ASMT-QAB2-FCCBE [AVAGO]
SINGLE COLOR LED, AMBER, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4;
| 型号： | ASMT-QAB2-FCCBE |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, AMBER, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4 光电 |
| 文件： | 总9页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMT-QxB2-Fxxxx
Super 0.5W Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Description
Features
The Super 0.5 W Power PLCC-4 SMT LED is an extension • Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9
of Power PLCC-4 SMT LEDs. The package can be driven
at high current due to its superior package design. The
product is able to dissipate the heat more efficiently
compared to the Power PLCC-4 SMT LEDs. These LEDs
produce higher light output with better flux perfor-
mance compared to the Power PLCC-4 SMT LED.
mm)
• High reliability package with enhanced silicone resin
encapsulation
• High intensity brightness with optimum flux
performance using AllnGaP chip technologies
• Available in Red, Red Orange and Amber colors
• High optical efficiency
• Available in 8mm carrier tape and 7 inch reel
• Low thermal resistance
The Super 0.5 W Power PLCC-4 SMT LEDs are designed
for higher reliability, better performance, and operate
under a wide range of environmental conditions. The
performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh
conditions such as in automotive applications, and in
electronics signs and signals.
• Super wide viewing angle at 120 degrees
• Longer life time with minimum degradation due to
enhanced Silicone resin material
• JEDEC MSL 2a
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin (except for red),
to provide close uniformity.
Applications
• Exterior automotive
- Turn signals
- Side repeaters
Super 0.5 W Power PLCC-4 SMT LED is available in red,
red orange and amber colors.
- CHSML
- Rear combination lamp
- Side markers
- Truck clearance lamp
• Electronic signs and signals
- Channel lettering
- Contour lighting
- Indoor variable message sign
• Office automation, home appliances, industrial
equipment
- Front panel backlighting
- Push button backlighting
- Display backlighting
CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
1.9 0.2
2.8 0.2
2.2 0.2
0.8 0.1
0.15 (TYP.)
1.15 0.05
2.40
C
C
0.41 (TYP.)
3.6 0.2
3.2 0.2
0.56 (TYP.)
0.8 0.3
A
A
0.5 0.1
2.30 0.05
0.7 0.1
ANODE
MARKING
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS.
2. LEAD POLARITY AS SHOWN IN FIGURE 13.
3. TERMINAL FINISH: Ag PLATING.
4. ENCAPSULATION MATERIAL: SILICONE RESIN.
Figure 1. Package drawing
Table 1. Device Selection Guide (T = 25 °C)
J
[1]
Luminous Flux, Φ (lm)
V
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Color
Part Number
Dice Technology
Amber
ASMT-QAB2-FDE0E
ASMT-QHB2-FEF0E
ASMT-QRB2-FCD0E
9.0
11.4
14.0
9.8
15.0
19.5
11.5
150
150
150
AlInGaP
Red Orange
11.5
7.0
AlInGaP
AlInGaP
Red
Notes:
1. Φ is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
V
2. Tolerance = 12ꢀ.
Part Numbering System
A S M T – Q X B 2 – F X
X X X
3 4 5
1
2
Packaging Option
Color Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
A - Amber
H - Red Orange
R - Red
2
Table 2. Absolute Maximum Ratings (T = 25°C)
A
Parameters
ASMT-QxB2-Fxxxx
150 mA
DC Forward Current [1]
Peak Forward Current [2]
Power Dissipation
Reverse Voltage
200 mA
470 mW
5 V
Junction Temperature
Operating Temperature
Storage Temperature
125°C
-40°C to +110°C
-40°C to +110°C
Notes:
1. Derate l inearly as shown in Figure 6.
2. Duty Factor = 10ꢀ, Frequency = 1kHz.
Table 3. Optical Characteristics (T = 25°C)
J
Dominant
Viewing
Luminous
Efficiency
e
Total Flux /
1 [2]
Wavelength
Angle 2θ /
Luminous Intensity
F (lm) / I (cd)
2
[1]
λ
(nm)
(Degrees)
η (lm/W)
D
V
V
Dice
Color
Part Number
Technology
AlInGaP
AlInGaP
AlInGaP
Typ.
Typ.
120
120
120
Typ.
28
Typ.
3.3
3.3
3.3
Amber
Red Orange
Red
ASMT-QAB2-Fxxxx
ASMT-QHB2-Fxxxx
ASMT-QRB2-Fxxxx
594.5
617.0
624.0
35
21
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity diagram and represents the color of the device.
D
2. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
Table 4. Electrical Characteristics (T = 25°C)
J
Forward Voltage V
Reverse Voltage
R
Thermal Resistance
J-P
F
(Volts) @ I = 150 mA
V @ 100 μA
Rθ (°C/W)
F
Part Number
Typ.
2.70
2.70
3.10
Max.
3.25
3.25
3.55
Min.
5
ASMT-QAB2-Fxxxx
ASMT-QHB2-Fxxxx
ASMT-QRB2-Fxxxx
60
60
60
5
5
3
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
200
180
160
140
120
100
80
AlInGaP
AlInGaP AMBER
RED-ORANGE
AlInGaP AMBER
AlInGaP RED
60
AlInGaP RED
3
0.2
0.1
40
AlInGaP
20
RED-ORANGE
0
0
380
430
480
530
580
630
680
730
780
0
1
2
FORWARD VOLTAGE – V
4
WAVELENGTH – nm
Figure 2. Relative intensity vs. wavelength
Figure 3. Forward current vs. forward voltage
1.2
2.2
2.0
AMBER
1.8
1.0
AMBER
RED-ORANGE
1.6
0.8
0.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
RED/RED-ORANGE
0.4
0.2
0
RED
0
50
100
150
200
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE – C
DC FORWARD CURRENT – mA
Figure 4. Relative intensity vs. forward current
Figure 5. Relative intensity vs. temperature
160
160
140
RJA =
80 °C/W
140
RJA = 100 °C/W
AMBER / RED-ORANGE
RED
120
120
100
80
RJA = 110 °C/W
100
RJA = 130 °C/W
80
60
40
60
40
20
0
20
0
0
20
40
60
80
100
120
0
20
40
60
80
100
120
JUNCTION TEMPERATURE – °C
TEMPERATURE – °C
Figure 6a. Maximum forward current vs. ambient temperature. Derated
based on TJMAX = 125°C, RθJ-A = 130°C/W, 110°C/W, 100°C/W and 80°C/W.
Figure 6b. Maximum forward current vs. solder point temperature.
Derated based on TJMAX = 125°C, RJP = 60°C/W.
4
0.30
0.20
0.10
0.00
0.30
0.20
0.10
0.00
tp
tp
T
D =
0.05
0.10
0.25
0.50
1
D =
IF
T
D =
0.05
0.10
0.25
0.50
1
tp
tp
T
D =
IF
1.00E+01
T
1.00E-05
1.00E-03
1.00E-01
tp - Time - (S)
1.00E+01
1.00E-05
1.00E-03
1.00E-01
tp - Time - (S)
Figure 7a. Maximum pulse current vs. ambient temperature. Derated
based on TA = 25°C, RθJ-A =110°C/W.
Figure 7b. Maximum pulse current vs. ambient temperature.Derated vased
on TA= 85°C, RθJ-P =110°C/W.
630
0.15
0.10
0.05
0
AlInGaP RED
620
AlInGaP RED-ORANGE
610
600
-0.05
-0.10
-0.15
AlInGaP AMBER
590
580
-50
-25
0
25
50
75
100
0
50
100
150
200
TJ – JUNCTION TEMPERATURE – C
FORWARD CURRENT – mA
Figure 8. Dominant wavelength vs. forward current – AlInGaP devices
Figure 9. Forward voltage shift vs. temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 10. Radiation pattern
5
10 - 30 SEC.
255 - 260 °C
3 °C/SEC. MAX.
217 °C
200 °C
-6 °C/SEC. MAX.
ID
Note: Diameter "ID" should
be bigger than 2.3mm
150 °C
3 °C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure11. Recommended pick and place nozzle size
Figure 12. Recommended Pb-free reflow soldering profile
Note: For detail information on reflow soldering of Avago sur-
face mount LEDs, do refer to Avago Application Note AN 1060
Surface Mounting SMT LED Indicator Components.
2.4
0.6
0.9 X 6
C
C
C
C
1.3 x 6
A
A
0.4
A
A
1.1
4.6
A
A
ANODE
MARKING
CATHODE
ANODE
C
0.3
A
SOLDER MASK
ANODE
MARKING
MINIMUM 55 mm2 OF ANODE PAD
FOR IMPROVED HEAT DISSIPATION
Figure 13. Recommended soldering pad pattern
6
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 14. Tape leader and trailer dimensions
4
0.1
4
0.1
2 0.0ꢀ
+0.1
–0
1.7ꢀ 0.1
2.29 0.1
Ø1.ꢀ
C
C
3.ꢀ 0.0ꢀ
3.8 0.1
+0.3
8
–0.1
A
A
+0.1
3.0ꢀ 0.1
Ø1
–0
0.229 0.01
8°
ALL DIMENSIONS IN mm.
Figure 15. Tape dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 16. Reeling orientation
7
Device Color (X )
Color Bin Select (X )
Individual reel will contain parts from one full bin only.
1
4
A
Amber
X
4
H
R
Red Orange
Red
0
Full Distribution
1 and 2 only
A
B
C
D
E
2 and 3 only
3 and 4 only
Flux Bin Select (X X )
2 3
Individual reel will contain parts from one bin only.
4 and 5 only
5 and 6 only
X2
X3
Min Flux Bin
Max Flux Bin
G
H
J
1, 2 and 3 only
2, 3 and 4 only
3, 4 and 5 only
4, 5 and 6 only
1, 2, 3 and 4 only
2, 3, 4 and 5 only
3, 4, 5 and 6 only
1, 2, 3, 4 and 5 only
2, 3, 4, 5 and 6 only
Special Color Bin
K
M
N
P
R
S
Flux Bin Limits
Bin ID
Min. (lm)
4.30
Max. (lm)
5.50
A
B
C
D
E
5.50
7.00
7.00
9.00
Z
9.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
73.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
F
G
H
J
Color Bin Limits
Amber/Yellow
Min. (nm)
583.0
Max. (nm)
586.0
K
L
2
3
4
5
6
586.0
589.0
589.0
592.0
Tolerance of each bin limit = 12ꢀ.
592.0
595.0
595.0
598.0
Red Orange
Min. (nm)
611.0
Max. (nm)
616.0
1
2
3
616.0
620.0
620.0
625.0
Red
Min. (nm)
Max. (nm)
Full Distribution
620.0
635.0
Tolerance of each bin limit = 1 nm.
8
VF Binning
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precaution when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
Bin
Min.
2.35
2.50
2.65
2.80
2.95
3.10
3.25
3.40
Max.
2.50
2.65
2.80
2.95
3.10
3.25
3.40
3.55
2D
2E
2F
2G
2H
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90ꢀRH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
2J
2K
2L
Tolerance of each bin = 0.1 V.
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read im-
mediately upon opening of MBB.
Packaging Option (X5 )
- The LEDs must be kept at <30°C/60ꢀRH at all times
and all high temperature related processes, includ-
ing soldering, curing or rework, need to be com-
pleted within 672 hours.
Option
Test Current
Package Type
Reel Size
E
150 mA
Top Mount
7 Inch
C. Control for unfinished reel
- For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
D. Control of assembled boards
Handling Precaution
The encapsulation of the product is made of silicone
for better reliability of the product. As silicone is a soft
material, please do not press on the silicone or poke a
sharp object onto the silicone. This might damage the
product and cause premature failure. During assembly
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for
detailed information.
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in sealed MBB with desiccant or desic-
cator at <5ꢀ RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
- “10ꢀ”is Not Green and “5ꢀ”HIC indicator is Azure.
- The LEDs are exposed to condition of >30°C/60ꢀ
RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-0232EN - September 30, 2011
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