AT24C08A_14 [ATMEL]

Schmitt Trigger, Filtered Inputs for Noise Suppression;
AT24C08A_14
型号: AT24C08A_14
厂家: ATMEL    ATMEL
描述:

Schmitt Trigger, Filtered Inputs for Noise Suppression

文件: 总20页 (文件大小:257K)
中文:  中文翻译
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Features  
Standard-voltage Operation  
– 2.7 (VCC = 2.7V to 5.5V)  
Automotive Temperature Range –40C to 125C  
Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),  
1024 x 8 (8K) or 2048 x 8 (16K)  
Two-wire Serial Interface  
Schmitt Trigger, Filtered Inputs for Noise Suppression  
Bidirectional Data Transfer Protocol  
400 kHz Compatibility  
Write Protect Pin for Hardware Data Protection  
8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes  
Partial Page Writes are Allowed  
Self-timed Write Cycle (5 ms max)  
High-reliability  
– Endurance: 1 Million Write Cycles  
– Data Retention: 100 Years  
8-lead JEDEC SOIC and 8-lead TSSOP Packages  
Two-wire  
Automotive  
Temperature  
Serial EEPROM  
1K (128 x 8)  
Description  
2K (256 x 8)  
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial  
electrically erasable and programmable read-only memory (EEPROM) organized as  
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many  
automotive applications where low-power and low-voltage operation are essential.  
The AT24C01A/02/04/08A/16A is available in space-saving 8-lead JEDEC SOIC and  
8-lead TSSOP packages and is accessed via a two-wire serial interface. In addition,  
the entire family is available in 2.7V (2.7V to 5.5V) versions.  
4K (512 x 8)  
8K (1024 x 8)  
16K (2048 x 8)  
AT24C01A(1)  
AT24C02(2)  
AT24C04  
AT24C08A  
AT24C16A(3)  
1. AT24C01A not recommended  
for new design; Replaced by  
AT24C01B Automotive.  
8-lead SOIC  
Table 1. Pin Configurations  
Pin Name  
A0 A2  
SDA  
Function  
A0  
A1  
1
2
3
4
8
7
6
5
VCC  
WP  
Address Inputs  
Serial Data  
A2  
SCL  
SDA  
GND  
SCL  
Serial Clock Input  
Write Protect  
No Connect  
WP  
8-lead TSSOP  
NC  
A0  
A1  
1
2
3
4
8
7
6
5
VCC  
WP  
A2  
SCL  
SDA  
GND  
2. AT24C02 not recommended for  
new design; Replaced by  
AT24C02B Automotive.  
3. AT24C16A not recommended  
for new design; replaced by  
AT24C16C Automotive.  
5092D–SEEPR–4/07  
Absolute Maximum Ratings  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Operating Temperature  55C to +125C  
Storage Temperature 65C to +150C  
Voltage on Any Pin  
with Respect to Ground1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Figure 1. Block Diagram  
Pin Description  
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each  
EEPROM device and negative edge clock data out of each device.  
SERIAL DATA (SDA): The SDA pin is bi-directional for serial data transfer. This pin is  
open-drain driven and may be wire-ORed with any number of other open-drain or open-  
collector devices.  
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device  
address inputs that are hard wired for the AT24C01A and the AT24C02. As many as  
eight 1K/2K devices may be addressed on a single bus system (device addressing is  
discussed in detail under the Device Addressing section).  
The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K  
devices may be addressed on a single bus system. The A0 pin is a no connect.  
2
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K  
devices may be addressed on a single bus system. The A0 and A1 pins are no  
connects.  
The AT24C16A does not use the device address pins, which limits the number of  
devices on a single bus to one. The A0, A1 and A2 pins are no connects.  
WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that  
provides hardware data protection. The Write Protect pin allows normal read/write oper-  
ations when connected to ground (GND). When the Write Protect pin is connected to  
VCC, the write protection feature is enabled and operates as shown in the following  
table.  
Table 2. Write Protect  
Part of the Array Protected  
WP Pin  
Status  
At VCC  
At GND  
24C01A  
24C02  
24C04  
24C08A  
24C16A  
Full (1K) Array  
Full (2K) Array  
Full (4K) Array  
Full (8K) Array  
Full (16K) Array  
Normal Read/Write Operations  
Memory Organization AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,  
the 1K requires a 7-bit data word address for random word addressing.  
AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,  
the 2K requires an 8-bit data word address for random word addressing.  
AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,  
the 4K requires a 9-bit data word address for random word addressing.  
AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each,  
the 8K requires a 10-bit data word address for random word addressing.  
AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes  
each, the 16K requires an 11-bit data word address for random word addressing.  
3
5092D–SEEPR–4/07  
Table 3. Pin Capacitance(1)  
Applicable over recommended operating range from TA = 25C, f = 1.0 MHz, VCC = +2.7V  
Symbol  
CI/O  
Test Condition  
Max  
8
Units  
pF  
Conditions  
VI/O = 0V  
VIN = 0V  
Input/Output Capacitance (SDA)  
Input Capacitance (A0, A1, A2, SCL)  
CIN  
6
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
Table 4. DC Characteristics  
Applicable over recommended operating range from: TA = 40C to +125C, VCC = +2.7V to +5.5V (unless otherwise noted)  
Symbol  
VCC1  
ICC  
Parameter  
Test Condition  
Min  
Typ  
Max  
5.5  
Units  
V
Supply Voltage  
2.7  
Supply Current VCC = 5.0V  
Supply Current VCC = 5.0V  
Standby Current VCC = 2.7V  
Standby Current VCC = 5.0V  
Input Leakage Current  
Output Leakage Current  
Input Low Level(1)  
Read at 100 kHz  
Write at 100 kHz  
VIN = VCC or VSS  
VIN = VCC or VSS  
VIN = VCC or VSS  
VOUT = VCC or VSS  
0.4  
2.0  
1.0  
mA  
mA  
µA  
µA  
µA  
µA  
V
ICC  
3.0  
ISB1  
ISB2  
ILI  
1.6  
4.0  
8.0  
18.0  
3.0  
0.10  
0.05  
ILO  
3.0  
VIL  
0.6  
VCC x 0.3  
VCC + 0.5  
0.4  
VIH  
Input High Level(1)  
VCC x 0.7  
V
VOL2  
VOL1  
Output Low Level VCC = 3.0V  
Output Low Level VCC = 1.8V  
IOL = 2.1 mA  
V
IOL = 0.15 mA  
0.2  
V
Note:  
1. VIL min and VIH max are reference only and are not tested.  
4
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
Table 5. AC Characteristics  
Applicable over recommended operating range from TA = 40C to +125C, VCC = +2.7V to +5.5V, CL = 1 TTL Gate and  
100 pF (unless otherwise noted)  
AT24C01A/02/04/08A/16A  
Symbol  
fSCL  
Parameter  
Min  
Max  
Units  
kHz  
µs  
Clock Frequency, SCL  
Clock Pulse Width Low  
Clock Pulse Width High  
Noise Suppression Time(1)  
Clock Low to Data Out Valid  
400  
tLOW  
tHIGH  
tI  
1.2  
0.6  
µs  
50  
ns  
tAA  
0.1  
1.2  
0.9  
µs  
Time the bus must be free before  
a new transmission can start(2)  
tBUF  
µs  
tHD.STA  
tSU.STA  
tHD.DAT  
tSU.DAT  
tR  
Start Hold Time  
0.6  
0.6  
0
µs  
Start Set-up Time  
Data In Hold Time  
Data In Set-up Time  
Inputs Rise Time(2)  
Inputs Fall Time(2)  
Stop Set-up Time  
Data Out Hold Time  
Write Cycle Time  
5.0V, 25C, Page Mode  
µs  
µs  
100  
ns  
300  
300  
ns  
tF  
ns  
tSU.STO  
tDH  
0.6  
50  
µs  
ns  
tWR  
5
ms  
Endurance(2)  
1M  
Write Cycles  
Note:  
1. This parameter is characterized and is not 100% tested (TA = 25C).  
2. This parameter is characterized.  
Device Operation  
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-  
nal device. Data on the SDA pin may change only during SCL low time periods (see to  
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop  
condition as defined below.  
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition  
which must precede any other command (see to Figure 5 on page 7).  
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.  
After a read sequence, the stop command will place the EEPROM in a standby power  
mode (see Figure 5 on page 7).  
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the  
EEPROM in 8-bit words. The EEPROM sends a “0” to acknowledge that it has received  
each word. This happens during the ninth clock cycle.  
STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode  
which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the  
completion of any internal operations.  
5
5092D–SEEPR–4/07  
MEMORY RESET: After an interruption in protocol, power loss or system reset, any  
two-wire part can be reset by following these steps:  
1. Clock up to 9 cycles.  
2. Look for SDA high in each cycle while SCL is high.  
3. Create a start condition.  
Bus Timing  
Figure 2. SCL: Serial Clock, SDA: Serial Data I/O  
Write Cycle Timing  
Figure 3. SCL: Serial Clock, SDA: Serial Data I/O  
SCL  
SDA  
ACK  
8th BIT  
WORDn  
(1)  
wr  
t
START  
CONDITION  
STOP  
CONDITION  
Note:  
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.  
6
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
Figure 4. Data Validity  
Figure 5. Start and Stop Definition  
SDA  
SCL  
START  
STOP  
Figure 6. Output Acknowledge  
7
5092D–SEEPR–4/07  
Device Addressing  
The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word  
following a start condition to enable the chip for a read or write operation (see to Figure  
7 on page 9).  
The device address word consists of a mandatory “1”, “0” sequence for the first four  
most significant bits as shown. This is common to all the Serial EEPROM devices.  
The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM.  
These 3 bits must compare to their corresponding hardwired input pins.  
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a  
memory page address bit. The two device address bits must compare to their corre-  
sponding hardwired input pins. The A0 pin is no connect.  
The 8K EEPROM only uses the A2 device address bit with the next two bits being for  
memory page addressing. The A2 bit must compare to its corresponding hardwired  
input pin. The A1 and A0 pins are no connect.  
The 16K does not use any device address bits but instead the three bits are used for  
memory page addressing. These page addressing bits on the 4K, 8K and 16K devices  
should be considered the most significant bits of the data word address which follows.  
The A0, A1 and A2 pins are no connect.  
The eighth bit of the device address is the read/write operation select bit. A read opera-  
tion is initiated if this bit is high and a write operation is initiated if this bit is low.  
Upon a compare of the device address, the EEPROM will output a “0”. If a compare is  
not made, the chip will return to a standby state.  
Write Operations  
BYTE WRITE: A write operation requires an 8-bit data word address following the  
device address word and acknowledgment. Upon receipt of this address, the EEPROM  
will again respond with a “0” and then clock in the first 8-bit data word. Following receipt  
of the 8-bit data word, the EEPROM will output a “0” and the addressing device, such as  
a microcontroller, must terminate the write sequence with a stop condition. At this time  
the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All  
inputs are disabled during this write cycle and the EEPROM will not respond until the  
write is complete (see Figure 8 on page 10).  
PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K  
and 16K devices are capable of 16-byte page writes.  
A page write is initiated the same as a byte write, but the microcontroller does not send  
a stop condition after the first data word is clocked in. Instead, after the EEPROM  
acknowledges receipt of the first data word, the microcontroller can transmit up to seven  
(1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a “0”  
after each data word received. The microcontroller must terminate the page write  
sequence with a stop condition (see Figure 9 on page 10).  
The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally  
incremented following the receipt of each data word. The higher data word address bits  
are not incremented, retaining the memory page row location. When the word address,  
internally generated, reaches the page boundary, the following byte is placed at the  
beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data  
words are transmitted to the EEPROM, the data word address will “roll over” and previ-  
ous data will be overwritten.  
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the  
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send-  
8
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
ing a start condition followed by the device address word. The read/write bit is  
representative of the operation desired. Only if the internal write cycle has completed  
will the EEPROM respond with a “0”, allowing the read or write sequence to continue.  
Read Operations  
Read operations are initiated the same way as write operations with the exception that  
the read/write select bit in the device address word is set to “1”. There are three read  
operations: current address read, random address read and sequential read.  
CURRENT ADDRESS READ: The internal data word address counter maintains the  
last address accessed during the last read or write operation, incremented by one. This  
address stays valid between operations as long as the chip power is maintained. The  
address “roll over” during read is from the last byte of the last memory page to the first  
byte of the first page. The address “roll over” during write is from the last byte of the cur-  
rent page to the first byte of the same page.  
Once the device address with the read/write select bit set to “1” is clocked in and  
acknowledged by the EEPROM, the current address data word is serially clocked out.  
The microcontroller does not respond with an input “0” but does generate a following  
stop condition (see Figure 10 on page 10).  
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the  
data word address. Once the device address word and data word address are clocked  
in and acknowledged by the EEPROM, the microcontroller must generate another start  
condition. The microcontroller now initiates a current address read by sending a device  
address with the read/write select bit high. The EEPROM acknowledges the device  
address and serially clocks out the data word. The microcontroller does not respond  
with a “0” but does generate a following stop condition (see Figure 11 on page 11).  
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or  
a random address read. After the microcontroller receives a data word, it responds with  
an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to  
increment the data word address and serially clock out sequential data words. When the  
memory address limit is reached, the data word address will “roll over” and the sequen-  
tial read will continue. The sequential read operation is terminated when the  
microcontroller does not respond with a “0” but does generate a following stop condition  
(see Figure 12 on page 11).  
Figure 7. Device Address  
MSB  
9
5092D–SEEPR–4/07  
Figure 8. Byte Write  
Figure 9. Page Write  
(* = DON’T CARE bit for 1K)  
Figure 10. Current Address Read  
10  
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
Figure 11. Random Read  
(* = DON’T CARE bit for 1K)  
Figure 12. Sequential Read  
11  
5092D–SEEPR–4/07  
AT24C01A Ordering Information(1)  
Ordering Code  
Package  
Operation Range  
AT24C01A-10SQ-2.7  
AT24C01A-10TQ-2.7  
8S1  
8A2  
Lead-free/Halogen-free/Automotive  
Temperature  
(40C to 125C)  
Note:  
1. This device is not recommended for new design. Please refer to AT24C01B Automotive datasheet.  
Package Type  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
8S1  
8A2  
2.7  
Low-voltage (2.7V to 5.5V)  
12  
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
AT24C02 Ordering Information(1)  
Ordering Code  
Package  
Operation Range  
AT24C02N-10SQ-2.7  
AT24C02-10TQ-2.7  
8S1  
8A2  
Lead-free/Halogen-free/Automotive  
Temperature  
(40C to 125C)  
Note:  
1. This device is not recommended for new design. Please refer to AT24C02B Automotive datasheet.  
Package Type  
8S1  
8A2  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
2.7  
Low-voltage (2.7V to 5.5V)  
13  
5092D–SEEPR–4/07  
AT24C04 Ordering Information  
Ordering Code  
Package  
Operation Range  
AT24C04N-10SQ-2.7  
AT24C04-10TQ-2.7  
8S1  
8A2  
Lead-free/Halogen-free/Automotive  
Temperature  
(40C to 125C)  
Package Type  
8S1  
8A2  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
2.7  
Low-voltage (2.7V to 5.5V)  
14  
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
AT24C08A Ordering Information  
Ordering Code  
Package  
Operation Range  
8S1  
8A2  
Lead-free/Halogen-free/  
Automotive Temperature  
(40C to 125C)  
AT24C08AN-10SQ-2.7  
AT24C08A-10TQ-2.7  
Note:  
For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables  
(Table 4 on page 4 and Table 5 on page 5).  
Package Type  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
8S1  
8A2  
2.7  
Low Voltage (2.7V to 5.5V)  
15  
5092D–SEEPR–4/07  
AT24C16A Ordering Information  
Ordering Code  
Package  
Operation Range  
AT24C16AN-10SQ-2.7  
AT24C16A-10TQ-2.7  
8S1  
8A2  
Lead-free/Halogen-free/  
Automotive Temperature  
(40C to 125C)  
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables  
(Table 4 on page 4 and Table 5 on page 5).  
2. AT24C16A not recommended for new design; replaced by AT24C16C Automotive.  
Package Type  
8S1  
8A2  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
2.7  
Low Voltage (2.7V to 5.5V)  
16  
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
Packaging Information  
8S1 – JEDEC SOIC  
C
1
E
E1  
L
N
Top View  
End View  
e
B
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.35  
0.10  
MAX  
1.75  
0.25  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
0.31  
0.17  
4.80  
3.81  
5.79  
0.51  
0.25  
5.00  
3.99  
6.20  
C
D
E1  
E
D
Side View  
e
1.27 BSC  
L
0.40  
0˚  
1.27  
8˚  
Note:  
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.  
10/7/03  
REV.  
TITLE  
DRAWING NO.  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
B
R
Small Outline (JEDEC SOIC)  
17  
5092D–SEEPR–4/07  
8A2 – TSSOP  
3
2 1  
Pin 1 indicator  
this corner  
E1  
E
L1  
N
L
Top View  
End View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
3.00  
NOTE  
SYMBOL  
D
2.90  
3.10  
2, 5  
A
b
E
6.40 BSC  
4.40  
E1  
A
4.30  
4.50  
1.20  
1.05  
0.30  
3, 5  
4
A2  
b
0.80  
0.19  
1.00  
e
A2  
D
e
0.65 BSC  
0.60  
L
0.45  
0.75  
Side View  
L1  
1.00 REF  
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,  
datums, etc.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm  
(0.010 in) per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the  
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
5/30/02  
DRAWING NO.  
TITLE  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8A2, 8-lead, 4.4 mm Body, Plastic  
Thin Shrink Small Outline Package (TSSOP)  
B
8A2  
R
18  
AT24C01A/02/04/08A/16A  
5092D–SEEPR–4/07  
AT24C01A/02/04/08A/16A  
Revision History  
Doc. Rev.  
Date  
Comments  
5092D  
8/2012  
AT24C16A not recommended for new design; replaced by  
AT24C16C Automotive.  
5092D  
5092C  
4/2007  
2/2007  
Added ‘Not recommended for new design’ notes to AT24C01A and  
AT24C02 on pages 1, 12 and 13.  
Implemented revision history.  
Removed PDIP offering and parts.  
Added ‘AT24C02 Not Recommended for New Design’ note to page  
1.  
19  
5092D–SEEPR–4/07  
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5092D–SEEPR–4/07  

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