ATS-53190D-C2-R0 [ATS]
High Performance BGA Cooling; 高性能BGA散热
| 型号： | ATS-53190D-C2-R0 |
| 厂家： | 
Advanced Thermal Solutions |
| 描述： | High Performance BGA Cooling |
| 文件： | 总1页 (文件大小：283K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Performance BGA Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-53190D-C2-R0
D
Features & Benefits
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»
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High aspect ratio, straight fin heat sinks that are ideal for
compact PCB environments
C
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
A
B
Designed specifically for BGAs and other surface mount
packages
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock
Testing and Unpackaged Drop Testing standards
»
Comes preassembled with high performance, phase
changing, thermal interface material
ꢁhermal Performance
*Image above is for illustration purposes only.
AIR VELOCITy
THERMAL RESISTANCE
FT/MIN
200
M/S
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
11.6
22
300
17.5
15.1
13.5
12.3
11.4
10.7
400
500
600
700
800
Product Details
INTERFACE MATERIAL
SAINT-GOBAIN C1100F
BLACK-ANODIZED
DIMENSION A
19 mm
DIMENSION B
DIMENSION C
DIMENSION D
FINISH
19 mm
9.5 mm
19 mm
Nꢀꢁꢂꢃ:
1)
2)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
ATS-53190D-C1-R0 is a subsitute item available utilizing an equivalent phase change
material (Chomerics T766).
3)
4)
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
5)
6)
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT190
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV1_0908
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