AT24C08-10SI-2.5T/R
更新时间:2024-09-18 13:04:14
品牌:ATMEL
描述:EEPROM, 1KX8, Serial, CMOS, PDSO14, 0.150 INCH, PLASTIC, SOIC-14
AT24C08-10SI-2.5T/R 概述
EEPROM, 1KX8, Serial, CMOS, PDSO14, 0.150 INCH, PLASTIC, SOIC-14 EEPROM
AT24C08-10SI-2.5T/R 规格参数
生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 14 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.7 |
Is Samacsys: | N | 其他特性: | 2-WIRE SERIAL INTERFACE |
最大时钟频率 (fCLK): | 0.1 MHz | JESD-30 代码: | R-PDSO-G14 |
长度: | 8.65 mm | 内存密度: | 8192 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 14 |
字数: | 1024 words | 字数代码: | 1000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1KX8 |
输出特性: | OPEN-DRAIN | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
认证状态: | Not Qualified | 座面最大高度: | 1.75 mm |
串行总线类型: | I2C | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
宽度: | 3.9 mm | 最长写入周期时间 (tWC): | 10 ms |
Base Number Matches: | 1 |
AT24C08-10SI-2.5T/R 数据手册
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PDF下载Features
• Low-voltage and Standard-voltage Operation
– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),
1024 x 8 (8K) or 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms max)
• High-reliability
Two-wire
Serial EEPROM
1K (128 x 8)
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
2K (256 x 8)
• Automotive Grade and Lead-free/Halogen-free Devices Available
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23,
8-lead TSSOP and 8-ball dBGA2 Packages
• Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
4K (512 x 8)
8K (1024 x 8)
16K (2048 x 8)
Description
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial
electrically erasable and programmable read-only memory (EEPROM) organized as
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage operation
are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP,
8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8-
lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter-
face. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to
5.5V) versions.
AT24C01A
AT24C02
AT24C04
AT24C08A
AT24C16A
8-lead TSSOP
8-lead SOIC
Table 1. Pin Configuration
A0
A1
1
2
3
4
8
7
6
5
VCC
WP
A0
A1
1
2
3
4
8
7
6
5
VCC
WP
Pin Name
A0 - A2
SDA
Function
Address Inputs
Serial Data
A2
SCL
SDA
A2
SCL
SDA
GND
GND
SCL
Serial Clock Input
Write Protect
No Connect
Ground
8-ball dBGA2
8-lead MAP
WP
8
7
6
5
1
2
3
4
A0
A1
A2
VCC
VCC 8
1 A0
2 A1
3 A2
4 GND
NC
WP
SCL
SDA
WP 7
SCL 6
SDA 5
GND
VCC
GND
Power Supply
Bottom View
8-lead PDIP
Bottom View
5-lead SOT23
A0
A1
1
2
3
4
8
7
6
5
VCC
WP
WP
SCL
GND
SDA
1
2
3
5
4
A2
SCL
SDA
VCC
GND
0180V–SEEPR–8/05
Absolute Maximum Ratings
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Operating Temperature..................................–55°C to +125°C
Storage Temperature.....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground....................................–1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
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AT24C01A/02/04/08A/16A
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open-
collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device
address inputs that are hard wired for the AT24C01A and the AT24C02. As many as
eight 1K/2K devices may be addressed on a single bus system (device addressing is
discussed in detail under the Device Addressing section).
The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K
devices may be addressed on a single bus system. The A0 pin is a no connect.
The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K
devices may be addressed on a single bus system. The A0 and A1 pins are no
connects.
The AT24C16A does not use the device address pins, which limits the number of
devices on a single bus to one. The A0, A1 and A2 pins are no connects.
WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that
provides hardware data protection. The Write Protect pin allows normal Read/Write
operations when connected to ground (GND). When the Write Protect pin is connected
to VCC, the write protection feature is enabled and operates as shown in Table 2.
Table 2. Write Protect
Part of the Array Protected
WP Pin
Status
At VCC
At GND
24C01A
24C02
24C04
24C08A
Full (8K)
Array
24C16A
Full (1K)
Array
Full (2K)
Array
Full (4K)
Array
Full (16K)
Array
Normal Read/Write Operations
Memory Organization AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,
the 1K requires a 7-bit data word address for random word addressing.
AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,
the 2K requires an 8-bit data word address for random word addressing.
AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,
the 4K requires a 9-bit data word address for random word addressing.
AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each,
the 8K requires a 10-bit data word address for random word addressing.
AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes
each, the 16K requires an 11-bit data word address for random word addressing.
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Table 3. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V
Symbol
CI/O
Test Condition
Max
8
Units
pF
Conditions
VI/O = 0V
VIN = 0V
Input/Output Capacitance (SDA)
Input Capacitance (A0, A1, A2, SCL)
CIN
6
pF
Note:
1. This parameter is characterized and is not 100% tested.
Table 4. DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +1.8V to +5.5V
(unless otherwise noted)
Symbol
VCC1
VCC2
VCC3
ICC
Parameter
Test Condition
Min
1.8
2.7
4.5
Typ
Max
5.5
Units
V
Supply Voltage
Supply Voltage
5.5
V
Supply Voltage
5.5
V
Supply Current VCC = 5.0V
Supply Current VCC = 5.0V
Standby Current VCC = 1.8V
Standby Current VCC = 2.5V
Standby Current VCC = 2.7V
Standby Current VCC = 5.0V
Input Leakage Current
Output Leakage Current
Input Low Level(1)
READ at 100 kHz
WRITE at 100 kHz
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VOUT = VCC or VSS
0.4
2.0
1.0
mA
mA
µA
µA
µA
µA
µA
µA
V
ICC
3.0
ISB1
ISB2
ISB3
ISB4
ILI
0.6
3.0
1.4
4.0
1.6
4.0
8.0
18.0
3.0
0.10
0.05
ILO
3.0
VIL
–0.6
VCC x 0.3
VCC + 0.5
0.4
VIH
Input High Level(1)
VCC x 0.7
V
VOL2
VOL1
Output Low Level VCC = 3.0V
Output Low Level VCC = 1.8V
IOL = 2.1 mA
V
IOL = 0.15 mA
0.2
V
Note:
1. VIL min and VIH max are reference only and are not tested.
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AT24C01A/02/04/08A/16A
Table 5. AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V,
CL = 1 TTL Gate and 100 pF (unless otherwise noted)
1.8-volt
2.7, 5.0-volt
Min Max
Symbol
fSCL
tLOW
tHIGH
tI
Parameter
Min
Max
Units
kHz
µs
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Noise Suppression Time(1)
Clock Low to Data Out Valid
100
400
4.7
4.0
1.2
0.6
µs
100
4.5
50
ns
tAA
0.1
4.7
0.1
1.2
0.9
µs
Time the bus must be free before
a new transmission can start(1)
tBUF
µs
tHD.STA
tSU.STA
tHD.DAT
tSU.DAT
tR
Start Hold Time
4.0
4.7
0
0.6
0.6
0
µs
µs
µs
ns
µs
ns
µs
ns
ms
Start Setup Time
Data In Hold Time
Data In Setup Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Setup Time
Data Out Hold Time
Write Cycle Time
200
100
1.0
0.3
tF
300
300
tSU.STO
tDH
4.7
0.6
50
100
tWR
5
5
Write
Cycles
Endurance(1)
5.0V, 25°C, Byte Mode
1M
1M
Note:
1. This parameter is characterized.
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0180V–SEEPR–8/05
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.
After a read sequence, the stop command will place the EEPROM in a standby power
mode (see Figure 5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the
EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has
received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode
which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the
completion of any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-
wire part can be reset by following these steps:
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition.
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AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
Bus Timing
Figure 2. SCL: Serial Clock, SDA: Serial Data I/O
Write Cycle Timing
Figure 3. SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
ACK
8th BIT
WORDn
(1)
wr
t
START
CONDITION
STOP
CONDITION
Note:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
Figure 4. Data Validity
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0180V–SEEPR–8/05
Figure 5. Start and Stop Definition
Figure 6. Output Acknowledge
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AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
Device Addressing
The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word
following a start condition to enable the chip for a read or write operation (refer to Figure
7).
The device address word consists of a mandatory one, zero sequence for the first four
most significant bits as shown. This is common to all the EEPROM devices.
The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM.
These 3 bits must compare to their corresponding hard-wired input pins.
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a
memory page address bit. The two device address bits must compare to their corre-
sponding hard-wired input pins. The A0 pin is no connect.
The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for
memory page addressing. The A2 bit must compare to its corresponding hard-wired
input pin. The A1 and A0 pins are no connect.
The 16K does not use any device address bits but instead the 3 bits are used for mem-
ory page addressing. These page addressing bits on the 4K, 8K and 16K devices
should be considered the most significant bits of the data word address which follows.
The A0, A1 and A2 pins are no connect.
The eighth bit of the device address is the read/write operation select bit. A read opera-
tion is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is
not made, the chip will return to a standby state.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the
device address word and acknowledgment. Upon receipt of this address, the EEPROM
will again respond with a zero and then clock in the first 8-bit data word. Following
receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condi-
tion. At this time the EEPROM enters an internally timed write cycle, tWR, to the
nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will
not respond until the write is complete (see Figure 8 on page 11).
PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K
and 16K devices are capable of 16-byte page writes.
A page write is initiated the same as a byte write, but the microcontroller does not send
a stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to seven
(1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a zero
after each data word received. The microcontroller must terminate the page write
sequence with a stop condition (see Figure 9 on page 11).
The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally
incremented following the receipt of each data word. The higher data word address bits
are not incremented, retaining the memory page row location. When the word address,
internally generated, reaches the page boundary, the following byte is placed at the
beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data
words are transmitted to the EEPROM, the data word address will “roll over” and previ-
ous data will be overwritten.
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0180V–SEEPR–8/05
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond
with a zero allowing the read or write sequence to continue.
Read
Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll
over” during read is from the last byte of the last memory page to the first byte of the first page.
The address “roll over” during write is from the last byte of the current page to the first byte of
the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowl-
edged by the EEPROM, the current address data word is serially clocked out. The
microcontroller does not respond with an input zero but does generate a following stop condi-
tion (see Figure 10 on page 12).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition.
The microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. The microcontroller does not respond with a zero but does generate a fol-
lowing stop condition (see Figure 11 on page 12).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a ran-
dom address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory
address limit is reached, the data word address will “roll over” and the sequential read will con-
tinue. The sequential read operation is terminated when the microcontroller does not respond
with a zero but does generate a following stop condition (see Figure 12 on page 12).
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AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
Figure 7. Device Address
MSB
8K
16K
Figure 8. Byte Write
Figure 9. Page Write
(* = DON’T CARE bit for 1K)
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0180V–SEEPR–8/05
Figure 10. Current Address Read
Figure 11. Random Read
(* = DON’T CARE bit for 1K)
Figure 12. Sequential Read
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0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
AT24C01A Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C01A-10PI-2.7
AT24C01A-10SI-2.7
AT24C01A-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C01A-10PI-1.8
AT24C01A-10SI-1.8
AT24C01A-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C01A-10PU-2.7(2)
AT24C01A-10PU-1.8(2)
AT24C01A-10SU-2.7(2)
AT24C01A-10SU-1.8(2)
AT24C01A-10TU-2.7(2)
AT24C01A-10TU-1.8(2)
AT24C01A-10TSU-1.8(2)
AT24C01AU3-10UU-1.8(2)
AT24C01AY1-10YU-1.8(2)
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
8U31
8Y1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C01A-W2.7-11(3)
AT24C01A-W1.8-11(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
8S1
8A2
8Y1
5TS1
8U3-1
Options
–2.7
–1.8
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
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0180V–SEEPR–8/05
AT24C02 Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C02-10PI-2.7
AT24C02N-10SI-2.7
AT24C02-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C02-10PI-1.8
AT24C02N-10SI-1.8
AT24C02-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C02-10PU-2.7(2)
AT24C02-10PU-1.8(2)
AT24C02N-10SU-2.7(2)
8P3
8P3
8S1
AT24C02N-10SU-1.8(2)
AT24C02-10TU-2.7(2)
8S1
8A2
Lead-free/Halogen-free/
Industrial Temperature
AT24C02-10TU-1.8(2)
AT24C02Y1-10YU-1.8(2)
AT24C02-10TSU-1.8(2)
AT24C02U3-10UU-1.8(2)
8A2
8Y1
5TS1
8U3-1
(–40°C to 85°C)
AT24C02-W2.7-11(3)
AT24C02-W1.8-11(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
8S1
8A2
8Y1
5TS1
8U3-1
Options
–2.7
–1.8
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
14
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
AT24C04 Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C04-10PI-2.7
AT24C04N-10SI-2.7
AT24C04-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C04-10PI-1.8
AT24C04N-10SI-1.8
AT24C04-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C04-10PU-2.7(2)
AT24C04-10PU-1.8(2)
AT24C04N-10SU-2.7(2)
AT24C04N-10SU-1.8(2)
AT24C04-10TU-2.7(2)
AT24C04-10TU-1.8(2)
AT24C04Y1-10YU-1.8(2)
AT24C04-10TSU-1.8(2)
AT24C04U3-10UU-1.8(2)
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
5TS1
8U3-1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C04-W2.7-11(3)
AT24C04-W1.8-11(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
8S1
8A2
8Y1
5TS1
8U3-1
Options
–2.7
–1.8
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
15
0180V–SEEPR–8/05
AT24C08A Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C08A-10PI-2.7
AT24C08AN-10SI-2.7
AT24C08A-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C08A-10PI-1.8
AT24C08AN-10SI-1.8
AT24C08A-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C08A-10PU-2.7(2)
AT24C08A-10PU-1.8(2)
AT24C08AN-10SU-2.7(2)
AT24C08AN-10SU-1.8(2)
AT24C08A-10TU-2.7(2)
AT24C08A-10TU-1.8(2)
AT24C08AY1-10YU-1.8(2)
AT24C08AY5-10YU-1.8(2)
AT24C08AU2-10UU-1.8(2
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y5
8U2-1
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
AT24C08A-W2.7-11(3)
AT24C08A-W1.8-11(3)
Die Sale
Die Sale
Industrial Temperature
(−40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8S1
8A2
8Y1
8Y5
8U2-1
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-Leaded, Miniature Array Package (MAP)
8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7
−1.8
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
16
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
AT24C16A Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C16A-10PI-2.7
AT24C16AN-10SI-2.7
AT24C16A-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C16A-10PI-1.8
AT24C16AN-10SI-1.8
AT24C16A-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C16A-10PU-2.7(2)
AT24C16A-10PU-1.8(2)
AT24C16AN-10SU-2.7(2)
AT24C16AN-10SU-1.8(2)
AT24C16A-10TU-2.7(2)
AT24C16A-10TU-1.8(2)
AT24C16AY1-10YU-1.8(2)
AT24C16AY5-10YU-1.8(2)
AT24C16AU2-10UU-1.8(2)
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y5
8U2-1
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
AT24C16A-W2.7-11(3)
AT24C16A-W1.8-11(3)
Die Sale
Die Sale
Industrial Temperature
(−40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8S1
8A2
8Y1
8Y5
8U2-1
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7
−1.8
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
17
0180V–SEEPR–8/05
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
MIN
–
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
–
NOM
–
NOTE
SYMBOL
D1
A2 A
A
2
A2
b
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
–
5
6
6
b2
b3
c
D
3
3
4
3
b2
L
D1
E
b3
4 PLCS
0.310
0.250
0.100 BSC
0.300 BSC
0.130
0.325
0.280
b
E1
e
Side View
eA
L
4
2
0.115
0.150
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
R
18
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
8S1 – JEDEC SOIC
C
1
E
E1
L
N
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
NOTE
SYMBOL
A1
A
–
–
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.00
3.99
6.20
C
D
E1
E
e
–
–
D
–
–
Side View
1.27 BSC
L
0.40
0˚
–
–
1.27
8˚
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
REV.
TITLE
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1
B
R
Small Outline (JEDEC SOIC)
19
0180V–SEEPR–8/05
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
3.00
NOTE
SYMBOL
D
2.90
3.10
2, 5
A
b
E
6.40 BSC
4.40
E1
A
4.30
–
4.50
1.20
1.05
0.30
3, 5
4
–
A2
b
0.80
0.19
1.00
e
A2
–
D
e
0.65 BSC
0.60
L
0.45
0.75
Side View
L1
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
DRAWING NO.
TITLE
REV.
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
2325 Orchard Parkway
San Jose, CA 95131
B
8A2
R
20
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
8Y1 – MAP
PIN 1 INDEX AREA
A
1
3
4
2
PIN 1 INDEX AREA
E1
D1
D
L
8
6
5
7
b
e
A1
E
Bottom View
End View
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
MIN
–
MAX
0.90
0.05
5.10
3.20
1.15
1.15
0.35
NOM
–
NOTE
A
A1
D
0.00
4.70
2.80
0.85
0.85
0.25
–
4.90
3.00
1.00
1.00
0.30
0.65 TYP
0.60
Side View
E
D1
E1
b
e
L
0.50
0.70
2/28/03
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package
(MAP) Y1
8Y1
C
R
21
0180V–SEEPR–8/05
5TS1 – SOT23
e1
C
4
5
E1
C
E
L
L1
1
3
2
End View
Top View
b
A2
A
Seating
Plane
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
MIN
–
MAX
1.10
0.10
1.00
0.20
NOM
–
NOTE
SYMBOL
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
A
2. Dimension D does not include mold flash, protrusions, or gate burrs.
A1
A2
c
0.00
0.70
0.08
–
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
0.90
–
4
D
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
–
2, 3
2, 3
2, 3
E
E1
L1
e
e1
b
0.30
0.50
4, 5
6/25/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
R
PO5TS1
A
22
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
AT24C01A/02/04/08A/16A
8U3-1 – dBGA2
E
D
1.
b
A1
PIN 1 BALL PAD CORNER
A2
Top View
A
PIN 1 BALL PAD CORNER
Side View
1
2
3
4
(d1)
d
7
6
5
8
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
MIN
0.71
0.10
0.40
0.20
MAX
0.91
0.20
0.50
0.30
NOM
0.81
NOTE
SYMBOL
Bottom View
8 SOLDER BALLS
A
A1
A2
b
0.15
0.45
0.25
D
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
E
e
e1
d
d1
6/24/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
PO8U3-1
A
R
23
0180V–SEEPR–8/05
Atmel Corporation
Atmel Operations
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Memory
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
Regional Headquarters
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
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Avenue de Rochepleine
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
ASIC/ASSP/Smart Cards
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
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0180V–SEEPR–8/05
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