ASMT-MYL-4NKKU0 [AVAGO]
SINGLE COLOR LED, WARM WHITE, 5.26mm, ROHS COMPLIANT PACKAGE-2;
| 型号： | ASMT-MYL-4NKKU0 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, WARM WHITE, 5.26mm, ROHS COMPLIANT PACKAGE-2 光电 |
| 文件： | 总11页 (文件大小：227K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMT-Mxx4
Moonstone® 1W Power LED Light Source
Data Sheet
Description
Features
The Moonstone® 1W Power LED Light Source is a high per- ꢀ Available in Cool White & Warm White color
formance energy efficient device which can handle high
thermal and high driving current. The exposed pad design
has excellent heat transfer from the package to the moth-
ꢀ Energy efficient
ꢀ Exposed pad for excellent heat transfer
erboard.
ꢀ Suitable for reflow soldering process
ꢀ High current operation
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
ꢀ Long operation life
The package is compatible with reflow soldering. This ꢀ Wide viewing angle
will give more freedom and flexibility to the light source
designer.
ꢀ Silicone encapsulation
ꢀ Non-ESD sensitive (threshold > 16KV)
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
ꢀ MSL 2a products
Specifications
ꢀ InGaN Technology
ꢀ 4.0 V (max) at 350 mA
ꢀ 110° viewing angle
Applications
ꢀ Sign backlight, billboard illumination or backlight
ꢀ Exit sign or emergency sign lightings
ꢀ Commercial lightings
ꢀ Accent and marker lightings
ꢀ Pathway lighting
ꢀ Task lighting
ꢀ Reading lights
ꢀ Decorative lighting
ꢀ Garden lighting
ꢀ Architectural lighting
ꢀ Portable (flash light, bicycle head light
Package Dimension for Moonstone®
10.00
1
2
3
Anode
Cathode
Heat Sink
3.30
8.50
1.27
Metal Slug
3
Ø 5.26
LED
+
10.60
ZENER
−
8.50
Ø 8.00
2.00
5.25
1.30
2
1
0.81
5.08
Figure 1. Moonstone® package outline drawing.
Notes:
1. All dimensions are in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
3. Terminal finish: Ag plating.
Package Dimension for Moonstone® on MCPCB
1
2
3
Anode
16.00
2.50
60 °
Cathode
Heat Sink
∅ 5.00
∅ 3.00
∅ 19.00
14.00
20.00
R 1.60
4.00
3.00
19.00
24.00
1.40
2.30
1.60
1.30
3.30
4.90
4.60
19.90
Figure 2. MCPCB I package outline drawing.
Figure 3. MCPCB II package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is 0.1 mm unless otherwise specified.
2
Part Numbering System
ASMT-Mx1 x2 4 - N x3 x4 x5 x6
Packaging Option
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Moonstone®Type
0 – Non-diffused
B – Diffused
A - Non-diffused on MCPCB I
C - Diffused on MCPCB I
K - Non-diffused on MCPCB II
L - Diffused on MCPCB II
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 9 for selection details.
Device Selection Guide (T = 25°C)
j
[1,2]
Luminous Flux, Φ
(lm)
Test
Current
(mA)
Electrically
Isolated
Metal Slug
V
Dice
Technology
[3]
Part Number
Color
Min.
56.0
56.0
56.0
56.0
56.0
56.0
Typ.
Max.
95.0
124.0
95.0
95.0
124.0
95.0
ASMT-MWx24-NKL00
ASMT-MWx24-NKM00
ASMT-MYx24-NKL00
ASMT-MWx24-NKL00
ASMT-MWx24-NKM00
ASMT-MYx24-NKL00
Cool White
75.0
80.0
70.0
70.0
75.0
65.0
350
350
350
350
350
350
InGaN
Yes
Yes
Yes
Yes
Yes
Yes
Warm White
InGaN
InGaN
Cool White
Diffused
Warm White
Diffused
InGaN
Notes:
1.
Φ is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
V
2. Flux tolerance is 10 ꢀ.
3. Flux performance for respective part number is similar when device on MCPCB I or MCPCB II.
3
Absolute Maximum Ratings
Parameter
DC Forward Current [1]
ASMT-Mxx4
350
Units
mA
mA
mW
°C
Peak Pulsing Current [2]
1000
Power Dissipation
1400
LED Junction Temperature
LED Junction Temperature for short term application
Operating Metal Slug Temperature Range at 350 mA
Storage Temperature Range
Soldering Temperature
125
145
°C
-40 to +110
-40 to +120
Refer to Figure 13
Not recommended
°C
°C
Reverse Voltage [3]
Note:
1. Derate linearly based on Figure 11.
2. Pulse condition: duty factor = 10ꢀ, Frequency = 1 kHz.
3. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (T = 25°C)
J
Correlated Color Temperature, Viewing Angle,
Luminous Efficiency
(lm/W)
[2]
CCT (Kelvin)
2ꢁ½ (°)
Typ.
Part Number
Color
Min.
Max.
Typ.
61
65
57
57
61
53
ASMT-MWx24-NKL00
ASMT-MWx24-NKM00
ASMT-MYx24-NKL00
ASMT-MWx24-NKL00
ASMT-MWx24-NKM00
ASMT-MYx24-NKL00
Notes:
Cool White
4000
10000
10000
4000
110
4000
110
Warm White
2600
110
Cool White Diffused
4000
10000
10000
4000
110
4000
110
Warm White Diffused
2600
110
1. ꢁ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (T = 25°C)
J
Forward Voltage,
Thermal Resistance,
Rꢁ (°C/W)
j-ms
[1]
V
(Volts) at I = 350 mA
F
F
Dice Type
Min.
Typ.
Max.
Typ.
InGaN
Note:
2.8
3.5
4.0
10
1. Rꢁ
is the Thermal Resistance from LED junction to metal slug.
j-ms
4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.4
1.2
1
WARM WHITE
COOL WHITE
0.8
0.6
0.4
0.2
0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
0
50 100 150 200 250 300 350 400 450 500
DC FORWARD CURRENT - mA
Figure 4. Relative Intensity vs. Wavelength.
Figure 5. Relative Luminous Flux vs. Mono Pulse Current.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
500
450
400
350
300
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
4
-90
-60
-30
0
30
60
90
FORWARD VOLTAGE - V
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Forward Current vs. Forward Voltage.
Figure 7. Radiation Pattern.
1.4
1.4
tp
tp
D =
tp
T
tp
T
D =
IF
0.05
0.10
0.25
0.50
1.00
D =
IF
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
D =
T
T
0.05
0.10
0.25
0.50
1.00
0.00001 0.0001 0.001 0.01
0.1
1
10
100
0.00001 0.0001 0.001 0.01
0.1
1
10
100
PULSE DURATION, tp - sec
PULSE DURATION, tp - sec
Figure 8. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RꢁJ-A = 50°C/W.
Figure 9. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RꢁJ-A = 50°C/W.
5
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
WARM WHITE
COOL WHITE
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE, TJ - °C
Figure 10. Relative Light Output vs. Junction Temperature.
400
350
300
250
200
400
350
300
250
200
150
100
50
RꢀJ-MS = 10°C/W
RꢀJ-A = 30°C/W
RꢀJ-A = 40°C/W
RꢀJ-A = 50°C/W
150
100
50
0
0
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE, TA - °C
METAL SLUG TEMPERATURE, TMS - °C
Figure 11. Maximum Forward Current vs. Ambient Temperature.
Figure 12. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RꢁJ-A = 30°C/W, 40°C/W and 50°C/W.
Derated based on TJMAX = 125°C, RꢁJ-MS = 10°C/W.
10.70 0.10
10 - 30 SEC.
255 - 260°C
8.40 0.10
3.1 0.10
3°C/SEC. MAX.
217°C
17.00 0.20
200°C
6°C/SEC. MAX.
150°C
1.00 0.10
3°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
5.08 0.10
TIME
(Acc. to J-STD-020C)
Figure 13. Recommended Reflow Soldering.
Figure 14. Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
6
Flux Bin Limit [x , x ]
Option Selection Details
3
4
Luminous Flux (lm) at I = 350mA
F
ASMT-Mx x 4 - N x x x x
1 2
3 4 5 6
x – Minimum Flux Bin
Bin
K
Min.
56.0
73.0
95.0
Max.
73.0
95.0
124.0
3
x – Maximum Flux Bin
4
x – Color Bin Selection
5
L
x – Packaging Option
6
M
Tolerance for each bin limits is 10ꢀ.
Color Bin Selections [x ]
5
Individual reel will contain parts from one full bin only.
Cool White
Warm White
O
Full Distribution
A only
O
A
B
C
D
E
Full Distribution
A
B
C
D
E
A only
B only
B only
C only
C only
D only
D only
E only
E only
F
F only
F
F only
G
H
L
G only
N
P
A and C only
B and D only
E and C only
F and D only
E and F only
C and D only
A and B only
A, B, C and D only
C, D, E and F only
H only
A and G only
B and H only
A and C only
B and D only
E and C only
F and D only
G and H only
E and F only
C and D only
A and B only
A, B, C and D only
G, H, A and B only
C, D, E and F only
Q
R
U
W
Z
1
M
N
P
Q
R
S
4
U
W
Z
1
2
4
7
Color Bin Limit
Cool
White
Color Limits
(Chromaticity Coordinates)
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
Bin G
Bin H
X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin A
Bin B
Bin C
Bin D
Bin E
Bin F
X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerance: 0.01
X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: 0.01
0.48
0.46
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
G
A
A
4.0k
4.5k
C
2.6k
C
B
H
3.0k
E
5.6k
B
Black Body Curve
3.5k
D
7k
D
4.0k
E
Black Body Curve
F
10k
F
0.28
0.26
0.24
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Figure 15. Color bins (Cool White).
Figure 16. Color bins (Warm White).
Packaging Option [x ]
Example
6
ASMT-MW04-NKLZ1
Selection
Option
0
Tube (for Moonstone® only)
Tray (for Moonstone® on MCPCB only)
ASMT-MW04-Nxxxx – Cool White, Non-diffused
X = K
– Minimum Flux Bin K
– Maximum Flux Bin L
– Color Bin A and B only
– Tape and Reel Option
3
1
Tape and Reel
X = L
4
X = Z
5
X = 1
6
8
Packing Tube – Option 0
1.00
5.80
4.65
5.50
37.00
5.45
10.10
535.00
8.30
SIDE VIEW
TOP VIEW
Figure 17. Tube dimensions.
Tape and Reel – Option 1
A
Dim
AO
BO
KO
E
Value
8.80 0.10
16.45 0.10
3.60 0.10
1.75 0.10
11.50 0.10
24.0 0.10
16.0 0.10
F
B
B
W
P
A
Ko
P
Quantity/ 250 units
Reel
SECTION A
All dimensions in millimeters.
Ao
SECTION B
Figure 18. Carrier tape dimensions.
END
START
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
Figure 19. Carrier tape leader and trailer dimensions.
9
+1.00
−0.00
24.0
2.30
2.30
2.50 0.50
#268.00
#330.00 1.00
120.0º
Figure 20. Reel dimensions.
Packing Tray – Option 0 (for Moonstone® on MCPCB only)
Figure 21. Tray dimensions.
10
Handling Precaution
B. Control after opening the MBB
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C / 60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
Moisture Sensitivity
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5ꢀRH to ensure no LEDs have exceeded their
floor life of 672 hours.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀRH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
E. Baking is required if
– “60ꢀ”HIC indicator is NOT blue.
– The LEDs are exposed to condition of >30°C / 60ꢀ
RH at any time.
– The LED floor life exceeded 672hrs.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
Recommended baking condition: 60 5°C for 20hrs.
DISCLAIMER:Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1673EN - March 3, 2010
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