ATMEGA162V-8MU-SL383 [ATMEL]

Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 8MHz, CMOS, 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VKKD-3, MLF-44;
ATMEGA162V-8MU-SL383
型号: ATMEGA162V-8MU-SL383
厂家: ATMEL    ATMEL
描述:

Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 8MHz, CMOS, 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VKKD-3, MLF-44

时钟 ATM 异步传输模式 微控制器
文件: 总324页 (文件大小:5130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
High-performance, Low-power AVR® 8-bit Microcontroller  
Advanced RISC Architecture  
– 131 Powerful Instructions – Most Single-clock Cycle Execution  
– 32 x 8 General Purpose Working Registers  
– Fully Static Operation  
– Up to 16 MIPS Throughput at 16 MHz  
– On-chip 2-cycle Multiplier  
High Endurance Non-volatile Memory segments  
– 16K Bytes of In-System Self-programmable Flash program memory  
– 512 Bytes EEPROM  
8-bit  
– 1K Bytes Internal SRAM  
– Write/Erase cycles: 10,000 Flash/100,000 EEPROM  
– Data retention: 20 years at 85°C/100 years at 25°C(1)  
– Optional Boot Code Section with Independent Lock Bits  
In-System Programming by On-chip Boot Program  
True Read-While-Write Operation  
Microcontroller  
with 16K Bytes  
In-System  
Programmable  
Flash  
– Up to 64K Bytes Optional External Memory Space  
– Programming Lock for Software Security  
JTAG (IEEE std. 1149.1 Compliant) Interface  
– Boundary-scan Capabilities According to the JTAG Standard  
– Extensive On-chip Debug Support  
– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface  
Peripheral Features  
– Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes  
– Two 16-bit Timer/Counters with Separate Prescalers, Compare Modes, and  
Capture Modes  
ATmega162  
– Real Time Counter with Separate Oscillator  
– Six PWM Channels  
– Dual Programmable Serial USARTs  
ATmega162V  
– Master/Slave SPI Serial Interface  
– Programmable Watchdog Timer with Separate On-chip Oscillator  
– On-chip Analog Comparator  
Special Microcontroller Features  
– Power-on Reset and Programmable Brown-out Detection  
– Internal Calibrated RC Oscillator  
– External and Internal Interrupt Sources  
– Five Sleep Modes: Idle, Power-save, Power-down, Standby, and Extended Standby  
I/O and Packages  
– 35 Programmable I/O Lines  
– 40-pin PDIP, 44-lead TQFP, and 44-pad MLF  
Operating Voltages  
– 1.8 - 5.5V for ATmega162V  
– 2.7 - 5.5V for ATmega162  
Speed Grades  
– 0 - 8 MHz for ATmega162V (see Figure 113 on page 266)  
– 0 - 16 MHz for ATmega162 (see Figure 114 on page 266)  
2513K–AVR–07/09  
Pin  
Figure 1. Pinout ATmega162  
Configurations  
PDIP  
(OC0/T0) PB0  
(OC2/T1) PB1  
(RXD1/AIN0) PB2  
(TXD1/AIN1) PB3  
(SS/OC3B) PB4  
(MOSI) PB5  
VCC  
1
2
3
4
5
6
7
8
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
PA0 (AD0/PCINT0)  
PA1 (AD1/PCINT1)  
PA2 (AD2/PCINT2)  
PA3 (AD3/PCINT3)  
PA4 (AD4/PCINT4)  
PA5 (AD5/PCINT5)  
PA6 (AD6/PCINT6)  
PA7 (AD7/PCINT7)  
PE0 (ICP1/INT2)  
(MISO) PB6  
(SCK) PB7  
RESET  
(RXD0) PD0  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
(TXD0) PD1  
PE1 (ALE)  
PE2 (OC1B)  
(INT0/XCK1) PD2  
(INT1/ICP3) PD3  
(TOSC1/XCK0/OC3A) PD4  
(OC1A/TOSC2) PD5  
(WR) PD6  
PC7 (A15/TDI/PCINT15)  
PC6 (A14/TDO/PCINT14)  
PC5 (A13/TMS/PCINT13)  
PC4 (A12/TCK/PCINT12)  
PC3 (A11/PCINT11)  
PC2 (A10/PCINT10)  
PC1 (A9/PCINT9)  
PC0 (A8/PCINT8)  
(RD) PD7  
XTAL2  
XTAL1  
GND  
TQFP/MLF  
44 42 40 38 36 34  
43 41 39 37 35  
(MOSI) PB5  
(MISO) PB6  
(SCK) PB7  
RESET  
(RXD0) PD0  
PA4 (AD4/PCINT4)  
PA5 (AD5/PCINT5)  
PA6 (AD6/PCINT6)  
PA7 (AD7/PCINT7)  
PE0 (ICP1/INT2)  
GND  
PE1 (ALE)  
PE2 (OC1B)  
PC7 (A15/TDI/PCINT15)  
PC6 (A14/TDO/PCINT14)  
PC5 (A13/TMS/PCINT13)  
1
2
3
4
5
6
7
8
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
VCC  
(TXD0) PD1  
(INT0/XCK1) PD2  
(INT1/ICP3) PD3  
(TOSC1/XCK0/OC3A) PD4  
(OC1A/TOSC2) PD5  
9
10  
11  
13 15 17 19 21  
12 14 16 18 20 22  
NOTE:  
MLF bottom pad should  
be soldered to ground.  
Disclaimer  
Typical values contained in this datasheet are based on simulations and characterization of  
other AVR microcontrollers manufactured on the same process technology. Min and Max values  
will be available after the device is characterized.  
2
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Overview  
The ATmega162 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC  
architecture. By executing powerful instructions in a single clock cycle, the ATmega162  
achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize  
power consumption versus processing speed.  
Block Diagram  
Figure 2. Block Diagram  
PE0 - PE2  
PA0 - PA7  
PC0 - PC7  
VCC  
PORTE  
PORTA DRIVERS/BUFFERS  
PORTA DIGITAL INTERFACE  
DRIVERS/  
BUFFERS  
PORTC DRIVERS/BUFFERS  
PORTC DIGITAL INTERFACE  
PORTE  
DIGITAL  
INTERFACE  
GND  
INTERNAL  
PROGRAM  
STACK  
OSCILLATOR  
COUNTER  
POINTER  
XTAL1  
WATCHDOG  
TIMER  
PROGRAM  
FLASH  
OSCILLATOR  
SRAM  
XTAL2  
MCU CTRL.  
& TIMING  
INSTRUCTION  
REGISTER  
GENERAL  
PURPOSE  
REGISTERS  
RESET  
X
Y
Z
INTERNAL  
CALIBRATED  
OSCILLATOR  
INTERRUPT  
UNIT  
INSTRUCTION  
DECODER  
CONTROL  
LINES  
TIMERS/  
COUNTERS  
OSCILLATOR  
ALU  
STATUS  
REGISTER  
AVR CPU  
EEPROM  
USART0  
PROGRAMMING  
LOGIC  
SPI  
+
-
COMP.  
INTERFACE  
USART1  
PORTB DIGITAL INTERFACE  
PORTD DIGITAL INTERFACE  
PORTD DRIVERS/BUFFERS  
PORTB DRIVERS/BUFFERS  
PB0 - PB7  
PD0 - PD7  
3
2513K–AVR–07/09  
The AVR core combines a rich instruction set with 32 general purpose working registers. All the  
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent  
registers to be accessed in one single instruction executed in one clock cycle. The resulting  
architecture is more code efficient while achieving throughputs up to ten times faster than con-  
ventional CISC microcontrollers.  
The ATmega162 provides the following features: 16K bytes of In-System Programmable Flash  
with Read-While-Write capabilities, 512 bytes EEPROM, 1K bytes SRAM, an external memory  
interface, 35 general purpose I/O lines, 32 general purpose working registers, a JTAG interface  
for Boundary-scan, On-chip Debugging support and programming, four flexible Timer/Counters  
with compare modes, internal and external interrupts, two serial programmable USARTs, a pro-  
grammable Watchdog Timer with Internal Oscillator, an SPI serial port, and five software  
selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM,  
Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode  
saves the register contents but freezes the Oscillator, disabling all other chip functions until the  
next interrupt or Hardware Reset. In Power-save mode, the Asynchronous Timer continues to  
run, allowing the user to maintain a timer base while the rest of the device is sleeping. In  
Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping.  
This allows very fast start-up combined with low-power consumption. In Extended Standby  
mode, both the main Oscillator and the Asynchronous Timer continue to run.  
The device is manufactured using Atmel’s high density non-volatile memory technology. The  
On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI  
serial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot Pro-  
gram running on the AVR core. The Boot Program can use any interface to download the  
Application Program in the Application Flash memory. Software in the Boot Flash section will  
continue to run while the Application Flash section is updated, providing true Read-While-Write  
operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a  
monolithic chip, the Atmel ATmega162 is a powerful microcontroller that provides a highly flexi-  
ble and cost effective solution to many embedded control applications.  
The ATmega162 AVR is supported with a full suite of program and system development tools  
including: C compilers, macro assemblers, program debugger/simulators, In-Circuit Emulators,  
and evaluation kits.  
ATmega161 and  
ATmega162  
Compatibility  
The ATmega162 is a highly complex microcontroller where the number of I/O locations super-  
sedes the 64 I/O locations reserved in the AVR instruction set. To ensure back-ward  
compatibility with the ATmega161, all I/O locations present in ATmega161 have the same loca-  
tions in ATmega162. Some additional I/O locations are added in an Extended I/O space starting  
from 0x60 to 0xFF, (i.e., in the ATmega162 internal RAM space). These locations can be  
reached by using LD/LDS/LDD and ST/STS/STD instructions only, not by using IN and OUT  
instructions. The relocation of the internal RAM space may still be a problem for ATmega161  
users. Also, the increased number of Interrupt Vectors might be a problem if the code uses  
absolute addresses. To solve these problems, an ATmega161 compatibility mode can be  
selected by programming the fuse M161C. In this mode, none of the functions in the Extended  
I/O space are in use, so the internal RAM is located as in ATmega161. Also, the Extended Inter-  
rupt Vec-tors are removed. The ATmega162 is 100% pin compatible with ATmega161, and can  
replace the ATmega161 on current Printed Circuit Boards. However, the location of Fuse bits  
and the electrical characteristics differs between the two devices.  
ATmega161  
Programming the M161C will change the following functionality:  
Compatibility Mode  
The extended I/O map will be configured as internal RAM once the M161C Fuse is  
programmed.  
4
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The timed sequence for changing the Watchdog Time-out period is disabled. See “Timed  
Sequences for Changing the Configuration of the Watchdog Timer” on page 56 for details.  
The double buffering of the USART Receive Registers is disabled. See “AVR USART vs.  
AVR UART – Compatibility” on page 168 for details.  
Pin change interrupts are not supported (Control Registers are located in Extended I/O).  
One 16 bits Timer/Counter (Timer/Counter1) only. Timer/Counter3 is not accessible.  
Note that the shared UBRRHI Register in ATmega161 is split into two separate registers in  
ATmega162, UBRR0H and UBRR1H. The location of these registers will not be affected by the  
ATmega161 compatibility fuse.  
Pin Descriptions  
VCC  
Digital supply voltage  
Ground  
GND  
Port A (PA7..PA0)  
Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port A output buffers have symmetrical drive characteristics with both high sink and source  
capability. When pins PA0 to PA7 are used as inputs and are externally pulled low, they will  
source current if the internal pull-up resistors are activated. The Port A pins are tri-stated when a  
reset condition becomes active, even if the clock is not running.  
Port A also serves the functions of various special features of the ATmega162 as listed on page  
72.  
Port B (PB7..PB0)  
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port B output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,  
even if the clock is not running.  
Port B also serves the functions of various special features of the ATmega162 as listed on page  
72.  
Port C (PC7..PC0)  
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port C output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,  
even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins  
PC7(TDI), PC5(TMS) and PC4(TCK) will be activated even if a Reset occurs.  
Port C also serves the functions of the JTAG interface and other special features of the  
ATmega162 as listed on page 75.  
5
2513K–AVR–07/09  
Port D (PD7..PD0)  
Port E(PE2..PE0)  
RESET  
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port D output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,  
even if the clock is not running.  
Port D also serves the functions of various special features of the ATmega162 as listed on page  
78.  
Port E is an 3-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port E output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port E pins are tri-stated when a reset condition becomes active,  
even if the clock is not running.  
Port E also serves the functions of various special features of the ATmega162 as listed on page  
81.  
Reset input. A low level on this pin for longer than the minimum pulse length will generate a  
Reset, even if the clock is not running. The minimum pulse length is given in Table 18 on page  
48. Shorter pulses are not guaranteed to generate a reset.  
XTAL1  
XTAL2  
Input to the Inverting Oscillator amplifier and input to the internal clock operating circuit.  
Output from the Inverting Oscillator amplifier.  
6
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Resources  
A comprehensive set of development tools, application notes and datasheets are available for  
download on http://www.atmel.com/avr.  
Note:  
1.  
Data Retention  
Reliability Qualification results show that the projected data retention failure rate is much less  
than 1 PPM over 20 years at 85°C or 100 years at 25°C.  
7
2513K–AVR–07/09  
About Code  
Examples  
This documentation contains simple code examples that briefly show how to use various parts of  
the device. These code examples assume that the part specific header file is included before  
compilation. Be aware that not all C compiler vendors include bit definitions in the header files  
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documen-  
tation for more details.  
8
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
AVR CPU Core  
Introduction  
This section discusses the AVR core architecture in general. The main function of the CPU core  
is to ensure correct program execution. The CPU must therefore be able to access memories,  
perform calculations, control peripherals, and handle interrupts.  
Architectural  
Overview  
Figure 3. Block Diagram of the AVR Architecture  
Data Bus 8-bit  
Program  
Counter  
Status  
and Control  
Flash  
Program  
Memory  
Interrupt  
Unit  
32 x 8  
General  
Purpose  
Registrers  
Instruction  
Register  
SPI  
Unit  
Instruction  
Decoder  
Watchdog  
Timer  
ALU  
Analog  
Comparator  
Control Lines  
I/O Module1  
I/O Module 2  
I/O Module n  
Data  
SRAM  
EEPROM  
I/O Lines  
In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with  
separate memories and buses for program and data. Instructions in the program memory are  
executed with a single level pipelining. While one instruction is being executed, the next instruc-  
tion is pre-fetched from the program memory. This concept enables instructions to be executed  
in every clock cycle. The program memory is In-System Reprogrammable Flash memory.  
The fast-access Register File contains 32 x 8-bit general purpose working registers with a single  
clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typ-  
ical ALU operation, two operands are output from the Register File, the operation is executed,  
and the result is stored back in the Register File – in one clock cycle.  
Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data  
Space addressing – enabling efficient address calculations. One of the these address pointers  
9
2513K–AVR–07/09  
can also be used as an address pointer for look up tables in Flash Program memory. These  
added function registers are the 16-bit X-, Y-, and Z-register, described later in this section.  
The ALU supports arithmetic and logic operations between registers or between a constant and  
a register. Single register operations can also be executed in the ALU. After an arithmetic opera-  
tion, the Status Register is updated to reflect information about the result of the operation.  
Program flow is provided by conditional and unconditional jump and call instructions, able to  
directly address the whole address space. Most AVR instructions have a single 16-bit word for-  
mat. Every program memory address contains a 16- or 32-bit instruction.  
Program Flash memory space is divided in two sections, the Boot Program section and the  
Application Program section. Both sections have dedicated Lock bits for write and read/write  
protection. The SPM instruction that writes into the Application Flash memory section must  
reside in the Boot Program section.  
During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the  
Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack  
size is only limited by the total SRAM size and the usage of the SRAM. All user programs must  
initialize the SP in the reset routine (before subroutines or interrupts are executed). The Stack  
Pointer SP is read/write accessible in the I/O space. The data SRAM can easily be accessed  
through the five different addressing modes supported in the AVR architecture.  
The memory spaces in the AVR architecture are all linear and regular memory maps.  
A flexible interrupt module has its control registers in the I/O space with an additional Global  
Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the  
Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector posi-  
tion. The lower the Interrupt Vector address, the higher the priority.  
The I/O memory space contains 64 addresses for CPU peripheral functions as Control Regis-  
ters, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the Data  
Space locations following those of the Register File, 0x20 - 0x5F.  
ALU – Arithmetic  
Logic Unit  
The high-performance AVR ALU operates in direct connection with all the 32 general purpose  
working registers. Within a single clock cycle, arithmetic operations between general purpose  
registers or between a register and an immediate are executed. The ALU operations are divided  
into three main categories – arithmetic, logical, and bit-functions. Some implementations of the  
architecture also provide a powerful multiplier supporting both signed/unsigned multiplication  
and fractional format. See the “Instruction Set” section for a detailed description.  
Status Register  
The Status Register contains information about the result of the most recently executed arithme-  
tic instruction. This information can be used for altering program flow in order to perform  
conditional operations. Note that the Status Register is updated after all ALU operations, as  
specified in the Instruction Set Reference. This will in many cases remove the need for using the  
dedicated compare instructions, resulting in faster and more compact code.  
The Status Register is not automatically stored when entering an interrupt routine and restored  
when returning from an interrupt. This must be handled by software.  
The AVR Status Register – SREG – is defined as:  
Bit  
7
I
6
T
5
H
4
S
3
V
2
N
1
Z
0
C
SREG  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
10  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
• Bit 7 – I: Global Interrupt Enable  
The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual inter-  
rupt enable control is then performed in separate control registers. If the Global Interrupt Enable  
Register is cleared, none of the interrupts are enabled independent of the individual interrupt  
enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by  
the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by  
the application with the SEI and CLI instructions, as described in the instruction set reference.  
• Bit 6 – T: Bit Copy Storage  
The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T bit as source or destina-  
tion for the operated bit. A bit from a register in the Register File can be copied into T by the BST  
instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD  
instruction.  
• Bit 5 – H: Half Carry Flag  
The Half Carry Flag H indicates a half carry in some arithmetic operations. Half Carry is useful in  
BCD arithmetic. See the “Instruction Set Description” for detailed information.  
• Bit 4 – S: Sign Bit, S = N V  
The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement  
Overflow Flag V. See the “Instruction Set Description” for detailed information.  
• Bit 3 – V: Two’s Complement Overflow Flag  
The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the  
“Instruction Set Description” for detailed information.  
• Bit 2 – N: Negative Flag  
The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the  
“Instruction Set Description” for detailed information.  
• Bit 1 – Z: Zero Flag  
The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction  
Set Description” for detailed information.  
• Bit 0 – C: Carry Flag  
The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set  
Description” for detailed information.  
11  
2513K–AVR–07/09  
General Purpose  
Register File  
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve  
the required performance and flexibility, the following input/output schemes are supported by the  
Register File:  
One 8-bit output operand and one 8-bit result input  
Two 8-bit output operands and one 8-bit result input  
Two 8-bit output operands and one 16-bit result input  
One 16-bit output operand and one 16-bit result input  
Figure 4 shows the structure of the 32 general purpose working registers in the CPU.  
Figure 4. AVR CPU General Purpose Working Registers  
7
0
Addr.  
0x00  
0x01  
0x02  
R0  
R1  
R2  
R13  
R14  
R15  
R16  
R17  
0x0D  
0x0E  
0x0F  
0x10  
0x11  
General  
Purpose  
Working  
Registers  
R26  
R27  
R28  
R29  
R30  
R31  
0x1A  
0x1B  
0x1C  
0x1D  
0x1E  
0x1F  
X-register Low Byte  
X-register High Byte  
Y-register Low Byte  
Y-register High Byte  
Z-register Low Byte  
Z-register High Byte  
Most of the instructions operating on the Register File have direct access to all registers, and  
most of them are single cycle instructions.  
As shown in Figure 4, each register is also assigned a data memory address, mapping them  
directly into the first 32 locations of the user Data Space. Although not being physically imple-  
mented as SRAM locations, this memory organization provides great flexibility in access of the  
registers, as the X-, Y-, and Z-pointer registers can be set to index any register in the file.  
12  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The X-register, Y-  
The registers R26..R31 have some added functions to their general purpose usage. These reg-  
register, and Z-register isters are 16-bit address pointers for indirect addressing of the Data Space. The three indirect  
address registers X, Y, and Z are defined as described in Figure 5.  
Figure 5. The X-, Y-, and Z-registers  
15  
XH  
YH  
XL  
0
0
X - register  
7
0
0
7
R27 (0x1B)  
R26 (0x1A)  
15  
YL  
ZL  
0
0
Y - register  
Z - register  
7
7
R29 (0x1D)  
R28 (0x1C)  
15  
ZH  
0
0
7
7
0
R31 (0x1F)  
R30 (0x1E)  
In the different addressing modes these address registers have functions as fixed displacement,  
automatic increment, and automatic decrement (see the instruction set reference for details).  
Stack Pointer  
The Stack is mainly used for storing temporary data, for storing local variables and for storing  
return addresses after interrupts and subroutine calls. The Stack Pointer Register always points  
to the top of the Stack. Note that the Stack is implemented as growing from higher memory loca-  
tions to lower memory locations. This implies that a Stack PUSH command decreases the Stack  
Pointer.  
The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt  
Stacks are located. This Stack space in the data SRAM must be defined by the program before  
any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to  
point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack  
with the PUSH instruction, and it is decremented by two when the return address is pushed onto  
the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is  
popped from the Stack with the POP instruction, and it is incremented by two when data is  
popped from the Stack with return from subroutine RET or return from interrupt RETI.  
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of  
bits actually used is implementation dependent. Note that the data space in some implementa-  
tions of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register  
will not be present.  
Bit  
15  
SP15  
SP7  
7
14  
SP14  
SP6  
6
13  
SP13  
SP5  
5
12  
SP12  
SP4  
4
11  
SP11  
SP3  
3
10  
SP10  
SP2  
2
9
SP9  
SP1  
1
8
SP8  
SP0  
0
SPH  
SPL  
Read/Write  
Initial Value  
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
0
0
0
0
0
0
0
0
13  
2513K–AVR–07/09  
Instruction  
Execution Timing  
This section describes the general access timing concepts for instruction execution. The AVR  
CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the  
chip. No internal clock division is used.  
Figure 6 shows the parallel instruction fetches and instruction executions enabled by the Har-  
vard architecture and the fast-access Register File concept. This is the basic pipelining concept  
to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost,  
functions per clocks, and functions per power-unit.  
Figure 6. The Parallel Instruction Fetches and Instruction Executions  
T1  
T2  
T3  
T4  
clkCPU  
1st Instruction Fetch  
1st Instruction Execute  
2nd Instruction Fetch  
2nd Instruction Execute  
3rd Instruction Fetch  
3rd Instruction Execute  
4th Instruction Fetch  
Figure 7 shows the internal timing concept for the Register File. In a single clock cycle an ALU  
operation using two register operands is executed, and the result is stored back to the destina-  
tion register.  
Figure 7. Single Cycle ALU Operation  
T1  
T2  
T3  
T4  
clkCPU  
Total Execution Time  
Register Operands Fetch  
ALU Operation Execute  
Result Write Back  
Reset and  
Interrupt Handling  
The AVR provides several different interrupt sources. These interrupts and the separate Reset  
Vector each have a separate program vector in the program memory space. All interrupts are  
assigned individual enable bits which must be written logic one together with the Global Interrupt  
Enable bit in the Status Register in order to enable the interrupt. Depending on the Program  
Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12  
are programmed. This feature improves software security. See the section “Memory Program-  
ming” on page 231 for details.  
The lowest addresses in the program memory space are by default defined as the Reset and  
Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 57. The list also  
determines the priority levels of the different interrupts. The lower the address the higher is the  
priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request  
0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL  
bit in the General Interrupt Control Register (GICR). Refer to “Interrupts” on page 57 for more  
information. The Reset Vector can also be moved to the start of the Boot Flash section by pro-  
14  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
gramming the BOOTRST Fuse, see “Boot Loader Support – Read-While-Write Self-  
programming” on page 217.  
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are dis-  
abled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled  
interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a  
Return from Interrupt instruction – RETI – is executed.  
There are basically two types of interrupts. The first type is triggered by an event that sets the  
Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vec-  
tor in order to execute the interrupt handling routine, and hardware clears the corresponding  
Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s)  
to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is  
cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is  
cleared by software. Similarly, if one or more interrupt conditions occur while the global interrupt  
enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the  
Global Interrupt Enable bit is set, and will then be executed by order of priority.  
The second type of interrupts will trigger as long as the interrupt condition is present. These  
interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the  
interrupt is enabled, the interrupt will not be triggered.  
When the AVR exits from an interrupt, it will always return to the main program and execute one  
more instruction before any pending interrupt is served.  
Note that the Status Register is not automatically stored when entering an interrupt routine, nor  
restored when returning from an interrupt routine. This must be handled by software.  
When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled.  
No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the  
CLI instruction. The following example shows how this can be used to avoid interrupts during the  
timed EEPROM write sequence.  
Assembly Code Example  
in r16, SREG  
; store SREG value  
cli ; disable interrupts during timed sequence  
sbi EECR, EEMWE  
sbi EECR, EEWE  
out SREG, r16  
; start EEPROM write  
; restore SREG value (I-bit)  
C Code Example  
char cSREG;  
cSREG = SREG; /* store SREG value */  
/* disable interrupts during timed sequence */  
_CLI();  
EECR |= (1<<EEMWE); /* start EEPROM write */  
EECR |= (1<<EEWE);  
SREG = cSREG; /* restore SREG value (I-bit) */  
15  
2513K–AVR–07/09  
When using the SEI instruction to enable interrupts, the instruction following SEI will be exe-  
cuted before any pending interrupts, as shown in this example.  
Assembly Code Example  
sei  
; set global interrupt enable  
sleep ; enter sleep, waiting for interrupt  
; note: will enter sleep before any pending  
; interrupt(s)  
C Code Example  
_SEI(); /* set global interrupt enable */  
_SLEEP(); /* enter sleep, waiting for interrupt */  
/* note: will enter sleep before any pending interrupt(s) */  
Interrupt Response  
Time  
The interrupt execution response for all the enabled AVR interrupts is four clock cycles mini-  
mum. After four clock cycles the program vector address for the actual interrupt handling routine  
is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack.  
The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If  
an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed  
before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt  
execution response time is increased by four clock cycles. This increase comes in addition to the  
start-up time from the selected sleep mode.  
A return from an interrupt handling routine takes four clock cycles. During these four clock  
cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is  
incremented by two, and the I-bit in SREG is set.  
16  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
AVR  
ATmega162  
Memories  
This section describes the different memories in the ATmega162. The AVR architecture has two  
main memory spaces, the Data Memory and the Program Memory space. In addition, the  
ATmega162 features an EEPROM Memory for data storage. All three memory spaces are linear  
and regular.  
In-System  
The ATmega162 contains 16K bytes On-chip In-System Reprogrammable Flash memory for  
program storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as 8K  
x 16. For software security, the Flash Program memory space is divided into two sections, Boot  
Program section and Application Program section.  
Reprogrammable  
Flash Program  
Memory  
The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATmega162  
Program Counter (PC) is 13 bits wide, thus addressing the 8K program memory locations. The  
operation of Boot Program section and associated Boot Lock bits for software protection are  
described in detail in “Boot Loader Support – Read-While-Write Self-programming” on page 217.  
“Memory Programming” on page 231 contains a detailed description on Flash data serial down-  
loading using the SPI pins or the JTAG interface.  
Constant tables can be allocated within the entire program memory address space (see the LPM  
– Load Program Memory instruction description).  
Timing diagrams for instruction fetch and execution are presented in “Instruction Execution Tim-  
ing” on page 14.  
Figure 8. Program Memory Map(1)  
Program Memory  
0x0000  
Application Flash Section  
Boot Flash Section  
0x1FFF  
Note:  
1. The address reflects word addresses.  
17  
2513K–AVR–07/09  
SRAM Data  
Memory  
Figure 9 shows how the ATmega162 SRAM Memory is organized. Memory configuration B  
refers to the ATmega161 compatibility mode, configuration A to the non-compatible mode.  
The ATmega162 is a complex microcontroller with more peripheral units than can be supported  
within the 64 location reserved in the Opcode for the IN and OUT instructions. For the Extended  
I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can  
be used. The Extended I/O space does not exist when the ATmega162 is in the ATmega161  
compatibility mode.  
In Normal mode, the first 1280 Data Memory locations address both the Register File, the I/O  
Memory, Extended I/O Memory, and the internal data SRAM. The first 32 locations address the  
Register File, the next 64 location the standard I/O memory, then 160 locations of Extended I/O  
memory, and the next 1024 locations address the internal data SRAM.  
In ATmega161 compatibility mode, the lower 1120 Data Memory locations address the Register  
File, the I/O Memory, and the internal data SRAM. The first 96 locations address the Register  
File and I/O Memory, and the next 1024 locations address the internal data SRAM.  
An optional external data SRAM can be used with the ATmega162. This SRAM will occupy an  
area in the remaining address locations in the 64K address space. This area starts at the  
address following the internal SRAM. The Register File, I/O, Extended I/O and Internal SRAM  
uses the occupies the lowest 1280 bytes in Normal mode, and the lowest 1120 bytes in the  
ATmega161 compatibility mode (Extended I/O not present), so when using 64KB (65,536 bytes)  
of External Memory, 64,256 Bytes of External Memory are available in Normal mode, and  
64,416 Bytes in ATmega161 compatibility mode. See “External Memory Interface” on page 26  
for details on how to take advantage of the external memory map.  
When the addresses accessing the SRAM memory space exceeds the internal data memory  
locations, the external data SRAM is accessed using the same instructions as for the internal  
data memory access. When the internal data memories are accessed, the read and write strobe  
pins (PD7 and PD6) are inactive during the whole access cycle. External SRAM operation is  
enabled by setting the SRE bit in the MCUCR Register.  
Accessing external SRAM takes one additional clock cycle per byte compared to access of the  
internal SRAM. This means that the commands LD, ST, LDS, STS, LDD, STD, PUSH, and POP  
take one additional clock cycle. If the Stack is placed in external SRAM, interrupts, subroutine  
calls and returns take three clock cycles extra because the 2-byte Program Counter is pushed  
and popped, and external memory access does not take advantage of the internal pipeline  
memory access. When external SRAM interface is used with wait-state, one-byte external  
access takes two, three, or four additional clock cycles for one, two, and three wait-states  
respectively. Interrupt, subroutine calls and returns will need five, seven, or nine clock cycles  
more than specified in the instruction set manual for one, two, and three wait-states.  
The five different addressing modes for the data memory cover: Direct, Indirect with Displace-  
ment, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the Register  
File, registers R26 to R31 feature the indirect addressing pointer registers.  
The direct addressing reaches the entire data space.  
The Indirect with Displacement mode reaches 63 address locations from the base address given  
by the Y- or Z-register.  
When using register indirect addressing modes with automatic pre-decrement and post-incre-  
ment, the address registers X, Y, and Z are decremented or incremented.  
The 32 general purpose working registers, 64 (+160) I/O Registers, and the 1024 bytes of inter-  
nal data SRAM in the ATmega162 are all accessible through all these addressing modes. The  
Register File is described in “General Purpose Register File” on page 12.  
18  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 9. Data Memory Map  
Memory configuration A  
Memory configuration B  
Data Memory  
Data Memory  
0x0000 - 0x001F  
0x0020 - 0x005F  
0x0060 - 0x00FF  
32 Registers  
64 I/O Registers 0x0020 - 0x005F  
0x0060  
0x0000 - 0x001F  
32 Registers  
64 I/O Registers  
160 Ext I/O Reg.  
0x0100  
Internal SRAM  
(1024 x 8)  
Internal SRAM  
(1024 x 8)  
0x045F  
0x0460  
0x04FF  
0x0500  
External SRAM  
(0 - 64K x 8)  
External SRAM  
(0 - 64K x 8)  
0xFFFF  
0xFFFF  
Data Memory Access  
Times  
This section describes the general access timing concepts for internal memory access. The  
internal data SRAM access is performed in two clkCPU cycles as described in Figure 10.  
Figure 10. On-chip Data SRAM Access Cycles  
T1  
T2  
T3  
clkCPU  
Address valid  
Compute Address  
Address  
Data  
WR  
Data  
RD  
Memory Access Instruction  
Next Instruction  
EEPROM Data  
Memory  
The ATmega162 contains 512 bytes of data EEPROM memory. It is organized as a separate  
data space, in which single bytes can be read and written. The EEPROM has an endurance of at  
least 100,000 write/erase cycles. The access between the EEPROM and the CPU is described  
in the following, specifying the EEPROM Address Registers, the EEPROM Data Register, and  
the EEPROM Control Register.  
19  
2513K–AVR–07/09  
“Memory Programming” on page 231 contains a detailed description on EEPROM Programming  
in SPI, JTAG, or Parallel Programming mode.  
EEPROM Read/Write  
Access  
The EEPROM Access Registers are accessible in the I/O space.  
The write access time for the EEPROM is given in Table 1. A selftiming function, however, lets  
the user software detect when the next byte can be written. If the user code contains instructions  
that write the EEPROM, some precautions must be taken. In heavily filtered power supplies, VCC  
is likely to rise or fall slowly on Power-up/down. This causes the device for some period of time  
to run at a voltage lower than specified as minimum for the clock frequency used. See “Prevent-  
ing EEPROM Corruption” on page 24 for details on how to avoid problems in these situations.  
In order to prevent unintentional EEPROM writes, a specific write procedure must be followed.  
Refer to the description of the EEPROM Control Register for details on this.  
When the EEPROM is read, the CPU is halted for four clock cycles before the next instruction is  
executed. When the EEPROM is written, the CPU is halted for two clock cycles before the next  
instruction is executed.  
The EEPROM Address  
Register – EEARH and  
EEARL  
Bit  
15  
14  
13  
12  
11  
10  
9
8
EEAR8  
EEAR0  
0
EEARH  
EEARL  
EEAR7  
EEAR6  
EEAR5  
EEAR4  
EEAR3  
EEAR2  
EEAR1  
7
R
6
R
5
R
4
R
3
R
2
R
1
R
Read/Write  
Initial Value  
R/W  
R/W  
X
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
X
X
X
X
X
X
X
X
• Bits 15..9 – Res: Reserved Bits  
These bits are reserved bits in the ATmega162 and will always read as zero.  
• Bits 8..0 – EEAR8..0: EEPROM Address  
The EEPROM Address Registers – EEARH and EEARL specify the EEPROM address in the  
512 bytes EEPROM space. The EEPROM data bytes are addressed linearly between 0 and  
511. The initial value of EEAR is undefined. A proper value must be written before the EEPROM  
may be accessed.  
20  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The EEPROM Data  
Register – EEDR  
Bit  
7
6
5
4
3
2
1
0
MSB  
R/W  
0
LSB  
R/W  
0
EEDR  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
• Bits 7..0 – EEDR7.0: EEPROM Data  
For the EEPROM write operation, the EEDR Register contains the data to be written to the  
EEPROM in the address given by the EEAR Register. For the EEPROM read operation, the  
EEDR contains the data read out from the EEPROM at the address given by EEAR.  
The EEPROM Control  
Register – EECR  
Bit  
7
6
5
4
3
EERIE  
R/W  
0
2
EEMWE  
R/W  
0
1
EEWE  
R/W  
X
0
EERE  
R/W  
0
EECR  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
• Bits 7..4 – Res: Reserved Bits  
These bits are reserved bits in the ATmega162 and will always read as zero.  
• Bit 3 – EERIE: EEPROM Ready Interrupt Enable  
Writing EERIE to one enables the EEPROM Ready Interrupt if the I bit in SREG is set. Writing  
EERIE to zero disables the interrupt. The EEPROM Ready interrupt generates a constant inter-  
rupt when EEWE is cleared.  
• Bit 2 – EEMWE: EEPROM Master Write Enable  
The EEMWE bit determines whether setting EEWE to one causes the EEPROM to be written.  
When EEMWE is set, setting EEWE within four clock cycles will write data to the EEPROM at  
the selected address. If EEMWE is zero, setting EEWE will have no effect. When EEMWE has  
been written to one by software, hardware clears the bit to zero after four clock cycles. See the  
description of the EEWE bit for an EEPROM write procedure.  
• Bit 1 – EEWE: EEPROM Write Enable  
The EEPROM Write Enable signal EEWE is the write strobe to the EEPROM. When address  
and data are correctly set up, the EEWE bit must be written to one to write the value into the  
EEPROM. The EEMWE bit must be written to one before a logical one is written to EEWE, oth-  
erwise no EEPROM write takes place. The following procedure should be followed when writing  
the EEPROM (the order of steps 3 and 4 is not essential):  
1. Wait until EEWE becomes zero.  
2. Wait until SPMEN in SPMCR becomes zero.  
3. Write new EEPROM address to EEAR (optional).  
4. Write new EEPROM data to EEDR (optional).  
5. Write a logical one to the EEMWE bit while writing a zero to EEWE in EECR.  
6. Within four clock cycles after setting EEMWE, write a logical one to EEWE.  
The EEPROM can not be programmed during a CPU write to the Flash memory. The software  
must check that the Flash programming is completed before initiating a new EEPROM write.  
Step 2 is only relevant if the software contains a Boot Loader allowing the CPU to program the  
Flash. If the Flash is never being updated by the CPU, step 2 can be omitted. See “Boot Loader  
Support – Read-While-Write Self-programming” on page 217 for details about boot  
programming.  
21  
2513K–AVR–07/09  
Caution: An interrupt between step 5 and step 6 will make the write cycle fail, since the  
EEPROM Master Write Enable will time-out. If an interrupt routine accessing the EEPROM is  
interrupting another EEPROM access, the EEAR or EEDR Register will be modified, causing the  
interrupted EEPROM access to fail. It is recommended to have the Global Interrupt Flag cleared  
during all the steps to avoid these problems.  
When the write access time has elapsed, the EEWE bit is cleared by hardware. The user soft-  
ware can poll this bit and wait for a zero before writing the next byte. When EEWE has been set,  
the CPU is halted for two cycles before the next instruction is executed.  
• Bit 0 – EERE: EEPROM Read Enable  
The EEPROM Read Enable Signal EERE is the read strobe to the EEPROM. When the correct  
address is set up in the EEAR Register, the EERE bit must be written to a logic one to trigger the  
EEPROM read. The EEPROM read access takes one instruction, and the requested data is  
available immediately. When the EEPROM is read, the CPU is halted for four cycles before the  
next instruction is executed.  
The user should poll the EEWE bit before starting the read operation. If a write operation is in  
progress, it is neither possible to read the EEPROM, nor to change the EEAR Register.  
The calibrated Oscillator is used to time the EEPROM accesses. Table 1 lists the typical pro-  
gramming time for EEPROM access from the CPU.  
Table 1. EEPROM Programming Time  
Number of Calibrated RC  
Symbol  
Oscillator Cycles(1)  
Typ Programming Time  
EEPROM write (from CPU)  
8448  
8.5 ms  
Note:  
1. Uses 1 MHz clock, independent of CKSEL Fuse settings  
22  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The following code examples show one assembly and one C function for writing to the  
EEPROM. The examples assume that interrupts are controlled (e.g., by disabling interrupts  
globally) so that no interrupts will occur during execution of these functions. The examples also  
assume that no Flash Boot Loader is present in the software. If such code is present, the  
EEPROM write function must also wait for any ongoing SPM command to finish.  
Assembly Code Example  
EEPROM_write:  
; Wait for completion of?previous write  
sbic EECR,EEWE  
rjmp EEPROM_write  
; Set up address (r18:r1?) in address register  
out EEARH, r18  
out EEARL, r17  
; Write data (r16) to da?a register  
out EEDR,r16  
; Write logical one to E?MWE  
sbi EECR,EEMWE  
; Start eeprom write by ?etting EEWE  
sbi EECR,EEWE  
ret  
C Code Example  
void EEPROM_write(unsigned int uiAddress, unsigned char ucData)  
{
/* Wait for complet?on of previous write */  
while(EECR & (1<<EEWE))  
;
/* Set up address and da?a registers */  
EEAR = uiAddress;  
EEDR = ucData;  
/* Write logical on? to EEMWE */  
EECR |= (1<<EEMWE);  
/* Start eeprom write by?setting EEWE */  
EECR |= (1<<EEWE);  
}
23  
2513K–AVR–07/09  
The next code examples show assembly and C functions for reading the EEPROM. The exam-  
ples assume that interrupts are controlled so that no interrupts will occur during execution of  
these functions.  
Assembly Code Example  
EEPROM_read:  
; Wait for completion of?previous write  
sbic EECR,EEWE  
rjmp EEPROM_read  
; Set up address (r18:r1?) in address register  
out EEARH, r18  
out EEARL, r17  
; Start eeprom read by w?iting EERE  
sbi EECR,EERE  
; Read data from data re?ister  
in  
r16,EEDR  
ret  
C Code Example  
unsigned char EEPROM_read(unsigned int uiAddress)  
{
/* Wait for completion o? previous write */  
while(EECR & (1<<EEWE))  
;
/* Set up address regist?r */  
EEAR = uiAddress;  
/* Start eeprom rea? by writing EERE */  
EECR |= (1<<EERE);  
/* Return data from data?register */  
return EEDR;  
}
EEPROM Write During When entering Power-down sleep mode while an EEPROM write operation is active, the  
Power-down Sleep  
Mode  
EEPROM write operation will continue, and will complete before the write access time has  
passed. However, when the write operation is complete, the Oscillator continues running, and as  
a consequence, the device does not enter Power-down entirely. It is therefore recommended to  
verify that the EEPROM write operation is completed before entering Power-down.  
Preventing EEPROM  
Corruption  
During periods of low VCC, the EEPROM data can be corrupted because the supply voltage is  
too low for the CPU and the EEPROM to operate properly. These issues are the same as for  
board level systems using EEPROM, and the same design solutions should be applied.  
An EEPROM data corruption can be caused by two situations when the voltage is too low. First,  
a regular write sequence to the EEPROM requires a minimum voltage to operate correctly. Sec-  
ondly, the CPU itself can execute instructions incorrectly, if the supply voltage is too low.  
EEPROM data corruption can easily be avoided by following this design recommendation:  
Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can  
be done by enabling the internal Brown-out Detector (BOD). If the detection level of the internal  
BOD does not match the needed detection level, an external low VCC Reset Protection circuit  
can be used. If a Reset occurs while a write operation is in progress, the write operation will be  
completed provided that the power supply voltage is sufficient.  
24  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
I/O Memory  
The I/O space definition of the ATmega162 is shown in “Register Summary” on page 304.  
All ATmega162 I/Os and peripherals are placed in the I/O space. All I/O locations may be  
accessed by the LD/LDS/LDD and ST/STS/STD instructions, transferring data between the 32  
general purpose working registers and the I/O space. I/O Registers within the address range  
0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the  
value of single bits can be checked by using the SBIS and SBIC instructions. Refer to the  
instruction set section for more details. When using the I/O specific commands IN and OUT, the  
I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using  
LD and ST instructions, 0x20 must be added to these addresses. The ATmega162 is a complex  
microcontroller with more peripheral units than can be supported within the 64 location reserved  
in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 - 0xFF in  
SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. The Extended I/O  
space is replaced with SRAM locations when the ATmega162 is in the ATmega161 compatibility  
mode.  
For compatibility with future devices, reserved bits should be written to zero if accessed.  
Reserved I/O memory addresses should never be written.  
Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI  
instructions will operate on all bits in the I/O Register, writing a one back into any flag read as  
set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only.  
The I/O and peripherals control registers are explained in later sections.  
25  
2513K–AVR–07/09  
External Memory  
Interface  
With all the features the External Memory Interface provides, it is well suited to operate as an  
interface to memory devices such as external SRAM and FLASH, and peripherals such as LCD-  
display, A/D, and D/A. The main features are:  
Four Different Wait-state Settings (Including No Wait-state)  
Independent Wait-state Setting for Different External Memory Sectors (Configurable Sector Size)  
The Number of Bits Dedicated to Address High Byte is Selectable  
Bus Keepers on Data Lines to Minimize Current Consumption (Optional)  
Overview  
When the eXternal MEMory (XMEM) is enabled, address space outside the internal SRAM  
becomes available using the dedicated external memory pins (see Figure 1 on page 2, Table 29  
on page 70, Table 35 on page 75, and Table 41 on page 81). The memory configuration is  
shown in Figure 11.  
Figure 11. External Memory with Sector Select  
0x0000  
Internal Memory  
0x04FF/0x045F(1)  
0x0500/0x0460(1)  
Lower Sector  
SRW01  
SRW00  
SRL[2..0]  
External Memory  
Upper Sector  
(0-64K x 8)  
SRW11  
SRW10  
0xFFFF  
Note:  
1. Address depends on the ATmega161 compatibility Fuse. See “SRAM Data Memory” on page  
18 and Figure 9 on page 19 for details.  
Using the External  
Memory Interface  
The interface consists of:  
AD7:0: Multiplexed low-order address bus and data bus  
A15:8: High-order address bus (configurable number of bits)  
ALE: Address latch enable  
RD: Read strobe.  
WR: Write strobe.  
26  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The control bits for the External Memory Interface are located in three registers, the MCU Con-  
trol Register – MCUCR, the Extended MCU Control Register – EMCUCR, and the Special  
Function IO Register – SFIOR.  
When the XMEM interface is enabled, it will override the settings in the Data Direction registers  
corresponding to the ports dedicated to the interface. For details about this port override, see the  
alternate functions in section “I/O-Ports” on page 63. The XMEM interface will autodetect  
whether an access is internal or external. If the access is external, the XMEM interface will out-  
put address, data, and the control signals on the ports according to Figure 13 (this figure shows  
the wave forms without wait-states). When ALE goes from high to low, there is a valid address  
on AD7:0. ALE is low during a data transfer. When the XMEM interface is enabled, also an inter-  
nal access will cause activity on address-, data- and ALE ports, but the RD and WR strobes will  
not toggle during internal access. When the External Memory Interface is disabled, the normal  
pin and data direction settings are used. Note that when the XMEM interface is disabled, the  
address space above the internal SRAM boundary is not mapped into the internal SRAM. Figure  
12 illustrates how to connect an external SRAM to the AVR using an octal latch (typically  
“74x573” or equivalent) which is transparent when G is high.  
Address Latch  
Requirements  
Due to the high-speed operation of the XRAM interface, the address latch must be selected with  
care for system frequencies above 8 MHz @ 4V and 4 MHz @ 2.7V. When operating at condi-  
tions above these frequencies, the typical old style 74HC series latch becomes inadequate. The  
external memory interface is designed in compliance to the 74AHC series latch. However, most  
latches can be used as long they comply with the main timing parameters. The main parameters  
for the address latch are:  
D to Q propagation delay (tpd).  
Data setup time before G low (tsu).  
Data (address) hold time after G low (th).  
The external memory interface is designed to guaranty minimum address hold time after G is  
asserted low of th = 5 ns (refer to tLAXX_LD/tLLAXX_ST in Table 114 to Table 121 on page 272). The  
D to Q propagation delay (tpd) must be taken into consideration when calculating the access time  
requirement of the external component. The data setup time before G low (tsu) must not exceed  
address valid to ALE low (tAVLLC) minus PCB wiring delay (dependent on the capacitive load).  
Figure 12. External SRAM Connected to the AVR  
D[7:0]  
AD7:0  
ALE  
D
G
Q
A[7:0]  
SRAM  
A[15:8]  
AVR  
A15:8  
RD  
RD  
WR  
WR  
27  
2513K–AVR–07/09  
Pull-up and Bus  
Keeper  
The pull-up resistors on the AD7:0 ports may be activated if the corresponding Port register is  
written to one. To reduce power consumption in sleep mode, it is recommended to disable the  
pull-ups by writing the Port register to zero before entering sleep.  
The XMEM interface also provides a bus keeper on the AD7:0 lines. The Bus Keeper can be dis-  
abled and enabled in software as described in “Special Function IO Register – SFIOR” on page  
32. When enabled, the Bus Keeper will keep the previous value on the AD7:0 bus while these  
lines are tri-stated by the XMEM interface.  
Timing  
External memory devices have various timing requirements. To meet these requirements, the  
ATmega162 XMEM interface provides four different wait-states as shown in Table 3. It is impor-  
tant to consider the timing specification of the external memory device before selecting the wait-  
state. The most important parameters are the access time for the external memory in conjunc-  
tion with the set-up requirement of the ATmega162. The access time for the external memory is  
defined to be the time from receiving the chip select/address until the data of this address actu-  
ally is driven on the bus. The access time cannot exceed the time from the ALE pulse is asserted  
low until data must be stable during a read sequence (tLLRL+ tRLRH - tDVRH in Table 114 to Table  
121 on page 272). The different wait-states are set up in software. As an additional feature, it is  
possible to divide the external memory space in two sectors with individual wait-state settings.  
This makes it possible to connect two different memory devices with different timing require-  
ments to the same XMEM interface. For XMEM interface timing details, please refer to Figure  
118 to Figure 121, and Table 114 to Table 121.  
Note that the XMEM interface is asynchronous and that the waveforms in the figures below are  
related to the internal system clock. The skew between the internal and external clock (XTAL1)  
is not guaranteed (it varies between devices, temperature, and supply voltage). Consequently,  
the XMEM interface is not suited for synchronous operation.  
Figure 13. External Data Memory Cycles without Wait-state  
(SRWn1 = 0 and SRWn0 =0)(1)  
T1  
T2  
T3  
T4  
System Clock (CLKCPU  
)
ALE  
A15:8 Prev. addr.  
DA7:0 Prev. data  
WR  
Address  
Data  
Address  
Address  
XX  
DA7:0 (XMBK = 0)  
Data  
Data  
DA7:0 (XMBK = 1) Prev. data  
RD  
Address  
Note:  
1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper sector) or  
SRW00 (lower sector).  
The ALE pulse in period T4 is only present if the next instruction accesses the RAM (internal  
or external).  
28  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 14. External Data Memory Cycles with SRWn1 = 0 and SRWn0 = 1(1)  
T1  
T2  
T3  
T4  
T5  
System Clock (CLKCPU  
)
ALE  
A15:8 Prev. addr.  
DA7:0 Prev. data  
WR  
Address  
Data  
Address  
Address  
XX  
DA7:0 (XMBK = 0)  
Data  
Data  
DA7:0 (XMBK = 1) Prev. data  
RD  
Address  
Note:  
1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper sector) or  
SRW00 (lower sector)  
The ALE pulse in period T5 is only present if the next instruction accesses the RAM (internal  
or external).  
Figure 15. External Data Memory Cycles with SRWn1 = 1 and SRWn0 = 0(1)  
T1  
T2  
T3  
T4  
T5  
T6  
System Clock (CLKCPU  
)
ALE  
A15:8 Prev. addr.  
DA7:0 Prev. data  
WR  
Address  
Data  
Address  
Address  
XX  
DA7:0 (XMBK = 0)  
Data  
Data  
DA7:0 (XMBK = 1) Prev. data  
RD  
Address  
Note:  
1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper sector) or  
SRW00 (lower sector).  
The ALE pulse in period T6 is only present if the next instruction accesses the RAM (internal  
or external).  
29  
2513K–AVR–07/09  
Figure 16. External Data Memory Cycles with SRWn1 = 1 and SRWn0 = 1(1)  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
System Clock (CLKCPU  
)
ALE  
A15:8 Prev. addr.  
DA7:0 Prev. data  
WR  
Address  
Data  
Address  
Address  
XX  
DA7:0 (XMBK = 0)  
Data  
Data  
DA7:0 (XMBK = 1) Prev. data  
RD  
Address  
Note:  
1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper sector) or  
SRW00 (lower sector).  
The ALE pulse in period T7 is only present if the next instruction accesses the RAM (internal  
or external).  
XMEM Register  
Description  
MCU Control Register  
– MCUCR  
Bit  
7
6
SRW10  
R/W  
0
5
SE  
R/W  
0
4
3
ISC11  
R/W  
0
2
ISC10  
R/W  
0
1
ISC01  
R/W  
0
0
ISC00  
R/W  
0
SRE  
R/W  
0
SM1  
R/W  
0
MCUCR  
Read/Write  
Initial Value  
• Bit 7 – SRE: External SRAM/XMEM Enable  
Writing SRE to one enables the External Memory Interface.The pin functions AD7:0, A15:8,  
ALE, WR, and RD are activated as the alternate pin functions. The SRE bit overrides any pin  
direction settings in the respective Data Direction Registers. Writing SRE to zero, disables the  
External Memory Interface and the normal pin and data direction settings are used.  
• Bit 6 – SRW10: Wait State Select Bit  
For a detailed description, see common description for the SRWn bits below (EMCUCR  
description).  
Extended MCU  
Control Register –  
EMCUCR  
Bit  
7
6
SRL2  
R/W  
0
5
SRL1  
R/W  
0
4
SRL0  
R/W  
0
3
SRW01  
R/W  
0
2
SRW00  
R/W  
0
1
SRW11  
R/W  
0
0
SM0  
R/W  
0
ISC2  
R/W  
0
EMCUCR  
Read/Write  
Initial Value  
• Bit 6..4 – SRL2, SRL1, SRL0: Wait State Sector Limit  
It is possible to configure different wait-states for different external memory addresses. The  
external memory address space can be divided in two sectors that have separate wait-state bits.  
The SRL2, SRL1, and SRL0 bits select the splitting of these sectors, see Table 2 and Figure 11.  
By default, the SRL2, SRL1, and SRL0 bits are set to zero and the entire external memory  
address space is treated as one sector. When the entire SRAM address space is configured as  
one sector, the wait-states are configured by the SRW11 and SRW10 bits.  
30  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 2. Sector Limits with Different Settings of SRL2..0  
SRL2  
SRL1  
SRL0  
Sector Limits  
Lower sector = N/A  
0
0
0
Upper sector = 0x1100 - 0xFFFF  
Lower sector = 0x1100 - 0x1FFF  
Upper sector = 0x2000 - 0xFFFF  
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Lower sector = 0x1100 - 0x3FFF  
Upper sector = 0x4000 - 0xFFFF  
Lower sector = 0x1100 - 0x5FFF  
Upper sector = 0x6000 - 0xFFFF  
Lower sector = 0x1100 - 0x7FFF  
Upper sector = 0x8000 - 0xFFFF  
Lower sector = 0x1100 - 0x9FFF  
Upper sector = 0xA000 - 0xFFFF  
Lower sector = 0x1100 - 0xBFFF  
Upper sector = 0xC000 - 0xFFFF  
Lower sector = 0x1100 - 0xDFFF  
Upper sector = 0xE000 - 0xFFFF  
• Bit 1 and Bit 6 MCUCR – SRW11, SRW10: Wait-state Select Bits for Upper Sector  
The SRW11 and SRW10 bits control the number of wait-states for the upper sector of the exter-  
nal memory address space, see Table 3.  
• Bit 3..2 – SRW01, SRW00: Wait-state Select Bits for Lower Sector  
The SRW01 and SRW00 bits control the number of wait-states for the lower sector of the exter-  
nal memory address space, see Table 3.  
Table 3. Wait-states(1)  
SRWn1 SRWn0  
Wait-states  
0
0
1
0
1
0
No wait-states  
Wait one cycle during read/write strobe  
Wait two cycles during read/write strobe  
Wait two cycles during read/write and wait one cycle before driving out  
new address  
1
1
Note:  
1. n = 0 or 1 (lower/upper sector).  
For further details of the timing and wait-states of the External Memory Interface, see Figure  
13 to Figure 16 how the setting of the SRW bits affects the timing.  
31  
2513K–AVR–07/09  
Special Function IO  
Register – SFIOR  
Bit  
7
6
XMBK  
R/W  
0
5
XMM2  
R/W  
0
4
XMM1  
R/W  
0
3
XMM0  
R/W  
0
2
1
PSR2  
R/W  
0
0
PSR310  
R/W  
0
TSM  
R/W  
0
PUD  
R/W  
0
SFIOR  
Read/Write  
Initial Value  
• Bit 6 – XMBK: External Memory Bus Keeper Enable  
Writing XMBK to one enables the Bus Keeper on the AD7:0 lines. When the Bus Keeper is  
enabled, AD7:0 will keep the last driven value on the lines even if the XMEM interface has tri-  
stated the lines. Writing XMBK to zero disables the Bus Keeper. XMBK is not qualified with SRE,  
so even if the XMEM interface is disabled, the bus keepers are still activated as long as XMBK is  
one.  
• Bit 6..3 – XMM2, XMM1, XMM0: External Memory High Mask  
When the External Memory is enabled, all Port C pins are used for the high address byte by  
default. If the full 60KB address space is not required to access the external memory, some, or  
all, Port C pins can be released for normal Port Pin function as described in Table 4. As  
described in “Using all 64KB Locations of External Memory” on page 34, it is possible to use the  
XMMn bits to access all 64KB locations of the external memory.  
Table 4. Port C Pins Released as Normal Port Pins when the External Memory is Enabled  
XMM2 XMM1 XMM0 # Bits for External Memory Address  
Released Port Pins  
None  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8 (Full 60 KB space)  
7
PC7  
6
PC7 - PC6  
PC7 - PC5  
PC7 - PC4  
PC7 - PC3  
PC7 - PC2  
Full Port C  
5
4
3
2
No Address high bits  
Using all Locations of Since the external memory is mapped after the internal memory as shown in Figure 11, the  
External Memory  
Smaller than 64 KB  
external memory is not addressed when addressing the first 1,280 bytes of data space. It may  
appear that the first 1,280 bytes of the external memory are inaccessible (external memory  
addresses 0x0000 to 0x04FF). However, when connecting an external memory smaller than 64  
KB, for example 32 KB, these locations are easily accessed simply by addressing from address  
0x8000 to 0x84FF. Since the External Memory Address bit A15 is not connected to the external  
memory, addresses 0x8000 to 0x84FF will appear as addresses 0x0000 to 0x04FF for the exter-  
nal memory. Addressing above address 0x84FF is not recommended, since this will address an  
external memory location that is already accessed by another (lower) address. To the Applica-  
tion software, the external 32 KB memory will appear as one linear 32 KB address space from  
0x0500 to 0x84FF. This is illustrated in Figure 17. Memory configuration B refers to the  
ATmega161 compatibility mode, configuration A to the non-compatible mode.  
32  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
When the device is set in ATmega161 compatibility mode, the internal address space is 1,120  
bytes. This implies that the first 1,120 bytes of the external memory can be accessed at  
addresses 0x8000 to 0x845F. To the Application software, the external 32 KB memory will  
appear as one linear 32 KB address space from 0x0460 to 0x845F.  
Figure 17. Address Map with 32 KB External Memory  
Memory Configuration B  
Memory Configuration A  
AVR Memory Map  
External 32K SRAM  
AVR Memory Map  
External 32K SRAM  
0x0000  
0x0000  
0x0000  
0x0000  
Internal Memory  
Internal Memory  
0x045F  
0x0460  
0x045F  
0x0460  
0x04FF  
0x0500  
0x04FF  
0x0500  
External  
Memory  
External  
Memory  
0x7FFF  
0x8000  
0x7FFF  
0x8000  
0x7FFF  
0x7FFF  
0x84FF  
0x8500  
0x845F  
0x8460  
(Unused)  
(Unused)  
0xFFFF  
0xFFFF  
33  
2513K–AVR–07/09  
Using all 64KB  
Locations of External  
Memory  
Since the external memory is mapped after the internal memory as shown in Figure 11, only  
64,256 Bytes of external memory are available by default (address space 0x0000 to 0x04FF is  
reserved for internal memory). However, it is possible to take advantage of the entire external  
memory by masking the higher address bits to zero. This can be done by using the XMMn bits  
and control by software the most significant bits of the address. By setting Port C to output 0x00,  
and releasing the most significant bits for normal Port Pin operation, the Memory Interface will  
address 0x0000 - 0x1FFF. See code example below.  
Assembly Code Example(1)  
; OFFSET is defined to 0?2000 to ensure  
; external memory access  
; Configure Port C (addr?ss high byte) to  
; output 0x00 when the p?ns are released  
; for normal Port Pin op?ration  
ldi  
out  
ldi  
out  
r16, 0xFF  
DDRC, r16  
r16, 0x00  
PORTC, r16  
; release PC7:5  
ldi  
out  
r16, (1<<XMM1)|(1<<XMM0)  
SFIOR, r16  
; write 0xAA to address ?x0001 of external  
; memory  
ldi  
sts  
r16, 0xaa  
0x0001+OFFSET, r16  
; re-enable PC7:5 for ex?ernal memory  
ldi  
out  
r16, (0<<XMM1)|(0<<XMM0)  
SFIOR, r16  
; store 0x55 to address ?OFFSET + 1) of  
; external memory  
ldi  
sts  
r16, 0x55  
0x0001+OFFSET, r16  
C Code Example(1)  
#define OFFSET 0x2000  
void XRAM_example(void)  
{
unsigned char *p = (unsigned char *) (OFFSET + 1);  
DDRC = 0xFF;  
PORTC = 0x00;  
SFIOR = (1<<XMM1) | (1<<XMM0);  
*p = 0xaa;  
SFIOR = 0x00;  
*p = 0x55;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
Care must be exercised using this option as most of the memory is masked away.  
34  
ATmega162/V  
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ATmega162/V  
System Clock  
and Clock  
Options  
Clock Systems  
and their  
Distribution  
Figure 18 presents the principal clock systems in the AVR and their distribution. All of the clocks  
need not be active at a given time. In order to reduce power consumption, the clocks to modules  
not being used can be halted by using different sleep modes, as described in “Power Manage-  
ment and Sleep Modes” on page 43. The clock systems are detailed below.  
Figure 18. Clock Distribution  
Asynchronous  
Timer/Counter  
General I/O  
Modules  
Flash and  
EEPROM  
CPU Core  
RAM  
clkI/O  
clkCPU  
AVR Clock  
Control Unit  
clkASY  
clkFLASH  
Reset Logic  
Watchdog Timer  
Source clock  
Watchdog clock  
System Clock  
Prescaler  
Watchdog  
Oscillator  
Clock  
Multiplexer  
Timer/Counter  
Oscillator  
Crystal  
Oscillator  
Low-frequency  
Crystal Oscillator  
Calibrated RC  
Oscillator  
External Clock  
CPU clock – clkCPU  
I/O clock – clkI/O  
The CPU clock is routed to parts of the system concerned with operation of the AVR core.  
Examples of such modules are the General Purpose Register File, the Status Register and the  
data memory holding the Stack Pointer. Halting the CPU clock inhibits the core from performing  
general operations and calculations.  
The I/O clock is used by the majority of the I/O modules, like Timer/Counters, SPI, and USART.  
The I/O clock is also used by the External Interrupt module, but note that some external inter-  
rupts are detected by asynchronous logic, allowing such interrupts to be detected even if the I/O  
clock is halted.  
Flash clock – clkFLASH The Flash clock controls operation of the Flash interface. The Flash clock is usually active simul-  
taneously with the CPU clock.  
Asynchronous Timer  
clock – clkASY  
The Asynchronous Timer clock allows the Asynchronous Timer/Counter to be clocked directly  
from an external 32 kHz clock crystal. The dedicated clock domain allows using this  
Timer/Counter as a realtime counter even when the device is in sleep mode.  
35  
2513K–AVR–07/09  
Clock Sources  
The device has the following clock source options, selectable by Flash Fuse bits as shown  
below. The clock from the selected source is input to the AVR clock generator, and routed to the  
appropriate modules.  
Table 5. Device Clocking Options Select  
Device Clocking Option  
External Crystal/Ceramic Resonator  
External Low-frequency Crystal  
Calibrated Internal RC Oscillator  
External Clock  
CKSEL3..0  
1111 - 1000  
0111 - 0100  
0010  
0000  
Reserved  
0011, 0001  
Note:  
For all fuses “1” means unprogrammed while “0” means programmed.  
The various choices for each clocking option is given in the following sections. When the CPU  
wakes up from Power-down or Power-save, the selected clock source is used to time the start-  
up, ensuring stable Oscillator operation before instruction execution starts. When the CPU starts  
from Reset, there is an additional delay allowing the power to reach a stable level before com-  
mencing normal operation. The Watchdog Oscillator is used for timing this realtime part of the  
start-up time. The number of WDT Oscillator cycles used for each Time-out is shown in Table 6.  
The frequency of the Watchdog Oscillator is voltage dependent as shown in “ATmega162 Typi-  
cal Characteristics” on page 275.  
Table 6. Number of Watchdog Oscillator Cycles  
Typ Time-out (VCC = 5.0V)  
Typ Time-out (VCC = 3.0V)  
Number of Cycles  
4K (4,096)  
4.1 ms  
65 ms  
4.3 ms  
69 ms  
64K (65,536)  
Default Clock  
Source  
The device is shipped with CKSEL = “0010”, SUT = “10” and CKDIV8 programmed. The default  
clock source setting is therefore the Internal RC Oscillator with longest startup time and an initial  
system clock prescaling of 8. This default setting ensures that all users can make their desired  
clock source setting using an In-System or Parallel programmer.  
Crystal Oscillator  
XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can be con-  
figured for use as an On-chip Oscillator, as shown in Figure 19. Either a quartz crystal or a  
ceramic resonator may be used.  
C1 and C2 should always be equal for both crystals and resonators. The optimal value of the  
capacitors depends on the crystal or resonator in use, the amount of stray capacitance, and the  
electromagnetic noise of the environment. Some initial guidelines for choosing capacitors for  
use with crystals are given in Table 7. For ceramic resonators, the capacitor values given by the  
manufacturer should be used.  
36  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 19. Crystal Oscillator Connections  
C2  
XTAL2  
XTAL1  
GND  
C1  
The Oscillator can operate in four different modes, each optimized for a specific frequency  
range. The operating mode is selected by the fuses CKSEL3:1 as shown in Table 7.  
Table 7. Crystal Oscillator Operating Modes  
Frequency Range  
(MHz)  
Recommended Range for Capacitors C1 and  
C2 for Use with Crystals (pF)  
CKSEL3:1  
100(1)  
101  
0.4 - 0.9  
0.9 - 3.0  
3.0 - 8.0  
8.0 -  
12 - 22  
12 - 22  
12 - 22  
110  
111  
Note:  
1. This option should not be used with crystals, only with ceramic resonators.  
The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in Table  
8.  
Table 8. Start-up Times for the Crystal Oscillator Clock Selection  
Start-up Time from  
Power-down and  
Power-save  
Additional Delay from  
Reset (VCC = 5.0V)  
Recommended  
Usage  
CKSEL0 SUT1:0  
0
0
0
0
1
1
1
1
00  
01  
10  
11  
00  
01  
10  
11  
258 CK(1)  
258 CK(1)  
1K CK(2)  
1K CK(2)  
1K CK(2)  
16K CK  
16K CK  
16K CK  
4.1 ms  
65 ms  
Ceramic resonator,  
fast rising power  
Ceramic resonator,  
slowly rising power  
Ceramic resonator,  
BOD enabled  
4.1 ms  
65 ms  
Ceramic resonator,  
fast rising power  
Ceramic resonator,  
slowly rising power  
Crystal Oscillator,  
BOD enabled  
4.1 ms  
65 ms  
Crystal Oscillator,  
fast rising power  
Crystal Oscillator,  
slowly rising power  
37  
2513K–AVR–07/09  
Notes: 1. These options should only be used when not operating close to the maximum frequency of the  
device, and only if frequency stability at start-up is not important for the application. These  
options are not suitable for crystals.  
2. These options are intended for use with ceramic resonators and will ensure frequency stability  
at start-up. They can also be used with crystals when not operating close to the maximum fre-  
quency of the device, and if frequency stability at start-up is not important for the application.  
Low-frequency  
Crystal Oscillator  
To use a 32.768 kHz watch crystal as the clock source for the device, the Low-frequency Crystal  
Oscillator must be selected by setting the CKSEL Fuses to “0100”, “0101”, “0110” or “0111”. The  
crystal should be connected as shown in Figure 19. If CKSEL equals “0110” or “0111”, the inter-  
nal capacitors on XTAL1 and XTAL2 are enabled, thereby removing the need for external  
capacitors. The internal capacitors have a nominal value of 10 pF.  
When this Oscillator is selected, start-up times are determined by the SUT Fuses (real time-out  
from Reset) and CKSEL0 (number of clock cycles) as shown in Table 9 and Table 10.  
Table 9. Start-up Delay from Reset when Low-frequency Crystal Oscillator is Selected  
SUT1:0  
00  
Additional Delay from Reset (VCC = 5.0V)  
Recommended Usage  
0 ms  
4.1 ms  
65 ms  
Fast rising power or BOD enabled  
Fast rising power or BOD enabled  
Slowly rising power  
01  
10  
11  
Reserved  
Table 10. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection  
Start-up Time from  
Internal Capacitors  
Enabled?  
Power-down and  
Power-save  
CKSEL1:0  
00(1)  
Recommended Usage  
No  
No  
1K CK  
32K CK  
1K CK  
01  
Stable Frequency at start-up  
10(1)  
Yes  
Yes  
11  
32K CK  
Stable Frequency at start-up  
Note:  
1. These options should only be used if frequency stability at start-up is not important for the  
application.  
Calibrated Internal The calibrated internal RC Oscillator provides a fixed 8.0 MHz clock. The frequency is nominal  
value at 3V and 25°C. If 8.0 MHz frequency exceed the specification of the device (depends on  
RC Oscillator  
V
CC), the CKDIV8 Fuse must be programmed in order to divide the internal frequency by 8 dur-  
ing start-up. See “System Clock Prescaler” on page 41 for more details. This clock may be  
selected as the system clock by programming the CKSEL Fuses as shown in Table 11. If  
selected, it will operate with no external components. During Reset, hardware loads the calibra-  
tion byte into the OSCCAL Register and thereby automatically calibrates the RC Oscillator. At  
3V and 25°C, this calibration gives a frequency within 10% of the nominal frequency. Using cal-  
ibration methods as described in application notes available at www.atmel.com/avr it is possible  
to achieve 2% accuracy at any given VCC and Temperature. When this Oscillator is used as the  
chip clock, the Watchdog Oscillator will still be used for the Watchdog Timer and for the Reset  
38  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Time-out. For more information on the pre-programmed calibration value, see the section “Cali-  
bration Byte” on page 234.  
Table 11. Internal Calibrated RC Oscillator Operating Modes  
CKSEL3:0  
Nominal Frequency  
0010(1)  
8.0 MHz  
Note:  
1. The device is shipped with this option selected.  
When this Oscillator is selected, start-up times are determined by the SUT Fuses as shown in  
Table 12. XTAL1 and XTAL2 should be left unconnected (NC).  
Table 12. Start-up Times for the Internal Calibrated RC Oscillator Clock Selection  
Start-up Time from Power-  
down and Power-save  
Additional Delay from  
Reset (VCC = 5.0V)  
SUT1:0  
00  
Recommended Usage  
BOD enabled  
6 CK  
6 CK  
6 CK  
4.1 ms  
01  
Fast rising power  
Slowly rising power  
10(1)  
65 ms  
11  
Reserved  
Note:  
1. The device is shipped with this option selected.  
Oscillator Calibration  
Register – OSCCAL  
Bit  
7
6
5
4
3
2
1
0
CAL6  
R/W  
CAL5  
R/W  
CAL4  
R/W  
CAL3  
R/W  
CAL2  
R/W  
CAL1  
R/W  
CAL0  
R/W  
OSCCAL  
Read/Write  
Initial Value  
R
0
Device Specific Calibration Value  
• Bit 7 – Res: Reserved Bit  
This bit is reserved bit in the ATmega162, and will always read as zero.  
• Bits 6..0 – CAL6..0: Oscillator Calibration Value  
Writing the calibration byte to this address will trim the Internal Oscillator to remove process vari-  
ations from the Oscillator frequency. This is done automatically during Chip Reset. When  
OSCCAL is zero, the lowest available frequency is chosen. Writing non-zero values to this regis-  
ter will increase the frequency of the Internal Oscillator. Writing 0x7F to the register gives the  
highest available frequency. The calibrated Oscillator is used to time EEPROM and Flash  
access. If EEPROM or Flash is written, do not calibrate to more than 10% above the nominal fre-  
quency. Otherwise, the EEPROM or Flash write may fail.  
39  
2513K–AVR–07/09  
Table 13. Internal RC Oscillator Frequency Range.  
Min Frequency in Percentage of  
Max Frequency in Percentage of  
Nominal Frequency  
OSCCAL Value  
0x00  
Nominal Frequency  
50%  
75%  
100%  
150%  
200%  
0x3F  
0x7F  
100%  
External Clock  
To drive the device from an external clock source, XTAL1 should be driven as shown in Figure  
20. To run the device on an external clock, the CKSEL Fuses must be programmed to “0000”.  
Figure 20. External Clock Drive Configuration  
EXTERNAL  
CLOCK  
SIGNAL  
When this clock source is selected, start-up times are determined by the SUT Fuses as shown in  
Table 14.  
Table 14. Start-up Times for the External Clock Selection  
Start-up Time from  
Power-down and  
Power-save  
Additional Delay from  
Reset (VCC = 5.0V)  
SUT1..0  
00  
Recommended Usage  
BOD enabled  
6 CK  
6 CK  
6 CK  
4.1 ms  
01  
Fast rising power  
Slowly rising power  
10  
65 ms  
11  
Reserved  
When applying an external clock, it is required to avoid sudden changes in the applied clock fre-  
quency to ensure stable operation of the MCU. A variation in frequency of more than 2% from  
one clock cycle to the next can lead to unpredictable behavior. It is required to ensure that the  
MCU is kept in reset during such changes in the clock frequency.  
Note that the System Clock Prescaler can be used to implement run-time changes of the internal  
clock frequency while still ensuring stable operation. Refer to “System Clock Prescaler” on page  
41 for details.  
Clock output  
buffer  
When the CKOUT Fuse is programmed, the system clock will be output on PortB 0. This mode is  
suitable when chip clock is used to drive other circuits on the system. The clock will be output  
also during Reset and the normal operation of PortB will be overridden when the fuse is pro-  
40  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
grammed. Any clock sources, including Internal RC Oscillator, can be selected when PortB 0  
serves as clock output.  
If the system clock prescaler is used, it is the divided system clock that is output when the  
CKOUT Fuse is programmed. See “System Clock Prescaler” on page 41. for a description of the  
system clock prescaler.  
Timer/Counter  
Oscillator  
For AVR microcontrollers with Timer/Counter Oscillator pins (TOSC1 and TOSC2), the crystal is  
connected directly between the pins. The Oscillator provides internal capacitors on TOSC1 and  
TOSC2, thereby removing the need for external capacitors. The internal capacitors have a nom-  
inal value of 10 pF. The Oscillator is optimized for use with a 32.768 kHz watch crystal. Applying  
an external clock source to TOSC1 is not recommended.  
System Clock  
Prescaler  
The ATmega162 system clock can be divided by setting the Clock Prescale Register – CLKPR.  
This feature can be used to decrease the system clock frequency and power consumption when  
the requirement for processing power is low. This can be used with all clock source options, and  
it will affect the clock frequency of the CPU and all synchronous peripherals. clkI/O, clkCPU, and  
clkFLASH are divided by a factor as shown in Table 15. Note that the clock frequency of clkASY  
(asynchronously Timer/Counter) only will be scaled if the Timer/Counter is clocked  
synchronously.  
When switching between prescaler settings, the System Clock Prescaler ensures that no  
glitches occur in the clock system and that no intermediate frequency is higher than neither the  
clock frequency corresponding to the previous setting, nor the clock frequency corresponding to  
the new setting.  
The ripple counter that implements the prescaler runs at the frequency of the undivided clock,  
which may be faster than the CPU’s clock frequency. Hence, it is not possible to determine the  
state of the prescaler – even if it were readable, and the exact time it takes to switch from one  
clock division to another cannot be exactly predicted.  
From the time the CLKPS values are written, it takes between T1 + T2 and T1 + 2*T2 before the  
new clock frequency is active. In this interval, 2 active clock edges are produced. Here, T1 is the  
previous clock period, and T2 is the period corresponding to the new prescaler setting.  
To avoid unintentional changes of clock frequency, a special write procedure must be followed  
to change the CLKPS bits:  
1. Write the Clock Prescaler Change Enable (CLKPCE) bit to one and all other bits in  
CLKPR to zero.  
2. Within four cycles, write the desired value to CLKPS while writing a zero to CLKPCE.  
Caution: An interrupt between step 1 and step 2 will make the timed sequence fail. It is recom-  
mended to have the Global Interrupt Flag cleared during these steps to avoid this problem.  
Clock Prescale  
Register – CLKPR  
Bit  
7
CLKPCE  
R/W  
0
6
5
4
3
2
1
0
CLKPS3  
R/W  
CLKPS2  
R/W  
CLKPS1  
R/W  
CLKPS0  
R/W  
CLKPR  
Read/Write  
Initial Value  
R
0
R
0
R
0
See Bit Description  
• Bit 7 – CLKPCE: Clock Prescaler Change Enable  
The CLKPCE bit must be written to logic one to enable change of the CLKPS bits. CLKPCE is  
cleared by hardware four cycles after it is written or when CLKPS is written. Setting the CLKPCE  
bit will disable interrupts, as explained in the CLKPS description below.  
41  
2513K–AVR–07/09  
• Bits 3..0 – CLKPS3..0: Clock Prescaler Select Bits 3 - 0  
These bits define the division factor between the selected clock source and the internal system  
clock. These bits can be written run-time to vary the clock frequency to suit the application  
requirements. As the divider divides the master clock input to the MCU, the speed of all synchro-  
nous peripherals is reduced when a division factor is used. The division factors are given in  
Table 15.  
The CKDIV8 Fuse determines the initial value of the CLKPS bits. If CKDIV8 is unprogrammed,  
the CLKPS bits will be reset to “0000”. If CKDIV8 is programmed, CLKPS bits are reset to  
“0011”, giving a division factor of 8 at start up. This feature should be used if the selected clock  
source has a higher frequency than the maximum frequency of the device at the present operat-  
ing conditions. Note that any value can be written to the CLKPS bits regardless of the CKDIV8  
Fuse setting. The Application software must ensure that a sufficient division factor is chosen if  
the selected clock source has a higher frequency than the maximum frequency of the device at  
the present operating conditions. The device is shipped with the CKDIV8 Fuse programmed.  
Table 15. Clock Prescaler Select  
CLKPS3  
CLKPS2  
CLKPS1  
CLKPS0  
Clock Division Factor  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
2
4
8
16  
32  
64  
128  
256  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
42  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Power  
Sleep modes enable the application to shut down unused modules in the MCU, thereby saving  
power. The AVR provides various sleep modes allowing the user to tailor the power consump-  
tion to the application’s requirements.  
Management  
and Sleep  
Modes  
To enter any of the five sleep modes, the SE bit in MCUCR must be written to logic one and a  
SLEEP instruction must be executed. The SM2 bit in MCUCSR, the SM1 bit in MCUCR, and the  
SM0 bit in the EMCUCR Register select which sleep mode (Idle, Power-down, Power-save,  
Standby, or Extended Standby) will be activated by the SLEEP instruction. See Table 16 for a  
summary. If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up.  
The MCU is then halted for four cycles in addition to the start-up time, executes the interrupt rou-  
tine, and resumes execution from the instruction following SLEEP. The contents of the Register  
File and SRAM are unaltered when the device wakes up from sleep. If a Reset occurs during  
sleep mode, the MCU wakes up and executes from the Reset Vector.  
Figure 18 on page 35 presents the different clock systems in the ATmega162, and their distribu-  
tion. The figure is helpful in selecting an appropriate sleep mode.  
MCU Control Register  
– MCUCR  
Bit  
7
6
SRW10  
R/W  
0
5
SE  
R/W  
0
4
3
ISC11  
R/W  
0
2
ISC10  
R/W  
0
1
ISC01  
R/W  
0
0
ISC00  
R/W  
0
SRE  
R/W  
0
SM1  
R/W  
0
MCUCR  
Read/Write  
Initial Value  
• Bit 5 – SE: Sleep Enable  
The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP  
instruction is executed. To avoid the MCU entering the sleep mode unless it is the programmer’s  
purpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution of  
the SLEEP instruction and to clear it immediately after waking up.  
• Bit 4 – SM1: Sleep Mode Select Bit 1  
The Sleep Mode Select bits select between the five available sleep modes as shown in Table  
16.  
MCU Control and  
Status Register –  
MCUCSR  
Bit  
7
6
5
4
JTRF  
R/W  
0
3
WDRF  
R/W  
0
2
BORF  
R/W  
0
1
EXTRF  
R/W  
0
0
PORF  
R/W  
0
JTD  
R/W  
0
SM2  
R/W  
0
MCUCSR  
Read/Write  
Initial Value  
R/W  
0
• Bit 5 – SM2: Sleep Mode Select Bit 2  
The Sleep Mode Select bits select between the five available sleep modes as shown in Table  
16.  
43  
2513K–AVR–07/09  
Extended MCU  
Control Register –  
EMCUCR  
Bit  
7
6
SRL2  
R/W  
0
5
SRL1  
R/W  
0
4
SRL0  
R/W  
0
3
SRW01  
R/W  
0
2
SRW00  
R/W  
0
1
SRW11  
R/W  
0
0
SM0  
R/W  
0
ISC2  
R/W  
0
EMCUCR  
Read/Write  
Initial Value  
• Bit 7 – SM0: Sleep Mode Select Bit 0  
The Sleep Mode Select bits select between the five available sleep modes as shown in Table  
16.  
Table 16. Sleep Mode Select  
SM2  
SM1  
0
SM0  
Sleep Mode  
Idle  
0
0
0
0
1
1
1
1
0
1
0
1
0
1
0
1
0
Reserved  
1
Power-down  
Power-save  
Reserved  
1
0
0
Reserved  
1
Standby(1)  
Extended Standby(1)  
1
Note:  
1. Standby mode and Extended Standby mode are only available with external crystals or  
resonators.  
Idle Mode  
When the SM2..0 bits are written to 000, the SLEEP instruction makes the MCU enter Idle  
mode, stopping the CPU but allowing the SPI, USART, Analog Comparator, Timer/Counters,  
Watchdog, and the interrupt system to continue operating. This sleep mode basically halts  
clkCPU and clkFLASH, while allowing the other clocks to run.  
Idle mode enables the MCU to wake up from external triggered interrupts as well as internal  
ones like the Timer Overflow and USART Transmit Complete interrupts. If wake-up from the  
Analog Comparator interrupt is not required, the Analog Comparator can be powered down by  
setting the ACD bit in the Analog Comparator Control and Status Register – ACSR. This will  
reduce power consumption in Idle mode.  
Power-down Mode When the SM2..0 bits are written to 010, the SLEEP instruction makes the MCU enter Power-  
down mode. In this mode, the external Oscillator is stopped, while the external interrupts and the  
Watchdog continue operating (if enabled). Only an External Reset, a Watchdog Reset, a Brown-  
out Reset, an External Level Interrupt on INT0 or INT1, an external interrupt on INT2, or a pin  
change interrupt can wake up the MCU. This sleep mode basically halts all generated clocks,  
allowing operation of asynchronous modules only.  
Note that if a level triggered interrupt is used for wake-up from Power-down mode, the changed  
level must be held for some time to wake up the MCU. Refer to “External Interrupts” on page 84  
for details.  
When waking up from Power-down mode, there is a delay from the wake-up condition occurs  
until the wake-up becomes effective. This allows the clock to restart and become stable after  
having been stopped. The wake-up period is defined by the same CKSEL Fuses that define the  
Reset Time-out period, as described in “Clock Sources” on page 36.  
44  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Power-save Mode  
When the SM2..0 bits are written to 011, the SLEEP instruction makes the MCU enter Power-  
save mode. This mode is identical to Power-down, with one exception:  
If Timer/Counter2 is clocked asynchronously, i.e., the AS2 bit in ASSR is set, Timer/Counter2  
will run during sleep. The device can wake up from either Timer Overflow or Output Compare  
event from Timer/Counter2 if the corresponding Timer/Counter2 interrupt enable bits are set in  
TIMSK, and the Global Interrupt Enable bit in SREG is set.  
If the Asynchronous Timer is NOT clocked asynchronously, Power-down mode is recommended  
instead of Power-save mode because the contents of the registers in the Asynchronous Timer  
should be considered undefined after wake-up in Power-save mode if AS2 is 0.  
This sleep mode basically halts all clocks except clkASY, allowing operation only of asynchronous  
modules, including Timer/Counter 2 if clocked asynchronously.  
Standby Mode  
When the SM2..0 bits are 110 and an external crystal/resonator clock option is selected, the  
SLEEP instruction makes the MCU enter Standby mode. This mode is identical to Power-down  
with the exception that the main Oscillator is kept running. From Standby mode, the device  
wakes up in six clock cycles.  
Extended Standby When the SM2..0 bits are 111 and an external crystal/resonator clock option is selected, the  
SLEEP instruction makes the MCU enter Extended Standby mode. This mode is identical to  
Power-save mode with the exception that the main Oscillator is kept running. From Extended  
Standby mode, the device wakes up in six clock cycles.  
Mode  
Table 17. Active Clock domains and Wake up sources in the different sleep modes  
Active Clock domains  
Oscillators  
Wake-up Sources  
INT2  
INT1  
INT0  
SPM/  
EEPROM Other  
Main Clock  
clkCPU clkFLASH clkIO clkASY Source Enabled  
Timer Osc  
Enabled  
Sleep Mode  
Idle  
and Pin Change Timer2  
Ready  
I/O  
X
X
X
X(2)  
X(2)  
X(2)  
X
X
X
X
Power-down  
Power-save  
Standby(1)  
X(3)  
X(3)  
X(3)  
X(3)  
X(2)  
X(2)  
X
X
Extended Standby(1)  
X(2)  
X(2)  
Notes: 1. External Crystal or resonator selected as clock source  
2. If AS2 bit in ASSR is set  
3. For INT1 and INT0, only level interrupt  
45  
2513K–AVR–07/09  
Minimizing Power There are several issues to consider when trying to minimize the power consumption in an AVR  
controlled system. In general, sleep modes should be used as much as possible, and the sleep  
Consumption  
mode should be selected so that as few as possible of the device’s functions are operating. All  
functions not needed should be disabled. In particular, the following modules may need special  
consideration when trying to achieve the lowest possible power consumption.  
Analog Comparator  
Brown-out Detector  
When entering Idle mode, the Analog Comparator should be disabled if not needed. In the other  
sleep modes, the Analog Comparator is automatically disabled. However, if the Analog Compar-  
ator is set up to use the Internal Voltage Reference as input, the Analog Comparator should be  
disabled in all sleep modes. Otherwise, the Internal Voltage Reference will be enabled, indepen-  
dent of sleep mode. Refer to “Analog Comparator” on page 195 for details on how to configure  
the Analog Comparator.  
If the Brown-out Detector is not needed in the application, this module should be turned off. If the  
Brown-out Detector is enabled by the BODLEVEL Fuses, it will be enabled in all sleep modes,  
and hence, always consume power. In the deeper sleep modes, this will contribute significantly  
to the total current consumption. Refer to “Brown-out Detection” on page 50 for details on how to  
configure the Brown-out Detector.  
Internal Voltage  
Reference  
The Internal Voltage Reference will be enabled when needed by the Brown-out Detector or the  
Analog Comparator. If these modules are disabled as described in the sections above, the inter-  
nal voltage reference will be disabled and it will not be consuming power. When turned on again,  
the user must allow the reference to start up before the output is used. If the reference is kept on  
in sleep mode, the output can be used immediately. Refer to “Internal Voltage Reference” on  
page 52 for details on the start-up time.  
Watchdog Timer  
Port Pins  
If the Watchdog Timer is not needed in the application, this module should be turned off. If the  
Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence, always consume  
power. In the deeper sleep modes, this will contribute significantly to the total current consump-  
tion. Refer to “Watchdog Timer” on page 52 for details on how to configure the Watchdog Timer.  
When entering a sleep mode, all port pins should be configured to use minimum power. The  
most important thing is to ensure that no pins drive resistive loads. In sleep modes where the I/O  
clock (clkI/O) is stopped, the input buffers of the device will be disabled. This ensures that no  
power is consumed by the input logic when not needed. In some cases, the input logic is needed  
for detecting wake-up conditions, and it will then be enabled. Refer to the section “Digital Input  
Enable and Sleep Modes” on page 67 for details on which pins are enabled. If the input buffer is  
enabled and the input signal is left floating or have an analog signal level close to VCC/2, the  
input buffer will use excessive power.  
JTAG Interface and  
On-chip Debug  
System  
If the On-chip debug system is enabled by the OCDEN Fuse and the chip enter Power down or  
Power save sleep mode, the main clock source remains enabled. In these sleep modes, this will  
contribute significantly to the total current consumption. There are three alternative ways to  
avoid this:  
Disable OCDEN Fuse.  
Disable JTAGEN Fuse.  
Write one to the JTD bit in MCUCSR.  
The TDO pin is left floating when the JTAG interface is enabled while the JTAG TAP controller is  
not shifting data. If the hardware connected to the TDO pin does not pull up the logic level,  
power consumption will increase. Note that the TDI pin for the next device in the scan chain con-  
tains a pull-up that avoids this problem. Writing the JTD bit in the MCUCSR register to one or  
leaving the JTAG fuse unprogrammed disables the JTAG interface.  
46  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
System Control  
and Reset  
Resetting the AVR  
During Reset, all I/O Registers are set to their initial values, and the program starts execution  
from the Reset Vector. The instruction placed at the Reset Vector must be a JMP – Absolute  
Jump – instruction to the reset handling routine. If the program never enables an interrupt  
source, the Interrupt Vectors are not used, and regular program code can be placed at these  
locations. This is also the case if the Reset Vector is in the Application section while the Interrupt  
Vectors are in the Boot section or vice versa. The circuit diagram in Figure 21 shows the Reset  
Logic. Table 18 defines the electrical parameters of the reset circuitry.  
The I/O ports of the AVR are immediately reset to their initial state when a reset source goes  
active. This does not require any clock source to be running.  
After all reset sources have gone inactive, a delay counter is invoked, stretching the Internal  
Reset. This allows the power to reach a stable level before normal operation starts. The Time-  
out period of the delay counter is defined by the user through the CKSEL Fuses. The different  
selections for the delay period are presented in “Clock Sources” on page 36.  
Reset Sources  
The ATmega162 has five sources of reset:  
Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset  
threshold (VPOT).  
External Reset. The MCU is reset when a low level is present on the RESET pin for longer  
than the minimum pulse length.  
Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the  
Watchdog is enabled.  
Brown-out Reset. The MCU is reset when the supply voltage VCC is below the Brown-out  
Reset threshold (VBOT) and the Brown-out Detector is enabled. The device is guaranteed to  
operate at maximum frequency for the VCC voltage down to VBOT. VBOT must be set to the  
corresponding minimum voltage of the device (i.e., minimum VBOT for ATmega162V is 1.8V).  
JTAG AVR Reset. The MCU is reset as long as there is a logic one in the Reset Register,  
one of the scan chains of the JTAG system. Refer to the section “IEEE 1149.1 (JTAG)  
Boundary-scan” on page 204 for details.  
47  
2513K–AVR–07/09  
Figure 21. Reset Logic  
DATA BUS  
MCU Control and Status  
Register (MCUCSR)  
Power-on  
Reset Circuit  
VCC  
Brown-out  
Reset Circuit  
BODLEVEL [ 2..0]  
Pull-up Resistor  
SPIKE  
FILTER  
Reset Circuit  
RESET  
JTAG Reset  
Register  
Watchdog  
Timer  
Watchdog  
Oscillator  
Delay Counters  
Clock  
CK  
Generator  
TIMEOUT  
CKSEL[3:0]  
SUT[1:0]  
Table 18. Reset Characteristics  
Symbol Parameter  
Condition  
Min.  
Typ.  
Max.  
Units  
Power-on Reset  
Threshold Voltage (rising)  
TA = -40 - 85°C  
TA = -40 - 85°C  
0.7  
1.0  
1.4  
1.3  
V
VPOT  
Power-on Reset  
Threshold Voltage  
0.6  
0.9  
V
(falling)(1)  
RESET Pin Threshold  
Voltage  
VRST  
V
CC = 3V  
0.1 VCC  
0.9 VCC  
2.5  
V
Minimum pulse width on  
RESET Pin  
tRST  
VCC = 3V  
µs  
Note:  
1. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling)  
Power-on Reset  
A Power-on Reset (POR) pulse is generated by an On-chip detection circuit. The detection level  
is defined in Table 18. The POR is activated whenever VCC is below the detection level. The  
POR circuit can be used to trigger the Start-up Reset, as well as to detect a failure in supply  
voltage.  
A Power-on Reset (POR) circuit ensures that the device is Reset from Power-on. Reaching the  
Power-on Reset threshold voltage invokes the delay counter, which determines how long the  
device is kept in RESET after VCC rise. The RESET signal is activated again, without any delay,  
when VCC decreases below the detection level.  
48  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 22. MCU Start-up, RESET Tied to VCC  
.
VPOT  
VCC  
VRST  
RESET  
tTOUT  
TIME-OUT  
INTERNAL  
RESET  
Figure 23. MCU Start-up, RESET Extended Externally  
VPOT  
VCC  
VRST  
RESET  
tTOUT  
TIME-OUT  
INTERNAL  
RESET  
External Reset  
An External Reset is generated by a low level on the RESET pin. Reset pulses longer than the  
minimum pulse width (see Table 18) will generate a Reset, even if the clock is not running.  
Shorter pulses are not guaranteed to generate a Reset. When the applied signal reaches the  
Reset Threshold Voltage – VRST on its positive edge, the delay counter starts the MCU after the  
Time-out period tTOUT has expired.  
Figure 24. External Reset During Operation  
CC  
49  
2513K–AVR–07/09  
Brown-out Detection  
ATmega162 has an On-chip Brown-out Detection (BOD) circuit for monitoring the VCC level dur-  
ing operation by comparing it to a fixed trigger level. The trigger level for the BOD can be  
selected by the BODLEVEL Fuses. The trigger level has a hysteresis to ensure spike free  
Brown-out Detection. The hysteresis on the detection level should be interpreted as VBOT+  
BOT + VHYST/2 and VBOT- = VBOT - VHYST/2.  
=
V
Table 19. BODLEVEL Fuse Coding  
(1)  
BODLEVEL Fuses [2:0]  
Min. VBOT  
Typ. VBOT  
BOD Disabled  
Max. VBOT  
Units  
111  
110(2)  
1.7  
2.5  
4.1  
2.1  
1.8  
2.7  
4.3  
2.3  
2.0  
2.9  
4.5  
2.5  
101  
V
100  
011(2)  
010  
001  
Reserved  
000  
Notes: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where  
this is the case, the device is tested down to VCC = VBOT during the production test. This guar-  
antees that a Brown-out Reset will occur before VCC drops to a voltage where correct  
operation of the microcontroller is no longer guaranteed. This test is performed using  
BODLEVEL = 110 for ATmega162V, BODLEVEL = 101 and BODLEVEL = 100 for  
ATmega162.  
2. For ATmega162V. Otherwise reserved.  
Table 20. Brown-out Hysteresis  
Symbol  
VHYST  
tBOD  
Parameter  
Min.  
Typ.  
50  
2
Max.  
Units  
mV  
Brown-out Detector hysteresis  
Min Pulse Width on Brown-out Reset  
µs  
When the BOD is enabled and VCC decreases to a value below the trigger level (VBOT- in Figure  
25), the Brown-out Reset is immediately activated. When VCC increases above the trigger level  
(VBOT+ in Figure 25), the delay counter starts the MCU after the Time-out period tTOUT has  
expired.  
The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level for lon-  
ger than tBOD given in Table 18.  
50  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 25. Brown-out Reset During Operation  
V
V
BOT+  
CC  
V
BOT-  
RESET  
t
TOUT  
TIME-OUT  
INTERNAL  
RESET  
Watchdog Reset  
When the Watchdog times out, it will generate a short reset pulse of one CK cycle duration. On  
the falling edge of this pulse, the delay timer starts counting the Time-out period tTOUT. Refer to  
page 52 for details on operation of the Watchdog Timer.  
Figure 26. Watchdog Reset During Operation  
CC  
CK  
MCU Control and  
Status Register –  
MCUCSR  
The MCU Control and Status Register provides information on which reset source caused an  
MCU Reset.  
Bit  
7
6
5
SM2  
R
4
3
2
1
0
JTD  
R/W  
0
JTRF  
R/W  
WDRF  
R/W  
BORF  
R/W  
EXTRF  
R/W  
PORF  
R/W  
MCUCSR  
Read/Write  
Initial Value  
R/W  
0
0
See Bit Description  
• Bit 4 – JTRF: JTAG Reset Flag  
This bit is set if a reset is being caused by a logic one in the JTAG Reset Register selected by  
the JTAG instruction AVR_RESET. This bit is reset by a Power-on Reset, or by writing a logic  
zero to the flag.  
• Bit 3 – WDRF: Watchdog Reset Flag  
This bit is set if a Watchdog Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
51  
2513K–AVR–07/09  
• Bit 2 – BORF: Brown-out Reset Flag  
This bit is set if a Brown-out Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
• Bit 1 – EXTRF: External Reset Flag  
This bit is set if an External Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
• Bit 0 – PORF: Power-on Reset Flag  
This bit is set if a Power-on Reset occurs. The bit is reset only by writing a logic zero to the flag.  
To make use of the Reset Flags to identify a reset condition, the user should read and then  
Reset the MCUCSR as early as possible in the program. If the register is cleared before another  
reset occurs, the source of the Reset can be found by examining the Reset Flags.  
Internal Voltage  
Reference  
ATmega162 features an internal bandgap reference. This reference is used for Brown-out  
Detection, and it can be used as an input to the Analog Comparator.  
Voltage Reference  
Enable Signals and  
Start-up Time  
The voltage reference has a start-up time that may influence the way it should be used. The  
start-up time is given in Table 21. To save power, the reference is not always turned on. The ref-  
erence is on during the following situations:  
1. When the BOD is enabled (by programming the BODLEVEL Fuses).  
2. When the bandgap reference is connected to the Analog Comparator (by setting the  
ACBG bit in ACSR).  
Thus, when the BOD is not enabled, after setting the ACBG bit, the user must always allow the  
reference to start up before the output from the Analog Comparator is used. To reduce power  
consumption in Power-down mode, the user can avoid the two conditions above to ensure that  
the reference is turned off before entering Power-down mode.  
Table 21. Internal Voltage Reference Characteristics  
Symbol Parameter  
Min.  
Typ.  
1.10  
40  
Max.  
1.15  
70  
Units  
V
VBG  
tBG  
Bandgap reference voltage  
1.05  
Bandgap reference start-up time  
µs  
Bandgap reference current  
consumption  
IBG  
10  
µA  
Watchdog Timer  
The Watchdog Timer is clocked from a separate On-chip Oscillator which runs at 1 MHz. This is  
the typical frequency at VCC = 5V. See characterization data for typical values at other VCC lev-  
els. By controlling the Watchdog Timer prescaler, the Watchdog Reset interval can be adjusted  
as shown in Table 23 on page 54. The WDR – Watchdog Reset – instruction resets the Watch-  
dog Timer. The Watchdog Timer is also reset when it is disabled and when a Chip Reset occurs.  
Eight different clock cycle periods can be selected to determine the reset period. If the reset  
period expires without another Watchdog Reset, the ATmega162 resets and executes from the  
Reset Vector. For timing details on the Watchdog Reset, refer to page 54.  
To prevent unintentional disabling of the Watchdog or unintentional change of time-out period, 3  
different safety levels are selected by the Fuses M161C and WDTON as shown in Table 22.  
Safety level 0 corresponds to the setting in ATmega161. There is no restriction on enabling the  
52  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
WDT in any of the safety levels. Refer to “Timed Sequences for Changing the Configuration of  
the Watchdog Timer” on page 56 for details.  
Table 22. WDT Configuration as a Function of the Fuse Settings of M161C and WDTON.  
WDT  
How to  
Safety Initial  
How to Disable  
the WDT  
Change Time-  
out  
M161C  
WDTON  
Level  
State  
Timed  
sequence  
Unprogrammed Unprogrammed  
Unprogrammed Programmed  
1
Disabled Timed sequence  
Enabled Always enabled  
Timed  
sequence  
2
0
2
Programmed  
Programmed  
Unprogrammed  
Programmed  
Disabled Timed sequence No restriction  
Timed  
Enabled  
Always enabled  
sequence  
Figure 27. Watchdog Timer  
WATCHDOG  
OSCILLATOR  
Watchdog Timer  
Control Register –  
WDTCR  
Bit  
7
6
5
4
WDCE  
R/W  
0
3
WDE  
R/W  
0
2
WDP2  
R/W  
0
1
WDP1  
R/W  
0
0
WDP0  
R/W  
0
WDTCR  
Read/Write  
Initial Value  
R
0
R
0
R
0
• Bits 7..5 – Res: Reserved Bits  
These bits are reserved bits in the ATmega162 and will always read as zero.  
• Bit 4 – WDCE: Watchdog Change Enable  
This bit must be set when the WDE bit is written to logic zero. Otherwise, the Watchdog will not  
be disabled. Once written to one, hardware will clear this bit after four clock cycles. Refer to the  
description of the WDE bit for a Watchdog disable procedure. In Safety Levels 1 and 2, this bit  
must also be set when changing the prescaler bits. See “Timed Sequences for Changing the  
Configuration of the Watchdog Timer” on page 56.  
• Bit 3 – WDE: Watchdog Enable  
When the WDE is written to logic one, the Watchdog Timer is enabled, and if the WDE is written  
to logic zero, the Watchdog Timer function is disabled. WDE can only be cleared if the WDCE bit  
has logic level one. To disable an enabled Watchdog Timer, the following procedure must be  
followed:  
53  
2513K–AVR–07/09  
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written  
to WDE even though it is set to one before the disable operation starts.  
2. Within the next four clock cycles, write a logic 0 to WDE. This disables the Watchdog.  
In safety level 2, it is not possible to disable the Watchdog Timer, even with the algorithm  
described above. See “Timed Sequences for Changing the Configuration of the Watchdog  
Timer” on page 56.  
• Bits 2..0 – WDP2, WDP1, WDP0: Watchdog Timer Prescaler 2, 1, and 0  
The WDP2, WDP1, and WDP0 bits determine the Watchdog Timer prescaling when the Watch-  
dog Timer is enabled. The different prescaling values and their corresponding Timeout Periods  
are shown in Table 23.  
Table 23. Watchdog Timer Prescale Select  
Number of WDT  
Oscillator Cycles  
Typical Time-out  
at VCC = 3.0V  
Typical Time-out  
at VCC = 5.0V  
WDP2 WDP1 WDP0  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
16K (16,384)  
32K (32,768)  
17 ms  
34 ms  
69 ms  
0.14 s  
0.27 s  
0.55 s  
1.1 s  
16 ms  
33 ms  
65 ms  
0.13 s  
0.26 s  
0.52 s  
1.0 s  
65K (65,536)  
128K (131,072)  
256K (262,144)  
512K (524,288)  
1,024K (1,048,576)  
2,048K (2,097,152)  
2.2 s  
2.1 s  
54  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The following code example shows one assembly and one C function for turning off the WDT.  
The example assumes that interrupts are controlled (e.g., by disabling interrupts globally) so that  
no interrupts will occur during execution of these functions.  
Assembly Code Example  
WDT_off:  
; Reset WDT  
WDR  
; Write logical one to W?CE and WDE  
in  
r16, WDTCR  
ori r16, (1<<WDCE)|(1<<WDE)  
out WDTCR, r16  
; Turn off WDT  
ldi r16, (0<<WDE)  
out WDTCR, r16  
ret  
C Code Example  
void WDT_off(void)  
{
/* Reset WDT*/  
_WDR()  
/* Write logical on? to WDCE and WDE */  
WDTCR |= (1<<WDCE) | (1<?WDE);  
/* Turn off WDT */  
WDTCR = 0x00;  
}
55  
2513K–AVR–07/09  
Timed Sequences The sequence for changing configuration differs slightly between the three safety levels. Sepa-  
rate procedures are described for each level.  
for Changing the  
Configuration of  
the Watchdog  
Timer  
Safety Level 0  
Safety Level 1  
This mode is compatible with the Watchdog operation found in ATmega161. The Watchdog  
Timer is initially disabled, but can be enabled by writing the WDE bit to one without any restric-  
tion. The Time-out period can be changed at any time without restriction. To disable an enabled  
Watchdog Timer, the procedure described on page 53 (WDE bit description) must be followed.  
In this mode, the Watchdog Timer is initially disabled, but can be enabled by writing the WDE bit  
to one without any restriction. A timed sequence is needed when changing the Watchdog Time-  
out period or disabling an enabled Watchdog Timer. To disable an enabled Watchdog Timer,  
and/or changing the Watchdog Time-out, the following procedure must be followed:  
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written  
to WDE regardless of the previous value of the WDE bit.  
2. Within the next four clock cycles, in the same operation, write the WDE and WDP bits as  
desired, but with the WDCE bit cleared.  
Safety Level 2  
In this mode, the Watchdog Timer is always enabled, and the WDE bit will always read as one. A  
timed sequence is needed when changing the Watchdog Time-out period. To change the  
Watchdog Time-out, the following procedure must be followed:  
1. In the same operation, write a logical one to WDCE and WDE. Even though the WDE  
always is set, the WDE must be written to one to start the timed sequence.  
2. Within the next four clock cycles, in the same operation, write the WDP bits as desired,  
but with the WDCE bit cleared. The value written to the WDE bit is irrelevant.  
56  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Interrupts  
This section describes the specifics of the interrupt handling as performed in ATmega162. For a  
general explanation of the AVR interrupt handling, refer to “Reset and Interrupt Handling” on  
page 14. Table 24 shows the interrupt table when the compatibility fuse (M161C) is unpro-  
grammed, while Table 25 shows the interrupt table when M161C Fuse is programmed. All  
assembly code examples in this sections are using the interrupt table when the M161C Fuse is  
unprogrammed.  
Interrupt Vectors  
in ATmega162  
Table 24. Reset and Interrupt Vectors if M161C is unprogrammed  
Program  
Vector No. Address(2) Source  
Interrupt Definition  
1
0x000(1)  
RESET  
External Pin, Power-on Reset, Brown-out  
Reset, Watchdog Reset, and JTAG AVR  
Reset  
2
0x002  
0x004  
0x006  
0x008  
0x00A  
0x00C  
0x00E  
0x010  
0x012  
0x014  
0x016  
0x018  
0x01A  
0x01C  
0x01E  
0x020  
0x022  
0x024  
0x026  
0x028  
0x02A  
0x02C  
0x02E  
0x030  
0x032  
0x034  
0x036  
INT0  
External Interrupt Request 0  
External Interrupt Request 1  
External Interrupt Request 2  
Pin Change Interrupt Request 0  
Pin Change Interrupt Request 1  
Timer/Counter3 Capture Event  
Timer/Counter3 Compare Match A  
3
INT1  
4
INT2  
5
PCINT0  
6
PCINT1  
7
TIMER3 CAPT  
TIMER3 COMPA  
8
9
TIMER3 COMPB Timer/Counter3 Compare Match B  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
TIMER3 OVF  
Timer/Counter3 Overflow  
TIMER2 COMP  
TIMER2 OVF  
Timer/Counter2 Compare Match  
Timer/Counter2 Overflow  
TIMER1 CAPT  
TIMER1 COMPA  
Timer/Counter1 Capture Event  
Timer/Counter1 Compare Match A  
TIMER1 COMPB Timer/Counter1 Compare Match B  
TIMER1 OVF  
TIMER0 COMP  
TIMER0 OVF  
SPI, STC  
Timer/Counter1 Overflow  
Timer/Counter0 Compare Match  
Timer/Counter0 Overflow  
Serial Transfer Complete  
USART0, Rx Complete  
USART1, Rx Complete  
USART0 Data Register Empty  
USART1 Data Register Empty  
USART0, Tx Complete  
USART1, Tx Complete  
EEPROM Ready  
USART0, RXC  
USART1, RXC  
USART0, UDRE  
USART1, UDRE  
USART0, TXC  
USART1, TXC  
EE_RDY  
ANA_COMP  
SPM_RDY  
Analog Comparator  
Store Program Memory Ready  
57  
2513K–AVR–07/09  
Notes: 1. When the BOOTRST Fuse is programmed, the device will jump to the Boot Loader address at  
reset, see “Boot Loader Support – Read-While-Write Self-programming” on page 217.  
2. When the IVSEL bit in GICR is set, Interrupt Vectors will be moved to the start of the Boot  
Flash section. The address of each Interrupt Vector will then be the address in this table added  
to the start address of the Boot Flash section.  
Table 25. Reset and Interrupt Vectors if M161C is programmed  
Program  
Vector No. Address(2) Source  
Interrupt Definition  
1
0x000(1)  
RESET  
External Pin, Power-on Reset, Brown-out  
Reset, Watchdog Reset, and JTAG AVR  
Reset  
2
0x002  
0x004  
0x006  
0x008  
0x00A  
0x00C  
0x00E  
0x010  
0x012  
0x014  
0x016  
0x018  
0x01A  
0x01C  
0x01E  
0x020  
0x022  
0x024  
0x026  
0x028  
0x02A  
INT0  
External Interrupt Request 0  
External Interrupt Request 1  
External Interrupt Request 2  
Timer/Counter2 Compare Match  
Timer/Counter2 Overflow  
3
INT1  
4
INT2  
5
TIMER2 COMP  
TIMER2 OVF  
TIMER1 CAPT  
TIMER1 COMPA  
6
7
Timer/Counter1 Capture Event  
Timer/Counter1 Compare Match A  
8
9
TIMER1 COMPB Timer/Counter1 Compare Match B  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
TIMER1 OVF  
TIMER0 COMP  
TIMER0 OVF  
SPI, STC  
Timer/Counter1 Overflow  
Timer/Counter0 Compare Match  
Timer/Counter0 Overflow  
Serial Transfer Complete  
USART0, Rx Complete  
USART1, Rx Complete  
USART0 Data Register Empty  
USART1 Data Register Empty  
USART0, Tx Complete  
USART1, Tx Complete  
EEPROM Ready  
USART0, RXC  
USART1, RXC  
USART0, UDRE  
USART1, UDRE  
USART0, TXC  
USART1, TXC  
EE_RDY  
ANA_COMP  
SPM_RDY  
Analog Comparator  
Store Program Memory Ready  
Notes: 1. When the BOOTRST Fuse is programmed, the device will jump to the Boot Loader address at  
reset, see “Boot Loader Support – Read-While-Write Self-programming” on page 217.  
2. When the IVSEL bit in GICR is set, Interrupt Vectors will be moved to the start of the Boot  
Flash section. The address of each Interrupt Vector will then be the address in this table added  
to the start address of the Boot Flash section.  
58  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 26 shows Reset and Interrupt Vectors placement for the various combinations of  
BOOTRST and IVSEL settings. If the program never enables an interrupt source, the Interrupt  
Vectors are not used, and regular program code can be placed at these locations. This is also  
the case if the Reset Vector is in the Application section while the Interrupt Vectors are in the  
Boot section or vice versa.  
Table 26. Reset and Interrupt Vectors Placement(1)  
BOOTRST  
IVSEL  
Reset address  
0x0000  
Interrupt Vectors Start Address  
0x0002  
1
1
0
0
0
1
0
1
0x0000  
Boot Reset Address + 0x0002  
0x0002  
Boot Reset Address  
Boot Reset Address  
Boot Reset Address + 0x0002  
Note:  
1. The Boot Reset Address is shown in Table 93 on page 228. For the BOOTRST Fuse “1”  
means unprogrammed while “0” means programmed.  
The most typical and general program setup for the Reset and Interrupt Vector Addresses in  
ATmega162 is:  
Address Labels  
0x000  
0x002  
0x004  
0x006  
0x008  
0x00A  
0x00C  
0x00E  
0x010  
0x012  
0x014  
0x016  
0x018  
0x01A  
0x01C  
0x01E  
0x020  
0x022  
0x024  
0x026  
0x028  
0x02A  
0x02C  
0x02E  
0x030  
0x032  
0x034  
0x036  
;
Code  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
jmp  
Comments  
RESET  
; Reset Handler  
EXT_INT0  
EXT_INT1  
EXT_INT2  
PCINT0  
; IRQ0 Handler  
; IRQ1 Handler  
; IRQ2 Handler  
; PCINT0 Handler  
PCINT1  
; PCINT1 Handler  
TIM3_CAPT  
TIM3_COMPA  
TIM3_COMPB  
TIM3_OVF  
TIM2_COMP  
TIM2_OVF  
TIM1_CAPT  
TIM1_COMPA  
TIM1_COMPB  
TIM1_OVF  
TIM0_COMP  
TIM0_OVF  
SPI_STC  
; Timer3 Capture Handler  
; Timer3 CompareA Handler  
; Timer3 CompareB Handler  
; Timer3 Overflow Handler  
; Timer2 Compare Handler  
; Timer2 Overflow Handler  
; Timer1 Capture Handler  
; Timer1 CompareA Handler  
; Timer1 CompareB Handler  
; Timer1 Overflow Handler  
; Timer0 Compare Handler  
; Timer0 Overflow Handler  
; SPI Transfer Complete Handler  
; USART0 RX Complete Handler  
; USART1 RX Complete Handler  
; UDR0 Empty Handler  
USART0_RXC  
USART1_RXC  
USART0_UDRE  
USART1_UDRE  
USART0_TXC  
USART1_TXC  
EE_RDY  
; UDR1 Empty Handler  
; USART0 TX Complete Handler  
; USART1 TX Complete Handler  
; EEPROM Ready Handler  
; Analog Comparator Handler  
; Store Program Memory Ready Handler  
ANA_COMP  
SPM_RDY  
0x038 RESET:  
0x039  
ldi  
out  
r16,high(RAMEND) ; Main program start  
SPH,r16 ; Set Stack Pointer to top of RAM  
59  
2513K–AVR–07/09  
0x03A  
0x03B  
0x03C  
0x03D  
...  
ldi  
out  
sei  
r16,low(RAMEND)  
SPL,r16  
; Enable interrupts  
<instr> xxx  
...  
...  
When the BOOTRST Fuse is unprogrammed, the boot section size set to 2K bytes and the  
IVSEL bit in the GICR Register is set before any interrupts are enabled, the most typical and  
general program setup for the Reset and Interrupt Vector Addresses is:  
Address Labels  
Code  
ldi  
out  
ldi  
out  
sei  
Comments  
0x000  
0x001  
0x002  
0x003  
0x004  
0x005  
;
RESET:  
r16,high(RAMEND) ; Main program start  
SPH,r16  
; Set Stack Pointer to top of RAM  
r16,low(RAMEND)  
SPL,r16  
; Enable interrupts  
<instr> xxx  
.org 0x1C02  
0x1C02  
jmp  
jmp  
..  
EXT_INT0  
EXT_INT1  
; IRQ0 Handler  
0x1C04  
; IRQ1 Handler  
...  
....  
;
0x1C36  
jmp  
SPM_RDY  
; Store Program Memory Ready Handler  
When the BOOTRST Fuse is programmed and the boot section size set to 2K bytes, the most  
typical and general program setup for the Reset and Interrupt Vector Addresses is:  
Address Labels  
.org 0x002  
0x002  
Code  
Comments  
jmp  
EXT_INT0  
EXT_INT1  
; IRQ0 Handler  
0x004  
jmp  
..  
; IRQ1 Handler  
...  
0x036  
;
....  
;
jmp  
SPM_RDY  
; Store Program Memory Ready Handler  
.org 0x1C00  
0x1C00  
0x1C01  
0x1C02  
0x1C03  
0x1C04  
0x1C05  
RESET:  
ldi  
out  
ldi  
out  
sei  
r16,high(RAMEND) ; Main program start  
SPH,r16  
; Set Stack Pointer to top of RAM  
r16,low(RAMEND)  
SPL,r16  
; Enable interrupts  
<instr> xxx  
60  
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ATmega162/V  
When the BOOTRST Fuse is programmed, the boot section size set to 2K bytes and the IVSEL  
bit in the GICR Register is set before any interrupts are enabled, the most typical and general  
program setup for the Reset and Interrupt Vector Addresses is:  
Address Labels  
Code  
Comments  
.org 0x1C00  
0x1C00  
0x1C02  
jmp  
jmp  
RESET  
EXT_INT0  
; Reset handler  
; IRQ0 Handler  
0x1C04  
jmp  
..  
EXT_INT1  
SPM_RDY  
; IRQ1 Handler  
...  
....  
;
0x1C36  
;
jmp  
; Store Program Memory Ready Handler  
0x1C38  
0x1C39  
0x1C3A  
0x1C3B  
0x1C3C  
0x1C3D  
RESET:  
ldi  
out  
ldi  
out  
sei  
r16,high(RAMEND) ; Main program start  
SPH,r16  
; Set Stack Pointer to top of RAM  
r16,low(RAMEND)  
SPL,r16  
; Enable interrupts  
<instr> xxx  
Moving Interrupts  
Between Application  
and Boot Space  
The General Interrupt Control Register controls the placement of the Interrupt Vector table.  
General Interrupt  
Control Register –  
GICR  
Bit  
7
6
5
4
PCIE1  
R/W  
0
3
PCIE0  
R/W  
0
2
1
IVSEL  
R/W  
0
0
IVCE  
R/W  
0
INT1  
R/W  
0
INT0  
R/W  
0
INT2  
R/W  
0
GICR  
Read/Write  
Initial Value  
R
0
• Bit 1 – IVSEL: Interrupt Vector Select  
When the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flash  
memory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the Boot  
Loader section of the Flash. The actual address of the start of the Boot Flash section is deter-  
mined by the BOOTSZ Fuses. Refer to the section “Boot Loader Support – Read-While-Write  
Self-programming” on page 217 for details. To avoid unintentional changes of Interrupt Vector  
tables, a special write procedure must be followed to change the IVSEL bit:  
1. Write the Interrupt Vector Change Enable (IVCE) bit to one.  
2. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE.  
Interrupts will automatically be disabled while this sequence is executed. Interrupts are disabled  
in the cycle IVCE is set, and they remain disabled until after the instruction following the write to  
IVSEL. If IVSEL is not written, interrupts remain disabled for four cycles. The I-bit in the Status  
Register is unaffected by the automatic disabling.  
Note:  
If Interrupt Vectors are placed in the Boot Loader section and Boot Lock bit BLB02 is programmed,  
interrupts are disabled while executing from the Application section. If Interrupt Vectors are placed  
in the Application section and Boot Lock bit BLB12 is programed, interrupts are disabled while  
executing from the Boot Loader section. Refer to the section “Boot Loader Support – Read-While-  
Write Self-programming” on page 217 for details on Boot Lock bits.  
61  
2513K–AVR–07/09  
• Bit 0 – IVCE: Interrupt Vector Change Enable  
The IVCE bit must be written to logic one to enable change of the IVSEL bit. IVCE is cleared by  
hardware four cycles after it is written or when IVSEL is written. Setting the IVCE bit will disable  
interrupts, as explained in the IVSEL description above. See Code Example below.  
Assembly Code Example  
Move_interrupts:  
; Enable change of Inter?upt Vectors  
ldi r16, (1<<IVCE)  
out GICR, r16  
; Move interrupts to Boo? Flash section  
ldi r16, (1<<IVSEL)  
out GICR, r16  
ret  
C Code Example  
void Move_interrupts(void)  
{
/* Enable change of?Interrupt Vectors */  
GICR = (1<<IVCE);  
/* Move interrupts to Bo?t Flash section */  
GICR = (1<<IVSEL);  
}
62  
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ATmega162/V  
I/O-Ports  
Introduction  
All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports.  
This means that the direction of one port pin can be changed without unintentionally changing  
the direction of any other pin with the SBI and CBI instructions. The same applies when chang-  
ing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as  
input). Each output buffer has symmetrical drive characteristics with both high sink and source  
capability. The pin driver is strong enough to drive LED displays directly. All port pins have indi-  
vidually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have  
protection diodes to both VCC and Ground as indicated in Figure 28. Refer to “Electrical Charac-  
teristics” on page 264 for a complete list of parameters.  
Figure 28. I/O Pin Equivalent Schematic  
Rpu  
Pxn  
Logic  
Cpin  
See figure  
"General Digital I/O" for  
details  
All registers and bit references in this section are written in general form. A lower case “x” repre-  
sents the numbering letter for the port, and a lower case “n” represents the bit number. However,  
when using the register or bit defines in a program, the precise form must be used. For example,  
PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Regis-  
ters and bit locations are listed in “Register Description for I/O-Ports” on page 82.  
Three I/O memory address locations are allocated for each port, one each for the Data Register  
– PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins  
I/O location is read only, while the Data Register and the Data Direction Register are read/write.  
In addition, the Pull-up Disable – PUD bit in SFIOR disables the pull-up function for all pins in all  
ports when set.  
Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page  
63. Most port pins are multiplexed with alternate functions for the peripheral features on the  
device. How each alternate function interferes with the port pin is described in “Alternate Port  
Functions” on page 68. Refer to the individual module sections for a full description of the alter-  
nate functions.  
Note that enabling the alternate function of some of the port pins does not affect the use of the  
other pins in the port as general digital I/O.  
Ports as General  
Digital I/O  
The ports are bi-directional I/O ports with optional internal pull-ups. Figure 29 shows a functional  
description of one I/O-port pin, here generically called Pxn.  
63  
2513K–AVR–07/09  
Figure 29. General Digital I/O(1)  
PUD  
Q
D
DDxn  
Q CLR  
WDx  
RDx  
RESET  
Q
D
Pxn  
PORTxn  
Q CLR  
WRx  
RRx  
RESET  
SLEEP  
SYNCHRONIZER  
RPx  
D
Q
D
L
Q
Q
PINxn  
Q
clk I/O  
WDx:  
RDx:  
WRx:  
RRx:  
RPx:  
WRITE DDRx  
PUD:  
PULLUP DISABLE  
READ DDRx  
SLEEP:  
SLEEP CONTROL  
I/O CLOCK  
WRITE PORTx  
clkI/O  
:
READ PORTx REGISTER  
READ PORTx PIN  
Note:  
1. WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP,  
and PUD are common to all ports.  
Configuring the Pin  
Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in “Register  
Description for I/O-Ports” on page 82, the DDxn bits are accessed at the DDRx I/O address, the  
PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address.  
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one,  
Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input  
pin.  
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is  
activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to  
be configured as an output pin. The port pins are tri-stated when a reset condition becomes  
active, even if no clocks are running.  
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven  
high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port  
pin is driven low (zero).  
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn}  
= 0b11), an intermediate state with either pull-up enabled ({DDxn, PORTxn} = 0b01) or output  
low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully accept-  
able, as a high-impedant environment will not notice the difference between a strong high driver  
and a pull-up. If this is not the case, the PUD bit in the SFIOR Register can be set to disable all  
pull-ups in all ports.  
64  
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ATmega162/V  
Switching between input with pull-up and output low generates the same problem. The user  
must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn}  
= 0b11) as an intermediate step.  
Table 27 summarizes the control signals for the pin value.  
Table 27. Port Pin Configurations  
PUD  
DDxn PORTxn (in SFIOR)  
I/O  
Pull-up Comment  
0
0
X
Input  
No  
Tri-state (Hi-Z)  
Pxn will source current if ext. pulled  
low.  
0
0
1
1
1
1
0
1
0
1
Input  
Input  
Yes  
No  
No  
No  
Tri-state (Hi-Z)  
X
X
Output  
Output  
Output Low (Sink)  
Output High (Source)  
Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the  
PINxn Register bit. As shown in Figure 29, the PINxn Register bit and the preceding latch consti-  
tute a synchronizer. This is needed to avoid metastability if the physical pin changes value near  
the edge of the internal clock, but it also introduces a delay. Figure 30 shows a timing diagram of  
the synchronization when reading an externally applied pin value. The maximum and minimum  
propagation delays are denoted tpd,max and tpd,min respectively.  
Figure 30. Synchronization when Reading an Externally Applied Pin Value  
SYSTEM CLK  
XXX  
XXX  
in r17, PINx  
INSTRUCTIONS  
SYNC LATCH  
PINxn  
0x00  
tpd, max  
0xFF  
r17  
tpd, min  
65  
2513K–AVR–07/09  
Consider the clock period starting shortly after the first falling edge of the system clock. The latch  
is closed when the clock is low, and goes transparent when the clock is high, as indicated by the  
shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock  
goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indi-  
cated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed  
between ½ and 1½ system clock period depending upon the time of assertion.  
When reading back a software assigned pin value, a nop instruction must be inserted as indi-  
cated in Figure 31. The out instruction sets the “SYNC LATCH” signal at the positive edge of the  
clock. In this case, the delay tpd through the synchronizer is one system clock period.  
Figure 31. Synchronization when Reading a Software Assigned Pin Value  
SYSTEM CLK  
0xFF  
r16  
out PORTx, r16  
nop  
in r17, PINx  
INSTRUCTIONS  
SYNC LATCH  
PINxn  
0x00  
tpd  
0xFF  
r17  
66  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and define  
the port pins from 4 to 7 as input with pull-ups assigned to port pins 6 and 7. The resulting pin  
values are read back again, but as previously discussed, a nop instruction is included to be able  
to read back the value recently assigned to some of the pins.  
Assembly Code Example(1)  
...  
; Define pull-ups a?d set outputs high  
; Define directions?for port pins  
ldi  
ldi  
out  
out  
r16,(1<<PB7)|(1<<PB6)|(1<<PB1)|(1<<PB0)  
r17,(1<<DDB3)|(1<<DDB2)|(1<<DDB1)|(1<<DDB0)  
PORTB,r16  
DDRB,r17  
; Insert nop for sy?chronization  
nop  
; Read port pins  
in  
r16,PINB  
...  
C Code Example(1)  
unsigned char i;  
...  
/* Define pull-ups ?nd set outputs high */  
/* Define direction? for port pins */  
PORTB = (1<<PB7)|(1<<PB6?|(1<<PB1)|(1<<PB0);  
DDRB = (1<<DDB3)|(1<<DDB?)|(1<<DDB1)|(1<<DDB0);  
/* Insert nop for s?nchronization*/  
_NOP();  
/* Read port pins */  
i = PINB;  
...  
Note:  
1. For the assembly program, two temporary registers are used to minimize the time from pull-  
ups are set on pins 0, 1, 6, and 7, until the direction bits are correctly set, defining bit 2 and 3  
as low and redefining bits 0 and 1 as strong high drivers.  
Digital Input Enable  
and Sleep Modes  
As shown in Figure 29, the digital input signal can be clamped to ground at the input of the  
Schmitt Trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in  
Power-down mode, Power-save mode, Standby mode, and Extended Standby mode to avoid  
high power consumption if some input signals are left floating, or have an analog signal level  
close to VCC/2.  
SLEEP is overridden for port pins enabled as External Interrupt pins. If the External Interrupt  
Request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by vari-  
ous other alternate functions as described in “Alternate Port Functions” on page 68.  
If a logic high level (“one”) is present on an Asynchronous External Interrupt pin configured as  
“Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt  
is not enabled, the corresponding External Interrupt Flag will be set when resuming from the  
above mentioned sleep modes, as the clamping in these sleep modes produces the requested  
logic change.  
67  
2513K–AVR–07/09  
Unconnected pins  
If some pins are unused, it is recommended to ensure that these pins have a defined level. Even  
though most of the digital inputs are disabled in the deep sleep modes as described above, float-  
ing inputs should be avoided to reduce current consumption in all other modes where the digital  
inputs are enabled (Reset, Active mode and Idle mode).  
The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up.  
In this case, the pull-up will be disabled during reset. If low power consumption during reset is  
important, it is recommended to use an external pull-up or pull-down. Connecting unused pins  
directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is  
accidentally configured as an output.  
Alternate Port  
Functions  
Most port pins have alternate functions in addition to being general digital I/Os. Figure 32 shows  
how the port pin control signals from the simplified Figure 29 can be overridden by alternate  
functions. The overriding signals may not be present in all port pins, but the figure serves as a  
generic description applicable to all port pins in the AVR microcontroller family.  
Figure 32. Alternate Port Functions(1)  
PUOExn  
PUOVxn  
1
PUD  
0
DDOExn  
DDOVxn  
1
Q
D
0
DDxn  
Q CLR  
WDx  
RDx  
PVOExn  
PVOVxn  
RESET  
1
0
Pxn  
Q
D
PORTxn  
Q CLR  
DIEOExn  
DIEOVxn  
SLEEP  
WRx  
RRx  
RESET  
1
0
SYNCHRONIZER  
RPx  
SET  
D
Q
D
L
Q
Q
PINxn  
CLR Q  
CLR  
clk I/O  
DIxn  
AIOxn  
PUOExn: Pxn PULL-UP OVERRIDE ENABLE  
PUOVxn: Pxn PULL-UP OVERRIDE VALUE  
DDOExn: Pxn DATA DIRECTION OVERRIDE ENABLE  
DDOVxn: Pxn DATA DIRECTION OVERRIDE VALUE  
PVOExn: Pxn PORT VALUE OVERRIDE ENABLE  
PVOVxn: Pxn PORT VALUE OVERRIDE VALUE  
PUD:  
WDx:  
RDx:  
RRx:  
WRx:  
RPx:  
PULLUP DISABLE  
WRITE DDRx  
READ DDRx  
READ PORTx REGISTER  
WRITE PORTx  
READ PORTx PIN  
DIEOExn: Pxn DIGITAL INPUT-ENABLE OVERRIDE ENABLE  
DIEOVxn: Pxn DIGITAL INPUT-ENABLE OVERRIDE VALUE  
clkI/O  
DIxn:  
AIOxn:  
:
I/O CLOCK  
DIGITAL INPUT PIN n ON PORTx  
ANALOG INPUT/OUTPUT PIN n ON PORTx  
SLEEP:  
SLEEP CONTROL  
Note:  
1. WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP,  
and PUD are common to all ports. All other signals are unique for each pin.  
68  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 28 summarizes the function of the overriding signals. The pin and port indexes from Fig-  
ure 32 are not shown in the succeeding tables. The overriding signals are generated internally in  
the modules having the alternate function.  
Table 28. Generic Description of Overriding Signals for Alternate Functions.  
Signal Name Full Name  
Description  
PUOE  
PUOV  
DDOE  
DDOV  
PVOE  
Pull-up Override  
Enable  
If this signal is set, the pull-up enable is controlled by the  
PUOV signal. If this signal is cleared, the pull-up is  
enabled when {DDxn, PORTxn, PUD} = 0b010.  
Pull-up Override  
Value  
If PUOE is set, the pull-up is enabled/disabled when  
PUOV is set/cleared, regardless of the setting of the  
DDxn, PORTxn, and PUD Register bits.  
Data Direction  
If this signal is set, the Output Driver Enable is controlled  
Override Enable by the DDOV signal. If this signal is cleared, the Output  
driver is enabled by the DDxn Register bit.  
Data Direction  
Override Value  
If DDOE is set, the Output Driver is enabled/disabled  
when DDOV is set/cleared, regardless of the setting of the  
DDxn Register bit.  
Port Value  
If this signal is set and the Output Driver is enabled, the  
Override Enable port value is controlled by the PVOV signal. If PVOE is  
cleared, and the Output Driver is enabled, the port Value is  
controlled by the PORTxn Register bit.  
PVOV  
Port Value  
Override Value  
If PVOE is set, the port value is set to PVOV, regardless of  
the setting of the PORTxn Register bit.  
DIEOE  
Digital Input  
Enable Override  
Enable  
If this bit is set, the Digital Input Enable is controlled by the  
DIEOV signal. If this signal is cleared, the Digital Input  
Enable is determined by MCU state (Normal Mode, Sleep  
Modes).  
DIEOV  
DI  
Digital Input  
Enable Override  
Value  
If DIEOE is set, the Digital Input is enabled/disabled when  
DIEOV is set/cleared, regardless of the MCU state  
(Normal Mode, Sleep Modes).  
Digital Input  
This is the Digital Input to alternate functions. In the figure,  
the signal is connected to the output of the schmitt trigger  
but before the synchronizer. Unless the Digital Input is  
used as a clock source, the module with the alternate  
function will use its own synchronizer.  
AIO  
Analog  
Input/output  
This is the Analog Input/output to/from alternate functions.  
The signal is connected directly to the pad, and can be  
used bi-directionally.  
The following subsections shortly describe the alternate functions for each port, and relate the  
overriding signals to the alternate function. Refer to the alternate function description for further  
details.  
69  
2513K–AVR–07/09  
Special Function IO  
Register – SFIOR  
Bit  
7
6
XMBK  
R/W  
0
5
XMM2  
R/W  
0
4
XMM1  
R/W  
0
3
XMM0  
R/W  
0
2
1
PSR2  
R/W  
0
0
PSR310  
R/W  
0
TSM  
R/W  
0
PUD  
R/W  
0
SFIOR  
Read/Write  
Initial Value  
• Bit 2 – PUD: Pull-up Disable  
When this bit is written to one, the pull-ups in the I/O ports are disabled even if the DDxn and  
PORTxn Registers are configured to enable the pull-ups ({DDxn, PORTxn} = 0b01). See “Con-  
figuring the Pin” on page 64 for more details about this feature.  
Alternate Functions of Port A has an alternate function as the address low byte and data lines for the External Memory  
Port A  
Interface and as Pin Change Interrupt.  
Table 29. Port A Pins Alternate Functions  
Port Pin  
Alternate Function  
AD7 (External memory interface address and data bit 7)  
PCINT7 (Pin Change INTerrupt 7)  
PA7  
AD6 (External memory interface address and data bit 6)  
PCINT6 (Pin Change INTerrupt 6)  
PA6  
PA5  
PA4  
PA3  
PA2  
PA1  
PA0  
AD5 (External memory interface address and data bit 5)  
PCINT5 (Pin Change INTerrupt 5)  
AD4 (External memory interface address and data bit 4)  
PCINT4 (Pin Change INTerrupt 4)  
AD3 (External memory interface address and data bit 3)  
PCINT3 (Pin Change INTerrupt 3)  
AD2 (External memory interface address and data bit 2)  
PCINT2 (Pin Change INTerrupt 2)  
AD1 (External memory interface address and data bit 1)  
PCINT1 (Pin Change INTerrupt 1)  
AD0 (External memory interface address and data bit 0)  
PCINT0 (Pin Change INTerrupt 0)  
Table 30 and Table 31 relate the alternate functions of Port A to the overriding signals shown in  
Figure 32 on page 68.  
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ATmega162/V  
Table 30. Overriding Signals for Alternate Functions in PA7..PA4  
Signal  
Name  
PA7/AD7/  
PCINT7  
PA6/AD6/PCINT6  
PA5/AD5/PCINT5  
PA4/AD4/PCINT4  
PUOE  
PUOV  
SRE  
SRE  
SRE  
SRE  
~(WR + ADA(1)) •  
PORTA7  
~(WR + ADA) •  
PORTA6  
~(WR + ADA) •  
PORTA5  
~(WR + ADA) •  
PORTA4  
DDOE  
DDOV  
PVOE  
PVOV  
SRE  
SRE  
SRE  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
if (ADA) then  
A7  
if (ADA) then  
A6  
if (ADA) then  
A5  
if (ADA) then  
A4  
else  
else  
else  
else  
D7 OUTPUT  
• WR  
D6 OUTPUT  
• WR  
D5 OUTPUT  
• WR  
D4 OUTPUT  
• WR  
DIEOE(2 PCIE0 • PCINT7  
PCIE0 • PCINT6  
PCIE0 • PCINT5  
PCIE0 • PCINT4  
)
DIEOV  
DI(3)  
1
1
1
1
D7 INPUT/  
PCINT7  
D6 INPUT/  
PCINT6  
D5 INPUT/  
PCINT5  
D4 INPUT/  
PCINT4  
AIO  
Notes: 1. ADA is short for ADdress Active and represents the time when address is output. See “Exter-  
nal Memory Interface” on page 26.  
2. PCINTn is Pin Change Interrupt Enable bit n.  
3. PCINTn is Pin Change Interrupt input n.  
Table 31. Overriding Signals for Alternate Functions in PA3..PA0  
Signal  
Name  
PA3/AD3/  
PCINT3  
PA2/AD2/  
PCINT2  
PA1/AD1/  
PCINT1  
PA0/AD0/  
PCINT0  
PUOE  
PUOV  
SRE  
SRE  
SRE  
SRE  
~(WR + ADA) •  
PORTA3  
~(WR + ADA) •  
PORTA2  
~(WR + ADA) •  
PORTA1  
~(WR + ADA) •  
PORTA0  
DDOE  
DDOV  
PVOE  
PVOV  
SRE  
SRE  
SRE  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
WR + ADA  
SRE  
if (ADA) then  
A3  
if (ADA) then  
A2  
if (ADA) then  
A1  
if (ADA) then  
A0  
else  
else  
else  
else  
D3 OUTPUT  
• WR  
D2 OUTPUT  
• WR  
D1 OUTPUT  
• WR  
D0 OUTPUT  
• WR  
DIEOE(1)  
DIEOV  
DI(2)  
PCIE0 • PCINT3  
1
PCIE0 • PCINT2  
1
PCIE0 • PCINT1  
1
PCIE0 • PCINT0  
1
D3 INPUT  
/PCINT3  
D2 INPUT  
/PCINT2  
D1 INPUT  
/PCINT1  
D0 INPUT  
/PCINT0  
AIO  
Notes: 1. PCINT is Pin Change Interrupt Enable bit n.  
2. PCINT is Pin Change Interrupt input n.  
71  
2513K–AVR–07/09  
Alternate Functions Of The Port B pins with alternate functions are shown in Table 32.  
Port B  
Table 32. Port B Pins Alternate Functions  
Port Pin  
PB7  
Alternate Functions  
SCK (SPI Bus Serial Clock)  
PB6  
MISO (SPI Bus Master Input/Slave Output)  
MOSI (SPI Bus Master Output/Slave Input)  
PB5  
SS (SPI Slave Select Input)  
PB4  
PB3  
PB2  
PB1  
OC3B (Timer/Counter3 Output Compare Match Output)  
AIN1 (Analog Comparator Negative Input)  
TXD1 (USART1 Output Pin)  
AIN0 (Analog Comparator Positive Input)  
RXD1 (USART1 Input Pin)  
T1 (Timer/Counter1 External Counter Input)  
OC2 (Timer/Counter2 Output Compare Match Output)  
T0 (Timer/Counter0 External Counter Input)  
OC0 (Timer/Counter0 Output Compare Match Output)  
clkI/O (Divided System Clock)  
PB0  
The alternate pin configuration is as follows:  
• SCK – Port B, Bit 7  
SCK: Master Clock output, Slave Clock input pin for SPI channel. When the SPI is enabled as a  
Slave, this pin is configured as an input regardless of the setting of DDB7. When the SPI is  
enabled as a Master, the data direction of this pin is controlled by DDB7. When the pin is forced  
by the SPI to be an input, the pull-up can still be controlled by the PORTB7 bit.  
• MISO – Port B, Bit 6  
MISO: Master Data input, Slave Data output pin for SPI channel. When the SPI is enabled as a  
Master, this pin is configured as an input regardless of the setting of DDB6. When the SPI is  
enabled as a Slave, the data direction of this pin is controlled by DDB6. When the pin is forced  
by the SPI to be an input, the pull-up can still be controlled by the PORTB6 bit.  
• MOSI – Port B, Bit 5  
MOSI: SPI Master Data output, Slave Data input for SPI channel. When the SPI is enabled as a  
Slave, this pin is configured as an input regardless of the setting of DDB5. When the SPI is  
enabled as a Master, the data direction of this pin is controlled by DDB5. When the pin is forced  
by the SPI to be an input, the pull-up can still be controlled by the PORTB5 bit.  
• SS/OC3B – Port B, Bit 4  
SS: Slave Select input. When the SPI is enabled as a slave, this pin is configured as an input  
regardless of the setting of DDB4. As a Slave, the SPI is activated when this pin is driven low.  
When the SPI is enabled as a Master, the data direction of this pin is controlled by DDB4. When  
the pin is forced by the SPI to be an input, the pull-up can still be controlled by the PORTB4 bit.  
OC3B, Output Compare Match B output: The PB4 pin can serve as an external output for the  
Timer/Counter3 Output Compare B. The pin has to be configured as an output (DDB4 set (one))  
to serve this function. The OC3B pin is also the output pin for the PWM mode timer function.  
72  
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2513K–AVR–07/09  
ATmega162/V  
• AIN1/TXD1 – Port B, Bit 3  
AIN1, Analog Comparator Negative input. Configure the port pin as input with the internal pull-up  
switched off to avoid the digital port function from interfering with the function of the Analog  
Comparator.  
TXD1, Transmit Data (Data output pin for USART1). When the USART1 Transmitter is enabled,  
this pin is configured as an output regardless of the value of DDB3.  
• AIN0/RXD1 – Port B, Bit 2  
AIN0, Analog Comparator Positive Input. Configure the port pin as input with the internal pull-up  
switched off to avoid the digital port function from interfering with the function of the Analog  
Comparator.  
RXD1, Receive Data (Data input pin for USART1). When the USART1 Receiver is enabled this  
pin is configured as an input regardless of the value of DDB2. When the USART1 forces this pin  
to be an input, the pull-up can still be controlled by the PORTB2 bit.  
• T1/OC2 – Port B, Bit 1  
T1, Timer/Counter1 Counter Source.  
OC2, Output Compare Match output: The PB1 pin can serve as an external output for the  
Timer/Counter2 Compare Match. The PB1 pin has to be configured as an output (DDB1 set  
(one)) to serve this function. The OC2 pin is also the output pin for the PWM mode timer  
function.  
• T0/OC0 – Port B, Bit 0  
T0, Timer/Counter0 counter source.  
OC0, Output Compare Match output: The PB0 pin can serve as an external output for the  
Timer/Counter0 Compare Match. The PB0 pin has to be configured as an output (DDB0 set  
(one)) to serve this function. The OC0 pin is also the output pin for the PWM mode timer  
function.  
clkI/O, Divided System Clock: The divided system clock can be output on the PB0 pin. The  
divided system clock will be output if the CKOUT Fuse is programmed, regardless of the  
PORTB0 and DDB0 settings. It will also be output during reset.  
Table 33 and Table 34 relate the alternate functions of Port B to the overriding signals shown in  
Figure 32 on page 68. SPI MSTR INPUT and SPI SLAVE OUTPUT constitute the MISO signal,  
while MOSI is divided into SPI MSTR OUTPUT and SPI SLAVE INPUT.  
73  
2513K–AVR–07/09  
Table 33. Overriding Signals for Alternate Functions in PB7..PB4  
Signal  
Name  
PUOE  
PUOV  
PB7/SCK  
PB6/MISO  
PB5/MOSI  
PB4/SS/OC3B  
SPE • MSTR  
SPE • MSTR  
PORTB6 • PUD  
SPE • MSTR  
PORTB5 • PUD  
SPE • MSTR  
PORTB7 •  
PUD  
PORTB4 •  
PUD  
DDOE  
DDOV  
PVOE  
SPE • MSTR  
0
SPE • MSTR  
0
SPE • MSTR  
0
SPE • MSTR  
0
SPE • MSTR  
SPE • MSTR  
SPE • MSTR  
OC3B  
ENABLE  
PVOV  
SCK OUTPUT  
SPI SLAVE  
OUTPUT  
SPI MSTR  
OUTPUT  
OC3B  
DIEOE  
DIEOV  
DI  
0
0
0
0
0
0
0
0
SCK INPUT  
SPI MSTR INPUT  
SPI SLAVE INPUT  
SPI SS  
AIO  
Table 34. Overriding Signals for Alternate Functions in PB3..PB0  
Signal Name  
PUOE  
PB3/AIN1/TXD1  
PB2/AIN0/RXD1  
PB1/T1/OC2  
PB0/T0/OC0  
TXEN1  
0
RXEN1  
0
0
PUOV  
PORTB2• PUD  
0
0
DDOE  
TXEN1  
1
RXEN1  
0
CKOUT(1)  
DDOV  
0
0
0
1
PVOE  
TXEN1  
OC2 ENABLE  
CKOUT + OC0  
ENABLE  
PVOV  
TXD1  
0
OC2  
if (CKOUT) then  
(2)  
clkI/O  
else  
OC0  
DIEOE  
DIEOV  
DI  
0
0
0
0
0
0
0
0
RXD1  
T1 INPUT  
T0 INPUT  
AIO  
AIN1 INPUT  
AIN0 INPUT  
Notes: 1. CKOUT is one if the CKOUT Fuse is programmed.  
2. clkI/O is the divided system clock.  
74  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Alternate Functions of The Port C pins with alternate functions are shown in Table 35. If the JTAG interface is enabled,  
Port C  
the pull-up resistors on pins PC7(TDI), PC5(TMS) and PC4(TCK) will be activated even if a reset  
occurs.  
Table 35. Port C Pins Alternate Functions  
Port Pin  
Alternate Function  
A15 (External memory interface address bit 15)  
TDI (JTAG Test Data Input)  
PC7  
PCINT15 (Pin Change INTerrupt 15)  
A14 (External memory interface address bit 14)  
TDO (JTAG Test Data Output)  
PC6  
PC5  
PC4  
PCINT14 (Pin Change INTerrupt 14)  
A13 (External memory interface address bit 13)  
TMS (JTAG Test Mode Select)  
PCINT13 (Pin Change INTerrupt 13)  
A12 (External memory interface address bit 12)  
TCK (JTAG Test Clock)  
PCINT12 (Pin Change INTerrupt 12)  
A11 (External memory interface address bit 11)  
PCINT11 (Pin Change INTerrupt 11)  
PC3  
PC2  
PC1  
PC0  
A10 (External memory interface address bit 10)  
PCINT10 (Pin Change INTerrupt 10)  
A9 (External memory interface address bit 9)  
PCINT9 (Pin Change INTerrupt 9)  
A8 (External memory interface address bit 8)  
PCINT8 (Pin Change INTerrupt 8)  
• A15/TDI/PCINT15 – Port C, Bit 7  
A15, External memory interface address bit 15.  
TDI, JTAG Test Data In: Serial input data to be shifted into the Instruction Register or Data Reg-  
ister (scan chains). When the JTAG interface is enabled, this pin can not be used as an I/O pin.  
PCINT15: The pin can also serve as a pin change interrupt.  
• A14/TDO/PCINT14 – Port C, Bit 6  
A14, External memory interface address bit 14.  
TDO, JTAG Test Data Out: Serial output data from Instruction Register or Data Register. When  
the JTAG interface is enabled, this pin can not be used as an I/O pin. In TAP states that shift out  
data, the TD0 pin drives actively. In other states the pin is pulled high.  
PCINT14: The pin can also serve as a pin change interrupt.  
75  
2513K–AVR–07/09  
• A13/TMS/PCINT13 – Port C, Bit 5  
A13, External memory interface address bit 13.  
TMS, JTAG Test Mode Select: This pin is used for navigating through the TAP-controller state  
machine. When the JTAG interface is enabled, this pin can not be used as an I/O pin.  
PCINT13: The pin can also serve as a pin change interrupt.  
• A12/TCK/PCINT12 – Port C, Bit 4  
A12, External memory interface address bit 12.  
TCK, JTAG Test Clock: JTAG operation is synchronous to TCK. When the JTAG interface is  
enabled, this pin can not be used as an I/O pin.  
PCINT12: The pin can also serve as a pin change interrupt.  
• A11/PCINT11 – Port C, Bit 3  
A11, External memory interface address bit 11.  
PCINT11: The pin can also serve as a pin change interrupt.  
• A10/PCINT10 – Port C, Bit 2  
A10, External memory interface address bit 10.  
PCINT11: The pin can also serve as a pin change interrupt.  
• A9/PCINT9 – Port C, Bit 1  
A9, External memory interface address bit 9.  
PCINT9: The pin can also serve as a pin change interrupt.  
• A8/PCINT8 – Port C, Bit 0  
A8, External memory interface address bit 8.  
PCINT8: The pin can also serve as a pin change interrupt.  
Table 36 and Table 37 relate the alternate functions of Port C to the overriding signals shown in  
Figure 32 on page 68.  
76  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 36. Overriding Signals for Alternate Functions in PC7..PC4  
PC7/A15/TDI  
/PCINT15  
PC6/A14/TDO  
/PCINT14  
PC5/A13/TMS  
/PCINT13  
PC4/A12/TCK  
/PCINT12  
Signal Name  
PUOE  
(XMM < 1) •  
(XMM < 2) •  
(XMM < 3) •  
(XMM < 4) •  
SRE + JTAGEN  
SRE +JTAGEN  
SRE + JTAGEN  
SRE + JTAGEN  
PUOV  
DDOE  
JTAGEN  
JTAGEN  
JTAGEN  
JTAGEN  
SRE • (XMM<1)  
+ JTAGEN  
SRE • (XMM<2)  
+ JTAGEN  
SRE • (XMM<3)  
+ JTAGEN  
SRE • (XMM<4)  
+ JTAGEN  
DDOV  
JTAGEN  
JTAGEN +  
JTAGEN •  
JTAGEN  
JTAGEN  
(SHIFT_IR |  
SHIFT_DR)  
PVOE  
PVOV  
SRE • (XMM<1)  
A15  
SRE • (XMM<2)  
+ JTAGEN  
SRE • (XMM<3)  
SRE • (XMM<4)  
A12  
if (JTAGEN) then A13  
TDO  
else  
A14  
DIEOE(1)  
JTAGEN |  
PCIE1 •  
JTAGEN | PCIE1  
• PCINT14  
JTAGEN |  
PCIE1 •  
JTAGEN |  
PCIE1 •  
PCINT15  
PCINT13  
PCINT12  
DIEOV  
DI(2)  
JTAGEN  
PCINT15  
TDI  
JTAGEN  
PCINT14  
JTAGEN  
PCINT13  
TMS  
JTAGEN  
PCINT12  
TCK  
AIO  
Notes: 1. PCINTn is Pin Change Interrupt Enable bit n.  
2. PCINTn is Pin Change Interrupt input n.  
Table 37. Overriding Signals for Alternate Functions in PC3..PC0  
PC3/A11/  
PCINT11  
PC2/A10/  
PCINT10  
Signal Name  
PUOE  
PC1/A9/PCINT9 PC0/A8/PCINT8  
SRE • (XMM<5)  
SRE • (XMM<6)  
SRE • (XMM<7)  
SRE • (XMM<7)  
PUOV  
0
0
0
0
DDOE  
SRE • (XMM<5)  
SRE • (XMM<6)  
SRE • (XMM<7)  
SRE • (XMM<7)  
DDOV  
1
1
1
1
PVOE  
SRE • (XMM<5)  
A11  
SRE • (XMM<6)  
A10  
SRE • (XMM<7)  
A9  
SRE • (XMM<7)  
A8  
PVOV  
DIEOE(1)  
PCIE1 •  
PCIE1 •  
PCIE1 • PCINT9 PCIE1 • PCINT8  
PCINT11  
PCINT10  
DIEOV  
DI(2)  
1
1
1
1
PCINT11  
PCINT10  
PCINT9  
PCINT8  
AIO  
Notes: 1. PCINTn is Pin Change Interrupt Enable bit n.  
2. PCINTn is Pin Change Interrupt input n.  
77  
2513K–AVR–07/09  
Alternate Functions of The Port D pins with alternate functions are shown in Table 38.  
Port D  
Table 38. Port D Pins Alternate Functions  
Port Pin  
PD7  
Alternate Function  
RD (Read strobe to external memory)  
WR (Write strobe to external memory)  
PD6  
TOSC2 (Timer Oscillator Pin 2)  
PD5  
PD4  
OC1A (Timer/Counter1 Output Compare A Match Output)  
TOSC1 (Timer Oscillator Pin 1)  
XCK0 (USART0 External Clock Input/Output)  
OC3A (Timer/Counter3 Output Compare A Match Output)  
INT1 (External Interrupt 1 Input)  
PD3  
PD2  
ICP3 (Timer/Counter3 Input Capture Pin)  
INT0 (External Interrupt 0 Input)  
XCK1 (USART1 External Clock Input/Output)  
PD1  
PD0  
TXD0 (USART0 Output Pin)  
RXD0 (USART0 Input Pin)  
The alternate pin configuration is as follows:  
• RD – Port D, Bit 7  
RD is the external data memory read control strobe.  
• WR – Port D, Bit 6  
WR is the external data memory write control strobe.  
• TOSC2/OC1A – Port D, Bit 5  
TOSC2, Timer Oscillator pin 2: When the AS2 bit in ASSR is set (one) to enable asynchronous  
clocking of Timer/Counter2, pin PD5 is disconnected from the port, and becomes the inverting  
output of the Oscillator amplifier. In this mode, a crystal Oscillator is connected to this pin, and  
the pin can not be used as an I/O pin.  
OC1A, Output Compare Match A output: The PD5 pin can serve as an external output for the  
Timer/Counter1 Output Compare A. The pin has to be configured as an output (DDD5 set (one))  
to serve this function. The OC1A pin is also the output pin for the PWM mode timer function.  
78  
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ATmega162/V  
• TOSC1/XCK0/OC3A – Port D, Bit 4  
TOSC1, Timer Oscillator pin 1: When the AS2 bit in ASSR is set (one) to enable asynchronous  
clocking of Timer/Counter2, pin PD4 is disconnected from the port, and becomes the input of the  
inverting Oscillator Amplifier. In this mode, a crystal Oscillator is connected to this pin, and the  
pin can not be used as an I/O pin.  
XCK0, USART0 External Clock: The Data Direction Register (DDD4) controls whether the clock  
is output (DDD4 set (one)) or input (DDD4 cleared (zero)). The XCK0 pin is active only when  
USART0 operates in Synchronous mode.  
OC3A, Output Compare Match A output: The PD4 pin can serve as an external output for the  
Timer/Counter1 Output Compare A. The pin has to be configured as an output (DDD4 set (one))  
to serve this function. The OC4A pin is also the output pin for the PWM mode timer function.  
• INT1/ICP3 – Port D, Bit 3  
INT1, External Interrupt Source 1: The PD3 pin can serve as an external interrupt source.  
ICP3, Input Capture Pin: The PD3 pin can act as an Input Capture pin for Timer/Counter3.  
• INT0/XCK1 – Port D, Bit 2  
INT0, External Interrupt Source 0: The PD2 pin can serve as an external interrupt source.  
XCK1, USART1 External Clock: The Data Direction Register (DDD2) controls whether the clock  
is output (DDD2 set (one)) or input (DDD2 cleared (zero)). The XCK1 pin is active only when  
USART1 operates in Synchronous mode.  
• TXD0 – Port D, Bit 1  
TXD0, Transmit Data (Data output pin for USART0). When the USART0 Transmitter is enabled,  
this pin is configured as an output regardless of the value of DDD1.  
79  
2513K–AVR–07/09  
• RXD0 – Port D, Bit 0  
RXD0, Receive Data (Data input pin for USART0). When the USART0 Receiver is enabled this  
pin is configured as an input regardless of the value of DDD0. When USART0 forces this pin to  
be an input, the pull-up can still be controlled by the PORTD0 bit.  
Table 39 and Table 40 relate the alternate functions of Port D to the overriding signals shown in  
Figure 32 on page 68.  
Table 39. Overriding Signals for Alternate Functions PD7..PD4  
Signal Name  
PUOE  
PD7/RD  
SRE  
0
PD6/WR  
SRE  
0
PD5/TOSC2/OC1A  
PD4/TOSC1/XCK0/OC3A  
AS2  
AS2  
0
PUOV  
0
DDOE  
SRE  
1
SRE  
1
AS2  
AS2  
0
DDOV  
0
PVOE  
SRE  
SRE  
OC1A ENABLE  
XCK0 OUTPUT ENABLE |  
OC3A ENABLE  
PVOV  
RD  
WR  
OC1A  
if (XCK0 OUTPUT  
ENABLE)then  
XCK0 OUTPUT  
else  
OC3A  
DIEOE  
DIEOV  
DI  
0
0
0
0
AS2  
AS2  
0
0
XCK0 INPUT  
T/C2 OSC INPUT  
AIO  
T/C2 OSC OUTPUT  
Table 40. Overriding Signals for Alternate Functions in PD3..PD0  
Signal Name PD3/INT1  
PD2/INT0/XCK1  
PD1/TXD0 PD0/RXD0  
PUOE  
PUOV  
DDOE  
DDOV  
PVOE  
PVOV  
DIEOE  
DIEOV  
DI  
0
0
0
0
0
0
0
TXEN0  
RXEN0  
0
0
PORTD0 • PUD  
0
TXEN0  
RXEN0  
0
1
0
XCK1 OUTPUT ENABLE  
XCK1  
TXEN0  
0
TXD0  
0
INT1 ENABLE INT0 ENABLE  
0
0
0
1
1
0
INT1 INPUT/  
ICP1 INPUT  
INT0 INPUT/XCK1 INPUT  
RXD0  
AIO  
80  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Alternate Functions of The Port E pins with alternate functions are shown in Table 41.  
Port E  
Table 41. Port E Pins Alternate Functions  
Port Pin  
PE2  
Alternate Function  
OC1B (Timer/Counter1 Output CompareB Match Output)  
ALE (Address Latch Enable to external memory)  
PE1  
ICP1 (Timer/Counter1 Input Capture Pin)  
INT2 (External Interrupt 2 Input)  
PE0  
The alternate pin configuration is as follows:  
• OC1B – Port E, Bit 2  
OC1B, Output Compare Match B output: The PE2 pin can serve as an external output for the  
Timer/Counter1 Output Compare B. The pin has to be configured as an output (DDE0 set (one))  
to serve this function. The OC1B pin is also the output pin for the PWM mode timer function.  
Table 42 relate the alternate functions of Port E to the overriding signals shown in Figure 32 on  
page 68.  
• ALE – Port E, Bit 1  
ALE is the external data memory Address Latch Enable signal.  
• ICP1/INT2 – Port E, Bit 0  
ICP1, Input Capture Pin: The PE0 pin can act as an Input Capture pin for Timer/Counter1.  
INT2, External Interrupt Source 2: The PE0 pin can serve as an external interrupt source.  
Table 42. Overriding Signals for Alternate Functions PE2..PE0  
Signal Name  
PUOE  
PUOV  
DDOE  
DDOV  
PVOE  
PVOV  
DIEOE  
DIEOV  
DI  
PE2  
PE1  
SRE  
0
PE0  
0
0
0
0
0
SRE  
1
0
0
0
OC1B ENABLE  
SRE  
ALE  
0
0
OC1B  
0
0
0
0
INT2 ENABLED  
0
1
0
INT2 INPUT/ ICP1 INPUT  
AIO  
81  
2513K–AVR–07/09  
Register  
Description for I/O-  
Ports  
Port A Data Register –  
PORTA  
Bit  
7
PORTA7  
R/W  
0
6
PORTA6  
R/W  
0
5
PORTA5  
R/W  
0
4
PORTA4  
R/W  
0
3
PORTA3  
R/W  
0
2
PORTA2  
R/W  
0
1
PORTA1  
R/W  
0
0
PORTA0  
R/W  
0
PORTA  
DDRA  
PINA  
Read/Write  
Initial Value  
Port A Data Direction  
Register – DDRA  
Bit  
7
DDA7  
R/W  
0
6
DDA6  
R/W  
0
5
DDA5  
R/W  
0
4
DDA4  
R/W  
0
3
DDA3  
R/W  
0
2
DDA2  
R/W  
0
1
DDA1  
R/W  
0
0
DDA0  
R/W  
0
Read/Write  
Initial Value  
Port A Input Pins  
Address – PINA  
Bit  
7
PINA7  
R
6
PINA6  
R
5
PINA5  
R
4
PINA4  
R
3
PINA3  
R
2
PINA2  
R
1
PINA1  
R
0
PINA0  
R
Read/Write  
Initial Value  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Port B Data Register –  
PORTB  
Bit  
7
PORTB7  
R/W  
0
6
PORTB6  
R/W  
0
5
PORTB5  
R/W  
0
4
PORTB4  
R/W  
0
3
PORTB3  
R/W  
0
2
PORTB2  
R/W  
0
1
PORTB1  
R/W  
0
0
PORTB0  
R/W  
0
PORTB  
DDRB  
PINB  
Read/Write  
Initial Value  
Port B Data Direction  
Register – DDRB  
Bit  
7
DDB7  
R/W  
0
6
DDB6  
R/W  
0
5
DDB5  
R/W  
0
4
DDB4  
R/W  
0
3
DDB3  
R/W  
0
2
DDB2  
R/W  
0
1
DDB1  
R/W  
0
0
DDB0  
R/W  
0
Read/Write  
Initial Value  
Port B Input Pins  
Address – PINB  
Bit  
7
PINB7  
R
6
PINB6  
R
5
PINB5  
R
4
PINB4  
R
3
PINB3  
R
2
PINB2  
R
1
PINB1  
R
0
PINB0  
R
Read/Write  
Initial Value  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Port C Data Register –  
PORTC  
Bit  
7
PORTC7  
R/W  
0
6
PORTC6  
R/W  
0
5
PORTC5  
R/W  
0
4
PORTC4  
R/W  
0
3
PORTC3  
R/W  
0
2
PORTC2  
R/W  
0
1
PORTC1  
R/W  
0
0
PORTC0  
R/W  
0
PORTC  
Read/Write  
Initial Value  
Port C Data Direction  
Register – DDRC  
Bit  
7
DDC7  
R/W  
0
6
DDC6  
R/W  
0
5
DDC5  
R/W  
0
4
DDC4  
R/W  
0
3
DDC3  
R/W  
0
2
DDC2  
R/W  
0
1
DDC1  
R/W  
0
0
DDC0  
R/W  
0
DDRC  
Read/Write  
Initial Value  
82  
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2513K–AVR–07/09  
ATmega162/V  
Port C Input Pins  
Address – PINC  
Bit  
7
PINC7  
R
6
PINC6  
R
5
PINC5  
R
4
PINC4  
R
3
PINC3  
R
2
PINC2  
R
1
PINC1  
R
0
PINC0  
R
PINC  
PORTD  
DDRD  
PIND  
Read/Write  
Initial Value  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Port D Data Register –  
PORTD  
Bit  
7
PORTD7  
R/W  
0
6
PORTD6  
R/W  
0
5
PORTD5  
R/W  
0
4
PORTD4  
R/W  
0
3
PORTD3  
R/W  
0
2
PORTD2  
R/W  
0
1
PORTD1  
R/W  
0
0
PORTD0  
R/W  
0
Read/Write  
Initial Value  
Port D Data Direction  
Register – DDRD  
Bit  
7
DDD7  
R/W  
0
6
DDD6  
R/W  
0
5
DDD5  
R/W  
0
4
DDD4  
R/W  
0
3
DDD3  
R/W  
0
2
DDD2  
R/W  
0
1
DDD1  
R/W  
0
0
DDD0  
R/W  
0
Read/Write  
Initial Value  
Port D Input Pins  
Address – PIND  
Bit  
7
PIND7  
R
6
PIND6  
R
5
PIND5  
R
4
PIND4  
R
3
PIND3  
R
2
PIND2  
R
1
PIND1  
R
0
PIND0  
R
Read/Write  
Initial Value  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Port E Data Register –  
PORTE  
Bit  
7
6
5
4
3
2
PORTE2  
R/W  
0
1
PORTE1  
R/W  
0
0
PORTE0  
R/W  
0
PORTE  
DDRE  
PINE  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
Port E Data Direction  
Register – DDRE  
Bit  
7
6
5
4
3
2
DDE2  
R/W  
0
1
DDE1  
R/W  
0
0
DDE0  
R/W  
0
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
Port E Input Pins  
Address – PINE  
Bit  
7
6
5
4
3
2
PINE2  
R
1
PINE1  
R
0
PINE0  
R
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
N/A  
N/A  
N/A  
83  
2513K–AVR–07/09  
External  
Interrupts  
The External Interrupts are triggered by the INT0, INT1, INT2 pin, or any of the PCINT15..0 pins.  
Observe that, if enabled, the interrupts will trigger even if the INT2..0 or PCINT15..0 pins are  
configured as outputs. This feature provides a way of generating a software interrupt. The Exter-  
nal Interrupts can be triggered by a falling or rising edge or a low level (INT2 is only an edge  
triggered interrupt). This is set up as indicated in the specification for the MCU Control Register  
– MCUCR and Extended MCU Control Register – EMCUCR. When the external interrupt is  
enabled and is configured as level triggered (only INT0/INT1), the interrupt will trigger as long as  
the pin is held low. The pin change interrupt PCI1 will trigger if any enabled PCINT15..8 pin tog-  
gles. Pin change interrupts PCI0 will trigger if any enabled PCINT7..0 pin toggles. The PCMSK1  
and PCMSK0 Registers control which pins contribute to the pin change interrupts. Note that rec-  
ognition of falling or rising edge interrupts on INT0 and INT1 requires the presence of an I/O  
clock, described in “Clock Systems and their Distribution” on page 35. Low level interrupts on  
INT0/INT1, the edge interrupt on INT2, and Pin change interrupts on PCINT15..0 are detected  
asynchronously. This implies that these interrupts can be used for waking the part also from  
sleep modes other than Idle mode. The I/O clock is halted in all sleep modes except Idle mode.  
Note that if a level triggered interrupt is used for wake-up from Power-down mode, the changed  
level must be held for some time to wake up the MCU. This makes the MCU less sensitive to  
noise. The changed level is sampled twice by the Watchdog Oscillator clock. The period of the  
Watchdog Oscillator is 1 µs (nominal) at 5.0V and 25°C. The frequency of the Watchdog Oscilla-  
tor is voltage dependent as shown in “Electrical Characteristics” on page 264. The MCU will  
wake up if the input has the required level during this sampling or if it is held until the end of the  
start-up time. The start-up time is defined by the SUT Fuses as described in “System Clock and  
Clock Options” on page 35. If the level is sampled twice by the Watchdog Oscillator clock but  
disappears before the end of the start-up time, the MCU will still wake up, but no interrupt will be  
generated. The required level must be held long enough for the MCU to complete the wake up to  
trigger the level interrupt.  
MCU Control Register The MCU Control Register contains control bits for interrupt sense control and general MCU  
– MCUCR  
functions.  
Bit  
7
6
SRW10  
R/W  
0
5
SE  
R/W  
0
4
3
ISC11  
R/W  
0
2
ISC10  
R/W  
0
1
ISC01  
R/W  
0
0
ISC00  
R/W  
0
SRE  
R/W  
0
SM1  
R/W  
0
MCUCR  
Read/Write  
Initial Value  
• Bit 3, 2 – ISC11, ISC10: Interrupt Sense Control 1 Bit 1 and Bit 0  
The External Interrupt 1 is activated by the external pin INT1 if the SREG I-bit and the corre-  
sponding interrupt mask in the GICR are set. The level and edges on the external INT1 pin that  
activate the interrupt are defined in Table 43. The value on the INT1 pin is sampled before  
detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock  
period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If  
low level interrupt is selected, the low level must be held until the completion of the currently  
executing instruction to generate an interrupt.  
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ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 43. Interrupt 1 Sense Control  
ISC11  
ISC10  
Description  
0
0
1
1
0
1
0
1
The low level of INT1 generates an interrupt request.  
Any logical change on INT1 generates an interrupt request.  
The falling edge of INT1 generates an interrupt request.  
The rising edge of INT1 generates an interrupt request.  
• Bit 1, 0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0  
The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corre-  
sponding interrupt mask are set. The level and edges on the external INT0 pin that activate the  
interrupt are defined in Table 44. The value on the INT0 pin is sampled before detecting edges.  
If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate  
an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is  
selected, the low level must be held until the completion of the currently executing instruction to  
generate an interrupt.  
Table 44. Interrupt 0 Sense Control  
ISC01  
ISC00  
Description  
0
0
1
1
0
1
0
1
The low level of INT0 generates an interrupt request.  
Any logical change on INT0 generates an interrupt request.  
The falling edge of INT0 generates an interrupt request.  
The rising edge of INT0 generates an interrupt request.  
Extended MCU  
Control Register –  
EMCUCR  
Bit  
7
6
SRL2  
R/W  
0
5
SRL1  
R/W  
0
4
SRL0  
R/W  
0
3
SRW01  
R/W  
0
2
SRW00  
R/W  
0
1
SRW11  
R/W  
0
0
SM0  
R/W  
0
ISC2  
R/W  
0
EMCUCR  
Read/Write  
Initial Value  
• Bit 0 – ISC2: Interrupt Sense Control 2  
The asynchronous External Interrupt 2 is activated by the external pin INT2 if the SREG I-bit and  
the corresponding interrupt mask in GICR are set. If ISC2 is cleared (zero), a falling edge on  
INT2 activates the interrupt. If ISC2 is set (one), a rising edge on INT2 activates the interrupt.  
Edges on INT2 are registered asynchronously. Pulses on INT2 wider than the minimum pulse  
width given in Table 45 will generate an interrupt. Shorter pulses are not guaranteed to generate  
an interrupt. When changing the ISC2 bit, an interrupt can occur. Therefore, it is recommended  
to first disable INT2 by clearing its Interrupt Enable bit in the GICR Register. Then, the ISC2 bit  
can be changed. Finally, the INT2 Interrupt Flag should be cleared by writing a logical one to its  
Interrupt Flag bit (INTF2) in the GIFR Register before the interrupt is re-enabled.  
Table 45. Asynchronous External Interrupt Characteristics  
Symbol Parameter  
Condition Min. Typ. Max. Units  
Minimum pulse width for  
asynchronous external interrupt  
tINT  
50 ns  
85  
2513K–AVR–07/09  
General Interrupt  
Control Register –  
GICR  
Bit  
7
6
5
4
PCIE1  
R/W  
0
3
PCIE0  
R/W  
0
2
1
IVSEL  
R/W  
0
0
IVCE  
R/W  
0
INT1  
R/W  
0
INT0  
R/W  
0
INT2  
R/W  
0
GICR  
Read/Write  
Initial Value  
R
0
• Bit 7 – INT1: External Interrupt Request 1 Enable  
When the INT1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the exter-  
nal pin interrupt is enabled. The Interrupt Sense Control1 bits 1/0 (ISC11 and ISC10) in the MCU  
general Control Register (MCUCR) define whether the external interrupt is activated on rising  
and/or falling edge of the INT1 pin or level sensed. Activity on the pin will cause an interrupt  
request even if INT1 is configured as an output. The corresponding interrupt of External Interrupt  
Request 1 is executed from the INT1 Interrupt Vector.  
• Bit 6 – INT0: External Interrupt Request 0 Enable  
When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the exter-  
nal pin interrupt is enabled. The Interrupt Sense Control0 bits 1/0 (ISC01 and ISC00) in the MCU  
general Control Register (MCUCR) define whether the external interrupt is activated on rising  
and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt  
request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt  
Request 0 is executed from the INT0 Interrupt Vector.  
• Bit 5 – INT2: External Interrupt Request 2 Enable  
When the INT2 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the exter-  
nal pin interrupt is enabled. The Interrupt Sense Control2 bit (ISC2) in the Extended MCU  
Control Register (EMCUCR) defines whether the external interrupt is activated on rising or fall-  
ing edge of the INT2 pin. Activity on the pin will cause an interrupt request even if INT2 is  
configured as an output. The corresponding interrupt of External Interrupt Request 2 is executed  
from the INT2 Interrupt Vector.  
• Bit 4 – PCIE1: Pin Change Interrupt Enable 1  
When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin  
change interrupt 1 is enabled. Any change on any enabled PCINT15..8 pin will cause an inter-  
rupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1  
Interrupt Vector. PCINT15..8 pins are enabled individually by the PCMSK1 Register.  
• Bit 3 – PCIE0: Pin Change Interrupt Enable 0  
When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin  
change interrupt 0 is enabled. Any change on any enabled PCINT7..0 pin will cause an interrupt.  
The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Interrupt  
Vector. PCINT7..0 pins are enabled individually by the PCMSK0 Register.  
86  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
General Interrupt Flag  
Register – GIFR  
Bit  
7
INTF1  
R/W  
0
6
INTF0  
R/W  
0
5
INTF2  
R/W  
0
4
PCIF1  
R/W  
0
3
PCIF0  
R/W  
0
2
1
0
R
0
GIFR  
Read/Write  
Initial Value  
R
0
R
0
• Bit 7 – INTF1: External Interrupt Flag 1  
When an edge or logic change on the INT1 pin triggers an interrupt request, INTF1 becomes set  
(one). If the I-bit in SREG and the INT1 bit in GICR are set (one), the MCU will jump to the corre-  
sponding Interrupt Vector. The flag is cleared when the interrupt routine is executed.  
Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared  
when INT1 is configured as a level interrupt.  
• Bit 6 – INTF0: External Interrupt Flag 0  
When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set  
(one). If the I-bit in SREG and the INT0 bit in GICR are set (one), the MCU will jump to the corre-  
sponding Interrupt Vector. The flag is cleared when the interrupt routine is executed.  
Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared  
when INT0 is configured as a level interrupt.  
• Bit 5 – INTF2: External Interrupt Flag 2  
When an event on the INT2 pin triggers an interrupt request, INTF2 becomes set (one). If the I-  
bit in SREG and the INT2 bit in GICR are set (one), the MCU will jump to the corresponding  
Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag  
can be cleared by writing a logical one to it. Note that when entering some sleep modes with the  
INT2 interrupt disabled, the input buffer on this pin will be disabled. This may cause a logic  
change in internal signals which will set the INTF2 flag. See “Digital Input Enable and Sleep  
Modes” on page 67 for more information.  
• Bit 4 – PCIF1: Pin Change Interrupt Flag 1  
When a logic change on any PCINT15..8 pin triggers an interrupt request, PCIF1 becomes set  
(one). If the I-bit in SREG and the PCIE1 bit in GICR are set (one), the MCU will jump to the cor-  
responding Interrupt Vector. The flag is cleared when the interrupt routine is executed.  
Alternatively, the flag can be cleared by writing a logical one to it.  
• Bit 3 – PCIF0: Pin Change Interrupt Flag 0  
When a logic change on any PCINT7..0 pin triggers an interrupt request, PCIF0 becomes set  
(one). If the I-bit in SREG and the PCIE0 bit in GICR are set (one), the MCU will jump to the cor-  
responding Interrupt Vector. The flag is cleared when the interrupt routine is executed.  
Alternatively, the flag can be cleared by writing a logical one to it.  
87  
2513K–AVR–07/09  
Pin Change Mask  
Register 1 – PCMSK1  
Bit  
7
PCINT15  
R/W  
0
6
PCINT14  
R/W  
0
5
PCINT13  
R/W  
0
4
PCINT12  
R/W  
0
3
PCINT11  
R/W  
0
2
PCINT10  
R/W  
0
1
PCINT9  
R/W  
0
0
PCINT9  
R/W  
0
PCMSK1  
Read/Write  
Initial Value  
• Bit 7..0 – PCINT15..8: Pin Change Enable Mask 15..8  
Each PCINT15..8 bit selects whether pin change interrupt is enabled on the corresponding I/O  
pin. If PCINT15..8 is set and the PCIE1 bit in GICR is set, pin change interrupt is enabled on the  
corresponding I/O pin. If PCINT15..8 is cleared, pin change interrupt on the corresponding I/O  
pin is disabled.  
Pin Change Mask  
Register 0 – PCMSK0  
Bit  
7
PCINT7  
R/W  
0
6
PCINT6  
R/W  
0
5
PCINT5  
R/W  
0
4
PCINT4  
R/W  
0
3
PCINT3  
R/W  
0
2
PCINT2  
R/W  
0
1
PCINT1  
R/W  
0
0
PCINT0  
R/W  
0
PCMSK0  
Read/Write  
Initial Value  
• Bit 7..0 – PCINT7..0: Pin Change Enable Mask 7..0  
Each PCINT7..0 bit selects whether pin change interrupt is enabled on the corresponding I/O  
pin. If PCINT7..0 is set and the PCIE0 bit in GICR is set, pin change interrupt is enabled on the  
corresponding I/O pin. If PCINT7..0 is cleared, pin change interrupt on the corresponding I/O pin  
is disabled.  
The mapping between I/O pins and PCINT bits can be found in Figure 1 on page 2. Note that the  
Pin Change Mask Register are located in Extended I/O. Thus, the pin change interrupts are not  
supported in ATmega161 compatibility mode.  
88  
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ATmega162/V  
8-bit  
Timer/Counter0  
with PWM  
Timer/Counter0 is a general purpose, single channel, 8-bit Timer/Counter module. The main  
features are:  
Single Channel Counter  
Clear Timer on Compare Match (Auto Reload)  
Glitch-free, Phase Correct Pulse Width Modulator (PWM)  
Frequency Generator  
External Event Counter  
10-bit Clock Prescaler  
Overflow and Compare Match Interrupt Sources (TOV0 and OCF0)  
Overview  
A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 33. For the actual place-  
ment of I/O pins, refer to “Pinout ATmega162” on page 2. CPU accessible I/O Registers,  
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-  
tions are listed in the “8-bit Timer/Counter Register Description” on page 100.  
Figure 33. 8-bit Timer/Counter Block Diagram  
TCCRn  
count  
TOVn  
(Int.Req.)  
clear  
Control Logic  
TOP  
Clock Select  
direction  
clk  
Tn  
Edge  
Detector  
Tn  
BOTTOM  
( From Prescaler )  
Timer/Counter  
TCNTn  
= 0  
= 0xFF  
OCn  
(Int.Req.)  
Waveform  
Generation  
OCn  
=
OCRn  
Registers  
The Timer/Counter (TCNT0) and Output Compare Register (OCR0) are 8-bit registers. Interrupt  
request (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag  
Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register  
(TIMSK). TIFR and TIMSK are not shown in the figure since these registers are shared by other  
timer units.  
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on  
the T0 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter  
uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source  
is selected. The output from the clock select logic is referred to as the timer clock (clkT0).  
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2513K–AVR–07/09  
The double buffered Output Compare Register (OCR0) is compared with the Timer/Counter  
value at all times. The result of the compare can be used by the Waveform Generator to gener-  
ate a PWM or variable frequency output on the Output Compare pin (OC0). See “Output  
Compare Unit” on page 91. for details. The Compare Match event will also set the Compare Flag  
(OCF0) which can be used to generate an output compare interrupt request.  
Definitions  
Many register and bit references in this section are written in general form. A lower case “n”  
replaces the Timer/Counter number, in this case 0. However, when using the register or bit  
defines in a program, the precise form must be used i.e., TCNT0 for accessing Timer/Counter0  
counter value and so on.  
The definitions in Table 46 are also used extensively throughout the document.  
Table 46. Definitions  
BOTTOM The counter reaches the BOTTOM when it becomes 0x00.  
MAX  
TOP  
The counter reaches its MAXimum when it becomes 0xFF (decimal 255).  
The counter reaches the TOP when it becomes equal to the highest  
value in the count sequence. The TOP value can be assigned to be the  
fixed value 0xFF (MAX) or the value stored in the OCR0 Register. The  
assignment is dependent on the mode of operation.  
Timer/Counter  
Clock Sources  
The Timer/Counter can be clocked by an internal or an external clock source. The clock source  
is selected by the Clock Select logic which is controlled by the Clock Select (CS02:0) bits  
located in the Timer/Counter Control Register (TCCR0). For details on clock sources and pres-  
caler, see “Timer/Counter0, Timer/Counter1, and Timer/Counter3 Prescalers” on page 104.  
90  
ATmega162/V  
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ATmega162/V  
Counter Unit  
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure  
34 shows a block diagram of the counter and its surroundings.  
Figure 34. Counter Unit Block Diagram  
TOVn  
(Int.Req.)  
DATA BUS  
Clock Select  
count  
clear  
Edge  
Detector  
Tn  
clkTn  
TCNTn  
Control Logic  
direction  
( From Prescaler )  
bottom  
top  
Signal description (internal signals):  
count Increment or decrement TCNT0 by 1.  
direction Select between increment and decrement.  
clear  
clkTn  
top  
Clear TCNT0 (set all bits to zero).  
Timer/Counter clock, referred to as clkT0 in the following.  
Signalize that TCNT0 has reached maximum value.  
Signalize that TCNT0 has reached minimum value (zero).  
bottom  
Depending of the mode of operation used, the counter is cleared, incremented, or decremented  
at each timer clock (clkT0). clkT0 can be generated from an external or internal clock source,  
selected by the clock select bits (CS02:0). When no clock source is selected (CS02:0 = 0) the  
timer is stopped. However, the TCNT0 value can be accessed by the CPU, regardless of  
whether clkT0 is present or not. A CPU write overrides (has priority over) all counter clear or  
count operations.  
The counting sequence is determined by the setting of the WGM01 and WGM00 bits located in  
the Timer/Counter Control Register (TCCR0). There are close connections between how the  
counter behaves (counts) and how waveforms are generated on the output Compare Output  
OC0. For more details about advanced counting sequences and waveform generation, see  
“Modes of Operation” on page 94.  
The Timer/Counter Overflow (TOV0) Flag is set according to the mode of operation selected by  
the WGM01:0 bits. TOV0 can be used for generating a CPU interrupt.  
Output Compare  
Unit  
The 8-bit comparator continuously compares TCNT0 with the Output Compare Register  
(OCR0). Whenever TCNT0 equals OCR0, the comparator signals a match. A match will set the  
Output Compare Flag (OCF0) at the next timer clock cycle. If enabled (OCIE0 = 1 and Global  
Interrupt Flag in SREG is set), the Output Compare Flag generates an output compare interrupt.  
The OCF0 Flag is automatically cleared when the interrupt is executed. Alternatively, the OCF0  
Flag can be cleared by software by writing a logical one to its I/O bit location. The waveform gen-  
erator uses the match signal to generate an output according to operating mode set by the  
WGM01:0 bits and Compare Output mode (COM01:0) bits. The max and bottom signals are  
used by the waveform generator for handling the special cases of the extreme values in some  
modes of operation (See “Modes of Operation” on page 94.).  
Figure 35 shows a block diagram of the output compare unit.  
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Figure 35. Output Compare Unit, Block Diagram  
DATA BUS  
OCRn  
TCNTn  
= (8-bit Comparator )  
OCFn (Int.Req.)  
top  
bottom  
FOCn  
Waveform Generator  
OCn  
WGMn1:0  
COMn1:0  
The OCR0 Register is double buffered when using any of the Pulse Width Modulation (PWM)  
modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the double  
buffering is disabled. The double buffering synchronizes the update of the OCR0 Compare Reg-  
ister to either top or bottom of the counting sequence. The synchronization prevents the  
occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.  
The OCR0 Register access may seem complex, but this is not case. When the double buffering  
is enabled, the CPU has access to the OCR0 Buffer Register, and if double buffering is disabled  
the CPU will access the OCR0 directly.  
Force Output  
Compare  
In non-PWM waveform generation modes, the match output of the comparator can be forced by  
writing a one to the Force Output Compare (FOC0) bit. Forcing Compare Match will not set the  
OCF0 Flag or reload/clear the Timer, but the OC0 pin will be updated as if a real Compare  
Match had occurred (the COM01:0 bits settings define whether the OC0 pin is set, cleared or  
toggled).  
Compare Match  
Blocking by TCNT0  
Write  
All CPU write operations to the TCNT0 Register will block any Compare Match that occur in the  
next timer clock cycle, even when the timer is stopped. This feature allows OCR0 to be initialized  
to the same value as TCNT0 without triggering an interrupt when the Timer/Counter clock is  
enabled.  
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Using the Output  
Compare Unit  
Since writing TCNT0 in any mode of operation will block all compare matches for one timer clock  
cycle, there are risks involved when changing TCNT0 when using the output compare channel,  
independently of whether the Timer/Counter is running or not. If the value written to TCNT0  
equals the OCR0 value, the Compare Match will be missed, resulting in incorrect waveform gen-  
eration. Similarly, do not write the TCNT0 value equal to BOTTOM when the counter is down-  
counting.  
The setup of the OC0 should be performed before setting the Data Direction Register for the port  
pin to output. The easiest way of setting the OC0 value is to use the Force Output Compare  
(FOC0) strobe bits in Normal mode. The OC0 Register keeps its value even when changing  
between Waveform Generation modes.  
Be aware that the COM01:0 bits are not double buffered together with the compare value.  
Changing the COM01:0 bits will take effect immediately.  
Compare Match  
Output Unit  
The Compare Output mode (COM01:0) bits have two functions. The Waveform Generator uses  
the COM01:0 bits for defining the Output Compare (OC0) state at the next Compare Match.  
Also, the COM01:0 bits control the OC0 pin output source. Figure 36 shows a simplified sche-  
matic of the logic affected by the COM01:0 bit setting. The I/O Registers, I/O bits, and I/O pins in  
the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and  
PORT) that are affected by the COM01:0 bits are shown. When referring to the OC0 state, the  
reference is for the internal OC0 Register, not the OC0 pin. If a System Reset occur, the OC0  
Register is reset to “0”.  
Figure 36. Compare Match Output Unit, Schematics  
COMn1  
Waveform  
Generator  
COMn0  
FOCn  
D
Q
Q
1
0
OCn  
Pin  
OCn  
D
PORT  
D
Q
DDR  
clkI/O  
The general I/O port function is overridden by the Output Compare (OC0) from the waveform  
generator if either of the COM01:0 bits are set. However, the OC0 pin direction (input or output)  
is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Regis-  
ter bit for the OC0 pin (DDR_OC0) must be set as output before the OC0 value is visible on the  
pin. The port override function is independent of the Waveform Generation mode.  
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The design of the output compare pin logic allows initialization of the OC0 state before the out-  
put is enabled. Note that some COM01:0 bit settings are reserved for certain modes of  
operation. See “8-bit Timer/Counter Register Description” on page 100.  
Compare Output Mode The Waveform Generator uses the COM01:0 bits differently in Normal, CTC, and PWM modes.  
and Waveform  
Generation  
For all modes, setting the COM01:0 = 0 tells the Waveform Generator that no action on the OC0  
Register is to be performed on the next Compare Match. For Compare Output actions in the  
non-PWM modes refer to Table 48 on page 101. For fast PWM mode, refer to Table 49 on page  
101, and for phase correct PWM refer to Table 50 on page 101.  
A change of the COM01:0 bits state will have effect at the first Compare Match after the bits are  
written. For non-PWM modes, the action can be forced to have immediate effect by using the  
FOC0 strobe bits.  
Modes of  
Operation  
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is  
defined by the combination of the Waveform Generation mode (WGM01:0) and Compare Output  
mode (COM01:0) bits. The Compare Output mode bits do not affect the counting sequence,  
while the Waveform Generation mode bits do. The COM01:0 bits control whether the PWM out-  
put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes  
the COM01:0 bits control whether the output should be set, cleared, or toggled at a Compare  
Match (See “Compare Match Output Unit” on page 93.).  
For detailed timing information refer to Figure 40, Figure 41, Figure 42 and Figure 43 in  
“Timer/Counter Timing Diagrams” on page 98.  
Normal Mode  
The simplest mode of operation is the Normal mode (WGM01:0 = 0). In this mode the counting  
direction is always up (incrementing), and no counter clear is performed. The counter simply  
overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bot-  
tom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV0) will be set in the same  
timer clock cycle as the TCNT0 becomes zero. The TOV0 Flag in this case behaves like a ninth  
bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt  
that automatically clears the TOV0 Flag, the timer resolution can be increased by software.  
There are no special cases to consider in the Normal mode, a new counter value can be written  
anytime.  
The output compare unit can be used to generate interrupts at some given time. Using the out-  
put compare to generate waveforms in Normal mode is not recommended, since this will occupy  
too much of the CPU time.  
Clear Timer on  
In Clear Timer on Compare or CTC mode (WGM01:0 = 2), the OCR0 Register is used to manip-  
Compare Match (CTC) ulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value  
Mode  
(TCNT0) matches the OCR0. The OCR0 defines the top value for the counter, hence also its  
resolution. This mode allows greater control of the Compare Match output frequency. It also sim-  
plifies the operation of counting external events.  
The timing diagram for the CTC mode is shown in Figure 37. The counter value (TCNT0)  
increases until a Compare Match occurs between TCNT0 and OCR0, and then counter (TCNT0)  
is cleared.  
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Figure 37. CTC Mode, Timing Diagram  
OCn Interrupt Flag Set  
TCNTn  
OCn  
(Toggle)  
(COMn1:0 = 1)  
1
2
3
4
Period  
An interrupt can be generated each time the counter value reaches the TOP value by using the  
OCF0 Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the  
TOP value. However, changing TOP to a value close to BOTTOM when the counter is running  
with none or a low prescaler value must be done with care since the CTC mode does not have  
the double buffering feature. If the new value written to OCR0 is lower than the current value of  
TCNT0, the counter will miss the Compare Match. The counter will then have to count to its max-  
imum value (0xFF) and wrap around starting at 0x00 before the Compare Match can occur.  
For generating a waveform output in CTC mode, the OC0 output can be set to toggle its logical  
level on each Compare Match by setting the Compare Output mode bits to toggle bitmode  
(COM01:0 = 1). The OC0 value will not be visible on the port pin unless the data direction for the  
pin is set to output. The waveform generated will have a maximum frequency of fOC0 = fclk_I/O/2  
when OCR0 is set to zero (0x00). The waveform frequency is defined by the following equation:  
f
clk_I/O  
f
= ----------------------------------------------  
OCn  
2 N ⋅ (1 + OCRn)  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle that the  
counter counts from MAX to 0x00.  
Fast PWM Mode  
The fast Pulse Width Modulation or fast PWM mode (WGM01:0 = 3) provides a high frequency  
PWM waveform generation option. The fast PWM differs from the other PWM option by its sin-  
gle-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. In  
non-inverting Compare Output mode, the Output Compare (OC0) is cleared on the Compare  
Match between TCNT0 and OCR0, and set at BOTTOM. In inverting Compare Output mode, the  
output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the  
operating frequency of the fast PWM mode can be twice as high as the phase correct PWM  
mode that use dual-slope operation. This high frequency makes the fast PWM mode well suited  
for power regulation, rectification, and DAC applications. High frequency allows physically small  
sized external components (coils, capacitors), and therefore reduces total system cost.  
In fast PWM mode, the counter is incremented until the counter value matches the MAX value.  
The counter is then cleared at the following timer clock cycle. The timing diagram for the fast  
PWM mode is shown in Figure 38. The TCNT0 value is in the timing diagram shown as a histo-  
gram for illustrating the single-slope operation. The diagram includes non-inverted and inverted  
PWM outputs. The small horizontal line marks on the TCNT0 slopes represent compare  
matches between OCR0 and TCNT0.  
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Figure 38. Fast PWM Mode, Timing Diagram  
OCRn Interrupt Flag Set  
OCRn Update ans  
TOVn Interrupt Flag Set  
TCNTn  
(COMn1:0 = 2)  
(COMn1:0 = 3)  
OCn  
OCn  
1
2
3
4
5
6
7
Period  
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches MAX. If the inter-  
rupt is enabled, the interrupt handler routine can be used for updating the compare value.  
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC0 pin. Set-  
ting the COM01:0 bits to two will produce a non-inverted PWM and an inverted PWM output can  
be generated by setting the COM01:0 to three (See Table 49 on page 101). The actual OC0  
value will only be visible on the port pin if the data direction for the port pin is set as output. The  
PWM waveform is generated by setting (or clearing) the OC0 Register at the Compare Match  
between OCR0 and TCNT0, and clearing (or setting) the OC0 Register at the timer clock cycle  
the counter is cleared (changes from MAX to BOTTOM).  
The PWM frequency for the output can be calculated by the following equation:  
f
clk_I/O  
f
= -----------------  
OCnPWM  
N 256  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
The extreme values for the OCR0 Register represents special cases when generating a PWM  
waveform output in the fast PWM mode. If the OCR0 is set equal to BOTTOM, the output will be  
a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0 equal to MAX will result in a  
constantly high or low output (depending on the polarity of the output set by the COM01:0 bits.)  
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-  
ting OC0 to toggle its logical level on each Compare Match (COM01:0 = 1). The waveform  
generated will have a maximum frequency of fOC0 = fclk_I/O/2 when OCR0 is set to zero. This fea-  
ture is similar to the OC0 toggle in CTC mode, except the double buffer feature of the output  
compare unit is enabled in the fast PWM mode.  
Phase Correct PWM  
Mode  
The phase correct PWM mode (WGM01:0 = 1) provides a high resolution phase correct PWM  
waveform generation option. The phase correct PWM mode is based on a dual-slope operation.  
The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In non-  
inverting Compare Output mode, the Output Compare (OC0) is cleared on the Compare Match  
between TCNT0 and OCR0 while up-counting, and set on the Compare Match while down-  
counting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation  
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has lower maximum operation frequency than single slope operation. However, due to the sym-  
metric feature of the dual-slope PWM modes, these modes are preferred for motor control  
applications.  
The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correct  
PWM mode the counter is incremented until the counter value matches MAX. When the counter  
reaches MAX, it changes the count direction. The TCNT0 value will be equal to MAX for one  
timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 39.  
The TCNT0 value is in the timing diagram shown as a histogram for illustrating the dual-slope  
operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal  
line marks on the TCNT0 slopes represent compare matches between OCR0 and TCNT0.  
Figure 39. Phase Correct PWM Mode, Timing Diagram  
OCn Interrupt Flag Set  
OCRn Update  
TOVn Interrupt Flag Set  
TCNTn  
(COMn1:0 = 2)  
OCn  
(COMn1:0 = 3)  
OCn  
1
2
3
Period  
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOTTOM. The  
Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM  
value.  
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the  
OC0 pin. Setting the COM01:0 bits to two will produce a non-inverted PWM. An inverted PWM  
output can be generated by setting the COM01:0 to three (See Table 50 on page 101). The  
actual OC0 value will only be visible on the port pin if the data direction for the port pin is set as  
output. The PWM waveform is generated by clearing (or setting) the OC0 Register at the Com-  
pare Match between OCR0 and TCNT0 when the counter increments, and setting (or clearing)  
the OC0 Register at Compare Match between OCR0 and TCNT0 when the counter decrements.  
The PWM frequency for the output when using phase correct PWM can be calculated by the fol-  
lowing equation:  
f
clk_I/O  
f
= -----------------  
OCnPCPWM  
N 510  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
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The extreme values for the OCR0 Register represent special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCR0 is set equal to BOTTOM, the out-  
put will be continuously low and if set equal to MAX the output will be continuously high for non-  
inverted PWM mode. For inverted PWM the output will have the opposite logic values.  
At the very start of period 2 in Figure 39 OCn has a transition from high to low even though there  
is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM.  
There are two cases that give a transition without Compare Match.  
OCR0 changes its value from MAX, like in Figure 39. When the OCR0 value is MAX the  
OCn pin value is the same as the result of a down-counting Compare Match. To ensure  
symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-  
counting Compare Match.  
The timer starts counting from a value higher than the one in OCR0, and for that reason  
misses the Compare Match and hence the OCn change that would have happened on the  
way up.  
Timer/Counter  
Timing Diagrams  
The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore shown as a  
clock enable signal in the following figures. The figures include information on when Interrupt  
Flags are set. Figure 40 contains timing data for basic Timer/Counter operation. The figure  
shows the count sequence close to the MAX value in all modes other than phase correct PWM  
mode.  
Figure 40. Timer/Counter Timing Diagram, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 41 shows the same timing data, but with the prescaler enabled.  
Figure 41. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 42 shows the setting of OCF0 in all modes except CTC mode.  
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Figure 42. Timer/Counter Timing Diagram, Setting of OCF0, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
OCRn  
OCFn  
OCRn - 1  
OCRn  
OCRn + 1  
OCRn + 2  
OCRn Value  
Figure 43 shows the setting of OCF0 and the clearing of TCNT0 in CTC mode.  
Figure 43. Timer/Counter Timing Diagram, Clear Timer on Compare Match Mode, with Pres-  
caler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
(CTC)  
TOP - 1  
TOP  
BOTTOM  
BOTTOM + 1  
OCRn  
TOP  
OCFn  
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8-bit  
Timer/Counter  
Register  
Description  
Timer/Counter Control  
Register – TCCR0  
Bit  
7
FOC0  
W
6
WGM00  
R/W  
0
5
COM01  
R/W  
0
4
COM00  
R/W  
0
3
WGM01  
R/W  
0
2
CS02  
R/W  
0
1
CS01  
R/W  
0
0
CS00  
R/W  
0
TCCR0  
Read/Write  
Initial Value  
0
• Bit 7 – FOC0: Force Output Compare  
The FOC0 bit is only active when the WGM00 bit specifies a non-PWM mode. However, for  
ensuring compatibility with future devices, this bit must be set to zero when TCCR0 is written  
when operating in PWM mode. When writing a logical one to the FOC0 bit, an immediate Com-  
pare Match is forced on the Waveform Generation unit. The OC0 output is changed according to  
its COM01:0 bits setting. Note that the FOC0 bit is implemented as a strobe. Therefore it is the  
value present in the COM01:0 bits that determines the effect of the forced compare.  
A FOC0 strobe will not generate any interrupt, nor will it clear the timer in CTC mode using  
OCR0 as TOP.  
The FOC0 bit is always read as zero.  
• Bit 6, 3 – WGM01:0: Waveform Generation Mode  
These bits control the counting sequence of the counter, the source for the maximum (TOP)  
counter value, and what type of waveform generation to be used. Modes of operation supported  
by the Timer/Counter unit are: Normal mode, Clear Timer on Compare match (CTC) mode, and  
two types of Pulse Width Modulation (PWM) modes. See Table 47 and “Modes of Operation” on  
page 94.  
Table 47. Waveform Generation Mode Bit Description(1)  
WGM01 WGM00 Timer/Counter Mode  
Update of TOV0 Flag  
OCR0 at Set on  
Mode  
(CTC0)  
(PWM0) of Operation  
TOP  
0xFF  
0xFF  
0
1
2
3
0
0
1
1
0
1
0
1
Normal  
Immediate MAX  
TOP BOTTOM  
PWM, Phase Correct  
CTC  
OCR0 Immediate MAX  
0xFF TOP MAX  
Fast PWM  
Note:  
1. The CTC0 and PWM0 bit definition names are now obsolete. Use the WGM01:0 definitions.  
However, the functionality and location of these bits are compatible with previous versions of  
the timer.  
• Bit 5:4 – COM01:0: Compare Match Output Mode  
These bits control the output compare pin (OC0) behavior. If one or both of the COM01:0 bits  
are set, the OC0 output overrides the normal port functionality of the I/O pin it is connected to.  
However, note that the Data Direction Register (DDR) bit corresponding to the OC0 pin must be  
set in order to enable the output driver.  
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When OC0 is connected to the pin, the function of the COM01:0 bits depends on the WGM01:0  
bit setting. Table 48 shows the COM01:0 bit functionality when the WGM01:0 bits are set to a  
Normal or CTC mode (non-PWM).  
Table 48. Compare Output Mode, non-PWM Mode  
COM01  
COM00  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC0 disconnected.  
Toggle OC0 on Compare Match.  
Clear OC0 on Compare Match.  
Set OC0 on Compare Match.  
Table 49 shows the COM01:0 bit functionality when the WGM01:0 bits are set to fast PWM  
mode.  
Table 49. Compare Output Mode, fast PWM Mode(1)  
COM01  
COM00  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC0 disconnected.  
Reserved  
Clear OC0 on Compare Match, set OC0 at TOP.  
Set OC0 on Compare Match, clear OC0 at TOP.  
Note:  
1. A special case occurs when OCR0 equals TOP and COM01 is set. In this case, the Compare  
Match is ignored, but the set or clear is done at TOP. See “Fast PWM Mode” on page 95 for  
more details.  
Table 50 shows the COM01:0 bit functionality when the WGM01:0 bits are set to phase correct  
PWM mode.  
Table 50. Compare Output Mode, Phase Correct PWM Mode(1)  
COM01  
COM00  
Description  
0
0
1
0
1
0
Normal port operation, OC0 disconnected.  
Reserved  
Clear OC0 on Compare Match when up-counting. Set OC0 on  
Compare Match when down-counting.  
1
1
Set OC0 on Compare Match when up-counting. Clear OC0 on  
Compare Match when down-counting.  
Note:  
1. A special case occurs when OCR0 equals TOP and COM01 is set. In this case, the Compare  
Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page  
96 for more details.  
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• Bit 2:0 – CS02:0: Clock Select  
The three Clock Select bits select the clock source to be used by the Timer/Counter.  
Table 51. Clock Select Bit Description  
CS02  
CS01  
CS00  
Description  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source (Timer/Counter stopped).  
clkI/O/(No prescaling)  
clkI/O/8 (From prescaler)  
clkI/O/64 (From prescaler)  
clkI/O/256 (From prescaler)  
clkI/O/1024 (From prescaler)  
External clock source on T0 pin. Clock on falling edge.  
External clock source on T0 pin. Clock on rising edge.  
If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the  
counter even if the pin is configured as an output. This feature allows software control of the  
counting.  
Timer/Counter  
Register – TCNT0  
Bit  
7
6
5
4
3
2
1
0
TCNT0[7:0]  
TCNT0  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Timer/Counter Register gives direct access, both for read and write operations, to the  
Timer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes) the Compare  
Match on the following timer clock. Modifying the counter (TCNT0) while the counter is running,  
introduces a risk of missing a Compare Match between TCNT0 and the OCR0 Register.  
Output Compare  
Register – OCR0  
Bit  
7
6
5
4
3
2
1
0
OCR0[7:0]  
OCR0  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Output Compare Register contains an 8-bit value that is continuously compared with the  
counter value (TCNT0). A match can be used to generate an output compare interrupt, or to  
generate a waveform output on the OC0 pin.  
Timer/Counter  
Interrupt Mask  
Register – TIMSK  
Bit  
7
TOIE1  
R/W  
0
6
OCIE1A  
R/W  
0
5
OCIE1B  
R/W  
0
4
OCIE2  
R/W  
0
3
TICIE1  
R/W  
0
2
TOIE2  
R/W  
0
1
TOIE0  
R/W  
0
0
OCIE0  
R/W  
0
TIMSK  
Read/Write  
Initial Value  
• Bit 1 – TOIE0: Timer/Counter0 Overflow Interrupt Enable  
When the TOIE0 bit is written to one, and the I-bit in the Status Register is set (one), the  
Timer/Counter0 Overflow interrupt is enabled. The corresponding interrupt is executed if an  
overflow in Timer/Counter0 occurs, i.e., when the TOV0 bit is set in the Timer/Counter Interrupt  
Flag Register – TIFR.  
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• Bit 0 – OCIE0: Timer/Counter0 Output Compare Match Interrupt Enable  
When the OCIE0 bit is written to one, and the I-bit in the Status Register is set (one), the  
Timer/Counter0 Compare Match interrupt is enabled. The corresponding interrupt is executed if  
a Compare Match in Timer/Counter0 occurs, i.e., when the OCF0 bit is set in the Timer/Counter  
Interrupt Flag Register – TIFR.  
Note:  
In ATmega161 OCIE2 and TOIE2 have switched places in the TIMSK register.  
Timer/Counter  
Interrupt Flag Register  
– TIFR  
Bit  
7
TOV1  
R/W  
0
6
OCF1A  
R/W  
0
5
OCF1B  
R/W  
0
4
OCF2  
R/W  
0
3
2
TOV2  
R/W  
0
1
TOV0  
R/W  
0
0
OCF0  
R/W  
0
ICF1  
R/W  
0
TIFR  
Read/Write  
Initial Value  
• Bit 1 – TOV0: Timer/Counter0 Overflow Flag  
The bit TOV0 is set (one) when an overflow occurs in Timer/Counter0. TOV0 is cleared by hard-  
ware when executing the corresponding interrupt handling vector. Alternatively, TOV0 is cleared  
by writing a logic one to the flag. When the SREG I-bit, TOIE0 (Timer/Counter0 Overflow Inter-  
rupt Enable), and TOV0 are set (one), the Timer/Counter0 Overflow interrupt is executed. In  
phase correct PWM mode, this bit is set when Timer/Counter0 changes counting direction at  
0x00.  
• Bit 0 – OCF0: Output Compare Flag 0  
The OCF0 bit is set (one) when a Compare Match occurs between the Timer/Counter0 and the  
data in OCR0 – Output Compare Register0. OCF0 is cleared by hardware when executing the  
corresponding interrupt handling vector. Alternatively, OCF0 is cleared by writing a logic one to  
the flag. When the I-bit in SREG, OCIE0 (Timer/Counter0 Compare match Interrupt Enable), and  
OCF0 are set (one), the Timer/Counter0 Compare Match Interrupt is executed.  
Note:  
In ATmega161 OCF2 and TOV2 have switched places in the TIFR register.  
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Timer/Counter0, Timer/Counter3, Timer/Counter1, and Timer/Counter0 share the same prescaler module, but  
the Timer/Counters can have different prescaler settings. The description below applies to  
Timer/Counter3, Timer/Counter1, and Timer/Counter0.  
Timer/Counter1,  
and  
Timer/Counter3  
Prescalers  
Internal Clock Source The Timer/Counter can be clocked directly by the system clock (by setting the CSn2:0 = 1). This  
provides the fastest operation, with a maximum Timer/Counter clock frequency equal to system  
clock frequency (fCLK_I/O). Alternatively, one of four taps from the prescaler can be used as a  
clock source. The prescaled clock has a frequency of either fCLK_I/O/8, fCLK_I/O/64, fCLK_I/O/256, or  
fCLK_I/O/1024. In addition, Timer/Counter3 has the option of choosing fCLK_I/O/16 and fCLK_I/O/32.  
Prescaler Reset  
The prescaler is free running, i.e., operates independently of the clock select logic of the  
Timer/Counter, and it is shared by Timer/Counter3, Timer/Counter1, and Timer/Counter0. Since  
the prescaler is not affected by the Timer/Counter’s clock select, the state of the prescaler will  
have implications for situations where a prescaled clock is used. One example of prescaling arti-  
facts occurs when the Timer is enabled and clocked by the prescaler (6 > CSn2:0 > 1). The  
number of system clock cycles from when the Timer is enabled to the first count occurs can be  
from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024,  
additional selections for Timer/Counter3: 32 and 64).  
It is possible to use the Prescaler Reset for synchronizing the Timer/Counter to program execu-  
tion. However, care must be taken if the other Timer/Counter that shares the same prescaler  
also uses prescaling. A Prescaler Reset will affect the prescaler period for all Timer/Counters it  
is connected to.  
External Clock Source An external clock source applied to the Tn/T0 pin can be used as Timer/Counter clock  
(clkT1/clkT0) for Timer/Counter1 and Timer/Counter0. The Tn/T0 pin is sampled once every sys-  
tem clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then  
passed through the edge detector. Figure 44 shows a functional equivalent block diagram of the  
Tn/T0 synchronization and edge detector logic. The registers are clocked at the positive edge of  
the internal system clock (clkI/O). The latch is transparent in the high period of the internal system  
clock.  
The edge detector generates one clkT1/clkT pulse for each positive (CSn2:0 = 7) or negative  
0
(CSn2:0 = 6) edge it detects.  
Figure 44. Tn/T0 Pin Sampling  
Tn_sync  
(To Clock  
Tn  
D
Q
D
Q
D
Q
Select Logic)  
LE  
clkI/O  
Synchronization  
Edge Detector  
The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles  
from an edge has been applied to the Tn/T0 pin to the counter is updated.  
Enabling and disabling of the clock input must be done when Tn/T0 has been stable for at least  
one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated.  
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Each half period of the external clock applied must be longer than one system clock cycle to  
ensure correct sampling. The external clock must be guaranteed to have less than half the sys-  
tem clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses  
sampling, the maximum frequency of an external clock it can detect is half the sampling fre-  
quency (Nyquist sampling theorem). However, due to variation of the system clock frequency  
and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is  
recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5.  
An external clock source can not be prescaled.  
Figure 45. Prescaler for Timer/Counter0, Timer/Counter1, and Timer/Counter3(1)  
CK  
10-BIT T/C PRESCALER  
Clear  
PSR321  
T1  
T0  
0
0
0
CS30  
CS31  
CS32  
CS10  
CS11  
CS12  
CS00  
CS01  
CS02  
TIMER/COUNTER3 CLOCK SOURCE  
TIMER/COUNTER1 CLOCK SOURCE  
TIMER/COUNTER1 CLOCK SOURCE  
clkT3  
clkT1  
clkT0  
Note:  
1. The synchronization logic on the input pins (Tn/T0) is shown in Figure 44.  
Special Function IO  
Register – SFIOR  
Bit  
7
6
XMBK  
R/W  
0
5
XMM2  
R/W  
0
4
XMM1  
R/W  
0
3
XMM0  
R/W  
0
2
1
PSR2  
R/W  
0
0
PSR310  
R/W  
0
TSM  
R/W  
0
PUD  
R/W  
0
SFIOR  
Read/Write  
Initial Value  
• Bit 7 – TSM: Timer/Counter Synchronization Mode  
Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the  
value that is written to the PSR2 and PSR310 bits is kept, hence keeping the corresponding  
prescaler reset signals asserted. This ensures that the corresponding Timer/Counters are halted  
and can be configured to the same value without the risk of one of them advancing during con-  
figuration. When the TSM bit is written to zero, the PSR2 and PSR310 bits are cleared by  
hardware, and the Timer/Counters start counting simultaneously.  
• Bit 0 – PSR310: Prescaler Reset Timer/Counter3, Timer/Counter1, and Timer/Counter0  
When this bit is one, the Timer/Counter3, Timer/Counter1, and Timer/Counter0 prescaler will be  
reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. Note  
that Timer/Counter3, Timer/Counter1, and Timer/Counter0 share the same prescaler and a  
reset of this prescaler will affect all three timers.  
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16-bit  
The 16-bit Timer/Counter unit allows accurate program execution timing (event management),  
wave generation, and signal timing measurement. The main features are:  
True 16-bit Design (i.e., allows 16-bit PWM)  
Two Independent Output Compare Units  
Double Buffered Output Compare Registers  
One Input Capture Unit  
Timer/Counter  
(Timer/Counter  
1 and  
Input Capture Noise Canceler  
Timer/Counter3  
)
Clear Timer on Compare Match (Auto Reload)  
Glitch-free, Phase Correct Pulse Width Modulator (PWM)  
Variable PWM Period  
Frequency Generator  
External Event Counter  
Eight Independent Interrupt Sources (TOV1, OCF1A, OCF1B, ICF1, TOV3, OCF3A, OCF3B, and  
ICF3)  
Restriction in  
ATmega161  
Compatibility  
Mode  
Note that in ATmega161 compatibility mode, only one 16-bits Timer/Counter is available  
(Timer/Counter1).  
Overview  
Most register and bit references in this section are written in general form. A lower case “n”  
replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit  
channel. However, when using the register or bit defines in a program, the precise form must be  
used i.e., TCNT1 for accessing Timer/Counter1 counter value and so on.  
A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 46. For the actual  
placement of I/O pins, refer to “Pinout ATmega162” on page 2. CPU accessible I/O Registers,  
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-  
tions are listed in the “16-bit Timer/Counter Register Description” on page 128.  
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Figure 46. 16-bit Timer/Counter Block Diagram(1)  
Count  
TOVn  
(Int.Req.)  
Clear  
Control Logic  
Direction  
Clock Select  
clkTn  
Edge  
Detector  
Tn  
TOP BOTTOM  
( From Prescaler )  
Timer/Counter  
TCNTn  
=
=
0
OCnA  
(Int.Req.)  
Waveform  
Generation  
OCnA  
OCnB  
=
OCRnA  
OCnB  
(Int.Req.)  
Fixed  
TOP  
Values  
Waveform  
Generation  
=
OCRnB  
( From Analog  
Comparator Ouput )  
ICFn (Int.Req.)  
Edge  
Detector  
Noise  
Canceler  
ICRn  
ICPn  
TCCRnA  
TCCRnB  
Note:  
1. Refer to Figure 1 on page 2, Table 32 on page 72, and Table 38 on page 78 for  
Timer/Counter1 pin placement and description.  
Registers  
The Timer/Counter (TCNTn), Output Compare Registers (OCRnA/B), and Input Capture Regis-  
ter (ICRn) are all 16-bit registers. Special procedures must be followed when accessing the 16-  
bit registers. These procedures are described in the section “Accessing 16-bit Registers” on  
page 109. The Timer/Counter Control Registers (TCCRnA/B) are 8-bit registers and have no  
CPU access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all  
visible in the Timer Interrupt Flag Register (TIFR) and Extended Timer Interrupt Flag Register  
(ETIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK)  
and Extended Timer Interrupt Mask Register (ETIMSK). (E)TIFR and (E)TIMSK are not shown in  
the figure since these registers are shared by other Timer units.  
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on  
the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter  
uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source  
is selected. The output from the Clock Select logic is referred to as the Timer Clock (clkTn).  
The double buffered Output Compare Registers (OCRnA/B) are compared with the Timer/Coun-  
ter value at all time. The result of the compare can be used by the waveform generator to  
generate a PWM or variable frequency output on the Output Compare pin (OCnA/B). See “Out-  
put Compare Units” on page 114. The Compare Match event will also set the Compare Match  
Flag (OCFnA/B) which can be used to generate an output compare interrupt request.  
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The Input Capture Register can capture the Timer/Counter value at a given external (edge trig-  
gered) event on either the Input Capture pin (ICPn) or on the Analog Comparator pins (See  
“Analog Comparator” on page 195.) The Input Capture unit includes a digital filtering unit (Noise  
Canceler) for reducing the chance of capturing noise spikes.  
The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined  
by either the OCRnA Register, the ICRn Register, or by a set of fixed values. When using  
OCRnA as TOP value in a PWM mode, the OCRnA Register can not be used for generating a  
PWM output. However, the TOP value will in this case be double buffered allowing the TOP  
value to be changed in run time. If a fixed TOP value is required, the ICRn Register can be used  
as an alternative, freeing the OCRnA to be used as PWM output.  
Definitions  
The following definitions are used extensively throughout the section:  
Table 52. Definitions  
BOTTOM The counter reaches the BOTTOM when it becomes 0x0000.  
MAX  
The counter reaches its MAXimum when it becomes 0xFFFF (decimal  
65535).  
TOP  
The counter reaches the TOP when it becomes equal to the highest  
value in the count sequence. The TOP value can be assigned to be one  
of the fixed values: 0x00FF, 0x01FF, or 0x03FF, or to the value stored in  
the OCRnA or ICRn Register. The assignment is dependent of the mode  
of operation.  
Compatibility  
The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit  
AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version  
regarding:  
All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt  
Registers.  
Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers.  
Interrupt Vectors.  
The following control bits have changed name, but have same functionality and register location:  
PWMn0 is changed to WGMn0.  
PWMn1 is changed to WGMn1.  
CTCn is changed to WGMn2.  
The following bits are added to the 16-bit Timer/Counter Control Registers:  
FOCnA and FOCnB are added to TCCRnA.  
WGMn3 is added to TCCRnB.  
The 16-bit Timer/Counter has improvements that will affect the compatibility in some special  
cases.  
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Accessing 16-bit  
Registers  
The TCNTn, OCRnA/B, and ICRn are 16-bit registers that can be accessed by the AVR CPU via  
the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations.  
Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16-bit  
access. The same Temporary Register is shared between all 16-bit registers within each 16-bit  
timer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a  
16-bit register is written by the CPU, the high byte stored in the temporary register, and the low  
byte written are both copied into the 16-bit register in the same clock cycle. When the low byte of  
a 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the tempo-  
rary register in the same clock cycle as the low byte is read.  
Not all 16-bit accesses uses the temporary register for the high byte. Reading the OCRnA/B 16-  
bit registers does not involve using the temporary register.  
To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the low  
byte must be read before the high byte.  
The following code examples show how to access the 16-bit Timer Registers assuming that no  
interrupts updates the temporary register. The same principle can be used directly for accessing  
the OCRnA/B and ICRn Registers. Note that when using “C”, the compiler handles the 16-bit  
access.  
Assembly Code Examples(1)  
...  
; Set TCNTn to 0x01FF  
ldi r17,0x01  
ldi r16,0xFF  
out TCNTnH,r17  
out TCNTnL,r16  
; Read TCNTn into r17:r16  
in r16,TCNTnL  
in r17,TCNTnH  
...  
C Code Examples(1)  
unsigned int i;  
...  
/* Set TCNTn to 0x01FF */  
TCNTn = 0x1FF;  
/* Read TCNTn into i */  
i = TCNTn;  
...  
Note:  
1. The example code assumes that the part specific header file is included.  
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”  
instructions must be replaced with instructions that allow access to extended I/O. Typically  
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.  
The assembly code example returns the TCNTn value in the r17:r16 register pair.  
It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt  
occurs between the two instructions accessing the 16-bit register, and the interrupt code  
updates the temporary register by accessing the same or any other of the 16-bit Timer Regis-  
ters, then the result of the access outside the interrupt will be corrupted. Therefore, when both  
the main code and the interrupt code update the temporary register, the main code must disable  
the interrupts during the 16-bit access.  
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The following code examples show how to do an atomic read of the TCNTn Register contents.  
Reading any of the OCRnA/B or ICRn Registers can be done by using the same principle.  
Assembly Code Example(1)  
TIM16_ReadTCNTn:  
; Save Global Inter?upt Flag  
in r18,SREG  
; Disable interrupt?  
cli  
; Read TCNTn into r17:r16  
in r16,TCNTnL  
in r17,TCNTnH  
; Restore Global In?errupt Flag  
out SREG,r18  
ret  
C Code Example(1)  
unsigned int TIM16_ReadTCNTn( void )  
{
unsigned char sreg;  
unsigned int i;  
/* Save Global Inte?rupt Flag */  
sreg = SREG;  
/* Disable interrup?s */  
_CLI();  
/* Read TCNTn into i */  
i = TCNTn;  
/* Restore Global I?terrupt Flag */  
SREG = sreg;  
return i;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”  
instructions must be replaced with instructions that allow access to extended I/O. Typically  
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.  
The assembly code example returns the TCNTn value in the r17:r16 register pair.  
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The following code examples show how to do an atomic write of the TCNTn Register contents.  
Writing any of the OCRnA/B or ICRn Registers can be done by using the same principle.  
Assembly Code Example(1)  
TIM16_WriteTCNTn:  
; Save Global Inter?upt Flag  
in r18,SREG  
; Disable interrupt?  
cli  
; Set TCNTn to r17:r16  
out TCNTnH,r17  
out TCNTnL,r16  
; Restore Global In?errupt Flag  
out SREG,r18  
ret  
C Code Example(1)  
void TIM16_WriteTCNTn( unsigned int i )  
{
unsigned char sreg;  
unsigned int i;  
/* Save Global Inte?rupt Flag */  
sreg = SREG;  
/* Disable interrup?s */  
_CLI();  
/* Set TCNTn to i */  
TCNTn = i;  
/* Restore Global I?terrupt Flag */  
SREG = sreg;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”  
instructions must be replaced with instructions that allow access to extended I/O. Typically  
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.  
The assembly code example requires that the r17:r16 register pair contains the value to be writ-  
ten to TCNTn.  
Reusing the  
Temporary High Byte  
Register  
If writing to more than one 16-bit register where the high byte is the same for all registers written,  
then the high byte only needs to be written once. However, note that the same rule of atomic  
operation described previously also applies in this case.  
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Timer/Counter  
Clock Sources  
The Timer/Counter can be clocked by an internal or an external clock source. The clock source  
is selected by the clock select logic which is controlled by the Clock Select (CSn2:0) bits located  
in the Timer/Counter Control Register B (TCCRnB). For details on clock sources and prescaler,  
see “Timer/Counter0, Timer/Counter1, and Timer/Counter3 Prescalers” on page 104.  
Counter Unit  
The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit.  
Figure 47 shows a block diagram of the counter and its surroundings.  
Figure 47. Counter Unit Block Diagram  
DATA BUS (8-bit)  
TOVn  
(Int.Req.)  
TEMP (8-bit)  
Clock Select  
Count  
Clear  
Edge  
Detector  
Tn  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
clkTn  
Control Logic  
Direction  
TCNTn (16-bit Counter)  
( From Prescaler )  
TOP  
BOTTOM  
Signal description (internal signals):  
Count Increment or decrement TCNTn by 1.  
Direction Select between increment and decrement.  
Clear  
clkTn  
TOP  
Clear TCNTn (set all bits to zero).  
Timer/Counter clock.  
Signalize that TCNTn has reached maximum value.  
BOTTOM Signalize that TCNTn has reached minimum value (zero).  
The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNTnH) con-  
taining the upper eight bits of the counter, and Counter Low (TCNTnL) containing the lower eight  
bits. The TCNTnH Register can only be indirectly accessed by the CPU. When the CPU does an  
access to the TCNTnH I/O location, the CPU accesses the high byte temporary register (TEMP).  
The temporary register is updated with the TCNTnH value when the TCNTnL is read, and  
TCNTnH is updated with the temporary register value when TCNTnL is written. This allows the  
CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus.  
It is important to notice that there are special cases of writing to the TCNTn Register when the  
counter is counting that will give unpredictable results. The special cases are described in the  
sections where they are of importance.  
Depending on the mode of operation used, the counter is cleared, incremented, or decremented  
at each Timer Clock (clkTn). The clkTn can be generated from an external or internal clock  
source, selected by the Clock Select bits (CSn2:0). When no clock source is selected (CSn2:0 =  
0) the Timer is stopped. However, the TCNTn value can be accessed by the CPU, independent  
of whether clkTn is present or not. A CPU write overrides (has priority over) all counter clear or  
count operations.  
The counting sequence is determined by the setting of the Waveform Generation mode bits  
(WGMn3:0) located in the Timer/Counter Control Registers A and B (TCCRnA and TCCRnB).  
There are close connections between how the counter behaves (counts) and how waveforms  
are generated on the Output Compare outputs OCnx. For more details about advanced counting  
sequences and waveform generation, see “Modes of Operation” on page 118.  
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The Timer/Counter Overflow Flag (TOVn) is set according to the mode of operation selected by  
the WGMn3:0 bits. TOVn can be used for generating a CPU interrupt.  
Input Capture Unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give  
them a time-stamp indicating time of occurrence. The external signal indicating an event, or mul-  
tiple events, can be applied via the ICPn pin or alternatively, via the Analog Comparator unit.  
The time-stamps can then be used to calculate frequency, duty-cycle, and other features of the  
signal applied. Alternatively the time-stamps can be used for creating a log of the events.  
The Input Capture unit is illustrated by the block diagram shown in Figure 48. The elements of  
the block diagram that are not directly a part of the Input Capture unit are gray shaded. The  
small “n” in register and bit names indicates the Timer/Counter number.  
Figure 48. Input Capture Unit Block Diagram(1)  
DATA BUS (8-bit)  
TEMP (8-bit)  
ICRnH (8-bit)  
ICRnL (8-bit)  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
ICRn (16-bit Register)  
TCNTn (16-bit Counter)  
WRITE  
ACO*  
ACIC*  
ICNC  
ICES  
Analog  
Comparator  
Noise  
Canceler  
Edge  
Detector  
ICFn (Int.Req.)  
ICPn  
Note:  
1. The Analog Comparator Output (ACO) can only trigger the Timer/Counter1 ICP – not  
Timer/Counter3.  
When a change of the logic level (an event) occurs on the Input Capture pin (ICPn), alternatively  
on the Analog Comparator output (ACO), and this change confirms to the setting of the edge  
detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter  
(TCNTn) is written to the Input Capture Register (ICRn). The Input Capture Flag (ICFn) is set at  
the same system clock as the TCNTn value is copied into ICRn Register. If enabled (TICIEn =  
1), the Input Capture Flag generates an Input Capture interrupt. The ICFn Flag is automatically  
cleared when the interrupt is executed. Alternatively the ICFn Flag can be cleared by software  
by writing a logical one to its I/O bit location.  
Reading the 16-bit value in the Input Capture Register (ICRn) is done by first reading the low  
byte (ICRnL) and then the high byte (ICRnH). When the low byte is read the high byte is copied  
into the high byte temporary register (TEMP). When the CPU reads the ICRnH I/O location it will  
access the TEMP Register.  
The ICRn Register can only be written when using a Waveform Generation mode that utilizes  
the ICRn Register for defining the counter’s TOP value. In these cases the Waveform Genera-  
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tion mode (WGMn3:0) bits must be set before the TOP value can be written to the ICRn  
Register. When writing the ICRn Register the high byte must be written to the ICRnH I/O location  
before the low byte is written to ICRnL.  
For more information on how to access the 16-bit registers refer to “Accessing 16-bit Registers”  
on page 109.  
Input Capture Trigger  
Source  
The main trigger source for the Input Capture unit is the Input Capture pin (ICPn).  
Timer/Counter1 can alternatively use the Analog Comparator output as trigger source for the  
Input Capture unit. The Analog Comparator is selected as trigger source by setting the Analog  
Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register  
(ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag  
must therefore be cleared after the change.  
Both the Input Capture pin (ICPn) and the Analog Comparator output (ACO) inputs are sampled  
using the same technique as for the Tn pin (Figure 44 on page 104). The edge detector is also  
identical. However, when the noise canceler is enabled, additional logic is inserted before the  
edge detector, which increases the delay by four system clock cycles. Note that the input of the  
noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Wave-  
form Generation mode that uses ICRn to define TOP.  
An Input Capture can be triggered by software by controlling the port of the ICPn pin.  
Noise Canceler  
The Noise Canceler improves noise immunity by using a simple digital filtering scheme. The  
Noise Canceler input is monitored over four samples, and all four must be equal for changing the  
output that in turn is used by the edge detector.  
The Noise Canceler is enabled by setting the Input Capture Noise Canceler (ICNCn) bit in  
Timer/Counter Control Register B (TCCRnB). When enabled the noise canceler introduces addi-  
tional four system clock cycles of delay from a change applied to the input, to the update of the  
ICRn Register. The noise canceler uses the system clock and is therefore not affected by the  
prescaler.  
Using the Input  
Capture Unit  
The main challenge when using the Input Capture unit is to assign enough processor capacity  
for handling the incoming events. The time between two events is critical. If the processor has  
not read the captured value in the ICRn Register before the next event occurs, the ICRn will be  
overwritten with a new value. In this case the result of the capture will be incorrect.  
When using the Input Capture interrupt, the ICRn Register should be read as early in the inter-  
rupt handler routine as possible. Even though the Input Capture interrupt has relatively high  
priority, the maximum interrupt response time is dependent on the maximum number of clock  
cycles it takes to handle any of the other interrupt requests.  
Using the Input Capture unit in any mode of operation when the TOP value (resolution) is  
actively changed during operation, is not recommended.  
Measurement of an external signal’s duty cycle requires that the trigger edge is changed after  
each capture. Changing the edge sensing must be done as early as possible after the ICRn  
Register has been read. After a change of the edge, the Input Capture Flag (ICFn) must be  
cleared by software (writing a logical one to the I/O bit location). For measuring frequency only,  
the clearing of the ICFn Flag is not required (if an interrupt handler is used).  
Output Compare  
Units  
The 16-bit comparator continuously compares TCNTn with the Output Compare Register  
(OCRnx). If TCNT equals OCRnx the comparator signals a match. A match will set the Output  
Compare Flag (OCFnx) at the next timer clock cycle. If enabled (OCIEnx = 1), the Output Com-  
pare Flag generates an output compare interrupt. The OCFnx Flag is automatically cleared  
when the interrupt is executed. Alternatively the OCFnx Flag can be cleared by software by writ-  
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ing a logical one to its I/O bit location. The Waveform Generator uses the match signal to  
generate an output according to operating mode set by the Waveform Generation mode  
(WGMn3:0) bits and Compare Output mode (COMnx1:0) bits. The TOP and BOTTOM signals  
are used by the Waveform Generator for handling the special cases of the extreme values in  
some modes of operation (See “Modes of Operation” on page 118.)  
A special feature of output compare unit A allows it to define the Timer/Counter TOP value (i.e.,  
counter resolution). In addition to the counter resolution, the TOP value defines the period time  
for waveforms generated by the Waveform Generator.  
Figure 49 shows a block diagram of the output compare unit. The small “n” in the register and bit  
names indicates the device number (n = n for Timer/Counter n), and the “x” indicates output  
compare unit (A/B). The elements of the block diagram that are not directly a part of the output  
compare unit are gray shaded.  
Figure 49. Output Compare Unit, Block Diagram  
DATA BUS (8-bit)  
TEMP (8-bit)  
OCRnxH Buf. (8-bit)  
OCRnxL Buf. (8-bit)  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
OCRnx Buffer (16-bit Register)  
TCNTn (16-bit Counter)  
OCRnxH (8-bit)  
OCRnxL (8-bit)  
OCRnx (16-bit Register)  
=
(16-bit Comparator )  
OCFnx (Int.Req.)  
TOP  
OCnx  
Waveform Generator  
BOTTOM  
WGMn3:0  
COMnx1:0  
The OCRnx Register is double buffered when using any of the twelve Pulse Width Modulation  
(PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the dou-  
ble buffering is disabled. The double buffering synchronizes the update of the OCRnx Compare  
Register to either TOP or BOTTOM of the counting sequence. The synchronization prevents the  
occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.  
The OCRnx Register access may seem complex, but this is not case. When the double buffering  
is enabled, the CPU has access to the OCRnx Buffer Register, and if double buffering is dis-  
abled the CPU will access the OCRnx directly. The content of the OCR1x (Buffer or Compare)  
Register is only changed by a write operation (the Timer/Counter does not update this register  
automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high byte  
temporary register (TEMP). However, it is a good practice to read the low byte first as when  
accessing other 16-bit registers. Writing the OCRnx Registers must be done via the TEMP Reg-  
ister since the compare of all 16 bits is done continuously. The high byte (OCRnxH) has to be  
written first. When the high byte I/O location is written by the CPU, the TEMP Register will be  
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updated by the value written. Then when the low byte (OCRnxL) is written to the lower eight bits,  
the high byte will be copied into the upper eight bits of either the OCRnx buffer or OCRnx Com-  
pare Register in the same system clock cycle.  
For more information of how to access the 16-bit registers refer to “Accessing 16-bit Registers”  
on page 109.  
Force Output  
Compare  
In non-PWM waveform generation modes, the match output of the comparator can be forced by  
writing a one to the Force Output Compare (FOCnx) bit. Forcing Compare Match will not set the  
OCFnx Flag or reload/clear the timer, but the OCnx pin will be updated as if a real Compare  
Match had occurred (the COMn1:0 bits settings define whether the OCnx pin is set, cleared or  
toggled).  
Compare Match  
Blocking by TCNTn  
Write  
All CPU writes to the TCNTn Register will block any Compare Match that occurs in the next timer  
clock cycle, even when the timer is stopped. This feature allows OCRnx to be initialized to the  
same value as TCNTn without triggering an interrupt when the Timer/Counter clock is enabled.  
Using the Output  
Compare Unit  
Since writing TCNTn in any mode of operation will block all compare matches for one timer clock  
cycle, there are risks involved when changing TCNTn when using any of the output compare  
channels, independent of whether the Timer/Counter is running or not. If the value written to  
TCNTn equals the OCRnx value, the Compare Match will be missed, resulting in incorrect wave-  
form generation. Do not write the TCNTn equal to TOP in PWM modes with variable TOP  
values. The Compare Match for the TOP will be ignored and the counter will continue to  
0xFFFF. Similarly, do not write the TCNTn value equal to BOTTOM when the counter is down-  
counting.  
The setup of the OCnx should be performed before setting the Data Direction Register for the  
port pin to output. The easiest way of setting the OCnx value is to use the Force Output Com-  
pare (FOCnx) strobe bits in Normal mode. The OCnx Register keeps its value even when  
changing between Waveform Generation modes.  
Be aware that the COMnx1:0 bits are not double buffered together with the compare value.  
Changing the COMnx1:0 bits will take effect immediately.  
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Compare Match  
Output Unit  
The Compare Output mode (COMnx1:0) bits have two functions. The waveform generator uses  
the COMnx1:0 bits for defining the output compare (OCnx) state at the next Compare Match.  
Secondly the COMnx1:0 bits control the OCnx pin output source. Figure 50 shows a simplified  
schematic of the logic affected by the COMnx1:0 bit setting. The I/O Registers, I/O bits, and I/O  
pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers  
(DDR and PORT) that are affected by the COMnx1:0 bits are shown. When referring to the  
OCnx state, the reference is for the internal OCnx Register, not the OCnx pin. If a System Reset  
occur, the OCnx Register is reset to “0”.  
Figure 50. Compare Match Output Unit, Schematic  
COMnx1  
Waveform  
Generator  
COMnx0  
FOCnx  
D
Q
1
0
OCnx  
Pin  
OCnx  
D
Q
PORT  
D
Q
DDR  
clkI/O  
The general I/O port function is overridden by the output compare (OCnx) from the Waveform  
Generator if either of the COMnx1:0 bits are set. However, the OCnx pin direction (input or out-  
put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction  
Register bit for the OCnx pin (DDR_OCnx) must be set as output before the OCnx value is visi-  
ble on the pin. The port override function is generally independent of the Waveform Generation  
mode, but there are some exceptions. Refer to Table 53, Table 54 and Table 55 for details.  
The design of the output compare pin logic allows initialization of the OCnx state before the out-  
put is enabled. Note that some COMnx1:0 bit settings are reserved for certain modes of  
operation. See “16-bit Timer/Counter Register Description” on page 128.  
The COMnx1:0 bits have no effect on the Input Capture unit.  
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Compare Output Mode The Waveform Generator uses the COMnx1:0 bits differently in normal, CTC, and PWM modes.  
and Waveform  
Generation  
For all modes, setting the COMnx1:0 = 0 tells the Waveform Generator that no action on the  
OCnx Register is to be performed on the next Compare Match. For Compare Output actions in  
the non-PWM modes refer to Table 53 on page 128. For fast PWM mode refer to Table 54 on  
page 129, and for phase correct and phase and frequency correct PWM refer to Table 55 on  
page 129.  
A change of the COMnx1:0 bits state will have effect at the first Compare Match after the bits are  
written. For non-PWM modes, the action can be forced to have immediate effect by using the  
FOCnx strobe bits.  
Modes of  
Operation  
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is  
defined by the combination of the Waveform Generation mode (WGMn3:0) and Compare Output  
mode (COMnx1:0) bits. The Compare Output mode bits do not affect the counting sequence,  
while the Waveform Generation mode bits do. The COMnx1:0 bits control whether the PWM out-  
put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes  
the COMnx1:0 bits control whether the output should be set, cleared or toggle at a Compare  
Match (See “Compare Match Output Unit” on page 117.)  
For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 126.  
Normal Mode  
The simplest mode of operation is the Normal mode (WGMn3:0 = 0). In this mode the counting  
direction is always up (incrementing), and no counter clear is performed. The counter simply  
overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the  
BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOVn) will be set in  
the same timer clock cycle as the TCNTn becomes zero. The TOVn Flag in this case behaves  
like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow  
interrupt that automatically clears the TOVn Flag, the timer resolution can be increased by soft-  
ware. There are no special cases to consider in the normal mode, a new counter value can be  
written anytime.  
The Input Capture unit is easy to use in Normal mode. However, observe that the maximum  
interval between the external events must not exceed the resolution of the counter. If the interval  
between events are too long, the timer overflow interrupt or the prescaler must be used to  
extend the resolution for the capture unit.  
The Output Compare units can be used to generate interrupts at some given time. Using the  
Output Compare to generate waveforms in Normal mode is not recommended, since this will  
occupy too much of the CPU time.  
Clear Timer on  
In Clear Timer on Compare or CTC mode (WGMn3:0 = 4 or 12), the OCRnA or ICRn Register  
Compare Match (CTC) are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when  
Mode  
the counter value (TCNTn) matches either the OCRnA (WGMn3:0 = 4) or the ICRn (WGMn3:0 =  
12). The OCRnA or ICRn define the top value for the counter, hence also its resolution. This  
mode allows greater control of the Compare Match output frequency. It also simplifies the oper-  
ation of counting external events.  
The timing diagram for the CTC mode is shown in Figure 51. The counter value (TCNTn)  
increases until a Compare Match occurs with either OCRnA or ICRn, and then counter (TCNTn)  
is cleared.  
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Figure 51. CTC Mode, Timing Diagram  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
TCNTn  
OCnA  
(Toggle)  
(COMnA1:0 = 1)  
1
2
3
4
Period  
An interrupt can be generated at each time the counter value reaches the TOP value by either  
using the OCFnA or ICFn Flag according to the register used to define the TOP value. If the  
interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. How-  
ever, changing the TOP to a value close to BOTTOM when the counter is running with none or a  
low prescaler value must be done with care since the CTC mode does not have the double buff-  
ering feature. If the new value written to OCRnA or ICRn is lower than the current value of  
TCNTn, the counter will miss the Compare Match. The counter will then have to count to its max-  
imum value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can occur.  
In many cases this feature is not desirable. An alternative will then be to use the fast PWM mode  
using OCRnA for defining TOP (WGMn3:0 = 15) since the OCRnA then will be double buffered.  
For generating a waveform output in CTC mode, the OCnA output can be set to toggle its logical  
level on each Compare Match by setting the Compare Output mode bits to toggle mode  
(COMnA1:0 = 1). The OCnA value will not be visible on the port pin unless the data direction for  
the pin is set to output (DDR_OCnA = 1). The waveform generated will have a maximum fre-  
quency of fOCnA = fclk_I/O/2 when OCRnA is set to zero (0x0000). The waveform frequency is  
defined by the following equation:  
f
clk_I/O  
f
= --------------------------------------------------  
OCnA  
2 N ⋅ (1 + OCRnA)  
The N variable represents the prescaler factor (1, 8, 64, 256, or 1024). For Timer/Counter3 also  
prescaler factors 16 and 32 are available.  
As for the Normal mode of operation, the TOVn Flag is set in the same timer clock cycle that the  
counter counts from MAX to 0x0000.  
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Fast PWM Mode  
The fast Pulse Width Modulation or fast PWM mode (WGMn3:0 = 5,6,7,14, or 15) provides a  
high frequency PWM waveform generation option. The fast PWM differs from the other PWM  
options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts  
from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is set on  
the Compare Match between TCNTn and OCRnx, and cleared at TOP. In inverting Compare  
Output mode output is cleared on Compare Match and set at TOP. Due to the single-slope oper-  
ation, the operating frequency of the fast PWM mode can be twice as high as the phase correct  
and phase and frequency correct PWM modes that use dual-slope operation. This high fre-  
quency makes the fast PWM mode well suited for power regulation, rectification, and DAC  
applications. High frequency allows physically small sized external components (coils, capaci-  
tors), hence reduces total system cost.  
The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICRn or  
OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to 0x0003), and the max-  
imum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolution in bits can be  
calculated by using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
FPWM  
log(2)  
In fast PWM mode the counter is incremented until the counter value matches either one of the  
fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 5, 6, or 7), the value in ICRn (WGMn3:0 =  
14), or the value in OCRnA (WGMn3:0 = 15). The counter is then cleared at the following timer  
clock cycle. The timing diagram for the fast PWM mode is shown in Figure 52. The figure shows  
fast PWM mode when OCRnA or ICRn is used to define TOP. The TCNTn value is in the timing  
diagram shown as a histogram for illustrating the single-slope operation. The diagram includes  
non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes  
represent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set  
when a Compare Match occurs.  
Figure 52. Fast PWM Mode, Timing Diagram  
OCRnx / TOP Update  
and TOVn Interrupt Flag  
Set and OCnA Interrupt  
Flag Set or ICFn  
Interrupt Flag Set  
(Interrupt on TOP)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
5
6
7
8
Period  
The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches TOP. In addition  
the OCnA or ICFn Flag is set at the same timer clock cycle as TOVn is set when either OCRnA  
or ICRn is used for defining the TOP value. If one of the interrupts are enabled, the interrupt han-  
dler routine can be used for updating the TOP and compare values.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the compare registers. If the TOP value is lower than any of the com-  
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pare registers, a Compare Match will never occur between the TCNTn and the OCRnx. Note  
that when using fixed TOP values the unused bits are masked to zero when any of the OCRnx  
Registers are written.  
The procedure for updating ICRn differs from updating OCRnA when used for defining the TOP  
value. The ICRn Register is not double buffered. This means that if ICRn is changed to a low  
value when the counter is running with none or a low prescaler value, there is a risk that the new  
ICRn value written is lower than the current value of TCNTn. The result will then be that the  
counter will miss the Compare Match at the TOP value. The counter will then have to count to  
the MAX value (0xFFFF) and wrap around starting at 0x0000 before the Compare Match can  
occur. The OCRnA Register however, is double buffered. This feature allows the OCRnA I/O  
location to be written anytime. When the OCRnA I/O location is written the value written will be  
put into the OCRnA Buffer Register. The OCRnA Compare Register will then be updated with  
the value in the Buffer Register at the next timer clock cycle the TCNTn matches TOP. The  
update is done at the same timer clock cycle as the TCNTn is cleared and the TOVn Flag is set.  
Using the ICRn Register for defining TOP works well when using fixed TOP values. By using  
ICRn, the OCRnA Register is free to be used for generating a PWM output on OCnA. However,  
if the base PWM frequency is actively changed (by changing the TOP value), using the OCRnA  
as TOP is clearly a better choice due to its double buffer feature.  
In fast PWM mode, the compare units allow generation of PWM waveforms on the OCnx pins.  
Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an inverted PWM output  
can be generated by setting the COMnx1:0 to three (See Table on page 129). The actual OCnx  
value will only be visible on the port pin if the data direction for the port pin is set as output  
(DDR_OCnx). The PWM waveform is generated by setting (or clearing) the OCnx Register at  
the Compare Match between OCRnx and TCNTn, and clearing (or setting) the OCnx Register at  
the timer clock cycle the counter is cleared (changes from TOP to BOTTOM).  
The PWM frequency for the output can be calculated by the following equation:  
f
clk_I/O  
f
= ----------------------------------  
OCnxPWM  
N ⋅ (1 + TOP)  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). For Timer/Counter3 also  
prescaler factors 16 and 32 are available.  
The extreme values for the OCRnx Register represents special cases when generating a PWM  
waveform output in the fast PWM mode. If the OCRnx is set equal to BOTTOM (0x0000) the out-  
put will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCRnx equal to TOP  
will result in a constant high or low output (depending on the polarity of the output set by the  
COMnx1:0 bits.)  
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-  
ting OCnA to toggle its logical level on each Compare Match (COMnA1:0 = 1). This applies only  
if OCRnA is used to define the TOP value (WGMn3:0 = 15). The waveform generated will have  
a maximum frequency of fOCnA = fclk_I/O/2 when OCRnA is set to zero (0x0000). This feature is  
similar to the OCnA toggle in CTC mode, except the double buffer feature of the output compare  
unit is enabled in the fast PWM mode.  
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Phase Correct PWM  
Mode  
The phase correct Pulse Width Modulation or phase correct PWM mode (WGMn3:0 = 1, 2, 3,  
10, or 11) provides a high resolution phase correct PWM waveform generation option. The  
phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dual-  
slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from  
TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is  
cleared on the Compare Match between TCNTn and OCRnx while up-counting, and set on the  
Compare Match while down-counting. In inverting Output Compare mode, the operation is  
inverted. The dual-slope operation has lower maximum operation frequency than single slope  
operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes  
are preferred for motor control applications.  
The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined  
by either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to  
0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolu-  
tion in bits can be calculated by using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
PCPWM  
log(2)  
In phase correct PWM mode the counter is incremented until the counter value matches either  
one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 1, 2, or 3), the value in ICRn  
(WGMn3:0 = 10), or the value in OCRnA (WGMn3:0 = 11). The counter has then reached the  
TOP and changes the count direction. The TCNTn value will be equal to TOP for one timer clock  
cycle. The timing diagram for the phase correct PWM mode is shown on Figure 53. The figure  
shows phase correct PWM mode when OCRnA or ICRn is used to define TOP. The TCNTn  
value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The  
diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on  
the TCNTn slopes represent compare matches between OCRnx and TCNTn. The OCnx Inter-  
rupt Flag will be set when a Compare Match occurs.  
Figure 53. Phase Correct PWM Mode, Timing Diagram  
OCRnx/TOP Update and  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
TOVn Interrupt Flag Set  
(Interrupt on Bottom)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
Period  
The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches BOTTOM. When  
either OCRnA or ICRn is used for defining the TOP value, the OCnA or ICFn Flag is set accord-  
ingly at the same timer clock cycle as the OCRnx Registers are updated with the double buffer  
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value (at TOP). The Interrupt Flags can be used to generate an interrupt each time the counter  
reaches the TOP or BOTTOM value.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the compare registers. If the TOP value is lower than any of the com-  
pare registers, a Compare Match will never occur between the TCNTn and the OCRnx. Note  
that when using fixed TOP values, the unused bits are masked to zero when any of the OCRnx  
Registers are written. As the third period shown in Figure 53 illustrates, changing the TOP  
actively while the Timer/Counter is running in the phase correct mode can result in an unsym-  
metrical output. The reason for this can be found in the time of update of the OCRnx Register.  
Since the OCRnx update occurs at TOP, the PWM period starts and ends at TOP. This implies  
that the length of the falling slope is determined by the previous TOP value, while the length of  
the rising slope is determined by the new TOP value. When these two values differ the two  
slopes of the period will differ in length. The difference in length gives the unsymmetrical result  
on the output.  
It is recommended to use the phase and frequency correct mode instead of the phase correct  
mode when changing the TOP value while the Timer/Counter is running. When using a static  
TOP value there are practically no differences between the two modes of operation.  
In phase correct PWM mode, the compare units allow generation of PWM waveforms on the  
OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an inverted  
PWM output can be generated by setting the COMnx1:0 to three (See Table 55 on page 129).  
The actual OCnx value will only be visible on the port pin if the data direction for the port pin is  
set as output (DDR_OCnx). The PWM waveform is generated by setting (or clearing) the OCnx  
Register at the Compare Match between OCRnx and TCNTn when the counter increments, and  
clearing (or setting) the OCnx Register at Compare Match between OCRnx and TCNTn when  
the counter decrements. The PWM frequency for the output when using phase correct PWM can  
be calculated by the following equation:  
f
clk_I/O  
f
= ---------------------------  
OCnxPCPWM  
2 N TOP  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). For Timer/Counter3 also  
prescaler factors 16 and 32 are available.  
The extreme values for the OCRnx Register represent special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCRnx is set equal to BOTTOM the  
output will be continuously low and if set equal to TOP the output will be continuously high for  
non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. If  
OCRnA is used to define the TOP value (WGMn3:0 = 11) and COMnA1:0 = 1, the OCnA output  
will toggle with a 50% duty cycle.  
Phase and Frequency The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM  
Correct PWM Mode  
mode (WGMn3:0 = 8 or 9) provides a high resolution phase and frequency correct PWM wave-  
form generation option. The phase and frequency correct PWM mode is, like the phase correct  
PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM  
(0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the  
Output Compare (OCnx) is cleared on the Compare Match between TCNTn and OCRnx while  
up-counting, and set on the Compare Match while down-counting. In inverting Compare Output  
mode, the operation is inverted. The dual-slope operation gives a lower maximum operation fre-  
quency compared to the single-slope operation. However, due to the symmetric feature of the  
dual-slope PWM modes, these modes are preferred for motor control applications.  
The main difference between the phase correct, and the phase and frequency correct PWM  
mode is the time the OCRnx Register is updated by the OCRnx Buffer Register, (see Figure 53  
and Figure 54).  
123  
2513K–AVR–07/09  
The PWM resolution for the phase and frequency correct PWM mode can be defined by either  
ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to 0x0003), and  
the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM resolution in bits can  
be calculated using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
PFCPWM  
log(2)  
In phase and frequency correct PWM mode the counter is incremented until the counter value  
matches either the value in ICRn (WGMn3:0 = 8), or the value in OCRnA (WGMn3:0 = 9). The  
counter has then reached the TOP and changes the count direction. The TCNTn value will be  
equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency  
correct PWM mode is shown on Figure 54. The figure shows phase and frequency correct PWM  
mode when OCRnA or ICRn is used to define TOP. The TCNTn value is in the timing diagram  
shown as a histogram for illustrating the dual-slope operation. The diagram includes non-  
inverted and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes repre-  
sent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a  
Compare Match occurs.  
Figure 54. Phase and Frequency Correct PWM Mode, Timing Diagram  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
OCRnx/TOP Update and  
TOVn Interrupt Flag Set  
(Interrupt on Bottom)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
Period  
The Timer/Counter Overflow Flag (TOVn) is set at the same timer clock cycle as the OCRnx  
Registers are updated with the double buffer value (at BOTTOM). When either OCRnA or ICRn  
is used for defining the TOP value, the OCnA or ICFn Flag set when TCNTn has reached TOP.  
The Interrupt Flags can then be used to generate an interrupt each time the counter reaches the  
TOP or BOTTOM value.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the compare registers. If the TOP value is lower than any of the com-  
pare registers, a Compare Match will never occur between the TCNTn and the OCRnx.  
As Figure 54 shows the output generated is, in contrast to the phase correct mode, symmetrical  
in all periods. Since the OCRnx Registers are updated at BOTTOM, the length of the rising and  
the falling slopes will always be equal. This gives symmetrical output pulses and is therefore fre-  
quency correct.  
124  
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ATmega162/V  
Using the ICRn Register for defining TOP works well when using fixed TOP values. By using  
ICRn, the OCRnA Register is free to be used for generating a PWM output on OCnA. However,  
if the base PWM frequency is actively changed by changing the TOP value, using the OCRnA as  
TOP is clearly a better choice due to its double buffer feature.  
In phase and frequency correct PWM mode, the compare units allow generation of PWM wave-  
forms on the OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and  
an inverted PWM output can be generated by setting the COMnx1:0 to three (See Table 55 on  
page 129). The actual OCnx value will only be visible on the port pin if the data direction for the  
port pin is set as output (DDR_OCnx). The PWM waveform is generated by setting (or clearing)  
the OCnx Register at the Compare Match between OCRnx and TCNTn when the counter incre-  
ments, and clearing (or setting) the OCnx Register at Compare Match between OCRnx and  
TCNTn when the counter decrements. The PWM frequency for the output when using phase  
and frequency correct PWM can be calculated by the following equation:  
f
clk_I/O  
f
= ---------------------------  
OCnxPFCPWM  
2 N TOP  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). For Timer/Counter3 also  
prescaler factors 16 and 32 are available.  
The extreme values for the OCRnx Register represents special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCRnx is set equal to BOTTOM the  
output will be continuously low and if set equal to TOP the output will be set to high for non-  
inverted PWM mode. For inverted PWM the output will have the opposite logic values. If OCRnA  
is used to define the TOP value (WGMn3:0 = 9) and COMnA1:0 = 1, the OCnA output will toggle  
with a 50% duty cycle.  
125  
2513K–AVR–07/09  
Timer/Counter  
Timing Diagrams  
The Timer/Counter is a synchronous design and the timer clock (clkTn) is therefore shown as a  
clock enable signal in the following figures. The figures include information on when Interrupt  
Flags are set, and when the OCRnx Register is updated with the OCRnx buffer value (only for  
modes utilizing double buffering). Figure 55 shows a timing diagram for the setting of OCFnx.  
Figure 55. Timer/Counter Timing Diagram, Setting of OCFnx, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
OCRnx  
OCFnx  
OCRnx - 1  
OCRnx  
OCRnx + 1  
OCRnx + 2  
OCRnx Value  
Figure 56 shows the same timing data, but with the prescaler enabled.  
Figure 56. Timer/Counter Timing Diagram, Setting of OCFnx, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
OCRnx  
OCFnx  
OCRnx - 1  
OCRnx  
OCRnx + 1  
OCRnx + 2  
OCRnx Value  
Figure 57 shows the count sequence close to TOP in various modes. When using phase and  
frequency correct PWM mode the OCRnx Register is updated at BOTTOM. The timing diagrams  
will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on.  
The same renaming applies for modes that set the TOVn Flag at BOTTOM.  
126  
ATmega162/V  
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ATmega162/V  
Figure 57. Timer/Counter Timing Diagram, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
TOP - 1  
TOP - 1  
TOP  
TOP  
BOTTOM  
BOTTOM + 1  
TOP - 2  
(CTC and FPWM)  
TCNTn  
(PC and PFC PWM)  
TOP - 1  
TOVn (FPWM)  
and ICFn (if used  
as TOP)  
OCRnx  
(Update at TOP)  
Old OCRnx Value  
New OCRnx Value  
Figure 58 shows the same timing data, but with the prescaler enabled.  
Figure 58. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
TOP - 1  
TOP - 1  
TOP  
TOP  
BOTTOM  
TOP - 1  
BOTTOM + 1  
TOP - 2  
(CTC and FPWM)  
TCNTn  
(PC and PFC PWM)  
TOVn (FPWM)  
and ICFn (if used  
as TOP)  
OCRnx  
(Update at TOP)  
Old OCRnx Value  
New OCRnx Value  
127  
2513K–AVR–07/09  
16-bit  
Timer/Counter  
Register  
Description  
Timer/Counter1  
Control Register A –  
TCCR1A  
Bit  
7
COM1A1  
R/W  
6
COM1A0  
R/W  
5
COM1B1  
R/W  
4
COM1B0  
R/W  
3
FOC1A  
W
2
FOC1B  
W
1
WGM11  
R/W  
0
0
WGM10  
R/W  
0
TCCR1A  
Read/Write  
Initial Value  
0
0
0
0
0
0
Timer/Counter3  
Control Register A –  
TCCR3A  
Bit  
7
COM3A1  
R/W  
6
COM3A0  
R/W  
5
COM3B1  
R/W  
4
COM3B0  
R/W  
3
FOC3A  
W
2
FOC3B  
W
1
WGM31  
R/W  
0
0
WGM30  
R/W  
0
TCCR3A  
Read/Write  
Initial Value  
0
0
0
0
0
0
• Bit 7:6 – COMnA1:0: Compare Output Mode for channel A  
• Bit 5:4 – COMnB1:0: Compare Output Mode for channel B  
The COMnA1:0 and COMnB1:0 control the Output Compare pins (OCnA and OCnB respec-  
tively) behavior. If one or both of the COMnA1:0 bits are written to one, the OCnA output  
overrides the normal port functionality of the I/O pin it is connected to. If one or both of the  
COMnB1:0 bit are written to one, the OCnB output overrides the normal port functionality of the  
I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit correspond-  
ing to the OCnA or OCnB pin must be set in order to enable the output driver.  
When the OCnA or OCnB is connected to the pin, the function of the COMnx1:0 bits is depen-  
dent of the WGMn3:0 bits setting. Table 53 shows the COMnx1:0 bit functionality when the  
WGMn3:0 bits are set to a normal or a CTC mode (non-PWM).  
Table 53. Compare Output Mode, non-PWM  
COMnA1/  
COMnB1  
COMnA0/  
COMnB0  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OCnA/OCnB disconnected.  
Toggle OCnA/OCnB on Compare Match.  
Clear OCnA/OCnB on Compare Match (Set output to low level).  
Set OCnA/OCnB on Compare Match (Set output to high level).  
128  
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ATmega162/V  
Table 54 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to the fast PWM  
mode.  
Table 54. Compare Output Mode, Fast PWM(1)  
COMnA1/  
COMnB1  
COMnA0/  
COMnB0  
Description  
0
0
0
1
Normal port operation, OCnA/OCnB disconnected.  
WGMn3:0 = 15: Toggle OCnA on Compare Match, OCnB  
disconnected (normal port operation). For all other WGMn  
settings, normal port operation, OCnA/OCnB disconnected.  
1
1
0
1
Clear OCnA/OCnB on Compare Match, set OCnA/OCnB at TOP.  
Set OCnA/OCnB on Compare Match, clear OCnA/OCnB at TOP.  
Note:  
1. A special case occurs when OCRnA/OCRnB equals TOP and COMnA1/COMnB1 is set. In  
this case the Compare Match is ignored, but the set or clear is done at TOP. See “Fast PWM  
Mode” on page 120. for more details.  
Table 55 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to the phase cor-  
rect or the phase and frequency correct, PWM mode.  
Table 55. Compare Output Mode, Phase Correct and Phase and Frequency Correct PWM(1)  
COMnA1/  
COMnB1  
COMnA0  
COMnB0  
Description  
0
0
0
1
Normal port operation, OCnA/OCnB disconnected.  
WGMn3:0 = 9 or 14: Toggle OCnA on Compare Match, OCnB  
disconnected (normal port operation). For all other WGMn  
settings, normal port operation, OCnA/OCnB disconnected.  
1
1
0
1
Clear OCnA/OCnB on Compare Match when up-counting. Set  
OCnA/OCnB on Compare Match when down-counting.  
Set OCnA/OCnB on Compare Match when up-counting. Clear  
OCnA/OCnB on Compare Match when down-counting.  
Note:  
1. A special case occurs when OCRnA/OCRnB equals TOP and COMnA1/COMnB1 is set. See  
“Phase Correct PWM Mode” on page 122. for more details.  
• Bit 3 – FOCnA: Force Output Compare for channel A  
• Bit 2 – FOCnB: Force Output Compare for channel B  
The FOCnA/FOCnB bits are only active when the WGMn3:0 bits specifies a non-PWM mode.  
However, for ensuring compatibility with future devices, these bits must be set to zero when  
TCCRnA is written when operating in a PWM mode. When writing a logical one to the  
FOCnA/FOCnB bit, an immediate Compare Match is forced on the Waveform Generation unit.  
The OCnA/OCnB output is changed according to its COMnx1:0 bits setting. Note that the  
FOCnA/FOCnB bits are implemented as strobes. Therefore it is the value present in the  
COMnx1:0 bits that determine the effect of the forced compare.  
A FOCnA/FOCnB strobe will not generate any interrupt nor will it clear the timer in Clear Timer  
on Compare match (CTC) mode using OCRnA as TOP.  
The FOCnA/FOCnB bits are always read as zero.  
129  
2513K–AVR–07/09  
• Bit 1:0 – WGMn1:0: Waveform Generation Mode  
Combined with the WGMn3:2 bits found in the TCCRnB Register, these bits control the counting  
sequence of the counter, the source for maximum (TOP) counter value, and what type of wave-  
form generation to be used, see Table 56. Modes of operation supported by the Timer/Counter  
unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode, and three types  
of Pulse Width Modulation (PWM) modes. (See “Modes of Operation” on page 118.)  
Table 56. Waveform Generation Mode Bit Description(1)  
WGMn2  
(CTCn)  
WGMn1  
WGMn0  
Update of TOVn Flag  
OCRnx at Set on  
Mode WGMn3  
(PWMn1) (PWMn0) Timer/Counter Mode of Operation  
TOP  
0
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Normal  
0xFFFF Immediate MAX  
PWM, Phase Correct, 8-bit  
PWM, Phase Correct, 9-bit  
PWM, Phase Correct, 10-bit  
CTC  
0x00FF  
0x01FF  
0x03FF  
TOP  
TOP  
TOP  
BOTTOM  
BOTTOM  
BOTTOM  
2
3
4
OCRnA Immediate MAX  
5
Fast PWM, 8-bit  
0x00FF  
0x01FF  
0x03FF  
TOP  
TOP  
6
Fast PWM, 9-bit  
TOP  
TOP  
7
Fast PWM, 10-bit  
TOP  
TOP  
8
PWM, Phase and Frequency Correct ICRn  
BOTTOM  
BOTTOM  
BOTTOM  
BOTTOM  
BOTTOM  
9
PWM, Phase and Frequency Correct OCRnA BOTTOM  
10  
11  
12  
13  
14  
15  
Note:  
PWM, Phase Correct  
PWM, Phase Correct  
CTC  
ICRn  
TOP  
OCRnA TOP  
ICRn  
Immediate MAX  
Reserved  
Fast PWM  
ICRn  
TOP  
TOP  
TOP  
Fast PWM  
OCRnA TOP  
1. The CTCn and PWMn1:0 bit definition names are obsolete. Use the WGMn2:0 definitions. However, the functionality and  
location of these bits are compatible with previous versions of the timer.  
130  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Timer/Counter1  
Control Register B –  
TCCR1B  
Bit  
7
ICNC1  
R/W  
0
6
ICES1  
R/W  
0
5
4
WGM13  
R/W  
0
3
WGM12  
R/W  
0
2
CS12  
R/W  
0
1
CS11  
R/W  
0
0
CS10  
R/W  
0
TCCR1B  
Read/Write  
Initial Value  
R
0
Timer/Counter3  
Control Register B –  
TCCR3B  
Bit  
7
ICNC3  
R/W  
0
6
ICES3  
R/W  
0
5
4
WGM33  
R/W  
0
3
WGM32  
R/W  
0
2
CS32  
R/W  
0
1
CS31  
R/W  
0
0
CS30  
R/W  
0
TCCR3B  
Read/Write  
Initial Value  
R
0
• Bit 7 – ICNCn: Input Capture Noise Canceler  
Setting this bit (to one) activates the Input Capture noise canceler. When the noise canceler is  
activated, the input from the Input Capture pin (ICPn) is filtered. The filter function requires four  
successive equal valued samples of the ICPn pin for changing its output. The Input Capture is  
therefore delayed by four Oscillator cycles when the noise canceler is enabled.  
• Bit 6 – ICESn: Input Capture Edge Select  
This bit selects which edge on the Input Capture pin (ICPn) that is used to trigger a capture  
event. When the ICESn bit is written to zero, a falling (negative) edge is used as trigger, and  
when the ICESn bit is written to one, a rising (positive) edge will trigger the capture.  
When a capture is triggered according to the ICESn setting, the counter value is copied into the  
Input Capture Register (ICRn). The event will also set the Input Capture Flag (ICFn), and this  
can be used to cause an Input Capture Interrupt, if this interrupt is enabled.  
When the ICRn is used as TOP value (see description of the WGMn3:0 bits located in the  
TCCRnA and the TCCRnB Register), the ICPn is disconnected and consequently the Input Cap-  
ture function is disabled.  
• Bit 5 – Reserved Bit  
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be  
written to zero when TCCRnB is written.  
• Bit 4:3 – WGMn3:2: Waveform Generation Mode  
See TCCRnA Register description.  
131  
2513K–AVR–07/09  
• Bit 2:0 – CSn2:0: Clock Select  
The three Clock Select bits select the clock source to be used by the Timer/Counter, see Figure  
55 and Figure 56.  
Table 57. Clock Select Bit Description Timer/Counter1  
CS12  
CS11  
CS10  
Description  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source. (Timer/Counter stopped).  
clkI/O/1 (No prescaling)  
clkI/O/8 (From prescaler)  
clkI/O/64 (From prescaler)  
clkI/O/256 (From prescaler)  
clkI/O/1024 (From prescaler)  
External clock source on T1 pin. Clock on falling edge.  
External clock source on T1 pin. Clock on rising edge.  
If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the  
counter even if the pin is configured as an output. This feature allows software control of the  
counting..  
Table 58. Clock Select Bit Description Timer/Counter3  
Description  
CS32  
CS31  
CS30  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source. (Timer/Counter stopped).  
clkI/O / 1 (No prescaling)  
clkI/O / 8 (From prescaler).  
clkI/O / 64 (From prescaler).  
clkI/O / 256 (From prescaler).  
clkI/O / 1024 (From prescaler).  
clkI/O / 16 (From prescaler).  
clkI/O / 32 (From prescaler).  
132  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Timer/Counter1 –  
TCNT1H and TCNT1L  
Bit  
7
6
5
4
3
2
1
0
TCNT1[15:8]  
TCNT1[7:0]  
TCNT1H  
TCNT1L  
R/W  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
R/W  
0
R/W  
0
0
0
0
Timer/Counter3 –  
TCNT3H and TCNT3L  
Bit  
7
6
5
4
3
2
1
0
TCNT3[15:8]  
TCNT3[7:0]  
TCNT3H  
TCNT3L  
R/W  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
R/W  
0
R/W  
0
0
0
0
The two Timer/Counter I/O locations (TCNTnH and TCNTnL, combined TCNTn) give direct  
access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To  
ensure that both the high and low bytes are read and written simultaneously when the CPU  
accesses these registers, the access is performed using an 8-bit temporary high byte register  
(TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit  
Registers” on page 109.  
Modifying the counter (TCNTn) while the counter is running introduces a risk of missing a Com-  
pare Match between TCNTn and one of the OCRnx Registers.  
Writing to the TCNTn Register blocks (removes) the Compare Match on the following timer clock  
for all compare units.  
Output Compare  
Register 1 A –  
OCR1AH and OCR1AL  
Bit  
7
6
5
4
3
2
1
0
OCR1A[15:8]  
OCR1A[7:0]  
OCR1AH  
OCR1AL  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
Output Compare  
Register 1 B –  
OCR1BH and OCR1BL  
Bit  
7
6
5
4
3
2
1
0
OCR1B[15:8]  
OCR1B[7:0]  
OCR1BH  
OCR1BL  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
Output Compare  
Register 3 A –  
OCR3AH and OCR3AL  
Bit  
7
6
5
4
3
2
1
0
OCR3A[15:8]  
OCR3A[7:0]  
OCR3AH  
OCR3AL  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
Output Compare  
Register 3 B –  
OCR3BH and OCR3BL  
Bit  
7
6
5
4
3
2
1
0
OCR3B[15:8]  
OCR3B[7:0]  
OCR3BH  
OCR3BL  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
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The Output Compare Registers contain a 16-bit value that is continuously compared with the  
counter value (TCNTn). A match can be used to generate an output compare interrupt, or to  
generate a waveform output on the OCnx pin.  
The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes are  
written simultaneously when the CPU writes to these registers, the access is performed using an  
8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16-  
bit registers. See “Accessing 16-bit Registers” on page 109.  
Input Capture Register  
1 – ICR1H and ICR1L  
Bit  
7
6
5
4
3
2
1
0
ICR1[15:8]  
ICR1[7:0]  
ICR1H  
ICR1L  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
Input Capture Register  
3 – ICR3H and ICR3L  
Bit  
7
6
5
4
3
2
1
0
ICR3[15:8]  
ICR3[7:0]  
ICR3H  
ICR3L  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
The Input Capture is updated with the counter (TCNTn) value each time an event occurs on the  
ICPn pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capture  
can be used for defining the counter TOP value.  
The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are read  
simultaneously when the CPU accesses these registers, the access is performed using an 8-bit  
temporary high byte register (TEMP). This temporary register is shared by all the other 16-bit  
registers. See “Accessing 16-bit Registers” on page 109.  
Timer/Counter  
Bit  
7
TOIE1  
R/W  
0
6
OCIE1A  
R/W  
0
5
OCIE1B  
R/W  
0
4
OCIE2  
R/W  
0
3
TICIE1  
R/W  
0
2
TOIE2  
R/W  
0
1
TOIE0  
R/W  
0
0
OCIE0  
R/W  
0
Interrupt Mask  
Register – TIMSK(1)  
TIMSK  
Read/Write  
Initial Value  
Note:  
1. This register contains interrupt control bits for several Timer/Counters, but only Timer1 bits are  
described in this section. The remaining bits are described in their respective Timer sections.  
• Bit 7 – TOIE1: Timer/Counter1, Overflow Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 overflow interrupt is enabled. The corresponding Interrupt Vector  
(See “Interrupts” on page 57.) is executed when the TOV1 Flag, located in TIFR, is set.  
• Bit 6 – OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Output Compare A Match interrupt is enabled. The corresponding  
Interrupt Vector (See “Interrupts” on page 57.) is executed when the OCF1A Flag, located in  
TIFR, is set.  
• Bit 5 – OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Output Compare B Match interrupt is enabled. The corresponding  
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Interrupt Vector (See “Interrupts” on page 57.) is executed when the OCF1B Flag, located in  
TIFR, is set.  
• Bit 3 – TICIE1: Timer/Counter1, Input Capture Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Input Capture interrupt is enabled. The corresponding Interrupt  
Vector (See “Interrupts” on page 57.) is executed when the ICF1 Flag, located in TIFR, is set.  
Extended  
Bit  
7
6
5
TICIE3  
R/W  
0
4
OCIE3A  
R/W  
0
3
OCIE3B  
R/W  
0
2
TOIE3  
R/W  
0
1
0
Timer/Counter  
Interrupt Mask  
Register – ETIMSK(1)  
ETIMSK  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
Note:  
1. This register contains interrupt control bits for several Timer/Counters, but only Timer3 bits are  
described in this section. The remaining bits are described in their respective Timer sections.  
• Bit 5 – TICIE3: Timer/Counter3, Input Capture Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter3 Input Capture interrupt is enabled. The corresponding Interrupt  
Vector (See “Interrupts” on page 57.) is executed when the ICF3 Flag, located in TIFR, is set.  
• Bit 4 – OCIE3A: Timer/Counter3, Output Compare A Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter3 Output Compare A Match interrupt is enabled. The corresponding  
Interrupt Vector (See “Interrupts” on page 57.) is executed when the OCF3A Flag, located in  
TIFR, is set.  
• Bit 3 – OCIE3B: Timer/Counter3, Output Compare B Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter3 Output Compare B Match interrupt is enabled. The corresponding  
Interrupt Vector (See “Interrupts” on page 57.) is executed when the OCF3B Flag, located in  
TIFR, is set.  
• Bit 2 – TOIE3: Timer/Counter3, Overflow Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter3 overflow interrupt is enabled. The corresponding Interrupt Vector  
(See “Interrupts” on page 57.) is executed when the TOV3 Flag, located in TIFR, is set.  
Timer/Counter  
Interrupt Flag Register  
– TIFR(1)  
Bit  
7
TOV1  
R/W  
0
6
OCF1A  
R/W  
0
5
OC1FB  
R/W  
0
4
OCF2  
R/W  
0
3
2
TOV2  
R/W  
0
1
TOV0  
R/W  
0
0
OCF0  
R/W  
0
ICF1  
R/W  
0
TIFR  
Read/Write  
Initial Value  
Note:  
1. This register contains flag bits for several Timer/Counters, but only Timer1 bits are described  
in this section. The remaining bits are described in their respective Timer sections.  
• Bit 7 – TOV1: Timer/Counter1, Overflow Flag  
The setting of this flag is dependent of the WGMn3:0 bits setting. In Normal and CTC modes,  
the TOV1 Flag is set when the timer overflows. Refer to Table 56 on page 130 for the TOV1 Flag  
behavior when using another WGMn3:0 bit setting.  
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TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed.  
Alternatively, TOV1 can be cleared by writing a logic one to its bit location.  
• Bit 6 – OCF1A: Timer/Counter1, Output Compare A Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output  
Compare Register A (OCR1A).  
Note that a Forced Output Compare (FOC1A) strobe will not set the OCF1A Flag.  
OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is exe-  
cuted. Alternatively, OCF1A can be cleared by writing a logic one to its bit location.  
• Bit 5 – OCF1B: Timer/Counter1, Output Compare B Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output  
Compare Register B (OCR1B).  
Note that a Forced Output Compare (FOC1B) strobe will not set the OCF1B Flag.  
OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is exe-  
cuted. Alternatively, OCF1B can be cleared by writing a logic one to its bit location.  
• Bit 3 – ICF1: Timer/Counter1, Input Capture Flag  
This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register  
(ICR1) is set by the WGMn3:0 to be used as the TOP value, the ICF1 Flag is set when the coun-  
ter reaches the TOP value.  
ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively,  
ICF1 can be cleared by writing a logic one to its bit location.  
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Extended  
Bit  
7
6
5
4
OCF3A  
R/W  
0
3
OC3FB  
R/W  
0
2
TOV3  
R/W  
0
1
0
Timer/Counter  
Interrupt Flag Register  
– ETIFR(1)  
ICF3  
R/W  
0
R
0
ETIFR  
Read/Write  
Initial Value  
R
0
R
0
R
0
Note:  
1. This register contains flag bits for several Timer/Counters, but only Timer3 bits are described  
in this section. The remaining bits are described in their respective Timer sections.  
• Bit 5 – ICF3: Timer/Counter3, Input Capture Flag  
This flag is set when a capture event occurs on the ICP3 pin. When the Input Capture Register  
(ICR3) is set by the WGMn3:0 to be used as the TOP value, the ICF3 Flag is set when the coun-  
ter reaches the TOP value.  
ICF3 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively,  
ICF3 can be cleared by writing a logic one to its bit location.  
• Bit 4 – OCF3A: Timer/Counter3, Output Compare A Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT3) value matches the Output  
Compare Register A (OCR3A).  
Note that a Forced Output Compare (FOC3A) strobe will not set the OCF3A Flag.  
OCF3A is automatically cleared when the Output Compare Match A Interrupt Vector is exe-  
cuted. Alternatively, OCF3A can be cleared by writing a logic one to its bit location.  
• Bit 3 – OCF3B: Timer/Counter3, Output Compare B Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT3) value matches the Output  
Compare Register B (OCR3B).  
Note that a Forced Output Compare (FOC3B) strobe will not set the OCF3B Flag.  
OCF3B is automatically cleared when the Output Compare Match B Interrupt Vector is exe-  
cuted. Alternatively, OCF3B can be cleared by writing a logic one to its bit location.  
• Bit 2 – TOV3: Timer/Counter3, Overflow Flag  
The setting of this flag is dependent of the WGMn3:0 bits setting. In normal and CTC modes, the  
TOV3 Flag is set when the timer overflows. Refer to Table 56 on page 130 for the TOV3 Flag  
behavior when using another WGMn3:0 bit setting.  
TOV3 is automatically cleared when the Timer/Counter3 Overflow Interrupt Vector is executed.  
Alternatively, TOV3 can be cleared by writing a logic one to its bit location.  
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8-bit  
Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The main  
features are:  
Single Channel Counter  
Clear Timer on Compare Match (Auto Reload)  
Glitch-free, Phase Correct Pulse Width Modulator (PWM)  
Frequency Generator  
10-bit Clock Prescaler  
Overflow and Compare Match Interrupt Sources (TOV2 and OCF2)  
Allows Clocking from External 32 kHz Watch Crystal Independent of the I/O Clock  
Timer/Counter2  
with PWM and  
Asynchronous  
operation  
Overview  
A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 59. For the actual place-  
ment of I/O pins, refer to “Pinout ATmega162” on page 2. CPU accessible I/O Registers,  
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-  
tions are listed in the “8-bit Timer/Counter Register Description” on page 149.  
Figure 59. 8-bit Timer/Counter Block Diagram  
TCCRn  
count  
TOVn  
(Int.Req.)  
clear  
Control Logic  
TOP  
direction  
clkTn  
TOSC1  
BOTTOM  
T/C  
Oscillator  
Prescaler  
TOSC2  
Timer/Counter  
TCNTn  
= 0  
= 0xFF  
clkI/O  
OCn  
OCn  
(Int.Req.)  
Waveform  
Generation  
=
OCRn  
clkI/O  
Synchronized Status flags  
Synchronization Unit  
clkASY  
Status flags  
ASSRn  
asynchronous mode  
select (ASn)  
Registers  
The Timer/Counter (TCNT2) and Output Compare Register (OCR2) are 8-bit registers. Interrupt  
request (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFR).  
All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and  
TIMSK are not shown in the figure since these registers are shared by other timer units.  
The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked from  
the TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled by  
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the Asynchronous Status Register (ASSR). The Clock Select logic block controls which clock  
source the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inac-  
tive when no clock source is selected. The output from the clock select logic is referred to as the  
Timer Clock (clkT2).  
The double buffered Output Compare Register (OCR2) is compared with the Timer/Counter  
value at all times. The result of the compare can be used by the waveform generator to generate  
a PWM or variable frequency output on the Output Compare Pin (OC2). See “Output Compare  
Unit” on page 140. for details. The Compare Match event will also set the Compare Flag (OCF2)  
which can be used to generate an output compare interrupt request.  
Definitions  
Many register and bit references in this document are written in general form. A lower case “n”  
replaces the Timer/Counter number, in this case 2. However, when using the register or bit  
defines in a program, the precise form must be used i.e., TCNT2 for accessing Timer/Counter2  
counter value and so on.  
The definitions in Table 59 are also used extensively throughout the section.  
Table 59. Definitions  
BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00).  
MAX  
TOP  
The counter reaches its MAXimum when it becomes 0xFF (decimal 255).  
The counter reaches the TOP when it becomes equal to the highest  
value in the count sequence. The TOP value can be assigned to be the  
fixed value 0xFF (MAX) or the value stored in the OCR2 Register. The  
assignment is dependent on the mode of operation.  
Timer/Counter  
Clock Sources  
The Timer/Counter can be clocked by an internal synchronous or an external asynchronous  
clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2  
bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/Counter  
Oscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see “Asyn-  
chronous Status Register – ASSR” on page 152. For details on clock sources and prescaler, see  
“Timer/Counter Prescaler” on page 156.  
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Counter Unit  
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure  
60 shows a block diagram of the counter and its surrounding environment.  
Figure 60. Counter Unit Block Diagram  
TOVn  
(Int.Req.)  
DATA BUS  
TOSC1  
count  
T/C  
Oscillator  
clk Tn  
clear  
TCNTn  
Control Logic  
Prescaler  
direction  
TOSC2  
clk  
bottom  
top  
I/O  
Signal description (internal signals):  
count Increment or decrement TCNT2 by 1.  
direction Selects between increment and decrement.  
clear  
clkT2  
top  
Clear TCNT2 (set all bits to zero).  
Timer/Counter clock.  
Signalizes that TCNT2 has reached maximum value.  
bottom  
Signalizes that TCNT2 has reached minimum value (zero).  
Depending on the mode of operation used, the counter is cleared, incremented, or decremented  
at each timer clock (clkT2). clkT2 can be generated from an external or internal clock source,  
selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) the  
timer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless of  
whether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear or  
count operations.  
The counting sequence is determined by the setting of the WGM21 and WGM20 bits located in  
the Timer/Counter Control Register (TCCR2). There are close connections between how the  
counter behaves (counts) and how waveforms are generated on the Output Compare output  
OC2. For more details about advanced counting sequences and waveform generation, see  
“Modes of Operation” on page 143.  
The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected by  
the WGM21:0 bits. TOV2 can be used for generating a CPU interrupt.  
Output Compare  
Unit  
The 8-bit comparator continuously compares TCNT2 with the Output Compare Register  
(OCR2). Whenever TCNT2 equals OCR2, the comparator signals a match. A match will set the  
Output Compare Flag (OCF2) at the next timer clock cycle. If enabled (OCIE2 = 1), the Output  
Compare Flag generates an output compare interrupt. The OCF2 Flag is automatically cleared  
when the interrupt is executed. Alternatively, the OCF2 Flag can be cleared by software by writ-  
ing a logical one to its I/O bit location. The waveform generator uses the match signal to  
generate an output according to operating mode set by the WGM21:0 bits and Compare Output  
mode (COM21:0) bits. The max and bottom signals are used by the waveform generator for han-  
dling the special cases of the extreme values in some modes of operation (“Modes of Operation”  
on page 143).  
Figure 61 shows a block diagram of the output compare unit.  
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Figure 61. Output Compare Unit, Block Diagram  
DATA BUS  
OCRn  
TCNTn  
= (8-bit Comparator )  
OCFn (Int.Req.)  
top  
bottom  
FOCn  
Waveform Generator  
OCxy  
WGMn1:0  
COMn1:0  
The OCR2 Register is double buffered when using any of the Pulse Width Modulation (PWM)  
modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buff-  
ering is disabled. The double buffering synchronizes the update of the OCR2 Compare Register  
to either top or bottom of the counting sequence. The synchronization prevents the occurrence  
of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.  
The OCR2 Register access may seem complex, but this is not case. When the double buffering  
is enabled, the CPU has access to the OCR2 Buffer Register, and if double buffering is disabled  
the CPU will access the OCR2 directly.  
Force Output  
Compare  
In non-PWM waveform generation modes, the match output of the comparator can be forced by  
writing a one to the Force Output Compare (FOC2) bit. Forcing Compare Match will not set the  
OCF2 Flag or reload/clear the timer, but the OC2 pin will be updated as if a real Compare Match  
had occurred (the COM21:0 bits settings define whether the OC2 pin is set, cleared or toggled).  
Compare Match  
Blocking by TCNT2  
Write  
All CPU write operations to the TCNT2 Register will block any Compare Match that occurs in the  
next timer clock cycle, even when the timer is stopped. This feature allows OCR2 to be initialized  
to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock is  
enabled.  
Using the Output  
Compare Unit  
Since writing TCNT2 in any mode of operation will block all compare matches for one timer clock  
cycle, there are risks involved when changing TCNT2 when using the output compare channel,  
independently of whether the Timer/Counter is running or not. If the value written to TCNT2  
equals the OCR2 value, the Compare Match will be missed, resulting in incorrect Waveform  
Generation. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is  
down-counting.  
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The Setup of the OC2 should be performed before setting the Data Direction Register for the  
port pin to output. The easiest way of setting the OC2 value is to use the Force Output Compare  
(FOC2) strobe bit in Normal mode. The OC2 Register keeps its value even when changing  
between Waveform Generation modes.  
Be aware that the COM21:0 bits are not double buffered together with the compare value.  
Changing the COM21:0 bits will take effect immediately.  
Compare Match  
Output Unit  
The Compare Output mode (COM21:0) bits have two functions. The waveform generator uses  
the COM21:0 bits for defining the Output Compare (OC2) state at the next Compare Match.  
Also, the COM21:0 bits control the OC2 pin output source. Figure 62 shows a simplified sche-  
matic of the logic affected by the COM21:0 bit setting. The I/O Registers, I/O bits, and I/O pins in  
the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and  
PORT) that are affected by the COM21:0 bits are shown. When referring to the OC2 state, the  
reference is for the internal OC2 Register, not the OC2 pin.  
Figure 62. Compare Match Output Unit, Schematic  
COMn1  
Waveform  
Generator  
COMn0  
FOCn  
D
Q
Q
1
0
OCn  
Pin  
OCn  
D
PORT  
D
Q
DDR  
clkI/O  
The general I/O port function is overridden by the Output Compare (OC2) from the waveform  
generator if either of the COM21:0 bits are set. However, the OC2 pin direction (input or output)  
is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Regis-  
ter bit for the OC2 pin (DDR_OC2) must be set as output before the OC2 value is visible on the  
pin. The port override function is independent of the Waveform Generation mode.  
The design of the Output Compare pin logic allows initialization of the OC2 state before the out-  
put is enabled. Note that some COM21:0 bit settings are reserved for certain modes of  
operation. See “8-bit Timer/Counter Register Description” on page 149.  
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Compare Output Mode The Waveform Generator uses the COM21:0 bits differently in Normal, CTC, and PWM modes.  
and Waveform  
Generation  
For all modes, setting the COM21:0 = 0 tells the Waveform Generator that no action on the OC2  
Register is to be performed on the next Compare Match. For compare output actions in the non-  
PWM modes refer to Table 61 on page 150. For fast PWM mode, refer to Table 62 on page 150,  
and for phase correct PWM refer to Table 63 on page 150.  
A change of the COM21:0 bits state will have effect at the first Compare Match after the bits are  
written. For non-PWM modes, the action can be forced to have immediate effect by using the  
FOC2 strobe bits.  
Modes of  
Operation  
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is  
defined by the combination of the Waveform Generation mode (WGM21:0) and Compare Output  
mode (COM21:0) bits. The Compare Output mode bits do not affect the counting sequence,  
while the Waveform Generation mode bits do. The COM21:0 bits control whether the PWM out-  
put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes  
the COM21:0 bits control whether the output should be set, cleared, or toggled at a Compare  
Match (See “Compare Match Output Unit” on page 142.).  
For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 147.  
Normal Mode  
The simplest mode of operation is the Normal mode (WGM21:0 = 0). In this mode the counting  
direction is always up (incrementing), and no counter clear is performed. The counter simply  
overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bot-  
tom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the same  
timer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninth  
bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt  
that automatically clears the TOV2 Flag, the timer resolution can be increased by software.  
There are no special cases to consider in the normal mode, a new counter value can be written  
anytime.  
The Output Compare unit can be used to generate interrupts at some given time. Using the Out-  
put Compare to generate waveforms in Normal mode is not recommended, since this will  
occupy too much of the CPU time.  
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Clear Timer on  
In Clear Timer on Compare or CTC mode (WGM21:0 = 2), the OCR2 Register is used to manip-  
Compare Match (CTC) ulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value  
Mode  
(TCNT2) matches the OCR2. The OCR2 defines the top value for the counter, hence also its  
resolution. This mode allows greater control of the Compare Match output frequency. It also sim-  
plifies the operation of counting external events.  
The timing diagram for the CTC mode is shown in Figure 63. The counter value (TCNT2)  
increases until a Compare Match occurs between TCNT2 and OCR2, and then counter (TCNT2)  
is cleared.  
Figure 63. CTC Mode, Timing Diagram  
OCn Interrupt Flag Set  
TCNTn  
OCn  
(Toggle)  
(COMn1:0 = 1)  
1
2
3
4
Period  
An interrupt can be generated each time the counter value reaches the TOP value by using the  
OCF2 Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the  
TOP value. However, changing the TOP to a value close to BOTTOM when the counter is run-  
ning with none or a low prescaler value must be done with care since the CTC mode does not  
have the double buffering feature. If the new value written to OCR2 is lower than the current  
value of TCNT2, the counter will miss the Compare Match. The counter will then have to count to  
its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can  
occur.  
For generating a waveform output in CTC mode, the OC2 output can be set to toggle its logical  
level on each Compare Match by setting the Compare Output mode bits to toggle mode  
(COM21:0 = 1). The OC2 value will not be visible on the port pin unless the data direction for the  
pin is set to output. The waveform generated will have a maximum frequency of fOC2 = fclk_I/O/2  
when OCR2 is set to zero (0x00). The waveform frequency is defined by the following equation:  
f
clk_I/O  
f
= ----------------------------------------------  
OCn  
2 N ⋅ (1 + OCRn)  
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).  
As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that the  
counter counts from MAX to 0x00.  
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Fast PWM Mode  
The fast Pulse Width Modulation or fast PWM mode (WGM21:0 = 1) provides a high frequency  
PWM waveform generation option. The fast PWM differs from the other PWM option by its sin-  
gle-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. In  
non-inverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare  
Match between TCNT2 and OCR2, and set at BOTTOM. In inverting Compare Output mode, the  
output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the  
operating frequency of the fast PWM mode can be twice as high as the phase correct PWM  
mode that uses dual-slope operation. This high frequency makes the fast PWM mode well suited  
for power regulation, rectification, and DAC applications. High frequency allows physically small  
sized external components (coils, capacitors), and therefore reduces total system cost.  
In fast PWM mode, the counter is incremented until the counter value matches the MAX value.  
The counter is then cleared at the following timer clock cycle. The timing diagram for the fast  
PWM mode is shown in Figure 64. The TCNT2 value is in the timing diagram shown as a histo-  
gram for illustrating the single-slope operation. The diagram includes non-inverted and inverted  
PWM outputs. The small horizontal line marks on the TCNT2 slopes represent compare  
matches between OCR2 and TCNT2.  
Figure 64. Fast PWM Mode, Timing Diagram  
OCRn Interrupt Flag Set  
OCRn Update and  
TOVn Interrupt Flag Set  
TCNTn  
(COMn1:0 = 2)  
(COMn1:0 = 3)  
OCn  
OCn  
1
2
3
4
5
6
7
Period  
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches MAX. If the inter-  
rupt is enabled, the interrupt handler routine can be used for updating the compare value.  
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2 pin. Set-  
ting the COM21:0 bits to two will produce a non-inverted PWM and an inverted PWM output can  
be generated by setting the COM21:0 to three (See Table 62 on page 150). The actual OC2  
value will only be visible on the port pin if the data direction for the port pin is set as output. The  
PWM waveform is generated by setting (or clearing) the OC2 Register at the Compare Match  
between OCR2 and TCNT2, and clearing (or setting) the OC2 Register at the timer clock cycle  
the counter is cleared (changes from MAX to BOTTOM).  
The PWM frequency for the output can be calculated by the following equation:  
f
clk_I/O  
f
= -----------------  
OCnPWM  
N 256  
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).  
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The extreme values for the OCR2 Register represent special cases when generating a PWM  
waveform output in the fast PWM mode. If the OCR2 is set equal to BOTTOM, the output will be  
a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2 equal to MAX will result in a  
constantly high or low output (depending on the polarity of the output set by the COM21:0 bits.)  
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-  
ting OC2 to toggle its logical level on each Compare Match (COM21:0 = 1). The waveform  
generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2 is set to zero. This fea-  
ture is similar to the OC2 toggle in CTC mode, except the double buffer feature of the Output  
Compare unit is enabled in the fast PWM mode.  
Phase Correct PWM  
Mode  
The phase correct PWM mode (WGM21:0 = 3) provides a high resolution phase correct PWM  
waveform generation option. The phase correct PWM mode is based on a dual-slope operation.  
The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In non-  
inverting Compare Output mode, the Output Compare (OC2) is cleared on the Compare Match  
between TCNT2 and OCR2 while up-counting, and set on the Compare Match while down-  
counting. In inverting output compare mode, the operation is inverted. The dual-slope operation  
has lower maximum operation frequency than single slope operation. However, due to the sym-  
metric feature of the dual-slope PWM modes, these modes are preferred for motor control  
applications.  
The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correct  
PWM mode the counter is incremented until the counter value matches MAX. When the counter  
reaches MAX, it changes the count direction. The TCNT2 value will be equal to MAX for one  
timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 65.  
The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slope  
operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal  
line marks on the TCNT2 slopes represent compare matches between OCR2 and TCNT2.  
Figure 65. Phase Correct PWM Mode, Timing Diagram  
OCn Interrupt Flag Set  
OCRn Update  
TOVn Interrupt Flag Set  
TCNTn  
(COMn1:0 = 2)  
OCn  
(COMn1:0 = 3)  
OCn  
1
2
3
Period  
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. The  
Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM  
value.  
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the  
OC2 pin. Setting the COM21:0 bits to two will produce a non-inverted PWM. An inverted PWM  
output can be generated by setting the COM21:0 to three (See Table 63 on page 150). The  
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actual OC2 value will only be visible on the port pin if the data direction for the port pin is set as  
output. The PWM waveform is generated by clearing (or setting) the OC2 Register at the Com-  
pare Match between OCR2 and TCNT2 when the counter increments, and setting (or clearing)  
the OC2 Register at Compare Match between OCR2 and TCNT2 when the counter decrements.  
The PWM frequency for the output when using phase correct PWM can be calculated by the fol-  
lowing equation:  
f
clk_I/O  
f
= -----------------  
OCnPCPWM  
N 510  
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).  
The extreme values for the OCR2 Register represent special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCR2 is set equal to BOTTOM, the out-  
put will be continuously low and if set equal to MAX the output will be continuously high for non-  
inverted PWM mode. For inverted PWM the output will have the opposite logic values.  
At the very start of period 2 in Figure 65 OCn has a transition from high to low even though there  
is no Compare Match. The point of this transition is to guarantee symmetry around BOTTOM.  
There are two cases that give a transition without a Compare Match.  
OCR2 changes its value from MAX, like in Figure 65. When the OCR2 value is MAX the  
OCn pin value is the same as the result of a down-counting Compare Match. To ensure  
symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-  
counting Compare Match.  
The timer starts counting from a value higher than the one in OCR2, and for that reason  
misses the Compare Match and hence the OCn change that would have happened on the  
way up.  
Timer/Counter  
Timing Diagrams  
The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2)  
is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced by  
the Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags are  
set. Figure 66 contains timing data for basic Timer/Counter operation. The figure shows the  
count sequence close to the MAX value in all modes other than phase correct PWM mode.  
Figure 66. Timer/Counter Timing Diagram, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 67 shows the same timing data, but with the prescaler enabled.  
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Figure 67. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 68 shows the setting of OCF2 in all modes except CTC mode.  
Figure 68. Timer/Counter Timing Diagram, Setting of OCF2, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
OCRn  
OCFn  
OCRn - 1  
OCRn  
OCRn + 1  
OCRn + 2  
OCRn Value  
Figure 69 shows the setting of OCF2 and the clearing of TCNT2 in CTC mode.  
Figure 69. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Pres-  
caler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
(CTC)  
TOP - 1  
TOP  
BOTTOM  
BOTTOM + 1  
OCRn  
TOP  
OCFn  
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8-bit  
Timer/Counter  
Register  
Description  
Timer/Counter Control  
Register – TCCR2  
Bit  
7
FOC2  
W
6
WGM20  
R/W  
0
5
COM21  
R/W  
0
4
COM20  
R/W  
0
3
WGM21  
R/W  
0
2
CS22  
R/W  
0
1
CS21  
R/W  
0
0
CS20  
R/W  
0
TCCR2  
Read/Write  
Initial Value  
0
• Bit 7 – FOC2: Force Output Compare  
The FOC2 bit is only active when the WGM bits specify a non-PWM mode. However, for ensur-  
ing compatibility with future devices, this bit must be set to zero when TCCR2 is written when  
operating in PWM mode. When writing a logical one to the FOC2 bit, an immediate Compare  
Match is forced on the Waveform Generation unit. The OC2 output is changed according to its  
COM21:0 bits setting. Note that the FOC2 bit is implemented as a strobe. Therefore it is the  
value present in the COM21:0 bits that determines the effect of the forced compare.  
A FOC2 strobe will not generate any interrupt, nor will it clear the timer in CTC mode using  
OCR2 as TOP.  
The FOC2 bit is always read as zero.  
• Bit 6, 3 – WGM21:0: Waveform Generation Mode  
These bits control the counting sequence of the counter, the source for the maximum (TOP)  
counter value, and what type of waveform generation to be used. Modes of operation supported  
by the Timer/Counter unit are: Normal mode, Clear Timer on Compare match (CTC) mode, and  
two types of Pulse Width Modulation (PWM) modes. See Table 60 and “Modes of Operation” on  
page 143.  
Table 60. Waveform Generation Mode Bit Description(1)  
WGM21 WGM20 Timer/Counter Mode  
Update of TOV2 Flag  
OCR2 at Set on  
Mode  
(CTC2)  
(PWM2) of Operation  
TOP  
0xFF  
0xFF  
0
1
2
3
0
0
1
1
0
1
0
1
Normal  
Immediate MAX  
TOP BOTTOM  
PWM, Phase Correct  
CTC  
OCR2 Immediate MAX  
0xFF TOP MAX  
Fast PWM  
Note:  
1. The CTC2 and PWM2 bit definition names are now obsolete. Use the WGM21:0 definitions.  
However, the functionality and location of these bits are compatible with previous versions of  
the timer.  
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• Bit 5:4 – COM21:0: Compare Match Output Mode  
These bits control the Output Compare pin (OC2) behavior. If one or both of the COM21:0 bits  
are set, the OC2 output overrides the normal port functionality of the I/O pin it is connected to.  
However, note that the Data Direction Register (DDR) bit corresponding to OC2 pin must be set  
in order to enable the output driver.  
When OC2 is connected to the pin, the function of the COM21:0 bits depends on the WGM21:0  
bit setting. Table 61 shows the COM21:0 bit functionality when the WGM21:0 bits are set to a  
normal or CTC mode (non-PWM).  
Table 61. Compare Output Mode, non-PWM Mode  
COM21  
COM20  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC2 disconnected.  
Toggle OC2 on Compare Match.  
Clear OC2 on Compare Match.  
Set OC2 on Compare Match.  
Table 62 shows the COM21:0 bit functionality when the WGM21:0 bits are set to fast PWM  
mode.  
Table 62. Compare Output Mode, Fast PWM Mode(1)  
COM21  
COM20  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC2 disconnected.  
Reserved  
Clear OC2 on Compare Match, set OC2 at TOP.  
Set OC2 on Compare Match, clear OC2 at TOP.  
Note:  
1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare  
Match is ignored, but the set or clear is done at TOP. See “Fast PWM Mode” on page 145 for  
more details.  
Table 63 shows the COM21:0 bit functionality when the WGM21:0 bits are set to phase correct  
PWM mode.  
Table 63. Compare Output Mode, Phase Correct PWM Mode(1)  
COM21 COM20 Description  
0
0
1
0
1
0
Normal port operation, OC2 disconnected.  
Reserved  
Clear OC2 on Compare Match when up-counting. Set OC2 on Compare  
Match when down-counting.  
1
1
Set OC2 on Compare Match when up-counting. Clear OC2 on Compare  
Match when down-counting.  
Note:  
1. A special case occurs when OCR2 equals TOP and COM21 is set. In this case, the Compare  
Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page  
146 for more details.  
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• Bit 2:0 – CS22:0: Clock Select  
The three Clock Select bits select the clock source to be used by the Timer/Counter, see Table  
64.  
Table 64. Clock Select Bit Description  
Description  
CS22  
CS21  
CS20  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source (Timer/Counter stopped).  
clkT2S/(No prescaling)  
clkT2S/8 (From prescaler)  
clkT2S/32 (From prescaler)  
clkT2S/64 (From prescaler)  
clkT2S/128 (From prescaler)  
clkT2S/256 (From prescaler)  
clkT2S/1024 (From prescaler)  
Timer/Counter  
Register – TCNT2  
Bit  
7
6
5
4
3
2
1
0
TCNT2[7:0]  
TCNT2  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Timer/Counter Register gives direct access, both for read and write operations, to the  
Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the Compare  
Match on the following timer clock. Modifying the counter (TCNT2) while the counter is running,  
introduces a risk of missing a Compare Match between TCNT2 and the OCR2 Register.  
Output Compare  
Register – OCR2  
Bit  
7
6
5
4
3
2
1
0
OCR2[7:0]  
OCR2  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Output Compare Register contains an 8-bit value that is continuously compared with the  
counter value (TCNT2). A match can be used to generate an output compare interrupt, or to  
generate a waveform output on the OC2 pin.  
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Asynchronous  
operation of the  
Timer/Counter  
Asynchronous Status  
Register – ASSR  
Bit  
7
6
5
4
3
2
1
0
AS2  
R/W  
0
TCN2UB  
OCR2UB  
TCR2UB  
ASSR  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
R
0
R
0
• Bit 3 – AS2: Asynchronous Timer/Counter2  
When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 is  
written to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscil-  
lator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2, and  
TCCR2 might be corrupted.  
• Bit 2 – TCN2UB: Timer/Counter2 Update Busy  
When Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set.  
When TCNT2 has been updated from the temporary storage register, this bit is cleared by hard-  
ware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value.  
• Bit 1 – OCR2UB: Output Compare Register2 Update Busy  
When Timer/Counter2 operates asynchronously and OCR2 is written, this bit becomes set.  
When OCR2 has been updated from the temporary storage register, this bit is cleared by hard-  
ware. A logical zero in this bit indicates that OCR2 is ready to be updated with a new value.  
• Bit 0 – TCR2UB: Timer/Counter Control Register2 Update Busy  
When Timer/Counter2 operates asynchronously and TCCR2 is written, this bit becomes set.  
When TCCR2 has been updated from the temporary storage register, this bit is cleared by hard-  
ware. A logical zero in this bit indicates that TCCR2 is ready to be updated with a new value.  
If a write is performed to any of the three Timer/Counter2 Registers while its update Busy Flag is  
set, the updated value might get corrupted and cause an unintentional interrupt to occur.  
The mechanisms for reading TCNT2, OCR2, and TCCR2 are different. When reading TCNT2,  
the actual timer value is read. When reading OCR2 or TCCR2, the value in the temporary stor-  
age register is read.  
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Asynchronous  
Operation of  
Timer/Counter2  
When Timer/Counter2 operates asynchronously, some considerations must be taken.  
Warning: When switching between asynchronous and synchronous clocking of  
Timer/Counter2, the Timer Registers TCNT2, OCR2, and TCCR2 might be corrupted. A  
safe procedure for switching clock source is:  
1. Disable the Timer/Counter2 interrupts by clearing OCIE2 and TOIE2.  
2. Select clock source by setting AS2 as appropriate.  
3. Write new values to TCNT2, OCR2, and TCCR2.  
4. To switch to asynchronous operation: Wait for TCN2UB, OCR2UB, and TCR2UB.  
5. Clear the Timer/Counter2 Interrupt Flags.  
6. Enable interrupts, if needed.  
The Oscillator is optimized for use with a 32.768 kHz watch crystal. Applying an external  
clock to the TOSC1 pin may result in incorrect Timer/Counter2 operation. The CPU main  
clock frequency must be more than four times the Oscillator frequency.  
When writing to one of the registers TCNT2, OCR2, or TCCR2, the value is transferred to a  
temporary register, and latched after two positive edges on TOSC1. The user should not  
write a new value before the contents of the temporary register have been transferred to its  
destination. Each of the three mentioned registers have their individual temporary register,  
which means that e.g., writing to TCNT2 does not disturb an OCR2 write in progress. To  
detect that a transfer to the destination register has taken place, the Asynchronous Status  
Register – ASSR has been implemented.  
When entering Power-save or Extended Standby mode after having written to TCNT2,  
OCR2, or TCCR2, the user must wait until the written register has been updated if  
Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode  
before the changes are effective. This is particularly important if the Output Compare2  
interrupt is used to wake up the device, since the output compare function is disabled during  
writing to OCR2 or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode  
before the OCR2UB bit returns to zero, the device will never receive a Compare Match  
interrupt, and the MCU will not wake up.  
If Timer/Counter2 is used to wake the device up from Power-save or Extended Standby  
mode, precautions must be taken if the user wants to re-enter one of these modes: The  
interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and re-  
entering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the  
device will fail to wake up. If the user is in doubt whether the time before re-entering Power-  
save or Extended Standby mode is sufficient, the following algorithm can be used to ensure  
that one TOSC1 cycle has elapsed:  
1. Write a value to TCCR2, TCNT2, or OCR2.  
2. Wait until the corresponding Update Busy Flag in ASSR returns to zero.  
3. Enter Power-save or Extended Standby mode.  
When the asynchronous operation is selected, the 32.768 kHz Oscillator for Timer/Counter2  
is always running, except in Power-down and Standby modes. After a Power-up Reset or  
wake-up from Power-down or Standby mode, the user should be aware of the fact that this  
Oscillator might take as long as one second to stabilize. The user is advised to wait for at  
least one second before using Timer/Counter2 after Power-up or wake-up from Power-down  
or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost  
after a wake-up from Power-down or Standby mode due to unstable clock signal upon start-  
up, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin.  
Description of wake up from Power-save or Extended Standby mode when the Timer is  
clocked asynchronously: When the interrupt condition is met, the wake up process is started  
on the following cycle of the timer clock, that is, the Timer is always advanced by at least one  
before the processor can read the counter value. After wake-up, the MCU is halted for four  
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2513K–AVR–07/09  
cycles, it executes the interrupt routine, and resumes execution from the instruction  
following SLEEP.  
Reading of the TCNT2 Register shortly after wake-up from Power-save may give an  
incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2  
must be done through a register synchronized to the internal I/O clock domain.  
Synchronization takes place for every rising TOSC1 edge. When waking up from Power-  
save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous  
value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC  
clock after waking up from Power-save mode is essentially unpredictable, as it depends on  
the wake-up time. The recommended procedure for reading TCNT2 is thus as follows:  
1. Write any value to either of the registers OCR2 or TCCR2.  
2. Wait for the corresponding Update Busy Flag to be cleared.  
3. Read TCNT2.  
During asynchronous operation, the synchronization of the Interrupt Flags for the  
Asynchronous Timer takes three processor cycles plus one timer cycle. The Timer is  
therefore advanced by at least one before the processor can read the Timer value causing  
the setting of the Interrupt Flag. The output compare pin is changed on the Timer clock and  
is not synchronized to the processor clock.  
Timer/Counter  
Interrupt Mask  
Register – TIMSK  
Bit  
7
TOIE1  
R/W  
0
6
OCIE1A  
R/W  
0
5
OCIE1B  
R/W  
0
4
OCIE2  
R/W  
0
3
TICIE1  
R/W  
0
2
TOIE2  
R/W  
0
1
TOIE0  
R/W  
0
0
OCIE0  
R/W  
0
TIMSK  
Read/Write  
Initial Value  
• Bit 4 – OCIE2: Timer/Counter2 Output Compare Match Interrupt Enable  
When the OCIE2 bit is written to one and the I-bit in the Status Register is set (one), the  
Timer/Counter2 Compare Match interrupt is enabled. The corresponding interrupt is executed if  
a Compare Match in Timer/Counter2 occurs, i.e., when the OCF2 bit is set in the Timer/Counter  
Interrupt Flag Register – TIFR.  
• Bit 2 – TOIE2: Timer/Counter2 Overflow Interrupt Enable  
When the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), the  
Timer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if an  
overflow in Timer/Counter2 occurs, i.e., when the TOV2 bit is set in the Timer/Counter Interrupt  
Flag Register – TIFR.  
154  
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Timer/Counter  
Interrupt Flag Register  
– TIFR  
Bit  
7
TOV1  
R/W  
0
6
OCF1A  
R/W  
0
5
OC1FB  
R/W  
0
4
OCF2  
R/W  
0
3
2
TOV2  
R/W  
0
1
TOV0  
R/W  
0
0
ICF1  
R/W  
0
OCF0  
R/W  
0
TIFR  
Read/Write  
Initial Value  
• Bit 4 – OCF2: Output Compare Flag 2  
The OCF2 bit is set (one) when a Compare Match occurs between the Timer/Counter2 and the  
data in OCR2 – Output Compare Register2. OCF2 is cleared by hardware when executing the  
corresponding interrupt handling vector. Alternatively, OCF2 is cleared by writing a logic one to  
the flag. When the I-bit in SREG, OCIE2 (Timer/Counter2 Compare Match Interrupt Enable), and  
OCF2 are set (one), the Timer/Counter2 Compare Match Interrupt is executed.  
• Bit 2 – TOV2: Timer/Counter2 Overflow Flag  
The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hard-  
ware when executing the corresponding interrupt handling vector. Alternatively, TOV2 is cleared  
by writing a logic one to the flag. When the SREG I-bit, TOIE2 (Timer/Counter2 Overflow Inter-  
rupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. In  
PWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00.  
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Timer/Counter  
Prescaler  
Figure 70. Prescaler for Timer/Counter2  
clkI/O  
clkT2S  
10-BIT T/C PRESCALER  
Clear  
TOSC1  
AS2  
PSR2  
0
CS20  
CS21  
CS22  
TIMER/COUNTER2 CLOCK SOURCE  
clkT2  
The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the main  
system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronously  
clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter  
(RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port D. A crystal can  
then be connected between the TOSC1 and TOSC2 pins to serve as an independent clock  
source for Timer/Counter2. The Oscillator is optimized for use with a 32.768 kHz crystal. Apply-  
ing an external clock source to TOSC1 is not recommended.  
For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64,  
clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected.  
Setting the PSR2 bit in SFIOR resets the prescaler. This allows the user to operate with a pre-  
dictable prescaler.  
Special Function IO  
Register – SFIOR  
Bit  
7
6
XMBK  
R/W  
0
5
XMM2  
R/W  
0
4
XMM1  
R/W  
0
3
XMM0  
R/W  
0
2
1
PSR2  
R/W  
0
0
PSR310  
R/W  
0
TSM  
R/W  
0
PUD  
R/W  
0
SFIOR  
Read/Write  
Initial Val-  
ue  
• Bit 1 – PSR2: Prescaler Reset Timer/Counter2  
When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally cleared  
immediately by hardware. If this bit is written when Timer/Counter2 is operating in asynchronous  
mode, the bit will remain one until the prescaler has been reset. The bit will not be cleared by  
hardware if the TSM bit is set. Refer to the description of the “Bit 7 – TSM: Timer/Counter Syn-  
chronization Mode” on page 105 for a description of the Timer/Counter Synchronization mode.  
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Serial  
Peripheral  
Interface – SPI  
The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the  
ATmega162 and peripheral devices or between several AVR devices. The ATmega162 SPI  
includes the following features:  
Full-duplex, Three-wire Synchronous Data Transfer  
Master or Slave Operation  
LSB First or MSB First Data Transfer  
Seven Programmable Bit Rates  
End of Transmission Interrupt Flag  
Write Collision Flag Protection  
Wake-up from Idle Mode  
Double Speed (CK/2) Master SPI Mode  
Figure 71. SPI Block Diagram(1)  
DIVIDER  
/2/4/8/16/32/64/128  
Note:  
1. Refer to Figure 1 on page 2, and Table 32 on page 72 for SPI pin placement.  
The interconnection between Master and Slave CPUs with SPI is shown in Figure 72. The sys-  
tem consists of two Shift Registers, and a Master clock generator. The SPI Master initiates the  
communication cycle when pulling low the Slave Select SS pin of the desired Slave. Master and  
Slave prepare the data to be sent in their respective Shift Registers, and the Master generates  
the required clock pulses on the SCK line to interchange data. Data is always shifted from Mas-  
ter to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In  
– Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pulling  
high the Slave Select, SS, line.  
When configured as a Master, the SPI interface has no automatic control of the SS line. This  
must be handled by user software before communication can start. When this is done, writing a  
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byte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eight  
bits into the Slave. After shifting one byte, the SPI clock generator stops, setting the End of  
Transmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, an  
interrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, or  
signal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will be  
kept in the buffer register for later use.  
When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as long  
as the SS pin is driven high. In this state, software may update the contents of the SPI Data  
Register, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pin  
until the SS pin is driven low. As one byte has been completely shifted, the End of Transmission  
Flag, SPIF is set. If the SPI interrupt enable bit, SPIE, in the SPCR Register is set, an interrupt is  
requested. The Slave may continue to place new data to be sent into SPDR before reading the  
incoming data. The last incoming byte will be kept in the Buffer Register for later use.  
Figure 72. SPI Master-slave Interconnection  
MSB  
MASTER  
LSB  
MSB  
SLAVE  
LSB  
MISO  
MOSI  
MISO  
MOSI  
8-BIT SHIFT REGISTER  
8-BIT SHIFT REGISTER  
SHIFT  
ENABLE  
SPI  
SCK  
SS  
SCK  
CLOCK GENERATOR  
SS  
VCC  
The system is single buffered in the transmit direction and double buffered in the receive direc-  
tion. This means that bytes to be transmitted cannot be written to the SPI Data Register before  
the entire shift cycle is completed. When receiving data, however, a received character must be  
read from the SPI Data Register before the next character has been completely shifted in. Oth-  
erwise, the first byte is lost.  
In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensure  
correct sampling of the clock signal, the minimum low and high periods should be:  
Low periods: Longer than 2 CPU clock cycles.  
High periods: Longer than 2 CPU clock cycles.  
When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overridden  
according to Table 65. For more details on automatic port overrides, refer to “Alternate Port  
Functions” on page 68.  
Table 65. SPI Pin Overrides(1)  
Pin  
MOSI  
MISO  
SCK  
SS  
Direction, Master SPI  
User Defined  
Input  
Direction, Slave SPI  
Input  
User Defined  
Input  
User Defined  
User Defined  
Input  
Note:  
1. See “Alternate Functions Of Port B” on page 72 for a detailed description of how to define the  
direction of the user defined SPI pins.  
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The following code examples show how to initialize the SPI as a Master and how to perform a  
simple transmission. DDR_SPI in the examples must be replaced by the actual Data Direction  
Register controlling the SPI pins. DD_MOSI, DD_MISO, and DD_SCK must be replaced by the  
actual data direction bits for these pins. E.g., if MOSI is placed on pin PB5, replace DD_MOSI  
with DDB5 and DDR_SPI with DDRB.  
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Assembly Code Example(1)  
SPI_MasterInit:  
; Set MOSI and SCK outpu?, all others input  
ldi  
out  
r17,(1<<DD_MOSI)|(1<<DD_SCK)  
DDR_SPI,r17  
; Enable SPI, Master, se? clock rate fck/16  
ldi  
out  
ret  
r17,(1<<SPE)|(1<<MSTR)|(1<<SPR0)  
SPCR,r17  
SPI_MasterTransmit:  
; Start transmission of ?ata (r16)  
out  
SPDR,r16  
Wait_Transmit:  
; Wait for transmission ?omplete  
sbis SPSR,SPIF  
rjmp Wait_Transmit  
ret  
C Code Example(1)  
void SPI_MasterInit(void)  
{
/* Set MOSI and SCK outp?t, all others input */  
DDR_SPI = (1<<DD_MOSI)|(?<<DD_SCK);  
/* Enable SPI, Master, s?t clock rate fck/16 */  
SPCR = (1<<SPE)|(1<<MSTR?|(1<<SPR0);  
}
void SPI_MasterTransmit(char cData)  
{
/* Start transmission */  
SPDR = cData;  
/* Wait for transmission?complete */  
while(!(SPSR & (1<<?PIF)))  
;
}
Note:  
1. The example code assumes that the part specific header file is included.  
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The following code examples show how to initialize the SPI as a slave and how to perform a sim-  
ple reception.  
Assembly Code Example(1)  
SPI_SlaveInit:  
; Set MISO output, all o?hers input  
ldi  
out  
r17,(1<<DD_MISO)  
DDR_SPI,r17  
; Enable SPI  
ldi  
out  
ret  
r17,(1<<SPE)  
SPCR,r17  
SPI_SlaveReceive:  
; Wait for reception com?lete  
sbis SPSR,SPIF  
rjmp SPI_SlaveReceive  
; Read received data and?return  
in  
r16,SPDR  
ret  
C Code Example(1)  
void SPI_SlaveInit(void)  
{
/* Set MISO output, all ?thers input */  
DDR_SPI = (1<<DD_MISO);  
/* Enable SPI */  
SPCR = (1<<SPE);  
}
char SPI_SlaveReceive(void)  
{
/* Wait for reception co?plete */  
while(!(SPSR & (1<<?PIF)))  
;
/* Return data register ?/  
return SPDR;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
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SS Pin  
Functionality  
Slave Mode  
When the SPI is configured as a slave, the Slave Select (SS) pin is always input. When SS is  
held low, the SPI is activated, and MISO becomes an output if configured so by the user. All  
other pins are inputs. When SS is driven high, all pins are inputs except MISO which can be user  
configured as an output, and the SPI is passive, which means that it will not receive incoming  
data. Note that the SPI logic will be reset once the SS pin is driven high.  
The SS pin is useful for packet/byte synchronization to keep the slave bit counter synchronous  
with the master clock generator. When the SS pin is driven high, the SPI Slave will immediately  
reset the send and receive logic, and drop any partially received data in the Shift Register.  
Master Mode  
When the SPI is configured as a Master (MSTR in SPCR is set), the user can determine the  
direction of the SS pin.  
If SS is configured as an output, the pin is a general output pin which does not affect the SPI  
system. Typically, the pin will be driving the SS pin of the SPI Slave.  
If SS is configured as an input, it must be held high to ensure Master SPI operation. If the SS pin  
is driven low by peripheral circuitry when the SPI is configured as a Master with the SS pin  
defined as an input, the SPI system interprets this as another Master selecting the SPI as a  
slave And starting to send data to it. To avoid bus contention, the SPI system takes the following  
actions:  
1. The MSTR bit in SPCR is cleared and the SPI system becomes a Slave. As a result of  
the SPI becoming a Slave, the MOSI and SCK pins become inputs.  
2. The SPIF Flag in SPSR is set, and if the SPI interrupt is enabled, and the I-bit in SREG is  
set, the interrupt routine will be executed.  
Thus, when interrupt-driven SPI transmission is used in Master mode, and there exists a possi-  
bility that SS is driven low, the interrupt should always check that the MSTR bit is still set. If the  
MSTR bit has been cleared by a slave select, it must be set by the user to re-enable SPI Master  
mode.  
SPI Control Register –  
SPCR  
Bit  
7
SPIE  
R/W  
0
6
5
DORD  
R/W  
0
4
MSTR  
R/W  
0
3
CPOL  
R/W  
0
2
CPHA  
R/W  
0
1
SPR1  
R/W  
0
0
SPR0  
R/W  
0
SPE  
R/W  
0
SPCR  
Read/Write  
Initial Value  
• Bit 7 – SPIE: SPI Interrupt Enable  
This bit causes the SPI interrupt to be executed if SPIF bit in the SPSR Register is set and the if  
the Global Interrupt Enable bit in SREG is set.  
• Bit 6 – SPE: SPI Enable  
When the SPE bit is written to one, the SPI is enabled. This bit must be set to enable any SPI  
operations.  
• Bit 5 – DORD: Data Order  
When the DORD bit is written to one, the LSB of the data word is transmitted first.  
When the DORD bit is written to zero, the MSB of the data word is transmitted first.  
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• Bit 4 – MSTR: Master/Slave Select  
This bit selects Master SPI mode when written to one, and Slave SPI mode when written logic  
zero. If SS is configured as an input and is driven low while MSTR is set, MSTR will be cleared,  
and SPIF in SPSR will become set. The user will then have to set MSTR to re-enable SPI Mas-  
ter mode.  
• Bit 3 – CPOL: Clock Polarity  
When this bit is written to one, SCK is high when idle. When CPOL is written to zero, SCK is low  
when idle. Refer to Figure 73 and Figure 74 for an example. The CPOL functionality is summa-  
rized below:  
Table 66. CPOL Functionality  
CPOL  
Leading Edge  
Rising  
Trailing Edge  
Falling  
0
1
Falling  
Rising  
• Bit 2 – CPHA: Clock Phase  
The settings of the Clock Phase bit (CPHA) determine if data is sampled on the leading (first) or  
trailing (last) edge of SCK. Refer to Figure 73 and Figure 74 for an example. The CPHA func-  
tionality is summarized below:  
Table 67. CPHA Functionality  
CPHA  
Leading Edge  
Sample  
Trailing Edge  
Setup  
0
1
Setup  
Sample  
• Bits 1, 0 – SPR1, SPR0: SPI Clock Rate Select 1 and 0  
These two bits control the SCK rate of the device configured as a Master. SPR1 and SPR0 have  
no effect on the Slave. The relationship between SCK and the Oscillator Clock frequency fosc is  
shown in the following table:  
Table 68. Relationship Between SCK and the Oscillator Frequency  
SPI2X  
SPR1  
SPR0  
SCK Frequency  
fosc/4  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
fosc/16  
fosc/64  
fosc/128  
fosc/2  
fosc/8  
fosc/32  
fosc/64  
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SPI Status Register –  
SPSR  
Bit  
7
SPIF  
R
6
5
4
3
2
1
0
SPI2X  
R/W  
0
WCOL  
SPSR  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
R
0
0
• Bit 7 – SPIF: SPI Interrupt Flag  
When a serial transfer is complete, the SPIF Flag is set. An interrupt is generated if SPIE in  
SPCR is set and global interrupts are enabled. If SS is an input and is driven low when the SPI is  
in master mode, this will also set the SPIF Flag. SPIF is cleared by hardware when executing the  
corresponding interrupt handling vector. Alternatively, the SPIF bit is cleared by first reading the  
SPI Status Register with SPIF set, then accessing the SPI Data Register (SPDR).  
• Bit 6 – WCOL: Write COLlision Flag  
The WCOL bit is set if the SPI Data Register (SPDR) is written during a data transfer. The  
WCOL bit (and the SPIF bit) are cleared by first reading the SPI Status Register with WCOL set,  
and then accessing the SPI Data Register.  
• Bit 5..1 – Res: Reserved Bits  
These bits are reserved bits in the ATmega162 and will always read as zero.  
• Bit 0 – SPI2X: Double SPI Speed Bit  
When this bit is written logic one the SPI speed (SCK Frequency) will be doubled when the SPI  
is in Master mode (see Table 68). This means that the minimum SCK period will be two CPU  
clock periods. When the SPI is configured as Slave, the SPI is only guaranteed to work at fosc/4  
or lower.  
The SPI interface on the ATmega162 is also used for program memory and EEPROM down-  
loading or uploading. See page 245 for SPI serial programming and verification.  
SPI Data Register –  
SPDR  
Bit  
7
6
5
4
3
2
1
0
MSB  
R/W  
X
LSB  
R/W  
X
SPDR  
Read/Write  
Initial Value  
R/W  
X
R/W  
X
R/W  
X
R/W  
X
R/W  
X
R/W  
X
Undefined  
The SPI Data Register is a read/write register used for data transfer between the Register File  
and the SPI Shift Register. Writing to the register initiates data transmission. Reading the regis-  
ter causes the Shift Register receive buffer to be read.  
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Data Modes  
There are four combinations of SCK phase and polarity with respect to serial data, which are  
determined by control bits CPHA and CPOL. The SPI data transfer formats are shown in Figure  
73 and Figure 74. Data bits are shifted out and latched in on opposite edges of the SCK signal,  
ensuring sufficient time for data signals to stabilize. This is clearly seen by summarizing Table  
66 and Table 67, as done below:  
Table 69. CPOL and CPHA Functionality  
Leading Edge  
Sample (Rising)  
Setup (Rising)  
Sample (Falling)  
Setup (Falling)  
Trailing Edge  
Setup (Falling)  
Sample (Falling)  
Setup (Rising)  
Sample (Rising)  
SPI Mode  
CPOL=0, CPHA=0  
CPOL=0, CPHA=1  
CPOL=1, CPHA=0  
CPOL=1, CPHA=1  
0
1
2
3
Figure 73. SPI Transfer Format with CPHA = 0  
SCK (CPOL = 0)  
mode 0  
SCK (CPOL = 1)  
mode 2  
SAMPLE I  
MOSI/MISO  
CHANGE 0  
MOSI PIN  
CHANGE 0  
MISO PIN  
SS  
MSB first (DORD = 0) MSB  
LSB first (DORD = 1) LSB  
Bit 6  
Bit 1  
Bit 5  
Bit 2  
Bit 4  
Bit 3  
Bit 3  
Bit 4  
Bit 2  
Bit 5  
Bit 1  
Bit 6  
LSB  
MSB  
Figure 74. SPI Transfer Format with CPHA = 1  
SCK (CPOL = 0)  
mode 1  
SCK (CPOL = 1)  
mode 3  
SAMPLE I  
MOSI/MISO  
CHANGE 0  
MOSI PIN  
CHANGE 0  
MISO PIN  
SS  
MSB first (DORD = 0)  
LSB first (DORD = 1)  
MSB  
LSB  
Bit 6  
Bit 1  
Bit 5  
Bit 2  
Bit 4  
Bit 3  
Bit 3  
Bit 4  
Bit 2  
Bit 5  
Bit 1  
Bit 6  
LSB  
MSB  
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USART  
The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a  
highly flexible serial communication device. The main features are:  
Full Duplex Operation (Independent Serial Receive and Transmit Registers)  
Asynchronous or Synchronous Operation  
Master or Slave Clocked Synchronous Operation  
High Resolution Baud Rate Generator  
Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits  
Odd or Even Parity Generation and Parity Check Supported by Hardware  
Data OverRun Detection  
Framing Error Detection  
Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter  
Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete  
Multi-processor Communication Mode  
Double Speed Asynchronous Communication Mode  
Dual USART  
The ATmega162 has two USARTs, USART0 and USART1. The functionality for both USARTs is  
described below.  
USART0 and USART1 have different I/O Registers as shown in “Register Summary” on page  
304. Note that in ATmega161 compatibility mode, the double buffering of the USART Receive  
Register is disabled. For details, see “AVR USART vs. AVR UART – Compatibility” on page 168.  
Note also that the shared UBRRHI Register in ATmega161 has been split into two separate reg-  
isters, UBRR0H and UBRR1H, in ATmega162.  
A simplified block diagram of the USART Transmitter is shown in Figure 75. CPU accessible I/O  
Registers and I/O pins are shown in bold.  
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Figure 75. USART Block Diagram(1)  
Clock Generator  
UBRR[H:L]  
OSC  
BAUD RATE GENERATOR  
SYNC LOGIC  
PIN  
CONTROL  
XCK  
TxD  
RxD  
Transmitter  
TX  
CONTROL  
UDR (Transmit)  
PARITY  
GENERATOR  
PIN  
CONTROL  
TRANSMIT SHIFT REGISTER  
Receiver  
CLOCK  
RECOVERY  
RX  
CONTROL  
DATA  
RECOVERY  
PIN  
CONTROL  
RECEIVE SHIFT REGISTER  
PARITY  
CHECKER  
UDR (Receive)  
UCSRA  
UCSRB  
UCSRC  
Note:  
1. Refer to Figure 1 on page 2, Table 34 on page 74, Table 39 on page 80, and Table 40 on page  
80 for USART pin placement.  
The dashed boxes in the block diagram separate the three main parts of the USART (listed from  
the top): Clock Generator, Transmitter and Receiver. Control registers are shared by all units.  
The Clock Generation logic consists of synchronization logic for external clock input used by  
synchronous slave operation, and the baud rate generator. The XCK (Transfer Clock) pin is only  
used by synchronous transfer mode. The Transmitter consists of a single write buffer, a serial  
Shift Register, parity generator and control logic for handling different serial frame formats. The  
write buffer allows a continuous transfer of data without any delay between frames. The  
Receiver is the most complex part of the USART module due to its clock and data recovery  
units. The recovery units are used for asynchronous data reception. In addition to the recovery  
units, the Receiver includes a Parity Checker, Control logic, a Shift Register and a two level  
receive buffer (UDR). The receiver supports the same frame formats as the Transmitter, and can  
detect Frame Error, Data OverRun and Parity Errors.  
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AVR USART vs. AVR  
UART – Compatibility  
The USART is fully compatible with the AVR UART regarding:  
Bit locations inside all USART Registers  
Baud Rate Generation  
Transmitter Operation  
Transmit Buffer Functionality  
Receiver Operation  
However, the receive buffering has two improvements that will affect the compatibility in some  
special cases:  
A second Buffer Register has been added. The two buffer registers operate as a circular  
FIFO buffer. Therefore the UDR must only be read once for each incoming data! More  
important is the fact that the Error Flags (FE and DOR) and the ninth data bit (RXB8) are  
buffered with the data in the receive buffer. Therefore the status bits must always be read  
before the UDR Register is read. Otherwise the error status will be lost since the buffer state  
is lost.  
The Receiver Shift Register can now act as a third buffer level. This is done by allowing the  
received data to remain in the serial Shift Register (see Figure 75) if the Buffer Registers are  
full, until a new start bit is detected. The USART is therefore more resistant to Data OverRun  
(DOR) error conditions.  
The following control bits have changed name, but have same functionality and register location:  
CHR9 is changed to UCSZ2.  
OR is changed to DOR.  
Clock Generation  
The Clock Generation logic generates the base clock for the Transmitter and Receiver. The  
USART supports four modes of clock operation: Normal asynchronous, Double Speed asyn-  
chronous, Master synchronous and Slave synchronous mode. The UMSEL bit in USART  
Control and Status Register C (UCSRC) selects between asynchronous and synchronous oper-  
ation. Double Speed (asynchronous mode only) is controlled by the U2X found in the UCSRA  
Register. When using synchronous mode (UMSEL = 1), the Data Direction Register for the XCK  
pin (DDR_XCK) controls whether the clock source is internal (Master mode) or external (Slave  
mode). The XCK pin is only active when using synchronous mode.  
Figure 76 shows a block diagram of the clock generation logic.  
Figure 76. Clock Generation Logic, Block Diagram  
UBRR  
U2X  
fosc  
UBRR+1  
Prescaling  
Down-Counter  
/ 2  
/ 4  
/ 2  
0
1
0
1
OSC  
txclk  
UMSEL  
rxclk  
DDR_XCK  
Sync  
Register  
Edge  
Detector  
xcki  
0
1
XCK  
Pin  
xcko  
DDR_XCK  
UCPOL  
1
0
Signal description:  
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txclk Transmitter clock. (Internal Signal)  
rxclk Receiver base clock. (Internal Signal)  
xcki  
Input from XCK pin (internal Signal). Used for synchronous slave operation.  
xcko Clock output to XCK pin (Internal Signal). Used for synchronous master  
operation.  
fosc  
XTAL pin frequency (System Clock).  
Internal Clock  
Generation – The  
Baud Rate Generator  
Internal clock generation is used for the asynchronous and the synchronous master modes of  
operation. The description in this section refers to Figure 76.  
The USART Baud Rate Register (UBRR) and the down-counter connected to it function as a  
programmable prescaler or baud rate generator. The down-counter, running at system clock  
(fosc), is loaded with the UBRR value each time the counter has counted down to zero or when  
the UBRRL Register is written. A clock is generated each time the counter reaches zero. This  
clock is the baud rate generator clock output (= fosc/(UBRR+1)). The Transmitter divides the  
baud rate generator clock output by 2, 8 or 16 depending on mode. The baud rate generator out-  
put is used directly by the receiver’s clock and data recovery units. However, the recovery units  
use a state machine that uses 2, 8 or 16 states depending on mode set by the state of the  
UMSEL, U2X and DDR_XCK bits.  
Table 70 contains equations for calculating the baud rate (in bits per second) and for calculating  
the UBRR value for each mode of operation using an internally generated clock source.  
Table 70. Equations for Calculating Baud Rate Register Setting  
Equation for Calculating  
Baud Rate(1)  
Equation for Calculating  
UBRR Value  
Operating Mode  
Asynchronous Normal Mode  
(U2X = 0)  
f
f
OSC  
OSC  
BAUD = --------------------------------------  
16(UBRR + 1)  
UBRR = ----------------------- 1  
16BAUD  
Asynchronous Double Speed  
Mode (U2X = 1)  
f
f
OSC  
OSC  
BAUD = -----------------------------------  
8(UBRR + 1)  
UBRR = -------------------- 1  
8BAUD  
Synchronous Master Mode  
f
f
OSC  
OSC  
BAUD = -----------------------------------  
2(UBRR + 1)  
UBRR = -------------------- 1  
2BAUD  
Note:  
BAUD Baud rate (in bits per second, bps)  
fOSC System Oscillator clock frequency  
1. The baud rate is defined to be the transfer rate in bit per second (bps).  
UBRR Contents of the UBRRH and UBRRL Registers, (0 - 4095)  
Some examples of UBRR values for some system clock frequencies are found in Table 78 (see  
page 191).  
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Double Speed  
Operation (U2X)  
The transfer rate can be doubled by setting the U2X bit in UCSRA. Setting this bit only has effect  
for the asynchronous operation. Set this bit to zero when using synchronous operation.  
Setting this bit will reduce the divisor of the baud rate divider from 16 to 8, effectively doubling  
the transfer rate for asynchronous communication. Note however that the Receiver will in this  
case only use half the number of samples (reduced from 16 to 8) for data sampling and clock  
recovery, and therefore a more accurate baud rate setting and system clock are required when  
this mode is used. For the Transmitter, there are no downsides.  
External Clock  
External clocking is used by the synchronous slave modes of operation. The description in this  
section refers to Figure 76 for details.  
External clock input from the XCK pin is sampled by a synchronization register to minimize the  
chance of meta-stability. The output from the synchronization register must then pass through  
an edge detector before it can be used by the Transmitter and Receiver. This process intro-  
duces a two CPU clock period delay and therefore the maximum external XCK clock frequency  
is limited by the following equation:  
f
OSC  
f
< -----------  
XCK  
4
Note that fosc depends on the stability of the system clock source. It is therefore recommended to  
add some margin to avoid possible loss of data due to frequency variations.  
Synchronous Clock  
Operation  
When synchronous mode is used (UMSEL = 1), the XCK pin will be used as either clock input  
(Slave) or clock output (Master). The dependency between the clock edges and data sampling  
or data change is the same. The basic principle is that data input (on RxD) is sampled at the  
opposite XCK clock edge of the edge the data output (TxD) is changed.  
Figure 77. Synchronous Mode XCK Timing.  
UCPOL = 1  
XCK  
RxD / TxD  
Sample  
Sample  
UCPOL = 0  
XCK  
RxD / TxD  
The UCPOL bit UCRSC selects which XCK clock edge is used for data sampling and which is  
used for data change. As Figure 77 shows, when UCPOL is zero the data will be changed at ris-  
ing XCK edge and sampled at falling XCK edge. If UCPOL is set, the data will be changed at  
falling XCK edge and sampled at rising XCK edge.  
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Frame Formats  
A serial frame is defined to be one character of data bits with synchronization bits (start and stop  
bits), and optionally a parity bit for error checking. The USART accepts all 30 combinations of  
the following as valid frame formats:  
1 start bit  
5, 6, 7, 8, or 9 data bits  
no, even or odd parity bit  
1 or 2 stop bits  
A frame starts with the start bit followed by the least significant data bit. Then the next data bits,  
up to a total of nine, are succeeding, ending with the most significant bit. If enabled, the parity bit  
is inserted after the data bits, before the stop bits. When a complete frame is transmitted, it can  
be directly followed by a new frame, or the communication line can be set to an idle (high) state.  
Figure 78 illustrates the possible combinations of the frame formats. Bits inside brackets are  
optional.  
Figure 78. Frame Formats  
FRAME  
(IDLE)  
St  
0
1
2
3
4
[5]  
[6]  
[7]  
[8]  
[P] Sp1 [Sp2] (St / IDLE)  
St  
(n)  
P
Start bit, always low.  
Data bits (0 to 8).  
Parity bit. Can be odd or even.  
Stop bit, always high.  
Sp  
IDLE No transfers on the communication line (RxD or TxD). An IDLE line must be  
high.  
The frame format used by the USART is set by the UCSZ2:0, UPM1:0 and USBS bits in UCSRB  
and UCSRC. The Receiver and Transmitter use the same setting. Note that changing the setting  
of any of these bits will corrupt all ongoing communication for both the Receiver and Transmitter.  
The USART Character SiZe (UCSZ2:0) bits select the number of data bits in the frame. The  
USART Parity mode (UPM1:0) bits enable and set the type of parity bit. The selection between  
one or two stop bits is done by the USART Stop Bit Select (USBS) bit. The receiver ignores the  
second stop bit. An FE (Frame Error) will therefore only be detected in the cases where the first  
stop bit is zero.  
Parity Bit Calculation  
The parity bit is calculated by doing an exclusive-or of all the data bits. If odd parity is used, the  
result of the exclusive or is inverted. The relation between the parity bit and data bits is as  
follows::  
P
P
= d  
= d  
⊕ … ⊕ d d d d 0  
3 2 1 0  
even  
n 1  
n 1  
⊕ … ⊕ d d d d 1  
odd  
3 2 1 0  
Peven Parity bit using even parity  
Podd  
dn  
Parity bit using odd parity  
Data bit n of the character  
If used, the parity bit is located between the last data bit and first stop bit of a serial frame.  
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USART  
Initialization  
The USART has to be initialized before any communication can take place. The initialization pro-  
cess normally consists of setting the baud rate, setting frame format and enabling the  
Transmitter or the Receiver depending on the usage. For interrupt driven USART operation, the  
Global Interrupt Flag should be cleared (and interrupts globally disabled) when doing the  
initialization.  
Before doing a re-initialization with changed baud rate or frame format, be sure that there are no  
ongoing transmissions during the period the registers are changed. The TXC Flag can be used  
to check that the Transmitter has completed all transfers, and the RXC Flag can be used to  
check that there are no unread data in the receive buffer. Note that the TXC Flag must be  
cleared before each transmission (before UDR is written) if it is used for this purpose.  
The following simple USART initialization code examples show one assembly and one C func-  
tion that are equal in functionality. The examples assume asynchronous operation using polling  
(no interrupts enabled) and a fixed frame format. The baud rate is given as a function parameter.  
For the assembly code, the baud rate parameter is assumed to be stored in the r17:r16 Regis-  
ters. When the function writes to the UCSRC Register, the URSEL bit (MSB) must be set due to  
the sharing of I/O location by UBRRH and UCSRC.  
Assembly Code Example(1)  
USART_Init:  
; Set baud rate  
out  
out  
UBRRH, r17  
UBRRL, r16  
; Enable receiver a?d transmitter  
ldi  
out  
r16, (1<<RXEN)|(1<<TXEN)  
UCSRB,r16  
; Set frame format:?8data, 2stop bit  
ldi  
out  
ret  
r16, (1<<URSEL)|(1<<USBS)|(3<<UCSZ0)  
UCSRC,r16  
C Code Example(1)  
#define FOSC 1843200// Clock Speed  
#define BAUD 9600  
#define MYUBRR FOSC/16/BAUD-1  
void main( void )  
{
...  
USART_Init ( MYUBRR );  
...  
}
void USART_Init( unsigned int ubrr )  
{
/* Set baud rate */  
UBRRH = (unsigned c?ar)(ubrr>>8);  
UBRRL = (unsigned c?ar)ubrr;  
/* Enable receiver ?nd transmitter */  
UCSRB = (1<<RXEN)|(1<<TX?N);  
/* Set frame format? 8data, 2stop bit */  
UCSRC = (1<<URSEL)|(1<<U?BS)|(3<<UCSZ0);  
}
Note:  
1. See “About Code Examples” on page 8.  
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More advanced initialization routines can be made that include frame format as parameters, dis-  
able interrupts and so on. However, many applications use a fixed setting of the Baud and  
Control Registers, and for these types of applications the initialization code can be placed  
directly in the main routine, or be combined with initialization code for other I/O modules.  
Data Transmission The USART Transmitter is enabled by setting the Transmit Enable (TXEN) bit in the UCSRB  
Register. When the Transmitter is enabled, the normal port operation of the TxD pin is overrid-  
den by the USART and given the function as the transmitter’s serial output. The baud rate, mode  
of operation and frame format must be set up once before doing any transmissions. If synchro-  
nous operation is used, the clock on the XCK pin will be overridden and used as transmission  
clock.  
– The USART  
Transmitter  
Sending Frames with  
5 to 8 Data Bit  
A data transmission is initiated by loading the transmit buffer with the data to be transmitted. The  
CPU can load the transmit buffer by writing to the UDR I/O location. The buffered data in the  
transmit buffer will be moved to the Shift Register when the Shift Register is ready to send a new  
frame. The Shift Register is loaded with new data if it is in idle state (no ongoing transmission) or  
immediately after the last stop bit of the previous frame is transmitted. When the Shift Register is  
loaded with new data, it will transfer one complete frame at the rate given by the Baud Register,  
U2X bit or by XCK depending on mode of operation.  
The following code examples show a simple USART transmit function based on polling of the  
Data Register Empty (UDRE) Flag. When using frames with less than eight bits, the most signif-  
icant bits written to the UDR are ignored. The USART has to be initialized before the function  
can be used. For the assembly code, the data to be sent is assumed to be stored in Register  
R16  
Assembly Code Example(1)  
USART_Transmit:  
; Wait for empty tr?nsmit buffer  
sbis UCSRA,UDRE  
rjmp USART_Transmit  
; Put data (r16) in?o buffer, sends the data  
out  
ret  
UDR,r16  
C Code Example(1)  
void USART_Transmit( unsigned char data )  
{
/* Wait for empty t?ansmit buffer */  
while ( !( UCSRA & ?1<<UDRE)) )  
;
/* Put data into bu?fer, sends the data */  
UDR = data;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
The function simply waits for the transmit buffer to be empty by checking the UDRE Flag, before  
loading it with new data to be transmitted. If the Data Register Empty interrupt is utilized, the  
interrupt routine writes the data into the buffer.  
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Sending Frames with  
9 Data Bit  
If 9-bit characters are used (UCSZ = 7), the ninth bit must be written to the TXB8 bit in UCSRB  
before the low byte of the character is written to UDR. The following code examples show a  
transmit function that handles 9-bit characters. For the assembly code, the data to be sent is  
assumed to be stored in Registers R17:R16.  
Assembly Code Example(1)  
USART_Transmit:  
; Wait for empty tr?nsmit buffer  
sbis UCSRA,UDRE  
rjmp USART_Transmit  
; Copy 9th bit from?r17 to TXB8  
cbi  
UCSRB,TXB8  
sbrc r17,0  
sbi  
UCSRB,TXB8  
; Put LSB data (r16? into buffer, sends the data  
out  
ret  
UDR,r16  
C Code Example(1)  
void USART_Transmit( unsigned int data )  
{
/* Wait for empty t?ansmit buffer */  
while ( !( UCSRA & ?1<<UDRE)) )  
;
/* Copy 9th bit to ?XB8 */  
UCSRB &= ~(1<<TXB8);  
if ( data & 0x0100 )  
UCSRB |= (1<<TXB8);  
/* Put data into bu?fer, sends the data */  
UDR = data;  
}
Note:  
1. These transmit functions are written to be general functions. They can be optimized if the con-  
tents of the UCSRB is static. For example, only the TXB8 bit of the UCSRB Register is used  
after initialization.  
The ninth bit can be used for indicating an address frame when using multi processor communi-  
cation mode or for other protocol handling as for example synchronization.  
Transmitter Flags and The USART Transmitter has two flags that indicate its state: USART Data Register Empty  
Interrupts  
(UDRE) and Transmit Complete (TXC). Both flags can be used for generating interrupts.  
The Data Register Empty (UDRE) Flag indicates whether the transmit buffer is ready to receive  
new data. This bit is set when the transmit buffer is empty, and cleared when the transmit buffer  
contains data to be transmitted that has not yet been moved into the Shift Register. For compat-  
ibility with future devices, always write this bit to zero when writing the UCSRA Register.  
When the Data Register Empty Interrupt Enable (UDRIE) bit in UCSRB is written to one, the  
USART Data Register Empty Interrupt will be executed as long as UDRE is set (provided that  
global interrupts are enabled). UDRE is cleared by writing UDR. When interrupt-driven data  
transmission is used, the Data Register Empty Interrupt routine must either write new data to  
UDR in order to clear UDRE or disable the Data Register Empty Interrupt, otherwise a new inter-  
rupt will occur once the interrupt routine terminates.  
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The Transmit Complete (TXC) Flag bit is set one when the entire frame in the Transmit Shift  
Register has been shifted out and there are no new data currently present in the transmit buffer.  
The TXC Flag bit is automatically cleared when a transmit complete interrupt is executed, or it  
can be cleared by writing a one to its bit location. The TXC Flag is useful in half-duplex commu-  
nication interfaces (like the RS-485 standard), where a transmitting application must enter  
Receive mode and free the communication bus immediately after completing the transmission.  
When the Transmit Compete Interrupt Enable (TXCIE) bit in UCSRB is set, the USART Transmit  
Complete Interrupt will be executed when the TXC Flag becomes set (provided that global inter-  
rupts are enabled). When the transmit complete interrupt is used, the interrupt handling routine  
does not have to clear the TXC Flag, this is done automatically when the interrupt is executed.  
Parity Generator  
The Parity Generator calculates the parity bit for the serial frame data. When parity bit is enabled  
(UPM1 = 1), the transmitter control logic inserts the parity bit between the last data bit and the  
first stop bit of the frame that is sent.  
Disabling the  
Transmitter  
The disabling of the Transmitter (setting the TXEN to zero) will not become effective until ongo-  
ing and pending transmissions are completed, i.e., when the Transmit Shift Register and  
Transmit Buffer Register do not contain data to be transmitted. When disabled, the Transmitter  
will no longer override the TxD pin.  
Data Reception –  
The USART  
Receiver  
The USART Receiver is enabled by writing the Receive Enable (RXEN) bit in the UCSRB Regis-  
ter to one. When the receiver is enabled, the normal pin operation of the RxD pin is overridden  
by the USART and given the function as the receiver’s serial input. The baud rate, mode of oper-  
ation and frame format must be set up once before any serial reception can be done. If  
synchronous operation is used, the clock on the XCK pin will be used as transfer clock.  
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Receiving Frames with The Receiver starts data reception when it detects a valid start bit. Each bit that follows the start  
5 to 8 Data Bits  
bit will be sampled at the baud rate or XCK clock, and shifted into the Receive Shift Register until  
the first stop bit of a frame is received. A second stop bit will be ignored by the Receiver. When  
the first stop bit is received, i.e., a complete serial frame is present in the Receive Shift Register,  
the contents of the Shift Register will be moved into the receive buffer. The receive buffer can  
then be read by reading the UDR I/O location.  
The following code example shows a simple USART receive function based on polling of the  
Receive Complete (RXC) Flag. When using frames with less than eight bits the most significant  
bits of the data read from the UDR will be masked to zero. The USART has to be initialized  
before the function can be used.  
Assembly Code Example(1)  
USART_Receive:  
; Wait for data to ?e received  
sbis UCSRA, RXC  
rjmp USART_Receive  
; Get and return re?eived data from buffer  
in  
r16, UDR  
ret  
C Code Example(1)  
unsigned char USART_Receive( void )  
{
/* Wait for data to?be received */  
while ( !(UCSRA & (?<<RXC)) )  
;
/* Get and return r?ceived data from buffer */  
return UDR;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
The function simply waits for data to be present in the receive buffer by checking the RXC Flag,  
before reading the buffer and returning the value.  
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Receiving Frames with If 9-bit characters are used (UCSZ=7) the ninth bit must be read from the RXB8 bit in UCSRB  
9 Data Bits  
before reading the low bits from the UDR. This rule applies to the FE, DOR and UPE Status  
Flags as well. Read status from UCSRA, then data from UDR. Reading the UDR I/O location will  
change the state of the receive buffer FIFO and consequently the TXB8, FE, DOR and UPE bits,  
which all are stored in the FIFO, will change.  
The following code example shows a simple USART receive function that handles both nine bit  
characters and the status bits.  
Assembly Code Example(1)  
USART_Receive:  
; Wait for data to ?e received  
sbis UCSRA, RXC  
rjmp USART_Receive  
; Get status and 9t? bit, then data from buffer  
in  
in  
in  
r18, UCSRA  
r17, UCSRB  
r16, UDR  
; If error, return ?1  
andi r18,(1<<FE)|(1<<DOR)|(1<<UPE)  
breq USART_ReceiveNoError  
ldi  
ldi  
r17, HIGH(-1)  
r16, LOW(-1)  
USART_ReceiveNoError:  
; Filter the 9th bi?, then return  
lsr  
r17  
andi r17, 0x01  
ret  
C Code Example(1)  
unsigned int USART_Receive( void )  
{
unsigned char statu?, resh, resl;  
/* Wait for data to?be received */  
while ( !(UCSRA & (?<<RXC)) )  
;
/* Get status and 9?h bit, then data */  
/* from buffer */  
status = UCSRA;  
resh = UCSRB;  
resl = UDR;  
/* If error, return?-1 */  
if ( status & (1<<F?)|(1<<DOR)|(1<<UPE) )  
return -1;  
/* Filter the 9th b?t, then return */  
resh = (resh >> 1) & 0x0?;  
return ((resh << 8)?| resl);  
}
Note:  
1. The example code assumes that the part specific header file is included.  
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The receive function example reads all the I/O Registers into the Register File before any com-  
putation is done. This gives an optimal receive buffer utilization since the buffer location read will  
be free to accept new data as early as possible.  
Receive Compete Flag The USART Receiver has one flag that indicates the receiver state.  
and Interrupt  
The Receive Complete (RXC) Flag indicates if there are unread data present in the receive buf-  
fer. This flag is one when unread data exist in the receive buffer, and zero when the receive  
buffer is empty (i.e., does not contain any unread data). If the Receiver is disabled (RXEN = 0),  
the receive buffer will be flushed and consequently the RXC bit will become zero.  
When the Receive Complete Interrupt Enable (RXCIE) in UCSRB is set, the USART Receive  
Complete Interrupt will be executed as long as the RXC Flag is set (provided that global inter-  
rupts are enabled). When interrupt-driven data reception is used, the receive complete routine  
must read the received data from UDR in order to clear the RXC Flag, otherwise a new interrupt  
will occur once the interrupt routine terminates.  
Receiver Error Flags  
The USART Receiver has three Error Flags: Frame Error (FE), Data OverRun (DOR) and Parity  
Error (UPE). All can be accessed by reading UCSRA. Common for the Error Flags is that they  
are located in the receive buffer together with the frame for which they indicate the error status.  
Due to the buffering of the Error Flags, the UCSRA must be read before the receive buffer  
(UDR), since reading the UDR I/O location changes the buffer read location. Another equality for  
the Error Flags is that they can not be altered by software doing a write to the flag location. How-  
ever, all flags must be set to zero when the UCSRA is written for upward compatibility of future  
USART implementations. None of the Error Flags can generate interrupts.  
The Frame Error (FE) Flag indicates the state of the first stop bit of the next readable frame  
stored in the receive buffer. The FE Flag is zero when the stop bit was correctly read (as one),  
and the FE Flag will be one when the stop bit was incorrect (zero). This flag can be used for  
detecting out-of-sync conditions, detecting break conditions and protocol handling. The FE Flag  
is not affected by the setting of the USBS bit in UCSRC since the receiver ignores all, except for  
the first, stop bits. For compatibility with future devices, always set this bit to zero when writing to  
UCSRA.  
The Data OverRun (DOR) Flag indicates data loss due to a receiver buffer full condition. A Data  
OverRun occurs when the receive buffer is full (two characters), it is a new character waiting in  
the Receive Shift Register, and a new start bit is detected. If the DOR Flag is set there was one  
or more serial frame lost between the frame last read from UDR, and the next frame read from  
UDR. For compatibility with future devices, always write this bit to zero when writing to UCSRA.  
The DOR Flag is cleared when the frame received was successfully moved from the Shift Regis-  
ter to the receive buffer.  
The Parity Error (UPE) Flag indicates that the next frame in the receive buffer had a Parity Error  
when received. If parity check is not enabled the UPE bit will always be read zero. For compati-  
bility with future devices, always set this bit to zero when writing to UCSRA. For more details see  
“Parity Bit Calculation” on page 171 and “Parity Checker” on page 179.  
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Parity Checker  
The Parity Checker is active when the high USART Parity mode (UPM1) bit is set. Type of parity  
check to be performed (odd or even) is selected by the UPM0 bit. When enabled, the Parity  
Checker calculates the parity of the data bits in incoming frames and compares the result with  
the parity bit from the serial frame. The result of the check is stored in the receive buffer together  
with the received data and stop bits. The Parity Error (UPE) Flag can then be read by software to  
check if the frame had a Parity Error.  
The UPE bit is set if the next character that can be read from the receive buffer had a parity error  
when received and the parity checking was enabled at that point (UPM1 = 1). This bit is valid  
until the receive buffer (UDR) is read.  
Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoing  
receptions will therefore be lost. When disabled (i.e., the RXEN is set to zero) the receiver will no  
longer override the normal function of the RxD port pin. The receiver buffer FIFO will be flushed  
when the receiver is disabled. Remaining data in the buffer will be lost  
Flushing the Receive  
Buffer  
The receiver buffer FIFO will be flushed when the Receiver is disabled, i.e., the buffer will be  
emptied of its contents. Unread data will be lost. If the buffer has to be flushed during normal  
operation, due to for instance an error condition, read the UDR I/O location until the RXC Flag is  
cleared. The following code example shows how to flush the receive buffer.  
Assembly Code Example(1)  
USART_Flush:  
sbis UCSRA, RXC  
ret  
in  
r16, UDR  
rjmp USART_Flush  
C Code Example(1)  
void USART_Flush( void )  
{
unsigned char dummy?  
while ( UCSRA & (1<?RXC) ) dummy = UDR;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
Asynchronous  
Data Reception  
The USART includes a clock recovery and a data recovery unit for handling asynchronous data  
reception. The clock recovery logic is used for synchronizing the internally generated baud rate  
clock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic sam-  
ples and low pass filters each incoming bit, thereby improving the noise immunity of the receiver.  
The asynchronous reception operational range depends on the accuracy of the internal baud  
rate clock, the rate of the incoming frames, and the frame size in number of bits.  
Asynchronous Clock  
Recovery  
The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 79  
illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 times  
the baud rate for Normal mode, and 8 times the baud rate for Double Speed mode. The horizon-  
tal arrows illustrate the synchronization variation due to the sampling process. Note the larger  
time variation when using the double speed mode (U2X = 1) of operation. Samples denoted zero  
are samples done when the RxD line is idle (i.e., no communication activity).  
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Figure 79. Start Bit Sampling  
RxD  
IDLE  
START  
BIT 0  
Sample  
(U2X = 0)  
0
0
1
1
2
3
2
4
5
3
6
7
4
8
9
5
10  
11  
6
12  
13  
7
14  
15  
8
16  
1
1
2
3
Sample  
(U2X = 1)  
0
2
When the clock recovery logic detects a high (idle) to low (start) transition on the RxD line, the  
start bit detection sequence is initiated. Let sample 1 denote the first zero-sample as shown in  
the figure. The clock recovery logic then uses samples 8, 9 and 10 for Normal mode, and sam-  
ples 4, 5 and 6 for Double Speed mode (indicated with sample numbers inside boxes on the  
figure), to decide if a valid start bit is received. If two or more of these three samples have logical  
high levels (the majority wins), the start bit is rejected as a noise spike and the receiver starts  
looking for the next high to low-transition. If however, a valid start bit is detected, the clock recov-  
ery logic is synchronized and the data recovery can begin. The synchronization process is  
repeated for each start bit.  
Asynchronous Data  
Recovery  
When the receiver clock is synchronized to the start bit, the data recovery can begin. The data  
recovery unit uses a state machine that has 16 states for each bit in Normal mode and 8 states  
for each bit in Double Speed mode. Figure 80 shows the sampling of the data bits and the parity  
bit. Each of the samples is given a number that is equal to the state of the recovery unit.  
Figure 80. Sampling of Data and Parity Bit  
RxD  
BIT n  
Sample  
(U2X = 0)  
1
1
2
3
2
4
5
3
6
7
4
8
9
5
10  
11  
6
12  
13  
7
14  
15  
8
16  
1
1
Sample  
(U2X = 1)  
The decision of the logic level of the received bit is taken by doing a majority voting of the logic  
value to the three samples in the center of the received bit. The center samples are emphasized  
on the figure by having the sample number inside boxes. The majority voting process is done as  
follows: If two or all three samples have high levels, the received bit is registered to be a logic 1.  
If two or all three samples have low levels, the received bit is registered to be a logic 0. This  
majority voting process acts as a low pass filter for the incoming signal on the RxD pin. The  
recovery process is then repeated until a complete frame is received. Including the first stop bit.  
Note that the receiver only uses the first stop bit of a frame.  
Figure 81 shows the sampling of the stop bit and the earliest possible beginning of the start bit of  
the next frame.  
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Figure 81. Stop Bit Sampling and Next Start Bit Sampling  
(A)  
(B)  
(C)  
RxD  
STOP 1  
Sample  
(U2X = 0)  
1
1
2
3
2
4
5
3
6
7
4
8
9
5
10  
0/1 0/1 0/1  
Sample  
(U2X = 1)  
6
0/1  
The same majority voting is done to the stop bit as done for the other bits in the frame. If the stop  
bit is registered to have a logic 0 value, the Frame Error (FE) Flag will be set.  
A new high to low transition indicating the start bit of a new frame can come right after the last of  
the bits used for majority voting. For Normal Speed mode, the first low level sample can be at  
point marked (A) in Figure 81. For Double Speed mode the first low level must be delayed to (B).  
(C) marks a stop bit of full length. The early start bit detection influences the operational range of  
the receiver.  
Asynchronous  
Operational Range  
The operational range of the receiver is dependent on the mismatch between the received bit  
rate and the internally generated baud rate. If the Transmitter is sending frames at too fast or too  
slow bit rates, or the internally generated baud rate of the receiver does not have a similar (see  
Table 71) base frequency, the receiver will not be able to synchronize the frames to the start bit.  
The following equations can be used to calculate the ratio of the incoming data rate and internal  
receiver baud rate.  
(D + 2)S  
(D + 1)S + S  
(D + 1)S  
S 1 + D S + S  
R
= -----------------------------------  
R
= ------------------------------------------  
fast  
slow  
M
F
D
S
Sum of character size and parity size (D = 5 to 10 bit)  
Samples per bit. S = 16 for Normal Speed mode and S = 8 for Double Speed  
mode.  
SF  
First sample number used for majority voting. SF = 8 for Normal Speed and  
SF = 4 for Double Speed mode.  
SM Middle sample number used for majority voting. SM = 9 for Normal Speed and  
SM = 5 for Double Speed mode.  
Rslow is the ratio of the slowest incoming data rate that can be accepted in relation to the  
receiver baud rate. Rfast is the ratio of the fastest incoming data rate that can be  
accepted in relation to the receiver baud rate.  
Table 71 and Table 72 list the maximum receiver baud rate error that can be tolerated. Note that  
normal speed mode has higher toleration of baud rate variations.  
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Table 71. Recommended Maximum Receiver Baud Rate Error for Normal Speed Mode (U2X =  
0)  
D
Recommended Max.  
Receiver Error (%)  
# (Data+Parity Bit)  
Rslow (%) Rfast (%) Max. Total Error (%)  
5
6
93.20  
94.12  
94.81  
95.36  
95.81  
96.17  
106.67  
105.79  
105.11  
104.58  
104.14  
103.78  
+6.67/-6.8%  
+5.79/-5.88  
+5.11/-5.19  
+4.58/-4.54  
+4.14/-4.19  
+3.7 /-3.83  
3.0  
2.5  
2.0  
2.0  
1.5  
1.5  
7
8
9
10  
Table 72. Recommended Maximum Receiver Baud Rate Error for Double Speed Mode (U2X =  
1)  
D
Recommended Max.  
Receiver Error (%)  
# (Data+Parity Bit) Rslow (%) Rfast (%) Max. Total Error (%)  
5
6
94.12  
94.92  
95.52  
96.00  
96.39  
96.70  
105.66  
104.92  
104.35  
103.90  
103.53  
103.23  
+5.66/-5.88  
+4.92/-5.08  
+4.35/-4.48  
+3.90/-4.00  
+3.53/-3.61  
+3.23/-3.30  
2.5  
2.0  
1.5  
1.5  
1.5  
1.0  
7
8
9
10  
The recommendations of the maximum receiver baud rate error was made under the assump-  
tion that the Receiver and Transmitter equally divides the maximum total error.  
There are two possible sources for the receivers baud rate error. The receiver’s system clock  
(XTAL) will always have some minor instability over the supply voltage range and the tempera-  
ture range. When using a crystal to generate the system clock, this is rarely a problem, but for a  
resonator the system clock may differ more than 2% depending of the resonators tolerance. The  
second source for the error is more controllable. The baud rate generator can not always do an  
exact division of the system frequency to get the baud rate wanted. In this case an UBRR value  
that gives an acceptable low error can be used if possible.  
Multi-processor  
Communication  
Mode  
Setting the Multi-processor Communication mode (MPCM) bit in UCSRA enables a filtering  
function of incoming frames received by the USART Receiver. Frames that do not contain  
address information will be ignored and not put into the receive buffer. This effectively reduces  
the number of incoming frames that has to be handled by the CPU, in a system with multiple  
MCUs that communicate via the same serial bus. The Transmitter is unaffected by the MPCM  
setting, but has to be used differently when it is a part of a system utilizing the Multi-processor  
Communication mode.  
If the receiver is set up to receive frames that contain 5 to 8 data bits, then the first stop bit indi-  
cates if the frame contains data or address information. If the receiver is set up for frames with  
nine data bits, then the ninth bit (RXB8) is used for identifying address and data frames. When  
the frame type bit (the first stop or the ninth bit) is one, the frame contains an address. When the  
frame type bit is zero the frame is a data frame.  
The Multi-processor Communication mode enables several slave MCUs to receive data from a  
Master MCU. This is done by first decoding an address frame to find out which MCU has been  
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addressed. If a particular slave MCU has been addressed, it will receive the following data  
frames as normal, while the other slave MCUs will ignore the received frames until another  
address frame is received.  
Using MPCM  
For an MCU to act as a Master MCU, it can use a 9-bit character frame format (UCSZ = 7). The  
ninth bit (TXB8) must be set when an address frame (TXB8 = 1) or cleared when a data frame  
(TXB = 0) is being transmitted. The slave MCUs must in this case be set to use a 9-bit character  
frame format.  
The following procedure should be used to exchange data in Multi-processor Communication  
mode:  
1. All Slave MCUs are in Multi-processor Communication mode (MPCM in UCSRA is set).  
2. The Master MCU sends an address frame, and all slaves receive and read this frame. In  
the slave MCUs, the RXC Flag in UCSRA will be set as normal.  
3. Each Slave MCU reads the UDR Register and determines if it has been selected. If so, it  
clears the MPCM bit in UCSRA, otherwise it waits for the next address byte and keeps  
the MPCM setting.  
4. The addressed MCU will receive all data frames until a new address frame is received.  
The other Slave MCUs, which still have the MPCM bit set, will ignore the data frames.  
5. When the last data frame is received by the addressed MCU, the addressed MCU sets  
the MPCM bit and waits for a new address frame from master. The process then repeats  
from 2.  
Using any of the 5- to 8-bit character frame formats is possible, but impractical since the receiver  
must change between using n and n+1 character frame formats. This makes full-duplex opera-  
tion difficult since the Transmitter and Receiver uses the same character size setting. If 5 to 8 bit  
character frames are used, the Transmitter must be set to use two stop bit (USBS = 1) since the  
first stop bit is used for indicating the frame type.  
Do not use Read-Modify-Write instructions (SBI and CBI) to set or clear the MPCM bit. The  
MPCM bit shares the same I/O location as the TXC Flag and this might accidentally be cleared  
when using SBI or CBI instructions.  
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Accessing  
UBRRH/  
The UBRRH Register shares the same I/O location as the UCSRC Register. Therefore some  
special consideration must be taken when accessing this I/O location.  
UCSRC Registers  
Write Access  
When doing a write access of this I/O location, the high bit of the value written, the USART Reg-  
ister Select (URSEL) bit, controls which one of the two registers that will be written. If URSEL is  
zero during a write operation, the UBRRH value will be updated. If URSEL is one, the UCSRC  
setting will be updated.  
The following code examples show how to access the two registers.  
Assembly Code Examples(1)  
...  
; Set UBRRH to 2  
ldi r16,0x02  
out UBRRH,r16  
...  
; Set the USBS and ?he UCSZ1 bit to one, and  
; the remaining bit? to zero.  
ldi r16,(1<<URSEL)|(1<<USBS)|(1<<UCSZ1)  
out UCSRC,r16  
...  
C Code Examples(1)  
...  
/* Set UBRRH to 2 */  
UBRRH = 0x02;  
...  
/* Set the USBS and?the UCSZ1 bit to one, and */  
/* the remaining bi?s to zero. */  
UCSRC = (1<<URSEL)|(1<<U?BS)|(1<<UCSZ1);  
...  
Note:  
1. The example code assumes that the part specific header file is included.  
As the code examples illustrate, write accesses of the two registers are relatively unaffected of  
the sharing of I/O location.  
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Read Access  
Doing a read access to the UBRRH or the UCSRC Register is a more complex operation. How-  
ever, in most applications, it is rarely necessary to read any of these registers.  
The read access is controlled by a timed sequence. Reading the I/O location once returns the  
UBRRH Register contents. If the register location was read in previous system clock cycle, read-  
ing the register in the current clock cycle will return the UCSRC contents. Note that the timed  
sequence for reading the UCSRC is an atomic operation. Interrupts must therefore be controlled  
(e.g., by disabling interrupts globally) during the read operation.  
The following code example shows how to read the UCSRC Register contents.  
Assembly Code Example(1)  
USART_ReadUCSRC:  
; Read UCSRC  
in r16,UBRRH  
in r16,UCSRC  
ret  
C Code Example(1)  
unsigned char USART_ReadUCSRC( void )  
{
unsigned char ucsrc?  
/* Read UCSRC ?/  
ucsrc = UBRRH;  
ucsrc = UCSRC;  
return ucsrc;  
}
Note:  
1. The example code assumes that the part specific header file is included.  
The assembly code example returns the UCSRC value in r16.  
Reading the UBRRH contents is not an atomic operation and therefore it can be read as an ordi-  
nary register, as long as the previous instruction did not access the register location.  
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USART Register  
Description  
USART I/O Data  
Register – UDR  
Bit  
7
6
5
4
3
2
1
0
RXB[7:0]  
TXB[7:0]  
UDR (Read)  
UDR (Write)  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The USART Transmit Data Buffer Register and USART Receive Data Buffer Registers share the  
same I/O address referred to as USART Data Register or UDR. The Transmit Data Buffer Reg-  
ister (TXB) will be the destination for data written to the UDR Register location. Reading the  
UDR Register location will return the contents of the Receive Data Buffer Register (RXB).  
For 5-, 6-, or 7-bit characters the upper unused bits will be ignored by the Transmitter and set to  
zero by the Receiver.  
The transmit buffer can only be written when the UDRE Flag in the UCSRA Register is set. Data  
written to UDR when the UDRE Flag is not set, will be ignored by the USART Transmitter. When  
data is written to the transmit buffer, and the Transmitter is enabled, the Transmitter will load the  
data into the Transmit Shift Register when the Shift Register is empty. Then the data will be seri-  
ally transmitted on the TxD pin.  
The receive buffer consists of a two level FIFO. The FIFO will change its state whenever the  
receive buffer is accessed. Due to this behavior of the receive buffer, do not use read modify  
write instructions (SBI and CBI) on this location. Be careful when using bit test instructions (SBIC  
and SBIS), since these also will change the state of the FIFO.  
USART Control and  
Status Register A –  
UCSRA  
Bit  
7
RXC  
R
6
5
UDRE  
R
4
FE  
R
3
DOR  
R
2
UPE  
R
1
0
MPCM  
R/W  
0
TXC  
R/W  
0
U2X  
R/W  
0
UCSRA  
Read/Write  
Initial Value  
0
1
0
0
0
• Bit 7 – RXC: USART Receive Complete  
This flag bit is set when there are unread data in the receive buffer and cleared when the receive  
buffer is empty (i.e., does not contain any unread data). If the receiver is disabled, the receive  
buffer will be flushed and consequently the RXC bit will become zero. The RXC Flag can be  
used to generate a Receive Complete interrupt (see description of the RXCIE bit).  
• Bit 6 – TXC: USART Transmit Complete  
This flag bit is set when the entire frame in the Transmit Shift Register has been shifted out and  
there are no new data currently present in the transmit buffer (UDR). The TXC Flag bit is auto-  
matically cleared when a transmit complete interrupt is executed, or it can be cleared by writing  
a one to its bit location. The TXC Flag can generate a Transmit Complete interrupt (see descrip-  
tion of the TXCIE bit).  
• Bit 5 – UDRE: USART Data Register Empty  
The UDRE Flag indicates if the transmit buffer (UDR) is ready to receive new data. If UDRE is  
one, the buffer is empty, and therefore ready to be written. The UDRE Flag can generate a Data  
Register Empty interrupt (see description of the UDRIE bit).  
UDRE is set after a Reset to indicate that the transmitter is ready.  
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• Bit 4 – FE: Frame Error  
This bit is set if the next character in the receive buffer had a Frame Error when received. I.e.,  
when the first stop bit of the next character in the receive buffer is zero. This bit is valid until the  
receive buffer (UDR) is read. The FE bit is zero when the stop bit of received data is one. Always  
set this bit to zero when writing to UCSRA.  
• Bit 3 – DOR: Data OverRun  
This bit is set if a Data OverRun condition is detected. A data overrun occurs when the receive  
buffer is full (two characters), it is a new character waiting in the reCeive Shift Register, and a  
new start bit is detected. This bit is valid until the receive buffer (UDR) is read. Always set this bit  
to zero when writing to UCSRA.  
• Bit 2 – UPE: Parity Error  
This bit is set if the next character in the receive buffer had a Parity Error when received and the  
Parity Checking was enabled at that point (UPM1 = 1). This bit is valid until the receive buffer  
(UDR) is read. Always set this bit to zero when writing to UCSRA.  
• Bit 1 – U2X: Double the USART Transmission Speed  
This bit only has effect for the asynchronous operation. Write this bit to zero when using syn-  
chronous operation.  
Writing this bit to one will reduce the divisor of the baud rate divider from 16 to 8 effectively dou-  
bling the transfer rate for asynchronous communication.  
• Bit 0 – MPCM: Multi-processor Communication Mode  
This bit enables the Multi-processor Communication mode. When the MPCM bit is written to  
one, all the incoming frames received by the USART receiver that do not contain address infor-  
mation will be ignored. The transmitter is unaffected by the MPCM setting. For more detailed  
information see “Multi-processor Communication Mode” on page 182.  
USART Control and  
Status Register B –  
UCSRB  
Bit  
7
RXCIE  
R/W  
0
6
TXCIE  
R/W  
0
5
UDRIE  
R/W  
0
4
RXEN  
R/W  
0
3
TXEN  
R/W  
0
2
UCSZ2  
R/W  
0
1
RXB8  
R
0
TXB8  
R/W  
0
UCSRB  
Read/Write  
Initial Value  
0
• Bit 7 – RXCIE: RX Complete Interrupt Enable  
Writing this bit to one enables interrupt on the RXC Flag. A USART Receive Complete interrupt  
will be generated only if the RXCIE bit is written to one, the Global Interrupt Flag in SREG is writ-  
ten to one and the RXC bit in UCSRA is set.  
• Bit 6 – TXCIE: TX Complete Interrupt Enable  
Writing this bit to one enables interrupt on the TXC Flag. A USART Transmit Complete interrupt  
will be generated only if the TXCIE bit is written to one, the Global Interrupt Flag in SREG is writ-  
ten to one and the TXC bit in UCSRA is set.  
• Bit 5 – UDRIE: USART Data Register Empty Interrupt Enable  
Writing this bit to one enables interrupt on the UDRE Flag. A Data Register Empty interrupt will  
be generated only if the UDRIE bit is written to one, the Global Interrupt Flag in SREG is written  
to one and the UDRE bit in UCSRA is set.  
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• Bit 4 – RXEN: Receiver Enable  
Writing this bit to one enables the USART Receiver. The Receiver will override normal port oper-  
ation for the RxD pin when enabled. Disabling the Receiver will flush the receive buffer  
invalidating the FE, DOR and UPE Flags.  
• Bit 3 – TXEN: Transmitter Enable  
Writing this bit to one enables the USART Transmitter. The Transmitter will override normal port  
operation for the TxD pin when enabled. The disabling of the Transmitter (writing TXEN to zero)  
will not become effective until ongoing and pending transmissions are completed, i.e., when the  
Transmit Shift Register and Transmit Buffer Register do not contain data to be transmitted.  
When disabled, the Transmitter will no longer override the TxD port.  
• Bit 2 – UCSZ2: Character Size  
The UCSZ2 bits combined with the UCSZ1:0 bit in UCSRC sets the number of data bits (charac-  
ter size) in a frame the Receiver and Transmitter use.  
• Bit 1 – RXB8: Receive Data Bit 8  
RXB8 is the ninth data bit of the received character when operating with serial frames with nine  
data bits. Must be read before reading the low bits from UDR.  
• Bit 0 – TXB8: Transmit Data Bit 8  
TXB8 is the 9th data bit in the character to be transmitted when operating with serial frames with  
9 data bits. Must be written before writing the low bits to UDR.  
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USART Control and  
Status Register C –  
UCSRC(1)  
Bit  
7
URSEL  
R/W  
1
6
UMSEL  
R/W  
0
5
UPM1  
R/W  
0
4
UPM0  
R/W  
0
3
USBS  
R/W  
0
2
UCSZ1  
R/W  
1
1
UCSZ0  
R/W  
1
0
UCPOL  
R/W  
0
UCSRC  
Read/Write  
Initial Value  
Note:  
1. The UCSRC Register shares the same I/O location as the UBRRH Register. See the “Access-  
ing UBRRH/ UCSRC Registers” on page 184 section which describes how to access this  
register.  
• Bit 7 – URSEL: Register Select  
This bit selects between accessing the UCSRC or the UBRRH Register. It is read as one when  
reading UCSRC. The URSEL must be one when writing the UCSRC.  
• Bit 6 – UMSEL: USART Mode Select  
This bit selects between asynchronous and synchronous mode of operation.  
Table 73. UMSEL Bit Settings  
UMSEL  
Mode  
0
1
Asynchronous Operation  
Synchronous Operation  
• Bit 5:4 – UPM1:0: Parity Mode  
These bits enable and set type of parity generation and check. If enabled, the transmitter will  
automatically generate and send the parity of the transmitted data bits within each frame. The  
receiver will generate a parity value for the incoming data and compare it to the UPM0 setting. If  
a mismatch is detected, the UPE Flag in UCSRA will be set.  
Table 74. UPM Bits Settings  
UPM1  
UPM0  
Parity Mode  
0
0
1
1
0
1
0
1
Disabled  
Reserved  
Enabled, Even Parity  
Enabled, Odd Parity  
• Bit 3 – USBS: Stop Bit Select  
This bit selects the number of stop bits to be inserted by the transmitter. The receiver ignores  
this setting.  
Table 75. USBS Bit Settings  
USBS  
Stop Bit(s)  
1-bit  
0
1
2-bit  
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• Bit 2:1 – UCSZ1:0: Character Size  
The UCSZ1:0 bits combined with the UCSZ2 bit in UCSRB sets the number of data bits (Char-  
acter Size) in a frame the receiver and transmitter use.  
Table 76. UCSZ Bits Settings  
UCSZ2  
UCSZ1  
UCSZ0  
Character Size  
5-bit  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
6-bit  
7-bit  
8-bit  
Reserved  
Reserved  
Reserved  
9-bit  
• Bit 0 – UCPOL: Clock Polarity  
This bit is used for synchronous mode only. Write this bit to zero when asynchronous mode is  
used. The UCPOL bit sets the relationship between data output change and data input sample,  
and the synchronous clock (XCK).  
Table 77. UCPOL Bit Settings  
Transmitted Data Changed  
UCPOL (Output of TxD Pin)  
Received Data Sampled  
(Input on RxD Pin)  
0
1
Rising XCK Edge  
Falling XCK Edge  
Falling XCK Edge  
Rising XCK Edge  
USART Baud Rate  
Registers – UBRRL  
and UBRRH(1)  
Bit  
15  
14  
13  
12  
11  
10  
9
8
URSEL  
UBRR[11:8]  
UBRRH  
UBRRL  
UBRR[7:0]  
7
R/W  
R/W  
0
6
R
5
R
4
R
3
R/W  
R/W  
0
2
R/W  
R/W  
0
1
R/W  
R/W  
0
0
R/W  
R/W  
0
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
0
0
0
0
0
0
0
0
Note:  
1. The UBRRH Register shares the same I/O location as the UCSRC Register. See the “Access-  
ing UBRRH/ UCSRC Registers” on page 184 section which describes how to access this  
register.  
• Bit 15 – URSEL: Register Select  
This bit selects between accessing the UBRRH or the UCSRC Register. It is read as zero when  
reading UBRRH. The URSEL must be zero when writing the UBRRH.  
• Bit 14:12 – Reserved Bits  
These bits are reserved for future use. For compatibility with future devices, these bit must be  
written to zero when UBRRH is written.  
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• Bit 11:0 – UBRR11:0: USART Baud Rate Register  
This is a 12-bit register which contains the USART baud rate. The UBRRH contains the four  
most significant bits, and the UBRRL contains the eight least significant bits of the USART baud  
rate. Ongoing transmissions by the transmitter and receiver will be corrupted if the baud rate is  
changed. Writing UBRRL will trigger an immediate update of the baud rate prescaler.  
Examples of Baud For standard crystal and resonator frequencies, the most commonly used baud rates for asyn-  
chronous operation can be generated by using the UBRR settings in Table 78. UBRR values  
Rate Setting  
which yield an actual baud rate differing less than 0.5% from the target baud rate, are bold in the  
table. Higher error ratings are acceptable, but the receiver will have less noise resistance when  
the error ratings are high, especially for large serial frames (see “Asynchronous Operational  
Range” on page 181). The error values are calculated using the following equation:  
BaudRateClosest Match  
Error[%] = ------------------------------------------------------- 1 100%  
BaudRate  
Table 78. Examples of UBRR Settings for Commonly Used Oscillator Frequencies  
fosc = 1.0000 MHz fosc = 1.8432 MHz  
U2X = 0 U2X = 1 U2X = 0 U2X = 1  
UBRR UBRR UBRR UBRR  
fosc = 2.0000 MHz  
U2X = 0 U2X = 1  
UBRR  
Baud  
Rate  
(bps)  
Error  
0.2%  
0.2%  
-7.0%  
8.5%  
8.5%  
8.5%  
-18.6%  
8.5%  
Error  
0.2%  
0.2%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
8.5%  
-18.6%  
8.5%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-25.0%  
0.0%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
UBRR  
Error  
0.2%  
0.2%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
8.5%  
-18.6%  
8.5%  
Error  
0.2%  
0.2%  
0.2%  
2.1%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
8.5%  
2400  
25  
12  
6
51  
25  
12  
8
47  
23  
11  
7
95  
47  
23  
15  
11  
7
51  
25  
12  
8
103  
51  
25  
16  
12  
8
4800  
9600  
14.4k  
19.2k  
28.8k  
38.4k  
57.6k  
76.8k  
115.2k  
230.4k  
250k  
3
2
6
5
6
1
3
3
3
1
2
2
5
2
6
0
1
1
3
1
3
1
1
2
1
2
0
0
1
0
1
0
0
0.0%  
Max. (1)  
62.5 kbps  
UBRR = 0, Error = 0.0%  
125 kbps  
115.2 kbps  
230.4 kbps  
125 kbps  
250 kbps  
1.  
191  
2513K–AVR–07/09  
Table 79. Examples of UBRR Settings for Commonly Used Oscillator Frequencies (Continued)  
fosc = 3.6864 MHz fosc = 4.0000 MHz  
U2X = 0 U2X = 1 U2X = 0 U2X = 1  
UBRR UBRR UBRR UBRR  
fosc = 7.3728 MHz  
U2X = 0 U2X = 1  
UBRR UBRR  
Baud  
Rate  
(bps)  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
-7.8%  
Error  
0.2%  
0.2%  
0.2%  
2.1%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
8.5%  
8.5%  
0.0%  
Error  
0.2%  
0.2%  
0.2%  
-0.8%  
0.2%  
2.1%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
0.0%  
0.0%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
-7.8%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
-7.8%  
-7.8%  
2400  
4800  
9600  
14.4k  
19.2k  
28.8k  
38.4k  
57.6k  
76.8k  
115.2k  
230.4k  
250k  
95  
47  
23  
15  
11  
7
191  
95  
47  
31  
23  
15  
11  
7
103  
51  
25  
16  
12  
8
207  
103  
51  
34  
25  
16  
12  
8
191  
95  
47  
31  
23  
15  
11  
7
383  
191  
95  
63  
47  
31  
23  
15  
11  
7
5
6
3
3
2
5
2
6
5
1
3
1
3
3
0
1
0
1
1
3
0
1
0
1
1
3
0.5M  
0
0
0
1
1M  
0
Max. (1)  
230.4 kbps  
UBRR = 0, Error = 0.0%  
460.8 kbps  
250 kbps  
0.5 Mbps  
460.8 kbps  
921.6 kbps  
1.  
192  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 80. Examples of UBRR Settings for Commonly Used Oscillator Frequencies (Continued)  
fosc = 8.0000 MHz fosc = 11.0592 MHz  
U2X = 0 U2X = 1 U2X = 0 U2X = 1  
UBRR UBRR UBRR UBRR  
fosc = 14.7456 MHz  
Baud  
Rate  
(bps)  
U2X = 0  
U2X = 1  
UBRR  
Error  
0.2%  
0.2%  
0.2%  
-0.8%  
0.2%  
2.1%  
0.2%  
-3.5%  
-7.0%  
8.5%  
8.5%  
0.0%  
0.0%  
Error  
-0.1%  
0.2%  
0.2%  
0.6%  
0.2%  
-0.8%  
0.2%  
2.1%  
0.2%  
-3.5%  
8.5%  
0.0%  
0.0%  
0.0%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
-7.8%  
UBRR  
383  
191  
95  
63  
47  
31  
23  
15  
11  
7
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
-7.8%  
-7.8%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
5.3%  
-7.8%  
-7.8%  
2400  
4800  
9600  
14.4k  
19.2k  
28.8k  
38.4k  
57.6k  
76.8k  
115.2k  
230.4k  
250k  
207  
103  
51  
34  
25  
16  
12  
8
416  
207  
103  
68  
51  
34  
25  
16  
12  
8
287  
143  
71  
47  
35  
23  
17  
11  
8
575  
287  
143  
95  
71  
47  
35  
23  
17  
11  
5
767  
383  
191  
127  
95  
63  
47  
31  
23  
15  
7
6
3
5
1
3
2
3
1
3
2
5
3
6
0.5M  
0
1
2
1
3
1M  
0
0
1
Max. (1)  
0.5 Mbps  
UBRR = 0, Error = 0.0%  
1 Mbps  
691.2 kbps  
1.3824 Mbps  
921.6 kbps  
1.8432 Mbps  
1.  
193  
2513K–AVR–07/09  
Table 81. Examples of UBRR Settings for Commonly Used Oscillator Frequencies (Continued)  
fosc = 16.0000 MHz fosc = 18.4320 MHz fosc = 20.0000 MHz  
U2X = 0 U2X = 1 U2X = 0 U2X = 1 U2X = 0 U2X = 1  
UBRR UBRR UBRR UBRR UBRR UBRR  
Baud  
Rate  
(bps)  
Error  
-0.1%  
0.2%  
0.2%  
0.6%  
0.2%  
-0.8%  
0.2%  
2.1%  
0.2%  
-3.5%  
8.5%  
0.0%  
0.0%  
0.0%  
Error  
0.0%  
-0.1%  
0.2%  
-0.1%  
0.2%  
0.6%  
0.2%  
-0.8%  
0.2%  
2.1%  
-3.5%  
0.0%  
0.0%  
0.0%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
-7.8%  
Error  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
0.0%  
2.4%  
-7.8%  
Error  
0.0%  
0.2%  
0.2%  
-0.2%  
0.2%  
0.9%  
-1.4%  
-1.4%  
1.7%  
-1.4%  
8.5%  
0.0%  
Error  
0.0%  
0.0%  
0.2%  
-0.2%  
0.2%  
-0.2%  
0.2%  
0.9%  
-1.4%  
-1.4%  
-1.4%  
0.0%  
0.0%  
2400  
4800  
9600  
14.4k  
19.2k  
28.8k  
38.4k  
57.6k  
76.8k  
115.2k  
230.4k  
250k  
416  
207  
103  
68  
51  
34  
25  
16  
12  
8
832  
416  
207  
138  
103  
68  
51  
34  
25  
16  
8
479  
239  
119  
79  
59  
39  
29  
19  
14  
9
959  
479  
239  
159  
119  
79  
59  
39  
29  
19  
9
520  
259  
129  
86  
64  
42  
32  
21  
15  
10  
4
1041  
520  
259  
173  
129  
86  
64  
42  
32  
21  
3
4
10  
3
7
4
8
4
9
0.5M  
1
3
4
4
1M  
0
1
Max. (1)  
1 Mbps  
UBRR = 0, Error = 0.0%  
2 Mbps  
1.152 Mbps  
2.304 Mbps  
1.25 Mbps  
2.5 Mbps  
1.  
194  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Analog  
Comparator  
The Analog Comparator compares the input values on the positive pin AIN0 and negative pin  
AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pin  
AIN1, the Analog Comparator Output, ACO, is set. The comparator’s output can be set to trigger  
the Timer/Counter1 Input Capture function. In addition, the comparator can trigger a separate  
interrupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on com-  
parator output rise, fall or toggle. A block diagram of the comparator and its surrounding logic is  
shown in Figure 82.  
Figure 82. Analog Comparator Block Diagram(1)  
BANDGAP  
REFERENCE  
ACBG  
Note:  
1. Refer to Figure 1 on page 2 and Table 32 on page 72 for Analog Comparator pin placement.  
Analog Comparator  
Control and Status  
Register – ACSR  
Bit  
7
6
ACBG  
R/W  
0
5
ACO  
R
4
ACI  
R/W  
0
3
ACIE  
R/W  
0
2
ACIC  
R/W  
0
1
ACIS1  
R/W  
0
0
ACIS0  
R/W  
0
ACD  
R/W  
0
ACSR  
Read/Write  
Initial Value  
N/A  
• Bit 7 – ACD: Analog Comparator Disable  
When this bit is written logic one, the power to the Analog Comparator is switched off. This bit  
can be set at any time to turn off the Analog Comparator. This will reduce power consumption in  
Active and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must be  
disabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit is  
changed.  
• Bit 6 – ACBG: Analog Comparator Bandgap Select  
When this bit is set, a fixed bandgap reference voltage replaces the positive input to the Analog  
Comparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog Compar-  
ator. When the bandgap reference is used as input to the Analog Comparator, it will take a  
certain time for the voltage to stabilize. If not stibilized, the first conversion may give a wrong  
value. See “Internal Voltage Reference” on page 52.  
• Bit 5 – ACO: Analog Comparator Output  
The output of the Analog Comparator is synchronized and then directly connected to ACO. The  
synchronization introduces a delay of 1 - 2 clock cycles.  
195  
2513K–AVR–07/09  
• Bit 4 – ACI: Analog Comparator Interrupt Flag  
This bit is set by hardware when a comparator output event triggers the interrupt mode defined  
by ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is set  
and the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding inter-  
rupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag.  
• Bit 3 – ACIE: Analog Comparator Interrupt Enable  
When the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Com-  
parator interrupt is activated. When written logic zero, the interrupt is disabled.  
• Bit 2 – ACIC: Analog Comparator Input Capture Enable  
When written logic one, this bit enables the Input Capture function in Timer/Counter1 to be trig-  
gered by the Analog Comparator. The comparator output is in this case directly connected to the  
Input Capture front-end logic, making the comparator utilize the noise canceler and edge select  
features of the Timer/Counter1 Input Capture interrupt. When written logic zero, no connection  
between the Analog Comparator and the Input Capture function exists. To make the comparator  
trigger the Timer/Counter1 Input Capture interrupt, the TICIE1 bit in the Timer Interrupt Mask  
Register (TIMSK) must be set.  
• Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode Select  
These bits determine which comparator events that trigger the Analog Comparator interrupt. The  
different settings are shown in Table 82.  
Table 82. ACIS1/ACIS0 Settings  
ACIS1  
ACIS0  
Interrupt Mode  
0
0
1
1
0
1
0
1
Comparator Interrupt on Output Toggle.  
Reserved  
Comparator Interrupt on Falling Output Edge.  
Comparator Interrupt on Rising Output Edge.  
When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled by  
clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when the  
bits are changed.  
196  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
JTAG Interface  
and On-chip  
Debug System  
Features  
JTAG (IEEE std. 1149.1 Compliant) Interface  
Boundary-scan Capabilities According to the IEEE std. 1149.1 (JTAG) Standard  
Debugger Access to:  
– All Internal Peripheral Units  
– Internal and External RAM  
– The Internal Register File  
– Program Counter  
– EEPROM and Flash Memories  
Extensive On-chip Debug Support for Break Conditions, Including  
– AVR Break Instruction  
– Break on Change of Program Memory Flow  
– Single Step Break  
– Program Memory Breakpoints on Single Address or Address Range  
– Data Memory Breakpoints on Single Address or Address Range  
Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface  
On-chip Debugging Supported by AVR Studio®  
Overview  
The AVR IEEE std. 1149.1 compliant JTAG interface can be used for  
Testing PCBs by using the JTAG Boundary-scan capability.  
Programming the non-volatile memories, Fuses and Lock bits.  
On-chip debugging.  
A brief description is given in the following sections. Detailed descriptions for Programming via  
the JTAG interface, and using the Boundary-scan Chain can be found in the sections “Program-  
ming via the JTAG Interface” on page 250 and “IEEE 1149.1 (JTAG) Boundary-scan” on page  
204, respectively. The On-chip Debug support is considered being private JTAG instructions,  
and distributed within ATMEL and to selected third party vendors only.  
Figure 83 shows a block diagram of the JTAG interface and the On-chip Debug system. The  
TAP Controller is a state machine controlled by the TCK and TMS signals. The TAP Controller  
selects either the JTAG Instruction Register or one of several Data Registers as the scan chain  
(Shift Register) between the TDI – input and TDO – output. The Instruction Register holds JTAG  
instructions controlling the behavior of a Data Register.  
The ID-Register, Bypass Register, and the Boundary-scan Chain are the Data Registers used  
for board-level testing. The JTAG Programming Interface (actually consisting of several physical  
and virtual Data Registers) is used for serial programming via the JTAG interface. The Internal  
Scan Chain and Break Point Scan Chain are used for On-chip debugging only.  
Test Access Port – The JTAG interface is accessed through four of the AVR’s pins. In JTAG terminology, these pins  
constitute the Test Access Port – TAP. These pins are:  
TAP  
TMS: Test mode select. This pin is used for navigating through the TAP-controller state  
machine.  
TCK: Test Clock. JTAG operation is synchronous to TCK.  
TDI: Test Data In. Serial input data to be shifted in to the Instruction Register or Data  
Register (Scan Chains).  
TDO: Test Data Out. Serial output data from Instruction Register or Data Register.  
197  
2513K–AVR–07/09  
The IEEE std. 1149.1 also specifies an optional TAP signal; TRST – Test ReSeT – which is not  
provided.  
When the JTAGEN fuse is unprogrammed, these four TAP pins are normal port pins and the  
TAP controller is in reset. When programmed and the JTD bit in MCUCSR is cleared, the TAP  
input signals are internally pulled high and the JTAG is enabled for Boundary-scan and program-  
ming. In this case, the TAP output pin (TDO) is left floating in states where the JTAG TAP  
controller is not shifting data, and must therefore be connected to a pull-up resistor or other  
hardware having pull-ups (for instance the TDI-input of the next device in the scan chain). The  
device is shipped with this fuse programmed.  
For the On-chip Debug system, in addition to the JTAG interface pins, the RESET pin is moni-  
tored by the debugger to be able to detect External Reset sources. The debugger can also pull  
the RESET pin low to reset the whole system, assuming only open collectors on the reset line  
are used in the application.  
Figure 83. Block Diagram  
I/O PORT 0  
DEVICE BOUNDARY  
BOUNDARY SCAN CHAIN  
TDI  
TDO  
TCK  
TMS  
JTAG PROGRAMMING  
INTERFACE  
TAP  
CONTROLLER  
AVR CPU  
INTERNAL  
FLASH  
MEMORY  
Address  
Data  
SCAN  
CHAIN  
PC  
Instruction  
INSTRUCTION  
REGISTER  
ID  
REGISTER  
BREAKPOINT  
UNIT  
M
U
X
FLOW CONTROL  
UNIT  
BYPASS  
REGISTER  
DIGITAL  
PERIPHERAL  
UNITS  
ANALOG  
PERIPHERIAL  
UNITS  
Analog inputs  
BREAKPOINT  
SCAN CHAIN  
JTAG / AVR CORE  
COMMUNICATION  
INTERFACE  
ADDRESS  
DECODER  
OCD STATUS  
AND CONTROL  
Control & Clock lines  
I/O PORT n  
198  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 84. TAP Controller State Diagram  
1
Test-Logic-Reset  
0
1
1
1
0
Run-Test/Idle  
Select-DR Scan  
Select-IR Scan  
0
0
Capture-IR  
0
1
1
Capture-DR  
0
Shift-DR  
0
Shift-IR  
0
1
Exit1-DR  
0
1
1
1
Exit1-IR  
0
Pause-IR  
1
Pause-DR  
1
0
0
0
0
Exit2-DR  
1
Exit2-IR  
1
Update-DR  
Update-IR  
1
1
0
0
199  
2513K–AVR–07/09  
TAP Controller  
The TAP controller is a 16-state finite state machine that controls the operation of the Boundary-  
scan circuitry, JTAG programming circuitry, or On-chip Debug system. The state transitions  
depicted in Figure 84 depend on the signal present on TMS (shown adjacent to each state tran-  
sition) at the time of the rising edge at TCK. The initial state after a Power-on Reset is Test-  
Logic-Reset.  
As a definition in this document, the LSB is shifted in and out first for all Shift Registers.  
Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is:  
At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift  
Instruction Register – Shift-IR state. While in this state, shift the four bits of the JTAG  
instructions into the JTAG Instruction Register from the TDI input at the rising edge of TCK.  
The TMS input must be held low during input of the 3 LSBs in order to remain in the Shift-IR  
state. The MSB of the instruction is shifted in when this state is left by setting TMS high.  
While the instruction is shifted in from the TDI pin, the captured IR-state 0x01 is shifted out  
on the TDO pin. The JTAG Instruction selects a particular Data Register as path between  
TDI and TDO and controls the circuitry surrounding the selected Data Register.  
Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is  
latched onto the parallel output from the Shift Register path in the Update-IR state. The Exit-  
IR, Pause-IR, and Exit2-IR states are only used for navigating the state machine.  
At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift  
Data Register – Shift-DR state. While in this state, upload the selected data register  
(selected by the present JTAG instruction in the JTAG Instruction Register) from the TDI  
input at the rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must  
be held low during input of all bits except the MSB. The MSB of the data is shifted in when  
this state is left by setting TMS high. While the Data Register is shifted in from the TDI pin,  
the parallel inputs to the Data Register captured in the Capture-DR state is shifted out on the  
TDO pin.  
Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected data  
register has a latched parallel-output, the latching takes place in the Update-DR state. The  
Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine.  
As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting  
JTAG instruction and using Data Registers, and some JTAG instructions may select certain  
functions to be performed in the Run-Test/Idle, making it unsuitable as an Idle state.  
Note:  
Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be  
entered by holding TMS high for five TCK clock periods.  
For detailed information on the JTAG specification, refer to the literature listed in “Bibliography”  
on page 203.  
Using the  
Boundary-scan  
Chain  
A complete description of the Boundary-scan capabilities are given in the section “IEEE 1149.1  
(JTAG) Boundary-scan” on page 204.  
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Using the On-chip As shown in Figure 83, the hardware support for On-chip Debugging consists mainly of  
Debug system  
A scan chain on the interface between the internal AVR CPU and the internal peripheral  
units  
Break Point unit  
Communication interface between the CPU and JTAG system  
All read or modify/write operations needed for implementing the Debugger are done by applying  
AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/O  
memory mapped location which is part of the communication interface between the CPU and the  
JTAG system.  
The Break Point unit implements Break on Change of program flow, Single Step Break, two Pro-  
gram memory Break Points, and two Combined Break Points. Together, the four Break Points  
can be configured as either:  
4 single Program Memory Break Points  
3 Single Program Memory Break Point + 1 single Data Memory Break Point  
2 single Program Memory Break Points + 2 single Data Memory Break Points  
2 single Program Memory Break Points + 1 Program Memory Break Point with mask (“range  
Break Point”)  
2 single Program Memory Break Points + 1 Data Memory Break Point with mask (“range  
Break Point”)  
A debugger, like the AVR Studio®, may however use one or more of these resources for its inter-  
nal purpose, leaving less flexibility to the end-user.  
A list of the On-chip Debug specific JTAG instructions is given in “On-chip debug specific JTAG  
instructions” on page 202.  
The JTAGEN Fuse must be programmed to enable the JTAG Test Access Port. In addition, the  
OCDEN Fuse must be programmed and no Lock bits must be set for the On-chip debug system  
to work. As a security feature, the On-chip debug system is disabled when either of the LB1 or  
LB2 Lock bits are set. Otherwise, the On-chip debug system would have provided a backdoor  
into a secured device.  
The AVR Studio enables the user to fully control execution of programs on an AVR device with  
On-chip Debug capability, AVR In-Circuit Emulator, or the built-in AVR Instruction Set Simulator.  
AVR Studio supports source level execution of Assembly programs assembled with Atmel Cor-  
poration’s AVR Assembler and C programs compiled with third party vendors’ compilers.  
AVR Studio runs under Microsoft® Windows® 95/98/2000, Windows NT®, and Windows XP®.  
For a full description of the AVR Studio, please refer to the AVR Studio User Guide. Only high-  
lights are presented in this document.  
All necessary execution commands are available in AVR Studio, both on source level and on  
disassembly level. The user can execute the program, single step through the code either by  
tracing into or stepping over functions, step out of functions, place the cursor on a statement and  
execute until the statement is reached, stop the execution, and reset the execution target. In  
addition, the user can have an unlimited number of code Break Points (using the BREAK  
instruction) and up to two data memory Break Points, alternatively combined as a mask (range)  
Break Point.  
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On-chip debug  
specific JTAG  
instructions  
The On-chip debug support is considered being private JTAG instructions, and distributed within  
ATMEL and to selected 3rd party vendors only. Instruction opcodes are listed for reference.  
PRIVATE0; 0x8  
PRIVATE1; 0x9  
PRIVATE2; 0xA  
PRIVATE3; 0xB  
Private JTAG instruction for accessing On-chip debug system.  
Private JTAG instruction for accessing On-chip debug system.  
Private JTAG instruction for accessing On-chip debug system.  
Private JTAG instruction for accessing On-chip debug system.  
On-chip Debug  
Related Register in  
I/O Memory  
On-chip Debug  
Register – OCDR  
Bit  
7
MSB/IDRD  
R/W  
6
5
4
3
2
1
0
LSB  
R/W  
0
OCDR  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
The OCDR Register provides a communication channel from the running program in the micro-  
controller to the debugger. The CPU can transfer a byte to the debugger by writing to this  
location. At the same time, an internal flag; I/O Debug Register Dirty – IDRD – is set to indicate  
to the debugger that the register has been written. When the CPU reads the OCDR Register the  
7 LSB will be from the OCDR Register, while the MSB is the IDRD bit. The debugger clears the  
IDRD bit when it has read the information.  
In some AVR devices, this register is shared with a standard I/O location. In this case, the OCDR  
Register can only be accessed if the OCDEN Fuse is programmed, and the debugger enables  
access to the OCDR Register. In all other cases, the standard I/O location is accessed.  
Refer to the debugger documentation for further information on how to use this register.  
Using the JTAG  
Programming  
Capabilities  
Programming of AVR parts via JTAG is performed via the 4-pin JTAG port, TCK, TMS, TDI and  
TDO. These are the only pins that need to be controlled/observed to perform JTAG program-  
ming (in addition to power pins). It is not required to apply 12V externally. The JTAGEN Fuse  
must be programmed and the JTD bit in the MCUSR Register must be cleared to enable the  
JTAG Test Access Port.  
The JTAG programming capability supports:  
Flash programming and verifying.  
EEPROM programming and verifying.  
Fuse programming and verifying.  
Lock bit programming and verifying.  
The Lock bit security is exactly as in parallel programming mode. If the Lock bits LB1 or LB2 are  
programmed, the OCDEN Fuse cannot be programmed unless first doing a chip erase. This is a  
security feature that ensures no backdoor exists for reading out the content of a secured device.  
The details on programming through the JTAG interface and programming specific JTAG  
instructions are given in the section “Programming via the JTAG Interface” on page 250.  
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Bibliography  
For more information about general Boundary-scan, the following literature can be consulted:  
IEEE: IEEE Std. 1149.1-1990. IEEE Standard Test Access Port and Boundary-scan  
Architecture, IEEE, 1993  
Colin Maunder: The Board Designers Guide to Testable Logic Circuits, Addison-Wesley,  
1992  
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IEEE 1149.1  
(JTAG)  
Boundary-scan  
Features  
JTAG (IEEE std. 1149.1 Compliant) Interface  
Boundary-scan Capabilities According to the JTAG Standard  
Full Scan of all Port Functions as well as Analog Circuitry Having Off-chip Connections  
Supports the Optional IDCODE Instruction  
Additional Public AVR_RESET Instruction to Reset the AVR  
System Overview  
The Boundary-scan chain has the capability of driving and observing the logic levels on the digi-  
tal I/O pins, as well as the boundary between digital and analog logic for analog circuitry having  
Off-chip connections. At system level, all ICs having JTAG capabilities are connected serially by  
the TDI/TDO signals to form a long Shift Register. An external controller sets up the devices to  
drive values at their output pins, and observe the input values received from other devices. The  
controller compares the received data with the expected result. In this way, Boundary-scan pro-  
vides a mechanism for testing interconnections and integrity of components on Printed Circuits  
Boards by using the four TAP signals only.  
The four IEEE 1149.1 defined mandatory JTAG instructions IDCODE, BYPASS, SAMPLE/PRE-  
LOAD, and EXTEST, as well as the AVR specific public JTAG instruction AVR_RESET can be  
used for testing the Printed Circuit Board. Initial scanning of the Data Register path will show the  
ID-code of the device, since IDCODE is the default JTAG instruction. It may be desirable to have  
the AVR device in Reset during Test mode. If not Reset, inputs to the device may be determined  
by the scan operations, and the internal software may be in an undetermined state when exiting  
the test mode. Entering Reset, the outputs of any Port Pin will instantly enter the high impedance  
state, making the HIGHZ instruction redundant. If needed, the BYPASS instruction can be  
issued to make the shortest possible scan chain through the device. The device can be set in  
the Reset state either by pulling the external RESET pin low, or issuing the AVR_RESET  
instruction with appropriate setting of the Reset Data Register.  
The EXTEST instruction is used for sampling external pins and loading output pins with data.  
The data from the output latch will be driven out on the pins as soon as the EXTEST instruction  
is loaded into the JTAG IR-Register. Therefore, the SAMPLE/PRELOAD should also be used for  
setting initial values to the scan ring, to avoid damaging the board when issuing the EXTEST  
instruction for the first time. SAMPLE/PRELOAD can also be used for taking a snapshot of the  
external pins during normal operation of the part.  
The JTAGEN Fuse must be programmed and the JTD bit in the I/O Register MCUCSR must be  
cleared to enable the JTAG Test Access Port.  
When using the JTAG interface for Boundary-scan, using a JTAG TCK clock frequency higher  
than the internal chip frequency is possible. The chip clock is not required to run.  
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Data Registers  
The data registers relevant for Boundary-scan operations are:  
Bypass Register  
Device Identification Register  
Reset Register  
Boundary-scan Chain  
Bypass Register  
The Bypass Register consists of a single Shift Register stage. When the Bypass Register is  
selected as path between TDI and TDO, the register is reset to 0 when leaving the Capture-DR  
controller state. The Bypass Register can be used to shorten the scan chain on a system when  
the other devices are to be tested.  
Device Identification  
Register  
Figure 85 shows the structure of the Device Identification Register.  
Figure 85. The Format of the Device Identification Register  
MSB  
31  
LSB  
0
Bit  
28  
27  
12  
11  
1
Device ID  
Version  
4 bits  
Part Number  
16 bits  
Manufacturer ID  
1
11 bits  
1 bit  
Version  
Version is a 4-bit number identifying the revision of the component. The JTAG version number  
follows the revision of the device. Revision A is 0x0, revision B is 0x1 and so on.  
Part Number  
The part number is a 16-bit code identifying the component. The JTAG Part Number for  
ATmega162 is listed in Table 83.  
Table 83. AVR JTAG Part Number  
Part number  
JTAG Part Number (Hex)  
ATmega162  
0x9404  
Manufacturer ID  
The Manufacturer ID is a 11-bit code identifying the manufacturer. The JTAG manufacturer ID  
for ATMEL is listed in Table 84.  
Table 84. Manufacturer ID  
Manufacturer  
JTAG Man. ID (Hex)  
ATMEL  
0x01F  
Reset Register  
The Reset Register is a test data register used to reset the part. Since the AVR tri-states Port  
Pins when reset, the Reset Register can also replace the function of the unimplemented optional  
JTAG instruction HIGHZ.  
A high value in the Reset Register corresponds to pulling the external Reset low. The part is  
reset as long as there is a high value present in the Reset Register. Depending on the Fuse set-  
tings for the clock options, the part will remain reset for a Reset Time-out Period (refer to “Clock  
Sources” on page 36) after releasing the Reset Register. The output from this data register is not  
latched, so the reset will take place immediately, as shown in Figure 86.  
205  
2513K–AVR–07/09  
Figure 86. Reset Register  
To  
TDO  
From Other Internal and  
External Reset Sources  
From  
TDI  
Internal Reset  
D
Q
ClockDR · AVR_RESET  
Boundary-scan Chain The Boundary-scan Chain has the capability of driving and observing the logic levels on the dig-  
ital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having  
Off-chip connections.  
See “Boundary-scan Chain” on page 208 for a complete description.  
Boundary-scan  
Specific JTAG  
Instructions  
The Instruction Register is 4-bit wide, supporting up to 16 instructions. Listed below are the  
JTAG instructions useful for Boundary-scan operation. Note that the optional HIGHZ instruction  
is not implemented, but all outputs with tri-state capability can be set in high-impedant state by  
using the AVR_RESET instruction, since the initial state for all port pins is tri-state.  
As a definition in this datasheet, the LSB is shifted in and out first for all Shift Registers.  
The OPCODE for each instruction is shown behind the instruction name in hex format. The text  
describes which Data Register is selected as path between TDI and TDO for each instruction.  
EXTEST; 0x0  
Mandatory JTAG instruction for selecting the Boundary-scan Chain as Data Register for testing  
circuitry external to the AVR package. For port-pins, Pull-up Disable, Output Control, Output  
Data, and Input Data are all accessible in the scan chain. For analog circuits having Off-chip  
connections, the interface between the analog and the digital logic is in the scan chain. The con-  
tents of the latched outputs of the Boundary-scan chain is driven out as soon as the JTAG IR-  
Register is loaded with the EXTEST instruction.  
The active states are:  
Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.  
Shift-DR: The Internal Scan Chain is shifted by the TCK input.  
Update-DR: Data from the scan chain is applied to output pins.  
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IDCODE; 0x1  
Optional JTAG instruction selecting the 32-bit ID-register as data register. The ID-Register con-  
sists of a version number, a device number and the manufacturer code chosen by JEDEC. This  
is the default instruction after Power-up.  
The active states are:  
Capture-DR: Data in the IDCODE Register is sampled into the Boundary-scan Chain.  
Shift-DR: The IDCODE scan chain is shifted by the TCK input.  
SAMPLE_PRELOAD;  
0x2  
Mandatory JTAG instruction for preloading the output latches and taking a snapshot of the  
input/output pins without affecting the system operation. However, the output latches are not  
connected to the pins. The Boundary-scan Chain is selected as Data Register.  
The active states are:  
Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.  
Shift-DR: The Boundary-scan Chain is shifted by the TCK input.  
Update-DR: Data from the Boundary-scan chain is applied to the output latches. However,  
the output latches are not connected to the pins.  
AVR_RESET; 0xC  
The AVR specific public JTAG instruction for forcing the AVR device into the Reset mode or  
releasing the JTAG Reset source. The TAP controller is not reset by this instruction. The one bit  
Reset Register is selected as data register. Note that the reset will be active as long as there is  
a logic 'one' in the Reset Chain. The output from this chain is not latched.  
The active states are:  
Shift-DR: The Reset Register is shifted by the TCK input.  
BYPASS; 0xF  
Mandatory JTAG instruction selecting the Bypass Register for data register.  
The active states are:  
Capture-DR: Loads a logic “0” into the Bypass Register.  
Shift-DR: The Bypass Register cell between TDI and TDO is shifted.  
Boundary-scan  
Related Register in I/O  
Memory  
MCU Control and  
Status Register –  
MCUCSR  
The MCU Control and Status Register contains control bits for general MCU functions, and pro-  
vides information on which reset source caused an MCU Reset.  
Bit  
7
6
5
SM2  
R
4
3
2
1
0
JTD  
R/W  
0
JTRF  
R/W  
WDRF  
R/W  
BORF  
R/W  
EXTRF  
R/W  
PORF  
R/W  
MCUCSR  
Read/Write  
Initial Value  
R/W  
0
0
See Bit Description  
• Bit 7 – JTD: JTAG Interface Disable  
When this bit is zero, the JTAG interface is enabled if the JTAGEN Fuse is programmed. If this  
bit is one, the JTAG interface is disabled. In order to avoid unintentional disabling or enabling of  
the JTAG interface, a timed sequence must be followed when changing this bit: The application  
software must write this bit to the desired value twice within four cycles to change its value.  
If the JTAG interface is left unconnected to other JTAG circuitry, the JTD bit should be set to  
one. The reason for this is to avoid static current at the TDO pin in the JTAG interface.  
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• Bit 4 – JTRF: JTAG Reset Flag  
This bit is set if a reset is being caused by a logic one in the JTAG Reset Register selected by  
the JTAG instruction AVR_RESET. This bit is reset by a Power-on Reset, or by writing a logic  
zero to the flag.  
Boundary-scan  
Chain  
The Boundary-scan Chain has the capability of driving and observing the logic levels on the dig-  
ital I/O pins, as well as the boundary between digital and analog logic for analog circuitry having  
Off-chip connection.  
Scanning the Digital  
Port Pins  
Figure 87 shows the Boundary-scan Cell for a bi-directional port pin with pull-up function. The  
cell consists of a standard Boundary-scan cell for the Pull-up Enable – PUExn – function, and a  
bi-directional pin cell that combines the three signals Output Control – OCxn, Output Data –  
ODxn, and Input Data – IDxn, into only a two-stage Shift Register. The port and pin indexes are  
not used in the following description  
The Boundary-scan logic is not included in the figures in the datasheet. Figure 88 shows a sim-  
ple digital Port Pin as described in the section “I/O-Ports” on page 63. The Boundary-scan  
details from Figure 87 replaces the dashed box in Figure 88.  
When no alternate port function is present, the Input Data – ID – corresponds to the PINxn Reg-  
ister value (but ID has no synchronizer), Output Data corresponds to the PORT Register, Output  
Control corresponds to the Data Direction – DD Register, and the Pull-up Enable – PUExn – cor-  
responds to logic expression PUD · DDxn · PORTxn.  
Digital alternate port functions are connected outside the dotted box in Figure 88 to make the  
scan chain read the actual pin value. For Analog function, there is a direct connection from the  
external pin to the analog circuit, and a scan chain is inserted on the interface between the digi-  
tal logic and the analog circuitry.  
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Figure 87. Boundary-scan Cell for Bi-directional Port Pin with Pull-up Function.  
ShiftDR  
To Next Cell  
EXTEST  
Vcc  
Pullup Enable (PUE)  
0
1
FF2  
Q
LD2  
0
1
D
D
Q
G
Output Control (OC)  
FF1  
D Q  
LD1  
0
1
0
1
D
G
Q
Output Data (OD)  
0
1
FF0  
D
LD0  
0
1
Port Pin (PXn)  
0
1
Q
D
G
Q
Input Data (ID)  
From Last Cell  
ClockDR  
UpdateDR  
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Figure 88. General Port Pin Schematic Diagram  
See Boundary-Scan Description  
for Details!  
PUExn  
PUD  
Q
D
DDxn  
Q CLR  
WDx  
RDx  
RESET  
OCxn  
Q
D
Pxn  
PORTxn  
ODxn  
Q CLR  
WRx  
RRx  
IDxn  
RESET  
SLEEP  
SYNCHRONIZER  
RPx  
D
Q
D
L
Q
Q
PINxn  
Q
CLK I/O  
PUD:  
PULLUP DISABLE  
WDx:  
RDx:  
WRITE DDRx  
PUExn:  
OCxn:  
ODxn:  
IDxn:  
PULLUP ENABLE for pin Pxn  
OUTPUT CONTROL for pin Pxn  
OUTPUT DATA to pin Pxn  
INPUT DATA from pin Pxn  
SLEEP CONTROL  
READ DDRx  
WRx:  
RRx:  
WRITE PORTx  
READ PORTx REGISTER  
READ PORTx PIN  
I/O CLOCK  
RPx:  
SLEEP:  
CLK I/O :  
Scanning the RESET  
pin  
The RESET pin accepts 5V active low logic for standard reset operation, and 12V active high  
logic for high voltage parallel programming. An observe-only cell as shown in Figure 89 is  
inserted both for the 5V reset signal; RSTT, and the 12V reset signal; RSTHV.  
Figure 89. Observe-only Cell  
To  
Next  
ShiftDR  
Cell  
From System Pin  
To System Logic  
FF1  
0
1
D
Q
From  
ClockDR  
Previous  
Cell  
210  
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Scanning the Clock  
Pins  
The AVR devices have many clock options selectable by fuses. These are: Internal RC Oscilla-  
tor, External Clock, (High Frequency) Crystal Oscillator, Low Frequency Crystal Oscillator, and  
Ceramic Resonator.  
Figure 90 shows how each Oscillator with external connection is supported in the scan chain.  
The Enable signal is supported with a general Boundary-scan cell, while the Oscillator/clock out-  
put is attached to an observe-only cell. In addition to the main clock, the Timer Oscillator is  
scanned in the same way. The output from the internal RC Oscillator is not scanned, as this  
Oscillator does not have external connections.  
Figure 90. Boundary-scan Cells for Oscillators and Clock Options  
XTAL1/TOSC1  
XTAL2/TOSC2  
To  
Next  
Cell  
To  
ShiftDR  
EXTEST  
Next  
Cell  
Oscillator  
ShiftDR  
From Digital Logic  
0
1
To System Logic  
ENABLE  
OUTPUT  
0
1
FF1  
D
Q
D
G
Q
0
1
D
Q
From  
ClockDR  
UpdateDR  
Previous  
Cell  
From  
ClockDR  
Previous  
Cell  
Table 85 summaries the scan registers for the external clock pin XTAL1, oscillators with  
XTAL1/XTAL2 connections as well as 32 kHz Timer Oscillator.  
Table 85. Scan Signals for the Oscillator(1)(2)(3)  
Scanned Clock  
Line when Not  
Enable Signal Scanned Clock Line Clock Option  
Used  
EXTCLKEN  
OSCON  
EXTCLK (XTAL1)  
OSCCK  
External Clock  
0
0
External Crystal  
External Ceramic Resonator  
OSC32EN  
TOSKON  
OSC32CK  
TOSCK  
Low Freq. External Crystal  
32 kHz Timer Oscillator  
0
0
Notes: 1. Do not enable more than one clock source as main clock at a time.  
2. Scanning an Oscillator output gives unpredictable results as there is a frequency drift between  
the Internal Oscillator and the JTAG TCK clock. If possible, scanning an external clock is  
preferred.  
3. The clock configuration is programmed by fuses. As a fuse is not changed run-time, the clock  
configuration is considered fixed for a given application. The user is advised to scan the same  
clock option as to be used in the final system. The enable signals are supported in the scan  
chain because the system logic can disable clock options in sleep modes, thereby disconnect-  
ing the Oscillator pins from the scan path if not provided. The INTCAP selection is not  
supported in the scan-chain, so the boundary scan chain can not make a XTAL Oscillator  
requiring internal capacitors to run unless the fuses are correctly programmed.  
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Scanning the Analog  
Comparator  
The relevant Comparator signals regarding Boundary-scan are shown in Figure 91. The Bound-  
ary-scan cell from Figure 92 is attached to each of these signals. The signals are described in  
Table 86.  
The Comparator need not be used for pure connectivity testing, since all analog inputs are  
shared with a digital port pin as well.  
Figure 91. Analog Comparator  
BANDGAP  
REFERENCE  
ACBG  
ACO  
AC_IDLE  
Figure 92. General Boundary-scan Cell used for Signals for Comparator  
To  
Next  
ShiftDR  
Cell  
EXTEST  
From Digital Logic/  
From Analog Ciruitry  
0
1
To Snalog Circuitry/  
To Digital Logic  
0
1
D
Q
D
G
Q
From  
ClockDR  
UpdateDR  
Previous  
Cell  
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Table 86. Boundary-scan Signals for the Analog Comparator  
Direction as  
seen from the  
Comparator  
Recommended Output Values when  
Signal  
Name  
Input when Not  
in Use  
Recommended  
Inputs are Used  
Description  
AC_IDLE  
input  
output  
input  
Turns off Analog  
comparator  
when true  
1
Depends upon µC  
code being executed  
ACO  
Analog  
Comparator  
Output  
Will become  
input to µC code  
being executed  
0
ACBG  
Bandgap  
Reference  
enable  
0
Depends upon µC  
code being executed  
ATmega162  
Boundary-scan  
Order  
Table 87 shows the Scan order between TDI and TDO when the Boundary-scan chain is  
selected as data path. Bit 0 is the LSB; the first bit scanned in, and the first bit scanned out. The  
scan order follows the pinout order as far as possible. Therefore, the bits of Port A and Port E is  
scanned in the opposite bit order of the other ports. Exceptions from the rules are the Scan  
chains for the analog circuits, which constitute the most significant bits of the scan chain regard-  
less of which physical pin they are connected to. In Figure 87, PXn. Data corresponds to FF0,  
PXn. Control corresponds to FF1, and PXn. Pullup_enable corresponds to FF2. Bit 4, 5, 6, and  
7of Port C is not in the scan chain, since these pins constitute the TAP pins when the JTAG is  
enabled.  
Table 87. ATmega162 Boundary-scan Order  
Bit Number  
105  
104  
103  
102  
101  
100  
99  
Signal Name  
AC_IDLE  
Module  
Comparator  
ACO  
ACBG  
PB0.Data  
Port B  
PB0.Control  
PB0.Pullup_Enable  
PB1.Data  
98  
PB1.Control  
PB1.Pullup_Enable  
PB2.Data  
97  
96  
95  
PB2.Control  
PB2.Pullup_Enable  
PB3.Data  
94  
93  
92  
PB3.Control  
PB3.Pullup_Enable  
PB4.Data  
91  
90  
89  
PB4.Control  
PB4.Pullup_Enable  
88  
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2513K–AVR–07/09  
Table 87. ATmega162 Boundary-scan Order (Continued)  
Bit Number  
87  
Signal Name  
PB5.Data  
Module  
Port B  
86  
PB5.Control  
PB5.Pullup_Enable  
PB6.Data  
85  
84  
83  
PB6.Control  
PB6.Pullup_Enable  
PB7.Data  
82  
81  
80  
PB7.Control  
PB7.Pullup_Enable  
RSTT  
79  
78  
Reset Logic  
(Observe-only)  
77  
RSTHV  
76  
TOSC  
32 kHz Timer Oscillator  
Port D  
75  
TOSCON  
74  
PD0.Data  
73  
PD0.Control  
PD0.Pullup_Enable  
PD1.Data  
72  
71  
70  
PD1.Control  
PD1.Pullup_Enable  
PD2.Data  
69  
68  
67  
PD2.Control  
PD2.Pullup_Enable  
PD3.Data  
66  
65  
64  
PD3.Control  
PD3.Pullup_Enable  
PD4.Data  
63  
62  
61  
PD4.Control  
PD4.Pullup_Enable  
PD5.Data  
60  
59  
Port D  
58  
PD5.Control  
PD5.Pullup_Enable  
PD6.Data  
57  
56  
55  
PD6.Control  
PD6.Pullup_Enable  
PD7.Data  
54  
53  
52  
PD7.Control  
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Table 87. ATmega162 Boundary-scan Order (Continued)  
Bit Number  
51  
Signal Name  
PD7.Pullup_Enable  
EXTCLKEN  
Module  
Port D  
50  
Enable signals for main  
Clock/Oscillators  
49  
OSCON  
48  
OSC32EN  
47  
EXTCLK (XTAL1)  
OSCCK  
Clock input and Oscillators  
for the main clock (Observe-  
only)  
46  
45  
OSC32CK  
44  
PC0.Data  
Port C  
43  
PC0.Control  
PC0.Pullup_Enable  
PC1.Data  
42  
41  
40  
PC1.Control  
PC1.Pullup_Enable  
PC2.Data  
39  
38  
37  
PC2.Control  
PC2.Pullup_Enable  
PC3.Data  
36  
35  
34  
PC3.Control  
PC3.Pullup_Enable  
PE2.Data  
33  
32  
Port E  
31  
PE2.Control  
PE2.Pullup_Enable  
PE1.Data  
30  
29  
28  
PE1.Control  
PE1.Pullup_Enable  
PE0.Data  
27  
26  
25  
PE0.Control  
PE0.Pullup_Enable  
PA7.Data  
24  
23  
Port A  
22  
PA7.Control  
21  
PA7.Pullup_Enable  
PA6.Data  
20  
19  
PA6.Control  
18  
PA6.Pullup_Enable  
PA5.Data  
17  
16  
PA5.Control  
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Table 87. ATmega162 Boundary-scan Order (Continued)  
Bit Number  
Signal Name  
PA5.Pullup_Enable  
PA4.Data  
Module  
15  
14  
13  
12  
11  
10  
9
Port A  
PA4.Control  
PA4.Pullup_Enable  
PA3.Data  
PA3.Control  
PA3.Pullup_Enable  
PA2.Data  
8
7
PA2.Control  
6
PA2.Pullup_Enable  
PA1.Data  
5
4
PA1.Control  
3
PA1.Pullup_Enable  
PA0.Data  
2
1
PA0.Control  
0
PA0.Pullup_Enable  
Note:  
1. PRIVATE_SIGNAL1 should always be scanned in as zero.  
Boundary-scan  
Description  
Language Files  
Boundary-scan Description Language (BSDL) files describe Boundary-scan capable devices in  
a standard format used by automated test-generation software. The order and function of bits in  
the Boundary-scan Data Register are included in this description. A BSDL file for ATmega162 is  
available.  
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ATmega162/V  
Boot Loader  
Support – Read-  
While-Write  
Self-  
The Boot Loader Support provides a real Read-While-Write Self-programming mechanism for  
downloading and uploading program code by the MCU itself. This feature allows flexible applica-  
tion software updates controlled by the MCU using a Flash-resident Boot Loader program. The  
Boot Loader program can use any available data interface and associated protocol to read code  
and write (program) that code into the Flash memory, or read the code from the program mem-  
ory. The program code within the Boot Loader section has the capability to write into the entire  
Flash, including the Boot Loader memory. The Boot Loader can thus even modify itself, and it  
can also erase itself from the code if the feature is not needed anymore. The size of the Boot  
Loader memory is configurable with Fuses and the Boot Loader has two separate sets of Boot  
Lock bits which can be set independently. This gives the user a unique flexibility to select differ-  
ent levels of protection.  
programming  
Features  
Read-While-Write Self-programming  
Flexible Boot Memory Size  
High Security (Separate Boot Lock Bits for a Flexible Protection)  
Separate Fuse to Select Reset Vector  
Optimized Page(1) Size  
Code Efficient Algorithm  
Efficient Read-Modify-Write Support  
Note:  
1. A page is a section in the Flash consisting of several bytes (see Table 105 on page 236) used  
during programming. The page organization does not affect normal operation.  
Application and  
Boot Loader Flash  
Sections  
The Flash memory is organized in two main sections, the Application section and the Boot  
Loader section (see Figure 94). The size of the different sections is configured by the BOOTSZ  
Fuses as shown in Table 93 on page 228 and Figure 94. These two sections can have different  
level of protection since they have different sets of Lock bits.  
Application Section  
The Application section is the section of the Flash that is used for storing the application code.  
The protection level for the application section can be selected by the Application Boot Lock bits  
(Boot Lock bits 0), see Table 89 on page 220. The Application section can never store any Boot  
Loader code since the SPM instruction is disabled when executed from the Application section.  
BLS – Boot Loader  
Section  
While the Application section is used for storing the application code, the The Boot Loader soft-  
ware must be located in the BLS since the SPM instruction can initiate a programming when  
executing from the BLS only. The SPM instruction can access the entire Flash, including the  
BLS itself. The protection level for the Boot Loader section can be selected by the Boot Loader  
Lock bits (Boot Lock bits 1), see Table 90 on page 220.  
Read-While-Write  
and No Read-  
While-Write Flash  
Sections  
Whether the CPU supports Read-While-Write or if the CPU is halted during a Boot Loader soft-  
ware update is dependent on which address that is being programmed. In addition to the two  
sections that are configurable by the BOOTSZ Fuses as described above, the Flash is also  
divided into two fixed sections, the Read-While-Write (RWW) section and the No Read-While-  
Write (NRWW) section. The limit between the RWW- and NRWW sections is given in Table 94  
on page 229 and Figure 94 on page 219. The main difference between the two sections is:  
When erasing or writing a page located inside the RWW section, the NRWW section can be  
read during the operation.  
When erasing or writing a page located inside the NRWW section, the CPU is halted during  
the entire operation.  
Note that the user software can never read any code that is located inside the RWW section dur-  
ing a Boot Loader software operation. The syntax “Read-While-Write section” refers to which  
section that is being programmed (erased or written), not which section that actually is being  
read during a Boot Loader software update.  
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RWW – Read-While-  
Write Section  
If a Boot Loader software update is programming a page inside the RWW section, it is possible  
to read code from the Flash, but only code that is located in the NRWW section. During an ongo-  
ing programming, the software must ensure that the RWW section never is being read. If the  
user software is trying to read code that is located inside the RWW section (i.e., by a  
call/jmp/lpm or an interrupt) during programming, the software might end up in an unknown  
state. To avoid this, the interrupts should either be disabled or moved to the Boot Loader sec-  
tion. The Boot Loader section is always located in the NRWW section. The RWW Section Busy  
bit (RWWSB) in the Store Program Memory Control Register (SPMCR) will be read as logical  
one as long as the RWW section is blocked for reading. After a programming is completed, the  
RWWSB must be cleared by software before reading code located in the RWW section. See  
“Store Program Memory Control Register – SPMCR” on page 221. for details on how to clear  
RWWSB.  
NRWW – No Read-  
While-Write Section  
The code located in the NRWW section can be read when the Boot Loader software is updating  
a page in the RWW section. When the Boot Loader code updates the NRWW section, the CPU  
is halted during the entire Page Erase or Page Write operation.  
Table 88. Read-While-Write Features  
Which Section does the Z-  
pointer Address During the  
Programming?  
Which Section Can be  
Read During  
Read-While-  
Write  
Supported?  
Is the CPU  
Halted?  
Programming?  
RWW section  
NRWW section  
None  
No  
Yes  
No  
NRWW section  
Yes  
Figure 93. Read-While-Write vs. No Read-While-Write  
Read-While-Write  
(RWW) Section  
Z-pointer  
Addresses NRWW  
Section  
Z-pointer  
No Read-While-Write  
(NRWW) Section  
Addresses RWW  
Section  
CPU is Halted  
During the Operation  
Code Located in  
NRWW Section  
Can be Read During  
the Operation  
218  
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Figure 94. Memory Sections(1)  
Program Memory  
BOOTSZ = '10'  
Program Memory  
BOOTSZ = '11'  
0x0000  
0x0000  
Application Flash Section  
Application Flash Section  
End RWW  
End RWW  
Start NRWW  
Start NRWW  
Application Flash Section  
Boot Loader Flash Section  
Application Flash Section  
Boot Loader Flash Section  
End Application  
End Application  
Start Boot Loader  
Flashend  
Start Boot Loader  
Flashend  
0x0000  
Program Memory  
BOOTSZ = '01'  
Program Memory  
BOOTSZ = '00'  
0x0000  
Application Flash Section  
Application flash Section  
End RWW, End Application  
End RWW  
Start NRWW, Start Boot Loader  
Start NRWW  
Application Flash Section  
Boot Loader Flash Section  
End Application  
Boot Loader Flash Section  
Start Boot Loader  
Flashend  
Flashend  
Note:  
1. The parameters are given in Table 93 on page 228.  
Boot Loader Lock If no Boot Loader capability is needed, the entire Flash is available for application code. The  
Boot Loader has two separate sets of Boot Lock bits which can be set independently. This gives  
the user a unique flexibility to select different levels of protection.  
Bits  
The user can select:  
To protect the entire Flash from a software update by the MCU  
To protect only the Boot Loader Flash section from a software update by the MCU  
To protect only the Application Flash section from a software update by the MCU  
Allow software update in the entire Flash  
See Table 89 and Table 90 for further details. The Boot Lock bits can be set in software and in  
Serial or Parallel Programming mode, but they can be cleared by a chip erase command only.  
The general Write Lock (Lock bit mode 2) does not control the programming of the Flash mem-  
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ory by SPM instruction. Similarly, the general Read/Write Lock (Lock bit mode 1) does not  
control reading nor writing by LPM/SPM, if it is attempted.  
Table 89. Boot Lock Bit0 Protection Modes (Application Section)(1)  
BLB0 Mode BLB02 BLB01 Protection  
No restrictions for SPM or LPM accessing the Application  
section.  
1
2
1
1
1
0
SPM is not allowed to write to the Application section.  
SPM is not allowed to write to the Application section, and  
LPM executing from the Boot Loader section is not  
allowed to read from the Application section. If Interrupt  
Vectors are placed in the Boot Loader section, interrupts  
are disabled while executing from the Application section.  
3
4
0
0
0
1
LPM executing from the Boot Loader section is not  
allowed to read from the Application section. If Interrupt  
Vectors are placed in the Boot Loader section, interrupts  
are disabled while executing from the Application section.  
Note:  
1. “1” means unprogrammed, “0” means programmed  
Table 90. Boot Lock Bit1 Protection Modes (Boot Loader Section)(1)  
BLB1 Mode BLB12 BLB11 Protection  
No restrictions for SPM or LPM accessing the Boot Loader  
section.  
1
2
1
1
1
0
SPM is not allowed to write to the Boot Loader section.  
SPM is not allowed to write to the Boot Loader section,  
and LPM executing from the Application section is not  
allowed to read from the Boot Loader section. If Interrupt  
Vectors are placed in the Application section, interrupts  
are disabled while executing from the Boot Loader section.  
3
4
0
0
0
1
LPM executing from the Application section is not allowed  
to read from the Boot Loader section. If Interrupt Vectors  
are placed in the Application section, interrupts are  
disabled while executing from the Boot Loader section.  
Note:  
1. “1” means unprogrammed, “0” means programmed  
220  
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Entering the Boot Entering the Boot Loader takes place by a jump or call from the application program. This may  
be initiated by a trigger such as a command received via USART, or SPI interface. Alternatively,  
Loader Program  
the Boot Reset Fuse can be programmed so that the Reset Vector is pointing to the Boot Flash  
start address after a reset. In this case, the Boot Loader is started after a reset. After the applica-  
tion code is loaded, the program can start executing the application code. Note that the fuses  
cannot be changed by the MCU itself. This means that once the Boot Reset Fuse is pro-  
grammed, the Reset Vector will always point to the Boot Loader Reset and the fuse can only be  
changed through the Serial or Parallel Programming interface.  
Table 91. Boot Reset Fuse(1)  
BOOTRST  
Reset Address  
1
0
Reset Vector = Application Reset (address 0x0000).  
Reset Vector = Boot Loader Reset (see Table 93 on page 228).  
Note:  
1. “1” means unprogrammed, “0” means programmed  
Store Program  
Memory Control  
Register – SPMCR  
The Store Program Memory Control Register contains the control bits needed to control the Boot  
Loader operations.  
Bit  
7
SPMIE  
R/W  
0
6
5
4
RWWSRE  
R/W  
3
BLBSET  
R/W  
0
2
PGWRT  
R/W  
0
1
PGERS  
R/W  
0
0
SPMEN  
R/W  
0
RWWSB  
SPMCR  
Read/Write  
Initial Value  
R
0
R
0
0
• Bit 7 – SPMIE: SPM Interrupt Enable  
When the SPMIE bit is written to one, and the I-bit in the Status Register is set (one), the SPM  
ready interrupt will be enabled. The SPM ready Interrupt will be executed as long as the SPMEN  
bit in the SPMCR Register is cleared.  
• Bit 6 – RWWSB: Read-While-Write Section Busy  
When a Self-programming (Page Erase or Page Write) operation to the RWW section is initi-  
ated, the RWWSB will be set (one) by hardware. When the RWWSB bit is set, the RWW section  
cannot be accessed. The RWWSB bit will be cleared if the RWWSRE bit is written to one after a  
Self-programming operation is completed. Alternatively the RWWSB bit will automatically be  
cleared if a page load operation is initiated.  
• Bit 5 – Res: Reserved Bit  
This bit is a reserved bit in the ATmega162 and always read as zero.  
• Bit 4 – RWWSRE: Read-While-Write Section Read Enable  
When programming (Page Erase or Page Write) to the RWW section, the RWW section is  
blocked for reading (the RWWSB will be set by hardware). To re-enable the RWW section, the  
user software must wait until the programming is completed (SPMEN will be cleared). Then, if  
the RWWSRE bit is written to one at the same time as SPMEN, the next SPM instruction within  
four clock cycles re-enables the RWW section. The RWW section cannot be re-enabled while  
the Flash is busy with a Page Erase or a Page Write (SPMEN is set). If the RWWSRE bit is writ-  
ten while the Flash is being loaded, the Flash load operation will abort and the data loaded will  
be lost.  
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• Bit 3 – BLBSET: Boot Lock Bit Set  
If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock  
cycles sets Boot Lock bits, according to the data in R0. The data in R1 and the address in the Z-  
pointer are ignored. The BLBSET bit will automatically be cleared upon completion of the Lock  
bit set, or if no SPM instruction is executed within four clock cycles.  
An LPM instruction within three cycles after BLBSET and SPMEN are set in the SPMCR Regis-  
ter, will read either the Lock bits or the Fuse bits (depending on Z0 in the Z-pointer) into the  
destination register. See “Reading the Fuse and Lock Bits from Software” on page 225 for  
details.  
• Bit 2 – PGWRT: Page Write  
If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock  
cycles executes Page Write, with the data stored in the temporary buffer. The page address is  
taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bit  
will auto–clear upon completion of a Page Write, or if no SPM instruction is executed within four  
clock cycles. The CPU is halted during the entire Page Write operation if the NRWW section is  
addressed.  
• Bit 1 – PGERS: Page Erase  
If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock  
cycles executes Page Erase. The page address is taken from the high part of the Z-pointer. The  
data in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase,  
or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire  
Page Write operation if the NRWW section is addressed.  
• Bit 0 – SPMEN: Store Program Memory Enable  
This bit enables the SPM instruction for the next four clock cycles. If written to one together with  
either RWWSRE, BLBSET, PGWRT’ or PGERS, the following SPM instruction will have a spe-  
cial meaning, see description above. If only SPMEN is written, the following SPM instruction will  
store the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB of  
the Z-pointer is ignored. The SPMEN bit will auto-clear upon completion of an SPM instruction,  
or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write,  
the SPMEN bit remains high until the operation is completed.  
Writing any other combination than “10001”, “01001”, “00101”, “00011” or “00001” in the lower  
five bits will have no effect.  
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Addressing the  
Flash During Self-  
programming  
The Z-pointer is used to address the SPM commands.  
Bit  
15  
Z15  
Z7  
7
14  
Z14  
Z6  
6
13  
Z13  
Z5  
5
12  
Z12  
Z4  
4
11  
Z11  
Z3  
3
10  
Z10  
Z2  
2
9
Z9  
Z1  
1
8
Z8  
Z0  
0
ZH (R31)  
ZL (R30)  
Since the Flash is organized in pages (see Table 105 on page 236), the Program Counter can  
be treated as having two different sections. One section, consisting of the least significant bits, is  
addressing the words within a page, while the most significant bits are addressing the pages.  
This is shown in Figure 95. Note that the Page Erase and Page Write operations are addressed  
independently. Therefore it is of major importance that the Boot Loader software addresses the  
same page in both the Page Erase and Page Write operation. Once a programming operation is  
initiated, the address is latched and the Z-pointer can be used for other operations.  
The only SPM operation that does not use the Z-pointer is Setting the Boot Loader Lock bits.  
The content of the Z-pointer is ignored and will have no effect on the operation. The LPM  
instruction does also use the Z-pointer to store the address. Since this instruction addresses the  
Flash byte-by-byte, also the LSB (bit Z0) of the Z-pointer is used.  
Figure 95. Addressing the Flash during SPM(1)  
BIT 15  
ZPCMSB  
ZPAGEMSB  
1
0
0
Z - REGISTER  
PCMSB  
PAGEMSB  
PCWORD  
PROGRAM  
COUNTER  
PCPAGE  
PAGE ADDRESS  
WITHIN THE FLASH  
WORD ADDRESS  
WITHIN A PAGE  
PROGRAM MEMORY  
PAGE  
PAGE  
INSTRUCTION WORD  
PCWORD[PAGEMSB:0]:  
00  
01  
02  
PAGEEND  
Notes: 1. The different variables used in Figure 95 are listed in Table 95 on page 230.  
2. PCPAGE and PCWORD are listed in Table 105 on page 236.  
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Self-programming The program memory is updated in a page by page fashion. Before programming a page with  
the data stored in the temporary page buffer, the page must be erased. The temporary page buf-  
fer is filled one word at a time using SPM and the buffer can be filled either before the Page  
Erase command or between a Page Erase and a Page Write operation:  
the Flash  
Alternative 1, fill the buffer before a Page Erase  
Fill temporary page buffer  
Perform a Page Erase  
Perform a Page Write  
Alternative 2, fill the buffer after Page Erase  
Perform a Page Erase  
Fill temporary page buffer  
Perform a Page Write  
If only a part of the page needs to be changed, the rest of the page must be stored (for example  
in the temporary page buffer) before the erase, and then be rewritten. When using alternative 1,  
the Boot Loader provides an effective Read-Modify-Write feature which allows the user software  
to first read the page, do the necessary changes, and then write back the modified data. If alter-  
native 2 is used, it is not possible to read the old data while loading since the page is already  
erased. The temporary page buffer can be accessed in a random sequence. It is essential that  
the page address used in both the Page Erase and Page Write operation is addressing the same  
page. See “Simple Assembly Code Example for a Boot Loader” on page 227 for an assembly  
code example.  
Performing Page  
Erase by SPM  
To execute Page Erase, set up the address in the Z-pointer, write “X0000011” to SPMCR and  
execute SPM within four clock cycles after writing SPMCR. The data in R1 and R0 is ignored.  
The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer will  
be ignored during this operation.  
Page Erase to the RWW section: The NRWW section can be read during the Page Erase.  
Page Erase to the NRWW section: The CPU is halted during the operation.  
Filling the Temporary  
To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write  
Buffer (Page Loading) “00000001” to SPMCR and execute SPM within four clock cycles after writing SPMCR. The con-  
tent of PCWORD in the Z-register is used to address the data in the temporary buffer. The  
temporary buffer will auto-erase after a Page Write operation or by writing the RWWSRE bit in  
SPMCR. It is also erased after a System Reset. Note that it is not possible to write more than  
one time to each address without erasing the temporary buffer.  
Note:  
If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will be  
lost.  
Performing a Page  
Write  
To execute Page Write, set up the address in the Z-pointer, write “X0000101” to SPMCR and  
execute SPM within four clock cycles after writing SPMCR. The data in R1 and R0 is ignored.  
The page address must be written to PCPAGE. Other bits in the Z-pointer must be written zero  
during this operation.  
Page Write to the RWW section: The NRWW section can be read during the Page Write.  
Page Write to the NRWW section: The CPU is halted during the operation.  
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Using the SPM  
Interrupt  
If the SPM interrupt is enabled, the SPM interrupt will generate a constant interrupt when the  
SPMEN bit in SPMCR is cleared. This means that the interrupt can be used instead of polling  
the SPMCR Register in software. When using the SPM interrupt, the Interrupt Vectors should be  
moved to the BLS section to avoid that an interrupt is accessing the RWW section when it is  
blocked for reading. How to move the interrupts is described in “Interrupts” on page 57.  
Consideration while  
Updating BLS  
Special care must be taken if the user allows the Boot Loader section to be updated by leaving  
Boot Lock bit11 unprogrammed. An accidental write to the Boot Loader itself can corrupt the  
entire Boot Loader, and further software updates might be impossible. If it is not necessary to  
change the Boot Loader software itself, it is recommended to program the Boot Lock bit11 to  
protect the Boot Loader software from any internal software changes.  
Prevent Reading the  
RWW Section During  
Self-programming  
During Self-programming (either Page Erase or Page Write), the RWW section is always  
blocked for reading. The user software itself must prevent that this section is addressed during  
the self programming operation. The RWWSB in the SPMCR will be set as long as the RWW  
section is busy. During Self-programming the Interrupt Vector table should be moved to the BLS  
as described in “Interrupts” on page 57, or the interrupts must be disabled. Before addressing  
the RWW section after the programming is completed, the user software must clear the  
RWWSB by writing the RWWSRE. See “Simple Assembly Code Example for a Boot Loader” on  
page 227 for an example.  
Setting the Boot  
Loader Lock Bits by  
SPM  
To set the Boot Loader Lock bits, write the desired data to R0, write “X0001001” to SPMCR and  
execute SPM within four clock cycles after writing SPMCR. The only accessible Lock bits are the  
Boot Lock bits that may prevent the Application and Boot Loader section from any software  
update by the MCU.  
Bit  
7
6
5
4
3
2
1
0
R0  
1
1
BLB12  
BLB11  
BLB02  
BLB01  
1
1
See Table 89 and Table 90 for how the different settings of the Boot Loader bits affect the Flash  
access.  
If bits 5..2 in R0 are cleared (zero), the corresponding Boot Lock bit will be programmed if an  
SPM instruction is executed within four cycles after BLBSET and SPMEN are set in SPMCR.  
The Z-pointer is don’t care during this operation, but for future compatibility it is recommended to  
load the Z-pointer with 0x0001 (same as used for reading the Lock bits). For future compatibility  
it is also recommended to set bits 7, 6, 1, and 0 in R0 to “1” when writing the Lock bits. When  
programming the Lock bits the entire Flash can be read during the operation.  
EEPROM Write  
Prevents Writing to  
SPMCR  
Note that an EEPROM write operation will block all software programming to Flash. Reading the  
Fuses and Lock bits from software will also be prevented during the EEPROM write operation. It  
is recommended that the user checks the status bit (EEWE) in the EECR Register and verifies  
that the bit is cleared before writing to the SPMCR Register.  
Reading the Fuse and It is possible to read both the Fuse and Lock bits from software. To read the Lock bits, load the  
Lock Bits from  
Software  
Z-pointer with 0x0001 and set the BLBSET and SPMEN bits in SPMCR. When an LPM instruc-  
tion is executed within three CPU cycles after the BLBSET and SPMEN bits are set in SPMCR,  
the value of the Lock bits will be loaded in the destination register. The BLBSET and SPMEN  
bits will auto-clear upon completion of reading the Lock bits or if no LPM instruction is executed  
within three CPU cycles or no SPM instruction is executed within four CPU cycles. When BLB-  
SET and SPMEN are cleared, LPM will work as described in the Instruction set Manual.  
Bit  
Rd  
7
6
5
4
3
2
1
0
BLB12  
BLB11  
BLB02  
BLB01  
LB2  
LB1  
225  
2513K–AVR–07/09  
The algorithm for reading the Fuse Low byte is similar to the one described above for reading  
the Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and set the BLBSET  
and SPMEN bits in SPMCR. When an LPM instruction is executed within three cycles after the  
BLBSET and SPMEN bits are set in the SPMCR, the value of the Fuse Low byte (FLB) will be  
loaded in the destination register as shown below. Refer to Table 100 on page 233 for a detailed  
description and mapping of the Fuse Low byte.  
Bit  
Rd  
7
6
5
4
3
2
1
0
FLB7  
FLB6  
FLB5  
FLB4  
FLB3  
FLB2  
FLB1  
FLB0  
Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an LPM instruc-  
tion is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCR,  
the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below.  
Refer to Table 98 on page 232 for detailed description and mapping of the Fuse High byte.  
Bit  
Rd  
7
6
5
4
3
2
1
0
FHB7  
FHB6  
FHB5  
FHB4  
FHB3  
FHB2  
FHB1  
FHB0  
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an LPM instruction  
is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCR, the  
value of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below.  
Refer to Table 98 on page 232 for detailed description and mapping of the Extended Fuse byte.  
Bit  
Rd  
7
6
5
4
3
2
1
0
EFB4  
EFB3  
EFB2  
EFB1  
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are  
unprogrammed, will be read as one.  
Preventing Flash  
Corruption  
During periods of low VCC, the Flash program can be corrupted because the supply voltage is  
too low for the CPU and the Flash to operate properly. These issues are the same as for board  
level systems using the Flash, and the same design solutions should be applied.  
A Flash program corruption can be caused by two situations when the voltage is too low. First, a  
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,  
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions  
is too low.  
Flash corruption can easily be avoided by following these design recommendations (one is  
sufficient):  
1. If there is no need for a Boot Loader update in the system, program the Boot Loader Lock  
bits to prevent any Boot Loader software updates.  
2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.  
This can be done by enabling the internal Brown-out Detector (BOD) if the operating volt-  
age matches the detection level. If not, an external low VCC Reset Protection circuit can  
be used. If a Reset occurs while a write operation is in progress, the write operation will  
be completed provided that the power supply voltage is sufficient.  
3. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will pre-  
vent the CPU from attempting to decode and execute instructions, effectively protecting  
the SPMCR Register and thus the Flash from unintentional writes.  
226  
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ATmega162/V  
Programming Time for The calibrated RC Oscillator is used to time Flash accesses. Table 92 shows the typical pro-  
Flash When Using  
SPM  
gramming time for Flash accesses from the CPU.  
Table 92. SPM Programming Time  
Symbol  
Min Programming Time Max Programming Time  
3.7ms 4.5ms  
Flash Write (Page Erase, Page Write,  
and Write Lock bits by SPM)  
Simple Assembly  
Code Example for a  
Boot Loader  
;-the routine writes one?page of data from RAM to Flash  
; the first data locatio? in RAM is pointed to by the Y pointer  
; the first data locatio? in Flash is pointed to by the Z-pointer  
;-error handling is not ?ncluded  
;-the routine must be pl?ced inside the boot space  
; (at least the Do_spm s?b routine). Only code inside NRWW section can  
; be read during self-pr?gramming (page erase and page write).  
;-registers used: r0, r1? temp1 (r16), temp2 (r17), looplo (r24),  
; loophi (r25), spmcrval?(r20)  
; storing and restoring ?f registers is not included in the routine  
; register usage can be ?ptimized at the expense of code size  
;-It is assumed that eit?er the interrupt table is moved to the Boot  
; loader section or that?the interrupts are disabled.  
.equ PAGESIZEB = PAGESIZE*2  
;PAGESIZEB is page size in BYTES, not  
; words  
.org SMALLBOOTSTART  
Write_page:  
; page erase  
ldi  
spmcrval, (1<<PGERS) | (1<<SPMEN)  
call Do_spm  
; re-enable the RWW section  
ldi  
spmcrval, (1<<RWWSRE) | (1<<SPMEN)  
call Do_spm  
; transfer data from RAM to Flash page buffer  
ldi  
ldi  
looplo, low(PAGESIZEB)  
loophi, high(PAGESIZEB)  
;init loop variable  
;not required for PAGESIZEB<=256  
Wrloop:  
ld  
r0, Y+  
ld  
r1, Y+  
ldi  
spmcrval, (1<<SPMEN)  
call Do_spm  
adiw ZH:ZL, 2  
sbiw loophi:looplo, 2  
brne Wrloop  
;use subi for PAGESIZEB<=256  
; execute page write  
subi ZL, low(PAGESIZEB)  
sbci ZH, high(PAGESIZEB)  
;restore pointer  
;not required for PAGESIZEB<=256  
ldi  
spmcrval, (1<<PGWRT) | (1<<SPMEN)  
call Do_spm  
; re-enable the RWW section  
ldi  
spmcrval, (1<<RWWSRE) | (1<<SPMEN)  
call Do_spm  
; read back and check, optional  
ldi  
ldi  
looplo, low(PAGESIZEB)  
loophi, high(PAGESIZEB)  
;init loop variable  
;not required for PAGESIZEB<=256  
;restore pointer  
subi YL, low(PAGESIZEB)  
sbci YH, high(PAGESIZEB)  
Rdloop:  
lpm  
r0, Z+  
227  
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ld  
cpse r0, r1  
jmp Error  
r1, Y+  
sbiw loophi:looplo, 1  
brne Rdloop  
;use subi for PAGESIZEB<=256  
; return to RWW section  
; verify that RWW section is safe to read  
Return:  
in  
temp1, SPMCR  
sbrs temp1, RWWSB  
; If RWWSB is set, the RWW section is not  
; ready yet  
ret  
; re-enable the RWW section  
ldi  
spmcrval, (1<<RWWSRE) | (1<<SPMEN)  
call Do_spm  
rjmp Return  
Do_spm:  
; check for previous SPM complete  
Wait_spm:  
in  
temp1, SPMCR  
sbrc temp1, SPMEN  
rjmp Wait_spm  
; input: spmcrval determines SPM action  
; disable interrupts if enabled, store status  
in  
temp2, SREG  
cli  
; check that no EEPROM write access is present  
Wait_ee:  
sbic EECR, EEWE  
rjmp Wait_ee  
; SPM timed sequence  
out  
spm  
SPMCR, spmcrval  
; restore SREG (to enable interrupts if originally enabled)  
out  
ret  
SREG, temp2  
ATmega162 Boot  
Loader Parameters  
In Table 93 through Table 95, the parameters used in the description of the self programming  
are given.  
Table 93. Boot Size Configuration(1)  
Boot Reset  
Boot  
Loader  
Flash  
Address  
(Start Boot  
Loader  
Application  
Flash  
Section  
End  
Application  
Section  
Boot  
Size  
BOOTSZ1  
BOOTSZ0  
Pages  
Section  
Section)  
128  
words  
0x0000 -  
0x1F7F  
0x1F80 -  
0x1FFF  
1
1
2
0x1F7F  
0x1EFF  
0x1DFF  
0x1BFF  
0x1F80  
0x1F00  
0x1E00  
0x1C00  
256  
words  
0x0000 -  
0x1EFF  
0x1F00 -  
0x1FFF  
1
0
0
0
1
0
4
512  
words  
0x0000 -  
0x1DFF  
0x1E00 -  
0x1FFF  
8
1024  
words  
0x0000 -  
0x1BFF  
0x1C00-  
0x1FFF  
16  
228  
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ATmega162/V  
Note:  
1. The different BOOTSZ Fuse configurations are shown in Figure 94  
Table 94. Read-While-Write Limit  
Section  
Pages  
112  
Address  
Read-While-Write section (RWW)  
No Read-While-Write section (NRWW)  
0x0000 - 0x1BFF  
0x1C00 - 0x1FFF  
16  
Note:  
1. For details about these two section, see “NRWW – No Read-While-Write Section” on page  
218 and “RWW – Read-While-Write Section” on page 218  
229  
2513K–AVR–07/09  
Table 95. Explanation of Different Variables Used in Figure 95 and the Mapping to the Z-  
pointer(1)  
Corresponding  
Variable  
Z-value  
Description  
12  
5
Most significant bit in the Program Counter.  
(The Program Counter is 13 bits PC[12:0])  
PCMSB  
Most significant bit which is used to address  
the words within one page (64 words in a page  
requires 6 bits PC [5:0]).  
PAGEMSB  
ZPCMSB  
Z13  
Z6  
Bit in Z-register that is mapped to PCMSB.  
Because Z0 is not used, the ZPCMSB equals  
PCMSB + 1.  
Bit in Z-register that is mapped to PCMSB.  
Because Z0 is not used, the ZPAGEMSB  
equals PAGEMSB + 1.  
ZPAGEMSB  
PCPAGE  
PC[12:6]  
PC[5:0]  
Z13:Z7  
Z6:Z1  
Program Counter page address: Page select,  
for Page Erase and Page Write  
Program Counter word address: Word select,  
for filling temporary buffer (must be zero during  
Page Write operation)  
PCWORD  
Note:  
1. Z15:Z14: always ignored  
Z0: should be zero for all SPM commands, byte select for the LPM instruction.  
See “Addressing the Flash During Self-programming” on page 223 for details about the use of  
Z-pointer during Self-programming.  
230  
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ATmega162/V  
Memory  
Programming  
Program And Data The ATmega162 provides six Lock bits which can be left unprogrammed (“1”) or can be pro-  
grammed (“0”) to obtain the additional features listed in Table 97. The Lock bits can only be  
erased to “1” with the Chip Erase command.  
Memory Lock Bits  
Table 96. Lock Bit Byte(1)  
Bit no  
Description  
Default Value  
Lock Bit Byte  
7
6
5
4
3
2
1
0
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
BLB12  
BLB11  
BLB02  
BLB01  
LB2  
Boot Lock bit  
Boot Lock bit  
Boot Lock bit  
Boot Lock bit  
Lock bit  
LB1  
Lock bit  
Note:  
Table 97. Lock Bit Protection Modes(1)(2)  
Memory Lock Bits Protection Type  
1. “1” means unprogrammed, “0” means programmed  
LB Mode  
LB2  
LB1  
1
1
1
No memory lock features enabled.  
Further programming of the Flash and EEPROM is  
disabled in Parallel and SPI/JTAG Serial Programming  
mode. The Fuse bits are locked in both Serial and Parallel  
2
1
0
0
0
Programming mode(1)  
.
Further programming and verification of the Flash and  
EEPROM is disabled in Parallel and SPI/JTAG Serial  
Programming mode. Also the Boot Lock bits and the Fuse  
bits are locked in both Serial and Parallel Programming  
3
mode(1)  
.
BLB0 Mode BLB02 BLB01  
No restrictions for SPM or LPM accessing the Application  
section.  
1
2
1
1
1
0
SPM is not allowed to write to the Application section.  
SPM is not allowed to write to the Application section, and  
LPM executing from the Boot Loader section is not  
allowed to read from the Application section. If Interrupt  
Vectors are placed in the Boot Loader section, interrupts  
are disabled while executing from the Application section.  
3
4
0
0
0
1
LPM executing from the Boot Loader section is not  
allowed to read from the Application section. If Interrupt  
Vectors are placed in the Boot Loader section, interrupts  
are disabled while executing from the Application section.  
231  
2513K–AVR–07/09  
Table 97. Lock Bit Protection Modes(1)(2) (Continued)  
Memory Lock Bits  
Protection Type  
BLB1 Mode BLB12 BLB11  
No restrictions for SPM or LPM accessing the Boot Loader  
section.  
1
2
1
1
1
0
SPM is not allowed to write to the Boot Loader section.  
SPM is not allowed to write to the Boot Loader section,  
and LPM executing from the Application section is not  
allowed to read from the Boot Loader section. If Interrupt  
Vectors are placed in the Application section, interrupts  
are disabled while executing from the Boot Loader section.  
3
4
0
0
0
1
LPM executing from the Application section is not allowed  
to read from the Boot Loader section. If Interrupt Vectors  
are placed in the Application section, interrupts are  
disabled while executing from the Boot Loader section.  
Notes: 1. Program the Fuse bits and Boot Lock bits before programming the LB1 and LB2.  
2. “1” means unprogrammed, “0” means programmed  
Fuse Bits  
The ATmega162 has three Fuse bytes. Table 99 and Table 100 describe briefly the functionality  
of all the fuses and how they are mapped into the Fuse bytes. Note that the fuses are read as  
logical zero, “0”, if they are programmed.  
Table 98. Extended Fuse Byte(1)(2)  
Fuse Low Byte  
Bit no Description  
Default Value  
7
6
5
1
1
1
ATmega161 compatibility  
mode  
M161C  
4
3
2
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
Brown-out Detector  
trigger level  
BODLEVEL2(2)  
BODLEVEL1(2)  
Brown-out Detector  
trigger level  
Brown-out Detector  
trigger level  
BODLEVEL0(2)  
1
0
1 (unprogrammed)  
1
Notes: 1. See “ATmega161 Compatibility Mode” on page 4 for details.  
2. See Table 19 on page 50 for BODLEVEL Fuse decoding.  
232  
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ATmega162/V  
Table 99. Fuse High Byte  
Fuse Low Byte Bit no Description  
Default Value  
1 (unprogrammed, OCD  
disabled)  
OCDEN(3)  
JTAGEN(4)  
7
6
Enable OCD  
Enable JTAG  
0 (programmed, JTAG  
enabled)  
Enable Serial Program and Data  
Downloading  
0 (programmed, SPI prog.  
enabled)  
SPIEN(1)  
WDTON  
EESAVE  
5
4
3
Watchdog Timer always on  
1 (unprogrammed)  
EEPROM memory is preserved  
through the Chip Erase  
1 (unprogrammed,  
EEPROM not preserved)  
Select Boot Size (see Table 93 for  
details)  
BOOTSZ1  
2
0 (programmed)(2)  
Select Boot Size (see Table 93 for  
details)  
BOOTSZ0  
BOOTRST  
1
0
0 (programmed)(2)  
1 (unprogrammed)  
Select Reset Vector  
Notes: 1. The SPIEN Fuse is not accessible in SPI Serial Programming mode.  
2. The default value of BOOTSZ1:0 results in maximum Boot Size. See Table 93 on page 228 for  
details.  
3. Never ship a product with the OCDEN Fuse programmed regardless of the setting of Lock bits  
and the JTAGEN Fuse. A programmed OCDEN Fuse enables some parts of the clock system  
to be running in all sleep modes. This may increase the power consumption.  
4. If the JTAG interface is left unconnected, the JTAGEN fuse should if possible be disabled. This  
to avoid static current at the TDO pin in the JTAG interface.  
Table 100. Fuse Low Byte  
Fuse Low Byte Bit no Description  
Default value  
CKDIV8(4)  
CKOUT(3)  
SUT1  
7
6
5
4
3
2
1
0
Divide clock by 8  
0 (programmed)  
Clock Output  
1 (unprogrammed)  
1 (unprogrammed)(1)  
0 (programmed)(1)  
0 (programmed)(2)  
0 (programmed)(2)  
1 (unprogrammed)(2)  
0 (programmed)(2)  
Select start-up time  
Select start-up time  
Select Clock source  
Select Clock source  
Select Clock source  
Select Clock source  
SUT0  
CKSEL3  
CKSEL2  
CKSEL1  
CKSEL0  
Notes: 1. The default value of SUT1:0 results in maximum start-up time for the default clock source. See  
Table 12 on page 39 for details.  
2. The default setting of CKSEL3:0 results in Internal RC Oscillator @ 8 MHz. See Table 5 on  
page 36 for details.  
3. The CKOUT Fuse allow the system clock to be output on PortB 0. See “Clock output buffer” on  
page 40 for details.  
4. See “System Clock Prescaler” on page 41 for details.  
The status of the Fuse bits is not affected by Chip Erase. Note that the Fuse bits are locked if  
Lock bit1 (LB1) is programmed. Program the Fuse bits before programming the Lock bits.  
233  
2513K–AVR–07/09  
Latching of Fuses  
The Fuse values are latched when the device enters Programming mode and changes of the  
Fuse values will have no effect until the part leaves Programming mode. This does not apply to  
the EESAVE Fuse which will take effect once it is programmed. The Fuses are also latched on  
Power-up in Normal mode.  
Signature Bytes  
All Atmel microcontrollers have a 3-byte signature code which identifies the device. This code  
can be read in both Serial and Parallel mode, also when the device is locked. The three bytes  
reside in a separate address space.  
For the ATmega162 the signature bytes are:  
1. 0x000: 0x1E (indicates manufactured by Atmel).  
2. 0x001: 0x94 (indicates 16KB Flash memory).  
3. 0x002: 0x04 (indicates ATmega162 device when 0x001 is 0x94).  
Calibration Byte  
The ATmega162 has a one-byte calibration value for the internal RC Oscillator. This byte  
resides in the high byte of address 0x000 in the signature address space. During Reset, this  
byte is automatically written into the OSCCAL Register to ensure correct frequency of the cali-  
brated RC Oscillator.  
Parallel  
This section describes how to parallel program and verify Flash Program memory, EEPROM  
Data memory, Memory Lock bits, and Fuse bits in the ATmega162. Pulses are assumed to be at  
least 250 ns unless otherwise noted.  
Programming  
Parameters, Pin  
Mapping, and  
Commands  
Signal Names  
In this section, some pins of the ATmega162 are referenced by signal names describing their  
functionality during parallel programming, see Figure 96 and Table 101. Pins not described in  
the following table are referenced by pin names.  
The XA1/XA0 pins determine the action executed when the XTAL1 pin is given a positive pulse.  
The bit coding is shown in Table 103.  
When pulsing WR or OE, the command loaded determines the action executed. The different  
Commands are shown in Table 104.  
Figure 96. Parallel Programming  
+5V  
RDY/BSY  
OE  
PD1  
PD2  
PD3  
PD4  
PD5  
PD6  
PD7  
VCC  
PB7 - PB0  
DATA  
WR  
BS1  
XA0  
XA1  
PAGEL  
+12 V  
BS2  
RESET  
PA0  
XTAL1  
GND  
234  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 101. Pin Name Mapping  
Signal Name in  
Programming Mode Pin Name I/O Function  
0: Device is busy programming, 1: Device is ready  
for new command  
RDY/BSY  
PD1  
O
OE  
PD2  
PD3  
I
I
Output Enable (Active low)  
Write Pulse (Active low)  
WR  
Byte Select 1 (“0” selects low byte, “1” selects high  
byte)  
BS1  
PD4  
I
XA0  
XA1  
PD5  
PD6  
PD7  
I
I
I
XTAL Action Bit 0  
XTAL Action Bit 1  
PAGEL  
Program Memory and EEPROM data Page Load  
Byte Select 2 (“0” selects low byte, “1” selects 2’nd  
high byte)  
BS2  
PA0  
I
DATA  
PB7 - 0  
I/O Bi-directional Data bus (Output when OE is low)  
Table 102. Pin Values used to Enter Programming Mode  
Pin  
PAGEL  
XA1  
Symbol  
Value  
Prog_enable[3]  
Prog_enable[2]  
Prog_enable[1]  
Prog_enable[0]  
0
0
0
0
XA0  
BS1  
Table 103. XA1 and XA0 Coding  
XA1 XA0 Action when XTAL1 is Pulsed  
0
0
1
1
0
1
0
1
Load Flash or EEPROM address (High or low address byte determined by BS1)  
Load Data (High or Low data byte for Flash determined by BS1).  
Load Command  
No Action, Idle  
235  
2513K–AVR–07/09  
Table 104. Command Byte Bit Coding  
Command Byte  
1000 0000  
0100 0000  
0010 0000  
0001 0000  
0001 0001  
0000 1000  
0000 0100  
0000 0010  
0000 0011  
Command Executed  
Chip Erase  
Write Fuse Bits  
Write Lock Bits  
Write Flash  
Write EEPROM  
Read Signature Bytes and Calibration byte  
Read Fuse and Lock Bits  
Read Flash  
Read EEPROM  
Table 105. No. of Words in a Page and no. of Pages in the Flash  
Flash Size  
Page Size  
PCWORD  
No. of Pages  
PCPAGE  
PCMSB  
8K words (16K bytes)  
64 words  
PC[5:0]  
128  
PC[12:6]  
12  
Table 106. No. of Words in a Page and no. of Pages in the EEPROM  
EEPROM Size  
Page Size  
PCWORD  
No. of pages  
PCPAGE  
EEAMSB  
512 bytes  
4 bytes  
EEA[1:0]  
128  
EEA[8:2]  
8
Parallel  
Programming  
Enter Programming  
Mode  
The following algorithm puts the device in Parallel Programming mode:  
1. Apply 4.5 - 5.5V between VCC and GND, and wait at least 100 µs.  
2. Set RESET to “0” and toggle XTAL1 at least six times.  
3. Set the Prog_enable pins listed in Table 102 on page 235 to “0000” and wait at least 100  
ns.  
4. Apply 11.5 - 12.5V to RESET. Any activity on Prog_enable pins within 100 ns after +12V  
has been applied to RESET, will cause the device to fail entering Programming mode.  
Considerations for  
The loaded command and address are retained in the device during programming. For efficient  
Efficient Programming programming, the following should be considered.  
The command needs only be loaded once when writing or reading multiple memory  
locations.  
Skip writing the data value 0xFF, that is the contents of the entire EEPROM (unless the  
EESAVE Fuse is programmed) and Flash after a Chip Erase.  
Address high byte needs only be loaded before programming or reading a new 256-word  
window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes  
reading.  
236  
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ATmega162/V  
Chip Erase  
The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock bits are  
not reset until the program memory has been completely erased. The Fuse bits are not  
changed. A Chip Erase must be performed before the Flash or EEPROM are reprogrammed.  
Note:  
1. The EEPRPOM memory is preserved during chip erase if the EESAVE Fuse is programmed.  
Load Command “Chip Erase”  
1. Set XA1, XA0 to “10”. This enables command loading.  
2. Set BS1 to “0”.  
3. Set DATA to “1000 0000”. This is the command for Chip Erase.  
4. Give XTAL1 a positive pulse. This loads the command.  
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.  
6. Wait until RDY/BSY goes high before loading a new command.  
Programming the  
Flash  
The Flash is organized in pages, see Table 105 on page 236. When programming the Flash, the  
program data is latched into a page buffer. This allows one page of program data to be pro-  
grammed simultaneously. The following procedure describes how to program the entire Flash  
memory:  
A. Load Command “Write Flash”  
1. Set XA1, XA0 to “10”. This enables command loading.  
2. Set BS1 to “0”.  
3. Set DATA to “0001 0000”. This is the command for Write Flash.  
4. Give XTAL1 a positive pulse. This loads the command.  
B. Load Address Low byte  
1. Set XA1, XA0 to “00”. This enables address loading.  
2. Set BS1 to “0”. This selects low address.  
3. Set DATA = Address low byte (0x00 - 0xFF).  
4. Give XTAL1 a positive pulse. This loads the address low byte.  
C. Load Data Low Byte  
1. Set XA1, XA0 to “01”. This enables data loading.  
2. Set DATA = Data low byte (0x00 - 0xFF).  
3. Give XTAL1 a positive pulse. This loads the data byte.  
D. Load Data High Byte  
1. Set BS1 to “1”. This selects high data byte.  
2. Set XA1, XA0 to “01”. This enables data loading.  
3. Set DATA = Data high byte (0x00 - 0xFF).  
4. Give XTAL1 a positive pulse. This loads the data byte.  
E. Latch Data  
1. Set BS1 to “1”. This selects high data byte.  
2. Give PAGEL a positive pulse. This latches the data bytes (See Figure 98 for signal  
waveforms).  
F. Repeat B through E until the entire buffer is filled or until all data within the page is loaded.  
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While the lower bits in the address are mapped to words within the page, the higher bits address  
the pages within the FLASH. This is illustrated in Figure 97 on page 238. Note that if less than  
eight bits are required to address words in the page (pagesize < 256), the most significant bit(s)  
in the address low byte are used to address the page when performing a Page Write.  
G. Load Address High byte  
1. Set XA1, XA0 to “00”. This enables address loading.  
2. Set BS1 to “1”. This selects high address.  
3. Set DATA = Address high byte (0x00 - 0xFF).  
4. Give XTAL1 a positive pulse. This loads the address high byte.  
H. Program Page  
1. Give WR a negative pulse. This starts programming of the entire page of data. RDY/BSY  
goes low.  
2. Wait until RDY/BSY goes high. (See Figure 98 for signal waveforms)  
I. Repeat B through H until the entire Flash is programmed or until all data has been  
programmed.  
J. End Page Programming  
1. 1. Set XA1, XA0 to “10”. This enables command loading.  
2. Set DATA to “0000 0000”. This is the command for No Operation.  
3. Give XTAL1 a positive pulse. This loads the command, and the internal write signals are  
reset.  
Figure 97. Addressing the Flash which is Organized in Pages(1)  
PCMSB  
PAGEMSB  
PROGRAM  
COUNTER  
PCPAGE  
PCWORD  
PAGE ADDRESS  
WITHIN THE FLASH  
WORD ADDRESS  
WITHIN A PAGE  
PROGRAM MEMORY  
PAGE  
PAGE  
INSTRUCTION WORD  
PCWORD[PAGEMSB:0]:  
00  
01  
02  
PAGEEND  
Note:  
1. PCPAGE and PCWORD are listed in Table 105 on page 236.  
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Figure 98. Programming the Flash Waveforms  
F
A
B
C
D
E
B
C
D
E
G
H
0x10  
ADDR. LOW DATA LOW  
DATA HIGH  
ADDR. LOW DATA LOW  
DATA HIGH  
XX  
ADDR. HIGH  
XX  
XX  
DATA  
XA1  
XA0  
BS1  
XTAL1  
WR  
RDY/BSY  
RESET +12V  
OE  
PAGEL  
BS2  
Note:  
“XX” is don’t care. The letters refer to the programming description above.  
Programming the  
EEPROM  
The EEPROM is organized in pages, see Table 106 on page 236. When programming the  
EEPROM, the program data is latched into a page buffer. This allows one page of data to be  
programmed simultaneously. The programming algorithm for the EEPROM data memory is as  
follows (refer to “Programming the Flash” on page 237 for details on Command, Address and  
Data loading):  
1. A: Load Command “0001 0001”.  
2. G: Load Address High Byte (0x00 - 0xFF).  
3. B: Load Address Low Byte (0x00 - 0xFF).  
4. C: Load Data (0x00 - 0xFF).  
5. E: Latch data (give PAGEL a positive pulse).  
K: Repeat 3 through 5 until the entire buffer is filled.  
L: Program EEPROM page  
1. Set BS to “0”.  
2. Give WR a negative pulse. This starts programming of the EEPROM page. RDY/BSY  
goes low.  
3. Wait until to RDY/BSY goes high before programming the next page  
(See Figure 99 for signal waveforms).  
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Figure 99. Programming the EEPROM Waveforms  
K
A
G
B
C
E
B
C
E
L
0x11  
ADDR. HIGH ADDR. LOW  
DATA  
ADDR. LOW  
DATA  
XX  
XX  
DATA  
XA1  
XA0  
BS1  
XTAL1  
WR  
RDY/BSY  
RESET +12V  
OE  
PAGEL  
BS2  
Reading the Flash  
The algorithm for reading the Flash memory is as follows (refer to “Programming the Flash” on  
page 237 for details on Command and Address loading):  
1. A: Load Command “0000 0010”.  
2. G: Load Address High Byte (0x00 - 0xFF).  
3. B: Load Address Low Byte (0x00 - 0xFF).  
4. Set OE to “0”, and BS1 to “0”. The Flash word low byte can now be read at DATA.  
5. Set BS to “1”. The Flash word high byte can now be read at DATA.  
6. Set OE to “1”.  
Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to “Programming the Flash”  
on page 237 for details on Command and Address loading):  
1. A: Load Command “0000 0011”.  
2. G: Load Address High Byte (0x00 - 0xFF).  
3. B: Load Address Low Byte (0x00 - 0xFF).  
4. Set OE to “0”, and BS1 to “0”. The EEPROM Data byte can now be read at DATA.  
5. Set OE to “1”.  
Programming the  
Fuse Low Bits  
The algorithm for programming the Fuse Low bits is as follows (refer to “Programming the Flash”  
on page 237 for details on Command and Data loading):  
1. A: Load Command “0100 0000”.  
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.  
3. Set BS1 to “0” and BS2 to “0”. This selects low data byte.  
4. Give WR a negative pulse and wait for RDY/BSY to go high.  
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Programming the  
Fuse High Bits  
The algorithm for programming the Fuse high bits is as follows (refer to “Programming the Flash”  
on page 237 for details on Command and Data loading):  
1. A: Load Command “0100 0000”.  
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.  
3. Set BS1 to “1” and BS2 to “0”. This selects high data byte.  
4. Give WR a negative pulse and wait for RDY/BSY to go high.  
5. Set BS1 to “0”. This selects low data byte.  
Programming the  
Extended Fuse Bits  
The algorithm for programming the Extended Fuse bits is as follows (refer to “Programming the  
Flash” on page 237 for details on Command and Data loading):  
1. 1. A: Load Command “0100 0000”.  
2. 2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.  
3. 3. Set BS1 to “0” and BS2 to “1”. This selects extended data byte.  
4. 4. Give WR a negative pulse and wait for RDY/BSY to go high.  
5. 5. Set BS2 to “0”. This selects low data byte.  
Figure 100. Programming the FUSES Waveforms  
Write Fuse Low byte  
Write Fuse high byte  
Write Extended Fuse byte  
A
C
A
C
A
C
0x40  
DATA  
XX  
0x40  
DATA  
XX  
0x40  
DATA  
XX  
DATA  
XA1  
XA0  
BS1  
BS2  
XTAL1  
WR  
RDY/BSY  
RESET +12V  
OE  
PAGEL  
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Programming the Lock The algorithm for programming the Lock bits is as follows (refer to “Programming the Flash” on  
Bits  
page 237 for details on Command and Data loading):  
1. A: Load Command “0010 0000”.  
2. C: Load Data Low Byte. Bit n = “0” programs the Lock bit. If LB mode 3 is programmed  
(LB1 and LB2 is programmed), it is not possible to program the Boot Lock Bits by any  
external Programming mode.  
3. Give WR a negative pulse and wait for RDY/BSY to go high.  
The Lock bits can only be cleared by executing Chip Erase.  
Reading the Fuse and The algorithm for reading the Fuse and Lock bits is as follows (refer to “Programming the Flash”  
Lock Bits  
on page 237 for details on Command loading):  
1. A: Load Command “0000 0100”.  
2. Set OE to “0”, BS2 to “0” and BS1 to “0”. The status of the Fuse Low bits can now be  
read at DATA (“0” means programmed).  
3. Set OE to “0”, BS2 to “1” and BS1 to “1”. The status of the Fuse High bits can now be  
read at DATA (“0” means programmed).  
4. Set OE to “0”, BS2 to “1” and BS1 to “0”. The status of the Extended Fuse bits can now  
be read at DATA (“0” means programmed).  
5. Set OE to “0”, BS2 to “0” and BS1 to “1”. The status of the Lock bits can now be read at  
DATA (“0” means programmed).  
6. Set OE to “1”.  
Figure 101. Mapping Between BS1, BS2 and the Fuse and Lock Bits During Read  
0
Fuse Low Byte  
Extended Fuse Byte  
Lock Bits  
0
1
1
0
DATA  
BS2  
BS1  
Fuse High Byte  
1
BS2  
Reading the Signature The algorithm for reading the signature bytes is as follows (refer to “Programming the Flash” on  
Bytes  
page 237 for details on Command and Address loading):  
1. A: Load Command “0000 1000”.  
2. B: Load Address Low Byte (0x00 - 0x02).  
3. Set OE to “0”, and BS to “0”. The selected Signature byte can now be read at DATA.  
4. Set OE to “1”.  
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Reading the  
Calibration Byte  
The algorithm for reading the calibration byte is as follows (refer to “Programming the Flash” on  
page 237 for details on Command and Address loading):  
1. A: Load Command “0000 1000”.  
2. B: Load Address Low Byte, 0x00.  
3. Set OE to “0”, and BS1 to “1”. The Calibration byte can now be read at DATA.  
4. Set OE to “1”.  
Parallel Programming Figure 102. Parallel Programming Timing, Including some General Timing Requirements  
Characteristics  
tXLWL  
tXHXL  
XTAL1  
tDVXH  
tXLDX  
Data & Contol  
(DATA, XA0/1, BS1, BS2)  
tBVPH  
tPLBX tBVWL  
tWLBX  
PAGEL  
tPHPL  
tWLWH  
WR  
tPLWL  
WLRL  
RDY/BSY  
tWLRH  
Figure 103. Parallel Programming Timing, Loading Sequence with Timing Requirements(1)  
LOAD DATA  
LOAD ADDRESS  
(LOW BYTE)  
LOAD DATA  
(LOW BYTE)  
LOAD DATA  
(HIGH BYTE)  
LOAD ADDRESS  
(LOW BYTE)  
tXLPH  
tXLXH  
tPLXH  
XTAL1  
BS1  
PAGEL  
DATA  
ADDR0 (low byte)  
DATA (low byte)  
DATA (high byte)  
ADDR1 (low byte)  
XA0  
XA1  
Note:  
1. The timing requirements shown in Figure 102 (i.e., tDVXH, tXHXL, and tXLDX) also apply to load-  
ing operation.  
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Figure 104. Parallel Programming Timing, Reading Sequence (within the Same Page) with  
Timing Requirements(1)  
LOAD ADDRESS  
(LOW BYTE)  
READ DATA  
(LOW BYTE)  
READ DATA  
(HIGH BYTE)  
LOAD ADDRESS  
(LOW BYTE)  
tXLOL  
XTAL1  
BS1  
tBVDV  
tOLDV  
OE  
tOHDZ  
ADDR1 (low byte)  
DATA (high byte)  
DATA  
ADDR0 (low byte)  
DATA (low byte)  
XA0  
XA1  
Note:  
1. The timing requirements shown in Figure 102 (i.e., tDVXH, tXHXL, and tXLDX) also apply to read-  
ing operation.  
Table 107. Parallel Programming Characteristics, VCC = 5 V 10%  
Symbol  
VPP  
Parameter  
Min  
Typ  
Max  
12.5  
250  
Units  
V
Programming Enable Voltage  
Programming Enable Current  
Data and Control Valid before XTAL1 High  
XTAL1 Low to XTAL1 High  
XTAL1 Pulse Width High  
11.5  
IPP  
μA  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
μs  
ms  
ms  
ns  
tDVXH  
tXLXH  
tXHXL  
tXLDX  
tXLWL  
tXLPH  
tPLXH  
tBVPH  
tPHPL  
tPLBX  
tWLBX  
tPLWL  
tBVWL  
tWLWH  
tWLRL  
tWLRH  
tWLRH_CE  
tXLOL  
67  
200  
150  
67  
0
Data and Control Hold after XTAL1 Low  
XTAL1 Low to WR Low  
XTAL1 Low to PAGEL high  
PAGEL low to XTAL1 high  
BS1 Valid before PAGEL High  
PAGEL Pulse Width High  
BS1 Hold after PAGEL Low  
BS2/1 Hold after WR Low  
PAGEL Low to WR Low  
0
150  
67  
150  
67  
67  
67  
67  
150  
0
BS1 Valid to WR Low  
WR Pulse Width Low  
WR Low to RDY/BSY Low  
WR Low to RDY/BSY High(1)  
WR Low to RDY/BSY High for Chip Erase(2)  
XTAL1 Low to OE Low  
1
4.5  
9
3.7  
7.5  
0
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Table 107. Parallel Programming Characteristics, VCC = 5 V 10% (Continued)  
Symbol  
tBVDV  
Parameter  
Min  
Typ  
Max  
250  
250  
250  
Units  
ns  
BS1 Valid to DATA valid  
OE Low to DATA Valid  
OE High to DATA Tri-stated  
0
tOLDV  
ns  
tOHDZ  
ns  
Notes: 1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse Bits and Write Lock Bits  
commands.  
2. tWLRH_CE is valid for the Chip Erase command.  
Serial  
Downloading  
SPI Serial  
Programming Pin  
Mapping  
Table 108. Pin Mapping SPI Serial Programming  
Symbol  
MOSI  
MISO  
SCK  
Pins  
PB5  
PB6  
PB7  
I/O  
Description  
Serial Data in  
Serial Data out  
Serial Clock  
I
O
I
Both the Flash and EEPROM memory arrays can be programmed using the serial SPI bus while  
RESET is pulled to GND. The serial interface consists of pins SCK, MOSI (input) and MISO (out-  
put). After RESET is set low, the Programming Enable instruction needs to be executed first  
before program/erase operations can be executed. NOTE, in Table 108 on page 245, the pin  
mapping for SPI programming is listed. Not all parts use the SPI pins dedicated for the internal  
SPI interface.  
Figure 105. SPI Serial Programming and Verify(1)  
VCC  
MOSI  
MISO  
SCK  
XTAL1  
RESET  
GND  
Note:  
1. If the device is clocked by the Internal Oscillator, it is no need to connect a clock source to the  
XTAL1 pin.  
When programming the EEPROM, an auto-erase cycle is built into the self-timed programming  
operation (in the Serial mode ONLY) and there is no need to first execute the Chip Erase  
instruction. The Chip Erase operation turns the content of every memory location in both the  
Program and EEPROM arrays into 0xFF.  
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Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high periods  
for the serial clock (SCK) input are defined as follows:  
Low:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz  
High:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz  
SPI Serial  
When writing serial data to the ATmega162, data is clocked on the rising edge of SCK.  
Programming  
Algorithm  
When reading data from the ATmega162, data is clocked on the falling edge of SCK. See Figure  
106.  
To program and verify the ATmega162 in the SPI Serial Programming mode, the following  
sequence is recommended (See four byte instruction formats in Table 110):  
1. Power-up sequence:  
Apply power between VCC and GND while RESET and SCK are set to “0”. In some sys-  
tems, the programmer can not guarantee that SCK is held low during Power-up. In this  
case, RESET must be given a positive pulse of at least two CPU clock cycles duration  
after SCK has been set to “0”.  
2. Wait for at least 20 ms and enable SPI Serial Programming by sending the Programming  
Enable serial instruction to pin MOSI.  
3. The SPI Serial Programming instructions will not work if the communication is out of syn-  
chronization. When in sync. the second byte (0x53), will echo back when issuing the third  
byte of the Programming Enable instruction. Whether the echo is correct or not, all four  
bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a  
positive pulse and issue a new Programming Enable command.  
4. The Flash is programmed one page at a time. The page size is found in Table 105 on  
page 236. The memory page is loaded one byte at a time by supplying the 6 LSB of the  
address and data together with the Load Program Memory Page instruction. To ensure  
correct loading of the page, the data low byte must be loaded before data high byte is  
applied for a given address. The Program Memory Page is stored by loading the Write  
Program Memory Page instruction with the 8 MSB of the address. If polling is not used,  
the user must wait at least tWD_FLASH before issuing the next page. (See Table 109.)  
Accessing the SPI serial programming interface before the Flash write operation com-  
pletes can result in incorrect programming.  
5. The EEPROM array can either be programmed one page at a time or it can be pro-  
grammed byte by byte.  
For Page Programming, the following algorithm is used:  
The EEPROM memory page is loaded one byte at a time by supplying the 2 LSB of the  
address and data together with the Load EEPROM Memory Page instruction. The EEPROM  
Memory Page is stored by loading the Write EEPROM Memory Page instruction with the 8  
MSB of the address. If polling is not used, the user must wait at least tWD_EEPROM before issu-  
ing the next page. (See Table 99.) Accessing the SPI Serial Programming interface before  
the EEPROM write operation completes can result in incorrect programming.  
Alternatively, the EEPROM can be programmed bytewise:  
The EEPROM array is programmed one byte at a time by supplying the address and data  
together with the Write EEPROM instruction. An EEPROM memory location is first automat-  
ically erased before new data is written. If polling is not used, the user must wait at least  
tWD_EEPROM before issuing the next byte. (See Table 109.) In a chip erased device, no 0xFFs  
in the data file(s) need to be programmed.  
6. Any memory location can be verified by using the Read instruction which returns the con-  
tent at the selected address at serial output MISO.  
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7. At the end of the programming session, RESET can be set high to commence normal  
operation.  
8. Power-off sequence (if needed):  
Set RESET to “1”.  
Turn VCC power off.  
Table 109. Minimum Wait Delay before Writing the Next Flash or EEPROM Location  
Symbol  
Minimum Wait Delay  
4.5 ms  
tWD_FLASH  
tWD_EEPROM  
tWD_ERASE  
tWD_FUSE  
9.0 ms  
9.0 ms  
4.5 ms  
Figure 106. SPI Serial Programming Waveforms  
SERIAL DATA INPUT  
(MOSI)  
MSB  
LSB  
LSB  
SERIAL DATA OUTPUT  
(MISO)  
MSB  
SERIAL CLOCK INPUT  
(SCK)  
SAMPLE  
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Table 110. SPI Serial Programming Instruction Set(1)  
Instruction  
Instruction Format  
Operation  
Byte 1  
Byte 2  
Byte 3  
Byte4  
1010 1100  
0101 0011  
xxxx xxxx  
xxxx xxxx  
Enable SPI Serial Programming  
after RESET goes low.  
Programming Enable  
Chip Erase  
1010 1100  
100x xxxx  
xxxx xxxx  
xxxx xxxx  
Chip Erase EEPROM and Flash.  
0010 H000  
00aa aaaa  
bbbb bbbb  
oooo oooo  
Read H (high or low) data o from  
Program memory at word address  
a:b.  
Read Program Memory  
0100 H000  
00xx xxxx  
xxbb bbbb  
iiii iiii  
Write H (high or low) data i to  
Program Memory page at word  
address b. Data low byte must be  
loaded before Data high byte is  
applied within the same address.  
Load Program Memory  
Page  
Write Program Memory  
Page  
0100 1100  
1010 0000  
1100 0000  
1100 0001  
00aa aaaa  
00xx xxaa  
00xx xxaa  
0000 0000  
bbxx xxxx  
bbbb bbbb  
bbbb bbbb  
0000 00bb  
xxxx xxxx  
oooo oooo  
iiii iiii  
iiii iiii  
Write Program Memory Page at  
address a:b.  
Read data o from EEPROM  
memory at address a:b.  
Read EEPROM Memory  
Write EEPROM Memory  
(byte access)  
Write data i to EEPROM memory  
at address a:b.  
Load data i to EEPROM memory  
page buffer. After data is loaded,  
program EEPROM page.  
Load EEPROM Memory  
Page (page access)  
Write EEPROM Memory  
Page (page access)  
1100 0010  
0101 1000  
00xx xxaa  
bbbb bb00  
xxxx xxxx  
Write EEPROM page at address  
a:b.  
0000 0000  
xxxx xxxx  
xxoo oooo  
Read Lock bits. “0” = programmed,  
“1” = unprogrammed. See Table  
96 on page 231 for details.  
Read Lock Bits  
1010 1100  
111x xxxx  
xxxx xxxx  
11ii iiii  
Write Lock bits. Set bits = “0” to  
program Lock bits. See Table 96  
on page 231 for details.  
Write Lock Bits  
0011 0000  
1010 1100  
00xx xxxx  
1010 0000  
xxxx xxbb  
oooo oooo  
iiii iiii  
Read Signature Byte o at address  
b.  
Read Signature Byte  
Write Fuse Bits  
xxxx xxxx  
Set bits = “0” to program, “1” to  
unprogram. See Table 100 on  
page 233 for details.  
1010 1100  
1010 1100  
0101 0000  
1010 1000  
1010 0100  
0000 0000  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
iiii iiii  
xxxx xxii  
oooo oooo  
Set bits = “0” to program, “1” to  
unprogram. See Table 99 on  
page 233 for details.  
Write Fuse High Bits  
Write Extended Fuse Bits  
Read Fuse Bits  
Set bits = “0” to program, “1” to  
unprogram. See Table 98 on  
page 232 for details.  
Read Fuse bits. “0” = programmed,  
“1” = unprogrammed. See Table  
100 on page 233 for details.  
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Table 110. SPI Serial Programming Instruction Set(1) (Continued)  
Instruction  
Instruction Format  
Operation  
Byte 1  
Byte 2  
Byte 3  
Byte4  
0101 1000  
0000 1000  
0000 1000  
xxxx xxxx  
oooo oooo  
Read Fuse high bits. “0” = pro-  
grammed, “1” = unprogrammed.  
See Table 99 on page 233 for  
details.  
Read Fuse High Bits  
0101 0000  
xxxx xxxx  
oooo oooo  
Read Extended Fuse bits. “0” =  
pro-grammed, “1” =  
Read Extended Fuse Bits  
Read Calibration Byte  
Poll RDY/BSY  
unprogrammed. See Table 98 on  
page 232 for details.  
0011 1000  
1111 0000  
00xx xxxx  
0000 0000  
0000 0000  
xxxx xxxx  
oooo oooo  
Read Calibration Byte  
xxxx xxxo  
If o = “1”, a programming operation  
is still busy. Wait until this bit  
returns to “0” before applying  
another command.  
Note:  
1. a = address high bits, b = address low bits, H = 0 – Low byte, 1 – High Byte, o = data out, i = data in, x = don’t care  
SPI Serial  
For characteristics of the SPI module, see “SPI Timing Characteristics” on page 268.  
Programming  
Characteristics  
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2513K–AVR–07/09  
Programming via  
the JTAG Interface  
Programming through the JTAG interface requires control of the four JTAG specific pins: TCK,  
TMS, TDI, and TDO. Control of the Reset and clock pins is not required.  
To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The device is  
default shipped with the Fuse programmed. In addition, the JTD bit in MCUCSR must be  
cleared. Alternatively, if the JTD bit is set, the External Reset can be forced low. Then, the JTD  
bit will be cleared after two chip clocks, and the JTAG pins are available for programming. This  
provides a means of using the JTAG pins as normal port pins in running mode while still allowing  
In-System Programming via the JTAG interface. Note that this technique can not be used when  
using the JTAG pins for Boundary-scan or On-chip Debug. In these cases the JTAG pins must  
be dedicated for this purpose.  
As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers.  
Programming Specific The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG instructions  
JTAG Instructions  
useful for Programming are listed below.  
The OPCODE for each instruction is shown behind the instruction name in hex format. The text  
describes which Data Register is selected as path between TDI and TDO for each instruction.  
The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can also be  
used as an idle state between JTAG sequences. The state machine sequence for changing the  
instruction word is shown in Figure 107.  
250  
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Figure 107. State machine sequence for changing the instruction word  
1
Test-Logic-Reset  
0
1
1
1
0
Run-Test/Idle  
Select-DR Scan  
Select-IR Scan  
0
0
Capture-IR  
0
1
1
Capture-DR  
0
Shift-DR  
0
Shift-IR  
0
1
Exit1-DR  
0
1
1
1
Exit1-IR  
0
Pause-IR  
1
Pause-DR  
1
0
0
0
0
Exit2-DR  
1
Exit2-IR  
1
Update-DR  
Update-IR  
1
1
0
0
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AVR_RESET (0xC)  
The AVR specific public JTAG instruction for setting the AVR device in the Reset mode or taking  
the device out from the Reset mode. The TAP controller is not reset by this instruction. The one  
bit Reset Register is selected as data register. Note that the reset will be active as long as there  
is a logic “one” in the Reset Chain. The output from this chain is not latched.  
The active states are:  
Shift-DR: The Reset Register is shifted by the TCK input.  
PROG_ENABLE (0x4)  
The AVR specific public JTAG instruction for enabling programming via the JTAG port. The 16-  
bit Programming Enable Register is selected as data register. The active states are the  
following:  
Shift-DR: The programming enable signature is shifted into the Data Register.  
Update-DR: The programming enable signature is compared to the correct value, and  
Programming mode is entered if the signature is valid.  
PROG_COMMANDS  
(0x5)  
The AVR specific public JTAG instruction for entering programming commands via the JTAG  
port. The 15-bit Programming Command Register is selected as data register. The active states  
are the following:  
Capture-DR: The result of the previous command is loaded into the Data Register.  
Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the  
previous command and shifting in the new command.  
Update-DR: The programming command is applied to the Flash inputs.  
Run-Test/Idle: One clock cycle is generated, executing the applied command (not always  
required, see Table 111 below).  
PROG_PAGELOAD  
(0x6)  
The AVR specific public JTAG instruction to directly load the Flash data page via the JTAG port.  
The 1024 bit Virtual Flash Page Load Register is selected as register. This is a virtual scan chain  
with length equal to the number of bits in one Flash page. Internally the Shift Register is 8-bit.  
Unlike most JTAG instructions, the Update-DR state is not used to transfer data from the Shift  
Register. The data are automatically transferred to the Flash page buffer byte-by-byte in the  
Shift-DR state by an internal state machine. This is the only active state:  
Shift-DR: Flash page data are shifted in from TDI by the TCK input, and automatically  
loaded into the Flash page one byte at a time.  
Note:  
The JTAG instruction PROG_PAGELOAD can only be used if the AVR device is the first device in  
JTAG scan chain. If the AVR cannot be the first device in the scan chain, the byte-wise program-  
ming algorithm must be used.  
PROG_PAGEREAD  
(0x7)  
The AVR specific public JTAG instruction to read one full Flash data page via the JTAG port.  
The 1032 bit Virtual Flash Page Read Register is selected as data register. This is a virtual scan  
chain with length equal to the number of bits in one Flash page plus eight. Internally the Shift  
Register is 8-bit. Unlike most JTAG instructions, the Capture-DR state is not used to transfer  
data to the Shift Register. The data are automatically transferred from the Flash page buffer  
byte-by-byte in the Shift-DR state by an internal state machine. This is the only active state:  
Shift-DR: Flash data are automatically read one byte at a time and shifted out on TDO by the  
TCK input. The TDI input is ignored.  
Note:  
The JTAG instruction PROG_PAGEREAD can only be used if the AVR device is the first device in  
JTAG scan chain. If the AVR cannot be the first device in the scan chain, the byte-wise program-  
ming algorithm must be used.  
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Data Registers  
The Data Registers are selected by the JTAG Instruction Registers described in section “Pro-  
gramming Specific JTAG Instructions” on page 250. The Data Registers relevant for  
programming operations are:  
Reset Register  
Programming Enable Register.  
Programming Command Register.  
Virtual Flash Page Load Register.  
Virtual Flash Page Read Register.  
Reset Register  
The Reset Register is a test data register used to reset the part during programming. It is  
required to reset the part before entering Programming mode.  
A high value in the Reset Register corresponds to pulling the external reset low. The part is reset  
as long as there is a high value present in the Reset Register. Depending on the fuse settings for  
the clock options, the part will remain reset for a Reset Time-out period (refer to “Clock Sources”  
on page 36) after releasing the Reset Register. The output from this data register is not latched,  
so the reset will take place immediately, as shown in Figure 86 on page 206.  
Programming Enable  
Register  
The Programming Enable Register is a 16-bit register. The contents of this register is compared  
to the programming enable signature, binary code 1010_0011_0111_0000. When the contents  
of the register is equal to the programming enable signature, programming via the JTAG port is  
enabled. The register is reset to 0 on Power-on Reset, and should always be reset when leaving  
Programming mode.  
Figure 108. Programming Enable Register  
TDI  
0xA370  
D
D
Q
A
T
A
Programming Enable  
=
ClockDR & PROG_ENABLE  
TDO  
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Programming  
Command Register  
The Programming Command Register is a 15-bit register. This register is used to serially shift in  
programming commands, and to serially shift out the result of the previous command, if any. The  
JTAG Programming Instruction Set is shown in Table 111. The state sequence when shifting in  
the programming commands is illustrated in Figure 110.  
Figure 109. Programming Command Register  
TDI  
S
T
R
O
B
E
S
Flash  
A
EEPROM  
D
Fuses  
D
R
E
S
S
/
Lock Bits  
D
A
T
A
TDO  
254  
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Table 111. JTAG Programming Instruction Set  
Instruction  
TDI sequence  
TDO sequence  
Notes  
1a. Chip eRase  
0100011_10000000  
0110001_10000000  
0110011_10000000  
0110011_10000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
1b. Poll for Chip Erase complete  
2a. Enter Flash Write  
0110011_10000000  
0100011_00010000  
0000111_aaaaaaaa  
0000011_bbbbbbbb  
0010011_iiiiiiii  
xxxxxox_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(2)  
(9)  
2b. Load Address High Byte  
2c. Load Address Low Byte  
2d. Load Data Low Byte  
2e. Load Data High Byte  
2f. Latch Data  
0010111_iiiiiiii  
0110111_00000000  
1110111_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(1)  
(1)  
2g. Write Flash Page  
0110111_00000000  
0110101_00000000  
0110111_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
2h. Poll for Page Write complete  
3a. Enter Flash Read  
0110111_00000000  
0100011_00000010  
0000111_aaaaaaaa  
0000011_bbbbbbbb  
xxxxxox_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(2)  
(9)  
3b. Load Address High Byte  
3c. Load Address Low Byte  
3d. Read Data Low and High Byte  
0110010_00000000  
0110110_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
xxxxxxx_oooooooo  
low byte  
high byte  
4a. Enter EEPROM Write  
4b. Load Address High Byte  
4c. Load Address Low Byte  
4d. Load Data Byte  
0100011_00010001  
0000111_aaaaaaaa  
0000011_bbbbbbbb  
0010011_iiiiiiii  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(9)  
4e. Latch Data  
0110111_00000000  
1110111_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(1)  
(1)  
4f. Write EEPROM Page  
0110011_00000000  
0110001_00000000  
0110011_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
4g. Poll for Page Write complete  
5a. Enter EEPROM Read  
0110011_00000000  
0100011_00000011  
0000111_aaaaaaaa  
0000011_bbbbbbbb  
xxxxxox_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(2)  
(9)  
5b. Load Address High Byte  
5c. Load Address Low Byte  
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Table 111. JTAG Programming Instruction Set (Continued)  
Instruction  
TDI sequence  
TDO sequence  
Notes  
5d. Read Data Byte  
0110011_bbbbbbbb  
0110010_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
6a. Enter Fuse Write  
0100011_01000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
6b. Load Data Low Byte(6)  
0010011_iiiiiiii  
(3)  
(1)  
6c. Write Fuse Extended Byte  
0111011_00000000  
0111001_00000000  
0111011_00000000  
0111011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
6d. Poll for Fuse Write complete  
6e. Load Data Low Byte(7)  
6f. Write Fuse High byte  
0110111_00000000  
xxxxxox_xxxxxxxx  
(2)  
(3)  
(1)  
0010011_iiiiiiii  
xxxxxxx_xxxxxxxx  
0110111_00000000  
0110101_00000000  
0110111_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
6g. Poll for Fuse Write complete  
6h. Load Data Low Byte(8)  
6i. Write Fuse Low Byte  
0110111_00000000  
xxxxxox_xxxxxxxx  
(2)  
(3)  
(1)  
0010011_iiiiiiii  
xxxxxxx_xxxxxxxx  
0110011_00000000  
0110001_00000000  
0110011_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
6j. Poll for Fuse Write complete  
7a. Enter Lock Bit Write  
7b. Load Data Byte(9)  
0110011_00000000  
0100011_00100000  
0010011_11iiiiii  
xxxxxox_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
(2)  
(4)  
(1)  
7c. Write Lock Bits  
0110011_00000000  
0110001_00000000  
0110011_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
7d. Poll for Lock Bit Write complete  
8a. Enter Fuse/Lock Bit Read  
8b. Read Fuse Extended Byte(6)  
0110011_00000000  
0100011_00000100  
xxxxxox_xxxxxxxx  
(2)  
xxxxxxx_xxxxxxxx  
0111010_00000000  
0111111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
8c. Read Fuse High Byte(7)  
8d. Read Fuse Low Byte(8)  
8e. Read Lock Bits(9)  
0111110_00000000  
0111111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
0110010_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
0110110_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
(5)  
xxxxxxx_xxoooooo  
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Table 111. JTAG Programming Instruction Set (Continued)  
Instruction  
TDI sequence  
TDO sequence  
Notes  
8f. Read Fuses and Lock Bits  
0111010_00000000  
0111110_00000000  
0110010_00000000  
0110110_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
xxxxxxx_oooooooo  
xxxxxxx_oooooooo  
xxxxxxx_oooooooo  
(5)  
Fuse ext. byte  
Fuse high byte  
Fuse low byte  
Lock bits  
9a. Enter Signature Byte Read  
9b. Load Address Byte  
0100011_00001000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
0000011_bbbbbbbb  
9c. Read Signature Byte  
0110010_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
10a. Enter Calibration Byte Read  
10b. Load Address Byte  
0100011_00001000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
0000011_bbbbbbbb  
10c. Read Calibration Byte  
0110110_00000000  
0110111_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_oooooooo  
11a. Load No Operation Command  
0100011_00000000  
0110011_00000000  
xxxxxxx_xxxxxxxx  
xxxxxxx_xxxxxxxx  
Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is  
normally the case).  
2. Repeat until o = “1”.  
3. Set bits to “0” to program the corresponding Fuse, “1” to unprogram the Fuse.  
4. Set bits to “0” to program the corresponding lock bit, “1” to leave the Lock bit unchanged.  
5. “0” = programmed, “1” = unprogrammed.  
6. The bit mapping for Fuses Extended byte is listed in Table 98 on page 232.  
7. The bit mapping for Fuses High byte is listed in Table 99 on page 233.  
8. The bit mapping for Fuses Low byte is listed in Table 100 on page 233.  
9. The bit mapping for Lock Bits byte is listed in Table 96 on page 231.  
10. Address bits exceeding PCMSB and EEAMSB (Table 105 and Table 106) are don’t care  
Note:  
a = address high bits  
b = address low bits  
H = 0 – Low byte, 1 – High Byte  
o = data out  
i = data in  
x = don’t care  
257  
2513K–AVR–07/09  
Figure 110. State Machine Sequence for Changing/Reading the Data Word  
1
Test-Logic-Reset  
0
1
1
1
0
Run-Test/Idle  
Select-DR Scan  
Select-IR Scan  
0
0
1
1
Capture-DR  
Capture-IR  
0
0
Shift-IR  
1
Shift-DR  
0
0
1
Exit1-DR  
0
1
1
Exit1-IR  
0
Pause-DR  
1
0
Pause-IR  
1
0
0
0
Exit2-DR  
1
Exit2-IR  
1
Update-DR  
Update-IR  
1
1
0
0
Virtual Flash Page  
Load Register  
The Virtual Flash Page Load Register is a virtual scan chain with length equal to the number of  
bits in one Flash page. Internally the Shift Register is 8-bit, and the data are automatically trans-  
ferred to the Flash page buffer byte-by-byte. Shift in all instruction words in the page, starting  
with the LSB of the first instruction in the page and ending with the MSB of the last instruction in  
the page. This provides an efficient way to load the entire Flash page buffer before executing  
Page Write.  
258  
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Figure 111. Virtual Flash Page Load Register  
STROBES  
State  
Machine  
ADDRESS  
TDI  
Flash  
EEPROM  
Fuses  
Lock Bits  
D
A
T
A
TDO  
Virtual Flash Page  
Read Register  
The Virtual Flash Page Read Register is a virtual scan chain with length equal to the number of  
bits in one Flash page plus eight. Internally the Shift Register is 8-bit, and the data are automati-  
cally transferred from the Flash data page byte-by-byte. The first eight cycles are used to  
transfer the first byte to the internal Shift Register, and the bits that are shifted out during these  
right cycles should be ignored. Following this initialization, data are shifted out starting with the  
LSB of the first instruction in the page and ending with the MSB of the last instruction in the  
page. This provides an efficient way to read one full Flash page to verify programming.  
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2513K–AVR–07/09  
Figure 112. Virtual Flash Page Read Register  
STROBES  
State  
Machine  
ADDRESS  
TDI  
Flash  
EEPROM  
Fuses  
Lock Bits  
D
A
T
A
TDO  
Programming  
Algorithm  
All references below of type “1a”, “1b”, and so on, refer to Table 111.  
EnteringProgramming 1. Enter JTAG instruction AVR_RESET and shift one in the Reset Register.  
Mode  
2. Enter instruction PROG_ENABLE and shift 1010_0011_0111_0000 in the Programming  
Enable Register.  
Leaving Programming 1. Enter JTAG instruction PROG_COMMANDS.  
Mode  
2. Disable all programming instructions by using no operation instruction 11a.  
3. Enter instruction PROG_ENABLE and shift 0000_0000_0000_0000 in the Programming  
Enable Register.  
4. Enter JTAG instruction AVR_RESET and shift 0 in the Reset Register.  
Performing Chip Erase 1. Enter JTAG instruction PROG_COMMANDS.  
2. Start Chip Erase using programming instruction 1a.  
3. Poll for Chip Erase complete using programming instruction 1b, or wait for tWLRH_CE (refer  
to Table 107 on page 244).  
Programming the  
Flash  
Before programming the Flash a Chip Erase must be performed. See “Performing Chip Erase”  
on page 260.  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Flash write using programming instruction 2a.  
3. Load address high byte using programming instruction 2b.  
4. Load address low byte using programming instruction 2c.  
5. Load data using programming instructions 2d, 2e and 2f.  
6. Repeat steps 4 and 5 for all instruction words in the page.  
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7. Write the page using programming instruction 2g.  
8. Poll for Flash write complete using programming instruction 2h, or wait for tWLRH_FLASH  
(refer to Table 107 on page 244).  
9. Repeat steps 3 to 7 until all data have been programmed.  
A more efficient data transfer can be achieved using the PROG_PAGELOAD instruction:  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Flash write using programming instruction 2a.  
3. Load the page address using programming instructions 2b and 2c. PCWORD (refer to  
Table 105 on page 236) is used to address within one page and must be written as 0.  
4. Enter JTAG instruction PROG_PAGELOAD.  
5. Load the entire page by shifting in all instruction words in the page, starting with the LSB  
of the first instruction in the page and ending with the MSB of the last instruction in the  
page.  
6. Enter JTAG instruction PROG_COMMANDS.  
7. Write the page using programming instruction 2g.  
8. Poll for Flash write complete using programming instruction 2h, or wait for tWLRH_FLASH  
(refer to Table 107 on page 244).  
9. Repeat steps 3 to 8 until all data have been programmed.  
Reading the Flash  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Flash read using programming instruction 3a.  
3. Load address using programming instructions 3b and 3c.  
4. Read data using programming instruction 3d.  
5. Repeat steps 3 and 4 until all data have been read.  
A more efficient data transfer can be achieved using the PROG_PAGEREAD instruction:  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Flash read using programming instruction 3a.  
3. Load the page address using programming instructions 3b and 3c. PCWORD (refer to  
Table 105 on page 236) is used to address within one page and must be written as 0.  
4. Enter JTAG instruction PROG_PAGEREAD.  
5. Read the entire page by shifting out all instruction words in the page, starting with the  
LSB of the first instruction in the page and ending with the MSB of the last instruction in  
the page. Remember that the first 8 bits shifted out should be ignored.  
6. Enter JTAG instruction PROG_COMMANDS.  
7. Repeat steps 3 to 6 until all data have been read.  
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Programming the  
EEPROM  
Before programming the EEPROM a Chip Erase must be performed. See “Performing Chip  
Erase” on page 260.  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable EEPROM write using programming instruction 4a.  
3. Load address high byte using programming instruction 4b.  
4. Load address low byte using programming instruction 4c.  
5. Load data using programming instructions 4d and 4e.  
6. Repeat steps 4 and 5 for all data bytes in the page.  
7. Write the data using programming instruction 4f.  
8. Poll for EEPROM write complete using programming instruction 4g, or wait for tWLRH  
(refer to Table 107 on page 244).  
9. Repeat steps 3 to 8 until all data have been programmed.  
Note:  
The PROG_PAGELOAD instruction can not be used when programming the EEPROM  
Reading the EEPROM 1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable EEPROM read using programming instruction 5a.  
3. Load address using programming instructions 5b and 5c.  
4. Read data using programming instruction 5d.  
5. Repeat steps 3 and 4 until all data have been read.  
Note:  
The PROG_PAGEREAD instruction can not be used when reading the EEPROM  
Programming the  
Fuses  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Fuse write using programming instruction 6a.  
3. Load data low byte using programming instructions 6b. A bit value of “0” will program the  
corresponding Fuse, a “1” will unprogram the Fuse.  
4. Write Fuse extended byte using programming instruction 6c.  
5. Poll for Fuse write complete using programming instruction 6d, or wait for tWLRH (refer to  
Table 107 on page 244).  
6. Load data low byte using programming instructions 6e. A bit value of “0” will program the  
corresponding Fuse, a “1” will unprogram the Fuse.  
7. Write Fuse High byte using programming instruction 6f.  
8. Poll for Fuse write complete using programming instruction 6g, or wait for tWLRH (refer to  
Table 107 on page 244).  
9. Load data low byte using programming instructions 6h. A “0” will program the Fuse, a “1”  
will unprogram the Fuse.  
10. Write Fuse Low byte using programming instruction 6i.  
11. Poll for Fuse write complete using programming instruction 6j, or wait for tWLRH (refer to  
Table 107 on page 244).  
Programming the Lock 1. Enter JTAG instruction PROG_COMMANDS.  
Bits  
2. Enable Lock bit write using programming instruction 7a.  
3. Load data using programming instructions 7b. A bit value of “0” will program the corre-  
sponding Lock bit, a “1” will leave the Lock bit unchanged.  
4. Write Lock bits using programming instruction 7c.  
5. Poll for Lock bit write complete using programming instruction 7d, or wait for tWLRH (refer  
to Table 107 on page 244).  
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Reading the Fuses  
and Lock Bits  
1. Enter JTAG instruction PROG_COMMANDS.  
2. Enable Fuse/Lock bit read using programming instruction 8a.  
3. To read all Fuses and Lock bits, use programming instruction 8f.  
To only read Fuse Extended byte, use programming instruction 8b.  
To only read Fuse High byte, use programming instruction 8c.  
To only read Fuse Low byte, use programming instruction 8d.  
To only read Lock bits, use programming instruction 8e.  
Reading the Signature 1. Enter JTAG instruction PROG_COMMANDS.  
Bytes  
2. Enable Signature byte read using programming instruction 9a.  
3. Load address 0x00 using programming instruction 9b.  
4. Read first signature byte using programming instruction 9c.  
5. Repeat steps 3 and 4 with address 0x01 and address 0x02 to read the second and third  
signature bytes, respectively.  
Reading the  
1. Enter JTAG instruction PROG_COMMANDS.  
Calibration Byte  
2. Enable Calibration byte read using programming instruction 10a.  
3. Load address 0x00 using programming instruction 10b.  
4. Read the calibration byte using programming instruction 10c.  
263  
2513K–AVR–07/09  
Electrical Characteristics  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Operating Temperature.................................. -55°C to +125°C  
Storage Temperature..................................... -65°C to +150°C  
Voltage on any Pin except RESET  
with respect to Ground ................................-0.5V to VCC+0.5V  
Voltage on RESET with respect to Ground......-0.5V to +13.0V  
Maximum Operating Voltage ............................................ 6.0V  
DC Current per I/O Pin ............................................... 40.0 mA  
DC Current VCC and GND Pins.......................200.0 mA PDIP,  
400 mA TQFP/MLF  
DC Characteristics  
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Units  
(1)  
(1)  
Input Low Voltage, Except XTAL1  
and RESETpin  
VCC = 1.8 - 2.4V  
VCC = 2.4 - 5.5V  
-0.5  
-0.5  
0.2 VCC  
0.3 VCC  
VIL  
V
(2)  
(2)  
Input High Voltage, Except XTAL1  
and RESET pin  
VCC = 1.8 - 2.4V  
VCC = 2.4 - 5.5V  
0.7 VCC  
0.6 VCC  
VCC + 0.5  
VCC + 0.5  
VIH  
V
V
V
(1)  
VIL1  
VIH1  
Input Low Voltage, XTAL1 pin  
Input High Voltage, XTAL1 pin  
VCC = 1.8 - 5.5V  
-0.5  
0.1 VCC  
(2)  
(2)  
VCC = 1.8 - 2.4V  
0.8 VCC  
0.7 VCC  
VCC + 0.5  
VCC + 0.5  
VCC = 2.4 - 5.5V  
VCC = 1.8 - 5.5V  
VCC = 1.8 - 5.5V  
VIL2  
VIH2  
Input Low Voltage, RESET pin  
Input High Voltage, RESET pin  
-0.5  
0.2 VCC  
V
V
(2)  
0.9 VCC  
VCC + 0.5  
Output Low Voltage(3), Ports A, B, C,  
D, and E  
IOL = 20 mA, VCC = 5V  
IOL = 10 mA, VCC = 3V  
0.7  
0.5  
V
V
VOL  
VOH  
IIL  
Output High Voltage(4), Ports A, B, C,  
D, and E  
IOL = -20 mA, VCC = 5V  
IOL = -10 mA, VCC = 3V  
4.2  
2.3  
V
V
Vcc = 5.5V, pin low  
(absolute value)  
Input Leakage Current I/O Pin  
Input Leakage Current I/O Pin  
1
1
µA  
µA  
Vcc = 5.5V, pin high  
(absolute value)  
IIH  
RRST  
Rpu  
Reset Pull-up Resistor  
I/O Pin Pull-up Resistor  
30  
20  
60  
50  
kΩ  
kΩ  
264  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) (Continued)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Units  
Active 1 MHz, VCC = 2V  
(ATmega162V)  
0.8  
mA  
Active 4 MHz, VCC = 3V  
5
16  
0.3  
2
mA  
mA  
mA  
mA  
(ATmega162/V)  
Active 8 MHz, VCC = 5V  
(ATmega162)  
Power Supply Current  
Idle 1 MHz, VCC = 2V  
(ATmega162V)  
ICC  
Idle 4 MHz, VCC = 3V  
(ATmega162/V)  
Idle 8 MHz, VCC = 5V  
(ATmega162)  
8
mA  
µA  
µA  
mV  
nA  
ns  
WDT Enabled,  
VCC = 3.0V  
< 10  
< 1.5  
< 10  
14  
2
Power-down mode  
WDT Disabled,  
VCC = 3.0V  
Analog Comparator Input Offset  
Voltage  
VCC = 5V  
Vin = VCC/2  
VACIO  
IACLK  
tACPD  
40  
50  
Analog Comparator Input Leakage  
Current  
VCC = 5V  
Vin = VCC/2  
-50  
Analog Comparator Propagation  
Delay  
VCC = 2.7V  
VCC = 4.0V  
750  
500  
Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low  
2. “Min” means the lowest value where the pin is guaranteed to be read as high  
3. Although each I/O port can sink more than the test conditions (20 mA at Vcc = 5V, 10 mA at Vcc = 3V) under steady state  
conditions (non-transient), the following must be observed:  
PDIP Package:  
1] The sum of all IOL, for all ports, should not exceed 200 mA.  
2] The sum of all IOL, for port B0 - B7, D0 - D7, and XTAL2, should not exceed 100 mA.  
3] The sum of all IOL, for ports A0 - A7, E0 - E2, C0 - C7, should not exceed 100 mA.  
TQFP and QFN/MLF Package:  
1] The sum of all IOL, for all ports, should not exceed 400 mA.  
2] The sum of all IOL, for ports B0 - B7, D0 - D7, and XTAL2, should not exceed 200 mA.  
3] The sum of all IOL, for ports C0 - C7 and E1 - E2, should not exceed 200 mA.  
4] The sum of all IOL, for ports A0 - A7 and E0, should not exceed 200 mA.  
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater  
than the listed test condition.  
4. Although each I/O port can source more than the test conditions (20 mA at Vcc = 5V, 10 mA at Vcc = 3V) under steady state  
conditions (non-transient), the following must be observed:  
PDIP Package:  
1] The sum of all IOH, for all ports, should not exceed 200 mA.  
2] The sum of all IOH, for port B0 - B7, D0 - D7, and XTAL2, should not exceed 100 mA.  
3] The sum of all IOH, for ports A0 - A7, E0 - E2, C0 - C7, should not exceed 100 mA.  
TQFP and MLF Package:  
1] The sum of all IOH, for all ports, should not exceed 400 mA.  
2] The sum of all IOH, for ports B0 - B7, D0 - D7, and XTAL2, should not exceed 200 mA.  
3] The sum of all IOH, for ports C0 - C7 and E1 - E2, should not exceed 200 mA.  
4] The sum of all IOH, for ports A0 - A7 and E0, should not exceed 200 mA.  
265  
2513K–AVR–07/09  
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current  
greater than the listed test condition.  
Figure 113. Absolute Maximum Frequency as a function of VCC, ATmega162V  
Frequency  
16 MHz  
8 MHz  
Safe Operating  
Area  
1 MHz  
VCC  
1.8V  
2.4V 2.7V  
4.5V  
5.5V  
Figure 114. Absolute Maximum Frequency as a function of VCC, ATmega162  
Frequency  
16 MHz  
8 MHz  
Safe Operating  
Area  
1 MHz  
VCC  
1.8V  
2.4V 2.7V  
4.5V  
5.5V  
266  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
External Clock  
Figure 115. External Clock Drive Waveforms  
Drive Waveforms  
VIH1  
VIL1  
External Clock  
Drive  
Table 112. External Clock Drive  
VCC = 1.8 - 5.5V VCC =2.7 - 5.5V VCC = 4.5 - 5.5V  
Symbol Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Units  
Oscillator  
0
1
0
8
0
16  
MHz  
1/tCLCL  
tCLCL  
Frequency  
Clock Period  
High Time  
Low Time  
Rise Time  
Fall Time  
1000  
400  
125  
50  
62.5  
25  
ns  
ns  
ns  
μs  
μs  
tCHCX  
tCLCX  
tCLCH  
tCHCL  
400  
50  
25  
2.0  
2.0  
1.6  
1.6  
0.5  
0.5  
Change in  
period from one  
clock cycle to  
the next  
2
2
2
%
ΔtCLCL  
267  
2513K–AVR–07/09  
SPI Timing  
See Figure 116 and Figure 117 for details.  
Characteristics  
Table 113. SPI Timing Parameters  
Description  
SCK period  
SCK high/low  
Rise/Fall time  
Setup  
Mode  
Master  
Master  
Master  
Master  
Master  
Master  
Master  
Master  
Slave  
Min  
Typ  
Max  
1
2
See Table 68  
50% duty cycle  
3
3.6  
10  
4
5
Hold  
10  
ns  
6
Out to SCK  
SCK to out  
SCK to out high  
SS low to out  
SCK period  
SCK high/low(1)  
Rise/Fall time  
Setup  
0.5 • tsck  
10  
7
8
10  
9
15  
10  
11  
12  
13  
14  
15  
16  
17  
18  
Slave  
4 • tck  
2 • tck  
Slave  
Slave  
1.6  
µs  
Slave  
10  
tck  
Hold  
Slave  
SCK to out  
SCK to SS high  
SS high to tri-state  
SS low to SCK  
Slave  
15  
10  
ns  
Slave  
20  
Slave  
Slave  
2 • tck  
Note:  
1. In SPI Programming mode, the minimum SCK high/low period is:  
– 2 tCLCL for fCK < 12 MHz  
– 3 tCLCL for fCK > 12 MHz.  
Figure 116. SPI Interface Timing Requirements (Master Mode)  
SS  
6
1
SCK  
(CPOL = 0)  
2
2
SCK  
(CPOL = 1)  
4
5
3
MISO  
(Data Input)  
MSB  
...  
LSB  
7
8
MOSI  
(Data Output)  
MSB  
...  
LSB  
268  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 117. SPI Interface Timing Requirements (Slave Mode)  
18  
SS  
10  
16  
9
SCK  
(CPOL = 0)  
11  
11  
SCK  
(CPOL = 1)  
13  
14  
12  
MOSI  
(Data Input)  
MSB  
...  
LSB  
15  
17  
MISO  
(Data Output)  
MSB  
...  
LSB  
X
269  
2513K–AVR–07/09  
External Data Memory Timing  
Table 114. External Data Memory Characteristics, 4.5 - 5.5 Volts, no Wait-state  
8 MHz Oscillator  
Variable Oscillator  
Symbol  
1/tCLCL  
tLHLL  
Parameter  
Min  
Max  
Min  
Max  
Unit  
MHz  
ns  
0
1
2
Oscillator Frequency  
ALE Pulse Width  
0.0  
16  
115  
1.0tCLCL-10  
0.5tCLCL-5(1)  
tAVLL  
Address Valid A to ALE Low  
57.5  
ns  
Address Hold After ALE Low,  
write access  
5
5
5
3a  
tLLAX_ST  
ns  
Address Hold after ALE Low,  
read access  
5
3b  
4
tLLAX_LD  
tAVLLC  
tAVRL  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Valid C to ALE Low  
Address Valid to RD Low  
Address Valid to WR Low  
ALE Low to WR Low  
ALE Low to RD Low  
57.5  
115  
115  
47.5  
47.5  
40  
0.5tCLCL-5(1)  
1.0tCLCL-10  
1.0tCLCL-10  
0.5tCLCL-15(2)  
0.5tCLCL-15(2)  
40  
5
6
tAVWL  
tLLWL  
7
67.5  
67.5  
0.5tCLCL+5(2)  
0.5tCLCL+5(2)  
8
tLLRL  
9
tDVRH  
tRLDV  
tRHDX  
tRLRH  
tDVWL  
tWHDX  
tDVWH  
tWLWH  
Data Setup to RD High  
Read Low to Data Valid  
Data Hold After RD High  
RD Pulse Width  
10  
11  
12  
13  
14  
15  
16  
75  
1.0tCLCL-50  
0
0
115  
42.5  
115  
125  
115  
1.0tCLCL-10  
0.5tCLCL-20(1)  
1.0tCLCL-10  
1.0tCLCL  
Data Setup to WR Low  
Data Hold After WR High  
Data Valid to WR High  
WR Pulse Width  
1.0tCLCL-10  
Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1.  
2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1.  
Table 115. External Data Memory Characteristics, 4.5 - 5.5 Volts, 1 Cycle Wait-state  
8 MHz Oscillator  
Variable Oscillator  
Min Max  
Symbol  
Parameter  
Min  
Max  
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
16  
10 tRLDV  
12 tRLRH  
15 tDVWH  
16 tWLWH  
200  
2.0tCLCL-50  
240  
240  
240  
2.0tCLCL-10  
2.0tCLCL  
ns  
Data Valid to WR High  
WR Pulse Width  
ns  
2.0tCLCL-10  
ns  
270  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table 116. External Data Memory Characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0  
4 MHz Oscillator Variable Oscillator  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
16  
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
10 tRLDV  
12 tRLRH  
15 tDVWH  
16 tWLWH  
325  
3.0tCLCL-50  
365  
375  
365  
3.0tCLCL-10  
3.0tCLCL  
ns  
Data Valid to WR High  
WR Pulse Width  
ns  
3.0tCLCL-10  
ns  
Table 117. External Data Memory Characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1  
4 MHz Oscillator Variable Oscillator  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
16  
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
10 tRLDV  
12 tRLRH  
14 tWHDX  
15 tDVWH  
16 tWLWH  
325  
3.0tCLCL-50  
365  
240  
375  
365  
3.0tCLCL-10  
2.0tCLCL-10  
3.0tCLCL  
ns  
Data Hold After WR High  
Data Valid to WR High  
WR Pulse Width  
ns  
ns  
3.0tCLCL-10  
ns  
Table 118. External Data Memory Characteristics, 2.7 - 5.5 Volts, no Wait-state  
4 MHz Oscillator  
Variable Oscillator  
Symbol  
1/tCLCL  
tLHLL  
Parameter  
Min  
Max  
Min  
0.0  
Max  
Unit  
MHz  
ns  
0
1
2
Oscillator Frequency  
ALE Pulse Width  
8
235  
115  
tCLCL-15  
0.5tCLCL-10(1)  
tAVLL  
Address Valid A to ALE Low  
ns  
Address Hold After ALE Low,  
write access  
5
5
5
3a tLLAX_ST  
ns  
Address Hold after ALE Low,  
read access  
5
3b tLLAX_LD  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4
5
6
7
8
9
tAVLLC  
tAVRL  
tAVWL  
tLLWL  
tLLRL  
Address Valid C to ALE Low  
Address Valid to RD Low  
Address Valid to WR Low  
ALE Low to WR Low  
115  
235  
235  
115  
115  
45  
0.5tCLCL-10(1)  
1.0tCLCL-15  
1.0tCLCL-15  
0.5tCLCL-10(2)  
0.5tCLCL-10(2)  
45  
130  
130  
0.5tCLCL+5(2)  
0.5tCLCL+5(2)  
ALE Low to RD Low  
tDVRH  
Data Setup to RD High  
Read Low to Data Valid  
Data Hold After RD High  
10 tRLDV  
11 tRHDX  
190  
1.0tCLCL-60  
0
0
271  
2513K–AVR–07/09  
Table 118. External Data Memory Characteristics, 2.7 - 5.5 Volts, no Wait-state (Continued)  
4 MHz Oscillator Variable Oscillator  
Min Max  
Symbol  
12 tRLRH  
Parameter  
Min  
Max  
Unit  
ns  
RD Pulse Width  
235  
105  
235  
250  
235  
1.0tCLCL-15  
0.5tCLCL-20(1)  
1.0tCLCL-15  
1.0tCLCL  
13 tDVWL  
14 tWHDX  
15 tDVWH  
16 tWLWH  
Data Setup to WR Low  
Data Hold After WR High  
Data Valid to WR High  
WR Pulse Width  
ns  
ns  
ns  
1.0tCLCL-15  
ns  
Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1.  
2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1.  
Table 119. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 0, SRWn0 = 1  
4 MHz Oscillator  
Variable Oscillator  
Min Max  
Symbol  
Parameter  
Min  
Max  
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
8
10 tRLDV  
12 tRLRH  
15 tDVWH  
16 tWLWH  
440  
2.0tCLCL-60  
485  
500  
485  
2.0tCLCL-15  
2.0tCLCL  
ns  
Data Valid to WR High  
WR Pulse Width  
ns  
2.0tCLCL-15  
ns  
Table 120. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0  
4 MHz Oscillator Variable Oscillator  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
8
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
10 tRLDV  
12 tRLRH  
15 tDVWH  
16 tWLWH  
690  
3.0tCLCL-60  
735  
750  
735  
3.0tCLCL-15  
3.0tCLCL  
ns  
Data Valid to WR High  
WR Pulse Width  
ns  
3.0tCLCL-15  
ns  
Table 121. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1  
4 MHz Oscillator Variable Oscillator  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
8
Unit  
MHz  
ns  
0
1/tCLCL  
Oscillator Frequency  
Read Low to Data Valid  
RD Pulse Width  
0.0  
10 tRLDV  
12 tRLRH  
14 tWHDX  
15 tDVWH  
16 tWLWH  
690  
3.0tCLCL-60  
735  
485  
750  
735  
3.0tCLCL-15  
2.0tCLCL-15  
3.0tCLCL  
ns  
Data Hold After WR High  
Data Valid to WR High  
WR Pulse Width  
ns  
ns  
3.0tCLCL-15  
ns  
272  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 118. External Memory Timing (SRWn1 = 0, SRWn0 = 0  
T1  
T2  
T3  
T4  
System Clock (CLKCPU  
)
1
ALE  
4
2
7
A15:8 Prev. addr.  
Address  
15  
3a  
3b  
13  
DA7:0 Prev. data  
Address  
6
XX  
Data  
16  
14  
WR  
9
11  
DA7:0 (XMBK = 0)  
Address  
5
Data  
10  
8
12  
RD  
Figure 119. External Memory Timing (SRWn1 = 0, SRWn0 = 1)  
T1  
T2  
T3  
T4  
T5  
System Clock (CLKCPU  
)
1
ALE  
4
2
7
A15:8 Prev. addr.  
Address  
15  
3a  
3b  
13  
Data  
16  
DA7:0 Prev. data  
Address  
6
XX  
14  
WR  
9
11  
DA7:0 (XMBK = 0)  
Address  
5
Data  
10  
8
12  
RD  
273  
2513K–AVR–07/09  
Figure 120. External Memory Timing (SRWn1 = 1, SRWn0 = 0)  
T1  
T2  
T3  
T4  
T5  
T6  
System Clock (CLKCPU  
)
1
ALE  
4
2
7
Address  
15  
A15:8 Prev. addr.  
3a  
3b  
13  
DA7:0 Prev. data  
Address  
6
XX  
Data  
16  
14  
WR  
9
11  
DA7:0 (XMBK = 0)  
Address  
5
Data  
10  
8
12  
RD  
Figure 121. External Memory Timing (SRWn1 = 1, SRWn0 = 1)(1)  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
System Clock (CLKCPU  
)
1
ALE  
4
2
7
Address  
15  
A15:8 Prev. addr.  
3a  
3b  
13  
DA7:0 Prev. data  
Address  
6
XX  
Data  
16  
14  
WR  
9
11  
DA7:0 (XMBK = 0)  
Address  
5
Data  
10  
8
12  
RD  
Note:  
1. The ALE pulse in the last period (T4 - T7) is only present if the next instruction accesses the  
RAM (internal or external).  
274  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
ATmega162  
Typical  
Characteristics  
The following charts show typical behavior. These figures are not tested during manufacturing.  
All current consumption measurements are performed with all I/O pins configured as inputs and  
with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock  
source. The CKSEL Fuses are programmed to select external clock.  
The power consumption in Power-down mode is independent of clock selection.  
The current consumption is a function of several factors such as: Operating voltage, operating  
frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient tempera-  
ture. The dominating factors are operating voltage and frequency.  
The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where  
CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin.  
The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to  
function properly at frequencies higher than the ordering code indicates.  
The difference between current consumption in Power-down mode with Watchdog Timer  
enabled and Power-down mode with Watchdog Timer disabled represents the differential cur-  
rent drawn by the Watchdog Timer.  
Active Supply Current Figure 122. Active Supply Current vs. Frequency (0.1 - 1.0 MHz)  
ACTIVE SUPPLY CURRENT vs. FREQUENCY  
0.1 - 1.0 MHz  
3
2.5  
2
5.5V  
5.0V  
4.5V  
4.0V  
1.5  
1
3.3V  
2.7V  
1.8V  
0.5  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
275  
2513K–AVR–07/09  
Figure 123. Active Supply Current vs. Frequency (1 - 20 MHz)  
ACTIVE SUPPLY CURRENT vs. FREQUENCY  
1- 20 MHz  
45  
40  
35  
30  
25  
20  
15  
5.5V  
5.0V  
4.5V  
4.0V  
3.3V  
10  
2.7V  
5
1.8V  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
Figure 124. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)  
ACTIVE SUPPLY CURRENT vs. VCC  
INTERNAL RC OSCILLATOR, 8 MHz  
20  
18  
16  
14  
12  
10  
8
85°C  
25°C  
-40°C  
6
4
2
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
276  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 125. Active Supply Current vs. VCC (32 kHz External Oscillator)  
ACTIVE SUPPLY CURRENT vs. VCC  
32kHz EXTERNAL OSCILLATOR  
300  
250  
200  
150  
100  
50  
25°C  
85°C  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Idle Supply Current  
Figure 126. Idle Supply Current vs. Frequency (0.1 - 1.0 MHz)  
IDLE SUPPLY CURRENT vs. FREQUENCY  
0.1 - 1.0 MHz  
1.2  
5.5V  
5.0V  
1
0.8  
0.6  
0.4  
0.2  
0
4.5V  
4.0V  
3.3V  
2.7V  
1.8V  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
277  
2513K–AVR–07/09  
Figure 127. Idle Supply Current vs. Frequency (1 - 20 MHz)  
IDLE SUPPLY CURRENT vs. FREQUENCY  
1 - 20 MHz  
25  
5.5V  
20  
15  
10  
5.0V  
4.5V  
4.0V  
3.3V  
5
2.7V  
1.8V  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
Figure 128. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)  
IDLE SUPPLY CURRENT vs. VCC  
INTERNAL RC OSCILLATOR, 8 MHz  
9
85°C  
25°C  
-40°C  
8
7
6
5
4
3
2
1
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
278  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 129. Idle Supply Current vs. VCC (32 kHz External Oscillator)  
IDLE SUPPLY CURRENT vs. VCC  
32kHz EXTERNAL OSCILLATOR  
70  
60  
50  
40  
30  
20  
10  
0
85°C  
25°C  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Power-down Supply  
Current  
Figure 130. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)  
POWER-DOWN SUPPLY CURRENT vs. VCC  
WATCHDOG TIMER DISABLED  
3
85°C  
2.5  
2
1.5  
1
-40°C  
25°C  
0.5  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
279  
2513K–AVR–07/09  
Figure 131. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)  
POWER-DOWN SUPPLY CURRENT vs. VCC  
WATCHDOG TIMER ENABLED  
25  
85°C  
20  
15  
10  
5
25°C  
-40°C  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Power-save Supply  
Current  
Figure 132. Power-save Supply Current vs. VCC (Watchdog Timer Disabled)  
POWER-SAVE SUPPLY CURRENT vs. VCC  
WATCHDOG TIMER DISABLED  
30  
85°C  
25°C  
25  
20  
15  
10  
5
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
280  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Standby Supply  
Current  
Figure 133. Standby Supply Current vs. VCC (455 kHz Resonator, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
455 kHz RESONATOR, WATCHDOG TIMER DISABLED  
70  
60  
50  
40  
30  
20  
10  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 134. Standby Supply Current vs. VCC (1 MHz Resonator, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
1 MHz RESONATOR, WATCHDOG TIMER DISABLED  
60  
50  
40  
30  
20  
10  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
281  
2513K–AVR–07/09  
Figure 135. Standby Supply Current vs. VCC (2 MHz Resonator, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
2 MHz XTAL, WATCHDOG TIMER DISABLED  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 136. Standby Supply Current vs. VCC (2 MHz Xtal, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
2 MHz XTAL, WATCHDOG TIMER DISABLED  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
282  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 137. Standby Supply Current vs. VCC (4 MHz Resonator, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
4 MHz RESONATOR, WATCHDOG TIMER DISABLED  
140  
120  
100  
80  
60  
40  
20  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 138. Standby Supply Current vs. VCC (4 MHz Xtal, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
4 MHz XTAL, WATCHDOG TIMER DISABLED  
140  
120  
100  
80  
60  
40  
20  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
283  
2513K–AVR–07/09  
Figure 139. Standby Supply Current vs. VCC (6 MHz Resonator, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
6 MHz RESONATOR, WATCHDOG TIMER DISABLED  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
Figure 140. Standby Supply Current vs. VCC (6 MHz Xtal, Watchdog Timer Disabled)  
STANDBY SUPPLY CURRENT vs. VCC  
6 MHz XTAL, WATCHDOG TIMER DISABLED  
200  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
284  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Pin Pull-up  
Figure 141. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)  
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE  
Vcc = 5V  
160  
85°C  
140  
25°C  
120  
100  
80  
60  
40  
20  
0
-40°C  
0
1
2
3
4
5
6
VIO (V)  
Figure 142. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V)  
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE  
Vcc = 2.7V  
80  
85°C  
70  
25°C  
-40°C  
60  
50  
40  
30  
20  
10  
0
0
0.5  
1
1.5  
2
2.5  
3
VIO (V)  
285  
2513K–AVR–07/09  
Figure 143. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8V)  
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE  
Vcc = 1.8V  
60  
50  
85°C  
25°C  
40  
-40°C  
30  
20  
10  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
V
OP (V)  
Figure 144. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)  
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE  
Vcc = 5V  
120  
-40°C  
25°C  
100  
85°C  
80  
60  
40  
20  
0
6
0
1
2
3
4
5
VRESET (V)  
286  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 145. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)  
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE  
Vcc = 2.7V  
60  
-40°C  
50  
25°C  
85°C  
40  
30  
20  
10  
0
0
0.5  
1
1.5  
2
2.5  
3
V
RESET (V)  
Figure 146. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V)  
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE  
Vcc = 1.8V  
40  
-40°C  
35  
25°C  
30  
85°C  
25  
20  
15  
10  
5
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
V
RESET (V)  
287  
2513K–AVR–07/09  
Pin Driver Strength  
Figure 147. I/O Pin Source Current vs. Output Voltage (VCC = 5V)  
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE  
Vcc = 5V  
90  
80  
-40°C  
70  
25°C  
60  
85°C  
50  
40  
30  
20  
10  
0
0
1
2
3
4
5
6
VOH (V)  
Figure 148. I/O Pin Source Current vs. Output Voltage (VCC = 2.7V)  
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE  
Vcc = 2.7V  
30  
-40°C  
25  
25°C  
85°C  
20  
15  
10  
5
0
0
0.5  
1
1.5  
2
2.5  
3
V
OH (V)  
288  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 149. I/O Pin Source Current vs. Output Voltage (VCC = 1.8V)  
I/O PIN SOURCE CURRENT vs. OUTPUT VOLTAGE  
Vcc = 1.8V  
-40°C  
85°C  
8
25°C  
7
6
5
4
3
2
1
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
VOH (V)  
Figure 150. I/O Pin Sink Current vs. Output Voltage (VCC = 5V)  
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE  
Vcc = 5V  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-40°C  
25°C  
85°C  
0
0.5  
1
1.5  
2
2.5  
VOL (V)  
289  
2513K–AVR–07/09  
Figure 151. I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V)  
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE  
Vcc = 2.7V  
35  
-40°C  
25°C  
85°C  
30  
25  
20  
15  
10  
5
0
0
0.5  
1
1.5  
2
2.5  
V
OL (V)  
Figure 152. I/O Pin Sink Current vs. Output Voltage (VCC = 1.8V)  
I/O PIN SINK CURRENT vs. OUTPUT VOLTAGE  
Vcc = 1.8V  
12  
-40°C  
25°C  
10  
8
85°C  
6
4
2
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
V
OL (V)  
290  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Pin Thresholds and  
Hysteresis  
Figure 153. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”)  
I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC  
VIH, I/O PIN READ AS '1'  
3
2.5  
2
85°C  
25°C  
-40°C  
1.5  
1
0.5  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 154. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”)  
I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC  
VIL, I/O PIN READ AS '0'  
3
85°C  
25°C  
-40°C  
2.5  
2
1.5  
1
0.5  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
291  
2513K–AVR–07/09  
Figure 155. I/O Pin Input Hysteresis vs. VCC  
I/O PIN INPUT HYSTERESIS vs. VCC  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-40°C  
25°C  
85°C  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
Figure 156. Reset Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”)  
RESET INPUT THRESHOLD VOLTAGE vs. VCC  
VIH, RESET PIN READ AS '1'  
3
2.5  
2
-40°C  
1.5  
25°C  
85°C  
1
0.5  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
292  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 157. Reset Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”)  
RESET INPUT THRESHOLD VOLTAGE vs. VCC  
VIL, RESET PIN READ AS '0'  
2.5  
2
1.5  
1
85°C  
25°C  
-40°C  
0.5  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 158. Reset Input Pin Hysteresis vs. VCC  
RESET INPUT PIN HYSTERESIS vs. VCC  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-40°C  
25°C  
85°C  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
293  
2513K–AVR–07/09  
BOD Thresholds and  
Analog Comparator  
Offset  
Figure 159. BOD Thresholds vs. Temperature (BOD Level is 4.3V)  
BOD THRESHOLDS vs. TEMPERATURE  
BODLEVEL IS 4.3V  
4.6  
4.5  
Rising VCC  
4.4  
Falling VCC  
4.3  
4.2  
4.1  
4
-50  
-40  
-30  
-20  
-10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Temperature (˚C)  
Figure 160. BOD Thresholds vs. Temperature (BOD Level is 2.7V)  
BOD THRESHOLDS vs. TEMPERATURE  
BODLEVEL IS 2.7V  
3
2.9  
Rising VCC  
2.8  
Falling VCC  
2.7  
2.6  
2.5  
2.4  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Temperature (˚C)  
294  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 161. BOD Thresholds vs. Temperature (BOD Level is 2.3V)  
BOD THRESHOLDS vs. TEMPERATURE  
BODLEVEL IS 2.3V  
2.6  
2.5  
Rising VCC  
2.4  
Falling VCC  
2.3  
2.2  
2.1  
2
-50  
-40  
-30  
-20  
-10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Temperature (˚C)  
Figure 162. BOD Thresholds vs. Temperature (BOD Level is 1.8V)  
BOD THRESHOLDS vs. TEMPERATURE  
BODLEVEL IS 1.8V  
2.1  
2
Rising VCC  
1.9  
1.8  
Falling VCC  
1.7  
1.6  
1.5  
-50  
-40  
-30  
-20  
-10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Temperature (˚C)  
295  
2513K–AVR–07/09  
Figure 163. Bandgap Voltage vs. VCC  
BANDGAP VOLTAGE vs. VCC  
1.14  
1.13  
1.12  
1.11  
1.1  
85°C  
25°C  
-40°C  
1.09  
1.08  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Vcc (V)  
Figure 164. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 5V)  
ANALOG COMPARATOR OFFSET VOLTAGE vs. COMMON MODE VOLTAGE  
VCC = 5V  
0.01  
85°C  
0.009  
25°C  
0.008  
-40°C  
0.007  
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Common Mode Voltage (V)  
296  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 165. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 2.7V)  
ANALOG COMPARATOR OFFSET VOLTAGE vs. COMMON MODE VOLTAGE  
VCC = 2.7V  
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
0
85°C  
25°C  
-40°C  
-0.001  
0
0.5  
1
1.5  
2
2.5  
3
Common Mode Voltage (V)  
Internal Oscillator  
Speed  
Figure 166. Watchdog Oscillator Frequency vs. VCC  
WATCHDOG OSCILLATOR FREQUENCY vs. VCC  
1300  
1250  
1200  
1150  
1100  
1050  
1000  
-40°C  
25°C  
85°C  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
297  
2513K–AVR–07/09  
Figure 167. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature  
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE  
8.4  
5.5V  
4.0V  
2.7V  
1.8V  
8.3  
8.2  
8.1  
8
7.9  
7.8  
7.7  
7.6  
7.5  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
Ta (˚C)  
Figure 168. Calibrated 8 MHz RC Oscillator Frequency vs.VCC  
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. VCC  
10  
9.5  
9
8.5  
8
85°C  
25°C  
-40°C  
7.5  
7
6.5  
6
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
298  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 169. Calibrated 8 MHz RC Oscillator Frequency vs. Osccal Value  
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE  
16  
14  
12  
10  
8
6
4
0
16  
32  
48  
64  
80  
96  
112  
OSCCAL VALUE  
Current Consumption Figure 170. Brownout Detector Current vs. VCC  
of Peripheral Units  
BROWNOUT DETECTOR CURRENT vs. VCC  
35  
30  
25  
20  
15  
10  
5
-40°C  
85°C  
25°C  
0
-5  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
299  
2513K–AVR–07/09  
Figure 171. 32 kHz TOSC Current vs. VCC (Watchdog Timer Disabled)  
32kHz TOSC CURRENT vs. VCC  
WATCHDOG TIMER DISABLED  
30  
85°C  
25°C  
25  
20  
15  
10  
5
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 172. Watchdog TImer Current vs. VCC  
WATCHDOG TIMER CURRENT vs. VCC  
20  
18  
16  
14  
12  
10  
8
85°C  
25°C  
-40°C  
6
4
2
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
300  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 173. Analog Comparator Current vs. VCC  
ANALOG COMPARATOR CURRENT vs. VCC  
80  
70  
60  
50  
40  
30  
20  
10  
0
-40°C  
25°C  
85°C  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 174. Programming Current vs. VCC  
PROGRAMMING CURRENT vs. Vcc  
25  
20  
15  
10  
5
-40°C  
25°C  
85°C  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
301  
2513K–AVR–07/09  
Current Consumption Figure 175. Reset Supply Current vs. Frequency (0.1 - 1.0 MHz, Excluding Current Through  
in Reset and Reset  
Pulsewidth  
The Reset Pull-up)  
RESET SUPPLY CURRENT vs. FREQUENCY  
0.1 - 1.0 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP  
4.5  
4
5.5V  
5.0V  
3.5  
3
4.5V  
4.0V  
2.5  
2
3.3V  
2.7V  
1.5  
1
1.8V  
0.5  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
Figure 176. Reset Supply Current vs. Frequency (1 - 20 MHz, Excluding Current Through The  
Reset Pull-up)  
RESET SUPPLY CURRENT vs. FREQUENCY  
1 - 20 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP  
35  
5.5V  
30  
5.0V  
25  
4.5V  
20  
4.0V  
15  
10  
3.3V  
5
2.7V  
1.8V  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
302  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Figure 177. Reset Pulse Width vs. VCC  
RESET PULSE WIDTH vs. VCC  
2500  
2000  
1500  
1000  
500  
85°C  
25°C  
-40°C  
0
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
303  
2513K–AVR–07/09  
Register Summary  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Page  
(0xFF)  
..  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
TCCR3A  
TCCR3B  
TCNT3H  
TCNT3L  
OCR3AH  
OCR3AL  
OCR3BH  
OCR3BL  
Reserved  
Reserved  
ICR3H  
(0x9E)  
(0x9D)  
(0x9C)  
(0x9B)  
(0x9A)  
(0x99)  
(0x98)  
(0x97)  
(0x96)  
(0x95)  
(0x94)  
(0x93)  
(0x92)  
(0x91)  
(0x90)  
(0x8F)  
(0x8E)  
(0x8D)  
(0x8C)  
(0x8B)  
(0x8A)  
(0x89)  
(0x88)  
(0x87)  
(0x86)  
(0x85)  
(0x84)  
(0x83)  
(0x82)  
(0x81)  
(0x80)  
(0x7F)  
(0x7E)  
(0x7D)  
(0x7C)  
(0x7B)  
(0x7A)  
(0x79)  
(0x78)  
(0x77)  
(0x76)  
(0x75)  
(0x74)  
(0x73)  
(0x72)  
(0x71)  
(0x70)  
(0x6F)  
(0x6E)  
(0x6D)  
(0x6C)  
(0x6B)  
(0x6A)  
(0x69)  
(0x68)  
(0x67)  
(0x66)  
(0x65)  
(0x64)  
(0x63)  
(0x62)  
(0x61)  
COM3B1  
COM3A1  
ICNC3  
COM3A0  
ICES3  
COM3B0  
WGM33  
FOC3A  
WGM32  
FOC3B  
CS32  
WGM31  
CS31  
WGM30  
CS30  
131  
128  
133  
133  
133  
133  
133  
133  
Timer/Counter3 – Counter Register High Byte  
Timer/Counter3 – Counter Register Low Byte  
Timer/Counter3 – Output Compare Register A High Byte  
Timer/Counter3 – Output Compare Register A Low Byte  
Timer/Counter3 – Output Compare Register B High Byte  
Timer/Counter3 – Output Compare Register B Low Byte  
Timer/Counter3 – Input Capture Register High Byte  
Timer/Counter3 – Input Capture Register Low Byte  
134  
134  
ICR3L  
Reserved  
Reserved  
ETIMSK  
TICIE3  
OCIE3A  
OCIE3B  
TOIE3  
135  
135  
ETIFR  
ICF3  
OCF3A  
OCF3B  
TOV3  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
PCMSK1  
PCMSK0  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
CLKPR  
PCINT15  
PCINT14  
PCINT13  
PCINT12  
PCINT11  
PCINT10  
PCINT9  
PCINT8  
88  
88  
PCINT7  
PCINT6  
PCINT5  
PCINT4  
PCINT3  
PCINT2  
PCINT1  
PCINT0  
CLKPCE  
CLKPS3  
CLKPS2  
CLKPS1  
CLKPS0  
41  
304  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Page  
(0x60)  
Reserved  
SREG  
T
H
S
V
N
0x3F (0x5F)  
0x3E (0x5E)  
0x3D (0x5D)  
I
Z
C
10  
13  
SPH  
SP15  
SP7  
SP14  
SP6  
SP13  
SP5  
SP12  
SP4  
SP11  
SP3  
SP10  
SP2  
SP9  
SP1  
SP8  
SP0  
SPL  
13  
UBRR1[11:8]  
UBRR1H  
UCSR1C  
GICR  
URSEL1  
URSEL1  
INT1  
190  
189  
61, 86  
87  
0x3C(2)(0x5C)(2)  
UMSEL1  
INT0  
UPM11  
INT2  
UPM10  
PCIE1  
PCIF1  
OCIE2  
OCF2  
USBS1  
PCIE0  
PCIF0  
UCSZ11  
UCSZ10  
IVSEL  
UCPOL1  
IVCE  
0x3B (0x5B)  
0x3A (0x5A)  
0x39 (0x59)  
0x38 (0x58)  
0x37 (0x57)  
0x36 (0x56)  
0x35 (0x55)  
0x34 (0x54)  
0x33 (0x53)  
0x32 (0x52)  
0x31 (0x51)  
GIFR  
INTF1  
TOIE1  
TOV1  
SPMIE  
SM0  
INTF0  
OCIE1A  
OCF1A  
RWWSB  
SRL2  
INTF2  
OCIE1B  
OCF1B  
TIMSK  
TIFR  
TICIE1  
ICF1  
TOIE2  
TOV2  
PGWRT  
SRW00  
ISC10  
BORF  
CS02  
TOIE0  
TOV0  
PGERS  
SRW11  
ISC01  
EXTRF  
CS01  
OCIE0  
OCF0  
SPMEN  
ISC2  
102, 134, 154  
103, 135, 155  
221  
30,44,85  
30,43,84  
43,51,207  
100  
102  
102  
32,70,105,156  
128  
131  
133  
133  
133  
133  
133  
133  
149  
152  
134  
134  
151  
151  
53  
SPMCR  
EMCUCR  
MCUCR  
MCUCSR  
TCCR0  
TCNT0  
OCR0  
RWWSRE  
SRL0  
BLBSET  
SRW01  
ISC11  
SRL1  
SE  
SRE  
SRW10  
SM1  
ISC00  
PORF  
CS00  
JTD  
SM2  
JTRF  
WDRF  
WGM01  
FOC0  
WGM00  
COM01  
COM00  
Timer/Counter0 (8 Bits)  
Timer/Counter0 Output Compare Register  
0x30 (0x50)  
0x2F (0x4F)  
0x2E (0x4E)  
0x2D (0x4D)  
0x2C (0x4C)  
0x2B (0x4B)  
0x2A (0x4A)  
0x29 (0x49)  
0x28 (0x48)  
0x27 (0x47)  
0x26 (0x46)  
0x25 (0x45)  
0x24 (0x44)  
0x23 (0x43)  
0x22 (0x42)  
0x21 (0x41)  
SFIOR  
TCCR1A  
TCCR1B  
TCNT1H  
TCNT1L  
OCR1AH  
OCR1AL  
OCR1BH  
OCR1BL  
TCCR2  
ASSR  
TSM  
COM1A1  
ICNC1  
XMBK  
COM1A0  
ICES1  
XMM2  
COM1B1  
XMM1  
COM1B0  
WGM13  
XMM0  
FOC1A  
WGM12  
PUD  
FOC1B  
CS12  
PSR2  
WGM11  
CS11  
PSR310  
WGM10  
CS10  
Timer/Counter1 – Counter Register High Byte  
Timer/Counter1 – Counter Register Low Byte  
Timer/Counter1 – Output Compare Register A High Byte  
Timer/Counter1 – Output Compare Register A Low Byte  
Timer/Counter1 – Output Compare Register B High Byte  
Timer/Counter1 – Output Compare Register B Low Byte  
FOC2  
WGM20  
COM21  
COM20  
WGM21  
AS2  
CS22  
CS21  
CS20  
TCN2UB  
OCR2UB  
TCR2UB  
ICR1H  
ICR1L  
Timer/Counter1 – Input Capture Register High Byte  
Timer/Counter1 – Input Capture Register Low Byte  
Timer/Counter2 (8 Bits)  
TCNT2  
OCR2  
Timer/Counter2 Output Compare Register  
WDTCR  
UBRR0H  
UCSR0C  
EEARH  
EEARL  
EEDR  
WDCE  
WDE  
WDP2  
WDP1  
WDP0  
URSEL0  
URSEL0  
UMSEL0  
UPM01  
UPM00  
UBRR0[11:8]  
190  
189  
20  
0x20(2) (0x40)(2)  
USBS0  
UCSZ01  
UCSZ00  
UCPOL0  
EEAR8  
0x1F (0x3F)  
0x1E (0x3E)  
0x1D (0x3D)  
0x1C (0x3C)  
0x1B (0x3B)  
0x1A (0x3A)  
0x19 (0x39)  
0x18 (0x38)  
0x17 (0x37)  
0x16 (0x36)  
0x15 (0x35)  
0x14 (0x34)  
0x13 (0x33)  
0x12 (0x32)  
0x11 (0x31)  
0x10 (0x30)  
0x0F (0x2F)  
0x0E (0x2E)  
0x0D (0x2D)  
0x0C (0x2C)  
0x0B (0x2B)  
0x0A (0x2A)  
0x09 (0x29)  
0x08 (0x28)  
0x07 (0x27)  
0x06 (0x26)  
0x05 (0x25)  
EEPROM Address Register Low Byte  
EEPROM Data Register  
20  
21  
EECR  
EERIE  
PORTA3  
DDA3  
EEMWE  
PORTA2  
DDA2  
EEWE  
PORTA1  
DDA1  
EERE  
PORTA0  
DDA0  
21  
PORTA  
DDRA  
PORTA7  
DDA7  
PORTA6  
DDA6  
PORTA5  
DDA5  
PORTA4  
DDA4  
82  
82  
PINA  
PINA7  
PORTB7  
DDB7  
PINA6  
PORTB6  
DDB6  
PINA5  
PORTB5  
DDB5  
PINA4  
PORTB4  
DDB4  
PINA3  
PINA2  
PINA1  
PINA0  
82  
PORTB  
DDRB  
PORTB3  
DDB3  
PORTB2  
DDB2  
PORTB1  
DDB1  
PORTB0  
DDB0  
82  
82  
PINB  
PINB7  
PORTC7  
DDC7  
PINB6  
PORTC6  
DDC6  
PINB5  
PORTC5  
DDC5  
PINB4  
PORTC4  
DDC4  
PINB3  
PINB2  
PINB1  
PINB0  
82  
PORTC  
DDRC  
PORTC3  
DDC3  
PORTC2  
DDC2  
PORTC1  
DDC1  
PORTC0  
DDC0  
82  
82  
PINC  
PINC7  
PORTD7  
DDD7  
PINC6  
PORTD6  
DDD6  
PINC5  
PORTD5  
DDD5  
PINC4  
PORTD4  
DDD4  
PINC3  
PINC2  
PINC1  
PINC0  
PORTD0  
DDD0  
83  
PORTD  
DDRD  
PORTD3  
DDD3  
PORTD2  
DDD2  
PORTD1  
DDD1  
83  
83  
PIND  
PIND7  
PIND6  
PIND5  
PIND4  
PIND3  
PIND2  
PIND1  
PIND0  
83  
SPDR  
SPI Data Register  
164  
164  
162  
186  
186  
187  
190  
195  
83  
SPSR  
SPIF  
SPIE  
WCOL  
SPE  
SPI2X  
SPR0  
SPCR  
DORD  
MSTR  
CPOL  
CPHA  
SPR1  
UDR0  
USART0 I/O Data Register  
UCSR0A  
UCSR0B  
UBRR0L  
ACSR  
RXC0  
TXC0  
UDRE0  
UDRIE0  
FE0  
DOR0  
UPE0  
U2X0  
MPCM0  
TXB80  
RXCIE0  
TXCIE0  
RXEN0  
TXEN0  
UCSZ02  
RXB80  
USART0 Baud Rate Register Low Byte  
ACD  
ACBG  
ACO  
ACI  
ACIE  
ACIC  
PORTE2  
DDE2  
ACIS1  
PORTE1  
DDE1  
ACIS0  
PORTE0  
DDE0  
PORTE  
DDRE  
83  
PINE  
PINE2  
CAL2  
PINE1  
CAL1  
PINE0  
CAL0  
83  
OSCCAL  
OCDR  
CAL6  
CAL5  
CAL4  
CAL3  
39  
0x04(1) (0x24)(1)  
On-chip Debug Register  
202  
186  
186  
0x03 (0x23)  
0x02 (0x22)  
UDR1  
USART1 I/O Data Register  
UCSR1A  
RXC1  
TXC1  
UDRE1  
FE1  
DOR1  
UPE1  
U2X1  
MPCM1  
305  
2513K–AVR–07/09  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Page  
0x01 (0x21)  
0x00 (0x20)  
UCSR1B  
UBRR1L  
RXCIE1  
TXCIE1  
UDRIE1  
RXEN1  
TXEN1  
UCSZ12  
RXB81  
TXB81  
187  
190  
USART1 Baud Rate Register Low Byte  
Notes: 1. When the OCDEN Fuse is unprogrammed, the OSCCAL Register is always accessed on this address. Refer to the debug-  
ger specific documentation for details on how to use the OCDR Register.  
2. Refer to the USART description for details on how to access UBRRH and UCSRC.  
3. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses  
should never be written.  
4. Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on  
all bits in the I/O Register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions  
work with registers 0x00 to 0x1F only.  
306  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Instruction Set Summary  
Mnemonics  
Flags  
#Clocks  
Operands  
Description  
Operation  
ARITHMETIC AND LOGIC INSTRUCTIONS  
ADD  
Rd, Rr  
Rd, Rr  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd  
Add two Registers  
Rd Rd + Rr  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,N,V  
1
1
2
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
ADC  
Add with Carry two Registers  
Add Immediate to Word  
Subtract two Registers  
Subtract Constant from Register  
Subtract with Carry two Registers  
Subtract with Carry Constant from Reg.  
Subtract Immediate from Word  
Logical AND Registers  
Logical AND Register and Constant  
Logical OR Registers  
Rd Rd + Rr + C  
Rdh:Rdl Rdh:Rdl + K  
Rd Rd - Rr  
ADIW  
SUB  
SUBI  
SBC  
Rd Rd - K  
Rd Rd - Rr - C  
Rd Rd - K - C  
Rdh:Rdl Rdh:Rdl - K  
Rd Rd Rr  
SBCI  
SBIW  
AND  
ANDI  
OR  
Rd Rd K  
Z,N,V  
Rd Rd v Rr  
Z,N,V  
ORI  
Logical OR Register and Constant  
Exclusive OR Registers  
One’s Complement  
Rd Rd v K  
Z,N,V  
EOR  
COM  
NEG  
SBR  
Rd Rd Rr  
Z,N,V  
Rd 0xFF Rd  
Rd 0x00 Rd  
Rd Rd v K  
Z,C,N,V  
Z,C,N,V,H  
Z,N,V  
Rd  
Two’s Complement  
Rd,K  
Rd,K  
Rd  
Set Bit(s) in Register  
CBR  
Clear Bit(s) in Register  
Increment  
Rd Rd (0xFF - K)  
Rd Rd + 1  
Z,N,V  
INC  
Z,N,V  
DEC  
Rd  
Decrement  
Rd Rd 1  
Z,N,V  
TST  
Rd  
Test for Zero or Minus  
Clear Register  
Rd Rd Rd  
Z,N,V  
CLR  
Rd  
Rd Rd Rd  
Rd 0xFF  
Z,N,V  
SER  
Rd  
Set Register  
None  
MUL  
Rd, Rr  
Rd, Rr  
Rd, Rr  
Rd, Rr  
Rd, Rr  
Rd, Rr  
Multiply Unsigned  
R1:R0 Rd x Rr  
R1:R0 Rd x Rr  
R1:R0 Rd x Rr  
R1:R0 (Rd x Rr) << 1  
R1:R0 (Rd x Rr) << 1  
R1:R0 (Rd x Rr) << 1  
Z,C  
MULS  
MULSU  
FMUL  
FMULS  
FMULSU  
Multiply Signed  
Z,C  
Multiply Signed with Unsigned  
Fractional Multiply Unsigned  
Fractional Multiply Signed  
Fractional Multiply Signed with Unsigned  
Z,C  
Z,C  
Z,C  
Z,C  
BRANCH INSTRUCTIONS  
RJMP  
IJMP  
k
Relative Jump  
PC PC + k + 1  
None  
None  
None  
None  
None  
None  
None  
I
2
2
Indirect Jump to (Z)  
PC Z  
JMP  
k
k
Direct Jump  
PC k  
3
RCALL  
ICALL  
CALL  
RET  
Relative Subroutine Call  
Indirect Call to (Z)  
PC PC + k + 1  
3
PC Z  
3
k
Direct Subroutine Call  
Subroutine Return  
PC k  
4
PC STACK  
4
RETI  
Interrupt Return  
PC STACK  
4
CPSE  
CP  
Rd,Rr  
Compare, Skip if Equal  
Compare  
if (Rd = Rr) PC PC + 2 or 3  
Rd Rr  
None  
Z, N,V,C,H  
Z, N,V,C,H  
Z, N,V,C,H  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1/2/3  
1
Rd,Rr  
CPC  
Rd,Rr  
Compare with Carry  
Rd Rr C  
1
CPI  
Rd,K  
Compare Register with Immediate  
Skip if Bit in Register Cleared  
Skip if Bit in Register is Set  
Skip if Bit in I/O Register Cleared  
Skip if Bit in I/O Register is Set  
Branch if Status Flag Set  
Branch if Status Flag Cleared  
Branch if Equal  
Rd K  
1
SBRC  
SBRS  
SBIC  
SBIS  
Rr, b  
if (Rr(b)=0) PC PC + 2 or 3  
if (Rr(b)=1) PC PC + 2 or 3  
if (P(b)=0) PC PC + 2 or 3  
if (P(b)=1) PC PC + 2 or 3  
if (SREG(s) = 1) then PCPC+k + 1  
if (SREG(s) = 0) then PCPC+k + 1  
if (Z = 1) then PC PC + k + 1  
if (Z = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (N = 1) then PC PC + k + 1  
if (N = 0) then PC PC + k + 1  
if (N V= 0) then PC PC + k + 1  
if (N V= 1) then PC PC + k + 1  
if (H = 1) then PC PC + k + 1  
if (H = 0) then PC PC + k + 1  
if (T = 1) then PC PC + k + 1  
if (T = 0) then PC PC + k + 1  
if (V = 1) then PC PC + k + 1  
if (V = 0) then PC PC + k + 1  
1/2/3  
1/2/3  
1/2/3  
1/2/3  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
Rr, b  
P, b  
P, b  
s, k  
s, k  
k
BRBS  
BRBC  
BREQ  
BRNE  
BRCS  
BRCC  
BRSH  
BRLO  
BRMI  
BRPL  
BRGE  
BRLT  
BRHS  
BRHC  
BRTS  
BRTC  
BRVS  
BRVC  
k
Branch if Not Equal  
k
Branch if Carry Set  
k
Branch if Carry Cleared  
Branch if Same or Higher  
Branch if Lower  
k
k
k
Branch if Minus  
k
Branch if Plus  
k
Branch if Greater or Equal, Signed  
Branch if Less Than Zero, Signed  
Branch if Half Carry Flag Set  
Branch if Half Carry Flag Cleared  
Branch if T Flag Set  
k
k
k
k
k
Branch if T Flag Cleared  
Branch if Overflow Flag is Set  
Branch if Overflow Flag is Cleared  
k
k
307  
2513K–AVR–07/09  
Mnemonics  
Flags  
None  
#Clocks  
Operands  
Description  
Operation  
BRIE  
BRID  
k
k
Branch if Interrupt Enabled  
Branch if Interrupt Disabled  
if ( I = 1) then PC PC + k + 1  
if ( I = 0) then PC PC + k + 1  
1/2  
1/2  
None  
DATA TRANSFER INSTRUCTIONS  
MOV  
MOVW  
LDI  
LD  
Rd, Rr  
Rd, Rr  
Rd, K  
Move Between Registers  
Copy Register Word  
Rd Rr  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
-
Rd+1:Rd Rr+1:Rr  
Load Immediate  
Rd K  
Rd, X  
Load Indirect  
Rd (X)  
LD  
Rd, X+  
Rd, - X  
Rd, Y  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect  
Rd (X), X X + 1  
X X - 1, Rd (X)  
Rd (Y)  
LD  
LD  
LD  
Rd, Y+  
Rd, - Y  
Rd,Y+q  
Rd, Z  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Indirect  
Rd (Y), Y Y + 1  
Y Y - 1, Rd (Y)  
Rd (Y + q)  
Rd (Z)  
LD  
LDD  
LD  
LD  
Rd, Z+  
Rd, -Z  
Rd, Z+q  
Rd, k  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Direct from SRAM  
Store Indirect  
Rd (Z), Z Z+1  
Z Z - 1, Rd (Z)  
Rd (Z + q)  
Rd (k)  
LD  
LDD  
LDS  
ST  
X, Rr  
(X) Rr  
ST  
X+, Rr  
- X, Rr  
Y, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect  
(X) Rr, X X + 1  
X X - 1, (X) Rr  
(Y) Rr  
ST  
ST  
ST  
Y+, Rr  
- Y, Rr  
Y+q,Rr  
Z, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Indirect  
(Y) Rr, Y Y + 1  
Y Y - 1, (Y) Rr  
(Y + q) Rr  
ST  
STD  
ST  
(Z) Rr  
ST  
Z+, Rr  
-Z, Rr  
Z+q,Rr  
k, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Direct to SRAM  
Load Program Memory  
Load Program Memory  
Load Program Memory and Post-Inc  
Store Program Memory  
In Port  
(Z) Rr, Z Z + 1  
Z Z - 1, (Z) Rr  
(Z + q) Rr  
ST  
STD  
STS  
LPM  
LPM  
LPM  
SPM  
IN  
(k) Rr  
R0 (Z)  
Rd, Z  
Rd (Z)  
Rd, Z+  
Rd (Z), Z Z+1  
(Z) R1:R0  
Rd, P  
P, Rr  
Rr  
Rd P  
1
1
2
2
OUT  
PUSH  
POP  
Out Port  
P Rr  
Push Register on Stack  
Pop Register from Stack  
STACK Rr  
Rd STACK  
Rd  
BIT AND BIT-TEST INSTRUCTIONS  
SBI  
P,b  
P,b  
Rd  
Rd  
Rd  
Rd  
Rd  
Rd  
s
Set Bit in I/O Register  
Clear Bit in I/O Register  
Logical Shift Left  
I/O(P,b) 1  
None  
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
CBI  
I/O(P,b) 0  
None  
LSL  
Rd(n+1) Rd(n), Rd(0) 0  
Z,C,N,V  
LSR  
ROL  
ROR  
ASR  
SWAP  
BSET  
BCLR  
BST  
BLD  
SEC  
CLC  
SEN  
CLN  
SEZ  
CLZ  
SEI  
Logical Shift Right  
Rd(n) Rd(n+1), Rd(7) 0  
Z,C,N,V  
Rotate Left Through Carry  
Rotate Right Through Carry  
Arithmetic Shift Right  
Swap Nibbles  
Rd(0)C,Rd(n+1)Rd(n),CRd(7)  
Z,C,N,V  
Rd(7)C,Rd(n)Rd(n+1),CRd(0)  
Z,C,N,V  
Rd(n) Rd(n+1), n=0..6  
Z,C,N,V  
Rd(3..0)Rd(7..4),Rd(7..4)Rd(3..0)  
None  
Flag Set  
SREG(s) 1  
SREG(s) 0  
T Rr(b)  
Rd(b) T  
C 1  
SREG(s)  
s
Flag Clear  
SREG(s)  
Rr, b  
Rd, b  
Bit Store from Register to T  
Bit load from T to Register  
Set Carry  
T
None  
C
C
N
N
Z
Clear Carry  
C 0  
Set Negative Flag  
N 1  
Clear Negative Flag  
Set Zero Flag  
N 0  
Z 1  
Clear Zero Flag  
Z 0  
Z
Global Interrupt Enable  
Global Interrupt Disable  
Set Signed Test Flag  
Clear Signed Test Flag  
Set Twos Complement Overflow.  
Clear Twos Complement Overflow  
Set T in SREG  
I 1  
I
CLI  
I 0  
I
SES  
CLS  
SEV  
CLV  
SET  
CLT  
SEH  
S 1  
S
S
V
V
T
S 0  
V 1  
V 0  
T 1  
Clear T in SREG  
T 0  
T
Set Half Carry Flag in SREG  
H 1  
H
308  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Mnemonics  
Flags  
#Clocks  
Operands  
Description  
Operation  
Clear Half Carry Flag in SREG  
CLH  
H 0  
H
1
MCU CONTROL INSTRUCTIONS  
NOP  
No Operation  
Sleep  
None  
None  
None  
None  
1
1
SLEEP  
WDR  
(see specific descr. for Sleep function)  
(see specific descr. for WDR/Timer)  
For On-chip Debug Only  
Watchdog Reset  
Break  
1
BREAK  
N/A  
309  
2513K–AVR–07/09  
Ordering Information  
Speed (MHz)  
Power Supply  
Ordering Code  
Package(1)  
Operation Range  
ATmega162V-8AI  
ATmega162V-8PI  
ATmega162V-8MI  
ATmega162V-8AU(2)  
ATmega162V-8PU(2)  
ATmega162V-8MU(2)  
44A  
40P6  
44M1  
44A  
Industrial  
(-40°C to 85°C)  
8(3)  
1.8 - 5.5V  
2.7 - 5.5V  
40P6  
44M1  
ATmega162-16AI  
ATmega162-16PI  
ATmega162-16MI  
ATmega162-16AU(2)  
ATmega162-16PU(2)  
ATmega162-16MU(2)  
44A  
40P6  
44M1  
44A  
Industrial  
(-40°C to 85°C)  
16(4)  
40P6  
44M1  
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information  
and minimum quantities.  
2. Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS direc-  
tive).Also Halide free and fully Green.  
3. See Figure 113 on page 266.  
4. See Figure 114 on page 266.  
Package Type  
44A  
44-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)  
40-pin, 0.600” Wide, Plastic Dual Inline Package (PDIP)  
40P6  
44M1  
44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Micro Lead Frame Package (QFN/MLF)  
310  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Packaging Information  
44A  
PIN 1  
B
PIN 1 IDENTIFIER  
E1  
E
e
D1  
D
C
0˚~7˚  
A2  
A
A1  
L
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
1.20  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.05  
0.95  
11.75  
9.90  
11.75  
9.90  
0.30  
0.09  
0.45  
0.15  
1.00  
12.00  
10.00  
12.00  
10.00  
1.05  
12.25  
D1  
E
10.10 Note 2  
12.25  
Notes:  
1. This package conforms to JEDEC reference MS-026, Variation ACB.  
2. Dimensions D1 and E1 do not include mold protrusion. Allowable  
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum  
plastic body size dimensions including mold mismatch.  
E1  
B
10.10 Note 2  
0.45  
C
0.20  
3. Lead coplanarity is 0.10 mm maximum.  
L
0.75  
e
0.80 TYP  
10/5/2001  
TITLE  
DRAWING NO. REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,  
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)  
44A  
B
R
311  
2513K–AVR–07/09  
40P6  
D
PIN  
1
E1  
A
SEATING PLANE  
A1  
L
B
B1  
e
E
COMMON DIMENSIONS  
(Unit of Measure = mm)  
0º ~ 15º REF  
C
MIN  
MAX  
4.826  
NOM  
NOTE  
SYMBOL  
A
eB  
A1  
D
0.381  
52.070  
15.240  
13.462  
0.356  
1.041  
3.048  
0.203  
15.494  
52.578 Note 2  
15.875  
E
E1  
B
13.970 Note 2  
0.559  
B1  
L
1.651  
Notes:  
1. This package conforms to JEDEC reference MS-011, Variation AC.  
2. Dimensions D and E1 do not include mold Flash or Protrusion.  
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").  
3.556  
C
0.381  
eB  
e
17.526  
2.540 TYP  
09/28/01  
DRAWING NO. REV.  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual  
Inline Package (PDIP)  
40P6  
B
R
312  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
44M1  
D
Marked Pin# 1 ID  
E
SEATING PLANE  
A1  
TOP VIEW  
A3  
A
K
L
Pin #1 Corner  
SIDE VIEW  
D2  
Pin #1  
Triangle  
Option A  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
1
2
3
MIN  
0.80  
MAX  
1.00  
0.05  
NOM  
0.90  
NOTE  
SYMBOL  
A
E2  
Option B  
Option C  
A1  
A3  
b
0.02  
Pin #1  
Chamfer  
(C 0.30)  
0.20 REF  
0.23  
0.18  
6.90  
5.00  
6.90  
0.30  
7.10  
5.40  
7.10  
D
7.00  
D2  
E
5.20  
K
Pin #1  
Notch  
(0.20 R)  
e
b
7.00  
E2  
e
5.00  
5.20  
0.50 BSC  
0.64  
5.40  
BOTTOM VIEW  
L
0.59  
0.20  
0.69  
0.41  
Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3.  
K
0.26  
9/26/08  
GPC  
ZWS  
DRAWING NO.  
TITLE  
REV.  
44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead  
Pitch 0.50 mm, 5.20 mm Exposed Pad,Thermally  
Enhanced Plastic Very Thin Quad Flat No  
Lead Package (VQFN)  
Package Drawing Contact:  
packagedrawings@atmel.com  
44M1  
H
313  
2513K–AVR–07/09  
Errata  
The revision letter in this section refers to the revision of the ATmega162 device.  
ATmega162, all  
rev.  
There are no errata for this revision of ATmega162. However, a proposal for solving problems  
regarding the JTAG instruction IDCODE is presented below.  
IDCODE masks data from TDI input  
Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request  
Interrupts may be lost when writing the timer register in asynchronous timer  
1. IDCODE masks data from TDI input  
The public but optional JTAG instruction IDCODE is not implemented correctly according to  
IEEE1149.1; a logic one is scanned into the shift register instead of the TDI input while shift-  
ing the Device ID Register. Hence, captured data from the preceding devices in the  
boundary scan chain are lost and replaced by all-ones, and data to succeeding devices are  
replaced by all-ones during Update-DR.  
If ATmega162 is the only device in the scan chain, the problem is not visible.  
Problem Fix / Workaround  
Select the Device ID Register of the ATmega162 (Either by issuing the IDCODE instruction  
or by entering the Test-Logic-Reset state of the TAP controller) to read out the contents of  
its Device ID Register and possibly data from succeeding devices of the scan chain. Note  
that data to succeeding devices cannot be entered during this scan, but data to preceding  
devices can. Issue the BYPASS instruction to the ATmega162 to select its Bypass Register  
while reading the Device ID Registers of preceding devices of the boundary scan chain.  
Never read data from succeeding devices in the boundary scan chain or upload data to the  
succeeding devices while the Device ID Register is selected for the ATmega162. Note that  
the IDCODE instruction is the default instruction selected by the Test-Logic-Reset state of  
the TAP-controller.  
Alternative Problem Fix / Workaround  
If the Device IDs of all devices in the boundary scan chain must be captured simultaneously  
(for instance if blind interrogation is used), the boundary scan chain can be connected in  
such way that the ATmega162 is the first device in the chain. Update-DR will still not work  
for the succeeding devices in the boundary scan chain as long as IDCODE is present in the  
JTAG Instruction Register, but the Device ID registered cannot be uploaded in any case.  
2. Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt  
request.  
Reading EEPROM by using the ST or STS command to set the EERE bit in the EECR reg-  
ister triggers an unexpected EEPROM interrupt request.  
Problem Fix / Workaround  
Always use OUT or SBI to set EERE in EECR.  
3. Interrupts may be lost when writing the timer register in asynchronous timer  
The interrupt will be lost if a timer register that is synchronous timer clock is written when the  
asynchronous Timer/Counter register (TCNTx) is 0x00.  
Problem Fix / Workaround  
Always check that the asynchronous Timer/Counter register neither have the value 0xFF nor  
0x00 before writing to the asynchronous Timer Control Register (TCCRx), asynchronous  
Timer Counter Register (TCNTx), or asynchronous Output Compare Register (OCRx).  
314  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Datasheet  
Revision  
History  
Please note that the referring page numbers in this section are referred to this document. The  
referring revision in this section are referring to the document revision.  
Changes from Rev. 1. Updated “Errata” on page 314.  
2513J-08/07 to  
2. Updated the last page with Atmel’s new adresses.  
Rev. 2513K-07/09  
Changes from Rev. 1. Updated “Features” on page 1.  
2513I-04/07 to Rev.  
2. Added “Data Retention” on page 7.  
2513J-08/07  
3. Updated “Errata” on page 314.  
4. Updated “Version” on page 205.  
5. Updated “C Code Example(1)” on page 172.  
6. Updated Figure 18 on page 35.  
7. Updated “Clock Distribution” on page 35.  
8. Updated “SPI Serial Programming Algorithm” on page 246.  
9. Updated “Slave Mode” on page 162.  
Changes from Rev. 1. Updated “Using all 64KB Locations of External Memory” on page 34.  
2513H-04/06 to  
Rev. 2513I-04/07  
2. Updated “Bit 6 – ACBG: Analog Comparator Bandgap Select” on page 195.  
3. Updated VOH conditions in“DC Characteristics” on page 264.  
Changes from Rev. 1. Added “Resources” on page 7.  
2513G-03/05 to  
2. Updated “Calibrated Internal RC Oscillator” on page 38.  
Rev. 2513H-04/06  
3. Updated note for Table 19 on page 50.  
4. Updated “Serial Peripheral Interface – SPI” on page 157.  
Changes from Rev. 1. MLF-package alternative changed to “Quad Flat No-Lead/Micro Lead Frame Package  
QFN/MLF”.  
2513F-09/03 to  
Rev. 2513G-03/05  
2. Updated “Electrical Characteristics” on page 264  
3. Updated “Ordering Information” on page 310  
Changes from Rev. 1. Removed “Preliminary” from the datasheet.  
2513D-04/03 to  
2. Added note on Figure 1 on page 2.  
Rev. 2513E-09/03  
315  
2513K–AVR–07/09  
3. Renamed and updated “On-chip Debug System” to “JTAG Interface and On-chip  
Debug System” on page 46.  
4. Updated Table 18 on page 48 and Table 19 on page 50.  
5. Updated “Test Access Port – TAP” on page 197 regarding JTAGEN.  
6. Updated description for the JTD bit on page 207.  
7. Added note on JTAGEN in Table 99 on page 233.  
8. Updated Absolute Maximum Ratings* and DC Characteristics in “Electrical Character-  
istics” on page 264.  
9. Added a proposal for solving problems regarding the JTAG instruction IDCODE in  
“Errata” on page 314.  
Changes from Rev. 1. Updated the “Ordering Information” on page 310 and “Packaging Information” on  
page 311.  
2513C-09/02 to  
Rev. 2513D-04/03  
2. Updated “Features” on page 1.  
3. Added characterization plots under “ATmega162 Typical Characteristics” on page  
275.  
4. Added Chip Erase as a first step under “Programming the Flash” on page 260 and  
“Programming the EEPROM” on page 262.  
5. Changed CAL7, the highest bit in the OSCCAL Register, to a reserved bit on page 39  
and in “Register Summary” on page 304.  
6. Changed CPCE to CLKPCE on page 41.  
7. Corrected code examples on page 55.  
8. Corrected OCn waveforms in Figure 52 on page 120.  
9. Various minor Timer1 corrections.  
10. Added note under “Filling the Temporary Buffer (Page Loading)” on page 224 about  
writing to the EEPROM during an SPM Page Load.  
11. Added section “EEPROM Write During Power-down Sleep Mode” on page 24.  
12. Added information about PWM symmetry for Timer0 on page 98 and Timer2 on page  
147.  
13. Updated Table 18 on page 48, Table 20 on page 50, Table 36 on page 77, Table 83 on  
page 205, Table 109 on page 247, Table 112 on page 267, and Table 113 on page 268.  
14. Added Figures for “Absolute Maximum Frequency as a function of VCC, ATmega162”  
on page 266.  
316  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
15. Updated Figure 29 on page 64, Figure 32 on page 68, and Figure 88 on page 210.  
16. Removed Table 114, “External RC Oscillator, Typical Frequencies(1),” on page 265.  
17. Updated “Electrical Characteristics” on page 264.  
Changes from Rev. 1. Changed the Endurance on the Flash to 10,000 Write/Erase Cycles.  
2513B-09/02 to  
Rev. 2513C-09/02  
Changes from Rev. 1. Added information for ATmega162U.  
2513A-05/02 to  
Rev. 2513B-09/02  
Information about ATmega162U included in “Features” on page 1, Table 19, “BODLEVEL  
Fuse Coding,” on page 50, and “Ordering Information” on page 310.  
317  
2513K–AVR–07/09  
318  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Table of Contents  
Features 1  
Pin Configurations 2  
Disclaimer 2  
Overview 3  
Block Diagram 3  
ATmega161 and ATmega162 Compatibility 4  
Pin Descriptions 5  
Resources 7  
Data Retention 7  
About Code Examples 8  
AVR CPU Core 9  
Introduction 9  
Architectural Overview 9  
ALU – Arithmetic Logic Unit 10  
Status Register 10  
General Purpose Register File 12  
Stack Pointer 13  
Instruction Execution Timing 14  
Reset and Interrupt Handling 14  
AVR ATmega162 Memories 17  
In-System Reprogrammable Flash Program Memory 17  
SRAM Data Memory 18  
EEPROM Data Memory 19  
I/O Memory 25  
External Memory Interface 26  
XMEM Register Description 30  
i
2513K–AVR–07/09  
System Clock and Clock Options 35  
Clock Systems and their Distribution 35  
Clock Sources 36  
Default Clock Source 36  
Crystal Oscillator 36  
Low-frequency Crystal Oscillator 38  
Calibrated Internal RC Oscillator 38  
External Clock 40  
Clock output buffer 40  
Timer/Counter Oscillator 41  
System Clock Prescaler 41  
Power Management and Sleep Modes 43  
Idle Mode 44  
Power-down Mode 44  
Power-save Mode 45  
Standby Mode 45  
Extended Standby Mode 45  
Minimizing Power Consumption 46  
System Control and Reset 47  
Internal Voltage Reference 52  
Watchdog Timer 52  
Timed Sequences for Changing the Configuration of the Watchdog Timer 56  
Interrupts 57  
Interrupt Vectors in ATmega162 57  
I/O-Ports 63  
Introduction 63  
Ports as General Digital I/O 63  
Alternate Port Functions 68  
Register Description for I/O-Ports 82  
External Interrupts 84  
8-bit Timer/Counter0 with PWM 89  
Overview 89  
Timer/Counter Clock Sources 90  
Counter Unit 91  
Output Compare Unit 91  
Compare Match Output Unit 93  
Modes of Operation 94  
Timer/Counter Timing Diagrams 98  
8-bit Timer/Counter Register Description 100  
ii  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Timer/Counter0, Timer/Counter1, and Timer/Counter3 Prescalers 104  
16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3) 106  
Restriction in ATmega161 Compatibility Mode 106  
Overview 106  
Accessing 16-bit Registers 109  
Timer/Counter Clock Sources 112  
Counter Unit 112  
Input Capture Unit 113  
Output Compare Units 114  
Compare Match Output Unit 117  
Modes of Operation 118  
Timer/Counter Timing Diagrams 126  
16-bit Timer/Counter Register Description 128  
8-bit Timer/Counter2 with PWM and Asynchronous operation 138  
Overview 138  
Timer/Counter Clock Sources 139  
Counter Unit 140  
Output Compare Unit 140  
Compare Match Output Unit 142  
Modes of Operation 143  
Timer/Counter Timing Diagrams 147  
8-bit Timer/Counter Register Description 149  
Asynchronous operation of the Timer/Counter 152  
Timer/Counter Prescaler 156  
Serial Peripheral Interface – SPI 157  
SS Pin Functionality 162  
Data Modes 165  
USART 166  
Dual USART 166  
Clock Generation 168  
Frame Formats 171  
USART Initialization 172  
Data Transmission – The USART Transmitter 173  
Data Reception – The USART Receiver 175  
Asynchronous Data Reception 179  
Multi-processor Communication Mode 182  
Accessing UBRRH/  
UCSRC Registers 184  
USART Register Description 186  
Examples of Baud Rate Setting 191  
iii  
2513K–AVR–07/09  
Analog Comparator 195  
JTAG Interface and On-chip Debug System 197  
Features 197  
Overview 197  
Test Access Port – TAP 197  
TAP Controller 200  
Using the Boundary-scan Chain 200  
Using the On-chip Debug system 201  
On-chip debug specific JTAG instructions 202  
On-chip Debug Related Register in I/O Memory 202  
Using the JTAG Programming Capabilities 202  
Bibliography 203  
IEEE 1149.1 (JTAG) Boundary-scan 204  
Features 204  
System Overview 204  
Data Registers 205  
Boundary-scan Specific JTAG Instructions 206  
Boundary-scan Chain 208  
ATmega162 Boundary-scan Order 213  
Boundary-scan Description Language Files 216  
Boot Loader Support – Read-While-Write Self-programming 217  
Features 217  
Application and Boot Loader Flash Sections 217  
Read-While-Write and No Read-While-Write Flash Sections 217  
Boot Loader Lock Bits 219  
Entering the Boot Loader Program 221  
Addressing the Flash During Self-programming 223  
Self-programming the Flash 224  
Memory Programming 231  
Program And Data Memory Lock Bits 231  
Fuse Bits 232  
Signature Bytes 234  
Calibration Byte 234  
Parallel Programming Parameters, Pin Mapping, and Commands 234  
Parallel Programming 236  
Serial Downloading 245  
SPI Serial Programming Pin Mapping 245  
Programming via the JTAG Interface 250  
iv  
ATmega162/V  
2513K–AVR–07/09  
ATmega162/V  
Electrical Characteristics 264  
Absolute Maximum Ratings* 264  
DC Characteristics 264  
External Clock Drive Waveforms 267  
External Clock Drive 267  
SPI Timing Characteristics 268  
External Data Memory Timing 270  
ATmega162 Typical Characteristics 275  
Register Summary 304  
Instruction Set Summary 307  
Ordering Information 310  
Packaging Information 311  
44A 311  
40P6 312  
44M1 313  
Errata 314  
ATmega162, all rev. 314  
Datasheet Revision History 315  
Changes from Rev. 2513I-04/07 to Rev. 2513J-08/07 315  
Changes from Rev. 2513H-04/06 to Rev. 2513I-04/07 315  
Changes from Rev. 2513G-03/05 to Rev. 2513H-04/06 315  
Changes from Rev. 2513F-09/03 to Rev. 2513G-03/05 315  
Changes from Rev. 2513D-04/03 to Rev. 2513E-09/03 315  
Changes from Rev. 2513C-09/02 to Rev. 2513D-04/03 316  
Changes from Rev. 2513B-09/02 to Rev. 2513C-09/02 317  
Changes from Rev. 2513A-05/02 to Rev. 2513B-09/02 317  
v
2513K–AVR–07/09  
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2513K–AVR–07/09  

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