AT25640A-10PE-2.7 概述
SPI Serial EEPROMs SPI串行EEPROM EEPROM
AT25640A-10PE-2.7 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP8,.3 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.67 | 最大时钟频率 (fCLK): | 5 MHz |
数据保留时间-最小值: | 100 | 耐久性: | 1000000 Write/Erase Cycles |
JESD-30 代码: | R-PDIP-T8 | JESD-609代码: | e0 |
长度: | 9.271 mm | 内存密度: | 65536 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 8192 words | 字数代码: | 8000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 8KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP8,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 5.334 mm |
串行总线类型: | SPI | 最大待机电流: | 0.00001 A |
子类别: | EEPROMs | 最大压摆率: | 0.007 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
最长写入周期时间 (tWC): | 5 ms | 写保护: | HARDWARE/SOFTWARE |
Base Number Matches: | 1 |
AT25640A-10PE-2.7 数据手册
通过下载AT25640A-10PE-2.7数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Features
• Serial Peripheral Interface (SPI) Compatible
• Supports SPI Modes 0 (0,0) and 3 (1,1)
– Data Sheet Describes Mode 0 Operation
• Medium-voltage and Standard-voltage Operation
– 2.7 (VCC = 2.7V to 5.5V)
• Extended Temperature Range –40°C to 125°C
• 5.0 MHz Clock Rate
• 32-byte Page Mode
• Block Write Protection
– Protect 1/4, 1/2, or Entire Array
• Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software
Data Protection
• Self-timed Write Cycle (2 ms [5V] typical)
• High Reliability
– Endurance: One Million Write Cycles
– Data Retention: 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC Packages and 8-lead TSSOP Packages
SPI Serial
Extended
Temperature
EEPROMs
8K (1024 x 8)
16K (2048 x 8)
32K (4096 x 8)
64K (8192 x 8)
Description
The AT25080A/160A/320A/640A provides 8192/16384/32768/65536 bits of serial
electrically-erasable programmable read-only memory (EEPROM) organized as
1024/2048/4096/8192 words of 8 bits each. The device is optimized for use in many
automotive applications where low-power and low-voltage operation are essential.
The AT25080A/160A/320A/640A is available in space-saving 8-lead PDIP, 8-lead
JEDEC SOIC and 8-lead TSSOP packages.
The AT25080A/160A/320A/640A is enabled through the Chip Select pin (CS) and
accessed via a three-wire interface consisting of Serial Data Input (SI), Serial Data
Output (SO), and Serial Clock (SCK). All programming cycles are completely self-
timed, and no separate erase cycle is required before write.
AT25080A
AT25160A
AT25320A
AT25640A
Block write protection is enabled by programming the status register with one of four
blocks of write protection. Separate program enable and program disable instructions
are provided for additional data protection. Hardware data protection is provided via
the WP pin to protect against inadvertent write attempts to the status register. The
HOLD pin may be used to suspend any serial communication without resetting the
serial sequence.
8-lead PDIP
Table 1. Pin Configurations
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
CS
SO
Pin Name
CS
Function
WP
Chip Select
GND
SCK
SI
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
8-lead SOIC
CS
SO
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
SO
WP
GND
VCC
WP
GND
Power Supply
Write Protect
Suspends Serial Input
No Connect
8-lead TSSOP
CS
SO
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
HOLD
NC
WP
GND
DC
Don’t Connect
5082B–SEEPR–1/05
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Operating Temperature......................................−40°C to +125°C
Storage Temperature .........................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground........................................ −1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
2
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
Table 2. Pin Capacitance(1)
Applicable over recommended operating range from TAE = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)
Symbol
COUT
CIN
Test Conditions
Max
8
Units
pF
Conditions
VOUT = 0V
VIN = 0V
Output Capacitance (SO)
Input Capacitance (CS, SCK, SI, WP, HOLD)
6
pF
Note:
1. This parameter is characterized and is not 100% tested.
Table 3. DC Characteristics
Applicable over recommended operating range from: TAE = −40°C to +125°C, VCC = +2.7V to +5.5V
Symbol
VCC1
ICC1
Parameter
Test Condition
Min
Typ
Max
5.5
6.0
3.0
7.0
Units
V
Supply Voltage
Supply Current
Supply Current
Supply Current
2.7
VCC = 5.0V at 5 MHz, SO = Open, Read
VCC = 5.0V at 1 MHz
mA
mA
mA
ICC2
ICC3
VCC = 5.0V at 5 MHz, SO = Open,
Read, Write
ISB1
ISB2
IIL
Standby Current
Standby Current
Input Leakage
VCC = 2.7V, CS = VCC
VCC = 5.0V, CS = VCC
VIN = 0V to VCC
0.2
2.0
10.0(1)
13.0(1)
µA
µA
µA
µA
V
−3.0
−3.0
IOL
Output Leakage
Input Low-voltage
Input High-voltage
Output Low-voltage
Output High-voltage
VIN = 0V to VCC
3.0
(2)
VIL
−0.6
VCC x 0.3
VCC + 0.5
0.4
(2)
VIH
VCC x 0.7
V
VOL1
VOH1
I
OL = 3.0 mA
V
2.7V ≤ VCC ≤ 5.5V
IOH = −1.6 mA
VCC − 0.8
V
Note:
1. Worst case measured at 125°C
2. VIL min and VIH max are reference only and are not tested.
3
5082B–SEEPR–1/05
Table 4. AC Characteristics
Applicable over recommended operating range from TAE = −40°C to +125°C, VCC = As Specified,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
Symbol
Parameter
Voltage
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
2.7–5.5
Min
Max
5.0
2
Units
fSCK
SCK Clock Frequency
Input Rise Time
Input Fall Time
0
MHz
tRI
µs
tFI
2
µs
tWH
SCK High Time
SCK Low Time
40
40
80
80
80
5
ns
tWL
ns
tCS
CS High Time
ns
tCSS
CS Setup Time
ns
tCSH
CS Hold Time
ns
tSU
Data In Setup Time
Data In Hold Time
Hold Setup Time
Hold Hold Time
Output Valid
ns
tH
20
40
40
0
ns
tHD
ns
tCD
ns
tV
40
ns
tHO
Output Hold Time
Hold to Output Low Z
Hold to Output High Z
Output Disable Time
Write Cycle Time
5.0V, 25°C, Page Mode
0
ns
tLZ
0
40
80
80
5
ns
tHZ
ns
ns
tDIS
tWC
ms
Endurance(1)
1M
Write Cycles
Note:
1. This parameter is characterized and is not 100% tested.
4
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
Serial Interface
Description
MASTER: The device that generates the serial clock.
SLAVE: Because the serial clock pin (SCK) is always an input, the
AT25080A/160A/320A/640A always operates as a slave.
TRANSMITTER/RECEIVER: The AT25080A/160A/320A/640A has separate pins des-
ignated for data transmission (SO) and reception (SI).
MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.
SERIAL OP-CODE: After the device is selected with CS going low, the first byte will be
received. This byte contains the op-code that defines the operations to be performed.
INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the
AT25080A/160A/320A/640A, and the serial output pin (SO) will remain in a high imped-
ance state until the falling edge of CS is detected again. This will reinitialize the serial
communication.
CHIP SELECT: The AT25080A/160A/320A/640A is selected when the CS pin is low.
When the device is not selected, data will not be accepted via the SI pin, and the serial
output pin (SO) will remain in a high impedance state.
HOLD: The HOLD pin is used in conjunction with the CS pin to select the
AT25080A/160A/320A/640A. When the device is selected and a serial sequence is
underway, HOLD can be used to pause the serial communication with the master device
without resetting the serial sequence. To pause, the HOLD pin must be brought low
while the SCK pin is low. To resume serial communication, the HOLD pin is brought high
while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be
ignored while the SO pin is in the high impedance state.
WRITE PROTECT: The write protect pin (WP) will allow normal read/write operations
when held high. When the WP pin is brought low and WPEN bit is “1”, all write opera-
tions to the status register are inhibited. WP going low while CS is still low will interrupt a
write to the status register. If the internal write cycle has already been initiated, WP
going low will have no effect on any write operation to the status register. The WP pin
function is blocked when the WPEN bit in the status register is "0". This will allow the
user to install the AT25080A/160A/320A/640A in a system with the WP pin tied to
ground and still be able to write to the status register. All WP pin functions are enabled
when the WPEN bit is set to “1”.
5
5082B–SEEPR–1/05
Figure 2. SPI Serial Interface
AT25080A/160A/320A/640A
6
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
Functional
Description
The AT25080A/160A/320A/640A is designed to interface directly with the synchronous
serial peripheral interface (SPI) of the 6805 and 68HC11 series of microcontrollers.
The AT25080A/160A/320A/640A utilizes an 8-bit instruction register. The list of instruc-
tions and their operation codes are contained in Table 5. All instructions, addresses, and
data are transferred with the MSB first and start with a high-to-low CS transition.
Table 5. Instruction Set for the AT25080A/160A/320A/640A
Instruction Name
WREN
Instruction Format
0000 X110
Operation
Set Write Enable Latch
Reset Write Enable Latch
Read Status Register
Write Status Register
Read Data from Memory Array
Write Data to Memory Array
WRDI
0000 X100
RDSR
0000 X101
WRSR
0000 X001
READ
0000 X011
WRITE
0000 X010
WRITE ENABLE (WREN): The device will power up in the write disable state when VCC
is applied. All programming instructions must therefore be preceded by a Write Enable
instruction.
WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the Write
Disable instruction disables all programming modes. The WRDI instruction is indepen-
dent of the status of the WP pin.
READ STATUS REGISTER (RDSR): The Read Status Register instruction provides
access to the status register. The READY/BUSY and Write Enable status of the device
can be determined by the RDSR instruction. Similarly, the block write protection bits
indicate the extent of protection employed. These bits are set by using the WRSR
instruction.
Table 6. Status Register Format
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WPEN
X
X
X
BP1
BP0
WEN
RDY
Table 7. Read Status Register Bit Definition
Bit
Definition
Bit 0 (RDY)
Bit 0 = “0” (RDY) indicates the device is ready. Bit 0 = “1” indicates the write
cycle is in progress.
Bit 1 (WEN)
Bit 1= “0” indicates the device is not write-enabled. Bit 1 = “1” indicates the
device is write-enabled.
Bit 2 (BP0)
Bit 3 (BP1)
See Table 8 on page 8.
See Table 8 on page 8.
Bits 4 − 6 are “0”s when device is not in an internal write cycle.
Bit 7 (WPEN) See Table 9 on page 8.
Bits 0 − 7 are “1”s during an internal write cycle.
7
5082B–SEEPR–1/05
WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select
one of four levels of protection. The AT25080A/160A/320A/640A is divided into four
array segments. One-quarter, one-half, or all of the memory segments can be protected.
Any of the data within any selected segment will therefore be read only. The block write
protection levels and corresponding status register control bits are shown in Table 8.
Bits BP0, BP1, and WPEN are nonvolatile cells that have the same properties and func-
tions as the regular memory cells (e.g., WREN, tWC, RDSR).
Table 8. Block Write Protect Bits
Status
Register Bits
Array Addresses Protected
Level
BP1
BP0
AT25080A
AT25160A
AT25320A
AT25640A
0
0
0
None
None
None
None
0300
− 03FF
0600
− 07FF
0C00
− 0FFF
1800
− 1FFF
1 (1/4)
2 (1/2)
3 (All)
0
1
1
1
0
1
0200
− 03FF
0400
− 07FF
0800
− 0FFF
1000
− 1FFF
0000
− 03FF
0000
− 07FF
0000
− 0FFF
0000
− 1FFF
The WRSR instruction also allows the user to enable or disable the write protect (WP)
pin through the use of the write protect enable (WPEN) bit. Hardware write protection is
enabled when the WP pin is low and the WPEN bit is “1”. Hardware write protection is
disabled when either the WP pin is high or the WPEN bit is “0”. When the device is hard-
ware write protected, writes to the status register, including the block protect bits and the
WPEN bit, and the block-protected sections in the memory array are disabled. Writes
are only allowed to sections of the memory that are not block-protected.
NOTE: When the WPEN bit is hardware write protected, it cannot be changed back to
“0” as long as the WP pin is held low.
Table 9. WPEN Operation
Protected
Blocks
Unprotected
Blocks
Status
Register
WPEN
WP
X
WEN
0
0
1
1
X
X
0
1
0
1
0
1
Protected
Protected
Protected
Protected
Protected
Protected
Protected
Writeable
Protected
Writeable
Protected
Writeable
Protected
Writeable
Protected
Protected
Protected
Writeable
X
Low
Low
High
High
8
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
READ SEQUENCE (READ): Reading the AT25080A/160A/320A/640A via the serial
output (SO) pin requires the following sequence. After the CS line is pulled low to select
a device, the read op-code is transmitted via the SI line followed by the byte address to
be read (A15−A0, see Table 10). Upon completion, any data on the SI line will be
ignored. The data (D7−D0) at the specified address is then shifted out onto the SO line.
If only one byte is to be read, the CS line should be driven high after the data comes out.
The read sequence can be continued since the byte address is automatically incre-
mented and data will continue to be shifted out. When the highest address is reached,
the address counter will roll over to the lowest address, allowing the entire memory to be
read in one continuous read cycle.
WRITE SEQUENCE (WRITE): In order to program the AT25080A/160A/320A/640A,
two separate instructions must be executed. First, the device must be write enabled via
the WREN instruction. Then a Write (WRITE) instruction may be executed. Also, the
address of the memory location(s) to be programmed must be outside the protected
address field location selected by the block write protection level. During an internal
write cycle, all commands will be ignored except the RDSR instruction.
A Write instruction requires the following sequence. After the CS line is pulled low to
select the device, the WRITE op-code is transmitted via the SI line followed by the byte
address (A15−A0) and the data (D7–D0) to be programmed (See Table 10). Program-
ming will start after the CS pin is brought high. The low-to-high transition of the CS pin
must occur during the SCK low-time immediately after clocking in the D0 (LSB) data bit.
The READY/BUSY status of the device can be determined by initiating a read status
register (RDSR) instruction. If Bit 0 = “1”, the write cycle is still in progress. If Bit 0 = “0”,
the write cycle has ended. Only the RDSR instruction is enabled during the write pro-
gramming cycle.
The AT25080A/160A/320A/640A is capable of a 32-byte page write operation. After
each byte of data is received, the five low-order address bits are internally incremented
by one; the high-order bits of the address will remain constant. If more than 32 bytes of
data are transmitted, the address counter will roll over and the previously written data
will be overwritten. The AT25080A/160A/320A/640A is automatically returned to the
write disable state at the completion of a write cycle.
NOTE: If the device is not write enabled (WREN), the device will ignore the write instruc-
tion and will return to the standby state, when CS is brought high. A new CS falling edge
is required to reinitiate the serial communication.
Table 10. Address Key
Address
AT25080A
AT25160A
AT25320A
AT25640A
AN
A9–A0
A10–A0
A11–A0
A12–A0
Don’t
Care Bits
A15–A10
A15–A11
A15–A12
A15–A13
9
5082B–SEEPR–1/05
Timing Diagrams
Figure 3. Synchronous Data Timing (for Mode 0)
tCS
VIH
CS
VIL
tCSH
tCSS
VIH
tWH
tWL
SCK
VIL
tSU
VIH
tH
SI
VALID IN
VIL
tHO
tDIS
tV
VOH
VOL
HI-Z
HI-Z
SO
Figure 4. WREN Timing
Figure 5. WRDI Timing
10
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
Figure 6. RDSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
INSTRUCTION
SI
DATA OUT
4
HIGH IMPEDANCE
7
6
3
2
1
0
SO
5
MSB
Figure 7. WRSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
SI
DATA IN
INSTRUCTION
7
6
5
4
3
2
1
0
HIGH IMPEDANCE
SO
11
5082B–SEEPR–1/05
Figure 8. READ Timing
CS
0
1
2
3
4
5
6
7
8
9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
SCK
BYTE ADDRESS
...
SI
INSTRUCTION
15 14 13
3
2
1
0
DATA OUT
HIGH IMPEDANCE
7
6
5
4
3
2
1
0
SO
MSB
Figure 9. WRITE Timing
CS
0
1
2
3
4
5
6
7
8
9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
SCK
BYTE ADDRESS
DATA IN
...
INSTRUCTION
15 14 13
3
2
1
0
7
SI
6
5
4
3
2
1
0
HIGH IMPEDANCE
SO
HOLD Timing
CS
SCK
HOLD
SO
12
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
AT25080A Ordering Information
Ordering Code
Package
Operation Range
AT25080A-10PE-2.7
AT25080AN-10SE-2.7
8P3
8S1
Extended Temperature
(−40°C to 125°C)
AT25080A-10PQ-2.7(1)
AT25080AN-10SQ-2.7(1)
AT25080A-10TQ-2.7(1)
8P3
8S1
8A2
Lead-free/Halogen-free
Extended Temperature
(−40°C to 125°C)
Notes: 1. “Q” designates Green package + RoHS compliant.
Package Type
8P3
8S1
8A2
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
−2.7
Low Voltage (2.7V to 5.5V)
13
5082B–SEEPR–1/05
AT25160A Ordering Information
Ordering Code
Package
Operation Range
AT25160A-10PE-2.7
AT25160AN-10SE-2.7
8P3
8S1
Extended Temperature
(−40°C to 125°C)
AT25160A-10PQ-2.7(1)
AT25160AN-10SQ-2.7(1)
AT25160A-10TQ-2.7(1)
8P3
8S1
8A2
Lead-free/Halogen-free
Extended Temperature
(−40°C to 125°C)
Notes: 1. “Q” designates Green package + RoHS compliant.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
8P3
8S1
8A2
−2.7
Low Voltage (2.7V to 5.5V)
14
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
AT25320A Ordering Information
Ordering Code
Package
Operation Range
AT25320A-10PE-2.7
AT25320AN-10SE-2.7
8P3
8S1
Extended Temperature
(−40°C to 125°C)
AT25320A-10PQ-2.7(1)
AT25320AN-10SQ-2.7(1)
AT25320A-10TQ-2.7(1)
8P3
8S1
8A2
Lead-free/Halogen-free
Extended Temperature
(−40°C to 125°C)
Notes: 1. “Q” designates Green package + RoHS compliant.
Package Type
8P3
8S1
8A2
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
−2.7
Low Voltage (2.7V to 5.5V)
15
5082B–SEEPR–1/05
AT25640A Ordering Information
Ordering Code
Package
Operation Range
AT25640A-10PE-2.7
AT25640AN-10SE-2.7
8P3
8S1
Extended Temperature
(−40°C to 125°C)
AT25640A-10PQ-2.7(1)
AT25640AN-10SQ-2.7(1)
AT25640A-10TQ-2.7(1)
8P3
8S1
8A2
Lead-free/Halogen-free
Extended Temperature
(−40°C to 125°C)
Note:
1. “Q” designates Green package + RoHS compliant.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
8P3
8S1
8A2
−2.7
Low Voltage (2.7V to 5.5V)
16
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
MIN
–
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
–
NOM
–
NOTE
SYMBOL
D1
A2 A
A
2
A2
b
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
–
5
6
6
b2
b3
c
D
3
3
4
3
b2
L
D1
E
b3
4 PLCS
0.310
0.250
0.100 BSC
0.300 BSC
0.130
0.325
0.280
b
E1
e
Side View
eA
L
4
2
0.115
0.150
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
R
17
5082B–SEEPR–1/05
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
NOTE
SYMBOL
A1
A
–
–
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.00
3.99
6.20
C
D
E1
E
–
–
D
–
–
Side View
e
1.27 BSC
L
0.40
0˚
–
–
1.27
8˚
∅
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
REV.
TITLE
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1
B
R
Small Outline (JEDEC SOIC)
18
AT25080A/160A/320A/640A
5082B–SEEPR–1/05
AT25080A/160A/320A/640A
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
3.00
NOTE
SYMBOL
D
2.90
3.10
2, 5
A
b
E
6.40 BSC
4.40
E1
A
4.30
–
4.50
1.20
1.05
0.30
3, 5
4
–
A2
b
0.80
0.19
1.00
e
A2
–
D
e
0.65 BSC
0.60
L
0.45
0.75
Side View
L1
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
DRAWING NO.
TITLE
REV.
2325 Orchard Parkway
San Jose, CA 95131
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
B
8A2
R
19
5082B–SEEPR–1/05
Atmel Corporation
Atmel Operations
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Memory
RF/Automotive
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74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
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Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
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Tel: 1(719) 576-3300
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5082B–SEEPR–1/05
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