AT60142FT-DS15MSV [ATMEL]

Rad Hard 512K x 8 5V Tolerant Very Low Power CMOS SRAM; 抗辐射512K ×8 5V容限非常低功耗CMOS SRAM
AT60142FT-DS15MSV
型号: AT60142FT-DS15MSV
厂家: ATMEL    ATMEL
描述:

Rad Hard 512K x 8 5V Tolerant Very Low Power CMOS SRAM
抗辐射512K ×8 5V容限非常低功耗CMOS SRAM

静态存储器
文件: 总13页 (文件大小:347K)
中文:  中文翻译
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Features  
Operating Voltage: 3.3V, 5V tolerant  
Access Time:  
– 17 ns  
– 15 ns  
Very Low Power Consumption  
– Active: 610 mW (Max) @ 17 ns(1), 540 mW (Max) @ 25 ns  
– Standby: 3.3 mW (Typ)  
Wide Temperature Range: -55 to +125°C  
TTL-Compatible Inputs and Outputs  
Asynchronous  
Designed on 0.25 µm Radiation Hardened Process  
No Single Event Latch Up below LET Threshold of 80 MeV/mg/cm2  
Tested up to a Total Dose of 300 krads (Si) according to MIL-STD-883 Method 1019  
500 Mils Wide FP36 Package  
Rad Hard  
512K x 8  
5V Tolerant  
Very Low Power  
CMOS SRAM  
ESD Better than 2000V  
Quality Grades: ESCC with 9301/052, QML-Q or V with smd 5962-05208  
Note:  
1. 650 mW (Max) @ 15 ns  
Description  
The AT60142FT is a very low power CMOS static RAM organized as 512K x 8 bits.  
Atmel brings the solution to applications where fast computing is as mandatory as low  
consumption, such as aerospace electronics, portable instruments, or embarked  
systems.  
AT60142FT  
Utilizing an array of six transistors (6T) memory cells, the AT60142FT combines an  
extremely low standby supply current (Typical value = 1 mA) with a fast access time at  
15 ns over the full military temperature range. The high stability of the 6T cell provides  
excellent protection against soft errors due to noise.  
The AT60142FT is processed according to the methods of the latest revision of the  
MIL PRF 38535 or ESCC 9000.  
It is produced on a radiation hardened 0.25 µm CMOS process.  
Rev. 7726B–AERO–04/09  
1
AT60142FT  
Block Diagram  
Pin Configuration  
A0  
A1  
NC  
1
2
3
4
5
6
7
8
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
A18  
A17  
A2  
A3  
A16  
A15  
A4  
CS  
OE  
I/O1  
I/O8  
I/O7  
GND  
I/O2  
Vcc  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
GND  
I/O3  
I/O4  
WE  
Vcc  
I/O6  
I/O5  
A14  
A5  
A6  
A7  
A8  
A9  
A13  
A12  
A11  
A10  
N/C  
2
7726B–AERO–04/09  
Pin Description  
Table 1. Pin Names  
Name  
Description  
Address Inputs  
Data Input/Output  
Chip Select  
A0 - A18  
I/O1 - I/O8  
CS  
WE  
Write Enable  
Output Enable  
Power Supply  
Ground  
OE  
Vcc  
GND  
Table 2. Truth Table(1)  
CS  
WE  
OE  
Inputs/Outputs  
Mode  
Deselect/  
H
X
X
Z
Power-down  
L
L
L
H
L
L
X
H
Data Out  
Data In  
Z
Read  
Write  
H
Output Disable  
Note:  
1. L=low, H=high, X= L or H, Z=high impedance.  
3
AT60142FT  
7726B–AERO–04/09  
AT60142FT  
Electrical Characteristics  
Absolute Maximum Ratings*  
*NOTE:  
Stresses beyond those listed under "Abso-  
lute Maximum Ratings” may cause perma-  
nent damage to the device. This is a stress  
rating only and functional operation of the  
device at these or any other conditions  
beyond those indicated in the operational  
sections of this specification is not implied.  
Exposure between recommended DC  
operating and absolute maximum rating  
conditions for extended periods may  
affect device reliability.  
Supply Voltage to GND Potential: ....................... -0.5V + 4.6V  
Voltage range on any input: ...................... GND -0.5V to 7.0V  
Voltage range on any ouput: ..................... GND -0.5V to 4.6V  
Storage Temperature: ................................. -65°C to + 150°C  
Output Current from Output Pins: ................................ 20 mA  
Electro Statics Discharge Voltage: ............................ > 2000V  
(MIL STD 883D Method 3015.3)  
Military Operating Range  
Operating Voltage  
3.3 + 0.3V  
Operating Temperature  
Military  
-55°C to + 125°C  
Recommended DC Operating Conditions  
Parameter  
Description  
Min  
Typ  
3.3  
0.0  
0.0  
Max  
3.6  
Unit  
V
Vcc  
Supply voltage  
Ground  
3
0.0  
GND  
VIL  
0.0  
V
Input low voltage  
Input high voltage  
GND - 0.3  
2.2  
0.8  
V
VIH  
5.5(1)  
V
Note:  
1. 5.8V in transient conditions.  
Capacitance  
Parameter  
Description  
Min  
Typ  
Max  
12  
Unit  
pF  
(1)  
Cin  
Input capacitance  
Output capacitance  
(1)  
Cout  
12  
pF  
Note:  
1. Guaranteed but not tested.  
4
7726B–AERO–04/09  
DC Parameters  
Parameter  
Description  
Minimum  
Typical  
Maximum  
Unit  
IIX (1)  
Input leakage current  
-1  
1
μA  
Output leakage  
current  
IOZ(1)  
-1  
1
2
μA  
μA  
μA  
Input Leakage  
Current  
IIH(2) at 5.5V  
Output Leakage  
Current  
IOZH(2) at 5.5V  
1.5  
VOL(3)  
VOH(4)  
Output low voltage  
Output high voltage  
0.4  
V
V
2.4  
1.  
2.  
3.  
GND < VIN < VCC, GND < VOUT < VCC Output Disabled.  
VIN = 5.5V, VOUT = 5.5V, Output Disabled.  
VCC min. IOL = 6 mA  
4.  
VCC min. IOH = -4 mA.  
Consumption  
TAVAV/TAVAW  
Test Condition  
Symbol  
Description  
AT60142FT-17  
AT60142FT-15  
Unit  
Value  
Standby Supply  
Current  
(1)  
ICCSB  
2
2.5  
2
mA  
max  
max  
Standby Supply  
Current  
(2)  
ICCSB1  
1.8  
mA  
mA  
15 ns  
17 ns  
25 ns  
50 ns  
-
180  
170  
150  
75  
Dynamic  
Operating  
Current  
170  
150  
75  
ICCOP(3) Read  
max  
max  
10  
10  
1 µs  
15 ns  
17 ns  
25 ns  
50 ns  
-
150  
145  
130  
120  
100  
Dynamic  
Operating  
Current  
145  
130  
120  
100  
ICCOP(4) Write  
mA  
1 µs  
1.  
2.  
3.  
4.  
CS >VIH  
CS > VCC - 0.3V  
F = 1/TAVAV, Iout = 0 mA, WE = OE = VIH, VIN = GND/VCC, VCC max.  
F = 1/TAVAW, Iout = 0 mA, WE = VIL, OE = VIH , VIN = GND/VCC, VCC max.  
5
AT60142FT  
7726B–AERO–04/09  
AT60142FT  
Data Retention Mode  
Atmel CMOS RAM's are designed with battery backup in mind. Data retention voltage  
and supply current are guaranteed over temperature. The following rules insure data  
retention:  
1. During data retention chip select CS must be held high within VCC to VCC -0.2V.  
2. Output Enable (OE) should be held high to keep the RAM outputs high imped-  
ance, minimizing power dissipation.  
3. During power-up and power-down transitions CS and OE must be kept between  
VCC + 0.3V and 70% of VCC.  
4. The RAM can begin operation > tR ns after VCC reaches the minimum operation  
voltages (3V).  
Figure 1. Data Retention Timing  
Data Retention Characteristics  
Parameter  
Description  
Min  
Typ TA = 25°C  
Max  
Unit  
VCCDR  
VCC for data retention  
2.0  
V
Chip deselect to data  
retention time  
tCDR  
0.0  
ns  
ns  
Operation recovery  
time  
(1)  
tR  
tAVAV  
1.5 (AT60142FT-15)  
1.3 (AT60142FT-17)  
(2)  
ICCDR  
Data retention current  
0.700  
mA  
1.  
2.  
TAVAV = Read cycle time.  
CS = VCC, VIN = GND/VCC  
.
6
7726B–AERO–04/09  
AC Characteristics  
Temperature Range:................................................ -55 +125°C  
Supply Voltage:........................................................ 3.3 +0.3V  
Input Pulse Levels:.................................................. GND to 3.0V  
Input Rise and Fall Times:....................................... 3ns (10 - 90%)  
Input and Output Timing Reference Levels:............ 1.5V  
Output Loading IOL/IOH:............................................ See Figure 1  
Figure 2. AC Test Loads Waveforms  
7
AT60142FT  
7726B–AERO–04/09  
AT60142FT  
Write Cycle  
Symbol  
Parameter  
AT60142FT-17  
AT60142FT-15  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Value  
min  
min  
min  
min  
min  
max  
min  
min  
min  
min  
TAVAW  
TAVWL  
TAVWH  
TDVWH  
TELWH  
TWLQZ  
TWLWH  
TWHAX  
TWHDX  
TWHQX  
Write cycle time  
17  
0
15  
0
Address set-up time  
Address valid to end of write  
Data set-up time  
8
8
7
7
CS low to write end  
Write low to high Z(1)  
Write pulse width  
12  
7
10  
6
8
8
Address hold from end of write  
Data hold time  
0
0
0
0
Write high to low Z(1)  
3
3
Notes: 1. Parameters guaranteed, not tested, with output loading 5 pF. (See “AC Test Loads Waveforms” on page 7.)  
Figure 3. Write Cycle 1. WE Controlled, OE High During Write  
E
Figure 4. Write Cycle 2. WE Controlled, OE Low  
E
8
7726B–AERO–04/09  
Figure 5. Write Cycle 3. CS Controlled  
E
Note:  
The internal write time of the memory is defined by the overlap of CS Low and W LOW. Both signals must be activated to initiate  
a write and either signal can terminate a write by going in active mode. The data input setup and hold timing should be refer-  
enced to the active edge of the signal that terminates the write.  
Data out is high impedance if OE= VIH.  
9
AT60142FT  
7726B–AERO–04/09  
AT60142FT  
Read Cycle  
Symbol  
Parameter  
AT60142FT-17  
AT60142FT-15  
Unit  
Value  
min  
TAVAV  
Read cycle time  
17  
17  
5
15  
15  
5
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TAVQV  
TAVQX  
TELQV  
TELQX  
TEHQZ  
TGLQV  
TGLQX  
TGHQZ  
Address access time  
Address valid to low Z  
Chip-select access time  
CS low to low Z(1)  
max  
min  
17  
5
15  
5
max  
min  
CS high to high Z(1)  
Output Enable access time  
OE low to low Z(1)  
7
6
max  
max  
min  
8
6
2
2
OE high to high Z (1)  
6
5
max  
Note:  
1. Parameters guaranteed, not tested, with output loading 5 pF. (See “AC Test Loads Waveforms” on page 7.)  
Figure 6. Read Cycle nb 1: Address Controlled (CS = OE = VIL, WE = VIH)  
Figure 7. Read Cycle nb 2: Chip Select Controlled (WE = VIH)  
10  
7726B–AERO–04/09  
Ordering Information  
Part Number  
Temperature Range  
Speed  
Package  
Flow  
AT60142FT-DC17M-E  
5962-0520801QXC  
25°C  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
17 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
15 ns/5V tol.  
FP36.5  
FP36.5  
Engineering Samples  
QML Q  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
25°C  
5962-0520801VXC  
FP36.5  
QML V  
5962R0520801VXC  
FP36.5  
QML V RHA  
ESCC  
930105201  
FP36.5  
AT60142FT-DS17M-E  
5962-0520801QYC  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
Die  
Engineering Samples  
QML Q  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
25°C  
5962-0520801VYC  
QML V  
5962R0520801VYC  
QML V RHA  
ESCC  
AT60142FT-DS17ESCC(3)  
AT60142FT-DD17M-E(1)  
AT60142FT-DD17MSV(1) (2)  
AT60142FT-DS15M-E(1)  
AT60142FT-DS15MMQ(1) (2)  
AT60142FT-DS15MSV(1) (2)  
AT60142FT-DS15MSR(1) (2)  
AT60142FT-DS15ESCC(3)  
AT60142FT-DD15M-E(1)  
AT60142FT-DS15MSV  
Engineering Samples  
QML V  
-55° to +125°C  
25°C  
Die  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
FP36.5 grounded lid  
Die  
Engineering Samples  
QML Q  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
-55° to +125°C  
25°C  
QML V  
QML V RHA  
ESCC  
Engineering Samples  
QML V  
-55° to +125°C  
Die  
Note:  
1. Contact Atmel for availability.  
2. Will be replaced by SMD part number when available.  
3. Will be replaced by ESCC part number when available.  
11  
AT60142FT  
7726B–AERO–04/09  
AT60142FT  
Package Drawings  
36-lead Flat Pack (500 Mils)  
Notes: 1. package DC : lid is NOT connected to GROUND  
2. package DS : lid is connected to GROUND  
Document Revision  
History  
Changes from  
1. Update of Absolute Maximum Ratings section  
Rev. A to Rev. B  
12  
7726B–AERO–04/09  
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subsidiaries. Other terms and product names may be the trademarks of others.  
Printed on recycled paper.  
7726B–AERO–04/09  
/xM  

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