ASMT-QBBC-NFFCE
更新时间:2024-09-19 00:16:05
品牌:AVAGO
描述:Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4
ASMT-QBBC-NFFCE 概述
Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4
ASMT-QBBC-NFFCE 数据手册
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PDF下载ASMT-QxBC-Nxxxx
Super 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
Features
The Super 0.5W Power PLCC-4 SMT LED is Blue mid-Power ꢀ Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
PLCC-4 SMT LEDs using InGaN chip technology. The
package can be driven at high current due to its superior
package design. The product is able to dissipate the heat
more efficiently compared to the Power PLCC-4 SMT LEDs.
ꢀ High reliability package with enhanced silicone resin
encapsulation
ꢀ High brightness with optimum flux performance using
InGaN chip technologies
These LEDs produce higher light output with better flux
performance compared to the Power PLCC-4 SMT LED.
ꢀ Available in Blue color
ꢀ Available in 8mm carrier tape & 7 inch reel
ꢀ Low Thermal Resistance 40°C/W
ꢀ Wide viewing angle at 120 degree
ꢀ JEDEC MSL 2
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs make
them uniquely suitable for use in harsh conditions such as
in automotive applications, and in electronics signs and
signals.
Applications
1. Electronic signs and signals
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
a. Decorative/Advertising Lighting
b. Channel Lettering
c. Signs Luminaire
d. RGB Backlighting
CAUTION: ASMT-QxBC-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
2.8 ꢀ.2
2.2 ꢀ.2
ꢀ.6 ꢀ.3
1.15 ꢀ.2
1.9 ꢀ.2
A
A
C
C
ꢀ.7
CATHODE
MARKING
Notes:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 13.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Figure 1. Package Drawing
Table 1. Device Selection Guide (T = 25°C)
J
[1]
Luminous Flux, ꢁ (lm)
V
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Color
Part Number
Dice Technology
Blue
ASMT-QBBC-NACxE
4.3
7.0
9.0
150
InGaN
Notes:
1.
ꢁ is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
V
2. Tolerance = 12ꢀ
Part Numbering System
ASMT- Q X1 B C – N X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
B – Blue
2
Table 2. Absolute Maximum Ratings (T = 25°C)
A
Parameters
ASMT-QxBC-Nxxxx
150 mA
DC Forward Current [1]
Peak Forward Current [2]
Power Dissipation
300 mA
570 mW
Reverse Voltage, VR @ 10 μA
Junction Temperature
Operating Temperature
Storage Temperature
4
125°C
-40°C to +120°C
-40°C to +120°C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10ꢀ, Frequency = 1kHz
Table 3. Optical Characteristics (T = 25°C)
J
Peak
Wavelength
Dominant
Wavelength
ꢂ (nm)
D
Viewing
Angle 2ꢃ½
(Degrees)
Luminous
Efficiency
ꢄe (lm/W)
Total Flux / Lumi-
nous Intensity
ꢁ (lm) / I (cd)
[1]
ꢂ
PEAK
(nm)
V
V
Dice
Color
Part Number
Technology
Typ.
Typ.
Typ.
Typ.
Typ.
2.70
Blue
ASMT-QBBC-Nxxxx
InGaN
458.0
464.0
120
10
Notes:
1. ꢃ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (T = 25°C)
J
Forward Voltage
Thermal
Resistance
V (Volts) @ I = 15ꢀ mA
F
F
Part Number
Typ.
3.4
Max.
Rꢃ (°C/W)
J-P
ASMT-QBBC-NxxxE
3.8
40
3
300
250
200
150
100
50
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
380 430 480 530 580 630 680 730 780
0
1
2
3
4
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 2. Relative Intensity Vs. Wavelength
Figure 3. Forward Current Vs. Forward Voltage.
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
50
100
150
200
250
300
-50
-25
0
25
50
75
100
DC FORWARD CURRENT - mA
TJ - JUNCTION TEMPERATURE - °C
Figure 4. Relative Flux vs. Forward Current
Figure 5. Relative Flux Vs. Temperature
160
140
160
140
120
RθJA = 90°C/W
RθJP = 40°C/W
120
100
80
60
40
20
0
RθJA = 110°C/W
100
80
60
40
20
0
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated
Based on TJMAX = 125°C, RꢃJ-A = 11ꢀ°C/W & 9ꢀ°C/W.
Based on TJMAX = 125°C, RꢃJ-P = 4ꢀ°C/W.
4
0.40
0.30
0.20
0.10
0.00
0.40
0.30
0.20
0.10
0.00
D =
0.05
0.10
0.25
0.50
1
t
p
t
T
p
D =
I
F
T
D =
0.05
0.10
0.25
0.50
1
t
p
t
T
p
D =
I
F
T
1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02
1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02
tp - Time - (S)
t - Time - (S)
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based
on TA = 25°C, RꢃJ-A = 11ꢀ°C/W.
on TA = 85°C, RꢃJ-A = 11ꢀ°C/W.
510
500
490
480
470
460
450
440
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
0
50
100
150
200
250
300
-50
-25
0
25
50
75
100
FORWARD CURRENT - mA
TJ - JUNCTION TEMPERATURE - °C
Figure 8. Chromaticity Shift Vs. Forward Current
Figure 9. Forward Voltage Shift Vs. Temperature.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 1ꢀ. Radiation Pattern
5
1ꢀ - 3ꢀ SEC.
255 - 26ꢀ°C
3°C/SEC. MAX.
217°C
2ꢀꢀ°C
6°C/SEC. MAX.
15ꢀ°C
D
3°C/SEC. MAX.
6ꢀ - 12ꢀ SEC.
1ꢀꢀ SEC. MAX.
TIME
(Acc. to J-STD-ꢀ2ꢀC)
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
Note: Diameter "D" should be smaller than 2.2mm
Figure 12. Recommended Pb-free Reflow Soldering Profile
Figure 11. Recommended Pick and Place Nozzle Size
2.4
0.6
0.9 X 6
1.3 x 6
A
C
A
C
0.4
A
C
A
C
1.1
4.6
C
C
0.3
CATHODE
MARKING
SOLDER MASK
ANODE
A
CATHODE
MARKING
MINIMUM 55 mm2 OF CATHODE PAD
CATHODE
C
FOR IMPROVED HEAT DISSIPATION
Figure 13. Recommended Soldering Pad Pattern
6
TRAILER
COMPONENT
LEADER
2ꢀꢀ mm MIN. FOR Ø18ꢀ REEL.
2ꢀꢀ mm MIN. FOR Ø33ꢀ REEL.
48ꢀ mm MIN. FOR Ø18ꢀ REEL.
96ꢀ mm MIN. FOR Ø33ꢀ REEL.
C
A
USER FEED DIRECTION
Figure 14. Tape Leader and Trailer Dimensions
4
0.1
4
0.1
2 0.05
+0.1
–0
1.75 0.1
2.29 0.1
Ø1.5
C
C
3.5 0.05
3.8 0.1
+0.3
–0.1
8
A
A
+0.1
3.05 0.1
Ø1
–0
0.229 0.01
8°
ALL DIMENSIONS IN mm.
Figure 15. Tape Dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 16. Reeling Orientation
7
Device Color (X )
Color Bin Select (X4)
1
Individual reel will contain parts from one full bin only.
B
Blue
X4
0
Full Distribution
1 and 2 only
Flux Bin Select (X X )
2 3
A
B
C
G
H
Z
Individual reel will contain parts from one bin only
2 and 3 only
X2
X3
Min Flux Bin
Max Flux Bin
3 and 4 only
1, 2 and 3 only
2, 3 and 4 only
Special binning
Flux Bin Limits
Bin ID
Min. (lm)
3.40
Max. (lm)
4.30
0
A
B
C
D
E
Color Bin Limits
4.30
5.50
Blue
Min. (nm)
460.0
Max. (nm)
465.0
5.50
7.00
1
2
3
4
7.00
9.00
465.0
470.0
9.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
73.00
470.0
475.0
11.50
15.00
19.50
25.50
33.00
43.00
56.00
475.0
480.0
F
Tolerance of each bin limit = 1 nm
G
H
J
V Bin Limits
F
Bin ID
S4
Min.
2.90
3.20
3.50
Max.
3.20
3.50
3.80
K
L
S5
Tolerance of each bin limit = 12ꢀ
S6
Tolerance of each bin limit = 0.1V
Packaging Option (X )
5
Option
Test Current
Package Type
Reel Size
E
150mA
Top Mount
7 Inch
8
Handling Precaution
The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft
material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product
and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to
Avago Application Note AN 5288 for detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at <40°C/90ꢀRH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the
original MSL rating.
– It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
– The LEDs must be kept at <30°C / 60ꢀRH at all time and all high temperature related process including soldering,
curing or rework need to be completed within 1 year.
C. Control for unfinished reel
– For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5ꢀRH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at <5ꢀRH to ensure no LEDs have exceeded their floor life of 1
year.
E. Baking is required if
– “60ꢀ”HIC indicator is NOT Green.
– The LEDs are exposed to condition of >30°C/60ꢀ RH at any time.
– The LEDs floor life exceeded 1 year.
Recommended baking condition: 60 5°C for 20 hours.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1885EN - April 8, 2010
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