AT29C020-90TI [ATMEL]

Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32;
AT29C020-90TI
型号: AT29C020-90TI
厂家: ATMEL    ATMEL
描述:

Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32

光电二极管 内存集成电路
文件: 总17页 (文件大小:420K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Fast Read Access Time – 70 ns  
5-volt Only Reprogramming  
Sector Program Operation  
– Single Cycle Reprogram (Erase and Program)  
– 1024 Sectors (256 Bytes/Sector)  
– Internal Address and Data Latches for 256 Bytes  
Internal Program Control and Timer  
Hardware and Software Data Protection  
Two 8K Bytes Boot Blocks with Lockout  
Fast Sector Program Cycle Time – 10 ms  
DATA Polling for End of Program Detection  
Low Power Dissipation  
2-megabit  
(256K x 8)  
5-volt Only  
Flash Memory  
– 40 mA Active Current  
– 100 µA CMOS Standby Current  
Typical Endurance > 10,000 Cycles  
Single 5V 10% Supply  
CMOS and TTL Compatible Inputs and Outputs  
Commercial and Industrial Temperature Ranges  
Green (Pb/Halide-free) Packaging Option  
AT29C020  
1. Description  
The AT29C020 is a 5-volt-only in-system Flash programmable and erasable read-only  
memory (PEROM). Its 2 megabits of memory is organized as 262,144 bytes. Manu-  
factured with Atmel’s advanced nonvolatile CMOS technology, the device offers  
access times to 70 ns with power dissipation of just 220 mW over the commercial tem-  
perature range. When the device is deselected, the CMOS standby current is less  
than 100 µA. Device endurance is such that any sector can typically be written to in  
excess of 10,000 times.  
To allow for simple in-system reprogrammability, the AT29C020 does not require high  
input voltages for programming. Five-volt-only commands determine the operation of  
the device. Reading data out of the device is similar to reading from an EPROM.  
Reprogramming the AT29C020 is performed on a sector basis; 256 bytes of data are  
loaded into the device and then simultaneously programmed.  
During a reprogram cycle, the address locations and 256 bytes of data are internally  
latched, freeing the address and data bus for other operations. Following the initiation  
of a program cycle, the device will automatically erase the sector and then program  
the latched data using an internal control timer. The end of a program cycle can be  
detected by DATA polling of I/O7. Once the end of a program cycle has been  
detected, a new access for a read or program can begin.  
0291Q–FLASH–11/05  
2. Pin Configurations  
Pin Name  
Function  
A0 - A17  
CE  
Addresses  
Chip Enable  
Output Enable  
Write Enable  
Data Inputs/Outputs  
No Connect  
OE  
WE  
I/O0 - I/O7  
NC  
2.1  
32-lead PLCC Top View  
A7  
A6  
A5  
A4  
A3  
5
6
7
8
9
29 A14  
28 A13  
27 A8  
26 A9  
25 A11  
24 OE  
23 A10  
22 CE  
21 I/O7  
A2 10  
A1 11  
A0 12  
I/O0 13  
2.2  
32-lead TSOP (Type 1) Top View  
A11  
A9  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
2
A10  
CE  
A8  
3
A13  
A14  
A17  
WE  
VCC  
NC  
A16  
A15  
A12  
A7  
4
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
GND  
I/O2  
I/O1  
I/O0  
A0  
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
A6  
A1  
A5  
A2  
A4  
A3  
2
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
3. Block Diagram  
4. Device Operation  
4.1  
4.2  
4.3  
Read  
The AT29C020 is accessed like an EPROM. When CE and OE are low and WE is high, the data  
stored at the memory location determined by the address pins is asserted on the outputs. The  
outputs are put in the high impedance state whenever CE or OE is high. This dual-line control  
gives designers flexibility in preventing bus contention.  
Byte Load  
Program  
Byte loads are used to enter the 256 bytes of a sector to be programmed or the software codes  
for data protection. A byte load is performed by applying a low pulse on the WE or CE input with  
CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or  
WE, whichever occurs last. The data is latched by the first rising edge of CE or WE.  
The device is reprogrammed on a sector basis. If a byte of data within a sector is to be changed,  
data for the entire sector must be loaded into the device. Any byte that is not loaded during the  
programming of its sector will be indeterminate. Once the bytes of a sector are loaded into the  
device, they are simultaneously programmed during the internal programming period. After the  
first data byte has been loaded into the device, successive bytes are entered in the same man-  
ner. Each new byte to be programmed must have its high-to-low transition on WE (or CE) within  
150 µs of the low-to-high transition of WE (or CE) of the preceding byte. If a high-to-low transi-  
tion is not detected within 150 µs of the last low-to-high transition, the load period will end and  
the internal programming period will start. A8 to A17 specify the sector address. The sector  
address must be valid during each high-to-low transition of WE (or CE). A0 to A7 specify the  
byte address within the sector. The bytes may be loaded in any order; sequential loading is not  
required. Once a programming operation has been initiated, and for the duration of tWC, a read  
operation will effectively be a polling operation.  
4.4  
Software Data Protection  
A software controlled data protection feature is available on the AT29C020. Once the software  
protection is enabled a software algorithm must be issued to the device before a program may  
be performed. The software protection feature may be enabled or disabled by the user; when  
3
0291Q–FLASH–11/05  
shipped from Atmel, the software data protection feature is disabled. To enable the software  
data protection, a series of three program commands to specific addresses with specific data  
must be performed. After the software data protection is enabled the same three program com-  
mands must begin each program cycle in order for the programs to occur. All software program  
commands must obey the sector program timing specifications. Once set, the software data pro-  
tection feature remains active unless its disable command is issued. Power transitions will not  
reset the software data protection feature; however, the software feature will guard against inad-  
vertent program cycles during power transitions.  
After setting SDP, any attempt to write to the device without the 3-byte command sequence will  
start the internal write timers. No data will be written to the device; however, for the duration of  
tWC, a read operation will effectively be a polling operation.  
After the software data protection’s 3-byte command code is given, a sector of data is loaded  
into the device using the sector program timing specifications.  
4.5  
4.6  
Hardware Data Protection  
Hardware features protect against inadvertent programs to the AT29C020 in the following ways:  
(a) VCC sense – if VCC is below 3.8V (typical), the program function is inhibited; (b) VCC power on  
delay – once VCC has reached the VCC sense level, the device will automatically time out 5 ms  
(typical) before programming; (c) Program inhibit – holding any one of OE low, CE high or WE  
high inhibits program cycles; and (d) Noise filter – pulses of less than 15 ns (typical) on the WE  
or CE inputs will not initiate a program cycle.  
Product Identification  
The product identification mode identifies the device and manufacturer as Atmel. It may be  
accessed by hardware or software operation. The hardware operation mode can be used by an  
external programmer to identify the correct programming algorithm for the Atmel product.  
In addition, users may wish to use the software product identification mode to identify the part  
(i.e. using the device code), and have the system software use the appropriate sector size for  
program operations. In this manner, the user can have a common board design for 256K to  
4-megabit densities and, with each density’s sector size in a memory map, have the system soft-  
ware apply the appropriate sector size.  
For details, see Operating Modes (for hardware operation) or Software Product Identification.  
The manufacturer and device code is the same for both modes.  
4.7  
4.8  
DATA Polling  
Toggle Bit  
The AT29C020 features DATA polling to indicate the end of a program cycle. During a program  
cycle an attempted read of the last byte loaded will result in the complement of the loaded data  
on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the  
next cycle may begin. DATA polling may begin at any time during the program cycle.  
In addition to DATA polling the AT29C020 provides another method for determining the end of a  
program or erase cycle. During a program or erase operation, successive attempts to read data  
from the device will result in I/O6 toggling between one and zero. Once the program cycle has  
completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin  
at any time during a program cycle.  
4
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
4.9  
Optional Chip Erase Mode  
The entire device can be erased by using a 6-byte software code. Please see Software Chip  
Erase application note for details.  
4.10 Boot Block Programming Lockout  
The AT29C020 has two designated memory blocks that have a programming lockout feature.  
This feature prevents programming of data in the designated block once the feature has been  
enabled. Each of these blocks consists of 8K bytes; the programming lockout feature can be set  
independently for either block. While the lockout feature does not have to be activated, it can be  
activated for either or both blocks.  
These two 8K memory sections are referred to as boot blocks. Secure code which will bring up a  
system can be contained in a boot block. The AT29C020 blocks are located in the first 8K bytes  
of memory and the last 8K bytes of memory. The boot block programming lockout feature can  
therefore support systems that boot from the lower addresses of memory or the higher  
addresses. Once the programming lockout feature has been activated, the data in that block can  
no longer be erased or programmed; data in other memory locations can still be changed  
through the regular programming methods. To activate the lockout feature, a series of seven  
program commands to specific addresses with specific data must be performed. Please see  
Boot Block Lockout Feature Enable Algorithm.  
If the boot block lockout feature has been activated on either block, the chip erase function will  
be disabled.  
4.10.1  
Boot Block Lockout Detection  
A software method is available to determine whether programming of either boot block section is  
locked out. See Software Product Identification Entry and Exit sections. When the device is in  
the software product identification mode, a read from location 00002H will show if programming  
the lower address boot block is locked out while reading location 3FFF2H will do so for the upper  
boot block. If the data is FE, the corresponding block can be programmed; if the data is FF, the  
program lockout feature has been activated and the corresponding block cannot be pro-  
grammed. The software product identification exit mode should be used to return to standard  
operation.  
5. Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability.  
Temperature Under Bias............................... -55°C to +125°C  
Storage Temperature.................................... -65°C to +150°C  
All Input Voltages (including NC Pins)  
with Respect to Ground...................................-0.6V to +6.25V  
All Output Voltages  
with Respect to Ground.............................-0.6V to VCC + 0.6V  
Voltage on OE  
with Respect to Ground...................................-0.6V to +13.5V  
5
0291Q–FLASH–11/05  
6. DC and AC Operating Range  
AT29C020-70  
AT29C020-90  
0°C - 70°C  
-40°C - 85°C  
5V 10%  
AT29C020-10  
0°C - 70°C  
-40°C - 85°C  
5V 10%  
AT29C020-12  
0°C - 70°C  
-40°C - 85°C  
5V 10%  
AT29C020-15  
0°C - 70°C  
-40°C - 85°C  
5V 10%  
Com.  
Ind.  
0°C - 70°C  
-40° C - 85° C  
5V 10%  
Operating  
Temperature (Case)  
VCC Power Supply  
Note:  
Not recommended for New Designs.  
7. Operating Modes  
Mode  
CE  
VIL  
VIL  
VIL  
VIH  
X
OE  
VIL  
VIH  
VIH  
X(1)  
X
WE  
VIH  
VIL  
VIL  
X
Ai  
Ai  
Ai  
Ai  
X
I/O  
Read  
DOUT  
DIN  
Program(2)  
5V Chip Erase  
Standby/Write Inhibit  
Program Inhibit  
Program Inhibit  
Output Disable  
Product Identification  
High Z  
VIH  
X
X
VIL  
VIH  
X
X
High Z  
A1 - A17 = VIL, A9 = VH,(3) A0 = VIL  
A1 - A17 = VIL, A9 = VH, A0 = VIH  
A0 = VIL  
Manufacturer Code(4)  
Device Code(4)  
Hardware  
VIL  
VIL  
VIH  
Manufacturer Code(4)  
Device Code(4)  
Software(5)  
A0 = VIH  
Notes: 1. X can be VIL or VIH.  
2. Refer to AC Programming Waveforms.  
3. VH = 12.0V 0.5V.  
4. Manufacturer Code: 1F, Device Code: DA.  
5. See details under Software Product Identification Entry/Exit.  
8. DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Max  
10  
Units  
µA  
µA  
µA  
µA  
mA  
mA  
V
ILI  
Input Load Current  
Output Leakage Current  
VIN = 0V to VCC  
VI/O = 0V to VCC  
ILO  
10  
Com.  
Ind.  
100  
300  
3
ISB1  
VCC Standby Current CMOS  
CE = VCC - 0.3V to VCC  
ISB2  
ICC  
VCC Standby Current TTL  
VCC Active Current  
CE = 2.0V to VCC  
f = 5 MHz; IOUT = 0 mA  
40  
VIL  
Input Low Voltage  
0.8  
VIH  
Input High Voltage  
2.0  
V
VOL  
VOH1  
VOH2  
Output Low Voltage  
Output High Voltage  
Output High Voltage CMOS  
IOL = 2.1 mA  
0.45  
V
IOH = -400 µA  
2.4  
4.2  
V
IOH = -100 µA; VCC = 4.5V  
V
6
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
9. AC Read Characteristics  
AT29C020-90 AT29C020-90 AT29C020-10 AT29C020-12 AT29C020-15  
Symbol  
Parameter  
Min  
Max  
70  
Min  
Max  
90  
Min  
Max  
100  
100  
50  
Min  
Max  
120  
120  
50  
Min  
Max  
150  
150  
70  
Units  
ns  
tACC  
Address to Output Delay  
CE to Output Delay  
OE to Output Delay  
CE or OE to Output Float  
0
0
(1)  
tCE  
70  
90  
ns  
(2)  
tOE  
0
0
40  
0
0
40  
0
0
0
0
0
0
ns  
(3)(4)  
tDF  
25  
25  
25  
30  
40  
ns  
Output Hold from OE, CE  
or Address, whichever  
occurred first  
tOH  
0
0
0
0
0
ns  
Note:  
Not recommended for New Designs.  
10. AC Read Waveforms(1)(2)(3)(4)  
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC  
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change  
without impact on tACC  
.
.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).  
4. This parameter is characterized and is not 100% tested.  
7
0291Q–FLASH–11/05  
11. Input Test Waveforms and Measurement Level  
tR, tF < 5 ns  
12. Output Test Load  
13. Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
4
Max  
6
Units  
pF  
Conditions  
VIN = 0V  
COUT  
8
12  
pF  
VOUT = 0V  
Note:  
1. This parameter is characterized and is not 100% tested.  
8
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
14. AC Byte Load Characteristics  
Symbol  
Parameter  
Min  
0
Max  
Units  
ns  
t
AS, tOES  
Address, OE Set-up Time  
Address Hold Time  
tAH  
tCS  
tCH  
tWP  
tDS  
50  
0
ns  
Chip Select Set-up Time  
Chip Select Hold Time  
Write Pulse Width (WE or CE)  
Data Set-up Time  
ns  
0
ns  
90  
50  
0
ns  
ns  
t
DH, tOEH  
Data, OE Hold Time  
Write Pulse Width High  
ns  
tWPH  
100  
ns  
15. AC Byte Load Waveforms  
15.1 WE Controlled  
15.2 CE Controlled  
9
0291Q–FLASH–11/05  
16. Program Cycle Characteristics  
Symbol  
Parameter  
Min  
Max  
Units  
ms  
ns  
tWC  
Write Cycle Time  
Address Set-up Time  
Address Hold Time  
Data Set-up Time  
Data Hold Time  
10  
tAS  
0
tAH  
50  
50  
0
ns  
tDS  
ns  
tDH  
ns  
tWP  
Write Pulse Width  
Byte Load Cycle Time  
Write Pulse Width High  
90  
ns  
tBLC  
tWPH  
150  
µs  
100  
ns  
17. Program Cycle Waveforms(1)(2)(3)  
Notes: 1. A8 through A17 must specify the sector address during each high-to-low transition of WE (or CE).  
2. OE must be high when WE and CE are both low.  
3. All words that are not loaded within the sector being programmed will be indeterminate.  
10  
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
18. Software Data Protection  
Enable Algorithm(19.)  
19. Software Data Protection  
Disable Algorithm(19.)  
LOAD DATA AA  
LOAD DATA AA  
TO  
TO  
ADDRESS 5555  
ADDRESS 5555  
LOAD DATA 55  
TO  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
ADDRESS 2AAA  
LOAD DATA 80  
TO  
ADDRESS 5555  
LOAD DATA A0  
TO  
ADDRESS 5555  
WRITES ENABLED  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA  
TO  
PAGE (128 BYTES)(4)  
ENTER DATA  
PROTECT STATE(2)  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
LOAD DATA 20  
TO  
ADDRESS 5555  
EXIT DATA  
PROTECT STATE(3)  
LOAD DATA  
TO  
PAGE (128 BYTES)(4)  
Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14  
- A0 (Hex).  
2. Data Protect state will be activated at end of  
program cycle.  
3. Data Protect state will be deactivated at end of pro-  
gram period.  
4. 256 bytes of data MUST BE loaded.  
20. Software Protected Program Cycle Waveform(1)(2)(3)  
Notes: 1. A8 through A17 must specify the sector address during each high-to-low transition of WE (or CE) after the software code has  
been entered.  
2. OE must be high when WE and CE are both low.  
3. All bytes that are not loaded within the sector being programmed will be indeterminate.  
11  
0291Q–FLASH–11/05  
21. Data Polling Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
OE Hold Time  
10  
ns  
OE to Output Delay(2)  
Write Recovery Time  
ns  
tWR  
0
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See tOE spec in AC Read Characteristics.  
22. Data Polling Waveforms  
23. Toggle Bit Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
tOEHP  
tWR  
OE Hold Time  
10  
ns  
OE to Output Delay(2)  
OE High Pulse  
ns  
150  
0
ns  
Write Recovery Time  
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See tOE spec in AC Read Characteristics.  
24. Toggle Bit Waveforms(1)(2)(3)  
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.  
2. Beginning and ending state of I/O6 may vary.  
3. Any address location may be used but the address should not vary.  
12  
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
25. Software Product Identification  
Entry(1)  
27. Boot Block Lockout  
Feature Enable Algorithm(1)  
LOAD DATA AA  
LOAD DATA AA  
TO  
TO  
ADDRESS 5555  
ADDRESS 5555  
LOAD DATA 55  
TO  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
ADDRESS 2AAA  
LOAD DATA 90  
TO  
LOAD DATA 80  
TO  
ADDRESS 5555  
ADDRESS 5555  
LOAD DATA AA  
TO  
PAUSE 10 mS  
ENTER PRODUCT  
IDENTIFICATION  
MODE(2)(3)(5)  
ADDRESS 5555  
LOAD DATA 55  
TO  
26. Software Product Identification  
Exit(1)  
ADDRESS 2AAA  
LOAD DATA AA  
TO  
LOAD DATA 40  
TO  
ADDRESS 5555  
ADDRESS 5555  
LOAD DATA 55  
TO  
LOAD DATA 00  
TO  
LOAD DATA FF  
TO  
ADDRESS 2AAA  
ADDRESS 00000H(2)  
ADDRESS 3FFFFH(3)  
LOAD DATA F0  
TO  
ADDRESS 5555  
PAUSE 20 mS  
PAUSE 20 mS  
Notes: 1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
PAUSE 10 mS  
EXIT PRODUCT  
IDENTIFICATION  
MODE(4)  
2. Lockout feature set on lower address boot block.  
3. Lockout feature set on higher address boot block.  
Notes: 1. Data Format: I/O15 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
2. A1 - A17 = VIL.  
Manufacturer Code is read for A0 = VIL;  
Device Code is read for A0 = VIH.  
3. The device does not remain in identification mode if  
powered down.  
4. The device returns to standard operation mode.  
5. Manufacturer Code is 1F. The Device Code is DA.  
13  
0291Q–FLASH–11/05  
28. Ordering Information  
28.1 Standard Package  
I
CC (mA)  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
AT29C020-70JC  
AT29C020-70TC  
32J  
32T  
Commercial  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
0.1  
0.3  
0.1  
0.3  
0.1  
0.3  
0.1  
0.3  
0.1  
0.3  
(0° to 70°C)  
70  
90  
AT29C020-70JI  
AT29C020-70TI  
32J  
32T  
Industrial  
(-40° to 85°C)  
AT29C020-90JC  
AT29C020-90TC  
32J  
32T  
Commercial  
(0° to 70°C)  
AT29C020-90JI  
AT29C020-90TI  
32J  
32T  
Industrial  
(-40° to 85°C)  
AT29C020-10JC  
AT29C020-10TC  
32J  
32T  
Commercial  
(0° to 70°C)  
100  
120  
150  
AT29C020-10JI  
AT29C020-10TI  
32J  
32T  
Industrial  
(-40° to 85°C)  
AT29C020-12JC  
AT29C020-12TC  
32J  
32T  
Commercial  
(0° to 70°C)  
AT29C020-12JI  
AT29C020-12TI  
32J  
32T  
Industrial  
(-40° to 85°C)  
AT29C020-15JC  
AT29C020-15TC  
32J  
32T  
Commercial  
(0° to 70°C)  
AT29C020-15JI  
AT29C020-15TI  
32J  
32T  
Industrial  
(-40° to 85°C)  
Note:  
Not recommended for New Designs.  
28.2 Green Package Option (Pb/Halide-free)  
I
CC (mA)  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
AT29C020-70JU  
AT29C020-70TU  
32J  
32T  
70  
90  
40  
40  
0.3  
0.3  
Industrial  
(-40° to 85°C)  
AT29C020-90JU  
AT29C020-90TU  
32J  
32T  
Package Type  
32J  
32T  
32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32-lead, Thin Small Outline Package (TSOP)  
14  
AT29C020  
0291Q–FLASH–11/05  
AT29C020  
29. Packaging Information  
29.1 32J – PLCC  
1.14(0.045) X 45˚  
PIN NO. 1  
IDENTIFIER  
1.14(0.045) X 45˚  
0.318(0.0125)  
0.191(0.0075)  
E2  
E1  
E
B1  
B
e
A2  
A1  
D1  
D
A
0.51(0.020)MAX  
45˚ MAX (3X)  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
3.175  
1.524  
0.381  
12.319  
11.354  
9.906  
14.859  
13.894  
12.471  
0.660  
0.330  
MAX  
3.556  
2.413  
NOM  
NOTE  
SYMBOL  
A
D2  
A1  
A2  
D
12.573  
D1  
D2  
E
11.506 Note 2  
10.922  
Notes:  
1. This package conforms to JEDEC reference MS-016, Variation AE.  
2. Dimensions D1 and E1 do not include mold protrusion.  
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the upper or lower parting line.  
15.113  
E1  
E2  
B
14.046 Note 2  
13.487  
0.813  
3. Lead coplanarity is 0.004" (0.102 mm) maximum.  
B1  
e
0.533  
1.270 TYP  
10/04/01  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32J  
B
R
15  
0291Q–FLASH–11/05  
29.2 32T – TSOP  
PIN 1  
0º ~ 8º  
c
Pin 1 Identifier  
D1  
D
L
b
L1  
e
A2  
E
GAGE PLANE  
A
SEATING PLANE  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A1  
MIN  
MAX  
1.20  
0.15  
1.05  
20.20  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.05  
0.95  
19.80  
18.30  
7.90  
0.50  
1.00  
Notes:  
1. This package conforms to JEDEC reference MO-142, Variation BD.  
2. Dimensions D1 and E do not include mold protrusion. Allowable  
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.  
3. Lead coplanarity is 0.10 mm maximum.  
20.00  
18.40  
8.00  
D1  
E
18.50 Note 2  
8.10  
0.70  
Note 2  
L
0.60  
L1  
b
0.25 BASIC  
0.22  
0.17  
0.10  
0.27  
0.21  
c
e
0.50 BASIC  
10/18/01  
DRAWING NO. REV.  
32T  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline  
Package, Type I (TSOP)  
B
R
16  
AT29C020  
0291Q–FLASH–11/05  
Atmel Corporation  
Atmel Operations  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Memory  
RF/Automotive  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
Tel: (49) 71-31-67-0  
Fax: (49) 71-31-67-2340  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 436-4314  
Regional Headquarters  
Microcontrollers  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906, USA  
Tel: 1(719) 576-3300  
Europe  
Atmel Sarl  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
Tel: (41) 26-426-5555  
Fax: (41) 26-426-5500  
Fax: 1(719) 540-1759  
Biometrics/Imaging/Hi-Rel MPU/  
High Speed Converters/RF Datacom  
Avenue de Rochepleine  
La Chantrerie  
BP 70602  
44306 Nantes Cedex 3, France  
Tel: (33) 2-40-18-18-18  
Fax: (33) 2-40-18-19-60  
BP 123  
38521 Saint-Egreve Cedex, France  
Tel: (33) 4-76-58-30-00  
Fax: (33) 4-76-58-34-80  
Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
Hong Kong  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
ASIC/ASSP/Smart Cards  
Zone Industrielle  
13106 Rousset Cedex, France  
Tel: (33) 4-42-53-60-00  
Fax: (33) 4-42-53-60-01  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906, USA  
Tel: 1(719) 576-3300  
Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
Tel: (81) 3-3523-3551  
Fax: (81) 3-3523-7581  
Fax: 1(719) 540-1759  
Scottish Enterprise Technology Park  
Maxwell Building  
East Kilbride G75 0QR, Scotland  
Tel: (44) 1355-803-000  
Fax: (44) 1355-242-743  
Literature Requests  
www.atmel.com/literature  
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any  
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMELS TERMS AND CONDI-  
TIONS OF SALE LOCATED ON ATMELS WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY  
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-  
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT  
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no  
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided  
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use  
as components in applications intended to support or sustain life.  
© Atmel Corporation 2005. All rights reserved. Atmel®, logo and combinations thereof, Everywhere You Are® and others, are registered trade-  
marks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.  
Printed on recycled paper.  
0291Q–FLASH–11/05  

相关型号:

AT29C020-90TU

2-megabit (256K x 8) 5-volt Only Flash Memory
ATMEL

AT29C040

4-Megabit 512K x 8 5-volt Only 256-Byte Sector CMOS Flash Memory
ATMEL

AT29C040-12DC

x8 Flash EEPROM
ETC

AT29C040-12DI

x8 Flash EEPROM
ETC

AT29C040-12PC

x8 Flash EEPROM
ETC

AT29C040-12PI

x8 Flash EEPROM
ETC

AT29C040-12TC

x8 Flash EEPROM
ETC

AT29C040-12TCT/R

Flash, 512KX8, 120ns, PDSO40, PLASTIC, TSOP1-40
ATMEL

AT29C040-15DC

x8 Flash EEPROM
ETC

AT29C040-15DI

x8 Flash EEPROM
ETC

AT29C040-15DM

x8 Flash EEPROM
ETC

AT29C040-15FI

x8 Flash EEPROM
ETC