ATS-51170D-C2-R0 [ATS]
Ultra High Performance BGA Cooling; 超高性能的BGA供冷
| 型号： | ATS-51170D-C2-R0 |
| 厂家： | 
Advanced Thermal Solutions |
| 描述： | Ultra High Performance BGA Cooling |
| 文件： | 总1页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ultra High Performance BGA Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-51170D-C2-R0
Features & Benefits
D
C
»
maxiFLOW™ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
»
»
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
B
A
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
»
»
Comes preassembled with high performance, phase
changing, thermal interface material
Designed for low profile components from 1.5 to 2.99mm
ꢁhermal Performance
*Image above is for illustration purposes only.
AIR VELOCITy
THERMAL RESISTANCE
FT/MIN
200
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
12.6
18.5
15.1
13.1
11.7
10.7
9.9
300
400
500
600
700
800
9.3
Product Details
INTERFACE MATERIAL
SAINT-GOBAIN C1100F
DIMENSION A
17 mm
DIMENSION B
DIMENSION C
DIMENSION D
FINISH
17 mm
9.5 mm
28.4 mm
BLACK- ANODIZED
Nꢀꢁꢂꢃ:
1)
2)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
ATS-51170D-C1-R0 is a subsitute item available utilizing an equivalent phase change
material (Chomerics T766).
3)
4)
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
5)
6)
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV1_0908
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