AOZ1312 [AOS]
Single Channel USB Switch; 单路USB开关
| 型号： | AOZ1312 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Single Channel USB Switch |
| 文件： | 总13页 (文件大小：743K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOZ1312
Single Channel USB Switch
General Description
Features
The AOZ1312 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switch family intended for applications where heavy
capacitive loads and short-circuits are likely to be
encountered. This device incorporates a 70 mΩ
N-channel MOSFET power switch for power-distribution
systems. The switch is controlled by a logic enable input.
Gate drive is provided by an internal charge pump
designed to control the power-switch rise time and fall
time to minimize current surges during switching. The
charge pump requires no external components and
allows operation from supplies as low as 2.7 V.
z Typical 70 mΩ (NFET)
z 1.5A maximum continuous current
z Vin range of 2.7 V to 5.5 V
z Open Drain Fault Flag
z Fault Flag deglitched (blanking time)
z Thermal shutdown
z Reverse current blocking
z Packages: SO-8 and eMSOP-8
Applications
z Notebook Computers
z Desktop Computers
The AOZ1312 is available in an SO-8 or eMSOP-8
package and is rated over the -40 °C to +85 °C ambient
temperature range.
Typical Application
VIN
OUT
IN
LOAD
C2
0.1μF
C1
22μF
R1
10kΩ
AOZ1312
Cin
OC
EN
GND
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Page 1 of 13
AOZ1312
Ordering Information
Maximum
Continuous Current
Typical Short-circuit
Current Limit
Enable
Setting
Output
Discharge Environmental
Part Number Channel 1 Channel 2 Channel 1 Channel 2
Package
AOZ1341AI
AOZ1341EI
SO-8
Active Low
Active High
EPAD MSOP-8
SO-8
1 A
1A
1.5 A
2 A
1.5 A
2 A
AOZ1341AI-1
AOZ1341EI-1
AOZ1342PI
EPAD MSOP-8
Active Low EPAD SO-8
Active High EPAD SO-8
1.5 A
1.5 A
1.5A
0.5A
AOZ1342PI-1
AOZ1343AI*
AOZ1343EI*
AOZ1343AI-1*
AOZ1343EI-1*
AOZ1312AI-1
AOZ1312EI-1
AOZ1310CI-1
Green Product
No
SO-8
Active Low
RoHS Compliant
EPAD MSOP-8
2 A
0.75 A
SO-8
Active High
EPAD MSOP-8
SO-8
Active High
1.5 A
0.5 A
None
None
2 A
None
None
EPAD MSOP-8
0.75 A
Active High SOT23-5
*Contact factory for availability
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
AOZ1312
1
2
3
4
8
7
6
5
GND
IN
NC
OUT
OUT
OC
IN
EN
eMSOP-8 / SO-8
(Top View)
Pin Description
Pin Name
Pin Number
Pin Function
GND
IN
1
2, 3
4
Ground
Input voltage
EN
Enable input, logic high turns on power switch, IN-OUT
Overcurrent, open-drain output, active low, IN-OUT
Power-switch output, IN-OUT
OC
OUT
NC
5
6, 7
8
No connection
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Page 2 of 13
AOZ1312
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings may damage the
Recommended Operating Conditions
The device is not guaranteed to operate beyond the
device.
Recommended Operating Conditions.
Parameter
Input Voltage (VIN)
Enable Voltage (VEN
Rating
Parameter
Input Voltage (VIN)
Rating
6 V
6 V
+2.7 V to +5.5 V
-40 °C to +125 °C
)
Junction Temperature (TJ)
Package Thermal Resistance (ΘJA
eMSOP-8
Storage Temperature (TS)
ESD Rating(1)
Note:
-55 °C to +150 °C
2 kV
)
60 °C/W
SO-8
115 °C/W
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model is a 100 pF capacitor discharging
through a 1.5 kΩ resistor.
Electrical Characteristics
T = 25 °C, V = V =5.5 V, unless otherwise specified.
A
IN
EN
(3)
Symbol
Parameter
Conditions
Min.
Typ. Max. Units
POWER SWITCH
RDS(ON) Switch On-Resistance
VIN = 5.5 V, IOUT = 1.5 A
70
0.6
0.4
135
1.5
1
mΩ
tr
Rise Time, Output
VIN = 5.5 V, CL = 1 μF, RL = 5 Ω
VIN = 2.7 V, CL = 1 μF, RL = 5 Ω
VIN = 5.5 V
ms
tf
Fall Time, Output
0.05
0.05
0.5
0.5
ms
VIN = 2.7 V
FET Leakage Current
Out connect to ground,
VI(ENx) = 5.5 V,
-40 °C ≤ TJ ≤ 125 °C(2)
1
μA
or VI(ENx) = 0 V
ENABLE INPUT EN
VIH
VIL
II
High-level Input Voltage
2.7V ≤ VIN ≤ 5.5V
2.7V ≤ VIN ≤ 5.5V
2.0
V
V
Low-level Input Voltage
Input Current
0.8
-0.5
3
-0.5
μA
ms
ton
toff
Turn-on Time
CL = 100 μF, RL = 5 Ω
CL = 100 μF, RL = 5 Ω
Turn-off Time
10
CURRENT LIMIT
IOS
Short-circuit Output Current
1.5
1.6
2.0
2.3
2.5
2.7
A
A
IOC_TRIP Overcurrent Trip Threshold
SUPPLY CURRENT
Supply Current, Low-level
Output
No load on OUT,
TJ = 25°C
-40 °C ≤ TJ ≤ 125 °C(2)
0.5
0.5
1
5
μA
μA
μA
VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
Supply Current, High-level
Output
No load on OUT,
VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
-40 °C ≤ TJ ≤ 125 °C(2)
50
50
70
90
Reverse Leakage Current
VI(OUTx) = 5.5V, IN = ground TJ = 25 °C
0.2
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AOZ1312
Electrical Characteristics (Continued)
T = 25 °C, V = V =5.5 V, unless otherwise specified.
A
IN
EN
(3)
Symbol
Parameter
Conditions
Min.
Typ. Max. Units
UNDERVOLTAGE LOCKOUT
Low-level Voltage, IN
Hysteresis, IN
2
2.5
V
TJ = 25°C
200
mV
OVERCURRENT OC
Output low Voltage VOL(OCx) IO(OCx) = 5mA
0.4
1
V
Off-state Current
OC_L Deglitch
V
O(OCx) = 5V or 3.3V
μA
ms
OCx assertion or deassertion
4
8
15
THERMAL SHUTDOWN
Thermal Shutdown
Threshold
135
105
°C
°C
°C
Recovery from Thermal
Shutdown
Hysteresis
30
Note:
2. Parameters are guaranteed by design only and not production tested.
3. Pulse testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
Functional Block Diagram
IN
OUT
Gate Driver
UVLO
Comparator
Current
Limit
2.5V
Thermal
Shutdown
EN
OC
Deglitch
AOZ1312
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AOZ1312
Functional Characteristics
Figure 2. Turn-Off Delay and Fall Time
with 1μF Load (Active High)
Figure 1. Turn-On Delay and Rise Time
with 1μF Load (Active High)
R
= 5ꢀ
= 1μF
= 25°C
L
L
R
C
T
= 5ꢀ
= 1μF
= 25°C
L
L
A
C
T
A
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
200μs/div
Figure 4. Turn-Off Delay and Fall Time
Figure 3. Turn-On Delay and Rise Time
with 100μF Load (Active High)
with 100μF Load (Active High)
R
C
A
= 5ꢀ
= 100μF
= 25°C
L
L
R
C
A
= 5ꢀ
= 100μF
= 25°C
L
L
T
T
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
500μs/div
Figure 5. Short-circuit Current, Device Enable
to Short (Active High)
Figure 6. 0.6Ω Load Connected to Enable to
Device (Active High)
EN
2V/div
OC
2V/div
IOUT
1A/div
IOUT
1A/div
200μs/div
2ms/div
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Page 5 of 13
AOZ1312
Functional Characteristics (Continued)
Figure 8. Short Circuit Current Limit
Figure 7. Inrush Current with Different Load Capacitance
V
= 5V
= 5ꢀ
IN
R
L
EN
T
= 25°C
A
5V/div
EN
2V/div
220μF
470μF
IOUT
500mA/div
IOUT
500mA/div
100μF
1ms/div
20ms/div
Typical Characteristics
Figure 9. Supply Current, Output Enabled
vs. Junction Temperature
Figure 10. Supply Current, Output Disabled
vs. Junction Temperature
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
70
60
50
40
30
20
10
0
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
0
-50
0
50
100
150
-50
0
50
100
C)
150
Junction Temperature (°C)
Junction Temperature (
°
Figure 12. UVLO Threshold vs. Junction Temperature
Figure 11. Rds(on) vs. Ambient Temperature
2.22
2.21
2.20
2.19
2.18
2.17
2.16
2.15
2.14
2.13
2.12
2.11
200
180
160
140
120
100
80
Rising
Falling
60
Vin=2.7V
Vin=3.3V
Vin=5V
40
20
Vin=5.5V
0
-50
0
50
100
C)
150
-50
0
50
100
150
Junction Temperature (°C)
Junction Temperature (
°
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AOZ1312
Detailed Description
The AOZ1312 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switches family. The AOZ1312 is intended for
applications where heavy capacitive loads and
short-circuits are likely to be encountered. Gate drive is
provided by an internal charge pump designed to control
the power-switch rise times and fall times to minimize
current surges during switching. The charge pump
requires no external components and allows operation
from supplies as low as 2.7 V.
Enable
The logic enable disables the power switch, charge
pump, gate driver, logic device, and other circuitry to
reduce the supply current. When the enable receives a
logic high the supply current is reduced to approximately
1 μA. The enable input is compatible with both TTL and
CMOS logic levels.
Over-current
The over-current open drain output is asserted
(active low) when an over-current condition occurs.
The output will remain asserted until the over-current
condition is removed. A 15 ms deglitch circuit prevents
the over-current from false triggering.
Power Switch
The power switch is a N-channel MOSFET with a low
on-state resistance capable of delivering 1 A of
continuous current. Configured as a high-side switch,
the MOSFET will go into high impedance when disabled.
Thus, preventing current flow from OUT to IN and IN to
OUT.
Thermal Shut-down Protection
When the output load exceeds the current-limit threshold
or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode,
pulling the overcurrent (OC) logic output low.
Charge Pump
An internal charge pump supplies power to the circuits
and provides the necessary voltage to drive the gate of
the MOSFET beyond the source. The charge pump is
capable of operating down to a low voltage of 2.7 Volts.
During current limit or short circuit conditions, the
increasing power dissipation in the chip causing the die
temperature to rise. When the die temperature reaches a
certain level, the thermal shutdown circuitry will shutdown
the device. The thermal shutdown will cycle repeatedly
until the short circuit condition is resolved.
Driver
The driver controls the voltage on the gate to the power
MOSFET switch. This is used to limit the large current
surges when the switch is being turned On and Off.
Proprietary circuitry controls the rise and fall time of the
output voltages.
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AOZ1312
Applications Information
Input Capacitor Selection
Power Dissipation Calculation
The input capacitor prevents large voltage transients
from appearing at the input, and provides the
Calculate the power dissipation for normal load condition
using the following equation:
instantaneous current needed each time the switch turns
on and to limit input voltage drop. The input capacitor
also prevents high-frequency noise on the power line
from passing through the output of the power side. The
choice of the input capacitor is based on its ripple current
and voltage ratings rather than its capacitor value. The
2
P = R x (I )
OUT
D
ON
The worst case power dissipation occurs when the load
current hits the current limit due to over-current or short
circuit faults. The power dissipation under these
conditions can be calculated using the following
equation:
input capacitor should be located as close to the V pin
IN
as possible. A 1 μF and above ceramic cap is
recommended. However, higher capacitor values further
reduce the voltage drop at the input.
P = (V – V
) x I
LIMIT
D
IN
OUT
Layout Guidelines
Output Capacitor Selection
Good PCB layout is important for improving the thermal
and overall performance of the AOZ1312. To optimize the
switch response time to output short-circuit conditions
keep all traces as short as possible to reduce the effect of
unwanted parasitic inductance. Place the input and
output bypass capacitors as close as possible to the IN
and OUT pins. The input and output PCB traces should
be as wide as possible for the given PCB space. Use a
ground plane to enhance the power dissipation capability
of the device.
The output capacitor acts in a similar way. A small 0.1 μF
capacitor prevents high-frequency noise from going into
the system. Also, the output capacitor has to supply
enough current for a large load that it may encounter
during system transients. This bulk capacitor must be
large enough to supply fast transient load in order to
prevent the output from dropping.
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AOZ1312
Package Dimensions, SO-8L
D
Gauge Plane
Seating Plane
e
0.25
8
L
E1
E
h x 45
1
C
θ
7 (4x)
A2
A
0.1
A1
b
RECOMMENDED LAND PATTERN
Dimensions in millimeters
Dimensions in inches
Symbols Min. Nom. Max.
Symbols Min.
Nom. Max.
0.053 0.065 0.069
0.004 0.010
0.049 0.059 0.065
A
A1
A2
b
c
D
E
e
E1
h
1.35
0.10
1.25
0.31
0.17
4.80
3.80
1.65
—
1.50
—
1.75
0.25
1.65
0.51
0.25
5.00
4.00
A
A1
A2
b
2.20
—
0.012
0.007
—
—
0.020
0.010
—
c
4.90
3.90
1.27 BSC
6.00
—
D
E
e
0.189 0.193 0.197
0.150 0.154 0.157
0.050 BSC
5.74
2.87
1.27
5.80
0.25
0.40
0°
6.20
0.50
1.27
8°
E1
h
L
0.228 0.236 0.244
0.010
0.016
0°
—
—
—
0.020
0.050
8°
L
—
θ
—
θ
0.80
UNIT: mm
0.635
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Rev. 1.1 July 2011
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Page 9 of 13
AOZ1312
Tape and Reel Dimensions, SO-8
Carrier Tape
P1
P2
D1
T
E1
E2
E
B0
K0
D0
P0
A0
Feeding Direction
UNIT: mm
Package
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
SO-8
(12mm)
6.40
0.10
5.20
0.10
2.10
0.10
1.60
0.10
1.50
0.10
12.00 1.75
0.10 0.10
5.50
0.10
8.00
0.10
4.00
0.10
2.00
0.10
0.25
0.10
Reel
W1
S
G
V
N
K
M
R
H
W
UNIT: mm
Tape Size Reel Size
12mm ø330
M
N
W
W1
ø330.00 ø97.00 13.00 17.40
0.50 0.10 0.30 1.00 +0.50/-0.20
H
K
S
G
R
V
ø13.00
10.60
2.00
0.50
—
—
—
Leader/Trailer and Orientation
Trailer Tape
300mm min. or
75 empty pockets
Components Tape
Orientation in Pocket
Leader Tape
500mm min. or
125 empty pockets
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Page 10 of 13
AOZ1312
Package Dimensions, MSOP8_EP1
Gauge Plane
L2
Seating Plane
D
L
2
L1
E2
E1
E
D1
c
1
A1
A2
A
0.10mm
b
e
Dimensions in millimeters
Dimensions in inches
Symbols Min.
Nom. Max.
Symbols Min. Nom. Max.
RECOMMENDED LAND PATTERN
A
A1
A2
b
c
D
D1
e
E
E1
E2
L
L1
L2
θ1
θ2
0.81
0.05
0.76
0.25
0.13
2.90
1.55
1.02
—
1.12
0.15
0.97
0.40
0.23
3.10
1.8
A
A1
A2
b
c
D
D1
e
E
E1
E2
L
L1
L2
θ1
θ2
0.032 0.040 0.044
0.002 0.006
0.030 0.034 0.038
0.010 0.012 0.016
0.005 0.006 0.010
0.116 0.118 0.120
0.75
—
0.86
0.30
0.15
3.00
—
1.9
4.35
1.9
0.06
—
0.07
0.65 TYP.
3.00
4.90
—
0.55
0.95
0.25 BSC
—
0.026 TYP.
0.116 0.118 0.120
2.90
4.70
1.3
0.40
0.90
3.10
5.10
1.8
0.70
1.00
0.185 0.192
0.05
0.20
0.07
—
0.35
0.65
0.016 0.022 0.028
0.035 0.037 0.039
0.010 BSC
0°
—
6°
—
0°
—
—
12°
6°
—
12°
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating.
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils each.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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AOZ1312
Tape and Reel Dimensions, MSO8P_EP1
Carrier Tape
P2
P1
D1
D0
Section B-B'
K1
E1
E2
R0.3
Max
E
B0
K1
A0
P0
R0.3 Typ.
T
4.2
3.4
K0
Feeding Direction
Section B-B'
UNIT: mm
Package
MSOP-8
T
0.30
0.05
B0
3.30
0.10
A0
5.20
0.10
K1
1.20
0.10
K0
1.60
D0
ø1.50
D1
E
E1
1.75
0.10
E2
5.50
0.05
P0
8.00
0.10
P1
4.00
0.05
P2
2.00
0.05
ø1.50 12.0
0.3
0.10 +0.1/-0.0 Min.
Reel
W1
S
G
N
K
M
V
R
H
W
UNIT: mm
Tape Size Reel Size
12mm ø330
M
N
W
W1
H
K
S
G
R
V
ø330.00 ø97.00 13.00 17.40
0.50 0.10 0.30
ø13.00
1.00 +0.50/-0.20
10.60
2.00
0.50
—
—
—
Leader/Trailer and Orientation
Trailer Tape
300mm min.
Components Tape
Orientation in Pocket
Leader Tape
500mm min.
Notes:
1. 10 sprocket hole pich cumulative tolerance 0.2.
2. Camber not to exceed 1mm in 100mm.
3. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket.
4. K0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
5. Pocket position relative to sprocket hole measured as tue position of pocket, not pocket hole.
6. All dimensions in mm.
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AOZ1312
Part Marking
AOZ1312AI-1
(SO-8)
Part Number Code
Assembly Lot Code
Fab Code & Assembly Location Code
Year Code and Week Code
AOZ1312EI-1
(MSOP8_EP1)
Part Number Code
Year Code and Week Code
Assembly Lot Code
Fab Code & Assembly
Location Code
This datasheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
Rev. 1.1 July 2011
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Page 13 of 13
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