AFBR-2541CZ [AVAGO]
DCâ¦5 Megabaud Versatile Link Fiber Optic Receiver for 1mm POF and 200μm PCS;
| 型号： | AFBR-2541CZ |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | DCâ¦5 Megabaud Versatile Link Fiber Optic Receiver for 1mm POF and 200μm PCS PCS 过程控制系统 光纤 |
| 文件： | 总9页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFBR-25x1CZ
DC…5 Megabaud Versatile Link Fiber Optic Receiver
for 1mm POF and 200µm PCS
Data Sheet
Description
Features
The AFBR-25x1CZ receiver consists of an IC with an inte- • RoHS-compliant
grated photodiode providing a TTL logic families compat-
• Data transmission at signal rates from DC up to 5MBd
ible output. In combination with the Avago AFBR-15x9Z
or AFBR-16x9Z transmitter any type of signal from DC up
to 5MBd at distances up to 50 meters with 1mm 0.5NA
POF and 500 meters with 200µm 0.37NA PCS is supported.
• Receiver: integrated PIN diode and digitalizing IC with
TTL output logic
• Power-on reset (POR)
• Up to 50 meter distance with 1mm Plastic Optical Fiber
(POF); up to 500 meter distance with 200µm Polymer
Cladding Silica (PCS) Fiber
The receiver is a 4-pin device, packed in Versatile Link
housing. Versatile Link components can be interlocked
(N-plexed together) to minimize space and to provide dual
connections with the duplex connectors. Various simplex
and duplex connectors, as well as POF cables are available
for Versatile Link components. Please contact Avago Tech-
nologies for details or visit our company website at www.
avagotech.com
• Operating temperature range of -40 °C to +85 °C
• Compatible with Avago’s Versatile Link family of
connectors, for easy termination of fiber
Applications
AFBR-25x1CZ devices have inverted output signals means
that light_on will lead to Data_out low.
• Optical Receiver for 5MBd systems and below
• Industrial control and factory automation
• Extension of RS-232 and RS-485
• High voltage insulation
Available options
Horizontal Package
Vertical Package
AFBR-2521CZ
AFBR-2531CZ
AFBR-2541CZ
• Elimination of ground loops
Tilted (30°) Package
• Reduces voltage transient susceptibility
• Drivers and Inverters
Application Literature
Handling
Application Note 1035 (Versatile Link) - AV02-0730EN
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Non-halogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant material and uses the same pad layout as a
standard, eight-pin dual-in-line package. Horizontal,
Vertical, and Tilted (30°) packages are available. These
low profile Versatile Link packages are stackable and are
enclosed to provide a dust-resistant seal. Snap action
simplex, simplex latching, duplex, and duplex latching
connectors are offered with simplex or duplex cables.
Versatile Link components are moisture sensitive devices
and are shipped in a moisture sealed bag. If the compo-
nents are exposed to air for an extended period of time,
they may require a baking step before the soldering
process. Refer to the special labeling on the shipping tube
for details.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connec-
tions. Receiver packages are black and transmitters are in
grey color respectively.
Recommended chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptanes. Other: soap solution, naphtha.
Package Orientation
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential en-
vironmental harm.
Performance and pinouts for the horizontal, vertical, and
tilted (30°) packages are identical. To provide additional
attachment support for the vertical Versatile Link housing
the designer has the option of using a self-tapping screw
through a printed circuit board into a mounting hole at
the bottom of the package. For most applications this is
not necessary.
2
Interlocked (Stacked) Assemblies (refer to Figure 1)
Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units.
To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom.
Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed.
Stacking Horizontal Modules
Stacking Vertical Modules
Figure 1a. Interlocked (stacked) Horizontal packages
Figure 1b. Interlocked (stacked) Vertical packages
Tilted (30°) Module
Figure 1c. Interlocked (stacked) Tilted (30°) packages
3
Mechanical Dimensions
Horizontal Module
Vertical Module
2.03
(0.080)
6.86
(0.270)
5.08
(0.200)
10.16
(0.400)
10.16
(0.400)
2.03
(0.080)
5.08
(0.200)
18.8
(0.74)
18.29
(0.720)
6.86
(0.27)
4.19
(0.165)
0.64
(0.025)
7.62
(0.30)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
18.80
(0.740)
1.27
7.62
0.51
(0.020)
(0.050)
(0.300)
2.54
(0.100)
0.64 (0.025) DIA.
1.85
(0.073)
2.77
(0.109)
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. Mechanical Dimensions - Horizontal packages
Figure 2b. Mechanical Dimensions - Vertical packages
Tilted (30°) Module
A
B
∅0.7
(0.03)
0.4
(0.02)
1.3
(0.05)
1.1
(0.05)
0.5
(0.02)
2.54
(0.100)
7.62
(0.300)
10.1
(0.40)
2.2
(0.09)
8.7
(0.34)
19.3
(0.76)
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2c. Mechanical Dimensions - Tilted (30°) packages
4
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
7.62
(0.300)
2.54
(0.100)
1.01 (0.040) DIA.
4
5
3
2
1
8
TOP VIEW
7.62
TOP VIEW
(0.300)
PCB EDGE
1.85
(0.073)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 3a. PCB Dimensions - Horizontal packages
Figure 3b. PCB Dimensions - Vertical packages
Tilted (30°) Module
7.62
(0.300)
2.54
(0.100)
0.5
(0.02)
1.01
DIA.
(0.040)
Bottom View
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 3c. PCB Dimensions - Tilted (30°) packages
5
Pin Description Receiver
RX
4 3 2 1
Fiber port facing front, pins downward, 1 = Rightmost pin to 4 = Leftmost pin
Pin
1
Name
Function/Description
Notes
Data Out
VEE
Data Output
1, 2
2
Ground
3
VCC
Power Supply 3.3V ± 5% or 5V ± 5%
No function, physical pin is available, recommended to signal GND
Physical pin is available, recommended to chassis GND
Physical pin is available, recommended to chassis GND
4
Pin
3
4
4
5
Housing Pin
Housing Pin
8
Notes:
1. TTL compatible data output
2. Light on at the receiver input will lead to a “low”output signal and light off to a “high”output signal.
3. It is recommended to connect this pin to signal GND
4. Pin 5 and 8 are for mounting and retaining purposes and should be connected to chassis GND.
Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge (ESD) to the Electrical Pins Human Body Model MIL-STD-883 Method 3015
Min +/- 2000V
Eye Safety
IEC 60825-1,2 ,Class 1
Specified Link Performance, T = -40 °C to +85 °C, 5 MBd
A
Parameter
Min.
0.1
Max.
50
Unit
Condition
Notes
Link Distance with POF cable
Link Distance with PCS
Notes:
meters
meters
-40°C to +85°C
-40°C to +85°C
5, 7
6, 7
0.1
500
5. HFBR-R/EXXYYYZ is the part number for 1mm POF. Worst case attenuation used (0.27dB/m for standard loss POF cable from -40°C to +85°C at
660nm).
6. PCS, worst case attenuation (12dB/km from -40°C to +85°C at 650nm)
7. The optical link performance is guaranteed only with transmitters AFBR-15x9Z (>20mA forward current) or AFBR-16x9Z
Recommended Application Circuit
GND
VCC
L2
4
NC
VCC
1 µH
3
C4
100 nF
C2
C6
10 µF
RX
2
1
VEE
Data Out
10 µF
GND
GND
TTL Output
GND
GND
GND
Figure 4. Recommended Application Circuit
6
Absolute Maximum Ratings
Parameter
Symbol
TS
Min.
–40
-40
0
Typ.
Max.
95
85
85
6
Unit
°C
Notes
Storage Temperature
Ambient Temperature
Relative Humidity
Supply Voltage
Data Output Current
Data Rate
1
1
1
1
1
TC
°C
RH
%
VCC
IO
–0.5
V
10
5
mA
MBd
DC
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time.
Recommended Operating Conditions
Parameter
Symbol
TA
Min.
-40
Typ.
25
3.3
5
Max.
85
Unit
°C
V
Notes
Ambient Temp
Supply Voltage
2
2
2
VCC
3.135
4.75
3.465
5.25
V
Notes:
2. Recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied,
and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specific reliability performance.
Process Compatibility
Parameter
Symbol
TSOLD
tSOLD
Min.
Typ.
Max.
260
10
Unit
°C
Notes
3, 5, 6
4, 5, 6
Solder Environment
sec
Notes:
3. Maximum temperature refers to peak temperature.
4. Maximum time refers to time spent at peak temperature.
5. Solder surface to be at least 1.6mm below lead frame stops.
6. Product is moisture sensitive level 3.
7
AFBR-25x1CZ Receiver
The AFBR-25x1CZ receiver consists of a digitalizing IC with integrated photodiode to produce an output level that is
compatible with TTL logic. The integrated photodiode and the following amplifier use a fully differential approach with
an active and a passive area for an improved EMI performance. Within the specified ranges the AFBR-25x1CZ devices
support a BER <10E-9.
Receiver Electrical Characteristics
(T = -40 °C to +85 °C, V = 3.3 V 5% or 5 V 5%)
A
CC
Parameter
Supply Current
Symbol
Min
Typical
Max
10
Unit
mA
V
Notes
1
ICC
6
Data Output Voltage – Low
Data Output Voltage – High
Rise Time (10%–90%)
Fall Time (90%–10%)
VOL
–0.3
2.5
0.4
2
VOH
Vcc+0.3
10
V
2
tR
ns
ns
ns
ns
ns
V
3
tF
10
3
Pulse Width Distortion
Propagation Delay
PWD
-30
30
3, 4, 5, 6
3, 4
3, 4, 7
1, 8
1, 8
1, 8
tD
60
Propagation Skew
tskew
20
Vcc level to deactivate POR
Vcc level to activate POR
POR deactivate delay time
VPOR_DEACT
VPOR_ACT
tPOR_DEACT_DEL
2.8
2.6
100
V
µs
Receiver Optical Characteristics
(T = -40 °C to +85 °C, V = 3.3 V 5% or 5 V 5%)
A
CC
Parameter
Symbol
PIN
Min
-24
-26
-40
-43
630
Typical
Max
1
Unit
dBm
dBm
dBm
dBm
nm
Notes
9
Input Optical Power POF (Peak)
Input Optical Power PCS (Peak)
Input Optical Power Off-State POF
Input Optical Power Off-State PCS
Optical Spectrum Range
PIN
-2
10
9
PIN_Off
PIN_Off
λ
10
685
Notes:
1. Typical values measured at 25°C and 5V
2. Standard TTL output.
3. Measured with RL =1MW and C =20pF
L
4. Guaranteed only if optical input signal is generated by AFBR-15x9Z or AFBR-16x9Z, with ideal alignment to the photodiode using a 1mm POF
(NA=0.5).
5. Optical input of 5MBaud PRBS-7 pattern and 50 % duty cycle. Input rise time (10%-90%)<=20ns, Input fall time (90%-10%)<=20ns
6. Pulse width is measured at 50% threshold using a rising edge trigger and PRBS-7 pattern.
7. Only valid for same input signal characteristics and environmental conditions. Optical input power has to be >=-21dBm
8. Power-on reset (POR) is active below V . Once V
POR_DEACT
is reached the POR remains active for t
. During power down POR
POR_DEACT
POR_DEACT_DEL
starts at V
. Refer to figure 5 (next page).
POR_ACT
9. Measured at the end of a 0.5m POF (1mm 0.5 NA) with a large area optical detector
10. Measured at the end of a 0.5m PCS (200µm, 0.37 NA) with a large area optical detector
8
Data_In
(optical)
time
VPOR_DEACT
POR disabled at ~ 2.8V
V POR_ACT
POR enabled at ~ 2.6V
VCC
~100µs
delay
time
Data_Out
time
Data_Out =
Inverted Data_In (optical)
Figure 5. Typical functionality of Power-on reset (POR)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-4783EN - March 31, 2015
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