AMMP-6130 [AVAGO]
30 GHz Power Amplifier with Frequency Multiplier (x2); 30 GHz功率放大器与倍频（×2）
| 型号： | AMMP-6130 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 30 GHz Power Amplifier with Frequency Multiplier (x2) |
| 文件： | 总8页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AMMP-6130
30 GHz Power Amplifier with Frequency Multiplier (x2)
in SMT Package
Data Sheet
Features
Description
Avago Technologies AMMP-6130 is a high gain,
narrowband doubler and output power amplifier
designed for DBS applications and other commercial
communication systems. The MMIC takes an input 15
GHz signal and passes it through a harmonic frequency
multiplier (x2) and then three stages of power
amplification. Integrated matching structures filter and
match input/output to 50 Ω. It has integrated input
and output DC blocking capacitors and bias structures
to all stages. The MMIC is fabricated using PHEMT
technology. The backside of this package part is both
RF and DC ground. This helps simply the assembly
process and reduces assembly related performance
variations and costs. The surface mount package allows
elimination of “chip & wire” assembly for lower cost.
This MMIC is a cost effective alternative to hybrid
(discrete-FET) amplifiers that require complex tuning
and assembly process.
• 5x5 mm Surface Mount Package
• Integrated DC Block and Choke
• 50 Ω Input and Output Match
• Single Positive Supply Pin
• No Negative Gate Bias
Specifications (Vd=4.5V, Idd=200mA)
• Frequency Range 15GHz in, 30GHz out
• Output Power: 21 dBm
• Harmonic Suppression: 60dBc
• Single Positive Supply
• DC Requirements: 4.5V, 200mA
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• Broadband Wireless Access)
Surface Mount Package, 5.0 x 5.0 x 1.25 mm
Pin Connections (Top View)
Pin
1
2
Function
Vd
1
2
3
3
4
RFOut
5
8
4
X2
6
7
8
RF In
7
6
5
PACKAGE
BASE
GND
Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure
that an ESD approved carrier is used when units are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices. The manufacturer
assumes no responsibilities for ESD damage due to improper storage and handling of these devices.
(1)
(2)
Absolute Maximum Ratings
DC Specifications/ Physical Properties
Sym Parameters/Condition
Vdd Drain to Ground Voltage
Idd Drain Current
Unit Max
Parameter and
Sym Test Condition
Unit Min Typ Max
200 250
V
5
Idd Drain Supply Current mA
under any RF power
drive and temp.
mA
300
Pin
RF CW Input Power Max
dBm 15
(Vd=4.5 V)
Tch Max channel temperature
Tstg Storage temperature
C
C
C
+150
Vd
Drain Supply Voltage
Thermal Resistance(3) C/W
V
3.5 4.5
45
5
-65 +150
θjc
Tmax Maximum Assembly Temp
260 for 20s
Notes.
2. Ambient operational temperature TA=25°C unless noted
1. Operation in excess of any of these conditions may result in
permanent damage to this device. The absolute maximum ratings
for Vdd, Idd and Pin were determined at an ambient temperature
of 25°C unless noted otherwise.
3. Channel-to-backside Thermal Resistance (Tchannel = 34°C) as
measured using infrared microscopy. Thermal Resistance at
backside temp. (Tb) = 25°C calculated from measured data.
(4,5)
AMMP-6130 RF Specifications
TA= 25°C, Vdd = 4.5 V, Idd = 200mA, Zo=50 Ω, Pin=5dBm
Symbol
Freq
Parameters and Test Conditions
Operational Frequency
Conversion Gain(4,5)
Frequency Units
Minimum
Maximum Typical
GHz
30
Gain
30
30
30
dB
14
19
18.5
23.5
16
21
60
50
Pout
Output Power(5)
dBm
dBc
dBc
FS
Fundamental Suppression
3rd Harmonic Suppression
3H Sup
Notes.
4. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
5. All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc.
Typical Distribution of Conversion Gain and Output Power based on 1000 parts
StDev = 0.46
StDev = 0.39
Conversion Gain at 30GHz
Output Power at 30GHz
2
AMMP-6130 Typical Performance
(TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50Ω, Pin=3dBm unless otherwise stated)
24
22
20
18
16
14
20
18
16
14
12
10
65
60
55
50
45
40
35
30
25
3dBm
5dBm
4dBm
8
C.G.
2H-1H
6
4
2
29
29.5
30
30.5
31
14
14.5
15
15.5
16
Output Frequency [GHz]
Input Frequency [GHz]
Figure 2. Output Power vs. Output Frequency vs. Input Power
Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq
24
22
20
18
25
20
15
10
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
4V
16
3.5V
2H
1H
3H
5
5V
4.5V
14
0
12
29
29.5
30
Frequency [GHz]
30.5
31
29
29.5
30
30.5
31
Frequency [GHz]
Figure 3. Output Power vs. Output Frequency @ 4 bias levels
Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq
24
20
16
12
0
S11[dB]
S22[dB]
-5
-10
-15
-20
-25
-30
8
14GHz
16GHz
4
0
15GHz
-6
-4
-2
0
2
4
6
13
18
23
28
33
Frequency [GHz]
Pin [dBm]
Figure 5. Output Power vs. Input Power vs. Input Freq
Figure 6. Input and Output Return Loss vs. Freq
24
22
20
18
16
-40C
25C
14
85C
12
29
29.5
30
30.5
31
Frequency [GHz]
Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C &
85C
3
Typical Scattering Parameters [1]
(TA = 25°C, Vdd =4.5 V, IDD = 200 mA, Zin = Zout = 50 Ω)
Freq
S11
S21
S12
S22
GHz dB
Mag
Phase
73.909
-33.368
dB
Mag
Phase
dB
Mag
Phase
96.570
14.797
dB
Mag
Phase
1
-2.166
0.779
0.747
0.669
0.570
0.579
0.620
0.642
0.669
0.720
0.758
0.754
0.696
0.608
0.573
0.471
-80.000 0.000
-55.139 0.002
32.383
-76.478 0.000
-0.425
-1.765
0.952
0.816
0.686
0.452
0.546
0.506
0.466
0.405
0.394
0.435
0.455
0.409
0.321
0.326
0.429
0.471
0.407
-101.410
159.979
61.101
2
-2.531
-3.497
-4.889
-4.747
-4.158
-3.851
-3.490
-2.858
-2.405
-2.455
-3.151
-4.322
-4.834
-8.532
131.860 -64.437 0.001
4.147 -60.915 0.001
-149.666 -61.938 0.001
14.517 -76.478 0.000
3
-148.095 -47.131 0.004
-81.506 -3.270
-167.459 -6.891
-43.361 -5.259
179.115 -5.923
4
81.765
-35.890 0.016
-39.659 0.010
-23.500
-102.375
170.014
79.202
5
-58.704
6
177.213 -42.499 0.008
-90.973 -60.000 0.001
125.799 -52.217 0.002
7
65.073
-40.491 0.009
-38.202 0.012
90.638
-0.484
-6.641
-7.851
8
-47.052
6.552
-50.903 0.003
-19.043
-114.956
158.758
78.557
9
-152.082 -36.449 0.015
115.491 -39.453 0.011
127.728 -51.213 0.003
-65.533 -50.752 0.003
-163.279 -51.057 0.003
107.046 -51.701 0.003
-66.346 -8.101
-143.716 -7.230
143.963 -6.848
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
30.433
-36.924 0.014
-31.920 0.025
-60.545
70.767
-5.502
-7.764
-9.863
-2.902
-169.451 -25.739 0.052
3.617
-53.351 0.002
-100.642
143.433
47.561
73.490
-21.180 0.087
-18.548 0.118
-117.593 -56.773 0.001
110.391 -58.416 0.001
-76.081 -9.730
-115.604 -7.355
176.951 -6.539
114.486 -7.803
-34.070
-17.084 0.140
178.992 -17.566 0.132
-53.423 -17.635 0.131
6.543
-55.139 0.002
-30.885
-107.509
152.353
7.160
-4.491
-3.044
-3.366
-3.044
-2.867
-3.422
-4.695
-4.668
-3.628
-3.951
-6.246
-4.878
-2.704
-2.261
-2.438
-4.679
-3.935
-2.625
-2.781
-1.933
-2.389
-3.601
-3.147
-2.535
0.596
0.704
0.679
0.704
0.719
0.674
0.582
0.584
0.659
0.635
0.487
0.570
0.732
0.771
0.755
0.584
0.636
0.739
0.726
0.800
0.760
0.661
0.696
0.747
-135.344 -54.895 0.002
136.100 -55.918 0.002
-155.503 -23.293 0.068
102.797 -18.655 0.117
53.047
10.720
-10.664 0.293
95.071
-55.650 0.002
-9.247
0.345
0.486
-9.051
-9.450
0.337
0.502
0.629
0.678
0.789
0.909
1.198
1.872
2.716
2.728
2.381
1.764
1.262
0.779
0.635
0.555
-14.777 -50.604 0.003
-145.395 -48.068 0.004
-48.544 -6.265
-113.148
132.293
-67.065
-171.437
116.377
37.539
-108.593 -5.991
162.205 -4.028
-132.798 -11.811 0.257
150.079 -13.966 0.200
82.328
-48.291 0.004
63.767
-3.379
-2.061
-39.850 -47.033 0.004
-163.461 -49.119 0.004
77.624
-10.858 0.287
-51.945
-14.763 -13.856 0.203
-91.783 -26.366 0.048
-133.605 -20.510 0.094
-121.717 -14.933 0.179
154.890 -13.580 0.209
104.130 -19.160 0.110
-154.450 -0.831
115.995 1.569
69.328
-54.425 0.002
-59.027 -63.098 0.001
160.771 -54.425 0.002
-161.333
150.560
94.577
5.230
5.448
-139.262 8.677
123.438 8.718
0.554
-161.843 -51.535 0.003
45.858 -44.883 0.006
-52.956 0.002
112.029
60.389
55.231
7.537
4.931
33.927
-10.134 0.324
-17.264
-99.661 -40.677 0.009
124.211 -45.352 0.005
-92.384 -16.812 0.144
171.824 -12.958 0.225
-33.753
93.604
-129.407 2.021
87.568
-0.364
-54.324
-2.173
-3.950
-5.113
-7.487
-121.959 -54.425 0.002
74.844 -51.213 0.003
-47.639 0.004
82.835
29.124
24.686
-7.855
-6.979
-7.925
0.405
0.448
0.402
28.172
-23.046
-70.880
-120.006
-83.063
-78.816
-129.674
175.556
-110.128 -14.647 0.185
-179.000 -20.114 0.099
-47.149 -50.314 0.003
-142.199 -47.432 0.004
119.631 -45.514 0.005
-44.356 -12.031 0.250
-103.624 -24.967 0.056
170.138 -11.511 0.266
76.661
-23.728 0.065
-29.776 0.032
-52.739
19.317
-48.995 0.004
109.913 -8.394
59.709 -8.793
0.380
0.363
-142.354 -37.109 0.014
-63.508 -48.636 0.004
Note:
Data obtained off of a connectorized module
4
Biasing and Operation
The AMMP-6130 frequency doubler has been designed
with a fully integrated self bias network; thus, requiring
only a single 4.5v bias input with a typical current draw
of 200mA.
The one-stage frequency doubler relies on the non-
linear behavior of the FET to produce the doubled
signal at the output. A high-pass filter at the input
shorts any reflected 2nd harmonic signal to ground.
The input also consists of matching components tuned
to 15GHz. An additional LC-filter is included at the
input for stability. The doubler is operated at pinch-
off to create a half-wave conduction angle ideal for
generation of the 2nd harmonic. The AMMP-6130 is
also designed for stability over temperature.
Figure 8. Evaluation / Test Board (Available to qualified
customer requests)
C
C3
MLIN
TL11
MLIN
TL12
MLIN
TL13
Port
Vd1
Port
Vd2
MLIN
TL10
C
C7
Port
Output_30G
HP_FET
HPFET4
MLOC
TL8
C
MLIN
TL22
MLIN
TL16
HP_FET
C6
HPFET3
C
MLIN
TL21
MLIN
TL15
HP_FET
C5
MLIN
TL19
C
C2
MLIN
TL3
HPFET2
MLIN
C
MLIN
TL20
MLIN
HP_FET
MLIN
MLIN
TL18
TL7
C4
TL14
TL17
HPFET1
C
C
C
C
R
Port
Input_15G
MLIN
TL4
MLIN
TL2
C15C13 C14C16R6
R
R4
MLOC
TL9
C
C
R
C11 C12 R5
R
R2
R
R3
C
C
R
C9 C10 R1
Figure 9. Simplified Doubler-Amplifier Schematic
5
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Recommended SMT Attachment for 5x5 Package
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is
strongly recommended. An electronic drawing of the
land pattern is available upon request from Avago Sales
& Application Engineering.
Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder
paste. Please see recommended solder reflow
profile. Neither Conductive epoxy or hand soldering
is recommended.
• Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
• Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
• Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that
the profile will not expose device beyond these
limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout
is shown in Figure 8. The stencil has a solder paste
deposition opening approximately 70% to 90% of the
PCB pad. Reducing stencil opening can potentially
generate more voids underneath. On the other hand,
stencil openings larger than 100% will lead to excessive
solder paste smear or bridging across the I/O pads.
Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good
choice is to use a laser cut stencil composed of
0.127mm (5 mils) thick stainless steel which is capable
of producing the required fine stencil outline.
NOTES:
DIMENSIONS ARE IN INCHES [MILIMETERS]
ALL GROUNDS MUST BE SOLDERED TO PCB RF
Material is Rogers RO4350, 0.010" thick
Figure 10. PCB Land Pattern and Stencil Layouts
300
Peak = 250 5ꢀC
250
Melting point = 218ꢀC
200
150
100
50
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 9. This profile is
designed to ensure reliable finished joints. However,
the profile indicated in Figure 1 will vary among
different solder pastes from different manufacturers
and is shown here for reference only.
Ramp 1 Preheat Ramp 2 Reflow
Cooling
250
0
0
50
100
150
200
300
Seconds
Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu
Solder Paste
Package, Tape & Reel, and Ordering Information
.011
Dimensional Tolerances: 0.002" [0.05mm]
Back View
Carrier Tape and Pocket Dimensions
AMMP-6130 Part Number Ordering Information
Part Number
Devices Per Container
Container
AMMP-6130-BLKG
AMMP-6130-TR1G
AMMP-6130-TR2G
10
Antistatic bag
100
500
7" Reel
7" Reel
Note: No RF performance degradation is seen due to ESD upto 250 V HBM and 80 V MM. The DC characteristics in
general show increased leakage at lower ESD discharge voltages. The user is reminded that this device is ESD
sensitive and needs to be handled with all necessary ESD protocols.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0287EN - August 2, 2006
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