AOZ8829-03 [AOS]

Ultra-Low Capacitance TVS Diode;
AOZ8829-03
型号: AOZ8829-03
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

Ultra-Low Capacitance TVS Diode

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AOZ8829-03  
Ultra-Low Capacitance TVS Diode  
General Description  
Features  
The AOZ8829-03 is a transient voltage suppressor array  
designed to protect high speed data lines such as HDMI  
1.4/2.0, USB 3.1, MDDI, SATA, and Gigabit Ethernet  
from damaging ESD events.  
ESD protection for high-speed data lines:  
IEC 61000-4-2, level 4 (ESD) immunity test  
IEC61000-4-5 (Lightning) 6 A (8/20 µS)  
Human Body Model (HBM) ±30 kV  
Array of surge rated diodes with internal TVS diode  
Protects four I/O lines  
This device incorporates eight surge rated, low  
capacitance steering diodes and a TVS in a single  
package. During transient conditions, the steering diodes  
direct the transient to either the positive side of the power  
supply line or to ground.  
Low capacitance between I/O lines: 0.25 pF  
Low clamping voltage  
Low operating voltage: 3.3 V  
The AOZ8829-03 provides a typical line-to-line  
Applications  
capacitance of 0.25 pF and low insertion loss up to 6  
GHz providing greater signal integrity making it ideally  
suited for HDMI 1.4/2.0 or USB 3.1 applications, such as  
Digital TVs, DVD players, computing, set-top boxes and  
MDDI applications in mobile computing devices.  
HDMI 1.4/2.0, USB 3.1, MDDI, SATA ports  
Monitors and flat panel displays  
Set-top box  
Video graphics cards  
Digital Video Interface (DVI)  
Notebook computers  
The AOZ8829-03 comes in a RoHS compliant and  
Halogen Free 2.5 mm x 1.0 mm x 0.55 mm DFN-10  
package and is rated for -40 °C to +85 °C junction  
temperature range.  
Typical Applications  
AOZ8829  
AOZ8829  
AOZ8902  
TX2+  
TX2-  
RX2+  
RX2-  
D+  
D-  
D+  
D-  
USB 3.1  
Connector  
TX1+  
TX1-  
HDMI 1.4/2.0  
Transmitter  
RX1+  
RX1-  
USB 3.1  
Transceiver  
HDMI 1.4/2.0  
Receiver  
RX0+  
SSRX+  
SSRX-  
SSRX+  
SSRX-  
TX0+  
TX0-  
RX0-  
SSTX+  
SSTX-  
SSTX+  
SSTX-  
CLK+  
CLK-  
CLK+  
CLK-  
Connector  
Connector  
AOZ8829  
AOZ8829  
AOZ8829  
Figure 1. USB 3.1 Ports  
Figure 2. HDMI 1.4/2.0 Ports  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 1 of 8  
AOZ8829-03  
Ordering Information  
Part Number  
Ambient Temperature Range  
-40 °C to +85 °C  
Package  
Environmental  
AOZ8829DI-03  
2.5 mm x 1.0 mm x 0.55 mm DFN-10  
Green Product  
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.  
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.  
Pin Configuration  
1
2
3
4
5
CH1  
CH2  
VN  
NC  
NC  
VN  
NC  
NC  
10  
9
8
CH3  
CH4  
7
6
DFN-10  
(Top View)  
Absolute Maximum Ratings  
Exceeding the Absolute Maximum ratings may damage the device.  
Parameter  
Rating  
Storage Temperature (TS)  
-65 °C to +150 °C  
ESD Rating per IEC61000-4-2, contact(1)(3)  
ESD Rating per IEC61000-4-2, air(1)(3)  
ESD Rating per Human Body Model(2)(3)  
±30 kV  
±30 kV  
±30 kV  
Notes:  
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330 .  
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100 pF, RDischarge = 1.5 k.  
Maximum Operating Ratings  
Parameter  
Rating  
Junction Temperature (TJ)  
-40 °C to +125 °C  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 2 of 8  
AOZ8829-03  
Electrical Characteristics  
T = 25°C unless otherwise specified.  
A
Symbol  
Parameter  
Diagram  
I
IPP  
Maximum Reverse Peak Pulse Current  
VCL  
Clamping Voltage @ IPP 100ns Transmission  
Line Pulse (TLP)  
I
F
VRWM  
IR  
Working Peak Reverse Voltage  
Maximum Reverse Leakage Current  
Breakdown Voltage  
V
V
V
CL BR RWM  
V
I
V
R
T
F
VBR  
IT  
I
Test Current  
VF  
Forward Voltage @ IF  
I
PP  
CJ  
Max. Capacitance @ VR = 0 and f = 1 MHz  
Symbol  
Parameter  
Conditions  
I/O pin to ground  
IT = 100 µA, I/O pin-to-ground  
Min.  
Typ.  
Max  
Units  
VRWM  
VBR  
IR  
Reverse Working Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
3.3  
V
V
6
VRWM = 3.3 V, I/O pin-to-ground  
0.1  
µA  
ITLP = 2 A  
ITLP = -2 A  
3
-2.5  
V
V
Clamping Voltage(3)  
(100 ns Transmission Line  
Pulse, I/O Pin-to-Ground)  
ITLP = 12 A  
ITLP = -12 A  
6.5  
-4.0  
V
V
VCL  
Clamping Voltage(3)  
(IEC61000-4-5, 8/20 µs, I/O  
Pin-to-Ground)  
IPP = 6 A  
IPP = -8 A  
7.5  
-8.5  
V
V
RDNY  
Dynamic Resistance(3)  
ITLP = 1 A to 16 A  
ITLP = -1 A to -16 A  
0.35  
0.15  
VPIN 3,8 = 0 V, VI/O = 0 V, f = 1 MHz,  
I/O pin-to-ground  
0.6  
pF  
CJ  
Junction Capacitance  
VPIN 3,8 = 0 V, VI/O = 0 V, f = 1 MHz,  
I/O pin-to-I/O pin  
0.25  
pF  
Notes:  
3. These specifications are guaranteed by design and characterization.  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 3 of 8  
AOZ8829-03  
Typical Performance Characteristics  
Forward Voltage vs. Forward Peak Pulse Current  
Clamping Voltage vs. Peak Pulse Current  
(t  
= 100ns, t = 1ns)  
r
(t  
= 100ns, t = 1ns)  
r
period  
period  
9
8
7
6
5
4
3
2
1
0
14  
12  
10  
8
6
4
2
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
Peak Puse Current, IPP (A)  
Forward Current, IPP (A)  
+8kV ESD Clamping Per IEC 61000-4-2  
(Contact, Between I/O to GND)  
-8kV ESD Clamping Per IEC 61000-4-2  
(Contact, Between I/O to GND)  
45  
35  
25  
15  
5
5
-5  
-15  
-25  
-35  
-5  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Time (ns)  
Time (ns)  
Thunderbolt 2.0 Eye Diagram with AOZ8829 (10Gbps)  
600m  
USB 3.1 Eye Diagram with AOZ8829 (10Gbps)  
600m  
-600m  
-600m  
-100p  
Time (s)  
100p  
-100  
Time (s)  
100p  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 4 of 8  
AOZ8829-03  
be improved by minimizing the impedance with relatively  
short and wide ground traces. The PCB layout and IC  
package parasitic inductances can cause significant  
overshoot to the TVS’s clamping voltage. The inductance  
of the PCB can be reduced by using short trace lengths  
and multiple layers with separate ground and power  
planes. One effective method to minimize loop problems  
is to incorporate a ground plane in the PCB design.  
High Speed PCB Layout Guidelines  
Printed circuit board layout is the key to achieving the  
highest level of surge immunity on power and data lines.  
The location of the protection devices on the PCB is the  
simplest and most important design rule to follow. The  
AOZ8829-03 devices should be located as close as  
possible to the noise source. The AOZ8829-03 device  
should be placed on all data and power lines that enter or  
exit the PCB at the I/O connector. In most systems, surge  
pulses occur on data and power lines that enter the PCB  
through the I/O connector. Placing the AOZ8829-03  
devices as close as possible to the noise source ensures  
that a surge voltage will be clamped before the pulse can  
be coupled into adjacent PCB traces. In addition, the  
PCB should use the shortest possible traces. A short  
trace length equates to low impedance, which ensures  
that the surge energy will be dissipated by the AOZ8829-  
03 device. Long signal traces will act as antennas to  
receive energy from fields that are produced by the ESD  
pulse. By keeping line lengths as short as possible, the  
efficiency of the line to act as an antenna for ESD related  
fields is reduced. Minimize interconnecting line lengths  
by placing devices with the most interconnect as close  
together as possible. The protection circuits should shunt  
the surge voltage to either the reference or chassis  
ground. Shunting the surge voltage directly to the IC’s  
signal ground can cause ground bounce. The clamping  
performance of TVS diodes on a single ground PCB can  
The AOZ8829-03 ultra-low capacitance TVS is designed  
to protect four high speed data transmission lines from  
transient over-voltages by clamping them to a fixed  
reference. The low inductance and construction  
minimizes voltage overshoot during high current surges.  
When the voltage on the protected line exceeds the  
reference voltage the internal steering diodes are forward  
biased, conducting the transient current away from the  
sensitive circuitry. The AOZ8829-03 is designed for ease  
of PCB layout by allowing the traces to run underneath  
the device. The pinout of the AOZ8829-03 is designed to  
simply drop onto the IO lines of a High Definition  
Multimedia Interface (HDMI 1.4/2.0) or USB 3.1 design  
without having to divert the signal lines that may add  
more parasitic inductance. Pins 1, 2, 4 and 5 are  
connected to the internal TVS devices and pins 6, 7, 9  
and 10 are no connects. The no connects was done so  
the package can be securely soldered onto the PCB  
surface.  
Clock  
Data0  
Ground  
Data1  
Data2  
Clock  
SSRX+  
SSRX–  
Ground  
SSTX+  
SSTX–  
SSRX+  
SSRX–  
Ground  
SSTX+  
SSTX–  
Data0  
Ground  
Data1  
Data2  
Figure 3. Flow Through Layout for HDMI 1.4/2.0  
Figure 4. Flow Through Layout for USB 3.1  
.
Rev. 2.0 March 2016  
www.aosmd.com  
Page 5 of 8  
AOZ8829-03  
Package Dimensions, DFN 2.5mm x 1.0mm x 0.5mm, 10L  
b1  
D
b
e
E
5
1
L
TOP VIEW  
e
Pin #1 Dot  
by Marking  
Pin #3 Identification R 0.130  
BOTTOM VIEW  
c
A
SIDE VIEW  
A1  
Dimensions in millimeters  
Dimensions in inches  
Symbols Min.  
Nom. Max.  
Symbols Min.  
Nom. Max.  
0.020 0.022 0.024  
0.000 0.002  
RECOMMENDED LAND PATTERN  
0.10  
0.30  
A
A1  
b
0.50  
0.00  
0.15  
0.55  
0.20  
0.60  
0.05  
0.25  
A
A1  
b
b1  
c
0.50  
0.15  
0.006 0.008 0.010  
0.016  
b1  
c
0.40  
0.36  
0.152 Ref.  
2.50  
0.006 Ref.  
0.48  
0.24  
D
E
2.45  
0.95  
2.55  
1.05  
D
E
e
0.096 0.098 0.100  
0.037 0.039 0.041  
0.020 BSC  
0.72  
1.00  
1.20  
e
0.50 BSC  
0.38  
L
0.33  
0.43  
L
0.013 0.015 0.017  
0.20  
0.40  
Note:  
1. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 6 of 8  
AOZ8829-03  
Tape and Reel Dimensions, DFN 2.5mm x 1.0mm x 0.5mm, 10L  
Carrier Tape  
P2  
P1  
D0  
D1  
E1  
K0  
E
E2  
B0  
Ref 5  
P0  
A0  
T
A–A  
Feeding Direction  
UNIT: mm  
Package  
A0  
B0  
K0  
D0  
D1  
E
E1  
E2  
P0  
P1  
P2  
T
DFN 2.5x1.0 1.12  
0.05  
2.62  
0.05  
0.70  
0.05  
ø1.55 ø0.55  
8.00  
1.75  
0.1  
3.50  
0.05  
4.00  
0.10  
4.0  
0.10  
2.0  
0.05  
0.25  
0.05  
0.05  
0.05 +0.3/-0.1  
Reel  
W1  
S
K
M
N
G
R
H
W
UNIT: mm  
Tape Size Reel Size  
8mm ø178  
M
N
W
11.80  
0.5  
W1  
9.0  
0.5  
H
S
K
E
ø9.8  
R
ø178.0 ø60.0  
1.0 0.5  
ø13.0  
+0.5 / –0.2  
2.40 10.25  
0.10 0.2  
Leader / Trailer & Orientation  
Trailer Tape  
300mm Min.  
Components Tape  
Orientation in Pocket  
Leader Tape  
500mm Min.  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 7 of 8  
AOZ8829-03  
Part Marking  
AOZ8829DI-03  
(2.5 x 1.0 DFN)  
TC12  
Assembly Lot Code  
Week and Year Code  
Part Number Code  
LEGAL DISCLAIMER  
Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or  
completeness of the information provided herein and takes no liabilities for the consequences of use of such  
information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes  
to such information at any time without further notice. This document does not constitute the grant of any intellectual  
property rights or representation of non-infringement of any third party’s intellectual property rights.  
LIFE SUPPORT POLICY  
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body or (b) support or sustain life, and (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of  
the user.  
2. A critical component in any component of a life  
support, device, or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
Rev. 2.0 March 2016  
www.aosmd.com  
Page 8 of 8  

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