ASMT-MWC9-NLMG0 [AVAGO]

Single Color LED, Cool White, Diffused, 5.26mm, ROHS COMPLIANT PACKAGE-3;
ASMT-MWC9-NLMG0
型号: ASMT-MWC9-NLMG0
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

Single Color LED, Cool White, Diffused, 5.26mm, ROHS COMPLIANT PACKAGE-3

文件: 总12页 (文件大小:227K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ASMT-Mxx9  
Moonstone® 1W Power LED Light Source  
Data Sheet  
Description  
Features  
The Moonstone® 1W Power LED Light Source is a high Available in Cool White & Warm White color  
performance energy efficient device which can handle  
high thermal and high driving current. The exposed pad  
design has excellent heat transfer from the package to the  
Energy efficient  
Exposed pad for excellent heat transfer  
motherboard.  
Suitable for reflow soldering process  
High current operation  
It is available in various color temperatures ranging from  
2600K to 10000K.  
Long operation life  
The package is compatible with reflow soldering. To Wide viewing angle  
facilitate easy pick and place assembly, the LEDs are also  
available in EIA-compliant tape and reel.  
Silicone encapsulation  
Non-ESD sensitive (threshold >16kV)  
The 1W Power LED light source can be mounted onto  
metal core PCB enabling optimum heat dissipation and  
ease of installation.  
MSL 4 products  
Applications  
Sign backlight, billboard illumination or backlight  
Exit sign or emergency sign lightings  
Commercial lightings  
Accent and marker lightings  
Pathway lighting  
Task lighting  
Reading lights  
Decorative lighting  
Garden lighting  
Architectural lighting  
Portable (flash light, bicycle head light)  
Package Dimension for Moonstone®  
10.00  
1
2
3
Anode  
Cathode  
Heat Sink  
3.30  
8.50  
1.27  
Metal Slug  
3
Ø 5.26  
LED  
+
10.60  
ZENER  
8.50  
Ø 8.00  
2.00  
5.25  
1.30  
2
1
Notes:  
1. All dimensions in mm.  
0.81  
5.08  
2. Tolerance = 0.10mm unless otherwise specified.  
3. Terminal finish: Ag plating.  
4. Metal slug is connected to anode.  
Figure 1. Moonstone® package outline drawing.  
Package Dimension for Moonstone® on MCPCB  
1
2
3
Anode  
Cathode  
Heat Sink  
16.00  
2.50  
60 °  
5.00  
3.00  
19.00  
14.00  
20.00  
R 1.60  
4.00  
3.00  
19.00  
24.00  
1.40  
2.30  
1.60  
1.30  
3.30  
4.90  
4.60  
19.90  
Figure 3. MCPCB II package outline drawing.  
Figure 2. MCPCB I package outline drawing.  
Notes:  
1. All dimensions in millimeters.  
2. Tolerance is 0.1 mm unless otherwise specified.  
2
Part Numbering System  
2 9 – N x  
ASMT-M x1 x  
3 x4 x5 x6  
Packaging option  
Color Bin Selection  
Maximum -Flux Bin Selection  
Minimum -Flux Bin Selection  
Moonstone® Type  
0 Non-diffused  
B Diffused  
A Non-diffused on MCPCB I  
C Diffused on MCPCB I  
K Non-diffused on MCPCB II  
L Diffused on MCPCB II  
Color  
W Cool White  
Y – Warm White  
Note:  
1. Please refer to Page 7 for selection details.  
Device Selection Guide (T = 25C) for Moonstone®  
j
[1,2]  
Luminous Flux, Φ  
(lm)  
Max.  
Electrically  
Isolated  
Metal Slug  
V
Test Current  
(mA)  
Dice  
Technology  
Part Number  
Color  
Min.  
73.0  
95.0  
56.0  
73.0  
73.0  
Typ.  
ASMT-MW09-NLM00  
ASMT-MW09-NMM00  
ASMT-MY09-NKM00  
ASMT-MY09-NLM00  
ASMT-MWB9-NLM00  
Cool White  
90.0  
124.0  
124.0  
124.0  
124.0  
124.0  
350  
350  
350  
350  
350  
InGaN  
InGaN  
InGaN  
InGaN  
InGaN  
No  
No  
No  
No  
No  
100.0  
75.0  
80.0  
87.0  
Warm White  
Cool White  
Diffused  
ASMT-MYB9-NKM00  
Warm White  
Diffused  
56.0  
72.0  
124.0  
350  
InGaN  
No  
Device Selection Guide (T = 25C) for Moonstone® on MCPCB  
j
[1,2]  
Luminous Flux, Φ  
(lm)  
Electrically  
Isolated  
V
Test Current  
Dice  
Part Number  
Color  
Min.  
73.0  
56.0  
Typ.  
Max.  
(mA)  
Technology  
Metal Slug  
ASMT-MWK9-NLM00  
ASMT-MYK9-NKM00  
Notes:  
Cool White  
Warm White  
90.0  
75.0  
124.0  
124.0  
350  
350  
InGaN  
InGaN  
No  
No  
1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.  
2. Flux tolerance is 10 ꢀ.  
3
Absolute Maximum Ratings  
Parameter  
DC Forward Current [1]  
ASMT-Mxx9  
500  
Units  
mA  
mW  
°C  
Power Dissipation  
2100  
LED Junction Temperature  
Operating Metal Slug Temperature Range at 350 mA  
Operating Metal Slug Temperature Range at 500 mA  
Storage Temperature Range  
Soldering Temperature  
125  
-40 to +110  
-40 to +105  
-40 to +120  
Refer to Figure 14  
Not recommended  
°C  
°C  
°C  
Reverse Voltage [2]  
Notes:  
1. Derate linearly based on Figure 11.  
2. Not designed for reverse bias operation.  
Optical Characteristics at 350 mA (T = 25 °C)  
J
Correlated Color Temperature,  
CCT (Kelvin)  
Viewing Angle,  
Luminous Efficiency  
(lm/W)  
[2]  
2ꢂ  
(°)  
½
Part Number  
Color  
Min.  
Max.  
Typ.  
110  
110  
110  
110  
110  
110  
110  
Typ.  
71  
71  
79  
60  
60  
63  
69  
ASMT-MW09-NLM00  
ASMT-MWK9-NLM00  
ASMT-MW09-NMM00  
ASMT-MY09-NKM00  
ASMT-MY09-NKM00  
ASMT-MY09-NLM00  
ASMT-MWB9-NLM00  
Cool White  
4000  
10000  
10000  
10000  
4000  
4000  
4000  
1000  
4000  
4000  
Warm White  
2600  
2600  
2600  
Cool White  
Diffused  
4000  
ASMT-MYB9-NKM00  
Warm White  
Diffused  
2600  
4000  
110  
57  
Notes:  
1. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.  
Electrical Characteristic at 350 mA (T = 25°C)  
J
Thermal Resistance,  
Thermal Resistance,  
[1]  
RC/W)  
j-ms  
[2]  
RC/W)  
j-b  
Forward Voltage, V (Volts)  
F
Dice Type  
Min.  
Typ.  
Max.  
Typ.  
Typ.  
InGaN  
Notes:  
3.2  
3.6  
4.0  
10  
14  
1. Rꢂ  
is the thermal resistance from LED junction to metal slug.  
j-ms  
2. Ris the thermal resistance from LED junction to MCPCB.  
j-b  
4
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Cool White  
Warm White  
0
0.0  
350 400 450 500 550 600 650 700 750 800  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
WAVELENGTH - nm  
VF - FORWARD VOLTAGE - V  
Figure 4. Relative intensity vs. wavelength  
Figure 5. Forward voltage vs. forward current.  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0
50 100 150 200 250 300 350 400 450 500  
IF - FORWARD CURRENT - mA  
-90  
-60  
-30  
0
30  
60  
90  
ANGULAR DISPLACEMENT - °  
Figure 6. Relative luminous flux vs. forward current.  
Figure 7. Radiation pattern.  
0.002  
0.001  
0.000  
-0.001  
-0.002  
-0.003  
-0.004  
0.002  
0.001  
0.000  
500mA  
500mA  
350mA  
250mA  
350mA  
250mA  
150mA  
-0.001  
-0.002  
-0.003  
-0.004  
150mA  
50mA  
0.001  
50mA  
-0.001  
X - COORDINATES  
-0.003  
-0.002  
0.000  
0.001  
0.002  
-0.002  
-0.001  
0.000  
0.002  
0.003  
X - COORDINATES  
Figure 8. Chromaticity coordinate shift vs. forward current (Cool White).  
Figure 9. Chromaticity coordinate shift vs. forward current (Warm White).  
5
1.2  
1
0.5  
0.4  
Warm White  
Cool White  
0.3  
0.8  
0.6  
0.4  
0.2  
0
0.2  
0.1  
Cool White &  
Warm White  
0.0  
-0.1  
-0.2  
-0.3  
-0.4  
-40 -20  
0
20  
40  
60  
80  
100 120  
-40 -20  
0
20  
40  
60  
80  
100 120  
TJ - JUNCTIONTEMPERATURE C  
TJ - JUNCTIONTEMPERATURE C  
Figure 10. Relative light output vs. junction temperature.  
Figure 11. Forward voltage shift vs. junction temperature.  
600  
500  
600  
500  
400  
400  
Rj-a = 30°C/W  
Rj-ms = 10°C/W  
300  
300  
Rj-a = 40°C/W  
Rj-a = 50°C/W  
200  
200  
100  
0
100  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
120  
140  
TA - AMBIENT TEMPERATURE - °C  
Tms - METAL SLUG TEMPERATURE - °C  
Figure 12. Maximum forward current vs. ambient temperature  
Figure 13. Maximum forward current vs. metal slug temperature  
10.70 0.10  
10 to 30 SEC.  
255 - 260°C  
3°C/SEC. MAX.  
8.40 0.10  
3.1 0.10  
217°C  
200°C  
6°C/SEC. MAX.  
17.00 0.20  
150°C  
1.00 0.10  
3°C/SEC. MAX.  
60 - 120 SEC.  
100 SEC. MAX.  
5.08 0.10  
TIME  
(Acc. to J-STD-020C)  
Figure 14. Recommended soldering profile.  
Figure 15 Recommended soldering land pattern.  
Note:  
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED  
Indicator Components.  
6
Flux Bin Limit [x x ]  
Option Selection Details  
3 4  
ASMT - M x x 9 - N x x x x  
Luminous Flux (lm) @ I = 350mA  
1 2  
3 4 5 6  
F
x = Minimum flux bin  
3
Bin ID  
Min  
Max  
x = Maximum flux bin  
4
K
L
56.0  
73.0  
95.0  
73.0  
95.0  
124.0  
x = Color Bin Selection  
5
x = Packaging Option  
6
M
Tolerance: 10ꢀ  
Color Bin Selections [x ]  
5
Individual reel or tube will contain parts from one color bin selection only.  
Cool White  
Warm White  
Selection  
Bin ID  
Selection  
Bin ID  
0
Full Distribution  
A only  
0
Full Distribution  
A only  
A
B
C
D
E
A
B
C
D
E
B only  
B only  
C only  
C only  
D only  
D only  
E only  
E only  
F
F only  
F
F only  
G
H
L
G only  
N
P
A and C only  
B and D only  
E and C only  
F and D only  
E and F only  
C and D only  
A and B only  
A, B, C and D only  
C, D, E and F only  
H only  
A and G only  
B and H only  
A and C only  
B and D only  
E and C only  
F and D only  
G and H only  
E and F only  
C and D only  
A and B only  
A, B, C and D only  
G, H, A and B only  
C, D, E and F only  
Q
R
U
W
Z
1
M
N
P
Q
R
S
4
U
W
Z
1
2
4
7
Color Bin Limit  
Cool  
White  
Color Limits  
(Chromaticity Coordinates)  
Warm  
White  
Color Limits  
(Chromaticity Coordinates)  
Bin A  
Bin B  
Bin C  
Bin D  
Bin E  
Bin F  
Bin G  
Bin H  
X
Y
0.367  
0.400  
0.362  
0.372  
0.329  
0.345  
0.329  
0.369  
Bin A  
Bin B  
Bin C  
Bin D  
Bin E  
Bin F  
X
Y
0.452  
0.434  
0.488  
0.447  
0.470  
0.414  
0.438  
0.403  
X
Y
0.362  
0.372  
0.356  
0.330  
0.329  
0.302  
0.329  
0.345  
X
Y
0.438  
0.403  
0.470  
0.414  
0.452  
0.384  
0.424  
0.376  
X
Y
0.329  
0.369  
0.329  
0.345  
0.305  
0.322  
0.301  
0.342  
X
Y
0.407  
0.393  
0.418  
0.422  
0.452  
0.434  
0.438  
0.403  
X
Y
0.329  
0.345  
0.329  
0.302  
0.311  
0.285  
0.305  
0.322  
X
Y
0.395  
0.362  
0.407  
0.393  
0.438  
0.403  
0.424  
0.376  
X
Y
0.303  
0.333  
0.307  
0.311  
0.283  
0.284  
0.274  
0.301  
X
Y
0.381  
0.377  
0.387  
0.404  
0.418  
0.422  
0.407  
0.393  
X
Y
0.307  
0.311  
0.311  
0.285  
0.290  
0.265  
0.283  
0.284  
X
Y
0.373  
0.349  
0.381  
0.377  
0.407  
0.393  
0.395  
0.362  
Tolerance: 0.01  
X
Y
0.388  
0.417  
0.379  
0.383  
0.362  
0.372  
0.367  
0.400  
X
Y
0.379  
0.383  
0.369  
0.343  
0.356  
0.330  
0.362  
0.372  
Tolerance: 0.01  
0.44  
0.42  
0.40  
0.38  
0.36  
0.34  
0.32  
0.30  
0.48  
0.46  
0.44  
0.42  
0.40  
0.38  
0.36  
0.34  
0.32  
G
A
A
4.0k  
4.5k  
C
2.6k  
C
H
B
3.0k  
E
B
5.6k  
3.5k  
BlackBodyCurve  
D
7k  
D
4.0k  
E
F
F
BlackBodyCurve  
10k  
0.28  
0.26  
0.24  
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44  
X - COORDINATE  
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52  
X - COORDINATE  
Figure 16. Color bins (Cool White)  
Figure 17. Color bins (Warm White)  
Packaging option [x ]  
Example  
6
Selection  
Option  
ASMT-MW09-NLMZ1  
0
Tube (for Moonstone® only)  
Tray (for Moonstone® on MCPCB only)  
ASMT-MW09-Nxxxx  
x = L  
-
-
-
-
-
Cool White, Non-diffused  
Minimum Flux Bin L  
3
1
Tape & reel  
x = M  
4
Maximum Flux Bin M  
Color Bin A and B only  
Tape and Reel Option  
x = Z  
5
x = 1  
6
8
Packing Tube - Option 0  
1.00  
5.80  
4.65  
5.50  
37.00  
5.45  
10.10  
535.00  
8.30  
SIDE VIEW  
TOP VIEW  
Quantity per tube = 25 pcs  
Figure 18. Tube dimensions  
Tape and Reel - Option 1  
A
Dim  
AO  
BO  
KO  
E
Value  
8.80 0.10  
16.45 0.10  
3.60 0.1  
1.75 0.10  
11.50 0.10  
24.0 0.10  
16.0 0.10  
B
B
F
A
W
Ko  
P
P
SECTION A  
Q'ty/Reel 250 units  
All dimensions in mm.  
Ao  
SECTION B  
Figure 19. Carrier tape dimensions  
9
END  
START  
MINIMUM OF 390 mm OF EMPTY COMPONENT  
POCKETS SEALED WITH COVER TAPE.  
MINIMUM OF 160 mm  
MOUNTED WITH  
COMPONENTS  
OF EMPTY COMPONENT  
POCKETS SEALED WITH  
COVER TAPE.  
*Note: Tape & Reel Packaging only applicable as per this datasheet only.  
Figure 20. Carrier tape leader and trailer dimensions  
+1.00  
0- .00  
24.0  
2.30  
2.30  
2.50 0.50  
120.0º  
268.00  
330.00 1.00  
Figure 21. Reel dimensions  
10  
Packing Tray - Option 0 (for Moonstone® on MCPCB only)  
Figure 22. Tray dimensions.  
11  
Handling Precaution  
B. Control after opening the MBB  
The encapsulation material of the product is made of  
silicone for better reliability of the product. As silicone is  
a soft material, please do not press on the silicone or poke  
a sharp object onto the silicone. These might damage the  
product and cause premature failure. During assembly or  
handling, the unit should be held on the body only. Please  
refer to Avago Application Note AN 5288 for detail infor-  
mation.  
– The humidity indicator card (HIC) shall be read  
immediately upon opening of MBB.  
– The LEDs must be kept at <30°C/60ꢀRH at all time  
and all high temperature related process including  
soldering, curing or rework need to be completed  
within 72 hours.  
C. Control for unfinished reel  
Moisture Sensitivity  
– For any unused LEDs, they need to be stored in  
sealed MBB with desiccant or desiccator at <5ꢀRH.  
This product is qualified as Moisture Sensitive Level 4 per  
Jedec J-STD-020. Precautions when handling this moisture  
sensitive product is important to ensure the reliability of  
the product. Do refer to Avago Application Note AN5305  
Handling of Moisture Sensitive Surface Mount Devices for  
details.  
D. Control of assembly boards  
– If the PCB soldered with the LEDs is to be subjected to  
other high temperature processes, the PCB need to  
be stored in sealed MBB with desiccant or desiccator  
at <5ꢀRH to ensure no LEDs have exceeded their  
floor life of 72 hours.  
A. Storage before use  
– Unopen moisture barrier bag (MBB) can be stored at  
<40°C/90ꢀRH for 12 months. If the actual shelf life  
has exceeded 12 months and the humidity indicator  
card (HIC) indicates that baking is not required, then  
it is safe to reflow the LEDs per the original MSL  
rating.  
E. Baking is required if  
– HIC “10ꢀ” indicator is not blue and “5ꢀ” indicator is  
pink.  
– The LEDs are exposed to condition of >30°C/60ꢀ RH  
at any time.  
– The LEDs floor life exceeded 72hrs.  
– It is not recommended to open the MBB prior to  
assembly (e.g. for IQC).  
Recommended baking condition: 60 5°C for 20hrs.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.  
AV02-1449EN - March 25, 2010  

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