TST0912-TJS [ATMEL]

Narrow Band Medium Power Amplifier, 880MHz Min, 915MHz Max, 1 Func, BIPolar, PSSOP-16;
TST0912-TJS
型号: TST0912-TJS
厂家: ATMEL    ATMEL
描述:

Narrow Band Medium Power Amplifier, 880MHz Min, 915MHz Max, 1 Func, BIPolar, PSSOP-16

ATM 异步传输模式 射频 微波
文件: 总6页 (文件大小:86K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TST0912  
SiGe Power Amplifier for GSM 900  
Description  
The TST0912 is a monolithic integrated power amplifier neglectable leakage current in  
IC. The device is manufactured using Atmel Wireless & power-down mode, the TST0912  
Microcontrollers’  
Silicon-Germanium  
(SiGe) needs few external components and reduces system costs.  
technology and has been designed for use in GSM  
900-MHz mobile phones.  
Electrostatic sensitive device.  
Observe precautions for handling.  
With a single supply voltage operation of 3 V and a  
FD e3a5tudBrmesoutput power  
D Power-ramp control  
D Power-added efficiency (PAE) 50%  
D Simple input and output matching  
D Simple output matching for maximum flexibility  
D SMD package (PSSOP16 with heat slug)  
D Single supply operation at 3 V  
no negative voltage necessary  
D Current consumption in power-down mode 10 µA,  
no external power-supply switch required  
Block Diagram  
VCC1  
VCC2  
GND  
5
1
2
3
4
10 16  
11  
12  
13  
14  
15  
RFin  
RFout/VCC3  
(900 MHz)  
6
Match  
Match  
Match  
(900 MHz)  
8
9
7
VCTL  
VCC,CTL  
GND  
Harmonic tuning  
Control  
14744  
Figure 1. Block diagram  
Ordering Information  
Extended Type Number  
TST0912-TJS  
Package  
Remarks  
PSSO16  
PSSO16  
Tube  
Taped and reeled  
TST0912-TJQ  
Rev. A2, 28-Sep-00  
1 (6)  
Preliminary Information  
TST0912  
Pin Description  
Pin  
Symbol  
Function  
Supply voltage 2  
1
V
CC2  
V
CC2  
V
CC2  
V
GND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC2  
2
Supply voltage 2  
V
CC2  
V
CC3  
RF /V  
3
Supply voltage 2  
out CC3  
4
GND  
Ground  
RF /V  
out CC3  
5
V
CC1  
Supply voltage 1  
6
RF  
RF input  
in  
GND  
RF /V  
out CC3  
7
GND  
Ground (control)  
V
8
V
CTL  
Control input  
CC1  
RF /V  
out CC3  
9
V
Supply voltage for control  
Ground (optional)  
RF output / supply voltage 3  
RF output / supply voltage 3  
RF output / supply voltage 3  
RF output / supply voltage 3  
RF output / harmonic tuning  
Ground  
CC,CTL  
RF  
RF /V  
in  
out CC3  
10  
11  
12  
13  
14  
15  
16  
GND  
RF /V  
out CC3  
GND  
GND  
V
RF /V  
out CC3  
V
RF /V  
CTL  
CC,CTL  
out CC3  
RF /V  
out CC3  
RF / V  
out  
CC3  
GND  
Figure 2. Pinning  
Absolute Maximum Ratings  
All voltages refer to GND  
Parameter  
Symbol  
Min.  
Max.  
Unit  
Supply voltage V  
Pin 5  
V
V
V
5.0  
V
CC  
CC1  
CC2  
CC3  
Pins 1, 2 and 3  
Pins 11, 12, 13 and 14  
Pin 9  
V
CC, CTL  
Input power  
Pin 6  
Pin 8  
P
12  
2.2  
dBm  
V
in  
Gain control voltage  
Duty cycle for operation  
Burst duration  
V
CTL  
0
25  
%
t
1.2  
ms  
°C  
°C  
burst  
Junction temperature  
Storage temperature  
T
+150  
+150  
j
T
stg  
– 40  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
Junction ambient  
2 (6)  
R
t.b.d.  
K/W  
thJA  
Rev. A2, 28-Sep-00  
Preliminary Information  
TST0912  
Operating Range  
All voltages refer to GND  
Parameter  
Symbol  
, V , V V  
CC3, CC, CTL  
Min.  
2.4  
Typ.  
Max.  
4.5  
Unit  
V
Supply voltage V  
V
CC1  
3.5  
CC  
CC2  
Ambient temperature  
Input frequency  
T
– 25  
+ 85  
°C  
amb  
f
900  
MHz  
in  
Electrical Characteristics  
Test conditions: V = V  
to V  
V
= 3.5 V, V  
= 1.5 V, T  
= + 25°C, t = 0.577 ms,  
burst  
CC  
CC1  
CC3, CC, CTL  
CTL  
amb  
t
= 4.615 ms (see application circuit)  
period  
Parameter  
Test Conditions / Pins  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Power supply  
Supply voltage  
V
2.4  
3.5  
1.7  
4.5  
10  
V
A
CC  
Current consumption  
Active mode  
= 34.5 dBm, PAE = 50%  
I
P
out  
Current consumption  
(leakage current)  
Power-down mode  
0.2 V  
I
µA  
V
CTL  
RF input  
Frequency range  
Input impedance *)  
Input power  
f
880  
900  
50  
3
915  
MHz  
W
in  
Z
i
P
12  
dBm  
in  
Input VSWR *)  
P
P
= 0 to 12 dBm,  
VSWR  
2 : 1  
in  
= 34.5 dBm  
out  
RF output  
Output impedance *)  
Output power  
Z
50  
W
o
P
in  
= 3 dBm, R = R = 50 Ω  
L
G
V
CC  
V
CC  
= 3.5 V, T  
= 2.7 V, T  
= +25°C  
= +85°C  
P
out  
34.3  
32.0  
34.8  
33.0  
dBm  
dBm  
amb  
amb  
Minimum output power  
Power-added efficiency  
V
= 0.3 V  
– 20  
dBm  
CTL  
V
CC  
V
CC  
V
CC  
= 3 V, P = 28 dBm  
25  
35  
50  
out  
= 3 V, P = 30 dBm  
PAE  
%
out  
= 3 V, P = 33.5 dBm  
out  
Stability  
T
= –25 to + 85 °C  
VSWR  
VSWR  
10 : 1  
10 : 1  
amb  
no spurious –60 dBc  
P = 34.5 dBm,  
out  
Load mismatch  
(stable, no demage)  
all phases  
Second harmonic distortion  
Third harmonic distortion  
Noise power  
2fo  
3fo  
–35  
–35  
dBc  
dBc  
P
out  
= 34 dBm, RBW = 100  
kHz  
– 73  
– 85  
– 70  
– 82  
dBm  
dBm  
f = 925 to 935 MHz  
f 935 MHz  
Rev. A2, 28-Sep-00  
3 (6)  
Preliminary Information  
TST0912  
Electrical Characteristics (continued)  
Test conditions: V = V  
to V  
V
= 3.5 V, V  
= 1.5 V, T  
= + 25°C, t = 0.577 ms,  
burst  
CC  
CC1  
CC3, CC, CTL  
CTL  
amb  
t
= 4.615 ms (see application circuit)  
period  
Parameter  
Test Conditions / Pins  
Symbol Min.  
t , t  
Typ.  
Max.  
Unit  
µs  
Rise and fall time  
0.5  
r
f
Isolation between input and  
output  
P
V
= 0 to 10 dBm,  
50  
dB  
in  
0.2 V (power down)  
CTL  
Power control  
Control curve slope  
Power-control range  
Control-voltage range  
Control current  
P
25 dBm  
150  
dB/ V  
dB  
out  
V
= 0.3 to 2.0 V  
50  
CTRL  
V
CTL  
0.3  
2.0  
V
P = 0 to 10 dBm,  
in  
V
CTL  
= 0 to 2.0 V  
I
200  
µA  
CTL  
*)  
with external matching (see application circuit)  
50  
45  
40  
35  
30  
25  
20  
50  
40  
30  
20  
10  
0
PAE  
Pout  
PAE  
Pout  
Gain  
–40  
–30  
–20  
–10  
(dBm)  
0
10  
20  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
P
V
CC  
(V)  
in  
Figure 5. Pout, PAE versus VCC  
Figure 3. Gain, Pout and PAE versus Pin  
60  
50  
40  
30  
20  
10  
0
Remarks for the Application Circuit  
PAE  
All components Tx are microstrip lines:  
FR4, epsilon(r) = 4.3, metal: Cu 3.5 mm;  
distance: 1. layer to RF ground = 0.5 mm  
Pout  
Name  
l
w
Name  
l
w
mm  
mm  
mm  
mm  
T1  
T2  
T3  
T4  
20.5  
1.3  
1.0  
1.0  
0.5  
0.5  
T5  
T6  
T7  
T8  
2.5  
43.1  
6.0  
1.0  
0.5  
14.8  
14.2  
1.25  
0.5  
–10  
10.0  
0.50 0.75 1.00 1.25 1.50 1.75 2.00  
(V)  
V
ramp  
Figure 4. Pout, PAE versus Vramp  
4 (6)  
Rev. A2, 28-Sep-00  
Preliminary Information  
TST0912  
Application Circuit  
C1  
C2  
V
C12  
CC  
220nF  
T1  
220nF  
220nF  
C11  
100pF  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
T2  
Harmonic tuning  
T8  
C3  
39pF  
AVX  
T6  
1/4 Wavelength line  
T3  
15pF  
AVX  
C4  
C10  
T7  
RF  
T4  
T5  
OUT  
56pF  
C9  
10 pF  
AVX  
C5  
12pF  
L1  
3.3nH  
RF  
IN  
900 MHz  
Control  
V
CC,CTL  
C7  
V
CTL  
C6  
C8  
1nF  
22pF  
22pF  
14250  
Figure 6.  
Package Information  
Rev. A2, 28-Sep-00  
5 (6)  
Preliminary Information  
TST0912  
Ozone Depleting Substances Policy Statement  
It is the policy of Atmel Germany GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems  
with respect to their impact on the health and safety of our employees and the public, as well as their impact on  
the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as  
ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid  
their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these  
substances.  
Atmel Germany GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed  
in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
Atmel Germany GmbH can certify that our semiconductors are not manufactured with ozone depleting substances  
and do not contain such substances.  
2.  
We reserve the right to make changes to improve technical design and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each customer  
application by the customer. Should the buyer use Atmel Wireless & Microcontrollers products for any unintended  
or unauthorized application, the buyer shall indemnify Atmel Wireless & Microcontrollers against all claims,  
costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death  
associated with such unintended or unauthorized use.  
Data sheets can also be retrieved from the Internet:  
http://www.atmel–wm.com  
Atmel Germany GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 67 2594, Fax number: 49 (0)7131 67 2423  
6 (6)  
Rev. A2, 28-Sep-00  
Preliminary Information  

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