AOZ1213 [AOS]

EZBuck™ 3A Simple Buck Regulator with Linear Controller; EZBuckâ ?? ¢ 3A简单的降压稳压器与线性控制器
AOZ1213
型号: AOZ1213
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

EZBuck™ 3A Simple Buck Regulator with Linear Controller
EZBuckâ ?? ¢ 3A简单的降压稳压器与线性控制器

稳压器 控制器
文件: 总16页 (文件大小:648K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOZ1213  
EZBuck™ 3A Simple Buck Regulator  
with Linear Controller  
General Description  
Features  
The AOZ1213 is a high efficiency, simple to use, buck  
regulator plus one linear regulator controller optimized for  
a variety of applications.  
4.5V to 28V operating input voltage range  
Integrated linear regulator controller  
70minternal NFET, efficiency: up to 95%  
Internal soft start  
The AOZ1213 works from a 4.5V to 28V wide input  
voltage range. The buck regulator provides up to 3A of  
continuous output current. Each output voltage is  
adjustable down to 0.8V.  
Each output voltage adjustable down to 0.8V  
3A continuous output current  
Fixed 370kHz PWM operation  
Cycle-by-cycle current limit  
The AOZ1213 is available in a 4x3 DFN-12 package  
and can operate over a -40°C to +85°C ambient  
temperature range.  
Short-circuit protection  
Thermal shutdown  
Small size 4x3 DFN-12 packages  
Applications  
Point of load DC/DC conversion  
Set top boxes  
LCD Monitors & TVs  
Cable modems  
Telecom/Networking/Datacom equipment  
Typical Application  
VIN  
C5  
0.1µF  
C1  
C4  
22µF  
1µF  
L1  
6.8µH  
VIN  
EN  
VBIAS  
BS  
LX  
VOUT1  
VOUT1  
AOZ1213  
C6  
R1  
LDRV  
1µF  
31.6k  
C2, C3  
FB1  
GND  
22µF x 2  
FB2  
R3  
VOUT2  
10k  
AGND COMP  
R2  
10k  
C7  
4.7µF  
R4  
RC  
8.06k  
30k  
CC  
2.2nF  
Figure 1. Typical Application Circuit  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 1 of 16  
AOZ1213  
Ordering Information  
Part Number  
Ambient Temperature Range  
Package  
Environmental  
AOZ1213DI  
-40°C to +85°C  
4x3 DFN-12  
RoHS Compliant  
Green Product  
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.  
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.  
Pin Configuration  
LX  
LX  
1
2
3
4
5
6
12 IN  
IN  
11 BIAS  
10 AGND  
BST  
PGND  
EN  
9
8
7
LDRV  
FB2  
AGND  
FB1  
COMP  
DFN-12  
(Top View)  
Pin Description  
Pin Number  
Pin Name  
Pin Function  
1, 2  
3
LX  
Buck Regulator Switching Node.  
BST  
Buck Regulator Bootstrap Pin. BST is the high side driver supply. Connect a 0.1µF  
capacitor between BST and LX to form a bootstrap circuit.  
4
5
6
PGND  
EN  
Power Ground.  
Enable Input. EN is active high. Connect EN to IN if not used. Do not leave EN floating.  
FB1  
Buck Regulator Feedback Input. FB1 is regulated to 0.8V. Set the buck regulator output  
voltage using a resistive voltage divider.  
7
8
COMP  
FB2  
Buck Regulator Compensation Pin. COMP is the output of the internal transconductance  
error amplifier. Connect a RC network between COMP and GND to compensate the  
control loop.  
Linear Regulator Feedback Input. FB2 is regulated to 0.8V. Set the linear regulator  
output voltage using a resistive voltage divider.  
9
LDRV  
AGND  
BIAS  
IN  
Linear Regulator Drive Output. LDRV controls the gate of an external pass transistor.  
Analog Ground.  
10  
11  
12  
Internal Bias Regulator Output. Connect a 1µF between BIAS and GND.  
Input Supply Pin. The input range is between 4.5V and 28V.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 2 of 16  
AOZ1213  
Block Diagram  
VIN  
+5V  
VBIAS  
EN  
UVLO  
& POR  
5V LDO  
Regulator  
OTP  
+
ISen  
Reference  
& Bias  
Softstart  
BST  
LX  
ILimit  
Q1  
+
+
GM = 200A/V  
EAmp  
+
PWM  
Control  
Logic  
PWM  
Comp  
0.8V  
FB1  
COMP  
Q2  
370kHz Oscillator  
Short Detect  
Comparator  
+
0.3V  
GM = 2A/V  
+
EAmp2  
FB2  
UVP  
< 0.6V  
LDRV  
AGND  
PGND  
Absolute Maximum Ratings  
Recommend Operating Ratings  
Exceeding the Absolute Maximum Ratings may damage the  
device.  
The device is not guaranteed to operate beyond the Maximum  
Operating Ratings.  
Parameter  
Supply Voltage (VIN)  
Rating  
Parameter  
Supply Voltage (VIN)  
Rating  
30V  
4.5V to 28V  
0.8V to 0.85*VIN  
-40°C to +85°C  
LX to GND  
-0.7V to VIN + 0.3V  
-0.3V to VIN + 0.3V  
-0.3V to 6V  
Output Voltage Range  
EN to GND  
Ambient Temperature (TA)  
Package Thermal Resistance  
FB1, 2 to GND  
)
(2  
COMP to GND  
-0.3V to 6V  
4 x 3 DFN-12 (ΘJA  
4 x 3 DFN-12 (ΘJC  
)
64.6°C/W  
7.1°C/W  
)
BST to GND  
VLX + 6V  
LDRV to GND  
-0.3V to 6V  
-0.3V to 30V  
+150°C  
Note:  
2. The value of ΘJA is measured with the device mounted on 1-in2  
FR-4 board with 2oz. Copper, in a still air environment with TA = 25°C.  
The value in any given application depends on the user's specific board  
design.  
PG to GND  
Junction Temperature (TJ)  
Storage Temperature (TS)  
ESD Rating: Human Body Model(1)  
Note:  
-65°C to +150°C  
2kV  
1. Devices are inherently ESD sensitive, handling precautions are  
required. Human body model rating: 1.5kin series with 100pF.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 3 of 16  
AOZ1213  
Electrical Characteristics  
TA = 25°C, VIN = VEN = 12V, unless otherwise specified(3)  
Symbol  
Parameter  
Supply Voltage  
Conditions  
Min.  
4.5  
Typ.  
Max.  
Units  
VIN  
28  
V
V
VUVLO  
Input Under-Voltage Lockout  
Threshold  
VIN Rising  
IN Falling  
4.0  
3.7  
2
V
V
IIN  
Supply Current (Quiescent)  
Shutdown Supply Current  
Feedback Voltage  
IOUT = 0, VFB = 1.2V, VEN >2V  
VEN = 0V  
3
mA  
μA  
V
IOFF  
3
20  
VFB1, 2  
0.788  
0.8  
0.5  
0.1  
0.812  
Load Regulation  
%
Line Regulation  
%
IFB1  
ENABLE  
VEN  
Feedback Voltage Input Current  
200  
nA  
EN Input Threshold  
Off Threshold  
On Threshold  
0.6  
V
V
2.5  
VHYS  
EN input Hysteresis  
200  
mV  
nA  
IEN  
MODULATOR  
fO  
Enable Sink/Source current  
50  
Frequency  
315  
370  
85  
425  
kHz  
%
DMAX  
Maximum Duty Cycle  
Minimum Duty Cycle  
DMIN  
5
%
GVEA  
Error Amplifier Voltage Gain  
Error Amplifier Transconductance  
500  
200  
V / V  
μA / V  
GEA  
PROTECTION  
ILIM  
Current Limit  
4
4.5  
145  
100  
6
5
A
Over-Temperature Shutdown Limit  
TJ Rising  
TJ Falling  
°C  
°C  
ms  
tSS  
Soft Start Interval  
PWM OUTPUT STAGE  
RDS(ON) High-Side Switch On-Resistance  
High-Side Switch Leakage  
70  
100  
10  
mΩ  
VEN = 0V, VLX = 0V  
µA  
LINEAR CONTROLLER  
LDRV Vout Drive Output High Voltage  
Vfb2 = 0.7V, LDRV, Iout = 20mA,  
Iout1 = 0  
4
V
LDRV Iout  
Drive Output Current  
Under Voltage Threshold  
Line Regulation  
Vfb2 = 0.7V, Iout1 = 0  
10  
mA  
V
0.6  
0.5  
1
%
Load Regulation  
%
IFB2  
FB2 Leakage  
150  
nA  
Note:  
3. Specification in BOLD indicate an ambient temperature range of -40°C to +85°C. These specifications are guaranteed by design.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 4 of 16  
AOZ1213  
Typical Performance Characteristics  
Circuit of Figure 1. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.  
Efficiency  
Efficiency  
Efficiency  
(Vin = 24V, L = 6.8µH)  
(Vin = 12V, L = 6.8µH)  
(Vin = 5V, L = 6.8µH)  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
8.0V OUTPUT  
5.0V OUTPUT  
3.3V OUTPUT  
3.3V OUTPUT  
8.0V OUTPUT  
5.0V OUTPUT  
3.3V OUTPUT  
1.8V OUTPUT  
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
Load Current (A)  
Load Current (A)  
Load Current (A)  
Frequency vs. Temperature  
Frequency vs. Vin  
Soft Start Time  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH, 25°C)  
( Vin = 12V, Vout = 3.3V, L = 6.8µH, 25°C)  
390  
380  
370  
360  
350  
420  
400  
380  
360  
340  
320  
300  
8
7
6
5
4
3
2
1
0
5
10  
15  
Vin (V)  
20  
25  
30  
0
5
10  
15  
Vin (V)  
20  
25  
30  
-45 -30 -15  
0
15 30 45 60 75 90  
Temperature (°C)  
UVLO vs. Temperature  
Soft Start Time vs. Temperature  
Minimum Vin  
(Vin = 12V, Vout = 3.3V, L = 6.8µH, 25°C)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
(25°C)  
6.5  
6
15  
4.2  
4.1  
4
14  
13  
12  
11  
10  
9
8
7
6
5
12V OUTPUT  
Vin_rise  
3.9  
3.8  
3.7  
3.6  
3.5  
5.5  
5
Vin_fall  
5V OUTPUT  
3.3V OUTPUT  
4
3
4.5  
-45 -30 -15  
0
15 30 45 60 75 90  
-45 -30 -15  
0
15 30 45 60 75 90  
0
0.5  
1
1.5  
2
2.5  
3
Temperature (°C)  
Load (A)  
Temperature (°C)  
VFB1 vs. Vin  
Icc vs. Temperature  
Current Limit vs. Vin  
(Vin = 12V, Vout = 3.3V, L = 6.8µH, 25°C)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH, 25°C)  
2
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1
0.85  
0.84  
0.83  
0.82  
0.81  
0.8  
5.5  
5
4.5  
4
3.5  
3
0.79  
0.78  
0.77  
0.76  
0.75  
2.5  
2
4
6
8
10 12 14 16 18 20 22 24 26 28  
-45 -30 -15  
0
15 30 45 60 75 90  
4
6
8
10 12 14 16 18 20 22 24 26 28  
Temperature (°C)  
Vin (V)  
Vin (V)  
Rev. 1.3 November 2009  
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Page 5 of 16  
AOZ1213  
Typical Performance Characteristics (Continued)  
Circuit of Figure 1. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.  
Current Limit vs. Temperature  
VFB2 vs. Temperature  
VFB1 vs. Temperature  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
(Vin = 12V, Vout = 3.3V, L = 6.8µH)  
0.85  
0.84  
0.83  
0.82  
0.81  
0.8  
5.5  
5
0.85  
0.84  
0.83  
0.82  
0.81  
0.8  
4.5  
4
3.5  
3
0.79  
0.78  
0.77  
0.76  
0.75  
0.79  
0.78  
0.77  
0.76  
0.75  
2.5  
2
-45 -30 -15  
0
15 30 45 60 75 90  
-45 -30 -15  
0
15 30 45 60 75 90  
-45 -30 -15  
0
15 30 45 60 75 90  
Temperature (°C)  
Temperature (°C)  
Temperature (°C)  
EN vs. Vin  
EN On vs. Temperature  
EN Off vs. Temperature  
(Vin = 12V, Vout = 3.3V, L = 6.8µH, no load, 25°C)  
(Vout = 3.3V, L = 6.8µH)  
(Vout = 3.3V, L = 6.8µH)  
3
2.5  
2
2.5  
2.4  
2.3  
2.2  
2.1  
2
3
2.5  
2
24V INPUT  
En on  
En off  
12V INPUT  
5V INPUT  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
24V INPUT  
12V INPUT  
1.5  
1.5  
5V INPUT  
1
1
-45 -30 -15  
0
15 30 45 60 75 90  
4
6
8
10 12 14 16 18 20 22 24 26 28  
-45 -30 -15  
0
15 30 45 60 75 90  
Temperature (°C)  
Temperature (°C)  
Vin (V)  
LDRV Output Voltage vs. Source Current  
LDRV Source Current vs. Temperature  
EN Hysteresis vs Temperature  
(FB2 = 0.7V, 25°C)  
5
(VFB2 = 0.7V, LDRV = 4V)  
(Vout = 3.3V, L = 6.8µH)  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
40  
35  
30  
25  
20  
15  
10  
5
24V INPUT  
4
3
2
1
0
12V INPUT  
5V INPUT  
0
-45 -30 -15  
0
15 30 45 60 75 90  
-45 -30 -15  
0
15 30 45 60 75 90  
0
10  
20  
30  
40  
50  
60  
Temperature (°C)  
Temperature (°C)  
LDRV source Current (mA)  
Load Transient Response  
Load Transient Response  
(Iout = 0-1.5A, L = 6.8µH)  
(Iout = 1.5-3A, L = 6.8µH)  
Vo Ripple  
Vo Ripple  
200mV/Div  
200mV/Div  
Io  
1A/div  
Io  
1A/div  
200µs/div  
200µs/div  
Rev. 1.3 November 2009  
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Page 6 of 16  
AOZ1213  
Detailed Description  
The AOZ1213 is a current-mode step down regulator  
with integrated high side NMOS switch. It operates from  
a 4.5V to 28V input voltage range and supplies up to 3A  
of load current. The duty cycle can be adjusted from 5%  
to 85% allowing a wide range of output voltage. Features  
include enable control, Power-On Reset, input under  
voltage lockout, fixed internal soft-start and thermal shut  
down. The linear regulator controller is designed to drive  
an external NPN power transistor or an N channel power  
MOSFET to provide up to 1A of current to an auxiliary  
load.  
transconductance error amplifier. The error voltage,  
which shows on the COMP pin, is compared against the  
current signal, which is the sum of inductor current signal  
and ramp compensation signal, at PWM comparator  
input. If the current signal is less than the error voltage,  
the internal high-side switch is on. The inductor current  
flows from the input through the inductor to the output.  
When the current signal exceeds the error voltage, the  
high-side switch is off. The inductor current is  
freewheeling through the Schottky diode to output.  
Switching Frequency  
The AOZ1213 is available in 4X3 DFN-12 package.  
The AOZ1213 switching frequency is fixed and set by an  
internal oscillator. The switching frequency is set  
370kHz.  
Enable and Soft Start  
The AOZ1213 has internal soft start feature to limit  
in-rush current and ensure the output voltage ramps up  
smoothly to regulation voltage. A soft start process  
begins when the input voltage rises to 4.0V and voltage  
on EN pin is HIGH. In soft start process, the output  
voltage is ramped to regulation voltage in typically 6ms.  
The 6ms soft start time is set internally.  
Output Voltage Programming  
Output voltage can be set by feeding back the output to  
the FB pin with a resistor divider network. In the  
application circuit shown in Figure 1. The resistor divider  
network includes R and R . Usually, a design is started  
1
2
by picking a fixed R value and calculating the required  
2
R with equation below:  
1
Connect the EN pin to VIN if the enable function is not  
used. Pulling EN to ground will disable the AOZ1213.  
Do not leave it open. The voltage on EN pin must be  
above 2.5 V to enable the AOZ1213. When voltage on  
EN pin falls below 0.6V, the AOZ1213 is disabled. If an  
application circuit requires the AOZ1213 to be disabled,  
an open drain or open collector circuit should be used to  
interface to the EN pin.  
R
1
------  
V
= 0.8 × 1 +  
OUT1  
R
2
Some standard values of R , R for most commonly used  
output voltage values are listed in Table 1.  
1
2
Table 1.  
Steady-State Operation  
R1 (k)  
R2 (k)  
Vo (V)  
Under steady-state conditions, the converter operates in  
fixed frequency and Continuous-Conduction Mode  
(CCM).  
0.8  
1.2  
1.5  
1.8  
2.5  
3.3  
5.0  
12.0  
1.0  
4.99  
10  
Open  
10  
11.5  
10.2  
10  
The AOZ1213 integrates an internal N-MOSFET as the  
high-side switch. Inductor current is sensed by amplifying  
the voltage drop across the drain to the source of the  
high side power MOSFET. Since the N-MOSFET  
requires a gate voltage higher than the input voltage, a  
boost capacitor connected between LX pin and BST pin  
drives the gate. The boost capacitor is charged while LX  
is low. An internal 10¾ switch from LX to PGND is used  
to ensure that LX is pulled to PGND even with a light  
load. Output voltage is divided down by the external  
voltage divider at the FB pin. The difference of the FB pin  
voltage and reference is amplified by the internal  
12.7  
21.5  
31.6  
52.3  
140  
10  
10  
10  
The combination of R and R should be large enough to  
1
2
avoid drawing excessive current from the output, which  
will cause power loss.  
Rev. 1.3 November 2009  
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Page 7 of 16  
AOZ1213  
The FB2 voltage is monitored by an Under Voltage  
Protection circuit, which shutdown LDRV output when  
FB2 voltage is under 0.6V.  
Protection Features  
The AOZ1213 has multiple protection features to prevent  
system circuit damage under abnormal conditions.  
Thermal Protection  
Over Current Protection (OCP)  
An internal temperature sensor monitors the junction  
temperature. It shuts down the internal control circuit and  
high side NMOS if the junction temperature exceeds  
145°C. The regulator will restart automatically under the  
control of soft-start circuit when the junction temperature  
decreases to 100°C.  
The sensed inductor current signal is also used for over  
current protection. Since the AOZ1213 employs peak  
current mode control, the COMP pin voltage is  
proportional to the peak inductor current. The COMP pin  
voltage is limited to be between 0.4V and 2.5V internally.  
The peak inductor current is automatically limited cycle  
by cycle.  
Application Information  
The cycle by cycle current limit threshold is internally set.  
When the load current reaches the current limit  
The basic AOZ1213 application circuit is shown in  
Figure 1. Component selection is explained below.  
threshold, the cycle by cycle current limit circuit turns off  
the high side switch immediately to terminate the current  
duty cycle. The inductor current stop rising. The cycle by  
cycle current limit protection directly limits inductor peak  
current. The average inductor current is also limited due  
to the limitation on peak inductor current. When cycle by  
cycle current limit circuit is triggered, the output voltage  
drops as the duty cycle decreasing.  
Buck Regulator Design  
Input Capacitor  
The input capacitor (C in Figure 1) must be connected to  
1
the V pin and GND pin of the AOZ1213 to maintain  
IN  
steady input voltage and filter out the pulsing input  
current. The voltage rating of input capacitor must be  
greater than maximum input voltage plus ripple voltage.  
The AOZ1213 has internal short circuit protection to  
protect itself from catastrophic failure under output short  
circuit conditions. The FB pin voltage is proportional to  
the output voltage. Whenever FB pin voltage is below  
0.3V, the short circuit protection is triggered. To prevent  
current limit running away, when comp pin voltage is  
higher than 2.1V, the short circuit protection is also  
triggered. When the above conditions happen, PWM  
turns off immediately, after about 1mS the converter  
restarts via a soft start scheme. The short circuit  
protection process repeats until the short circuit condition  
disappears.  
The input ripple voltage can be approximated by  
equation below:  
I
V
V
O
O
O
-----------------  
--------  
--------  
ΔV  
=
× 1 –  
×
IN  
V
f × C  
V
IN  
IN  
IN  
Since the input current is discontinuous in a buck  
converter, the current stress on the input capacitor is  
another concern when selecting the capacitor. For a buck  
circuit, the RMS value of input capacitor current can be  
calculated by:  
Power-On Reset (POR)  
V
V
O
O
--------  
--------  
I
= I ×  
1 –  
A power-on reset circuit monitors the input voltage.  
When the input voltage exceeds 4.0V, the converter  
starts operation. When input voltage falls below 3.7V,  
the converter will stop switching.  
CIN_RMS  
O
V
V
IN  
IN  
if let m equal the conversion ratio:  
V
O
--------  
Linear Regulator  
= m  
V
IN  
The AOZ1213 contains an error amplifier which can be  
configured as a linear regulator controller. By adding an  
external follower (NPN or NMOS) and divider resistors as  
shown in Figure 1, the FB2 and LDRV pins can be  
configured as a controller for a Low Dropout Regulator.  
The relationship between the input capacitor RMS  
current and voltage conversion ratio is calculated and  
shown in Figure 2 on the next page. It can be seen that  
when V is half of V , C is under the worst current  
O
IN  
IN  
stress. The worst current stress on CIN is 0.5 x I .  
O
The LDRV pin source capability come from LDO inside  
which is capable more than 10mA of base current to the  
external NPN transistor.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 8 of 16  
AOZ1213  
Surface mount inductors in different shape and styles are  
available from Coilcraft, Elytone and Murata. Shielded  
inductors are small and radiate less EMI noise. But they  
cost more than unshielded inductors. The choice  
depends on EMI requirement, price and size.  
0.5  
0.4  
0.3  
0.2  
0.1  
0
ICIN_RMS(m)  
IO  
Output Capacitor  
The output capacitor is selected based on the DC output  
voltage rating, output ripple voltage specification and  
ripple current rating.  
0
0.5  
m
1
The selected output capacitor must have a higher rated  
voltage specification than the maximum desired output  
voltage including ripple. De-rating needs to be  
considered for long term reliability.  
Figure 2. ICIN vs. Voltage Conversion Ratio  
For reliable operation and best performance, the input  
capacitors must have current rating higher than I  
CIN_RMS  
at worst operating conditions. Ceramic capacitors are  
preferred for input capacitors because of their low ESR  
and high ripple current rating. Depending on the  
application circuits, other low ESR tantalum capacitor or  
aluminum electrolytic capacitor may also be used. When  
selecting ceramic capacitors, X5R or X7R type dielectric  
ceramic capacitors are preferred for their better  
temperature and voltage characteristics. Note that the  
ripple current rating from capacitor manufactures is  
based on certain amount of life time. Further de-rating  
may be necessary for practical design requirement.  
Output ripple voltage specification is another important  
factor for selecting the output capacitor. In a buck con-  
verter circuit, output ripple voltage is determined by  
inductor value, switching frequency, output capacitor  
value and ESR. It can be calculated by the equation  
below:  
1
-------------------------  
ΔV = ΔI × ESR  
+
O
L
CO  
8 × f × C  
O
where;  
CO is output capacitor value and  
Inductor  
ESRCO is the Equivalent Series Resistor of output capacitor.  
The inductor is used to supply constant current to output  
when it is driven by a switching voltage. For given input  
and output voltage, inductance and switching frequency  
together decide the inductor ripple current, which is,  
When a low ESR ceramic capacitor is used as the output  
capacitor, the impedance of the capacitor at the  
switching frequency dominates. Output ripple is mainly  
caused by capacitor value and inductor ripple current.  
The output ripple voltage calculation can be simplified to:  
V
V
O
O
----------  
--------  
ΔI  
=
× 1 –  
L
1
V
f × L  
IN  
-------------------------  
ΔV = ΔI ×  
O
L
8 × f × C  
O
The peak inductor current is:  
If the impedance of ESR at switching frequency  
ΔI  
L
dominates, the output ripple voltage is mainly decided by  
capacitor ESR and inductor ripple current. The output  
ripple voltage calculation can be further simplified to:  
--------  
I
= I +  
Lpeak  
O
2
High inductance gives low inductor ripple current but  
requires larger size inductor to avoid saturation. Low  
ripple current reduces inductor core losses. It also  
reduces RMS current through inductor and switches,  
which results in less conduction loss.  
ΔV = ΔI × ESR  
CO  
O
L
For lower output ripple voltage across the entire  
operating temperature range, X5R or X7R dielectric type  
of ceramic, or other low ESR tantalum capacitor or  
aluminum electrolytic capacitor may also be used as  
output capacitors.  
When selecting the inductor, make sure it is able to  
handle the peak current without saturation even at the  
highest operating temperature.  
The inductor takes the highest current in a buck circuit.  
The conduction loss on inductor needs to be checked for  
thermal and efficiency requirements.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 9 of 16  
AOZ1213  
In a buck converter, output capacitor current is  
continuous. The RMS current of output capacitor is  
decided by the peak to peak inductor ripple current. It can  
be calculated by:  
The compensation design is actually to shape the  
converter close loop transfer function to get desired gain  
and phase. Several different types of compensation  
network can be used for AOZ1213. For most cases, a  
series capacitor and resistor network connected to the  
COMP pin sets the pole-zero and is adequate for a stable  
high-bandwidth control loop.  
ΔI  
L
----------  
12  
I
=
CO_RMS  
In the AOZ1213, FB pin and COMP pin are the inverting  
input and the output of internal transconductance error  
amplifier. A series R and C compensation network  
connected to COMP provides one pole and one zero.  
The pole is:  
Usually, the ripple current rating of the output capacitor is  
a smaller issue because of the low current stress. When  
the buck inductor is selected to be very small and  
inductor ripple current is high, output capacitor could be  
overstressed.  
G
EA  
Schottky Diode Selection  
------------------------------------------  
f
=
P2  
2π × C × G  
The external freewheeling diode supplies the current to  
the inductor when the high side NMOS switch is off.  
To reduce the losses due to the forward voltage drop and  
recovery of diode, Schottky diode is recommended to  
use. The maximum reverse voltage rating of the chosen  
Schottky diode should be greater than the maximum  
input voltage and size for average forward current in  
normal condition. Average forward current can be  
calculated from:  
C
VEA  
where;  
GEA is the error amplifier transconductance, which is 200 x 10-6  
A/V,  
GVEA is the error amplifier voltage gain, which is 500 V/V, and  
CC is the compensation capacitor  
The zero given by the external compensation network,  
capacitor C and resistor R , is located at:  
I
O
C
C
--------  
I
=
(V V  
)
OUT  
D_AVE  
IN  
V
IN  
1
-----------------------------------  
=
f
Z2  
2π × C × R  
C
C
Loop Compensation  
The AOZ1213 employs peak current mode control for  
easy use and fast transient response. Peak current mode  
control eliminates the double pole effect of the output  
L&C filter. It greatly simplifies the compensation loop  
design.  
To design the compensation circuit, a target crossover  
frequency f for close loop must be selected. The system  
C
crossover frequency is where control loop has unity gain.  
The crossover frequency is also called the converter  
bandwidth. Generally a higher bandwidth means faster  
response to load transient. However, the bandwidth  
should not be too high due to system stability concern.  
When designing the compensation loop, converter  
stability under all line and load condition must be  
considered.  
With peak current mode control, the buck power stage  
can be simplified to be a one-pole and one-zero system  
in frequency domain. The pole is dominant pole and can  
be calculated by:  
1
----------------------------------  
f
=
p1  
Usually, it is recommended to set the bandwidth to be  
less than 1/10 of switching frequency. It is recommended  
to choose a crossover frequency less than 30kHz.  
2π × C × R  
O
L
The zero is a ESR zero due to output capacitor and its  
ESR. It is can be calculated by:  
f
= 30kHz  
C
1
------------------------------------------------  
f
=
Z1  
2π × C × ESR  
O
CO  
where;  
CO is the output filter capacitor,  
RL is load resistor value, and  
ESRCO is the equivalent series resistance of output capacitor.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 10 of 16  
AOZ1213  
The strategy for choosing R and C is to set the cross  
External NPN Pass Transistor or MOSFET  
C
C
over frequency with R and set the compensator zero  
C
Both Transistor and MOSFET can be used as an  
external follower. Some precautions must be followed:  
with C . Using selected crossover frequency, f , to  
C
C
calculate R :  
C
1. The transistor and MOSFET should be able to supply  
maximum operating current for the linear regulator  
supply.  
V
2π × C  
O
O
---------- -----------------------------  
R
= f ×  
×
C
C
V
G
× G  
EA CS  
FB  
2. DC current gain h must be large enough so that  
FE  
where;  
the pass transistor and supply the maximum load  
current with 30mA with base current. However, too  
fC is desired crossover frequency,  
VFB is 0.8V,  
GEA is the error amplifier transconductance, which is 200x10-6  
A/V, and  
big of an h may cause the LDO to be sensitive to  
FE  
current noise, and as a compromise, a DC current  
gain transistor should be selected.  
3. The total power dissipation should not be higher than  
the rated value.  
GCS is the current sense circuit transconductance, which is  
6.6 A/V  
4. Compared to a transistor, a MOSFET has lower  
The compensation capacitor C and resistor R together  
C
C
dropout voltage which is R  
multiplied by the  
DS(ON)  
make a zero. This zero is put somewhere close to the  
dominate pole f but lower than 1/5 of selected cross-  
output current. The minimum input voltage will  
increase to V plus V while the transistor is V  
O
p1  
O
GS  
over frequency. C can is selected by:  
C
plus V  
.
BE  
1.5  
----------------------------------  
=
C
Linear Regulator Output Capacitor  
C
2π × R × f  
C
p1  
The linear regulator requires using an output capacitor  
as part of the frequency compensation network, which  
affects the stability and high frequency response. The  
regulator has a finite band width. For high frequency  
transient loads, recovery from transient is determined by  
both output capacitor and the bandwidth of the regulator.  
A minimum output capacitor of 4.7µF is recommended to  
prevent oscillations and provide good transient response.  
The equation above can also be simplified to:  
C × R  
O
L
---------------------  
C
=
C
R
C
An easy-to-use application software which helps to  
design and simulate the compensation loop can be found  
at www.aosmd.com.  
The ESR value should be maintained in the range that  
determines the loop stability. When small signal ringing  
occurs with ceramics due to insufficient ESR in low  
output voltage condition, adding ESR or increasing the  
capacitor value improves the stability and reduces the  
ringing. But too high an ESR is also not suggested, which  
will cause the zero to be too big and the phase margin is  
not satisfied. High ESR also brings in high voltage ripple.  
The lower the output voltage is, the higher the ESR value  
is needed. Basically, ESR between 0.02and 3can  
make sure the circuit stable.  
Linear Regulator Design  
Adjustable Output Voltage  
The output voltage can be set by feeding back the output  
to FB2 pin with a resistor divider network. In the  
application circuit shown in Figure1. The linear regulator  
output voltage can be obtained using the following  
equation:  
R3  
R4  
= 0.8 × 1 +  
-------  
V
OUT2  
Solid tantalum electrolytic, aluminum electrolytic, and  
multilayer ceramic capacitors are all suitable, only if the  
capacitance and ESR of them meet the requirements.  
R4 should be 10kor less to avoid bias current errors.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 11 of 16  
AOZ1213  
Output Voltage Ripple  
In the AOZ1213 buck regulator circuit, the three major  
power dissipating components are the AOZ1213,  
external diode and output inductor. The total power  
dissipation of converter circuit can be measured by  
input power minus output power.  
The LDO is designed to provide low output voltage noise  
while operating at any load. Because of the existence of  
stray inductance and capacitance, sometimes there  
could be a big ripple voltage in the output which is  
unexpected. The following tips could decrease the ripple  
voltage to a lower value:  
P
= V × I V × I  
IN IN O O  
total_loss  
The power dissipation of the inductor can be  
approximately calculated by output current and DCR of  
the inductor.  
1. Improve the PCB layout:  
Signal grounds should connect to AGND to insure  
the noise is small,  
2
P
= I × R  
× 1.1  
inductor  
inductor_loss  
O
Low side divider resistor connects to AGND directly;.  
The power dissipation of the diode is:  
Keep sensitive signal trace such as FB2 pin, LDRV  
pin as short as possible, and far away from noise  
trace.  
V
O
--------  
P
= I × V × 1 –  
diode_loss  
O
F
V
IN  
2. Adding a bypass capacitor from FB2 pin to AGND,  
which will lower the bandwidth of the loop. The  
impedance of the FB2 pin capacitor at the ripple  
frequency should be less than the value of R3.  
The actual AOZ1213 junction temperature can be  
calculated with power dissipation in the AOZ1213 and  
thermal impedance from junction to ambient.  
3. Adding a resistor R between LDRV and the base of  
G
the transistor (gate of MOSFET), which can structure  
a RC filter with the capacitor of Base-Emitter to  
T
= (P  
P  
) × Θ  
inductor_loss  
JA  
junction  
total_loss  
+
+ T  
ambient  
reduce the noise (Figure 2). As the increasing of R  
value, the noise getting smaller. Considering the  
G
The maximum junction temperature of AOZ1213 is  
145°C, which limits the maximum load current capability.  
power dispassion of the R , its value is often  
G
between 10and 100.  
The thermal performance of the AOZ1213 is strongly  
affected by the PCB layout. Extra care should be taken  
by users during design process to ensure that the IC will  
operate under the recommended environmental  
conditions.  
4. Increasing the capacitance of output capacitor or add  
the ESR of the output capacitor.  
5. Change the pass transistor to a lower h type  
FE  
(MOSFET to a lower g type), thus the loop gain  
FS  
can be smaller as a source follower. But the h  
FE  
and g should be large enough to meet the output  
current requirement.  
FS  
Several layout tips are listed below for the best electric  
and thermal performance. Figure 3 is the layout example.  
1. Do not use thermal relief connection to the VIN and  
the GND pin. Pour a maximized copper area to the  
GND pin and the VIN pin to help thermal dissipation.  
Thermal Management and Layout  
Consideration  
In the AOZ1213 buck regulator circuit, high pulsing  
current flows through two circuit loops. The first loop  
starts from the input capacitors, to the VIN pin, to the  
LX pins, to the filter inductor, to the output capacitor and  
load, and then return to the input capacitor through  
ground. Current flows in the first loop when the high side  
switch is on. The second loop starts from inductor, to the  
output capacitors and load, to the GND pin of the  
AOZ1213, to the LX pins of the AZO1213. Current flows  
in the second loop when the low side diode is on.  
2. Input capacitor should be connected as close as  
possible to the VIN pin and the GND pin.  
3. Make the current trace from LX pins to L to Co to the  
GND as short as possible.  
4. Pour copper plane on all unused board area and  
connect it to stable DC nodes, like VIN, GND or  
VOUT.  
5. Keep sensitive signal traces such as the trace  
connecting FB pin and COMP pin away from the  
LX pins.  
In PCB layout, minimizing the two loops area reduces the  
noise of this circuit and improves efficiency. A ground  
plane is recommended to connect input capacitor, output  
capacitor, and GND pin of the AOZ1213.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 12 of 16  
AOZ1213  
Layout Example of the AOZ1213  
Figure 3a. Top Side  
Figure 3b. Bottom Side  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 13 of 16  
AOZ1213  
Package Dimensions, DFN 4 x 3  
A
Pin #1 IDA  
e
L1  
Chamfer 0.15  
D/2  
1
L
Index Area  
(D/2 x E/2)  
L3  
L3  
E/2  
E1/2  
E
E1  
L2  
D1  
D2  
TOP VIEW  
BOTTOM VIEW  
A3  
A
Seating  
Plane  
A1  
b
SIDE VIEW  
Dimensions in millimeters  
Dimensions in inches  
RECOMMENDED LAND PATTERN  
Symbols Min.  
Nom. Max.  
Symbols Min.  
Nom. Max.  
A
A1  
A3  
b
0.80  
0.00  
0.90  
0.02  
1.00  
0.05  
A
A1  
A3  
b
0.031 0.035 0.039  
0.000 0.001 0.002  
0.008 REF.  
0.50  
0.25  
0.23  
0.20 REF.  
0.23  
0.50  
0.30  
0.20  
0.35  
0.008 0.009 0.014  
0.157 BSC  
D
4.00 BSC  
0.985  
D
D1  
D2  
E
0.83  
1.86  
1.09  
2.12  
D1  
D2  
E
0.033 0.039 0.043  
0.073 0.079 0.083  
0.118 BSC  
1.35  
2.015  
0.80  
0.715  
1.60  
3.00 BSC  
1.60  
2.70  
E1  
e
1.45  
1.70  
E1  
e
0.057 0.063 0.067  
0.020 BSC  
0.50 BSC  
0.40  
L
0.30  
0.61  
0.21  
0.50  
0.82  
0.42  
L
0.012 0.016 0.020  
0.024 0.028 0.032  
0.008 0.012 0.017  
0.012 REF.  
0.30  
L1  
L2  
L3  
aaa  
bbb  
ccc  
ddd  
0.715  
L1  
L2  
L3  
aaa  
bbb  
ccc  
ddd  
0.315  
0.30 REF.  
0.15  
0.20 x 45°  
1.035  
0.315  
2.065  
0.006  
Unit: mm  
0.10  
0.004  
0.10  
0.004  
0.08  
0.003  
Notes:  
1. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.  
2. The location of the terminal #1 identifier and terminal numbering conforms to JEDEC publication 95 SPP-002.  
3. Dimension b applied to metallized terminal and is measured between 0.20mm and 0.35mm from the terminal tip. If the terminal  
has the optional radius on the other end of the terminal, dimension b should not be measured in that radius area.  
4. Coplanarity ddd applies to the terminals and all other bottom surface metallization.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 14 of 16  
AOZ1213  
Tape and Reel Dimensions, DFN 4 x 3  
Carrier Tape  
P1  
P2  
D1  
T
E1  
E2  
E
C
L
B0  
K0  
D0  
A0  
P0  
Feeding Direction  
UNIT: mm  
Package  
A0  
B0  
K0  
D0  
1.50  
D1  
1.50  
E
E1  
E2  
P0  
P1  
P2  
T
DFN 4 x 3  
(12 mm)  
3.40  
0.10  
4.40  
0.10  
1.10  
12.0 1.75  
0.3  
5.50  
0.05  
8.00  
0.10  
4.00  
0.10  
2.00  
0.10  
0.30  
0.05  
0.10 Min. +0.10/-0.0  
0.10  
Reel  
W1  
S
N
K
M
V
R
H
W
UNIT: mm  
Tape Size Reel Size  
12mm ø330  
M
N
W
W1  
H
K
S
G
R
V
ø330.0 ø79.0  
2.0  
12.4  
17.0  
ø13.0  
0.5  
10.5  
0.2  
2.0  
0.5  
1.0 +2.0/-0 +2.6/-0  
Leader / Trailer & Orientation  
Components Tape  
Orientation in Pocket  
Leader Tape  
500mm Min.  
Trailer Tape  
300mm Min.  
125 Empty Pockets  
75 Empty Pockets  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 15 of 16  
AOZ1213  
Package Marking  
AOZ1213DI  
(4 x 3 DFN-12)  
Z1213DI  
Part Number Code  
FAYWLT  
Assembly Lot Code  
Fab & Assembly Location  
Year & Week Code  
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.  
LIFE SUPPORT POLICY  
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body or (b) support or sustain life, and (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of  
the user.  
2. A critical component in any component of a life  
support, device, or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
Rev. 1.3 November 2009  
www.aosmd.com  
Page 16 of 16  

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