ASMT-MWC9-NLMG0 [AVAGO]
Single Color LED, Cool White, Diffused, 5.26mm, ROHS COMPLIANT PACKAGE-3;型号: | ASMT-MWC9-NLMG0 |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | Single Color LED, Cool White, Diffused, 5.26mm, ROHS COMPLIANT PACKAGE-3 |
文件: | 总12页 (文件大小:227K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ASMT-Mxx9
Moonstone® 1W Power LED Light Source
Data Sheet
Description
Features
The Moonstone® 1W Power LED Light Source is a high ꢀ Available in Cool White & Warm White color
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
ꢀ Energy efficient
ꢀ Exposed pad for excellent heat transfer
motherboard.
ꢀ Suitable for reflow soldering process
ꢀ High current operation
It is available in various color temperatures ranging from
2600K to 10000K.
ꢀ Long operation life
The package is compatible with reflow soldering. To ꢀ Wide viewing angle
facilitate easy pick and place assembly, the LEDs are also
available in EIA-compliant tape and reel.
ꢀ Silicone encapsulation
ꢀ Non-ESD sensitive (threshold >16kV)
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
ꢀ MSL 4 products
Applications
ꢀ Sign backlight, billboard illumination or backlight
ꢀ Exit sign or emergency sign lightings
ꢀ Commercial lightings
ꢀ Accent and marker lightings
ꢀ Pathway lighting
ꢀ Task lighting
ꢀ Reading lights
ꢀ Decorative lighting
ꢀ Garden lighting
ꢀ Architectural lighting
ꢀ Portable (flash light, bicycle head light)
Package Dimension for Moonstone®
10.00
1
2
3
Anode
Cathode
Heat Sink
3.30
8.50
1.27
Metal Slug
3
Ø 5.26
LED
+
10.60
ZENER
−
8.50
Ø 8.00
2.00
5.25
1.30
2
1
Notes:
1. All dimensions in mm.
0.81
5.08
2. Tolerance = 0.10mm unless otherwise specified.
3. Terminal finish: Ag plating.
4. Metal slug is connected to anode.
Figure 1. Moonstone® package outline drawing.
Package Dimension for Moonstone® on MCPCB
1
2
3
Anode
Cathode
Heat Sink
16.00
2.50
60 °
∅ 5.00
∅ 3.00
∅ 19.00
14.00
20.00
R 1.60
4.00
3.00
19.00
24.00
1.40
2.30
1.60
1.30
3.30
4.90
4.60
19.90
Figure 3. MCPCB II package outline drawing.
Figure 2. MCPCB I package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
2
Part Numbering System
2 9 – N x
ASMT-M x1 x
3 x4 x5 x6
Packaging option
Color Bin Selection
Maximum -Flux Bin Selection
Minimum -Flux Bin Selection
Moonstone® Type
0 – Non-diffused
B – Diffused
A – Non-diffused on MCPCB I
C – Diffused on MCPCB I
K – Non-diffused on MCPCB II
L – Diffused on MCPCB II
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 7 for selection details.
Device Selection Guide (T = 25ꢁC) for Moonstone®
j
[1,2]
Luminous Flux, Φ
(lm)
Max.
Electrically
Isolated
Metal Slug
V
Test Current
(mA)
Dice
Technology
Part Number
Color
Min.
73.0
95.0
56.0
73.0
73.0
Typ.
ASMT-MW09-NLM00
ASMT-MW09-NMM00
ASMT-MY09-NKM00
ASMT-MY09-NLM00
ASMT-MWB9-NLM00
Cool White
90.0
124.0
124.0
124.0
124.0
124.0
350
350
350
350
350
InGaN
InGaN
InGaN
InGaN
InGaN
No
No
No
No
No
100.0
75.0
80.0
87.0
Warm White
Cool White
Diffused
ASMT-MYB9-NKM00
Warm White
Diffused
56.0
72.0
124.0
350
InGaN
No
Device Selection Guide (T = 25ꢁC) for Moonstone® on MCPCB
j
[1,2]
Luminous Flux, Φ
(lm)
Electrically
Isolated
V
Test Current
Dice
Part Number
Color
Min.
73.0
56.0
Typ.
Max.
(mA)
Technology
Metal Slug
ASMT-MWK9-NLM00
ASMT-MYK9-NKM00
Notes:
Cool White
Warm White
90.0
75.0
124.0
124.0
350
350
InGaN
InGaN
No
No
1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is 10 ꢀ.
3
Absolute Maximum Ratings
Parameter
DC Forward Current [1]
ASMT-Mxx9
500
Units
mA
mW
°C
Power Dissipation
2100
LED Junction Temperature
Operating Metal Slug Temperature Range at 350 mA
Operating Metal Slug Temperature Range at 500 mA
Storage Temperature Range
Soldering Temperature
125
-40 to +110
-40 to +105
-40 to +120
Refer to Figure 14
Not recommended
°C
°C
°C
Reverse Voltage [2]
Notes:
1. Derate linearly based on Figure 11.
2. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (T = 25 °C)
J
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
Luminous Efficiency
(lm/W)
[2]
2ꢂ
(°)
½
Part Number
Color
Min.
Max.
Typ.
110
110
110
110
110
110
110
Typ.
71
71
79
60
60
63
69
ASMT-MW09-NLM00
ASMT-MWK9-NLM00
ASMT-MW09-NMM00
ASMT-MY09-NKM00
ASMT-MY09-NKM00
ASMT-MY09-NLM00
ASMT-MWB9-NLM00
Cool White
4000
10000
10000
10000
4000
4000
4000
1000
4000
4000
Warm White
2600
2600
2600
Cool White
Diffused
4000
ASMT-MYB9-NKM00
Warm White
Diffused
2600
4000
110
57
Notes:
1. ꢂ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (T = 25°C)
J
Thermal Resistance,
Thermal Resistance,
[1]
Rꢂ (°C/W)
j-ms
[2]
Rꢂ (°C/W)
j-b
Forward Voltage, V (Volts)
F
Dice Type
Min.
Typ.
Max.
Typ.
Typ.
InGaN
Notes:
3.2
3.6
4.0
10
14
1. Rꢂ
is the thermal resistance from LED junction to metal slug.
j-ms
2. Rꢂ is the thermal resistance from LED junction to MCPCB.
j-b
4
500
450
400
350
300
250
200
150
100
50
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Cool White
Warm White
0
0.0
350 400 450 500 550 600 650 700 750 800
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
WAVELENGTH - nm
VF - FORWARD VOLTAGE - V
Figure 4. Relative intensity vs. wavelength
Figure 5. Forward voltage vs. forward current.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
50 100 150 200 250 300 350 400 450 500
IF - FORWARD CURRENT - mA
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - °
Figure 6. Relative luminous flux vs. forward current.
Figure 7. Radiation pattern.
0.002
0.001
0.000
-0.001
-0.002
-0.003
-0.004
0.002
0.001
0.000
500mA
500mA
350mA
250mA
350mA
250mA
150mA
-0.001
-0.002
-0.003
-0.004
150mA
50mA
0.001
50mA
-0.001
X - COORDINATES
-0.003
-0.002
0.000
0.001
0.002
-0.002
-0.001
0.000
0.002
0.003
X - COORDINATES
Figure 8. Chromaticity coordinate shift vs. forward current (Cool White).
Figure 9. Chromaticity coordinate shift vs. forward current (Warm White).
5
1.2
1
0.5
0.4
Warm White
Cool White
0.3
0.8
0.6
0.4
0.2
0
0.2
0.1
Cool White &
Warm White
0.0
-0.1
-0.2
-0.3
-0.4
-40 -20
0
20
40
60
80
100 120
-40 -20
0
20
40
60
80
100 120
TJ - JUNCTIONTEMPERATURE -°C
TJ - JUNCTIONTEMPERATURE -°C
Figure 10. Relative light output vs. junction temperature.
Figure 11. Forward voltage shift vs. junction temperature.
600
500
600
500
400
400
Rꢀj-a = 30°C/W
Rꢀj-ms = 10°C/W
300
300
Rꢀj-a = 40°C/W
Rꢀj-a = 50°C/W
200
200
100
0
100
0
0
20
40
60
80
100
0
20
40
60
80
100
120
140
TA - AMBIENT TEMPERATURE - °C
Tms - METAL SLUG TEMPERATURE - °C
Figure 12. Maximum forward current vs. ambient temperature
Figure 13. Maximum forward current vs. metal slug temperature
10.70 0.10
10 to 30 SEC.
255 - 260°C
3°C/SEC. MAX.
8.40 0.10
3.1 0.10
217°C
200°C
6°C/SEC. MAX.
17.00 0.20
150°C
1.00 0.10
3°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
5.08 0.10
TIME
(Acc. to J-STD-020C)
Figure 14. Recommended soldering profile.
Figure 15 Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
6
Flux Bin Limit [x x ]
Option Selection Details
3 4
ASMT - M x x 9 - N x x x x
Luminous Flux (lm) @ I = 350mA
1 2
3 4 5 6
F
x = Minimum flux bin
3
Bin ID
Min
Max
x = Maximum flux bin
4
K
L
56.0
73.0
95.0
73.0
95.0
124.0
x = Color Bin Selection
5
x = Packaging Option
6
M
Tolerance: 10ꢀ
Color Bin Selections [x ]
5
Individual reel or tube will contain parts from one color bin selection only.
Cool White
Warm White
Selection
Bin ID
Selection
Bin ID
0
Full Distribution
A only
0
Full Distribution
A only
A
B
C
D
E
A
B
C
D
E
B only
B only
C only
C only
D only
D only
E only
E only
F
F only
F
F only
G
H
L
G only
N
P
A and C only
B and D only
E and C only
F and D only
E and F only
C and D only
A and B only
A, B, C and D only
C, D, E and F only
H only
A and G only
B and H only
A and C only
B and D only
E and C only
F and D only
G and H only
E and F only
C and D only
A and B only
A, B, C and D only
G, H, A and B only
C, D, E and F only
Q
R
U
W
Z
1
M
N
P
Q
R
S
4
U
W
Z
1
2
4
7
Color Bin Limit
Cool
White
Color Limits
(Chromaticity Coordinates)
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
Bin G
Bin H
X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerance: 0.01
X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: 0.01
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.48
0.46
0.44
0.42
0.40
0.38
0.36
0.34
0.32
G
A
A
4.0k
4.5k
C
2.6k
C
H
B
3.0k
E
B
5.6k
3.5k
BlackBodyCurve
D
7k
D
4.0k
E
F
F
BlackBodyCurve
10k
0.28
0.26
0.24
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Figure 16. Color bins (Cool White)
Figure 17. Color bins (Warm White)
Packaging option [x ]
Example
6
Selection
Option
ASMT-MW09-NLMZ1
0
Tube (for Moonstone® only)
Tray (for Moonstone® on MCPCB only)
ASMT-MW09-Nxxxx
x = L
-
-
-
-
-
Cool White, Non-diffused
Minimum Flux Bin L
3
1
Tape & reel
x = M
4
Maximum Flux Bin M
Color Bin A and B only
Tape and Reel Option
x = Z
5
x = 1
6
8
Packing Tube - Option 0
1.00
5.80
4.65
5.50
37.00
5.45
10.10
535.00
8.30
SIDE VIEW
TOP VIEW
Quantity per tube = 25 pcs
Figure 18. Tube dimensions
Tape and Reel - Option 1
A
Dim
AO
BO
KO
E
Value
8.80 0.10
16.45 0.10
3.60 0.1
1.75 0.10
11.50 0.10
24.0 0.10
16.0 0.10
B
B
F
A
W
Ko
P
P
SECTION A
Q'ty/Reel 250 units
All dimensions in mm.
Ao
SECTION B
Figure 19. Carrier tape dimensions
9
END
START
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 160 mm
MOUNTED WITH
COMPONENTS
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
*Note: Tape & Reel Packaging only applicable as per this datasheet only.
Figure 20. Carrier tape leader and trailer dimensions
+1.00
0- .00
24.0
2.30
2.30
2.50 0.50
120.0º
∅268.00
∅330.00 1.00
Figure 21. Reel dimensions
10
Packing Tray - Option 0 (for Moonstone® on MCPCB only)
Figure 22. Tray dimensions.
11
Handling Precaution
B. Control after opening the MBB
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unfinished reel
Moisture Sensitivity
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
This product is qualified as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5ꢀRH to ensure no LEDs have exceeded their
floor life of 72 hours.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀRH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
E. Baking is required if
– HIC “10ꢀ” indicator is not blue and “5ꢀ” indicator is
pink.
– The LEDs are exposed to condition of >30°C/60ꢀ RH
at any time.
– The LEDs floor life exceeded 72hrs.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
Recommended baking condition: 60 5°C for 20hrs.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1449EN - March 25, 2010
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