ON) < 132m(VGS = 10V)  
DS(ON) < 168m(VGS = 4.5V)  
R
UIS TESTED!  
Rg,Ciss,Coss,Crss Tested  
D1  
S1  
D2  
1
2
3
4
8
7
6
5
S2  
G2  
S1  
G1  
D2  
D2  
D1  
D1  
G1  
G2  
S2  
PDIP-8  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Maximum  
Parameter  
Symbol  
VDS  
10 Sec  
Steady State  
Units  
Drain-Source Voltage  
75  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current AF  
±25  
15  
V
A
TA=25°C  
TA=70°C  
3.4  
2.7  
2.7  
2.1  
ID  
Pulsed Drain Current B  
IDM  
TA=25°C  
TA=70°C  
2.5  
1.6  
1.6  
1
PD  
W
Power Dissipation  
Avalanche Current B  
IAR  
10  
15  
A
Repetitive avalanche energy 0.3mH B  
EAR  
mJ  
°C  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
Max  
50  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
40  
67  
33  
t 10s  
Steady-State  
RθJA  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Lead C  
80  
Steady-State  
RθJL  
40  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOP806  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=10mA, VGS=0V  
VDS=75V, VGS=0V  
75  
V
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±25V  
100  
3
nA  
V
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
1
2.3  
V
GS=10V, VDS=5V  
GS=10V, ID=3.4A  
15  
A
V
108  
162  
128  
10  
132  
198  
168  
mΩ  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
VGS=4.5V, ID=2A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
VDS=5V, ID=3.4A  
IS=1A,VGS=0V  
S
V
A
0.77  
1
3
Maximum Body-Diode Continuous Current  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
290  
54  
380  
pF  
pF  
pF  
VGS=0V, VDS=30V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
24  
V
GS=0V, VDS=0V, f=1MHz  
2.4  
3.5  
7
SWITCHING PARAMETERS  
Qg(10V)  
Qg(4.5V)  
Qgs  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
5.1  
2.3  
1.0  
1.2  
4
nC  
nC  
nC  
nC  
ns  
VGS=10V, VDS=30V, ID=3.4A  
Qgd  
tD(on)  
tr  
tD(off)  
tf  
VGS=10V, VDS=30V, RL=8.8,  
3.4  
14.4  
2.4  
30.2  
21.5  
ns  
RGEN=3Ω  
ns  
ns  
trr  
IF=3.4A, dI/dt=100A/µs  
IF=3.4A, dI/dt=100A/µs  
45  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
nC  
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The  
value in any given application depends on the user's specific board design.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.  
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
F. The current rating is based on the t10s thermal resistance rating.  
Rev1: May. 2007  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOP806  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
15  
12  
9
6V  
10V  
4.5V  
VDS=5V  
4V  
125°C  
6
6
25°C  
3.5V  
3
3
0
0
0
1
2
3
4
5
1
2
3
GS(Volts)  
4
5
VDS (Volts)  
V
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
200  
170  
140  
110  
80  
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=3.4A  
VGS=4.5V  
VGS=4.5V  
ID=2A  
VGS=10V  
0.8  
0.6  
50  
0
2
4
6
8
10  
-50 -25  
0
25  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
50  
75 100 125 150 175  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage  
210  
180  
150  
120  
90  
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
ID=3.4A  
125°C  
125°C  
25°C  
25°C  
60  
2
4
6
8
10  
0.0  
0.2  
0.4  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
VGS (Volts)  
V
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOP806  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
500  
400  
300  
200  
100  
0
10  
VDS=30V  
ID=3.4A  
8
Ciss  
6
4
2
0
Coss  
Crss  
0
1
2
3
4
5
6
0
10  
20  
30  
VDS (Volts)  
40  
50  
60  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
50  
TJ(Max)=150°C TA=25°C  
TJ(Max)=150°C  
TA=25°C  
10µs  
40  
30  
20  
10  
0
100µs  
1ms  
10ms  
0.1s  
RDS(ON)  
limited  
DC  
10s  
1s  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
Pulse Width (s)  
V
DS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=80°C/W  
0.1  
PD  
Ton  
T
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
1
10  
100  
1000  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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