3090-390KH [API]
General Purpose Inductor, 0.039uH, 3%, 1 Element, Iron-Core, SMD, CHIP;
| 型号： | 3090-390KH |
| 厂家： | 
API Delevan |
| 描述： | General Purpose Inductor, 0.039uH, 3%, 1 Element, Iron-Core, SMD, CHIP |
| 文件： | 总1页 (文件大小：42K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3090R
3090
Series
Micro i® Low Profile Chip Inductors
SERIES 3090 IRON CORE
-100M
-150M
-220M
-330K
-390K
-470K
-560K
-680K
-820K
-101K
-121K
-151K
-181K
-221K
-271K
-331K
-391K
-471K
-561K
-681K
-821K
-102K
-122K
-152K
-182K
-222K
-272K
-332K
-392K
-472K
-562K
-682K
-822K
-103K
0.010
0.015
0.022
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
3.90
4.70
5.60
6.80
8.20
± 20%
± 20%
± 20%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
42
42
40
40
40
38
35
30
25
32
32
32
32
34
34
34
34
34
34
30
28
24
24
24
24
25
25
25
25
24
22
22
22
20
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
7.9
1000
1000
1000
900
900
900
800
700
650
510
410
370
330
300
250
220
200
180
160
140
120
100
95
0.095
0.115
0.140
0.185
0.100
0.110
0.135
0.16
0.19
0.08
0.10
0.12
0.14
0.16
0.20
0.25
0.30
0.36
0.45
0.50
0.60
0.70
1.10
1.20
1.25
1.30
1.50
1.90
2.30
3.00
3.50
4.00
4.50
5.00
890
810
765
640
870
830
750
690
630
970
870
795
765
690
615
550
500
460
410
390
355
330
265
250
245
240
225
200
180
160
145
135
130
120
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
90
85
80
70
65
60
55
53
Physical Parameters
Inches
Millimeters
1.27 Max.
2.54±.254
2.54±.254
1.27 Min.
A
B
C
D
E
F
0.050 Max.
0.100±0.010
0.100±0.010
0.050 Min.
7.9
7.9
7.9
50
45
40
0.015 Min. (Typ) 0.38 Min. (Typ)
0.020 Max. (Typ) 0.51 Max. (Typ)
10.0
Current Rating at 90°C Ambient 35°C Rise
Operating Temperature Range 55°C to +125°C
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%
*Complete part # must include series # PLUS the dash #
–
Maximum Power Dissipation at 90°C 0.105 W
Core Material Powdered iron core for improved
temperature stability.
For further surface finish information,
refer to TECHNICAL section of this catalog.
Mechanical Configuration Units are epoxy
encapsulated. Contact area for reflow soldering are
gold plated per MIL-G-45204 Type 1 Grade A.
Internal connections are thermal compression
bonded.
Notes 1) Designed specifically for reflow soldering and other
Termination Finish Options
high temperature processes with metalized edges to exhibit
Standard: Gold over Nickel.
solder fillet. 2) Self Resonant Frequency (SRF) values 250 MHz
For Tin/Lead over Nickel: Add suffix “S” to part
number and allow an additional .010 inch for
maximum height. For RoHS, order 3090R - XXXKS.
and above are calculated and for reference only.
Packaging Tape & reel (8mm): 7" reel, 2000 pieces
max.; 13" reel, 8000 pieces max.
MIL-PRF-83446 (Reference) for testing methods
only.
Made in the U.S.A.
PAGE
7
.
www.delevan.com E-mail: apisales@delevan com
270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814
7/2004
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