AT24C11-10TSU-2.7 [ATMEL]
EEPROM, 128X8, Serial, CMOS, PDSO5, 1.60 MM, LEAD AND HALOGEN FREE, PLASTIC, SOT-23, 5 PIN;型号: | AT24C11-10TSU-2.7 |
厂家: | ATMEL |
描述: | EEPROM, 128X8, Serial, CMOS, PDSO5, 1.60 MM, LEAD AND HALOGEN FREE, PLASTIC, SOT-23, 5 PIN 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路 |
文件: | 总15页 (文件大小:230K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• Low Voltage and Standard Voltage Operation
– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 128 x 8
• Two-wire Serial Interface
• Bidirectional Data Transfer Protocol
• 400 kHz (1.8V) and 1 MHz (2.5V, 2.7V, 5V) Compatibility
• 4-Byte Page Write Mode
• Self-Timed Write Cycle (5 ms max)
• High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
• Automotive Grade, Extended Temperature and Lead-Free/Halogen-Free
Devices Available
• 8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP Packages
• Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers
• Access to One Additional Page Upon Request
Two-wire Serial
EEPROM
1K (128 x 8)
AT24C11
Description
The AT24C11 provides 1024 bits of serial electrically erasable and programmable
read only memory (EEPROM) organized as 128 words of 8 bits each. The device is
optimized for use in many industrial and commercial applications where low power
and low voltage operation are essential. The AT24C11 is available in space saving
8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP packages and is
accessed via a two-wire serial interface. In addition, the entire family is available in
2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.
Table 1. Pin Configuration
8-lead TSSOP
Pin Name
NC
Function
NC
NC
1
8
7
6
5
VCC
TEST
SCL
No Connect
2
3
4
NC
SDA
Serial Data
GND
SDA
SCL
Serial Clock Input
Test Input (GND or VCC)
TEST
8-lead SOIC
8-lead PDIP
NC
1
8
7
6
5
VCC
NC
1
2
3
4
8
7
6
5
VCC
TEST
SCL
NC
NC
2
TEST
SCL
NC
NC
3
4
GND
SDA
GND
SDA
5-lead SOT23
SCL
1
2
3
5
4
TEST
VCC
GND
SDA
Rev. 3409D–SEEPR–11/04
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Operating Temperature..................................–55°C to +125°C
Storage Temperature.....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground....................................–1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
2
AT24C11
3409D–SEEPR–11/04
AT24C11
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open
collector devices.
Memory Organization AT24C11, 1K SERIAL EEPROM: Internally organized with 32 pages of 4 bytes each.
The 1K requires a 7-bit data word address for random word addressing. Access to one
additional page (33rd page) available upon request.
Table 2. Pin Capacitance
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V.
Symbol
CI/O
Test Condition
Max
8
Units
pF
Condition
VI/O = 0V
VIN = 0V
Input/Output Capacitance (SDA)
Input Capacitance (A0, A1, A2, SCL)
CIN
6
pF
Table 3. DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V
(unless otherwise noted).
Symbol
VCC1
VCC2
VCC3
VCC4
ICC
Parameter
Test Condition
Min
1.8
2.5
2.7
4.5
Typ
Max
5.5
Units
V
Supply Voltage
Supply Voltage
5.5
V
Supply Voltage
5.5
V
Supply Voltage
5.5
V
Supply Current VCC = 5.0V
Supply Current VCC = 5.0V
Standby Current VCC = 1.8V
Standby Current VCC = 2.5V
Standby Current VCC = 2.7V
Standby Current VCC = 5.0V
Input Leakage Current
Output Leakage Current
Input Low Level(1)
READ at 100 kHz
WRITE at 100 kHz
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VOUT = VCC or VSS
0.4
2.0
1.0
mA
mA
µA
µA
µA
µA
µA
µA
V
ICC
3.0
ISB1
ISB2
ISB3
ISB4
ILI
0.6
3.0
1.4
4.0
1.6
4.0
8.0
18.0
3.0
0.10
0.05
ILO
3.0
VIL
–0.6
VCC × 0.3
VCC + 0.5
0.4
VIH
Input High Level(1)
VCC × 0.7
V
VOL2
VOL1
Output Low Level VCC = 3.0V
Output Low Level VCC = 1.8V
IOL = 2.1 mA
V
IOL = 0.15 mA
0.2
V
Note:
1. VIL min and VIH max are reference only and are not tested.
3
3409D–SEEPR–11/04
Table 4. AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
1.8V
2.7V, 2.5V, 5.0V
Symbol
fSCL
Parameter
Min
Max
Min
Max
Units
kHz
µs
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Clock Low to Data Out Valid
400
1000
tLOW
1.2
0.6
0.1
0.4
0.4
tHIGH
tAA
µs
0.9
0.05
0.55
µs
Time the bus must be free before a new
transmission can start(1)
tBUF
1.2
0.5
µs
tHD.STA
tSU.STA
tHD.DAT
tSU.DAT
tR
Start Hold Time
0.6
0.6
0
0.25
0.6
0
µs
µs
µs
ns
µs
ns
µs
ns
ms
Start Set-up Time
Data In Hold Time
Data In Set-up Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Set-up Time
Data Out Hold Time
Write Cycle Time
100
100
0.3
0.3
tF
300
100
tSU.STO
tDH
0.6
50
0.25
50
tWR
5
5
Write
Cycles
Endurance(1)
5.0V, 25°C, Page Mode
1M
1M
Note:
1. This parameter is characterized and is not 100% tested.
4
AT24C11
3409D–SEEPR–11/04
AT24C11
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 6). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 7).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition
which terminates all communications. After a read sequence, the stop command will
place the EEPROM in a standby power mode (see Figure 5 on page 7).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from
the EEPROM in 8-bit words. Any device on the system bus receiving data (when com-
municating with the EEPROM) must pull the SDA bus low to acknowledge that it has
successfully received each word. This must happen during the ninth clock cycle after
each word received and after all other system devices have freed the SDA bus. The
EEPROM will likewise acknowledge by pulling SDA low after receiving each address or
data word (see Figure 6 on page 7).
STANDBY MODE: The AT24C11 features a low power standby mode which is enabled:
(a) upon power-up and (b) after the receipt of the STOP bit and the completion of any
internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-
wire part can be reset by following these steps:
(a) clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then
(c) create a start condition as SDA is high.
5
3409D–SEEPR–11/04
Figure 2. Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
Figure 3. Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
ACK
8th BIT
WORDn
(1)
wr
t
START
CONDITION
STOP
CONDITION
Note:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
Figure 4. Data Validity
6
AT24C11
3409D–SEEPR–11/04
AT24C11
Figure 5. Start and Stop Definition
Figure 6. Output Acknowledge
7
3409D–SEEPR–11/04
Write Operations
BYTE WRITE: Following a start condition, a write operation requires a 7-bit data word
address and a low write bit. Upon receipt of this address, the EEPROM will again
respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-
bit data word, the EEPROM will output a zero and the addressing device, such as a
microcontroller, must terminate the write sequence with a stop condition. At this time the
EEPROM enters an internally-timed write cycle to the nonvolatile memory. All inputs are
disabled during this write cycle, tWR, and the EEPROM will not respond until the write is
complete (see Figure 7 on page 9).
PAGE WRITE: The AT24C11 is capable of a 4-byte page write.
A page write is initiated the same as a byte write but the microcontroller does not send a
stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to three
more data words. The EEPROM will respond with a zero after each data word received.
The microcontroller must terminate the page write sequence with a stop condition (see
Figure 8 on page 9).
The data word address lower 2 bits are internally incremented following the receipt of
each data word. The higher five data word address bits are not incremented, retaining
the memory page row location. When the word address, internally generated, reaches
the page boundary, the following byte is placed at the beginning of the same page. If
more than four data words are transmitted to the EEPROM, the data word address will
“roll over” and previous data will be overwritten. Access to 1 additional page is available
upon request.
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send-
ing a start condition followed by the device address word. The read/write bit is
representative of the operation desired. Only if the internal write cycle has completed
will the EEPROM respond with a zero allowing the read or write sequence to continue.
Read Operations
Read operations are initiated the same way as write operations with the exception that
the read/write select bit in the device address word is set to one. There are two read
operations: byte read and sequential read.
BYTE READ: A byte read is initiated with a start condition followed by a 7-bit data word
address and a high read bit. The AT24C11 will respond with an acknowledge and then
serially output 8 data bits. The microcontroller does not respond with a zero but does
generate a following stop condition (see Figure 9 on page 9).
SEQUENTIAL READ: Sequential reads are initiated the same as a byte read. After the
microcontroller receives an 8-bit data word, it responds with an acknowledge. As long as
the EEPROM receives an acknowledge, it will continue to increment the data word
address and serially clock out sequential data words. When the memory address limit is
reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with
an input zero but does generate a following stop condition (see Figure 10 on page 9).
8
AT24C11
3409D–SEEPR–11/04
AT24C11
Figure 7. Byte Write
Figure 8. Page Write
Figure 9. Byte Read
Figure 10. Sequential Read
9
3409D–SEEPR–11/04
AT24C11 Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C11-10PI-2.7
AT24C11N-10SI-2.7
AT24C11-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C11-10PI-1.8
AT24C11N-10SI-1.8
AT24C11-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C11-10PU-2.7
AT24C11-10PU-1.8
AT24C11N-10SU-2.7
AT24C11N-10SU-1.8
AT24C11-10TU-2.7
AT24C11-10TU-1.8
AT24C11-10TSU-2.7
AT24C11-10TSU-1.8
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
5TS1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C11-W2.7-11(2)
AT24C11-W1.8-11(2)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
2. Die sales available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die sales available upon request.
Please contact Serial EEPROM Marketing.
Package Type
8P3
8S1
8A2
5TS1
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
Options
–2.7
–1.8
Low-Voltage (2.7V to 5.5V)
Low-Voltage (1.8V to 5.5V)
10
AT24C11
3409D–SEEPR–11/04
AT24C11
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
MIN
MAX
NOM
NOTE
SYMBOL
D1
A2 A
A
0.210
0.195
0.022
0.070
0.045
0.014
0.400
2
A2
b
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
5
6
6
b2
b3
c
D
3
3
4
3
b2
L
D1
E
b3
4 PLCS
0.310
0.250
0.325
0.280
b
E1
e
0.100 BSC
0.300 BSC
0.115
Side View
eA
L
4
0.130
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
R
11
3409D–SEEPR–11/04
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
NOTE
SYMBOL
A1
A
–
–
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.00
3.99
6.20
C
D
E1
E
–
–
D
–
–
Side View
e
1.27 BSC
L
0.40
0˚
–
–
1.27
8˚
∅
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
REV.
TITLE
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1
B
R
Small Outline (JEDEC SOIC)
12
AT24C11
3409D–SEEPR–11/04
AT24C11
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
3.00
NOTE
SYMBOL
D
2.90
3.10
2, 5
A
b
E
6.40 BSC
4.40
E1
A
4.30
–
4.50
1.20
1.05
0.30
3, 5
4
–
A2
b
0.80
0.19
1.00
e
A2
–
D
e
0.65 BSC
0.60
L
0.45
0.75
Side View
L1
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
DRAWING NO.
TITLE
REV.
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
2325 Orchard Parkway
San Jose, CA 95131
B
8A2
R
13
3409D–SEEPR–11/04
5TS1 – SOT23
e1
C
4
5
E1
E
C
L
L1
3
1
2
TOP VIEW
END VIEW
b
A2
A
SEATING
PLANE
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SIDE VIEW
MIN
-
0.00
MAX
1.10
0.10
NOM
NOTE
SYMBOL
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
A
-
-
A
A
c
1
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
2
0.70 0.90 1.00
0.08
-
0.20
3
D
E
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
1,2
1,2
1,2
E1
L
e
e
b
1
1
This drawing is for general information only. Refer to
JEDEC Drawing MO-193, Variation AB for additional
information.
0.30
-
0.50 3,4
6/20/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
R
PO5TS1
A
14
AT24C11
3409D–SEEPR–11/04
Atmel Corporation
Atmel Operations
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Memory
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
Regional Headquarters
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
ASIC/ASSP/Smart Cards
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-
TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Atmel’s products are not
intended, authorized, or warranted for use as components in applications intended to support or sustain life.
© Atmel Corporation 2004. All rights reserved. Atmel®, logo and combinations thereof, are registered trademarks, and Everywhere You AreSM
is the trademark of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Printed on recycled paper.
3409D–SEEPR–11/04
相关型号:
AT24C11N-10SJ-2.7
EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012AA, SOIC-8
ATMEL
AT24C11N-10SQ-2.7
EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012AA, SOIC-8
ATMEL
©2020 ICPDF网 联系我们和版权申明