TSXPC603PVAU8LE [ATMEL]
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240;型号: | TSXPC603PVAU8LE |
厂家: | ATMEL |
描述: | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240 时钟 外围集成电路 |
文件: | 总38页 (文件大小:599K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TSPC603P
PowerPC 603e RISC MICROPROCESSOR Family
PID7v-603e Specification
DESCRIPTION
The PID7v-603e implementation of PowerPC603e (after
named 603p) is a low-power implementation of reduced
instruction set computer (RISC) microprocessors PowerPC
family. The 603p implements 32-bit effective addresses, inte-
gerdatatypesof8, 16and32bits, andfloating-pointdatatypes
of 32 and 64 bits.
CERQUAD 240
The 603p is a low-power 2.5/3.3-volt design and provides four
software controllable power-saving modes.
The 603p is a superscalar processor capable of issuing and
retiring as many as three instructions per clock. Instructions
can execute out of order for increased performance ; however,
the 603p makes completion appear sequential. The 603p inte-
grates five execution units and is able to execute five instruc-
tions in parallel.
A suffix
CERQUAD 240
Ceramic Leaded Chip Carrier
The 603p provides independent on-chip, 16-Kbyte, four-way
set-associative, physically addressed caches for instructions
and data and on-chip instruction and data memory manage-
ment units (MMUs). The MMUs contain 64-entry, two-way set-
associative, data and instruction translation lookaside buffers
that provide support for demand-paged virtual memory
address translation and variable-sized block translation.
The 603p has a selectable 32 or 64-bit data bus and a 32-bit
address bus. The 603p interface protocol allows multiple mas-
ters to complete for system resources through a central exter-
nal arbiter. The 603p supports single-beat and burst data
transfers for memory accesses, and supports memory-
mapped I/O.
G suffix
CBGA 255
Ceramic Ball Grid Array
The 603p uses an advanced, 2.5/3.3-V CMOS process tech-
nology and maintains full interface compatibility with TTL devi-
ces.
The 603p integrates in system testability and debugging fea-
tures through JTAG boundary-scan capability.
MAIN FEATURES
H 4.0 SPECint95, 5.3 SPECfp95 @ 166 MHz (estimated)
H Superscalar (3 instructions per clock peak).
H Dual 16KB caches.
SCREENING / QUALITY / PACKAGING
H Selectable bus clock.
This product is manufactured in full compliance with :
H 32-bit compatibility PowerPC implementation.
H On chip debug support.
H MIL-STD-883 class Q or According to TCS standards
(planned)
H PD typical = 3.0 Watts (166 MHz), full operating conditions.
H Nap, doze and sleep modes for power savings.
H Branch folding.
H Upscreenings based upon TCS standards
H Full military temperature range (Tc = -55°C, Tc= +125°C)
Industrial temperature range (Tc = –40°C, Tc= +110°C)
H 64-bit data bus (32-bit data bus option).
H 4-Gbyte direct addressing range.
H Internal // I/O Power Supply = 2.5 ± 5 % // 3.3 V ± 5 %.
H 240 pin Cerquad or 255 pin CBGA packages
H Pipelined single/double precision float unit.
IEEE 754 compatible FPU.
H IEEE P 1149-1 test mode (JTAG/C0P).
H fint max = 200 MHz.
H fbus max = 66.67 MHz.
H Compatible CMOS input / TTL Output.
December 1998
1/38
TSPC603P
SUMMARY
4.4. JTAG AC timing specifications . . . . . . . . . . . 22
A. GENERAL DESCRIPTION . . . . . . . . . . . . . . 3
1. INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1. CQFP 240 package . . . . . . . . . . . . . . . . . . . . . 4
2.2. CBGA package . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3. Pinout listing . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . 8
5. FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . 24
5.1. PowerPC registers and programming
model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.1. General-Purpose Registers (GPRs) . . 24
5.1.2. Floating-Point Registers (FPRs) . . . . . 24
5.1.3. Condition Register (CR) . . . . . . . . . . . . 24
5.1.4. Floating-Point Status and Control Register
(FPSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.5. Machine State Register (MSR) . . . . . . 24
5.1.6. Segment Registers (SRs) . . . . . . . . . . . 24
5.1.7. Special-Purpose Registers (SPRs) . . . 24
B. DETAILED SPECIFICATIONS . . . . . . . . . . 11
1. SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2. APPLICABLE DOCUMENTS . . . . . . . . . . . . . . . . 11
3. REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2. Instruction set and addressing modes . . . . 27
5.2.1. PowerPC instruction set and addressing
modes . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2.2. PowerPC 603p microprocessor instruction
set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.3. Cache implementation . . . . . . . . . . . . . . . . . . 28
5.3.1. PowerPC cache characteristics . . . . . . 28
3.2. Design and construction . . . . . . . . . . . . . . . . 11
3.2.1. Terminal connections . . . . . . . . . . . . . . . 11
3.2.2. Lead material and finish . . . . . . . . . . . . 11
3.2.3. Package . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3.2. PowerPC 603p microprocessor cache
implementation . . . . . . . . . . . . . . . . . . . . 28
5.4. Exception model . . . . . . . . . . . . . . . . . . . . . . . 29
5.4.1. PowerPC exception model . . . . . . . . . . 29
5.4.2. PowerPC 603p microprocessor exception
model . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.3. Absolute maximum ratings . . . . . . . . . . . . . . 11
3.4. Recommended operating conditions . . . . . . 12
5.5. Memory management . . . . . . . . . . . . . . . . . . 33
5.5.1. PowerPC memory management . . . . . 33
3.5. Thermal characteristics . . . . . . . . . . . . . . . . . 12
3.5.1. CQFP240 package . . . . . . . . . . . . . . . . 12
3.5.2. CBGA255 package . . . . . . . . . . . . . . . . 13
5.5.2. PowerPC 603p microprocessor memory
management . . . . . . . . . . . . . . . . . . . . . . 33
5.6. Instruction timing . . . . . . . . . . . . . . . . . . . . . . 33
6. PREPARATION FOR DELIVERY . . . . . . . . . . . . . 34
6.1. Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.2. Certificate of compliance . . . . . . . . . . . . . . . . 34
7. HANDLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8. PACKAGE MECHANICAL DATA . . . . . . . . . . . . 35
8.1. 240 pins - CQFP . . . . . . . . . . . . . . . . . . . . . . . 35
3.6. Power consideration . . . . . . . . . . . . . . . . . . . 14
3.6.1. Dynamic Power Management . . . . . . . 14
3.6.2. Programmable Power Modes . . . . . . . . 14
3.6.3. Power Management Modes . . . . . . . . . 14
3.6.4. Power Management Software
Considerations . . . . . . . . . . . . . . . . . . . . 16
3.6.5. Power dissipation . . . . . . . . . . . . . . . . . . 16
3.7. Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4. ELECTRICAL CHARACTERISTICS . . . . . . . . . . 17
4.1. General requirements . . . . . . . . . . . . . . . . . . 17
4.2. Static characteristics . . . . . . . . . . . . . . . . . . . 17
8.2. BGA package description . . . . . . . . . . . . . . . 36
8.2.1. Package parameters . . . . . . . . . . . . . . . 36
8.2.2. Mechanical dimensions of the BGA pac-
kage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.3. Dynamic characteristics . . . . . . . . . . . . . . . . 18
4.3.1. Clock AC specifications . . . . . . . . . . . . . 18
4.3.2. Input AC specifications . . . . . . . . . . . . . 19
4.3.3. Output AC specifications . . . . . . . . . . . . 20
9. CLOCK RELATIONSHIPS CHOICE . . . . . . . . . . 37
10. ORDERING INFORMATION . . . . . . . . . . . . . . . . 38
2/38
TSPC603P
A. GENERAL DESCRIPTION
Fetch
Unit
Completion
Unit
Branch
Unit
Dispatch
Unit
Load/
Store
Unit
Gen
Reg
Unit
Gen
Re-
name
FP
Re-
name
FP
Reg
File
Float
Unit
Integer
Unit
D MMU
I MMU
16K Data Cache
16K Inst. Cache
Bus Interface Unit
32b
address
64b
data
System Bus
Figure 1 : Block diagram
1.INTRODUCTION
The 603p is a low-power implementation of the PowerPC microprocessor family of reduced instruction set commuter (RISC) micro-
processors. The 603p implements the 32-bit portion of the PowerPC architecture, which provides 32-bit effective addresses, integer
data types of 8, 16 and 32 bits, and floating-point data types of 32 and 64 bits. For 64-bit PowerPC microprocessors, the PowerPC
architecture provides 64-bit integer data types, 64-bit addressing, and other features required to complete the 64-bit architecture.
The603pprovidesfoursoftwarecontrollablepower-savingmodes. Threeofthemodes(thenap, doze, andsleepmodes)arestaticin
nature, and progressively reduce the amount of power dissipated by the processor. The fourth is a dynamic power management
mode that causes the functional units in the 603p to automatically enter a low-power mode when the functional units are idle without
affecting operational performance, software execution, or any external hardware.
The 603p is a superscalar processor capable of issuing and retiring as many as three instructions per clock. Instructions can execute
out of order for increased performance ; however, the 603p makes completion appear sequential.
The603eintegratesfiveexecutionunits-anintegerunit(IU), afloating-pointunit(FPU), abranchprocessingunit(BPU), aload/store
unit (LSU) and a system register unit (SRU). The ability to execute five instructions in parallel and the use of simple instructions with
rapid execution times yield high efficiency and throughput for 603p-based systems. Most integer instructions execute in one clock
cycle. The FPU is pipelined so a single-precision multiply-add instruction can be issued every clock cycle.
The 603p provides independent on-chip, 16 Kbyte, four-way set-associative, physically addressed caches for instructions and data
and on-chip instruction and data memory management units (MMUs). The MMUs contain 64-entry, two-way set-associative, data
and instruction translation lookaside buffers (DTLB and ITLB) that provide support for demand-paged virtual memory address
translation and variable-sized block translation. The TLBs and caches use a least recently used (LRU) replacement algorithm. The
603palsosupportsblockaddresstranslationthroughtheuseoftwoindependentinstructionanddatablockaddresstranslation(IBAT
and DBAT) arrays of four entries each. Effective addresses are compared simultaneously with all four entries in the BAT array during
block translation. In accordance with the PowerPC architecture, if an effective address hits in both the TLB and BAT array, the BAT
translation takes priority.
The 603p has a selectable 32 - or 64-bit - data bus and a 32-bit address bus. The 603p interface protocol allows multiple masters to
compete for system resources through a central external arbiter. The 603p provides a three-state coherency protocol that supports
the exclusive, modified, and invalid cache states. This protocol as a compatible subset of the MESI (modified/exclusive/shared/in-
valid)four-stateprotocolandoperatescoherentlyinsystemsthatcontainfour-statecaches. The603psupportssingle-beatandburst
data transfers for memory accesses, and supports memory-mapped I/O.
The 603p uses an advanced, 0.35 mm 5 metal layer CMOS process technology and maintains full interface compatibility with TTL
devices.
3/38
TSPC603P
2.PIN ASSIGNMENTS
2.1. CQFP 240 package
Figure 2 : CQFP 240 : Top view
4/38
TSPC603P
2.2. CBGA255 package
Figure3 (pin matrix) shows the pinout as viewed from the top of the CBGA package. The direction of the top surface view is shown by
the side profile of the CBGA package.
Pin matrix top view
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to scale
Substrate Assembly
VIEW
Die
Encapsulant
Figure 3 : CBGA 255 Top view
5/38
TSPC603P
2.3. Pinout listing
Table 1 : Power and ground pins
CBGA255 package
VDD
A10
9, 19,29, 39, 49, 65, 116, F06, F08, F09, F11, G07, C05, C12, E03, E06,
CQFP240 package
VDD
GND
GND
PLL (AVDD)
Internal logic
209
4, 14, 24, 34, 44, 59,
122, 137, 147, 157, 167, 132, 142, 152, 162, 172, G10, H06, H08, H09,
E08, E09, E11, E14, F05,
F07, F10, F12, G06,
177, 207
182, 206, 239
H11, J06, J08, J09, J11,
K07, K10, L06, L08, L09, G08, G09, G11, H05,
L11
H07, H10, H12, J05, J07,
J10, J12, K06, K08, K09,
K11, L05, L07, L10, L12,
M03, M06, M08, M09,
M11, M14, P05, P12
Output drivers
10, 20, 35, 45, 54, 61,
8, 18, 33, 43, 53, 60, 69, C07, E05, E07, E10,
70, 79, 88, 96, 104, 112, 77, 86, 95, 103, 111, 120, E12, G03, G05, G12,
121, 128, 138, 148, 163, 127, 136, 146, 161, 171, G14, K03, K05, K12,
173, 183, 194, 222, 229, 181, 193, 220, 228, 238
240
K14, M05, M07, M10,
M12, P07, P10
Table 2 : Signal pinout listing
Signal name
CQFP Pin number
CBGA Pin number
Active
I/O
I/O
A[0–31]
179, 2, 178, 3, 176, 5, 175, 6, 174, 7,
170, 11, 169, 12, 168, 13, 166, 15, 165,
16, 164, 17, 160, 21, 159, 22, 158, 23,
151, 30, 144, 37
C16, E04, D13, F02, D14, G01, D15,
E02, D16, D04, E13, G02, E15, H01,
E16, H02, F13, J01, F14, J02, F15, H03,
F16, F04, G13, K01, G15, K02, H16,
M01, J15, P01
High
AACK
28
L02
Low
Low
High
Low
Low
Low
Low
Low
Low
Low
-
Input
I/O
ABB
36
K04
AP[0–3]
APE
231,230,227,226
C01, B04, B03, B02
I/O
218
32
A04
J04
Output
I/O
ARTRY
BG
27
L01
Input
Output
Output
Input
Output
Output
Output
I/O
BR
219
237
215
216
221
225,150
145
26
B06
E01
D08
A06
D07
B01, B05
J14
CI
CKSTP_IN
CKSTP_OUT
CLK_OUT
CSE[0-1]
DBB
High
Low
Low
Low
Low
High
DBG
N01
H15
G04
Input
Input
Input
I/O
DBDIS
DBWO
DH[0-31]
153
25
115, 114, 113, 110, 109, 108, 99, 98,
97, 94, 93, 92, 91, 90, 89, 87, 85,
84, 83, 82, 81, 80, 78, 76, 75, 74,
73, 72, 71, 68, 67, 66
P14, T16, R15, T15, R13, R12, P11,
N11, R11, T12, T11, R10, P09, N09,
T10, R09, T09, P08, N08, R08, T08,
N07, R07, T07, P06, N06, R06, T06,
R05, N05, T05, T04
DL[0-31]
6/38
143, 141, 140, 139, 135, 134, 133, 131, K13, K15, K16, L16, L15, L13, L14,
High
I/O
130, 129, 126, 125, 124, 123, 119, 118,
117, 107, 106, 105, 102, 101, 100, 51,
52, 55, 56, 57, 58, 62, 63, 64
M16, M15, M13, N16, N15, N13, N14,
P16, P15, R16, R14, T14, N10, P13,
N12, T13, P03, N03, N04, R03, T01,
T02, P04, T03, R04
TSPC603P
Signal name
DP[0-7]
CQFP Pin number
CBGA Pin number
Active
I/O
38, 40, 41, 42, 46, 47, 48, 50
M02, L03, N02, L04, R01, P02, M04,
R02
High
I/O
DPE
217
A05
Low
Low
Low
Low
Low
-
Output
Input
I/O
DRTRY
GBL
156
G16
1
F01
HRESET
INT
214
A07
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Input
Input
Input
Input
Input
I/O
188
B15
L1_TSTCLK1
L2_TSTCLK1
LSSD_MODE1
MCP
204
D11
203
D12
-
205
B10
Low
Low
High
Low
Low
Low
Low
Low
-
186
C13
PLL_CFG[0-3]
QACK
QREQ
RSRV
213, 211, 210, 208
A08, B09, A09, D09
235
D03
31
J03
232
D01
SMI
187
A16
SRESET
SYSCLK
TA
189
B14
212
C09
155
H14
Low
High
Low
High
-
TBEN
234
C02
TBST
192
A14
TC[0–1]
TCK
224, 223
A02, A03
Output
Input
Input
Output
Input
Input
Input
Input
I/O
201
C11
TDI
199
A11
High
High
Low
Low
High
Low
Low
High
High
Low
Low
TDO
198
A12
TEA
154
H13
TLBISYNC
TMS
233
C04
200
B11
TRST
202
C10
TS
149
J13
TSIZ[0-2]
TT[0-4]
WT
197, 196, 195
191, 190, 185, 184, 180
236
A13, D10, B12
B13, A15, B16, C14, C15
D02
I/O
I/O
Output
Input
NC
B07, B08, C03, C06, C08, D05, D06,
F03, H04, J16
VOLTDETGND3
F03
Low
Output
Notes :
1. These are test signals for factory use only and must be pulled up to VDD for normal machine operation.
2. OVDD inputs supply power to the I/O drivers and VDD inputs supply power to the processor core.
3. NC (no-connect) in the 603e BGA package; internally tied to GND in the 603p BGA package to indicate to the power supply that a low-voltage
processor is present.
7/38
TSPC603P
3.SIGNAL DESCRIPTION
Figure 4, Table 3 and Table 4 describe the signals on the TSPC603p and indicate signal functions. The test signals, TRST, TMS,
TCK, TDI and TDO, comply with subset P-1149.1 of the IEEE testability bus standard.
The 3 signals LSSD_MODE, LI_TSTCLK and L2_TSTCLK are test signals for factory use only and must be pulled up to VDD for
normal machine operations.
BR
BG
DBG
DBWO
DBB
1
1
ADDRESS
ARBITRATION
DATA
ATTRIBUTION
1
1
1
1
ABB
ADDRESS
START
TS
DH[0-31], DL[0-31]
DP[0-7]
1
64
DATA
TRANSFER
8
1
1
A[0-31]
DPE
32
DBDIS
ADDRESS
BUS
AP[0-3]
APE
4
1
TA
1
DRTRY
TEA
DATA
TERMINATION
1
1
TT[0-4]
TBST
5
1
TSIZ[0-2]
GBL
INT, SMI
MCP
3
2
1
1
1
2
2
INTERRUPTS
CHECKSTOPS
RESET
TRANSFER
ATTRIBUTE
CI
CKSTP_IN, CKSTP_OUT
HRESET, SRESET
WT
1
2
2
CSE[0-1]
TC[0-1]
603p
RSRV
QREQ, QACK
TBEN
1
2
PROCESSOR
STATUS
1
1
TLBISYNC
AACK
1
1
ADDRESS
TERMINATION
ARTRY
TRST, TCK, TMS, TDI, TD0
JTAG/COP
INTERFACE
5
3
SYSCLK
CLK_OUT
1
1
4
LSSD_MODE,
L1_TSTCLK, L2_TSTCLK
LSSD TEST
CONTROL
CLOCKS
PLL_CFG[0-3]
VDD
(20) 13
(19) 23
15
OVDD
GND*
OGND*
AVDD
VOLTDETGND
POWER SUPPLY
INDICATOR
1
POWER SUPPLY
(40)
{
(*) Ground inputs not separated
on CBGA package
23
1
(number) pin number in CBGA
package
Figure 4 : Functional groups
8/38
TSPC603P
Table 3 : Address and data bus signal index
Signal function
Signal name
Address bus
Data bus
Mnemonic
A[0-31]
Signal
type
if output, physical address of data to be transferred.
if input, represents the physical address of a snoop operation.
I/O
I/O
I/O
DH[0-31]
DL[0-31]
Represents the state of data, during a data write operation if output, or
during a data read operation if input.
Data bus
Represents the state of data, during a data write operation if output, or
during a data read operation if input.
Table 4 : Signal index
Signal function
Signal name
Mnemonic
Signal
type
Address Acknowledge AACK
The address phase of a transaction is complete
Input
I/O
Address Bus Busy
ABB
If output, the 603p is the address bus master
If input, the address bus is in use
Address Bus Parity
AP[0-3]
If output, represents odd parity for each of 4 bytes of the physical
address for a transaction
I/O
If input, represents odd parity for each of 4 bytes of the physical address
for snooping operations
Address Parity Error
Address retry
APE
Incorrect address bus parity detected on a snoop
Output
ARTRY
If output, detects a condition in which a snooped address tenure must be I/O
retried
If input, must retry the preceding address tenure
Bus grant
BG
May, with the proper qualification, assume mastership of the address
bus
Input
Bus request
Cache Inhibit
Test Clock
BR
Request mastership of the address bus
Output
Output
Output
Input
Cl
A single-beat transfer will not be cached
CLK_OUT
CKSTP_IN
Provides PLL clock output for PLL testing and monitoring
Checkstop Input
Must terminate operation by internally gating off all clocks, and release
all outputs
Checkstop Output
Cache Set Entry
CKSTP_OUT
CSE[0-1]
Has detected a checkstop condition and has ceased operation
Output
Cache replacement set element for the current transaction reloading into Output
or writing out of the cache
Data Bus Busy
DBB
If output, the 603p is the data bus master
If input, another device is bus master
I/O
Data Bus Disable
DBDIS
(For a write transaction) must release data bus and the data bus parity
to high impedance during the following cycle
Input
Data Bus Grant
DBG
May, with the proper qualification, assume mastership of the data bus
May run the data bus tenure
Input
Input
I/O
Data Bus Write Only
Data Bus Parity
DBW0
DP[0-7]
If output, odd parity for each of 8 bytes of data write transactions
If input, odd parity for each byte of read data
Data Parity Error
Data Retry
Global
DPE
Incorrect data bus parity
Output
Input
I/O
DRTRY
GBL
Must invalidate the data from the previous read operation
If output, a transaction is global
If input, a transaction must be snooped by the 603p
Hard Reset
HRESET
Initiates a complete hard reset operation
Input
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TSPC603P
Signal name
Mnemonic
Signal function
Signal
type
Interrupt
INT
Initiates an interrupt if bit EE of MSR register is set
LSSD test control signal for factory use only
LSSD test control signal for factory use only
LSSD test control signal for factory use only
Input
Input
Input
Input
Input
LSSD_MODE
L1_TSTCLK
L2_TSTCLK
MCP
Machine Check Inter-
rupt
Initiates a machine check interrupt operation if the bit ME of MSR regis-
ter and bit EMCP of HID0 register are set
PLL Configuration
PLL_CFG[0-3] Configures the operation of the PLL and the internal processor clock
frequency
Input
Quiescent
Acknowledge
QACK
QREQ
RSRV
SMI
All bus activity has terminated and the 603p may enter a quiescent (or
low power) state
Input
Quiescent Request
Is requesting all bus activity normally to enter a quiescent (low power)
state
Output
Output
Input
Reservation
Represents the state of the reservation coherency bit in the reservation
address register
System Management
Interrupt
Initiates a system management interrupt operation if the bit EE of MSR
register is set
Soft Reset
SRESET
SYSCLK
Initiates processing for a reset exception
Input
Input
System Clock
Represents the primary clock input for the 603p, and the bus clock fre-
quency for 603p bus operation
Transfer Acknowledge TA
A single-beat data transfer completed successfully or a data beat in a
burst transfer completed successfully
Input
Timebase Enable
Transfer Burst
TBEN
The timebase should continue clocking
Input
I/O
TBST
If output, a burst transfer is in progress
If input, when snooping for single-beat reads
Transfer Code
Test clock
TC[0-1]
TCK
Special encoding for the transfer in progress
Clock signal for the IEEE P1149.1 test access port (TAP)
Serial data input for the TAP
Output
Input
Test data input
Test data output
TDI
Input
TDO
TEA
Serial data output for the TAP
Output
Input
Transfer Error
Acknowledge
A bus error occurred
TLBI Sync
TLBISYNC
TMS
Instruction execution should stop after execution of a tlbsync instruction Input
Test mode select
Test reset
Selects the principal operations of the test-support circuitry
Provides an asynchronous reset of the TAP controller
Input
Input
I/O
TRST
Transfer Size
TSIZ[0-2]
For memory accesses, these signals along with TBST indicate the data
transfer size for the current bus operation
Transfer start
TS
If output, begun a memory bus transaction and the address bus and
transfer attribute signals are valid
I/O
If input, another master has begun a bus transaction and the address
bus and transfer attribute signals are valid for snooping (see GBL)
Transfer Type
Write-Through
TT[0-4]
WT
Type of transfer in progress
I/O
A single-beat transaction is write-through
Output
Output
Power supply indicator VOLTDETGND Available only on BGA package
Indicates to the power supply that a low–voltage processor is present.
10/38
TSPC603P
B. DETAILED SPECIFICATIONS
1.SCOPE
This drawing describes the specific requirements for the microprocessor TSPC603p, in compliance with MIL-STD-883 class Q or
TCS standard screening.
2.APPLICABLE DOCUMENTS
1) MIL-STD-883 : Test methods and procedures for electronics.
2) MIL-PRF-38535 : General specifications for microcircuits.
3.REQUIREMENTS
3.1. General
The microcircuits are in accordance with the applicable documents and as specified herein.
3.2. Design and construction
3.2.1. Terminal connections
Depending on the package, the terminal connections shall be is shown in Figure 2 and Figure 4 (§ A. GENERAL DESCRIPTION).
3.2.2. Lead material and finish
Lead material and finish shall be as specified in MIL-STD-1835 (see enclosed § 8)
3.2.3. Hermetic Package
The macrocircuits are packaged in 240 pin ceramic quad flat packages (see § 8.1)
The precise case outlines are described at the end of the specification (§ 8.1) and into MIL-STD-1835.
3.3. Absolute maximum ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stresses beyond
those listed may affect device reliability or cause permanent damage to the device.
Table 5 : Absolute maximum rating for the 603p
Parameter
Symbol
Min
-0.3
-0.3
-0.3
-0.3
-55
Max
2.75
2.75
3.6
Unit
V
Core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
V
dd
AV
V
dd
OV
V
dd
V
in
5.5
V
Storage temperature range
T
stg
+150
°C
Notes:
1. Functional operating conditions are given in AC and DC electrical specifications. Stresses beyond the absolute maximums listed may affect
device reliability or cause permanent damage to the device.
2. Caution : Input voltage must not be greater than the OVdd supply voltage by more than 2.5 V at all times including during power-on reset.
3. Caution : OVdd voltage must not be greater than Vdd/AVdd supply voltage by more than 1.2 V at all times including during power-on reset.
4. Caution : Vdd/AVdd voltage must not be greater than OVdd supply voltage by more than 0.4 V at all times including during power-on reset.
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TSPC603P
3.4. Recommended operating conditions
These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
Parameter
Symbol
Min
2.375
2.375
3.135
GND
-55
Max
2.625
2.625
3.465
5.5
Unit
V
Core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
V
dd
AV
V
dd
OV
V
dd
V
in
V
Operating temperature
T
c
+125
°C
3.5. Thermal characterisrics
3.5.1.CQFP240 package
Thissectionprovidesthermalmanagementdataforthe603p;thisinformationisbasedonatypicaldesktopconfigurationusinga240
lead, 32 mm x 32 mm, wire-bond CQFP package. The heat sink used for this data is a pinfin configuration from Thermalloy, part
number 2338.
3.5.1.1. Thermal characteristics
The thermal characteristics for a wire-bond CQFP package are as follows :
Thermal resistance (junction-to-case) = Rqjc or qjc = 2.2°C/Watt.
Wire–bond CQFP die junction–to–lead thermal resistance (typical) = q JB = 18°C/W
3.5.1.2. Thermal management example
The following example is based on a typical desktop configuration using a wire-bond CQFP package. The heat sink used for this data
is a pinfin heat sink #2338 attached to the wire-bond CQFP package with thermal grease.
Figure 5 provides a thermal management example for the CQFP package.
35
30
Motorola Wire-Bond CQFP
With Heat Sink
25
20
15
10
5
0
0
1
2
3
4
5
Forced convection (m/sec)
Figure 5 : CQFP thermal management exemple
The junction temperature can be calculated from the junction to ambient thermal resistance, as follows :
Junction temperature :
or
Tj = Ta + Rqja * P
Tj = Ta + (Rqjc + Rcs + Rsa) * P
Where :
Ta is the ambient temperature in the vicinity of the device
Rqja is the junction-to-ambient thermal resistance
Rqjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
R
sa is the heat sink-to-ambient thermal resistance
12/38
TSPC603P
P is the power dissipated by the device
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heat sink, so the junction-to-ambient
thermal resistance is the sum of the resistances from the junction to the case, from the case to the heat sink, and from the heat sink to
the ambient.
Note that verification of external thermal resistance and case temperature should be performed for each application. Thermal resis-
tance can vary considerably due to many factors including degree of air turbulence.
For a power dissipation of 2.5 Watts in an ambient temperature of 40°C at 1 m/sec with the heat sink measured above, the junction
temperature of the device would be as follows :
Tj = Ta + Rqja * P
Tj = 40°C + (10°C/Watt * 2.5 watts) = 65°C
which is well within the reliability limits of the device.
Notes :
1. Junction-to-ambient thermal resistance is based on measurements on single-sided printed circuit boards per SEMI (Semiconductor Equip-
ment and Materials International) G38-87 in natural convection.
2. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88 with the exception that the cold plate
temperature is used for the case temperature.
3.5.2.CBGA255 package
The data found in this section concerns 603p’s packaged in the 255-lead 21 mm multi-layer ceramic (MLC), ceramic BGA package.
Data is shown for two cases, the expoded-die case (no heat sink) and using the Thermalloy 2338-pin fin heat sink.
3.5.2.1. Thermal characteristics
The internal thermal resistance for this package is negligible due to the exposed die design. A heat sink is attached directly to the
silicon die surface only when external thermal enhancement is necessary.
Additionally, the CBGA package offers an excellent thermal connection to the card and power planes. Heat generated at the chip is
dissipated through the package, the heat sink (when used) and the card. The parallel heat flow paths result in the lowest overall
thermal resistance as well as offer significaltly better power dissipation capability when a heat sink is not used.
The thermal characteristics for the flip–chip CBGA package are as follows :
Thermal resistance (junction-to-case) = Rqjc or qjc = 0.08°C/Watt.
Thermal resistance (junction-to-ball) = Rqjb or qjb = 2.8°C/Watt .
3.5.2.2. Thermal management example
The calculations are performed exactly as shown in theprevious section for CPFP240. Figure 6 shows typical thermal performance
data for the 21 mm CBGA package mounted to a test card.
qja (°C/W)
CBGA with exposed die
20
15
CBGA with thermalloy
2338B-pin fin heat sink
10
5
0
0
1
2
3
4
5
Approach air velocity (m/sec)
Assumptions :
1. 2P card with 1 OZ Cu planes
2. 63 mm x 76 mm card
3. Air flow on both sides of card
4. Vercical orientation
5. 2-stage epoxy heat sink attach
Figure 6 : CBGA thermal management example
Temperature calculations are also performed identically to those in the previous section. For a power dissipation of 2.5 Watts in an
ambient of 40°C at 1.0 m/sec, the associated overall thermal resistance and junction temperature, found in Table 6 will result.
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TSPC603P
Table 6 : Thermal resistance and junction temperature
Configuration
qja (°C/W)
18.4
Tj (°C)
86
Exposed die (no heat sink)
With 2338 heat sink
5.3
53
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakefield Engineering can supply heat sinks with a wide range of thermal
performance.
3.6. Power consideration
ThePowerPC603pisamicroprocessorspecificallydesignedforlow-poweroperation. Asthe603emicroprocessorversion, the603p
provides both automatic and program-controllable power reduction modes for progressive reduction of power consumption. This
chapter describes the hardware support provided by the 603p for power management.
3.6.1. Dynamic Power Management
Dynamic power management automatically powers up and down the individual execution units of the 603p, based upon the contents
oftheinstructionstream. Forexample, ifnofloating-pointinstructionsarebeingexecuted, thefloating-pointunitisautomaticallypow-
ered down. Power is not actually removed from the execution unit ; instead, each execution unit has an independent clock input,
which is automatically controlled on a clock-by- clock basis. Since CMOS circuits consume negligible power when they are not
switching, stopping the clock to an execution unit effectively eliminates its power consumption. The operation of DPM is completely
transparent to software or any external hardware. Dynamic power management is enabled by setting bit 11 in HID0 on power-up, of
following HRESET.
3.6.2. Programmable Power Modes
The 603p provides four programmable power states - full power, doze, nap and sleep. Software selects these modes by setting one
(andonlyone)ofthethreepowersavingmodebits. Hardwarecanenableapowermanagementstatethroughexternalasynchronous
interrupts The hardware interrupt causes the transfer of program flow to interrupt handler code. The appropriate mode is then set by
the software. The 603p provides a separate interrupt and interrupt vector for power management - the system management interrupt
(SMI). The 603p also contains a decrement timer which allows it to enter the nap or doze mode for a predetermined amount of time
and then return to full power operation through the decrementer interrupt (DI). Note that the 603p cannot switch from on power man-
agement mode to another without first returning to full on mode. The nap and sleep modes disable bus snooping ; therefore, a hard-
ware handshake is provided to ensure coherency before the 603p enters these power management modes. Table 7 summarizes the
four power states.
Table 7 : Power PC 603p Microprocessor Programmable Power Modes
PM Mode
Functioning Units
Activation Method
Full-Power Wake Up Method
Full power
All units active
–
–
–
Full power (with DPM)
Doze
Requested logic by
demand
By instruction dispatch
Controlled by SW
- Bus snooping
External asynchronous exceptions*
Decrementer interrupt
Reset
- Data cache as needed
- Decrementer timer
Nap
Decrementer timer
Controlled by hardware and External asynchronous exceptions
software
Decrementer interrupt
Reset
Sleep
None
Controlled by hardware and External asynchronous exceptions
software
Reset
* Exceptions are referred to as interrupts in the architecture specification
3.6.3. Power Management Modes
The following sections describe the characteristics of the 603p”s power management modes, the requirements for entering and exit-
ing the various modes, and the system capabilities provided by the 603p while the power management modes are active.
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TSPC603P
3.6.3.1. Full-Power Mode with DPM Disabled
Full-power mode with DPM disabled power mode is selected when the DPM enable bit (bit 11) in HID0 is cleared.
- Default state following power-up and HRESET.
- All functional units are operating at full processor speed at all times.
3.6.3.2. Full-Power Mode with DPM Enabled
Full-power mode with DPM enabled (HID0[11] = 1) provides on-chip power management without affecting the functionality or perfor-
mance of the 603p.
- Required functional units are operating at full processor speed.
- Functional units are clocked only when needed.
- No software or hardware intervention required after mode is set.
- Software/hardware and performance transparent.
3.6.3.3. Doze Mode
Doze ode disables most functional units but maintains cache coherency by enabling the bus interface unit and snooping. A snoop hit
will cause the 603p to enable the data cache, copy the data back to memory, disable the cache, and fully return to the doze state.
D Most functional units disabled.
D Bus snooping and time base/decrementer still enabled.
D Dose mode sequence :
- Set doze bit (HID0[8) = 1).
- 603p enters doze mode after several processor clocks.
D Several methods of returning to full-power mode :
- Assert INT, SMI, MCP or decrementer interrupts.
- Assert hard reset or soft reset.
D Transition to full-power state takes no more than a few processor cycles.
D PLL running and locked to SYSCLK.
3.6.3.4. Nap Mode
The nap mode disables the 603p but still maintains the phase locked loop (PLL) and the time base/decrementer. The time base can
be used to restore the 603p to full-on state after a programmed amount of time. Because bus snooping is disabled for nap and sleep
mode, a hardware handshake using the quiesce request (QREQ) and quiesce acknowledge (QACK) signals are requires to maintain
data coherency. The 603p will assert the QREQ signal to indicate that it is ready to disable bus snooping. When the system has
ensured that snooping is no longer necessary, it will assert QACK and the 603p will enter the sleep or nap mode.
D Time base/decrementer still enabled.
D Most functional units disabled (including bus snooping).
D All nonessential input receivers disables.
D Nap mode sequence :
- Set nap bit (HID0[9] = 1).
- 603p asserts quiesce request (QREQ) signal.
- System asserts quiesce acknowledge (QACK) signal.
- 603p enters sleep mode after several processor clocks.
D Several methods of returning to full-power mode :
- Assert INT, SPI, MCP or decrementer interrupts.
- Assert hard reset or soft reset.
D Transition to full-power takes no more than a few processor cycles.
D PLL running and locked to SYSCLK.
3.6.3.5. Sleep Mode
Sleep mode consumes the least amount of power of the four modes since all functional units are disabled. To conserve the maximum
amount of power, the PLL may be disabled and the SYSCLK may be removed. Due to the fully static design of the 603p, internal
processor state is preserved when no internal clock is present. Because the time base and decrementer are disabled while the 603p
is in sleep mode, the 603p’s time base contents will have to be updated from an external time base following sleep mode if accurate
time-of-daymaintenanceisrequired. Beforethe603pentersthesleepmode, the603pwillasserttheQREQsignaltoindicatethatitis
ready to disable bus snooping. When the system has ensured that snooping is no longer necessary, it will assert QACK and the 603p
will enter the sleep mode.
D All functional units disabled (including bus snooping and time base).
D All nonessential input receivers disabled :
- Internal clock regenerators disabled.
- PLL still running (see below).
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TSPC603P
D Sleep mode sequence :
- Set sleep bit (HID0[10] = 1).
- 603p asserts quiesce request (QREQ).
- System asserts quiesce acknowledge (QACK).
- 603p enters sleep mode after several processor clocks.
D Several methods of returning to full-power mode :
- Assert INT, SMI, or MCP interrupts.
- Assert hard reset or soft reset.
D PLL may be disabled and SYSCLK may be removed while in sleep mode.
D Return to full-power mode after PLL and SYSCLK disabled in sleep mode :
- Enable SYSCLK.
- Reconfigure PLL into desired processor clock mode.
- System logic waits for PLL startup and relock time (100 msec).
- System logic asserts one of the sleep recovery signals (for example, INT or SMI).
3.6.4. Power Management Software Considerations
Since the 603p is a dual issue processor with out -of-order execution capability, care must be taken in how the power management
mode is entered. Furthermore, nap and sleep modes require all outstanding bus operations to be completed before the power man-
agement mode is entered. Normally during system configuration time, one of the power management modes would be selected by
setting the appropriate HID0 mode bit. Later on, the power management mode is invoked by setting the MSR[POW] bit. To provide a
clean transition into and out of the power management mode, the stmsr[POW] should be preceded by a sync instruction and fol-
lowed by an isync instruction.
3.6.5. Power dissipation
Table 8 : Power dissipation
Vdd/AVdd = 2.5 ± 5 % V dc, OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, 0°C ≤ Tc ≤ 125°C
CPU clock Frequency
166 MHz
200 MHz
Units
Full-On Mode (DPM Enabled)
Typical
3.0
4.0
4.0
5.0
W
W
Max
Doze Mode(1)
Typical
1.2
80
70
1.5
120
100
60
W
Nap Mode(1)
Typical
mW
mW
mW
mW
Sleep Mode(1)
Typical
Sleep Mode-PLL Disabled(1)
Typical 60
Sleep Mode-PLL and SYSCLK Disabled(1)
Typical 60 60
(1) The values provided for this mode do not include pad driver power (OVDD) or
analog supply power (AVDD). Worst-case AVDD = 15 mW
Notes:
o
1. To calculate the power consumption at low temperature (–55 C), use a 1.25 factor
2. Maximum power measurements are performed with a worst case instruction mix at VDD=2.625 V
3. These values apply for all valid PLL settings and do not include OVDD/AVDD consumption
4. WORST case AVDD = 15 mW, OVDD is system dependent but is typically ≤ 10 % VDD
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TSPC603P
3.7. Marking
The document where are defined the marking are identified in the related reference documents. Each microcircuit are legible and
permanently marked with the following information as minimum :
- Thomson logo,
- Manufacturer’s part number,
- Class B identification if applicable,
- Date-code of inspection lot,
- ESD identifier if available,
- Country of manufacturing.
4.ELECTRICAL CHARACTERISTICS
4.1. General requirements
All static and dynamic electrical characteristics specified for inspection purposes and the relevant measurement conditions aregiven
below :
- Table 9 : Static electrical characteristics for the electrical variants.
- Table 10 : Dynamic electrical characteristics for the 603p.
These specifications are for 166 MHz and 200 MHz processor core frequencies. The processor core frequency is determined by the
bus (SYSCLK) frequency and the settings of the PLL_CFG0 to PLL_CFG3 signals. All timings are specified respective to the rise
edge of SYSCLK.
4.2. Static characteristics
Table 9 : Electrical characteristics
Vdd = AVdd = 2.5 V ± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, –55°C ≤ Tc ≤ 125°C
Characteristics
Symbol
VIH
Min
2.0
GND
2.4
GND
-
Max
5.5
0.8
5.5
0.4
30
Unit
V
Input high voltage (all inputs except SYSCLK)
Input low voltage (all inputs except SYSCLK)
SYSCLK input high voltage
VIL
V
CVIH
CVIL
Iin
V
SYSCLK input low voltage
V
Input leakage current
Vin = 3.465 V(1, 3)
Vin = 5.5 V(1, 3)
mA
mA
mA
Iin
-
300
30
Hi-Z (off-state)
leakage current
Vin = 3.465 V(1, 3)
ITSI
-
Vin = 5.5 V(1, 3)
IOH = –7 mA
IOL = +7 mA
ITSI
VOH
VOL
Cin
-
300
-
mA
V
Output high voltage
Output low voltage
2.4
-
-
0.4
10.0
V
Capacitance, Vin = 0 V, f = 1 MHz(2)
(excludes TS, ABB, DBB, and ARTRY)
pF
Capacitance, Vin = 0 V, f = 1 MHz(2)
(for TS, ABB, DBB, and ARTRY)
Cin
-
15.0
pF
Notes:
1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals).
2. Capacitance is periodically sampled rather than 100 % tested.
3. Leackage currents are measured for nominal OVdd/Vdd or both OVdd/Vdd. Same variation (for example, both Vdd and OVdd vary by
either +5 % or –5 %).
17/38
TSPC603P
4.3. Dynamic characteristics
4.3.1. Clock AC specifications
Table 10 provides the clock AC timing specifications as defined in Figure 7.
Table 10 : Clock AC timing specifications
Vdd = AVdd = 2.5 V ± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, –55°C ≤ Tc ≤ 125°C
166 MHz
Min
200 MHz
Min
Num
Characteristics
Unit
Note
Max
167
333
66.67
40
Max
200
400
66.67
40
Processor frequency
125
250
25
15
–
125
250
25
15
–
MHz
MHz
MHz
ns
5
5
VCO frequency
SYSCLK (bus) frequency
SYSCLK cycle time
1
2,3
4
SYSCLK rise and fall time
SYSCLK duty cycle (1.4V measured)
SYSCLK jitter
2.0
2.0
ns
1
3
40
–
60
40
–
60
%
±150
100
±150
100
ps
2
603p internal PLL relock time
–
–
ms
3,4
Notes:
1. Rise and fall times for the SYSCLK input are measured from 0.4 V to 2.4 V.
2. Cycle-to-cycle jitter is guaranteed by design.
3. Timing is guaranteed by design and characterization, and is not tested.
4. PLLrelock time is the maximum amount of time required for PLL lock after a stable Vdd and SYSCLK are reached during the power-on reset
sequence. This specification also applies when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that
HRESET must be held asserted for a minimum of 255 bus clocks after the PLL relock time (100 ms) during the power-on reset sequence.
5. Caution : The SYSCLK frequency and PLL_CFG0–PLL_CFG3 settings must be chosen such that the resulting SYSCLK (bus) frequency,
CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating frequencies. Refer to the
PLL_CFG0_PLL_CFG3 signal description for valid PLL settings.
Figure 7 : SYSCLK input timing diagram
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TSPC603P
4.3.2. Input AC specifications
Table 11 provides the input AC timing specifications for the 603p as defined in Figure 8 and Figure 9.
Table 11 : Input AC timing specifications
Vdd = AVdd = 2.5 V ± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, –55°C ≤ Tc ≤ 125°C
Num
Characteristics
166 MHz
Min Max
200 MHz
Min Max
Unit
Note
10a Address/data/transfer attribute inputs valid to SYSCLK (input setup)
10b All other inputs valid to SYSCLK (input setup)
2.5
4.0
-
-
-
2.5
4.0
-
-
-
ns
ns
ns
2
3
10c Mode select inputs valid to HRESET (input setup) (for DRTRY,
QACK and TLBISYNC)
8*
tsys
8*
tsys
4,5,6,7
11a SYSCLK to address/data/transfer attribute inputs invalid (input hold)
11b SYSCLK to all other inputs invalid (input hold)
1.0
1.0
0
-
-
-
1.0
1.0
0
-
-
-
ns
ns
ns
2
3
11c
HRESET to mode select inputs invalid (input hold) (for DRTRY,
QACK, and TLBISYNC)
4,6,7
Notes :
1. All input specifications are measured from the TTL level (0.8 or 2.0 V) of the signal in question to the 1.4 V of the rising edge of the input
SYSCLK. Both input and output timings are measured at the pin. See Figure 9.
2. Address/data/transferattributeinputsignalsarecomposedofthefollowing:A0–A31, AP0–AP3, TT0–TT4, TC0–TC1, TBST,TSIZ0–TSIZ2,
GBL, DH0–DH31, DL0–DL31, DP9–DP7.
3. All other input signals are compsed of the following: TS, ABB, DBB, ARTRY, BG, AACK, DBG, DBWO, TA, DRTRY, TEA, DBDIS, HRESET,
SRESET, INT, SMI, MCP, TBEN, QACK, TLBISYNC.
4. The setup and hold time is with respect to the rising edge of HRESET. See Figure 9.
5. t
is the period of the external clock (SYSCLK) in nanoseconds.
SYS
6. These values are guaranteed by design, and are not tested.
7. This specification is for configuration mode only. Also note that HRESET must be held asserted for a minimum of 255 bus clocks after the
PLL relock time (100 ms) during the power-on reset sequence.
Figure 8 : Input timing diagram
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TSPC603P
Figure 9 : Mode select input timing diagram
4.3.3. Output AC specifications
Table 12 provides the output AC timing specifications for the 603p (shown in Figure 10).
Table 12 : Output AC timing specifications
Vdd = AVdd = 2.5 V ± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, CL = 50 pF, –55°C ≤ Tc ≤ 125°C
166 MHz
200 MHz
Num
Characteristic
Unit
Note
Min
Max
–
Min
Max
–
12
SYSCLK to output driven (output enable time)
1.0
–
1.0
–
ns
ns
ns
ns
13a
13b
14a
SYSCLK to output valid (5.5 V to 0.8 V – TS, ABB, ARTRY, DBB)
SYSCLK to output valid (TS, ABB, ARTRY, DBB)
9.0
8.0
11.0
9.0
8.0
11.0
4
6
4
–
–
SYSCLK to output valid (5.5 V to 0.8 V – all except TS, ABB,
ARTRY, DBB)
–
–
14b
15
SYSCLK to output valid (all except TS, ABB, ARTRY, DBB)
SYSCLK to output invalid (output hold)
–
0.5
–
9.0
–
–
0.5
–
9.0
–
ns
ns
ns
6
3
16
SYSCLK to output high impedance (all except ARTRY, ABB,
DBB)
8.5
9.5
17
18
19
SYSCLK to ABB, DBB, high impedance after precharge
SYSCLK to ARTRY high impedance before precharge
SYSCLK to ARTRY precharge enable
–
–
1.0
8.0
–
–
–
1.0
8.0
–
tsys
ns
5, 7
0.2 *
tsys
0.2 *
tsys
ns
3, 5, 8
+ 1.0
+ 1.0
20
21
Maximum dalay to ARTRY precharge
–
–
1.0
2.0
–
–
1.0
2.0
tsys
tsys
5, 8
5, 8
SYSCLK to ARTRY high impedance after precharge
Notes:
1. All output specifications are measured from the 1.4 V of the rising edge of SYSCLK to the TTL level (0.8 V or 2.0 V) of the signal in question.
Both input and output timings are measured at the pin. See Figure 10.
2. All maximum timing specifications assume C = 50 pF.
L
3. This minimum parameter assumes C = 0 pF.
L
4. SYSCLK to output valid (5.5 V to 0.8 V) includes the extra delay associated with discharging the external voltage from 5.5 V to 0.8 V instead
of from Vdd to 0.8 V (5 V CMOS levels instead of 3.3 V CMOS levels).
5. t is the period of the external bus clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied by the period of
sys
SYSCLK to compute the actual time duration (in nanoseconds) of the parameter in question.
6. Output signal transitions from GND to 2.0 V or Vdd to 0.8 V.
7. Nominal precharge width for ABB and DBB is 0.5 t
.
sysclk
8. Nominal precharge width for ARTRY is 1.0 t
.
sysclk
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Figure 10 : Output timing diagram
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4.4. JTAG AC timing specifications
Table 13 : JTAG AC timing specifications (independent of SYSCLK)
Vdd = AVdd = 2.5 V ± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, CL = 50 pF, –55°C ≤ Tc ≤ 125°C
Figure 11 : Clock input timing diagram
Figure 12 : TRST timing diagram
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Figure 13 : Boundary-scan timing diagram
Figure 14 : Test access port timing diagram
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5.FUNCTIONAL DESCRIPTION
5.1. PowerPC registers and programming model
The PowerPC architecture defines register-to-register operations for most computational instructions. Source operands for these
instructionsareaccessedfromtheregistersorareprovidedasimmediatevaluesembeddedintheinstructionopcode. Thethree-reg-
ister instruction format allows specification of a target register distinct from the two source operands. Load and store instructions
transfer data between registers and memory.
PowerPC processors have two levels of privilege - supervisor mode of operation (typically used by the operating system) and user
mode of operation (used by the application software). The programming models incorporate 32 GPRs, 32 FPRs, special-purpose
registers (SPRs) and several miscellaneous registers. Each PowerPC microprocessor also has its own unique set of hardware
implementation (HID) registers.
Having access to privilege instructions, registers, and other resources allows the operating system to control the application environ-
ment(providingvirtualmemoryandprotectingoperating-systemandcriticalmachineresources). Instructionsthatcontrolthestateof
the processor, the address translation mechanism, and supervisor registers can be executed only when the processor is operatingin
supervisor mode.
The following sections summarize the PowerPC registers that are implemented in the 603p.
5.1.1. General-Purpose Registers (GPRs)
The PowerPC architecture defines 32 user-level, general-purpose registers (GPRs). These registers are either 32 bits wide in 32-bit
PowerPC microprocessors and 64 bits wide in 64-bit PowerPC microprocessors. The GPRs serve as the data source or destination
for all integer instructions.
5.1.2. Floating-Point Registers (FPRs)
The PowerPC architecture also defines 32 user-level, 64-bit floating-point registers (FPRs). The FPRs serve as the data source or
destinationforfloating-pointinstructions. Theseregisterscancontaindataobjectsofeithersingle-ordouble-precisionfloating-point
formats.
5.1.3. Condition Register (CR)
The CR is a 32-bit user-level register that consists of eight four-bit fields that reflect the results of certain operations, such as move,
integer and floating-point compare, arithmetic, and logical instructions, and provide a mechanism for testing and branching.
5.1.4. Floating-Point Status and Control Register (FPSCR)
The floating-point status and control register (FPSCR) is a user-level register that contains all exception signal bits, exception sum-
mary bits, exception enable bits, and rounding control bits needed for compliance with the IEEE 754 standard.
5.1.5. Machine State Register (MSR)
The machine state register (MSR) is a supervisor-level register that defines the state of the processor. The contents of this register
are saved when an exception is taken and restored when the exception handling completes. The 603p implements the MSR as a
32-bit register, 64-bit PowerPC processors implement a 64-bit MSR.
5.1.6. Segment Registers (SRs)
For memory management, 32-bit PowerPC microprocessors implement sixteen 32-bit segment registers (SRs). To speed access,
the 603p implements the segment registers as two arrays ; a main array (for data memory accesses) and a shadow array (for instruc-
tion memory accesses). Loading a segment entry with the Move to Segment Register (stsr) instruction loads both arrays.
5.1.7. Special-Purpose Registers (SPRs)
The powerPC operating environment architecture defines numerous special-purpose registers that serve a variety of functions, such
as providing controls, indicating status, configuring the processor, and performing special operations. During normal execution, a
program can access the registers, shown in Figure 15, depending on the program’s access privilege (supervisor or user, determined
by the privilege-level (PR) bit in the MSR). Note that register such as the GPRs and FPRs are accessed through operands that are
part of the instructions. Access to registers can be explicit (that is, through the use of specific instructions for that purpose such as
MovetoSpecial-PurposeRegister(mtspr)andMovefromSpecial-PurposeRegister(mfspr)instructions)orimplicit, asthepartofthe
execution of an instruction. Some registers are accessed both explicitly and implicitly.
Il the 603p, all SPRs are 32 bits wide.
5.1.7.1. User-Level SPRs
The following 603p SPRs are accessible by user-level software :
D Link register (LR) - The link register can be used to provide the branch target address and to hold the return address after branch
and link instructions. The LR is 32 bits wide in 32-bit implementations.
D Count register (CTR) - The CRT is decremented and tested automatically as a result of branch-and-count instructions. The CTR
is 32 bits wide in 32-bit implementations.
D Integer exception register (XER) - The 32-bit XER contains the summary overflow bit, integer carry bit, overflow bit, and a field
specifying the number of bytes to be transferred by a Load String Word Indexed (lswx) or Store String Word Indexed (stswx)
instruction.
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5.1.7.2. Supervisor-Level SPRs
The 603p also contains SPRs that can be accessed only by supervisor-level software. These registers consist of the following :
D The 32-bit DSISR defines the cause of data access and alignment exceptions.
D The data address register (DAR) is a 32-bit register that holds the address of an access after an alignment or DSI exception.
D Decrementer register (DEC) is a 32-bit decrementing counter that provides a mechanism for causing a decrementer exception
after a programmable delay.
D The 32-bit SDR1 specifies the page table format used in virtual-to-physical address translation for pages. (Note that physical
address is referred to as real address in the architecture specification).
D Themachinestatussave/restoreregister0(SRR0)isa32-bitregisterthatisusedbythe603pforsavingtheaddressoftheinstruc-
tion that caused the exception, and the address to return to when a Return from Interrupt (rfi) instruction is executed.
D The machine status save/restore register 1 (SRR1) is a 32-bit register used to save machine status on exceptions and to restore
machine status when an rfi instruction is executed.
D The 32-bit SPRG0-SPRG3 registers are provided for operating system use.
D The external access register (EAR) is a 32-bit register that controls access to the external control facility through the External
Control In Word Indexed (eciwx) and External Control Out Word Indexed (ecowx) instructions.
D The time base register (TB) is a 64-bit register that maintains the time of day and operates interval timers. The TB consists of two
32-bit fields - time base upper (TBU) and time base lower (TBL).
D The processor version register (PVR) is a 32-bit, read-only register that identifies the version (model) and revision level of the
PowerPC processor.
D Block address translation (BAT) arrays - The PowerPC architecture defines 16 BAT registers, divided into four pairs of data BATs
(DBATs) and four pairs of instruction BATs (IBATs). See Figure 15 for a list of the SPR numbers for the BAT arrays.
The following supervisor-level SPRs are implementation-specific to the 603p :
D The DMISS and IMISS registers are read-only registers that are loaded automatically upon an instruction or data TLB miss.
D The HASH1 and HASH2 registers contain the physical addresses of the primary and secondary page table entry groups (PTEGs).
D The ICMP and DCMP registers contain a duplicate of the first word in the page table entry (PTE) for which the table search is
looking.
D The required physical address (RPA) register is loaded by the processor with the second word of the correct PTE during a page
table search.
D The hardware implementation (HID0 and HID1) registers provide the means for enabling the 603p”s checkstops and features,
and allows software to read the configuration of the PLL configuration signals.
D The instruction address breakpoint register (IABR) is loaded with an instruction address that is compared to instruction addresses
in the dispatch queue. When an address match occurs, an instruction address breakpoint exception is generated.
Figure 15 shows all the 603p registers available at the user and supervisor level. The number to the right of the SPRs indicate the
number that is used in the syntax of the instruction operands to access the register.
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(1) These registers are 603p-specific registers. Tey may not be supported by other PowerPC processors.
Figure 15 : PowerPC microprocessor programming model - Register
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5.2. Instruction set and addressing modes
The following subsections describe the PowerPC instruction set and addressing modes in general.
5.2.1. PowerPC instruction set and addressing modes
All PowerPC instructions are encoded as single-word (32-bit) opcodes. Instruction formats are consistent among all instruction
types, permitting efficient decoding to occur in parallel with operand accesses. This fixed instruction length and consistent format
greatly simplifies instruction pipelining.
5.2.1.1. PowerPC instruction set
The PowerPC instructions are divided into the following categories :
D Integer instructions - These include computational and logical instructions.
- Integer arithmetic instructions.
- Integer compare instructions.
- Integer logical instructions.
- Integer rotate and shift instructions.
D Floating-point instructions -These include floating-point computational instructions, as well as instructions that affect the
FPSCR.
- Floating-point arithmetic instructions.
- Floating-point multiply/add instructions.
- Floating-point rounding and conversion instructions.
- Floating-point compare instructions.
- Floating-point status and control instructions.
D Load/store instructions - These include integer and floating-point load and store instructions.
- Integer load and store instruction.
- Integer load and store multiple instructions.
- Floating-point load and store.
- Primitives used to construct atomic memory operations (lwarx and stwcx. instructions).
D Flow control instructions - These include branching instructions, condition register logical instructions, trap instructions, and
other instructions that affect the instruction flow.
- Branch and trap instructions.
- Condition register logical instructions.
D Processor control instructions - These instructions are used for synchronizing memory accesses and management of caches,
TLBs, and the segment registers.
- Move to/from SPR instructions.
- Move to/from MSR.
- Synchronize.
- Instruction synchronize.
D Memory control instruction - These instructions provide control of caches, TLBs, and segment registers.
- Supervisor-level cache management instructions.
- User-level cache instructions.
- Segment register manipulation instructions.
- Translation lookaside buffer management instructions.
Note that this grouping of the instructions does not indicate which execution unit executes a particular instruction or group of instruc-
tions.
Integer instructions operate on byte, half-word, and word operands. Floating-point instructions operate on single-precision (one
word) and double-precision (one double word) floating-point operands. The PowerPC architecture uses instructions that are four
bytes long and word-aligned. It provides for byte, half-word, and word operand loads and stores between memory and a set of 32
GPRs. It also provides for word and double-word operand loads and stores between memory and a set of 32 floating-point registers
(FPRs).
Computational instructions do not modify memory. To use a memory operand in a computation and then modify the same or another
memory location, the memory contents must be loaded into a register, modified, and then written back to the target location with
distinct instructions.
PowerPC processors follow the program flow when they are in the normal execution state. However, the flow of instructions can be
interrupteddirectly by the execution of an instruction or by an asynchronous event. Either kind of exception may cause one ofseveral
components of the system software to be invoked.
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5.2.1.2. Calculating effective addresses
The effective address (EA) is the 32-bit address computed by the processor when executing a memory access or branch instruction
or when fetching the next sequential instruction.
The PowerPC architecture supports two simple memory addressing modes :
D EA = (RA|0) + offset (including offset = 0) (register indirect with immediate index).
D EA = (RA|0) + rB (register indirect with index).
These simple addressing modes allow efficient address generation for memory accesses. Calculation of the effective address for
aligned transfers occurs in a single clock cycle.
For a memory access instruction, if the sum of the effective address and the operand length exceeds the maximum effective address,
the memory operand is considered to wrap around from the maximum effective address to effective address 0.
Effective address computations for both data and instruction accesses use 32-bit unsigned binary arithmetic. A carry from bit 0 is
ignored in 32-bit implementations.
5.2.2. PowerPC 603p microprocessor instruction set
The 603p instruction set is defined as follows :
D The 603p provides hardware support for all 32-bit PowerPC instructions.
D The 603p provides two implementation-specific instructions used for software table search operations following TLB misses :
- Load Data TLB Entry (tlbld).
- Load Instruction TLB Entry (tlbli).
D The 603p implements the following instructions which are defined as optional by the PowerPC architecture :
- External Control In Word Indexed (eciwx).
- External Control Out Word Indexed (ecowx).
- Floating Select (fsed).
- Floating Reciprocal Estimate Single-Precision (fres).
- Floating Reciprocal Square Root Estimate (frsqrte).
- Store Floating-Point as Integer Word (stfiwx).
5.3. Cache implementation
The following subsections describe the PowerPC architecture’s treatment of cache in general, and the 603p specific implementation,
respectively.
5.3.1. PowerPC cache characteristics
The PowerPC architecture does not define hardware aspects of cache implementations. For example, some PowerPC processors,
including the 603p, have separate instruction and data caches (harvare architecture), while others, such as the PowerPC 601
microprocessor, implement a unified cache.
PowerPC microprocessor control the following memory access modes on a page or block basis :
D Write-back/write-through mode.
D Cache-inhibited mode.
D Memory coherency.
Note that in the 603p, a cache line is defined as eight words. The VEA defines cache management instructions that provide a means
by which the application programmer can affect the cache contents.
5.3.2. PowerPC 603p microprocessor cache implementation
The 603p has two 16-Kbyte, four-way set-associative (instruction and data) caches. The caches are physically addressed, and the
data cache can operate in either write-back or write-through mode as specified by the PowerPC architecture.
The data cache is configured as 128 sets of 4 lines each. Each line consists of 32 bytes, two state bits, and an address tag. The two
state bits implement the three-state MEI (modified/exclusive/invalid) protocol. Each line contains eight 32-bit words. Note that the
PowerPC architecture defines the term block as the cacheable unit. For the 603p, the block size is equivalent to a cache line. A block
diagram of the data cache organization is shown in Figure 16.
The instruction cache also consists of 128 sets of 4 lines, and each line consists of 32 bytes, an address tag, and a valid bit. The
instructioncachemaynotbewrittentoexceptthroughalinefilloperation. Theinstructioncacheisnotsnooped, andcachecoherency
must be maintained by software. A fast hardware invalidation capability is provided to support cache maintenance. The organization
of the instruction cache is very similar to the data cache shown in Figure 16.
Each cache line contains eight contiguous words from memory that are loaded from an 8-word boundary (that is, bits A27-A32 of the
effective addresses are zero) ; thus, a cache line never crosses a page boundary. Misaligned accesses across a page boundary can
incur a performance penalty.
The 603’s cache lines are loaded in four beats of 64 bits each. The burst load is performed as ”critical double word first”. The cache
that is being loaded is blocked to internal accesses until the load completes. The critical double word is simultaneously written to the
cache and forwarded to the requesting unit, thus minimizing stalls due to load delays.
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To ensure coherency among caches in a multiprocessor (or multiple caching-device) implementation, the 603p implemements the
MEI protocol. These three states, modified, exclusive, and invalid, indicate the state of the cache block as follows :
D Modified - The cache line is modified with respect to system memory ; that is, data for this address is valid only in the cache and
not in system memory.
D Exclusive - This cache line holds valid data that is identical to the data at this address in system memory. No other cache has
this data.
D Invalid - This cache line does not hold valid data.
Cache coherency is enforced by on-chip bus snooping logic. Since the 603p’s data cache tags are single ported, a simultaneous load
or store and snoop access represent a resource contention. The snoop access is given first access to the tags. The load or store then
occurs on the clock following snoop.
Figure 16 : Data cache organization
5.4. Exception model
The following subsections describe the PowerPC exception model and the 603p implementation, respectively.
5.4.1. PowerPC exception model
The PowerPC exception mechanism allows the processor to change to supervisor state as a result of external singles, errors, or
unusual conditions arising in the execution of instructions, and differ from the arithmetic exceptions defined by the IEEE for floating-
point operations. When exceptions occur, information about the state of the processor is saved to certain registers and the processor
begins execution at an address (exception vector) predetermined for each exception. Processing of exceptions occurs in supervisor
mode.
Althoughmultipleexceptionconditionscanmaptoasingleexceptionvector, amorespecificconditionmaybedeterminedbyexamin-
ingaregisterassociatedwiththeexception -forexample, theDSISRandtheFPSCR. Additionally, someexceptionconditionscanbe
explicitly enable or disabled by software.
The PowerPC architecture requires that exceptions be handled in program order ; therefore, although a particular implementation
may recognize exception conditions out of order, they are presented strictly in order. When an instruction-caused exception is recog-
nized, any unexecuted instructions that appear earlier in the instruction stream, including any that have not yet entered the execute
state, arerequiredtocompletebeforetheexceptionistaken. Anyexceptionscausedbythoseinstructionsarehandledfirst. Likewise,
exceptions that are asynchronous and precise are recognized when they occur, but are not handled until the instruction currently in
the completion state successfully completes execution or generates an exception, and the completed store queue is emptied.
Unless a catastrophic causes a system reset or machine check exception, only one exception is handled at a time. If, for example, a
singleinstructionencountersmultipleexceptionconditions, thoseconditionsareencounteredsequentially. Aftertheexceptionhand-
ler handles an exception, the instruction execution continues until the next exception condition is encountered. However, in many
cases there is no attempt to re-execute the instruction. This method of recognizing and handling exception conditions sequentially
guarantees that exceptions are recoverable.
Exception handlers should save the information stored in SRR0 and SRR1 early to prevent the program state from being lost due to a
system resetandmachinecheckexceptionortoaninstruction-causedexceptionintheexceptionhandler, andbeforeenablingexter-
nal interrupts.
The PowerPC architecture support four types of exceptions :
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D Synchronous, precise - These are causes by instructions. All instruction-caused exceptions are handled precisely ; that is, the
machine state at the time the exception occurs is known and can be completely restored. This means that (excluding the trap and
system call exceptions) the address of the faulting instruction is provided to the exception handler and that neither the faulting
instruction nor subsequent instructions in the code stream will complete execution before the exception is taken. Once the excep-
tionisprocessed, executionresumesattheaddressofthefaultinginstruction(oratanalternateaddressprovidedbytheexception
handler). When an exception is taken due to an trap or system call instruction, execution resumes at an address provided by the
handler.
D Synchronous, imprecise - The PowerPC architecture defines two imprecise floating-point exception modes, recoverable and
nonrecoverable. Even though the 603p provides a means to enable he imprecise modes, it implements these modes identically
to the precise mode (-hat is, all enabled floating-point enabled exceptions are always precise on the 603p).
D Asynchronous, maskable - The external, SMI, and decrementer interrupts are maskable asynchronous exceptions. When
these exceptions occur, their handling is postponed until the next instruction, and any exceptions associated with that instruction,
completes execution. If there are no instructions in the execution units, the exception is taken immediately upon determination
of the correct restart address (for loading SRR0).
D Asynchronous, non maskable - There are two non maskable asynchronous exceptions : system reset and the machine check
exception. These exceptions may not be recoverable, or may provide a limited degree of recoverability. All exceptions report
recoverability through the SMR[RI] bit.
5.4.2. PowerPC 603p microprocessor exception model
AspecifiedbythePowerPCarchitecture, all603pexceptionscanbedescribedaseitherpreciseorimpreciseandeithersynchronous
or asynchronous. Asynchronous exceptions (some or which are maskable) are caused by events external to the processor’s execu-
tion ; synchronous exceptions, which are all handled precisely by the 603p, are caused by instructions. The 603p exception classes
are shown in Table 14.
Synchronous/Asynchronous
precise/Imprecise
Exception type
Asynchronous, non maskable
Imprecise
Machine check
System reset
Asynchronous, maskable
Synchronous
Precise
Precise
External interrupt
Decrementer
System management interrupt
Instruction-caused exceptions
Table 15 : PowerPC 603p microprocessor exception classifications
Although exceptions have other characteristics as well, such as whether they are maskable or non maskable, the distinctions shown
in Table 15 define categories of exceptions that the 603p handles uniquely. Note that Table 15 includes no synchronous imprecise
instructions. While the PowerPC architecture supports imprecise handling of floating-point exceptions, the 603p implements these
exception modes as precise exceptions.
The 603p’s exceptions, and conditions that cause them, are listed in Table 16. Exceptions that are specific to the 603p are indicated.
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Table 16 : Exceptions and conditions
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5.5. Memory management
The following subsections describe the memory management features of the PowerPC architecture, and the 603p implementation,
respectively.
5.5.1. PowerPC memory management
The primary functions of the MMU are to translate logical (effective) addresses to physical addresses for memory accesses, and to
provide access protection on blocks and pages of memory.
There are two types of accesses generated by the 603p that require address translation - instruction accesses, and data accesses to
memory generated by load and store instructions.
The PowerPC MMU and exception model support demand-paged virtual memory. Virtual memory management permits execution of
programs larger than the size of physical memory ; demand-paged implies that individual pages are loaded into physical memory
from system memory only when they are first accessed by an executing program.
The hashed page table is a variable-sized data structure that defines the mapping between virtual page numbers and physical page
numbers. The page table size is a power of 2, and its starting address is a multiple of its size.
The page table contains a number of page table entry groups (PTEGs). A PTEG contains eight page table entries (PTEs) of eight
bytes each ; therefore, each PTEG is 64 bytes long. PTEG addresses are entry points for table search operations.
Address translations are enabled by setting bits in the MSR-MSR[IR] enables instruction address translations and MSR[DR] enables
data address translations.
5.5.2. PowerPC 603p microprocessor memory management
The instruction and data memory management units in the 603p provide 4 Gbyte of logical address space accessible to supervisor
and user programs with a 4-Kbyte page size and 256-Mbyte segment size. Block sizes range from 128 Kbyte to 256Mbyte and are
softwareselectable. Inaddition, the603pusesaninterim52-bitvirtualaddressandhashedpagetablesforgenerating32-bitphysical
addresses. The MMUs in the 603p rely on the exception processing mechanism for the implementation of the paged virtual memory
environment and for enforcing protection of designated memory areas.
InstructionanddataTLBsprovideaddresstranslationinparallelwiththeon-chipcacheaccess, incurringnoadditionaltimepenaltyin
the event of a TLB hit. A TLB is a cache of the most recently used page table entries. Software is responsible for maintaining the
consistency of the TLB with memory. The 603p’s TLBs are 64-entry, two-way set-associative caches that containinstructionanddata
address translations. The 603p provides hardware assist for software table search operations through the ashed page table on TLB
misses. Supervisor software can invalidate TLB entries selectively.
The 603p also provides independent four-entry BAT arrays for instructions and data that maintain address translations for blocks of
memory. These entries define blocks that can vary from 128 Kbyte to 256 Mbyte. The BAT arrays are maintained by system software.
As specified by the PowerPC architecture, the hashed page table is a variable-sized data structure that defines the mapping between
virtual page numbers and physical page numbers. The page table size is a power of 2, and its starting address is a multiple of its size.
Also as specified by the PowerPC architecture, the page table contains a number of page table entry groups (PTEGs). A PTEG con-
tainseightpagetableentries(PTEs)ofeightbyteseach;therefore, eachPTEGis64byteslong. PTEGaddressesareentrypointsfor
table search operations.
5.6. Instruction timing
The 603p is a pipelined superscalar processor. A pipelined processor is one in which the processing of an instruction is reduced into
discrete stages. Because the processing of an instruction is broken into a series of stages, an instruction does not require the entire
resources of an execution unit. For example, after an instruction completes the decode stage, it can pass on to the next stage, while
the subsequent instruction can advance into the decode stage. This improves the throughput of the instruction flow. For example, it
may take three cycles for a floating-point instruction to complete, but if there are no stalls in the floating-point pipeline, a series of
floating-point instructions can have a throughput of one instruction per cycle.
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The instruction pipeline in the 603p has four major pipeline stages, described a follows :
D The fetch pipeline stage primarily involves retrieving instructions from the memory system and determining the location of thenext
instruction fetch. Additionally, the BPU decodes branches during the fetch stage and folds out branch instructions before the dis-
patch stage if possible.
D The dispatch pipeline stage is responsible for decoding the instructions supplied by the instruction fetch stage, and determining
which of the instructions are eligible to be dispatched in the current cycle. in addition, the source operands of the instructions are
read from the appropriate register file and dispatched with the instruction to the execute pipeline stage. At the end of the dispatch
pipeline stage, the dispatched instructions and their operands are latched by the appropriate execution unit.
D During the execute pipeline stage each execution unit that has an executable instruction executes the selected instruction (per-
haps over multiple cycles), writes the instruction’s result into the appropriate rename register, and notifies the completion stage
that the instruction has finished execution. In the case of an internal exception, the execution unit reports the exception to the
completion/writeback pipeline stage and discontinues instruction execution until the exception is handled. The exception is not
signaled until that instruction is the next to be completed. Execution of most floating-point instructions is pipelined within the FPU
allowingup to three instructions to be executing in the FPU concurrently. The pipeline stages for the floating-point unit aremultiply,
add, and round-convert. Execution of most load/store instructions is also pipelined. The load/store units has two pipeline stages.
ThefirststageisforeffectiveaddresscalculationandMMUtranslationandthesecondstageisforaccessingthedatainthecache.
D The complete/writeback pipeline stage maintains the correct architectural machine state and transfers the contents of the rename
registers to the GPRs and FPRs as instructions are retired. If the completion logic detects an instruction causing an exception,
all following instructions are cancelled, their execution results in rename registers are discarded, and instructions are fetched from
the correct instruction stream.
A superscalar processor is one that issues multiple independent instructions intomultiplepipelinesallowinginstructionstoexecutein
parallel. The 603p has five independent execution units, one each for integer instructions, floating-point instructions, branch instruc-
tions, load/store instructions, and system register instructions. The IU and the FPU each have dedicated register files for maintaining
operands (GPRs and FPRs, respectively), allowing integer calculations and floating-point calculations to occur simultaneously with-
out interference.
Because the PowerPC architecture can be applied to such a wide variety of implementations, instruction timing among various Pow-
erPC processors varies accordingly.
6.PREPARATION FOR DELIVERY
6.1. Packaging
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
6.2. Certificate of compliance
TCSoffersacertificateofcomplianceswitheachshipmentofparts, affirmingtheproductsareincomplianceeitherwithMIL-STD-883
and guarantying the parameters not tested at temperature extremes for the entire temperature range.
7.HANDLING
MOS devices must be handled with certain precautions to avoid damage due to accumulation of static charge. Input protection devi-
ces have been designed in the chip to minimize the effect of this static buildup. However, the following handling practices are recom-
mended :
a) Devices should be handled on benches with conductive and grounded surfaces.
b) Ground test equipment, tools and operator.
c) Do not handle devices by the leads.
d) Store devices in conductive foam or carriers.
e) Avoid use of plastic, rubber, or silk in MOS areas.
f) Maintain relative humidity above 50 percent if practical.
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TSPC603P
8.PACKAGE MECHANICAL DATA
8.1. 240 pins - CQFP
Notes :
1. Dimensioning and tolerancing per
ASME Y14.5M–1994
2. Controlling dimension : millimeter.
3. Datum plane H is located at bottom of
lead and is coincident with the lead
where the lead exits the ceramic body at
the bottom of the parting line.
4. Datum L. M and N to be determined
at datum plane H.
5. Dimension S and V to be determined
at seating plane T.
6. Dimension A and B define maximum
ceramic body dimensions including
glass protrusion and top and bottom
mismatch.
MILLIMETERS
DIM
A
B
MIN
TYP
MAX
31.75
31.75
4.15
30.86
30.86
3.67
31.00
31.00
3.95
C
D
E
0.185
3.10
0.220
3.50
0.270
3.90
F
0.175
0.200
0.50 BSC
2.100
0.147
0.50
0.225
G
HE
J
2.025
0.130
0.45
2.175
0.175
0.55
K
P
S
U
V
W
Y
Z
AA
AB
q2
0.25 BSC
34.58
17.30
34.58
0.50
17.30
0.127
1.80 REF
0.95 REF
4°
34.41
17.20
34.41
0.25
17.20
0.122
34.75
17.40
34.75
0.75
17.40
0.132
1°
7°
Figure 17 : Mechanical dimensions of the Wire-bond CQFP package
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TSPC603P
8.2. BGA package description
The following sections provide the package parameters and mechanical dimensions for the CBGA packages.
8.2.1.Package parameters
The package parameters are as provided in the following list. The package type is 21 mm, 255-lead ceramic ball grid array (CBGA).
Package outline . . . . . . . . . . . 21 mm
Interconnects . . . . . . . . . . . . . 255
Pitch . . . . . . . . . . . . . . . . . . . . . 1.27 mm
maximum module height . . . 3.16 mm
8.2.2.Mechanical dimensions of the BGA package
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package.
NOTES :
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M 1994
2. CONTROLLING DIMENSION :
MILLIMETER
MILLIMETERS
MIN
INCHES
MAX
DIM
A
MAX
MIN
0.827 BSC
0.827 BSC
21.000 BSC
21.000 BSC
B
2.300
0.820
C
D
3.160
0.830
0.124
0.036
0.081
0.032
G
H
1.270 BSC
0.050 BSC
0.039
0.790
0.990 0.031
K
N
P
0.635 BSC
0.025 BSC
16.000
5.000
0.630
0.197
5.000 16.000
0.197 0.630
Figure 18 : Mechanical dimensions and bottom surface nomenclature of the CBGA package
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TSPC603P
9.CLOCK RELATIONSHIPS CHOICE
The 603p microprocessors offer customers numerous clocking options. An internal phase-lock loop synchronizes the processor
(CPU) clock to the bus or system clock (SYSCLK) at various ratios.
Inside each PowerPC microprocessor is a phase-lock loop circuit. A voltage controlled oscillator (VCO) is precisely controlled in
frequency and phase by a frequency/phase detector which compares the input bus frequency (SYSCLK frequency) to a submultiple
of the VCO.
The ratio of CPU to SYSCLK frequencies is often referred to as the bus mode (for example, 2:1 bus mode).
In the Table 17, the horizontal scale represents the bus frequency (SYSCLK) and the vertical scale represents the PLL–CFG[0–3]
signals.
For a given SYSCLK (bus) frequency, the PLL configuration signals set the internal CPU and VCO frequency of operation.
Table 17 : CPU frequencies for common bus frequencies and multipliers
CPU Frequency in MHZ (VCO Frequency in MHz)
PLL_CFG[0–3]
Bus–to–
Core
Multiplier Multiplier
Core–to
VCO
Bus
25 MHz
Bus
33.33
MHz
Bus
40 MHz
Bus
50 MHz
Bus
60 MHz
Bus
66.67
MHz
0100
0101
0110
1000
1110
1010
0111
1011
1001
1101
2x
2x
4x
2x
2x
2x
2x
2x
2x
2x
2x
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
133
(266)
2x
–
2.5x
3x
125
(250)
150
(300)
166
(333)
150
(300)
180
(360)
200
(400)
3.5x
4x
140
(280)
175
(350)
210
(420)
–
–
–
–
–
–
133
(266)
160
(320)
200
(400)
–
–
–
–
–
4.5x
5x
150
(300)
180
(360)
–
–
–
–
125
(250)
166
(333)
200
(400)
5.5x
6x
137
(275)
183
(366)
–
150
(300)
200
(400)
–
0011
1111
PLL bypass
Clock off
Notes :
1. Some PLL configurations may select bus, CPU or VCO frequencies which are not supported
2. In PLL–bypass mode, the SYSCLK input signal clocks the internal processor directly, the PLL is disabled, and
the bus mode is set for 1:1 mode operation. This mode is intended for factory use only.
Note : the AC timing specifications given in this document do not apply in PLL–bypass mode.
3. In clock–off mode, no clocking occurs inside the 603e regardless of the SYSCLK input.
37/38
TSPC603P
10. ORDERING INFORMATION
TS (X) PC603P M A B / Q 6
L
E
Revision level
E : Rev. 2.1.1
(1)
TCS prefix
Prototype
Type
Bus divider
L
:
Any bus ≤ 66 MHz
Temperature range : Tc
M : –55, +125 °C
V : –40, +110 °C
(2)
Max internal processor speed
6
8
: 166 MHz
: 200 MHz
Package :
A
:
:
CERQUAD
CBGA
G
(2)
Screening level
:
__ : Standard
B/Q : MIL-STD-883, class Q
B/T : according to MIL-STD-883
Upscreening
U/T : Upscreening + burn-in
U
:
(1) THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES
(2) For availability of the different versions, contact your TCS sale office
Information furnished is believed to be accurate and reliable. However THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES
assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of THOM-
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This publication supersedes and replaces all information previously supplied. THOMSON-CSF SEMICONDUCTEURS SPECIFI-
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from THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES.
The PowerPC names and logo type are trademarks of International Business Machines Corporation, used under licence
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