ASMT-MW05-NLM41
更新时间:2024-09-19 00:15:47
品牌:AVAGO
描述:SINGLE COLOR LED, COOL WHITE, 5.26mm, ROHS COMPLIANT PACKAGE-3
ASMT-MW05-NLM41 概述
SINGLE COLOR LED, COOL WHITE, 5.26mm, ROHS COMPLIANT PACKAGE-3
ASMT-MW05-NLM41 数据手册
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PDF下载ASMT-Mxx5 / ASMT-Mxx6
®
Moonstone 1W Power LED Light Source
Data Sheet
Description
Features
®
• Available in Cool White & Warm White color
• Energy efficient
The Moonstone 1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
• Exposed pad for excellent heat transfer
• Suitable for reflow soldering process
• High current operation
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
• Long operation life
• Wide viewing angle
• Silicone encapsulation
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
• Non-ESD sensitive (threshold > 16KV)
• MSL 4 products
The package is compatible with reflow soldering. This
will give more freedom and flexibility to the light source
• Available in both electrically isolated and non-isolated
metal heat slug
designer.
Specifications
Applications
• InGaN Technology
• 4.0 V (max) at 350 mA
• 110° viewing angle
• Sign backlight
• Safety, exit and emergency sign lightings
• Specialty lighting such as task lighting and reading
lights
• Retail display
• Commercial lighting
• Accent or marker lightings, strip or step lightings
• Portable lightings, bicycle head lamp, torch lights.
• Decorative lighting
• Architectural lighting
• Pathway lighting
• Street lighting
• Pedestrian street lighting
• Tunnel lighting
Package Dimensions
10.00
1
2
3
Anode
Cathode
Heat Sink
3.30
8.50
1.27
Metal Slug
3
Ø 5.26
LED
+
10.60
ZENER
ꢀ
8.50
Ø 8.00
2.00
5.25
1.30
2
1
0.81
5.08
Notes:
1. All dimensions are in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
3. Metal slug is connected to anode for electrically non-isolated option.
Figure 1. ASMT-Mxx5 / ASMT-Mxx6 package outline drawing.
2
Part Numbering System
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
Packaging Option
Color Bin Selection
Max Flux Bin
Min Flux Bin
Heat Sink
5 – Electrically Non-isolated
6 – Electrically Isolated
Silicone Type
0 – Non-diffused
B – Diffused
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 7 for selection details.
Device Selection Guide (T = 25°C)
J
[1,2]
Luminous Flux, Φ
(lm)
Electrically
v
Test Current Dice
Isolated Metal
Part Number
Color
Min.
Typ.
Max.
(mA)
Technology Slug
ASMT-MW05-NLM00
ASMT-MW06-NLM00
ASMT-MY05-NKM00
ASMT-MY06-NKM00
ASMT-MWB6-NLM00
ASMT-MYB6-NKM00
Notes:
Cool White
73.0
80.0
124.0
350
InGaN
No
Yes
No
Yes
Yes
Yes
Warm White
56.0
73.0
124.0
350
InGaN
Cool White Diffused
Warm White Diffused
73.0
56.0
70.0
65.0
124.0
124.0
350
350
InGaN
InGaN
1.
Φ is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
V
2. Flux tolerance is 10ꢀ.
3
Absolute Maximum Ratings
Parameter
ASMT-Mxx5 / ASMT-Mxx6
Units
mA
mA
mW
°C
DC Forward Current [1]
Peak Pulsing Current [2]
Power Dissipation
500
1000
2000
LED Junction Temperature
Operating Metal Slug Temperature Range at 350 mA
Storage Temperature Range
Soldering Temperature
Reverse Voltage [3]
125
-40 to +110
-40 to +120
°C
°C
Refer to Figure 12
Not recommended
Note:
1. Derate linearly based on Figure 8.
2. Pulse condition: duty factor = 10ꢀ, Frequency = 1 kHz.
3. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (T = 25°C)
J
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
Luminous
Efficiency (lm/W)
[2]
2θ
(°)
½
Part Number
Color
Min.
Max.
Typ.
Typ.
ASMT-MW05-NLM00
ASMT-MW06-NLM00
ASMT-MY05-NKM00
ASMT-MY06-NKM00
ASMT-MWB6-NLM00
ASMT-MYB6-NKM00
Notes:
Cool White
4000
10000
110
63
Warm White
2600
4000
110
58
Cool White Diffused
Warm White Diffused
4000
2600
10000
4000
110
110
56
52
1.
θ is the off-axis angle where the luminous intensity is ½ the peak intensity.
½
Electrical Characteristic at 350 mA (T = 25°C)
J
ForwardVoltage,
Thermal Resistance,
[1]
Rθ (°C/W)
j-ms
V
(Volts)
F
Dice Type
InGaN
Note:
Min.
Typ.
Max.
Typ.
3.0
3.6
4.0
10
1. Rθ
is Thermal Resistance from LED junction to metal slug.
j-ms
4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.4
1.2
1
WARM WHITE
COOL WHITE
0.8
0.6
0.4
0.2
0
380 430 480 530 580 630 680
WAVELENGTH - nm
730 780
0
50 100 150 200 250 300 350 400 450 500
DC FORWARD CURRENT - mA
Figure 2. Relative Intensity vs. Wavelength.
Figure 3. Relative Luminous Flux vs. Mono Pulse Current.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
500
450
400
350
300
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
4
-90
-60
-30
0
30
60
90
FORWARD VOLTAGE - V
ANGULAR DISPLACEMENT - DEGREES
Figure 4. Forward Current vs. ForwardVoltage.
Figure 5. Radiation Pattern.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
tp
D =
tp
T
D =
IF
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.05
0.10
0.25
0.50
1.00
T
D =
0.05
0.10
0.25
0.50
1.00
tp
tp
T
D =
IF
T
0.00001 0.0001 0.001 0.01
0.1
1
10
100
0.00001 0.0001 0.001 0.01
0.1
1
10
100
PULSE DURATION, tp - sec
PULSE DURATION, tp - sec
Figure 6. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RθJ-A = 30°C/W.
Figure 7. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RθJ-A = 30°C/W.
5
600
500
400
300
200
100
0
600
500
400
300
200
100
0
RθJ-A = 20°C/W
RθJ-A = 25°C/W
RθJ-A = 30°C/W
RθJ-MS = 10°C/W
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
METAL SLUG TEMPERATURE, TMS - °C
AMBIENT TEMPERATURE, TA - °C
Figure 8. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RθJ-A = 20°C/W, 25°C/W and 30°C/W.
Figure 9. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RθJ-MS = 10°C/W.
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
120.0
100.0
80.0
WARM WHITE
COOL WHITE
60.0
40.0
20.0
0.0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE,TJ - °C
JUNCTION TEMPERATURE,TJ - °C
Figure 10. ForwardVoltage Shift vs. Junction Temperature.
Figure 11. Relative Light Output vs. Junction Temperature.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
10.70 0.10
10 - 30 SEC.
8.40 0.10
255 - 260°C
3°C/SEC. MAX.
217°C
17.00 0.20
200°C
150°C
6°C/SEC. MAX.
1.00 0.10
3°C/SEC. MAX.
60 - 120 SEC.
3.1 0.10
100 SEC. MAX.
5.08 0.10
TIME
(Acc. to J-STD-020C)
Figure 12. Recommended Reflow Soldering.
Figure 13. Recommended soldering land pattern.
6
Flux Bin Limit [x x ]
Option Selection Details
4 5
Luminous Flux (lm) at I = 350mA
F
ASMT – M x x x – N x x x x
1 2 3
4 5 6 7
Bin
K
Min.
56.0
73.0
95.0
Max.
73.0
95.0
124.0
x – Minimum Flux Bin
4
x – Maximum Flux Bin
5
x – Color Bin Selection
6
L
x – Packaging Option
7
M
Tolerance for each bin limits is 10ꢀ.
Color Bin Selections [x ]
6
Individual reel will contain parts from one color bin selection only.
Cool White
Warm White
Selection
Bin ID
Selection
Bin ID
O
A
B
Full Distribution
A only
O
A
B
Full Distribution
A only
B only
B only
C
D
E
C only
C
D
E
C only
D only
D only
E only
E only
F
F only
F
F only
G
H
L
G only
N
P
A and C only
B and D only
E and C only
F and D only
E and F only
C and D only
A and B only
A, B, C and D only
C, D, E and F only
H only
A and G only
B and H only
A and C only
B and D only
E and C only
F and D only
G and H only
E and F only
C and D only
A and B only
A, B, C and D only
G, H, A and B only
C, D, E and F only
Q
R
M
N
P
U
W
Z
1
Q
R
S
4
U
W
Z
1
2
4
7
Color Bin Limit
Cool
White
Color Limits
(Chromaticity Coordinates)
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
Bin G
Bin H
X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerance: 0.01
X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: 0.01
0.48
0.46
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
G
A
A
4.0k
4.5k
C
2.6k
C
B
H
3.0k
E
5.6k
B
Black Body Curve
3.5k
D
7k
D
4.0k
E
Black Body Curve
F
10k
F
0.28
0.26
0.24
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Figure 14. Color bins (Cool White).
Figure 15. Color bins (Warm White).
Packaging Option [x ]
Example
4
Selection
Option
ASMT-MW05-NLMW0
0
1
Tube
ASMT-MW05-Nxxxx – Cool White, Electrically
Non-isolated Heat Sink,
Tape and Reel
Non-diffused
X = L
– Minimum Flux Bin L
– Maximum Flux Bin M
– Color Bin C and D only
– Tube Option
4
X = M
5
X = W
6
X = 0
7
8
Packing Tube – Option 0
1.00
5.80
4.65
5.50
37.00
5.45
10.10
535.00
8.30
SIDE VIEW
TOP VIEW
Figure 16. Tube dimensions.
Tape and Reel – Option 1
A
Dimension Value
A0
B0
K0
E
8.80 0.10
16.45 0.10
3.60 0.10
1.75 0.10
11.50 0.10
24.0 0.10
16.0 0.10
F
B
B
W
P
A
Ko
Quantity/ 250 units
Reel
P
SECTION A
All dimensions in millimeters.
Ao
SECTION B
Figure 17. Carrier tape dimensions.
9
END
START
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 160 mm
MOUNTED WITH
COMPONENTS
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
Figure 18. Carrier tape leader and trailer dimensions.
+1.00
−0.00
24.0
2.30
2.30
2.50 0.50
∅268.00
∅330.00 1.00
120.0º
Figure 19. Reel dimensions.
10
Handling Precaution
B. Control after opening the MBB
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unfinished reel
Moisture Sensitivity
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
This product is qualified as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5ꢀRH to ensure no LEDs have exceeded their
floor life of 72 hours.
A. Storage before use
E. Baking is required if
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀRH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
– HIC “10ꢀ” indicator is not blue and “5ꢀ” indicator is
pink.
– The LEDs are exposed to condition of >30°C/60ꢀ RH
at any time.
– The LEDs floor life exceeded 72hrs.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
Recommended baking condition: 60 5°C for 20hrs.
DISCLAIMER:Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1698EN - April 23, 2010
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