AT89C1051-12SC [ATMEL]

8-Bit Microcontroller with 1K Byte Flash; 8 -bit微控制器1K字节的FLASH
AT89C1051-12SC
型号: AT89C1051-12SC
厂家: ATMEL    ATMEL
描述:

8-Bit Microcontroller with 1K Byte Flash
8 -bit微控制器1K字节的FLASH

微控制器和处理器 外围集成电路 光电二极管 异步传输模式 ATM 时钟
文件: 总12页 (文件大小:154K)
中文:  中文翻译
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Features  
Compatible with MCS-51™ Products  
1K Byte of Reprogrammable Flash Memory  
– Endurance: 1,000 Write/Erase Cycles  
2.7V to 6V Operating Range  
Fully Static Operation: 0 Hz to 24 MHz  
Two-Level Program Memory Lock  
64 bytes SRAM  
15 Programmable I/O Lines  
One 16-Bit Timer/Counter  
Three Interrupt Sources  
Direct LED Drive Outputs  
On-Chip Analog Comparator  
Low Power Idle and Power Down Modes  
8-Bit  
Microcontroller  
with 1K Byte  
Flash  
Description  
The AT89C1051 is a low-voltage, high-performance CMOS 8-bit microcomputer with  
1K byte of Flash programmable and erasable read only memory (PEROM). The  
device is manufactured using Atmel’s high density nonvolatile memory technology  
and is compatible with the industry standard MCS-51™ instruction set. By combining  
a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C1051 is a pow-  
erful microcomputer which provides a highly flexible and cost effective solution to  
many embedded control applications.  
AT89C1051  
The AT89C1051 provides the following standard features: 1K Byte of Flash, 64 bytes  
of RAM, 15 I/O lines, one 16-bit timer/counter, a three vector two-level interrupt archi-  
tecture, a precision analog comparator, on-chip oscillator and clock circuitry. In addi-  
tion, the AT89C1051 is designed with static logic for operation down to zero frequency  
and supports two software selectable power saving modes. The Idle Mode stops the  
CPU while allowing the RAM, timer/counters, serial port and interrupt system to con-  
tinue functioning. The Power Down Mode saves the RAM contents but freezes the  
oscillator disabling all other chip functions until the next hardware reset.  
Pin Configuration  
PDIP/SOIC  
0366D-A–12/97  
4-3  
Block Diagram  
VCC  
RAM ADDR.  
REGISTER  
RAM  
FLASH  
GND  
PROGRAM  
ADDRESS  
REGISTER  
B
STACK  
POINTER  
ACC  
REGISTER  
BUFFER  
TMP2  
TMP1  
PC  
INCREMENTER  
ALU  
INTERRUPT,  
AND TIMER BLOCKS  
PROGRAM  
COUNTER  
PSW  
TIMING  
AND  
CONTROL  
INSTRUCTION  
REGISTER  
RST  
DPTR  
PORT 1  
LATCH  
PORT 3  
LATCH  
ANALOG  
COMPARATOR  
+
-
OSC  
PORT 1 DRIVERS  
P1.0 - P1.7  
PORT 3 DRIVERS  
P3.0 - P3.5  
P3.7  
AT89C1051  
4-4  
AT89C1051  
Pin Description  
VCC  
Supply voltage.  
Oscillator Characteristics  
XTAL1 and XTAL2 are the input and output, respectively,  
of an inverting amplifier which can be configured for use as  
an on-chip oscillator, as shown in Figure 1. Either a quartz  
crystal or ceramic resonator may be used. To drive the  
device from an external clock source, XTAL2 should be left  
unconnected while XTAL1 is driven as shown in Figure 2.  
There are no requirements on the duty cycle of the external  
clock signal, since the input to the internal clocking circuitry  
is through a divide-by-two flip-flop, but minimum and maxi-  
mum voltage high and low time specifications must be  
observed.  
GND  
Ground.  
Port 1  
Port 1 is an 8-bit bidirectional I/O port. Port pins P1.2 to  
P1.7 provide internal pullups. P1.0 and P1.1 require exter-  
nal pullups. P1.0 and P1.1 also serve as the positive input  
(AIN0) and the negative input (AIN1), respectively, of the  
on-chip precision analog comparator. The Port 1 output  
buffers can sink 20 mA and can drive LED displays directly.  
When 1s are written to Port 1 pins, they can be used as  
inputs. When pins P1.2 to P1.7 are used as inputs and are  
externally pulled low, they will source current (IIL) because  
of the internal pullups.  
Figure 1. Oscillator Connections  
Port 1 also receives code data during Flash programming  
and verification.  
Port 3  
Port 3 pins P3.0 to P3.5, P3.7 are seven bidirectional I/O  
pins with internal pullups. P3.6 is hard-wired as an input to  
the output of the on-chip comparator and is not accessible  
as a general purpose I/O pin. The Port 3 output buffers can  
sink 20 mA. When 1s are written to Port 3 pins they are  
pulled high by the internal pullups and can be used as  
inputs. As inputs, Port 3 pins that are externally being  
pulled low will source current (IIL) because of the pullups.  
Port 3 also serves the functions of various special features  
of the AT89C1051 as listed below:  
Note:  
C1, C2 = 30 pF ± 10 pF for Crystals  
= 40 pF ± 10 pF for Ceramic Resonators  
Port Pin  
Alternate Functions  
P3.2  
P3.3  
P3.4  
INT0 (external interrupt 0)  
INT1 (external interrupt 1)  
T0 (timer 0 external input)  
Figure 2. External Clock Drive Configuration  
Port 3 also receives some control signals for Flash pro-  
gramming and verification.  
RST  
Reset input. All I/O pins are reset to 1s as soon as RST  
goes high. Holding the RST pin high for two machine cycles  
while the oscillator is running resets the device.  
Each machine cycle takes 12 oscillator or clock cycles.  
XTAL1  
Input to the inverting oscillator amplifier and input to the  
internal clock operating circuit.  
XTAL2  
Output from the inverting oscillator amplifier.  
4-5  
Restrictions on Certain Instructions  
Special Function Registers  
The AT89C1051 is an economical and cost-effective mem-  
ber of Atmel’s growing family of microcontrollers. It con-  
tains 1K byte of flash program memory. It is fully compati-  
ble with the MCS-51 architecture, and can be programmed  
using the MCS-51 instruction set. However, there are a  
few considerations one must keep in mind when utilizing  
certain instructions to program this device.  
A map of the on-chip memory area called the Special Func-  
tion Register (SFR) space is shown in the table below.  
Note that not all of the addresses are occupied, and unoc-  
cupied addresses may not be implemented on the chip.  
Read accesses to these addresses will in general return  
random data, and write accesses will have an indetermi-  
nate effect.  
All the instructions related to jumping or branching should  
be restricted such that the destination address falls within  
the physical program memory space of the device, which is  
1K for the AT89C1051. This should be the responsibility of  
the software programmer. For example, LJMP 3FEH  
would be a valid instruction for the AT89C1051 (with 1K of  
memory), whereas LJMP 410H would not.  
User software should not write 1s to these unlisted loca-  
tions, since they may be used in future products to invoke  
new features. In that case, the reset or inactive values of  
the new bits will always be 0.  
Table 1. AT89C1051 SFR Map and Reset Values  
0F8H  
0FFH  
0F7H  
0EFH  
0E7H  
0DFH  
0D7H  
0F0H  
0E8H  
0E0H  
0D8H  
0D0H  
B
00000000  
ACC  
00000000  
PSW  
00000000  
0C8H  
0C0H  
0CFH  
0C7H  
0B8H  
0B0H  
0A8H  
0A0H  
98H  
IP  
0BFH  
0B7H  
0AFH  
0A7H  
9FH  
XXX00000  
P3  
11111111  
IE  
0XX00000  
90H  
P1  
97H  
11111111  
88H  
TCON  
00000000  
TMOD  
00000000  
TL0  
00000000  
TH0  
00000000  
8FH  
87H  
80H  
SP  
DPL  
DPH  
PCON  
00000111  
00000000  
00000000  
0XXX0000  
AT89C1051  
4-6  
AT89C1051  
1. Branching instructions:  
LCALL, LJMP, ACALL, AJMP, SJMP, JMP @A+DPTR  
Idle Mode  
In idle mode, the CPU puts itself to sleep while all the on-  
chip peripherals remain active. The mode is invoked by  
software. The content of the on-chip RAM and all the spe-  
cial functions registers remain unchanged during this  
mode. The idle mode can be terminated by any enabled  
interrupt or by a hardware reset.  
These unconditional branching instructions will execute  
correctly as long as the programmer keeps in mind that the  
destination branching address must fall within the physical  
boundaries of the program memory size (locations 00H to  
3FFH for the 89C1051). Violating the physical space limits  
may cause unknown program behavior.  
P1.0 and P1.1 should be set to ‘0’ if no external pullups are  
used, or set to ‘1’ if external pullups are used.  
CJNE [...], DJNZ [...], JB, JNB, JC, JNC, JBC, JZ, JNZ With  
these conditional branching instructions the same rule  
above applies. Again, violating the memory boundaries  
may cause erratic execution.  
It should be noted that when idle is terminated by a hard-  
ware reset, the device normally resumes program execu-  
tion, from where it left off, up to two machine cycles before  
the internal reset algorithm takes control. On-chip hardware  
inhibits access to internal RAM in this event, but access to  
the port pins is not inhibited. To eliminate the possibility of  
an unexpected write to a port pin when Idle is terminated by  
reset, the instruction following the one that invokes Idle  
should not be one that writes to a port pin or to external  
memory.  
For applications involving interrupts the normal interrupt  
service routine address locations of the 80C51 family archi-  
tecture have been preserved.  
2. MOVX-related instructions, Data Memory:  
The AT89C1051 contains 64 bytes of internal data mem-  
ory. Thus, in the AT89C1051 the stack depth is limited to  
64 bytes, the amount of available RAM. External DATA  
memory access is not supported in this device, nor is exter-  
nal PROGRAM memory execution. Therefore, no MOVX  
[...] instructions should be included in the program.  
Power Down Mode  
In the power down mode the oscillator is stopped, and the  
instruction that invokes power down is the last instruction  
executed. The on-chip RAM and Special Function Regis-  
ters retain their values until the power down mode is termi-  
nated. The only exit from power down is a hardware reset.  
Reset redefines the SFRs but does not change the on-chip  
RAM. The reset should not be activated before VCC is  
restored to its normal operating level and must be held  
active long enough to allow the oscillator to restart and sta-  
bilize.  
A typical 80C51 assembler will still assemble instructions,  
even if they are written in violation of the restrictions men-  
tioned above. It is the responsibility of the controller user to  
know the physical features and limitations of the device  
being used and adjust the instructions used correspond-  
ingly.  
Program Memory Lock Bits  
On the chip are two lock bits which can be left unpro-  
grammed (U) or can be programmed (P) to obtain the addi-  
tional features listed in the table below:  
P1.0 and P1.1 should be set to ’0’ if no external pullups are  
used, or set to ’1’ if external pullups are used.  
(1)  
Programming The Flash  
Lock Bit Protection Modes  
The AT89C1051 is shipped with the 1K byte of on-chip  
PEROM code memory array in the erased state (i.e., con-  
tents = FFH) and ready to be programmed. The code mem-  
ory array is programmed one byte at a time. Once the array  
is programmed, to re-program any non-blank byte, the  
entire memory array needs to be erased electrically.  
Program Lock Bits  
LB1  
LB2  
Protection Type  
1
2
U
U
No program lock features.  
P
U
Further programming of the Flash  
is disabled.  
Internal Address Counter: The AT89C1051 contains an  
internal PEROM address counter which is always reset to  
000H on the rising edge of RST and is advanced by apply-  
ing a positive going pulse to pin XTAL1.  
3
P
P
Same as mode 2, also verify is  
disabled.  
Note:  
1. The Lock Bits can only be erased with the Chip Erase  
operation.  
4-7  
Programming Algorithm: To program the AT89C1051,  
the following sequence is recommended.  
Data Polling: The AT89C1051 features Data Polling to  
indicate the end of a write cycle. During a write cycle, an  
attempted read of the last byte written will result in the com-  
plement of the written data on P1.7. Once the write cycle  
has been completed, true data is valid on all outputs, and  
the next cycle may begin. Data Polling may begin any time  
after a write cycle has been initiated.  
1. Power-up sequence:  
Apply power between VCC and GND pins  
Set RST and XTAL1 to GND  
2. Set pin RST to ‘H’  
Set pin P3.2 to ‘H’  
Ready/Busy: The Progress of byte programming can also  
be monitored by the RDY/BSY output signal. Pin P3.1 is  
pulled low after P3.2 goes High during programming to indi-  
cate BUSY. P3.1 is pulled High again when programming is  
done to indicate READY.  
3. Apply the appropriate combination of ‘H’ or ‘L’ logic  
levels to pins P3.3, P3.4, P3.5, P3.7 to select one of the  
programming operations shown in the PEROM Pro-  
gramming Modes table.  
To Program and Verify the Array:  
Program Verify: If lock bits LB1 and LB2 have not been  
programmed code data can be read back via the data lines  
for verification:  
4. Apply data for Code byte at location 000H to P1.0 to  
P1.7.  
5. Raise RST to 12V to enable programming.  
1. Reset the internal address counter to 000H by bringing  
RST from ’L’ to ’H’.  
2. Apply the appropriate control signals for Read Code data  
and read the output data at the port P1 pins.  
3. Pulse pin XTAL1 once to advance the internal address  
counter.  
6. Pulse P3.2 once to program a byte in the PEROM array  
or the lock bits. The byte-write cycle is self-timed and  
typically takes 1.2 ms.  
7. To verify the programmed data, lower RST from 12V to  
logic ‘H’ level and set pins P3.3 to P3.7 to the appropiate  
levels. Output data can be read at the port P1 pins.  
4. Read the next code data byte at the port P1 pins.  
5. Repeat steps 3 and 4 until the entire array is read.  
The lock bits cannot be verified directly. Verification of the  
lock bits is achieved by observing that their features are  
enabled.  
8. To program a byte at the next address location, pulse  
XTAL1 pin once to advance the internal address counter.  
Apply new data to the port P1 pins.  
9. Repeat steps 5 through 8, changing data and advancing  
the address counter for the entire 1K byte array or until  
the end of the object file is reached.  
10.Power-off sequence:  
set XTAL1 to ‘L’  
set RST to ‘L’  
Turn VCC power off  
Flash Programming Modes  
Mode  
RST/VPP  
P3.2/PROG  
P3.3  
P3.4  
P3.5  
P3.7  
Write Code Data(1)(3)  
12V  
L
H
H
H
Read Code Data(1)  
Write Lock  
H
H
L
L
H
H
H
H
Bit-1  
Bit-2  
12V  
H
H
12V  
12V  
H
H
H
L
H
L
L
L
L
L
L
L
L
Chip Erase  
(2)  
Read Signature Byte  
H
Note:  
1. The internal PEROM address counter is reset to 000H on the rising edge of RST and is advanced by a positive pulse at  
XTAL1 pin.  
2. Chip Erase requires a 10-ms PROG pulse.  
3. P3.1 is pulled Low during programming to indicate RDY/BSY.  
AT89C1051  
4-8  
AT89C1051  
Chip Erase: The entire PEROM array (1K byte) and the  
two Lock Bits are erased electrically by using the proper  
combination of control signals and by holding P3.2 low for  
10 ms. The code array is written with all “1”s in the Chip  
Erase operation and must be executed before any non-  
blank memory byte can be re-programmed.  
Programming Interface  
Every code byte in the Flash array can be written and the  
entire array can be erased by using the appropriate combi-  
nation of control signals. The write operation cycle is self-  
timed and once initiated, will automatically time itself to  
completion.  
Reading the Signature Bytes: The signature bytes are  
read by the same procedure as a normal verification of  
locations 000H, 001H, and 002H, except that P3.5 and  
P3.7 must be pulled to a logic low. The values returned are  
as follows.  
(000H) = 1EH indicates manufactured by Atmel  
(001H) = 11H indicates 89C1051  
Figure 3. Programming the Flash Memory  
Figure 4. Verifying the Flash Memory  
5V  
5V  
AT89C1051  
AT89C1051  
VCC  
VCC  
RDY/BSY  
PROG  
P3.1  
P3.2  
P3.3  
P3.4  
P3.5  
P3.7  
PGM  
DATA  
PGM  
DATA  
P1  
P1  
VI H  
P3.2  
P3.3  
P3.4  
P3.5  
P3.7  
SEE FLASH  
PROGRAMMING  
MODES TABLE  
SEE FLASH  
PROGRAMMING  
MODES TABLE  
VI H/ VPP  
XTAL1  
GND  
RST  
VI H  
XTAL1  
GND  
RST  
TO INCREMENT  
ADDRESS COUNTER  
4-9  
Flash Programming and Verification Characteristics  
TA = 0°C to 70°C, VCC = 5.0 ± 10%  
Symbol  
VPP  
Parameter  
Min  
Max  
12.5  
250  
Units  
V
Programming Enable Voltage  
Programming Enable Current  
Data Setup to PROG Low  
Data Hold After PROG  
P3.4 (ENABLE) High to VPP  
VPP Setup to PROG Low  
VPP Hold After PROG  
11.5  
IPP  
µA  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
tDVGL  
tGHDX  
tEHSH  
tSHGL  
tGHSL  
tGLGH  
tELQV  
tEHQZ  
tGHBL  
tWC  
1.0  
1.0  
1.0  
10  
10  
1
PROG Width  
110  
1.0  
1.0  
50  
ENABLE Low to Data Valid  
Data Float After ENABLE  
PROG High to BUSY Low  
Byte Write Cycle Time  
RDY/BSY to Increment Clock Delay  
Increment Clock High  
0
2.0  
ms  
µs  
ns  
tBHIH  
tIHIL  
Note:  
1.0  
200  
Only used in 12-volt programming mode.  
Flash Programming and Verification Waveforms  
AT89C1051  
4-10  
AT89C1051  
Absolute Maximum Ratings  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Operating Temperature........................-55°C to +125°C  
Storage Temperature ...........................-65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground........................... -1.0V to +7.0V  
Maximum Operating Voltage...................................6.6V  
DC Output Current ............................................25.0 mA  
DC Characteristics  
TA = -40°C to 85°C, VCC = 2.7V to 6.0V (unless otherwise noted)  
Symbol  
VIL  
Parameter  
Condition  
Min  
-0.5  
Max  
0.2 VCC - 0.1  
VCC + 0.5  
VCC + 0.5  
0.50  
Units  
Input Low Voltage  
Input High Voltage  
Input High Voltage  
V
V
V
V
VIH  
(Except XTAL1, RST)  
(XTAL1, RST)  
0.2 VCC + 0.9  
0.7 VCC  
VIH1  
VOL  
Output Low Voltage(1)  
(Ports 1, 3)  
IOL = 20 mA, VCC = 5V  
I
OL = 10 mA, VCC = 2.7V  
IOH = -80 µA, VCC = 5V ± 10%  
OH = -30 µA  
VOH  
Output High Voltage  
(Ports 1, 3)  
2.4  
V
V
I
0.75 VCC  
0.9 VCC  
IOH = -12 µA  
V
IIL  
Logical 0 Input Current  
(Ports 1, 3)  
VIN = 0.45V  
-50  
-750  
±10  
20  
µA  
ITL  
Logical 1 to 0 Transition  
Current (Ports 1, 3)  
VIN = 2V, VCC = 5V ± 10%  
0 < VIN < VCC  
µA  
µA  
mV  
V
ILI  
Input Leakage Current  
(Port P1.0, P1.1)  
VOS  
VCM  
Comparator Input Offset  
Voltage  
VCC = 5V  
Comparator Input Common  
Mode Voltage  
0
VCC  
RRST  
CIO  
Reset Pulldown Resistor  
Pin Capacitance  
50  
300  
10  
KΩ  
pF  
Test Freq. = 1 MHz, TA = 25°C  
ICC  
Power Supply Current  
Active Mode, 12 MHz, VCC = 6V/3V  
15/5.5  
5/1  
mA  
mA  
Idle Mode, 12 MHz, VCC = 6V/3V P1.0 &  
P1.1 = 0V or VCC  
Power Down Mode(2)  
VCC = 6V P1.0 & P1.1 = 0V or VCC  
100  
20  
µA  
µA  
V
CC = 3V P1.0 & P1.1 = 0V or VCC  
Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:  
Maximum IOL per port pin: 20 mA  
Maximum total IOL for all output pins: 80 mA  
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater  
than the listed test conditions.  
2. Minimum VCC for Power Down is 2V.  
4-11  
External Clock Drive Waveforms  
External Clock Drive  
Symbol  
Parameter  
VCC = 2.7V to 6.0V  
Min Max  
12  
VCC = 4.0V to 6.0V  
Units  
Min  
0
Max  
1/tCLCL  
tCLCL  
Oscillator Frequency  
Clock Period  
High Time  
0
24  
MHz  
ns  
83.3  
30  
41.6  
15  
tCHCX  
tCLCX  
tCLCH  
tCHCL  
ns  
Low Time  
30  
15  
ns  
Rise Time  
20  
20  
20  
20  
ns  
Fall Time  
ns  
(1)  
(1)  
AC Testing Input/Output Waveforms  
Float Waveforms  
Note:  
1. AC Inputs during testing are driven at VCC - 0.5V for a  
logic 1 and 0.45V for a logic 0. Timing measurements  
are made at VIH min. for a logic 1 and VIL max. for a  
logic 0.  
Note:  
1. For timing purposes, a port pin is no longer float-  
ing when a 100 mV change load voltage occurs. A  
port pin begins to float when a 100 mV change  
from the loaded V /V level occurs.  
OH OL  
AT89C1051  
4-12  
AT89C1051  
AT89C1051  
TYPICAL ICC - ACTIVE (85°C)  
20  
15  
10  
5
Vcc=6.0V  
I
C
C
Vcc=5.0V  
Vcc=3.0V  
m
A
0
0
6
12  
18  
24  
FREQUENCY (MHz)  
AT89C1051  
TYPICAL ICC - IDLE (85°C)  
3
2
1
0
Vcc=6.0V  
I
C
C
Vcc=5.0V  
m
A
Vcc=3.0V  
0
3
6
9
12  
FREQUENCY (MHz)  
AT89C1051  
TYPICAL ICC vs.VOLTAGE- POWER DOWN (85°C)  
20  
15  
10  
5
I
C
C
µ
A
0
3.0V  
4.0V  
5.0V  
6.0V  
Vcc VOLTAGE  
Notes: 1. XTAL1 tied to GND for I  
(power down)  
CC  
2. P.1.0 and P1.1 = V  
or GND  
CC  
3. Lock bits programmed  
4-13  
Ordering Information  
Speed  
(MHz)  
Power  
Supply  
Ordering Code  
Package  
Operation Range  
12  
2.7V to 6.0V  
AT89C1051-12PC  
AT89C1051-12SC  
20P3  
20S  
Commercial  
(0°C to 70°C)  
AT89C1051-12PI  
AT89C1051-12SI  
20P3  
20S  
Industrial  
(-40°C to 85°C)  
AT89C1051-12PA  
AT89C1051-12SA  
20P3  
20S  
Automotive  
(-40°C to 105°C)  
24  
4.0V to 6.0V  
AT89C1051-24PC  
AT89C1051-24SC  
20P3  
20S  
Commercial  
(0°C to 70°C)  
AT89C1051-24PI  
AT89C1051-24SI  
20P3  
20S  
Industrial  
(-40°C to 85°C)  
Package Type  
20P3  
20 Lead, 0.300” Wide, Plastic Dual In-line Package (PDIP)  
20 Lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC)  
20S  
AT89C1051  
4-14  

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