AT93C56 [ATMEL]
3-wire Serial EEPROMs; 3线串行EEPROM
| 型号： | AT93C56 |
| 厂家： | 
ATMEL |
| 描述： | 3-wire Serial EEPROMs |
| 文件： | 总15页 (文件大小：233K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Low-voltage and Standard-voltage Operation
– 5.0 (VCC = 4.5V to 5.5V)
– 2.7 (VCC = 2.7V to 5.5V)
– 2.5 (VCC = 2.5V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
• User-selectable Internal Organization
– 1K: 128 x 8 or 64 x 16
– 2K: 256 x 8 or 128 x 16
– 4K: 512 x 8 or 256 x 16
• 3-wire Serial Interface
• 2 MHz Clock Rate (5V)
• Self-timed Write Cycle (10 ms max)
• High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
• Automotive Grade and Extended Temperature Devices Available
• 8-lead PDIP, 8-lead JEDEC and EIAJ SOIC, and 8-lead TSSOP Packages
3-wire Serial
EEPROMs
1K (128 x 8 or 64 x 16)
2K (256 x 8 or 128 x 16)
4K (512 x 8 or 256 x 16)
Description
The AT93C46/56/66 provides 1024/2048/4096 bits of serial electrically erasable pro-
grammable read only memory (EEPROM) organized as 64/128/256 words of 16 bits
each, when the ORG pin is connected to VCC and 128/256/512 words of 8 bits each
when it is tied to ground. The device is optimized for use in many industrial and com-
mercial applications where low power and low voltage operations are essential. The
AT93C46/56/66 is available in space-saving 8-lead PDIP and 8-lead JEDEC and EIAJ
AT93C46
AT93C56
AT93C66
(continued)
SOIC packages.
Pin Configurations
8-lead PDIP
Pin Name
Function
CS
Chip Select
CS
SK
DI
1
8
7
6
5
VCC
DC
SK
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
2
3
4
ORG
GND
DI
DO
DO
GND
VCC
ORG
DC
Power Supply
Internal Organization
Don’t Connect
8-lead SOIC
CS
1
8
7
6
5
VCC
DC
SK
DI
2
3
4
ORG
GND
DO
8-lead SOIC
Rotated (R)
(1K JEDEC Only)
8-lead TSSOP
DC
VCC
CS
1
2
3
4
8
7
6
5
ORG
GND
DO
CS
1
2
3
4
8
7
6
5
VCC
DC
SK
DI
ORG
GND
SK
DI
DO
Rev. 0172O–08/01
The AT93C46/56/66 is enabled through the Chip Select pin (CS), and accessed via a
3-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock
(SK). Upon receiving a READ instruction at DI, the address is decoded and the data is
clocked out serially on the data output pin DO. The WRITE cycle is completely self-
timed and no separate ERASE cycle is required before WRITE. The WRITE cycle is
only enabled when the part is in the ERASE/WRITE ENABLE state. When CS is brought
“high” following the initiation of a WRITE cycle, the DO pin outputs the READY/BUSY
status of the part.
The AT93C46 is available in 4.5V to 5.5V, 2.7V to 5.5V, 2.5V to 5.5V, and 1.8V to 5.5V
versions. The AT93C56/66 is available in 4.5V to 5.5V, 2.7V to 5.5V, and 2.5V to 5.5V
versions.
Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
Storage Temperature..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground .....................................-1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Block Diagram
Notes: 1. When the ORG pin is connected to VCC, the x 16 organization is selected. When it is connected to ground, the x 8 orga-
nization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of
the internal 1 Meg ohm pullup, then the x 16 organization is selected. The feature is not available on the 1.8V devices.
2. For the AT93C46, if x 16 organization is the mode of choice and Pin 6 (ORG) is left unconnected, Atmel recommends
using the AT93C46A device. For more details, see the AT93C46A datasheet.
2
AT93C46/56/66
0172O–08/01
AT93C46/56/66
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).
Symbol
COUT
CIN
Test Conditions
Max
5
Units
pF
Conditions
VOUT = 0V
VIN = 0V
Output Capacitance (DO)
Input Capacitance (CS, SK, DI)
5
pF
Note:
1. This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V,
TAC = 0°C to +70°C, VCC = +1.8V to +5.5V (unless otherwise noted).
Symbol
VCC1
Parameter
Test Condition
Min
1.8
2.5
2.7
4.5
Typ
Max
5.5
5.5
5.5
5.5
2.0
2.0
0.1
10.0
10.0
30
Unit
V
Supply Voltage
Supply Voltage
Supply Voltage
Supply Voltage
VCC2
V
VCC3
V
VCC4
V
READ at 1.0 MHz
WRITE at 1.0 MHz
CS = 0V
0.5
0.5
0
mA
mA
µA
µA
µA
µA
µA
µA
ICC
Supply Current
VCC = 5.0V
ISB1
ISB2
ISB3
ISB4
IIL
Standby Current
Standby Current
Standby Current
Standby Current
Input Leakage
VCC = 1.8V
VCC = 2.5V
CS = 0V
6.0
6.0
17
VCC = 2.7V
CS = 0V
VCC = 5.0V
CS = 0V
VIN = 0V to VCC
VIN = 0V to VCC
0.1
0.1
1.0
1.0
IOL
Output Leakage
(1)
VIL1
Input Low Voltage
Input High Voltage
-0.6
2.0
0.8
CC + 1
4.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 2.7V
V
V
(1)
VIH1
V
(1)
VIL2
Input Low Voltage
Input High Voltage
-0.6
VCC x 0.7
VCC x 0.3
VCC + 1
(1)
VIH2
I
I
OL = 2.1 mA
OH = -0.4 mA
0.4
V
V
V
V
VOL1
VOH1
Output Low Voltage
Output High Voltage
4.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 2.7V
2.4
IOL = 0.15 mA
IOH = -100 µA
0.2
VOL2
VOH2
Output Low Voltage
Output High Voltage
VCC - 0.2
Note:
1. VIL min and VIH max are reference only and are not tested.
3
0172O–08/01
AC Characteristics
Applicable over recommended operating range from TA = -40°C to + 85°C, VCC = As Specified,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
Symbol
Parameter
Test Condition
Min
Typ
Max
Units
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
0
0
0
0
2
1
0.5
0.25
SK Clock
Frequency
fSK
MHz
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
tSKH
tSKL
tCS
SK High Time
SK Low Time
ns
ns
ns
ns
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
Minimum CS
Low Time
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
50
50
100
200
tCSS
CS Setup Time
Relative to SK
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
100
100
200
400
tDIS
tCSH
tDIH
DI Setup Time
CS Hold Time
DI Hold Time
Relative to SK
Relative to SK
Relative to SK
ns
ns
ns
0
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
100
100
200
400
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
tPD1
tPD0
tSV
Output Delay to ‘1’
Output Delay to ‘0’
CS to Status Valid
AC Test
AC Test
AC Test
ns
ns
ns
ns
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
250
250
500
1000
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC ≤ 5.5V
100
100
200
400
CS to DO in High
Impedance
AC Test
CS = VIL
tDF
10
ms
ms
tWP
Write Cycle Time
4.5V ≤ VCC ≤ 5.5V
3
Endurance(1)
5.0V, 25°C, Page Mode
1M
Write Cycles
Note:
1. This parameter is characterized and is not 100% tested.
4
AT93C46/56/66
0172O–08/01
AT93C46/56/66
Instruction Set for the AT93C46
Address
Data
Op
Instruction
SB
Code
x 8
x 16
x 8
x 16
Comments
READ
1
10
00
A6 - A0
A5 - A0
Reads data stored in memory, at
specified address.
EWEN
1
11XXXXX
11XXXX
Write enable must precede all
programming modes.
ERASE
WRITE
ERAL
1
1
1
11
01
00
A6 - A0
A6 - A0
A5 - A0
A5 - A0
Erase memory location An - A0.
Writes memory location An - A0.
D7 - D0
D7 - D0
D15 - D0
10XXXXX
10XXXX
Erases all memory locations. Valid
only at VCC = 4.5V to 5.5V.
WRAL
EWDS
1
1
00
00
01XXXXX
00XXXXX
01XXXX
00XXXX
D15 - D0
Writes all memory locations. Valid
only at VCC = 4.5V to 5.5V.
Disables all programming
instructions.
5
0172O–08/01
Functional
Description
The AT93C46/56/66 is accessed via a simple and versatile 3-wire serial communication
interface. Device operation is controlled by seven instructions issued by the host pro-
cessor. A valid instruction starts with a rising edge of CS and consists of a Start Bit
(logic “1”) followed by the appropriate Op Code and the desired memory Address
location.
READ (READ): The Read (READ) instruction contains the Address code for the mem-
ory location to be read. After the instruction and address are decoded, data from the
selected memory location is available at the serial output pin DO. Output data changes
are synchronized with the rising edges of serial clock SK. It should be noted that a
dummy bit (logic “0”) precedes the 8- or 16-bit data output string.
ERASE/WRITE (EWEN): To assure data integrity, the part automatically goes into the
Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable
(EWEN) instruction must be executed first before any programming instructions can be
carried out. Please note that once in the Erase/Write Enable state, programming
remains enabled until an Erase/Write Disable (EWDS) instruction is executed or VCC
power is removed from the part.
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified
memory location to the logical “1” state. The self-timed erase cycle starts once the
ERASE instruction and address are decoded. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
A logic “1” at pin DO indicates that the selected memory location has been erased, and
the part is ready for another instruction.
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be
written into the specified memory location. The self-timed programming cycle, tWP, starts
after the last bit of data is received at serial data input pin DI. The DO pin outputs the
READY/BUSY status of the part if CS is brought high after being kept low for a minimum
of 250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic
“1” indicates that the memory location at the specified address has been written with the
data pattern contained in the instruction and the part is ready for further instructions. A
READY/BUSY status cannot be obtained if the CS is brought high after the end of
the self-timed programming cycle, tWP
.
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-
ory array to the logic “1” state and is primarily used for testing purposes. The DO pin
outputs the READY/BUSY status of the part if CS is brought high after being kept low for
a minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V 10%.
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations
with the data patterns specified in the instruction. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
The WRAL instruction is valid only at VCC = 5.0V 10%.
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the
Erase/Write Disable (EWDS) instruction disables all programming modes and should be
executed after all programming operations. The operation of the READ instruction is
independent of both the EWEN and EWDS instructions and can be executed at any
time.
6
AT93C46/56/66
0172O–08/01
AT93C46/56/66
Timing Diagrams
Synchronous Data Timing
Note:
1. This is the minimum SK period.
Organization Key for Timing Diagrams
AT93C46 (1K)
AT93C56 (2K)
x 16
AT93C66 (4K)
I/O
AN
DN
x 8
A6
x 16
A5
x 8
x 8
A8
x 16
A7
(1)
(2)
A8
D7
A7
D15
D7
D15
D7
D15
Notes: 1. A8 is a DON’T CARE value, but the extra clock is required.
2. A7 is a DON’T CARE value, but the extra clock is required.
READ Timing
7
0172O–08/01
EWEN Timing
EWDS Timing
WRITE Timing
tCS
CS
SK
DI
...
1
0
0
1
1
tCS
CS
SK
DI
...
0
0
0
1
0
tCS
CS
SK
DI
...
...
AN
DN
1
0
1
A0
D0
HIGH IMPEDANCE
BUSY
READY
DO
tWP
WRAL Timing(1)
tCS
CS
SK
DI
1
0
0
0
1
...
DN ... D0
BUSY
HIGH IMPEDANCE
DO
READY
tWP
Note:
1. Valid only at VCC = 4.5V to 5.5V.
8
AT93C46/56/66
0172O–08/01
AT93C46/56/66
ERASE Timing
tCS
CS
STANDBY
CHECK
STATUS
SK
DI
A0
1
1
1
AN
...
AN-1 AN-2
tDF
tSV
HIGH IMPEDANCE
HIGH IMPEDANCE
BUSY
DO
READY
tWP
ERAL Timing(1)
tCS
CS
STANDBY
CHECK
STATUS
SK
DI
1
0
0
1
0
tDF
tSV
BUSY
HIGH IMPEDANCE
HIGH IMPEDANCE
DO
READY
tWP
Note:
1. Valid only at VCC = 4.5V to 5.5V.
9
0172O–08/01
AT93C46 Ordering Information
tWP (max)
ICC (max)
ISB (max)
fMAX
(ms)
(µA)
(µA)
(kHz)
Ordering Code
Package
Operation Range
10
2000
30.0
30.0
10.0
10.0
2000
2000
1000
1000
AT93C46-10PC
AT93C46-10SC
AT93C46R-10SC
AT93C46W-10SC
AT93C46-10TC
8P3
8S1
8S1
8S2
8T
Commercial
(0°C to 70°C)
AT93C46-10PI
AT93C46-10SI
AT93C46R-10SI
AT93C46W-10SI
AT93C46-10TI
8P3
8S1
8S1
8S2
8T
Industrial
(-40°C to 85°C)
10
800
AT93C46-10PC-2.7
AT93C46-10SC-2.7
AT93C46R-10SC-2.7
AT93C46W-10SC-2.7
AT93C46-10TC-2.7
8P3
8S1
8S1
8S2
8T
Commercial
(0°C to 70°C)
AT93C46-10PI-2.7
AT93C46-10SI-2.7
AT93C46R-10SI-2.7
AT93C46W-10SI-2.7
AT93C46-10TI-2.7
8P3
8S1
8S1
8S2
8T
Industrial
(-40°C to 85°C)
Package Type
8P3
8S1
8S2
8T
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
Blank
-2.7
-2.5
R
Standard Operation (4.5V to 5.5V)
Low Voltage (2.7V to 5.5V)
Low Voltage (2.5V to 5.5V)
Rotated Pinout
10
AT93C46/56/66
0172O–08/01
AT93C46/56/66
AT93C46 Ordering Information (Continued)
tWP (max)
ICC (max)
ISB (max)
fMAX
(ms)
(µA)
(µA)
(kHz)
Ordering Code
Package
Operation Range
10
600
10.0
10.0
0.1
500
500
250
250
AT93C46-10PC-2.5
AT93C46-10SC-2.5
AT93C46R-10SC-2.5
AT93C46W-10SC-2.5
AT93C46-10TC-2.5
8P3
8S1
8S1
8S2
8T
Commercial
(0°C to 70°C)
AT93C46-10PI-2.5
AT93C46-10SI-2.5
AT93C46R-10SI-2.5
AT93C46W-10SI-2.5
AT93C46-10TI-2.5
8P3
8S1
8S1
8S2
8T
Industrial
(-40°C to 85°C)
10
80
AT93C46-10PC-1.8
AT93C46-10SC-1.8
AT93C46R-10SC-1.8
AT93C46W-10SC-1.8
AT93C46-10TC-1.8
8P3
8S1
8S1
8S2
8T
Commercial
(0°C to 70°C)
0.1
AT93C46-10PI-1.8
AT93C46-10SI-1.8
AT93C46R-10SI-1.8
AT93C46W-10SI-1.8
AT93C46-10TI-1.8
8P3
8S1
8S1
8S2
8T
Industrial
(-40°C to 85°C)
Package Type
8P3
8S1
8S2
8T
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
Blank
-2.7
-2.5
-1.8
R
Standard Operation (4.5V to 5.5V)
Low Voltage (2.7V to 5.5V)
Low Voltage (2.5V to 5.5V)
Low Voltage (1.8V to 5.5V)
Rotated Pinout
11
0172O–08/01
AT93C56 Ordering Information
tWP (max)
ICC (max)
ISB (max)
fMAX
(ms)
(µA)
(µA)
(kHz)
Ordering Code
Package
Operation Range
10
10
10
2000
30.0
30.0
10.0
10.0
10.0
10.0
2000
2000
1000
1000
500
AT93C56-10PC
AT93C56-10SC
AT93C56W-10SC
8P3
8S1
8S2
Commercial
(0°C to 70°C)
AT93C56-10PI
AT93C56-10SI
AT93C56W-10SI
8P3
8S1
8S2
Industrial
(-40°C to 85°C)
800
AT93C56-10PC-2.7
AT93C56-10SC-2.7
AT93C56W-10SC-2.7
8P3
8S1
8S2
Commercial
(0°C to 70°C)
AT93C56-10PI-2.7
AT93C56-10SI-2.7
AT93C56W-10SI-2.7
8P3
8S1
8S2
Industrial
(-40°C to 85°C)
600
AT93C56-10PC-2.5
AT93C56-10SC-2.5
AT93C56W-10SC-2.5
8P3
8S1
8S2
Commercial
(0°C to 70°C)
500
AT93C56-10PI-2.5
AT93C56-10SI-2.5
AT93C56W-10SI-2.5
8P3
8S1
8S2
Industrial
(-40°C to 85°C)
Package Type
8P3
8S1
8S2
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
Options
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low Voltage (2.7V to 5.5V)
-2.5
Low Voltage (2.5V to 5.5V)
12
AT93C46/56/66
0172O–08/01
AT93C46/56/66
AT93C66 Ordering Information
tWP (max)
ICC (max)
ISB (max)
fMAX
(ms)
(µA)
(µA)
(kHz)
Ordering Code
Package
Operation Range
10
10
10
10
2000
800
600
80
30.0
30.0
10.0
10.0
10.0
10.0
0.1
2000
2000
1000
1000
500
AT93C66-10PC
AT93C66-10SC
AT93C66W-10SC
AT93C66-10TC
8P3
8S1
8S2
8T
Commercial
(0°C to 70°C)
AT93C66-10PI
AT93C66-10SI
AT93C66W-10SI
AT93C66-10TI
8P3
8S1
8S2
8T
Industrial
(-40°C to 85°C)
AT93C66-10PC-2.7
AT93C66-10SC-2.7
AT93C66W-10SC-2.7
AT93C66-10TC-2.7
8P3
8S1
8S2
8T
Commercial
(0°C to 70°C)
AT93C66-10PI-2.7
AT93C66-10SI-2.7
AT93C66W-10SI-2.7
AT93C66-10TI-2.7
8P3
8S1
8S2
8T
Industrial
(-40°C to 85°C)
AT93C66-10PC-2.5
AT93C66-10SC-2.5
AT93C66W-10SC-2.5
AT93C66-10TC-2.5
8P3
8S1
8S2
8T
Commercial
(0°C to 70°C)
500
AT93C66-10PI-2.5
AT93C66-10SI-2.5
AT93C66W-10SI-2.5
AT93C66-10TI-2.5
8P3
8S1
8S2
8T
Industrial
(-40°C to 85°C)
250
AT93C66-10PC-1.8
AT93C66-10SC-1.8
AT93C66W-10SC-1.8
AT93C66-10TC-1.8
8P3
8S1
8S2
8T
Commercial
(0°C to 70°C)
0.1
250
AT93C66-10PI-1.8
AT93C66-10SI-1.8
AT93C66W-10SI-1.8
AT93C66-10TI-1.8
8P3
8S1
8S2
8T
Industrial
(-40°C to 85°C)
Package Type
8P3
8S1
8S2
8T
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
Blank
-2.7
Standard Operation (4.5V to 5.5V)
Low Voltage (2.7V to 5.5V)
-2.5
Low Voltage (2.5V to 5.5V)
-1.8
Low Voltage (1.8V to 5.5V)
13
0172O–08/01
Packaging Information
8P3, 8-lead, 0.300" Wide, Plastic Dual Inline
Package (PDIP)
8S1, 8-lead, 0.150" Wide, Plastic Gull Wing Small
Outline (JEDEC SOIC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-001 BA
Dimensions in Inches and (Millimeters)
.400 (10.16)
.355 (9.02)
.020 (.508)
.013 (.330)
PIN
1
.280 (7.11)
.240 (6.10)
.244 (6.20)
.228 (5.79)
.157 (3.99)
.150 (3.81)
PIN 1
.037 (.940)
.027 (.690)
.300 (7.62) REF
.210 (5.33) MAX
.050 (1.27) BSC
.100 (2.54) BSC
SEATING
PLANE
.196 (4.98)
.189 (4.80)
.068 (1.73)
.053 (1.35)
.015 (.380) MIN
.150 (3.81)
.115 (2.92)
.022 (.559)
.014 (.356)
.070 (1.78)
.045 (1.14)
.010 (.254)
.004 (.102)
.325 (8.26)
.300 (7.62)
0
REF
15
0
8
REF
.010 (.254)
.007 (.203)
.012 (.305)
.008 (.203)
.430 (10.9) MAX
.050 (1.27)
.016 (.406)
8S2, 8-lead, 0.200" Wide, Plastic Gull Wing Small
Outline (EIAJ SOIC)
8T, 8-lead, 0.170" Wide, Thin Shrink Small Outline
Package (TSSOP)
Dimensions in Inches and (Millimeters)
Dimensions in Millimeters and (Inches)*
PIN 1
.020 (.508)
.012 (.305)
6.50 (.256)
6.25 (.246)
.213 (5.41) .330 (8.38)
.205 (5.21) .300 (7.62)
PIN 1
0.30 (.012)
0.19 (.008)
.050 (1.27) BSC
.212 (5.38)
.203 (5.16)
.080 (2.03)
.070 (1.78)
3.10 (.122)
2.90 (.114)
1.05 (.041)
0.80 (.033)
1.20 (.047) MAX
.65 (.026) BSC
0.15 (.006)
0.05 (.002)
.013 (.330)
.004 (.102)
4.5 (.177)
4.3 (.169)
0
8
REF
.010 (.254)
.007 (.178)
0.20 (.008)
0.09 (.004)
.035 (.889)
.020 (.508)
0.75 (.030)
0.45 (.018)
0
8
REF
*Controlling dimension: millimeters
14
AT93C46/56/66
0172O–08/01
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