ASMT-MWL4-NLN01 [AVAGO]
Visible LED, Diffused;
| 型号： | ASMT-MWL4-NLN01 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Visible LED, Diffused |
| 文件： | 总11页 (文件大小：417K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMT-Mxx4
Moonstone® 1W High Brightness Power LED Light Source
Data Sheet
Description
Features
The Moonstone® 1W High Brightness Power LED Light • Available in Cool White & Warm White color
Source is a high performance energy efficient device
which can handle high thermal and high driving current.
The exposed pad design has excellent heat transfer from
• Energy efficient
• Exposed pad for excellent heat transfer
the package to the motherboard.
• Suitable for reflow soldering process
• High current operation
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
• Long operation life
The package is compatible with reflow soldering. This • Wide viewing angle
will give more freedom and flexibility to the light source
designer.
• Silicone encapsulation
• Non-ESD sensitive (threshold > 16KV)
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
• MSL 2a products
Specifications
• InGaN Technology
• 3.5 V (max) at 350 mA
• 110° viewing angle
Applications
• Sign backlight, billboard illumination or backlight
• Exit sign or emergency sign lightings
• Commercial lightings
• Accent and marker lightings
• Pathway lighting
• Task lighting
• Reading lights
• Decorative lighting
• Garden lighting
• Architectural lighting
• Portable (flash light, bicycle head light
Package Dimension for Moonstone®
10.00
1
2
3
Anode
Cathode
Heat Sink
3.30
8.50
1.27
Metal Slug
3
Ø 5.26
LED
+
10.60
ZENER
−
8.50
Ø 8.00
2.00
5.25
1.30
2
1
0.81
5.08
Figure 1. Moonstone® package outline drawing.
Notes:
1. All dimensions are in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
3. Terminal finish: Ag plating.
Package Dimension for Moonstone® on MCPCB
1
2
3
Anode
16.00
2.50
60 °
Cathode
Heat Sink
∅ 5.00
∅ 3.00
∅ 19.00
14.00
20.00
R 1.60
4.00
3.00
19.00
24.00
1.40
2.30
1.60
1.30
3.30
4.90
4.60
19.90
Figure 2. MCPCB I package outline drawing.
Figure 3. MCPCB II package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
2
Part Numbering System
ASMT-Mx1 x2 4 - N x3 x4 x5 x6
Packaging Option
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Moonstone®Type
0 – Non-diꢀused
B – Diꢀused
A - Non-diꢀused on MCPCB I
C - Diꢀused on MCPCB I
K - Non-diꢀused on MCPCB II
L - Diꢀused on MCPCB II
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 9 for selection details.
Device Selection Guide (T = 25°C)
j
Electrically
Isolated
Technology Metal Slug
[1,2]
Luminous Flux, Φ
(lm)
Max.
V
Part
Number
Test Current Dice
[3]
Color
Min.
73.0
95.0
73.0
73.0
73.0
Typ.
(mA)
350
350
350
350
350
ASMT-MWx24-NLN00
ASMT-MWx24-NMN00
ASMT-MYx24-NLM00
ASMT-MWx24-NLM00
ASMT-MYx24-NLM00
Cool White
105.0
105.0
100.0
95.0
125.0
125.0
110.0
110.0
110.0
InGaN
Yes
Yes
Yes
Yes
Yes
Warm White
InGaN
InGaN
InGaN
Cool White Diffused
Warm White Diffused
90.0
Notes:
1.
Φ is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
V
2. Flux tolerance is 10 ꢀ.
3. Flux performance for respective part number is similar when device on MCPCB I or MCPCB II.
3
Absolute Maximum Ratings (T = 25°C)
A
Parameter
DC Forward Current [1]
ASMT-Mxx4
350
Units
mA
mA
mW
°C
Peak Pulsing Current
1000
Power Dissipation
1225
LED Junction Temperature
LED Junction Temperature for short term application
Operating Ambient Temperature Range
Storage Temperature Range
Soldering Temperature
125
145
°C
-40 to +110
-40 to +120
Refer to Figure 14
Not recommended
°C
°C
Reverse Voltage [2]
Notes:
1. Derate linearly based on Figure 11.
2. Not recommended for reverse bias operation.
Optical Characteristics at 350 mA (T = 25°C)
J
Correlated Color Temperature, Viewing Angle,
Luminous Efficiency
(lm/W)
[2]
CCT (Kelvin)
2q½ (°)
Part Number
Color
Min.
Max.
Typ.
Typ.
94
94
89
85
80
ASMT-MWx24-NLN00
ASMT-MWx24-NMN00
ASMT-MYx24-NLM00
ASMT-MWx24-NLM00
ASMT-MYx24-NLM00
Notes:
Cool White
4000
10000
10000
4000
110
4000
110
Warm White
2600
110
Cool White Diffused
Warm White Diffused
4000
10000
4000
110
2600
110
1. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (T = 25°C)
J
[1]
Forward Voltage V (Volts) at I = 350mA
Thermal Resistance Rθ
( °C/W)
j-ms
F
F
Dice type
InGaN
Min.
Typ.
3.2
Max.
Typ.
2.8
3.5
10
Note:
1. Rq
is the Thermal Resistance from LED junction to metal slug.
j-ms
4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
WARM WHITE
COOL WHITE
380
480
580
680
780
0
50
100
150
200
250
300
350
WAVELENGTH - nm
DC FORWARD CURRENT - mA
Figure 4. Relative Intensity vs. Wavelength.
Figure 5. Relative Luminous Flux vs. Mono Pulse Current.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
300
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
4
-90
-60
-30
0
30
60
90
FORWARD VOLTAGE - V
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Forward Current vs. Forward Voltage.
Figure 7. Radiation Pattern.
1.4
1.4
tp
tp
D =
tp
T
tp
T
D =
IF
0.05
0.10
0.25
0.50
1.00
D =
IF
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
D =
T
T
0.05
0.10
0.25
0.50
1.00
0.00001 0.0001 0.001 0.01
0.1
1
10
100
0.00001 0.0001 0.001 0.01
0.1
1
10
100
PULSE DURATION, tp - sec
PULSE DURATION, tp - sec
Figure 8. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RqJ-A = 50°C/W.
Figure 9. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RqJ-A = 50°C/W.
5
120.0
110.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
WARM WHITE
COOL WHITE
25
50
75
100
125
25
50
75
100
125
JUNCTION TEMPERATURE, TJ - °C
JUNCTION TEMPERATURE, TJ - °C
Figure 10. Relative Light Output vs. Junction Temperature.
Figure 11. Forward Voltage Shift vs. Junction Temperature.
400
350
300
250
200
400
350
300
250
200
150
100
50
RθJ-MS = 10°C/W
RθJ-A = 30°C/W
RθJ-A = 40°C/W
RθJ-A = 50°C/W
150
100
50
0
0
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE, TA - °C
METAL SLUG TEMPERATURE, TMS - °C
Figure 12. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RqJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 13. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RqJ-MS = 10°C/W.
10.70 0.10
10 - 30 SEC.
255 - 260°C
8.40 0.10
3.1 0.10
3°C/SEC. MAX.
217°C
17.00 0.20
200°C
6°C/SEC. MAX.
150°C
1.00 0.10
3°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
5.08 0.10
TIME
(Acc. to J-STD-020C)
Figure 14. Recommended Reflow Soldering.
Figure 15. Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
6
Flux Bin Limit [x , x ]
Option Selection Details
3
4
Luminous Flux (lm) at I = 350mA
F
ASMT-Mx x 4 - N x x x x
1 2
3 4 5 6
x – Minimum Flux Bin
Bin
L
Min.
73.0
95.0
110.0
Max.
95.0
3
x – Maximum Flux Bin
4
x – Color Bin Selection
5
M
N
110.0
125.0
x – Packaging Option
6
Tolerance for each bin limits is 10ꢀ.
Color Bin Selections [x ]
5
Individual reel will contain parts from one full bin only.
Cool White
Warm White
O
A
B
C
D
E
Full Distribution
O
Full Distribution
A only
A only
A
B
C
D
E
B only
B only
C only
C only
D only
D only
E only
E only
F
F only
F
F only
N
P
A and C only
B and D only
E and C only
F and D only
E and F only
C and D only
A and B only
A, B, C and D only
C, D, E and F only
G
H
L
G only
H only
Q
R
U
W
Z
1
A and G only
B and H only
A and C only
B and D only
E and C only
F and D only
G and H only
E and F only
C and D only
A and B only
A, B, C and D only
G, H, A and B only
C, D, E and F only
M
N
P
Q
R
S
4
U
W
Z
1
2
4
7
Color Bin Limit
Color Bin Limit
Cool
White
Color Limits
(Chromaticity Coordinates)
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
Bin G
Bin H
X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Tolerance: 0.01
X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: 0.01
0.48
0.46
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
0.24
G
A
A
4.0k
4.5k
H
C
2.6k
C
B
3.0k
E
5.6k
B
Black Body Curve
3.5k
D
7k
D
4.0k
E
F
Black Body Curve
F
10k
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Figure 16. Color bins (Cool White)
Figure 17. Color bins (Warm White).
Packaging Option [x ]
Example
6
Selection
Option
ASMT-MW04-NKLZ1
0
Tube (for Moonstone® only)
Tray (for Moonstone® on MCPCB only)
ASMT-MW04-Nxxxx
X3 = K
X4 = L
X5 = Z
X6 = 1
– Cool White, Non-diffused
– Minimum Flux Bin K
– Maximum Flux Bin L
– Color Bin A and B only
– Tape and Reel Option
1
Tape and Reel
8
Packing Tube – Option 0
5.39
10.3
37.00
6.5
20.85
11.00
6.3
10.95
8.3
535.00
SIDE VIEW
TOP VIEW
Figure 18. Tube dimensions.
Tape and Reel – Option 1
A
Dim
AO
BO
KO
E
Value
8.80 0.10
16.45 0.10
3.60 0.10
1.75 0.10
11.50 0.10
24.0 0.10
16.0 0.10
F
B
B
W
P
A
Ko
P
Quantity/ 250 units
Reel
SECTION A
All dimensions in millimeters.
Ao
SECTION B
Figure 19. Carrier tape dimensions.
END
START
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
Figure 20. Carrier tape leader and trailer dimensions.
9
+1.00
−0.00
24.0
2.30
2.30
2.50 0.50
∅268.00
∅330.00 1.00
120.0º
Figure 21. Reel dimensions.
Packing Tray – Option 0 (for Moonstone® on MCPCB only)
Figure 22. Tray dimensions.
10
Handling Precaution
B. Control after opening the MBB
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C / 60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
Moisture Sensitivity
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5ꢀRH to ensure no LEDs have exceeded their
floor life of 672 hours.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀRH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
E. Baking is required if
– HIC “10ꢀ” indicator is not blue and “5ꢀ” indicator is
pink.
– The LEDs are exposed to condition of >30°C / 60ꢀ
RH at any time.
– The LED floor life exceeded 672hrs.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
Recommended baking condition: 60 5°C for 20hrs.
DISCLAIMER:Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3752EN - December 10, 2012
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