AOZ8904CIL [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AOZ8904CIL |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总3页 (文件大小：41K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AOZ8904CIL, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOZ8904CIL.
Review of the electrical test results confirm that AOZ8904CIL passes AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring program
ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
Product Description
II.
Package and Die information
Qualification Test Requirements
Qualification Tests Result
Reliability Evaluation
III.
IV.
V.
I. Product Description:
The AOZ8904 is a transient voltage suppressor array designed to protect high speed data lines from Electro
Static Discharge (ESD) and lightning.
-ROHS compliant
-Halogen free
Detailed information refers to the datasheet on website.
.
II. Package and Die Information:
AOZ8904CIL
SOT23_6L
Cu,
Epoxy
Cu wire
Product ID
Package Type
Lead Frame
Die attach material
Bond wire
MSL level
Up to Level 1
2
III. Qualification Tests Result:
Test Item
Test Condition
Test duration Sample Size
Result
Pass
Standard
JESD22-A113
168hrs @85 °C
/85%RH+3 cyc
reflow@260°C
Pre-
Conditioning
-
5 lots (Sum of
TC,PCT and HAST)
Pass
Vdd= 80% Vbr max.
Temp = 150°C
JESD22-A108
168hrs
500hrs
1000hrs
HTRB
15 lots (77 /lot)
5 lots (77 /lot)
Pass
Pass
Pass
'-65 °C to +150 °C,
air to air
JESD22-A110
JESD22-A102
JESD22-A104
500cycles
96hrs
Temperature
Cycle
121°C, 29.7psi,
RH= 100%
5 lots (77 /lot)
5lots (55 /lot)
Pressure Pot
HAST
'130 +/- 2°C, 85%RH,
33.3 psi, at VCC min
power dissipation.
100hrs
IV. Reliability Evaluation
FIT rate (per billion): 6
MTTF = 18589 years
The presentation of FIT rate for the individual product reliability is restricted by the actual HTRB sample size
of the selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion device hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x (15x77x500) x258] = 6
MTTF = 109 / FIT = 1.63 x108hrs= 18589 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB tests
H = Duration of HTRB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C 70 deg C 85 deg C 100 deg
C
115 deg
C
5.64
130 deg
C
2.59
150 deg C
1
Af
258
87
32
13
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
3
相关型号：
©2020 ICPDF网 联系我们和版权申明