HCPL-2219 [AVAGO]

Low Input Current Logic Gate Optocouplers; 低输入电流逻辑门光电耦合器
HCPL-2219
型号: HCPL-2219
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

Low Input Current Logic Gate Optocouplers
低输入电流逻辑门光电耦合器

光电 输出元件 栅
文件: 总13页 (文件大小:426K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HCPL-2200,HCPL-2219  
LowInputCurrentLogicGateOptocouplers  
DataSheet  
Description  
Features  
The HCPL-2200/2219 are optically coupled logic gates • 2.5 kV/ µs minimum Common Mode Rejection (CMR) at  
that combine a GaAsP LED and an integrated high gain  
photo detector. The detector has a three state output  
stage and has a detector thresholdwithhysteresis. The  
three state output eliminates the need for a pullup  
resistor and allows for direct drive of data busses. The  
VCM = 400 V (HCPL-2219)  
Compatible with LSTTL, TTL, and CMOS logic  
• Wide V range (4.5 to 20 V)  
CC  
• 2.5 Mbd guaranteed over temperature  
hysteresis provides differential mode noise immunity Low input current (1.6 mA)  
and eliminates the potential for output signal chatter.  
Three state output (no pullup resistor required)  
Guaranteed performance from 0°C to 85°C  
Asuperiorinternalshieldon theHCPL-2219guarantees  
common mode transient immunity of 2.5 kV/µs at a  
common mode voltage of 400 volts.  
Hysteresis  
• Safety approval  
UL recognized -3750 V rms for 1 minute  
CSA approved  
The Electrical and Switching Characteristics of the  
HCPL-2200/2219 are guaranteed over the tempera-  
– IEC/ EN/ DIN EN 60747-5-2 approved with  
VIORM = 630 Vpeak (HCPL-2219 Option 060 only)  
ture range of 0°C to 85°C and a V range of 4.5 volts to  
CC  
• MIL-PRF-38534 hermetic version available  
(HCPL-5200/ 1)  
20volts. LowI andwideV rangeallowcompatibility  
F
CC  
with TTL, LSTTL, and CMOS logic and result in lower  
power consumption compared to other high speed  
optocouplers. Logic signals are transmitted with a Applications  
typical propagation delay of 160 nsec.  
• Isolation of high speed logic systems  
The HCPL-2200/2219 are useful for isolating high  
speed logic interfaces, buffering of input and output  
lines, and implementing isolated line receivers in  
high noise environments.  
Computer-peripheral interfaces  
• Microprocessor system interfaces  
Ground loop elimination  
• Pulse transformer replacement  
• Isolated buss driver  
Functional Diagram  
High speed line receiver  
NC  
ANODE  
CATHODE  
NC  
1
2
3
4
8
7
6
5
V
V
V
CC  
TRUTH TABLE  
(POSITIVE LOGIC)  
O
LED  
ENABLE OUTPUT  
ON  
OFF  
ON  
H
H
L
L
Z
Z
H
L
E
OFF  
GND  
SHIELD  
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this  
component to prevent damage and/or degradation which may be induced by ESD.  
Selection Guide  
Minimum CMR  
Small-Outline  
SO-8  
Widebody  
(400 Mil)  
8-Pin DIP (300 Mil)  
Hermetic  
Input On-  
Current  
(mA)  
Single  
Channel  
Package  
Dual  
Channel  
Package  
Single  
Channel  
Package  
Single  
Channel  
Package  
Single and Dual  
Channel  
dV/ dt  
(V/ µs)  
V
(V)  
CM  
Packages  
[1]  
1,000  
50  
1.6  
HCPL-2200  
HCPL-2201  
HCPL-2202  
HCPL-0201  
HCNW2201  
1.8  
1.6  
1.6  
HCPL-2231  
HCPL-2232  
[1]  
2,500  
400  
HCPL-2219  
[2]  
[2]  
5,000  
300  
HCPL-2211  
HCPL-2212  
HCPL-0211  
HCNW2211  
1.8  
2.0  
1,000  
50  
HCPL-52XX  
HCPL-62XX  
Notes:  
1. HCPL-2200/ 2219 devices include output enable/ disable functionality.  
2. Minimum CMR of 10 kV/ µs with VCM = 1000 V can be achieved with input current, IF, of 5 mA.  
2
Ordering Information  
HCPL-2200, HCPL-2219 are UL Recognized with 3750 Vrms for 1 minute per UL1577 and are approved  
under CSA Component Acceptance Notice #5, File CA 88324.  
Option  
Part  
RoHS  
non RoHS  
Surface Gull  
Tape  
UL 5000 Vrms/ IEC/ EN/ DIN  
Number Compliant Compliant Package  
Mount  
Wing & Reel 1 Minute rating EN 60747-5-2 Quantity  
-000E  
HCPL-2200 -300E  
-500E  
no option 300 mil DIP-8  
50 per tube  
-300  
X
X
X
X
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
-500  
X
X
X
-000E  
no option 300 mil DIP-8  
-300E  
-300  
-500  
-060  
-360  
-560  
X
X
X
X
HCPL-2219 -500E  
-060E  
X
X
X
-360E  
X
X
X
X
-560E  
To order, choose a part number from the part number column and combine with the desired option from  
the option column to form an order entry.  
Example 1:  
HCPL-2219-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel  
packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant.  
Example 2:  
HCPL-2200 to order product of 300 mil DIP package in Tube packaging and non RoHS compliant.  
Option datasheets are available. Contact your Avago sales representative or authorized distributor for  
information.  
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15,  
2001 and RoHS compliant will use ‘–XXXE.’  
Schematic  
I
CC  
V
CC  
8
I
F
I
O
+
V
V
O
2
7
6
5
V
F
I
E
E
3
GND  
SHIELD  
3
Package Outline Drawings  
8-Pin DIP Package  
7.62 ± 0.25  
(0.300 ± 0.010)  
9.65 ± 0.25  
(0.380 ± 0.010)  
8
7
6
5
TYPE NUMBER  
6.35 ± 0.25  
(0.250 ± 0.010)  
OPTION CODE*  
DATE CODE  
A XXXXZ  
YYWW  
U R  
UL  
1
2
3
4
RECOGNITION  
1.78 (0.070) MAX.  
1.19 (0.047) MAX.  
+ 0.076  
- 0.051  
0.254  
5° TYP.  
+ 0.003)  
- 0.002)  
(0.010  
3.56 ± 0.13  
(0.140 ± 0.005)  
4.70 (0.185) MAX.  
0.51 (0.020) MIN.  
2.92 (0.115) MIN.  
DIMENSIONS IN MILLIMETERS AND (INCHES).  
*MARKING CODE LETTER FOR OPTION NUMBERS.  
"V" = OPTION 060  
OPTION NUMBERS 300 AND 500 NOT MARKED.  
1.080 ± 0.320  
0.65 (0.025) MAX.  
(0.043 ± 0.013)  
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.  
2.54 ± 0.25  
(0.100 ± 0.010)  
8-Pin DIP Package with Gull Wing Surface Mount Option 300  
LAND PATTERN RECOMMENDATION  
1.016 (0.040)  
9.65 ± 0.25  
(0.380 ± 0.010)  
6
5
8
1
7
6.350 ± 0.25  
(0.250 ± 0.010)  
10.9 (0.430)  
2
3
4
2.0 (0.080)  
1.27 (0.050)  
9.65 ± 0.25  
(0.380 ± 0.010)  
1.780  
(0.070)  
MAX.  
1.19  
(0.047)  
MAX.  
7.62 ± 0.25  
(0.300 ± 0.010)  
+ 0.076  
- 0.051  
0.254  
3.56 ± 0.13  
(0.140 ± 0.005)  
+ 0.003)  
- 0.002)  
(0.010  
1.080 ± 0.320  
(0.043 ± 0.013)  
0.635 ± 0.25  
(0.025 ± 0.010)  
12° NOM.  
0.635 ± 0.130  
(0.025 ± 0.005)  
2.54  
(0.100)  
BSC  
DIMENSIONS IN MILLIMETERS (INCHES).  
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).  
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.  
4
Solder Reflow Thermal Profile  
Regulatory Information  
300  
The HCPL-2200/2219 have been  
approved by the following  
organizations:  
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.  
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.  
PEAK  
TEMP.  
245°C  
PEAK  
TEMP.  
240°C  
PEAK  
TEMP.  
230°C  
UL  
200  
100  
0
2.5°C ± 0.5°C/SEC.  
SOLDERING  
TIME  
200°C  
Recognized under UL 1577,  
Component Recognition Program,  
File E55361.  
30  
160°C  
150°C  
140°C  
SEC.  
30  
SEC.  
3°C + 1°C/–0.5°C  
PREHEATING TIME  
150°C, 90 + 30 SEC.  
CSA  
50 SEC.  
Approved under CSA Component  
Acceptance Notice #5, File CA  
88324.  
TIGHT  
TYPICAL  
LOOSE  
ROOM  
TEMPERATURE  
0
50  
100  
150  
200  
250  
TIME (SECONDS)  
IEC/ EN/ DIN EN 60747-5-2  
Note: Non-halide flux should be used.  
Approved under:  
IEC 60747-5-2:1997 + A1:2002  
EN 60747-5-2:2001 + A1:2002  
DIN EN 60747-5-2 (VDE 0884  
Teil 2):2003-01.  
Recommended Pb-Free IR Profile  
TIME WITHIN 5 °C of ACTUAL  
PEAKTEMPERATURE  
t
(Option 060 only)  
p
20-40 SEC.  
260 +0/-5 °C  
T
T
p
217 °C  
L
RAMP-UP  
3 °C/SEC. MAX.  
RAMP-DOWN  
6 °C/SEC. MAX.  
150 - 200 °C  
T
smax  
T
smin  
t
s
t
L
60 to 150 SEC.  
PREHEAT  
60 to 180 SEC.  
25  
t 25 °C to PEAK  
TIME  
NOTES:  
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.  
= 200 °C, T = 150 °C  
T
smax  
smin  
Note: Non-halide flux should be used.  
Insulation and Safety Related Specifications  
Parameter  
Symbol  
Value  
Units  
Conditions  
Min. External Air Gap  
(External Clearance)  
L(IO1)  
7.1  
mm  
Measured from input terminals to output terminals,  
shortest distance through air.  
Min. External  
Tracking Path  
(External Creepage)  
L(IO2)  
7.4  
0.08  
200  
IIIa  
mm  
mm  
V
Measured from input terminals to output terminals,  
shortest distance path along body.  
Minimum Internal  
Plastic Gap  
(Internal Clearance)  
Through insulation distance, conductor to conductor,  
usually the direct distance between the photoemitter  
and photodetector inside the optocoupler cavity.  
Tracking Resistance  
(Comparative  
Tracking Index)  
CTI  
DIN IEC 112/ VDE 0303 Part 1  
Isolation Group  
Material Group (DIN VDE 0110, 1/ 89, Table 1)  
Option 300 – surface mount classification is Class A in accordance with CECC 00802.  
5
IEC/ EN/ DIN EN 60747-5-2 Insulation Related Characteristics (HCPL-2219 OPTION 060 ONLY)  
Description  
Symbol  
Characteristic  
Units  
Installation classification per DIN VDE 0110/ 1.89, Table 1  
for rated mains voltage 300 V rms  
I-IV  
I-III  
for rated mains voltage 450 V rms  
Climatic Classification  
55/ 85/ 21  
2
Pollution Degree (DIN VDE 0110/ 1.89)  
Maximum Working Insulation Voltage  
Input to Output Test Voltage, Method b*  
V
IORM  
630  
V peak  
Vpeak  
V
x 1.875 = V , 100% Production Test with t = 1 sec,  
V
PR  
1181  
945  
IORM  
PR  
m
Partial Discharge < 5 pC  
Input to Output Test Voltage, Method a*  
V
x 1.5 = V , Type and sample test,  
V
PR  
Vpeak  
Vpeak  
IORM  
PR  
t = 60 sec, Partial Discharge < 5 pC  
m
Highest Allowable Overvoltage*  
(Transient Overvoltage, t = 10 sec)  
V
IOTM  
6000  
ini  
Safety Limiting Values  
(Maximum values allowed in the event of a failure,  
also see Figure 12, Thermal Derating curve.)  
Case Temperature  
Input Current  
Output Power  
T
175  
230  
600  
°C  
mA  
mW  
S
I
S,INPUT  
P
S,OUTPUT  
9
Insulation Resistance at T , V = 500 V  
R
S
10  
S
IO  
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/ EN/ DIN EN 60747-5-2, for a  
detailed description.  
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.  
6
Absolute Maximum Ratings  
(No Derating Required up to 70°C)  
Parameter  
Symbol  
Min.  
-55  
Max.  
125  
85  
Units  
°C  
Note  
Storage Temperature  
Operating Temperature  
Average Forward Input Current  
T
S
T
A
-40  
°C  
1
I
10  
mA  
A
F(AVG)  
Peak Transient Input Current  
I
1.0  
F(TRAN)  
(1 µs Pulse Width, 300 pps)  
Reverse Input Voltage  
V
5
25  
20  
20  
20  
210  
V
mA  
V
R
Average Output Current  
Supply Voltage  
I
O
V
CC  
0
Three State Enable Voltage  
Output Voltage  
V
E
-0.5  
-0.5  
V
V
O
V
Total Package Power Dissipation  
Lead Solder Temperature  
Solder Reflow Temperature Profile  
P
T
mW  
1
260°C for 10 sec., 1.6 mm below seating plane  
See Package Outline Drawings section  
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
4.5  
2.0  
0
Max.  
20  
Units  
Power Supply Voltage  
Enable Voltage High  
Enable Voltage Low  
Forward Input Current  
Forward Input Current  
Operating Temperature  
Fan Out  
V
CC  
V
V
V
EH  
20  
V
EL  
0.8  
5
V
IF(ON)  
IF(OFF)  
1.6*  
mA  
0.1  
85[1]  
4
mA  
T
A
0
°C  
N
TTL Loads  
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit  
at least a 20% CTR degradation guardband.  
7
Electrical Specifications  
For 0°C T [1] 85°C, 4.5 V V 20 V, 1.6 mA IF(ON) 5 mA, 2.0 V V 20 V, 0.0 V V 0.8 V, 0 mA IF(OFF) 0.1 mA.  
A
CC  
EH  
EL  
All Typicals at T = 25°C, V = 5 V, IF(ON) = 3 mA unless otherwise specified. See Note 7.  
A
CC  
Parameter  
Sym.  
Min. Typ. Max. Units  
Test Conditions  
Fig. Note  
Logic Low  
V
OL  
0.5  
V
IOL = 6.4 mA (4 TTL Loads)  
1
Output Voltage  
Logic High  
Output Voltage  
V
2.4  
2.0  
*
V
IOH = -2.6 mA *V = V - 2.1 V  
2
OH  
OH  
CC  
Output Leakage  
Current (VOUT > V )  
IOHH  
100  
500  
µA V = 5.5 V  
IF = 5 mA  
O
V = 4.5 V  
CC  
CC  
µA  
V
V = 20 V  
O
Logic High Enable  
Voltage  
V
EH  
Logic Low Enable  
Voltage  
V
EL  
0.8  
V
Logic High Enable  
Current  
IEH  
20  
µA V = 2.7 V  
EN  
100  
µA V = 5.5 V  
EN  
0.004 250  
µA  
VEN = 20 V  
Logic Low Enable  
Current  
IEL  
-0.32 mA V = 0.4 V  
EN  
Logic Low Supply  
Current  
ICCL  
IF = 0 mA  
IO = Open  
V = Don’t Care  
E
4.5  
5.25  
2.7  
6.0  
7.5  
mA V = 5.5 V  
CC  
mA V =20V  
CC  
Logic High Supply  
Current  
ICCH  
IF = 5 mA  
IO = Open  
V = Don’t Care  
E
4.5  
6.0  
-20  
mA V =5.5V  
CC  
mA V =20V  
3.1  
CC  
High Impedance  
State Output Current  
IOZL  
IOZH  
µA V = 0.4 V  
V = 2 V,  
O
EN  
IF = 5 mA  
20  
µA V = 2.4 V  
V = 2 V,  
EN  
O
IF = 5 mA  
100  
500  
µA V = 5.5 V  
O
µA V = 20 V  
O
Logic Low Short  
Circuit Output  
Current  
IOSL  
IOSH  
IHYS  
2
2
25  
40  
mA V =V = 5.5 V  
IF = 0 mA  
O
CC  
mA V =V = 20V  
O
CC  
Logic High Short  
Circuit Output  
Current  
I = 5 mA,  
F
mA V =5.5 V  
-10  
-25  
CC  
V = GND  
O
mA V = 20 V  
CC  
Input Current  
Hysteresis  
0.12  
1.5  
mA V = 5 V  
3
4
CC  
Input Forward  
Voltage  
V
F
1.7  
V
V
T = 25°C  
IF = 5 mA  
A
1.75  
Input Reverse  
BV  
5
IR = 10 µA  
R
Breakdown Voltage  
Input Diode  
Temperature  
Coefficient  
V  
T  
A
-1.7  
60  
mV/ °C IF = 5 mA  
F
Input Capacitance  
C
IN  
pF  
f = 1 MHz, V = 0 V, Pins 2 and 3  
F
8
Switching Specifications (AC)  
For 0°C T [1] 85°C, 4.5 V V 20 V, 1.6 mA IF(ON) 5 mA, 0.0 mA IF(OFF) 0.1 mA.  
A
CC  
All Typicals at T = 25°C, V = 5 V, IF(ON) = 3 mA unless otherwise specified.  
A
CC  
Parameter  
Sym. Min. Typ. Max. Units  
Test Conditions  
Without Peaking Capacitor  
With Peaking Capacitor  
Without Peaking Capacitor  
With Peaking Capacitor  
Fig. Note  
Propagation Delay Time to  
Logic Low Output Level  
tPHL  
210  
160  
170  
115  
25  
ns  
5, 6  
4, 5  
300  
300  
Propagation Delay Time to  
Logic High Output Level  
tPLH  
ns  
5, 6  
4, 5  
Output Enable Time to  
Logic High  
tPZH  
tPZL  
tPHZ  
tPLZ  
ns  
ns  
ns  
ns  
7, 9  
7, 8  
7, 9  
7, 8  
Output Enable Time to  
Logic Low  
28  
105  
60  
Output Disable Time from  
Logic High  
Output Disable Time from  
Logic Low  
Output Rise Time (10-90%)  
Output Fall Time (90-10%)  
tr  
tf  
55  
15  
ns  
ns  
5, 10  
5, 10  
Parameter  
Sym.  
Device  
Min.  
Units  
Test Conditions  
Fig.  
Note  
Logic High  
Common Mode  
Transient  
| CMH|  
IF = 1.6 mA  
11  
6
HCPL-2200  
1,000  
2,500  
1,000  
2,500  
V/ µs  
| V | = 50 V  
CM  
V = 5 V  
CC  
TA = 25°C  
HCPL-2219  
HCPL-2200  
HCPL-2219  
V/ µs  
V/ µs  
V/ µs  
| V | = 400 V  
CM  
Immunity  
Logic Low  
Common Mode  
Transient  
| CML|  
V = 0 V  
11  
6
F
| V | = 50 V  
CM  
V = 5 V  
CC  
TA = 25°C  
| V | = 400 V  
CM  
Immunity  
Package Characteristics  
Parameter  
Sym.  
Min.  
3750  
Typ. Max. Units  
Test Conditions  
Fig. Note  
Input-Output Momentary  
Withstand Voltage*  
V
ISO  
V rms  
RH 50%, t = 1 min.,  
T = 25°C  
3, 8  
A
Input-Output Resistance  
Input-Output Capacitance  
R
1012  
0.6  
V = 500 VDC  
3
3
I-O  
I-O  
C
I-O  
pF  
f = 1 MHz, V = 0 VDC  
I-O  
*The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For  
the continuous voltage rating refer to the IEC/ EN/ DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification  
or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E.  
9
Notes:  
50% point on the trailing edge of the input  
pulse to the 1.3 V point on the trailing edge  
of the output pulse.  
5. When the peaking capacitor is omitted,  
propagation delay times may increase by  
100 ns.  
6. CML is the maximum rate of rise of the  
common mode voltage that can be  
sustained with the output voltage in the  
logic low state (VO < 0.8 V). CMH is the  
maximum rate of fall of the common mode  
voltage that can be sustained with the  
output voltage in the logic high state  
(VO > 2.0 V).  
7. Use of a 0.1 µF bypass capacitor connected  
between pins 5 and 8 is recommended.  
8. In accordance with UL1577, each  
optocoupler is proof tested by applying an  
insulation test voltage 4500 V rms for one  
second (leakage detection current limit, II-O  
5 µA). This test is performed before the  
100% production test for partial discharge  
(Method b) shown in the IEC/ EN/ DIN EN  
60747-5-2 Insulation Characteristics Table, if  
applicable.  
1. Derate total package power dissipation, PT,  
linearly above 70°C free air temperature at a  
rate of 4.5 mW/ °C.  
2. Duration of output short circuit time should  
not exceed 10 ms.  
3. Device considered a two-terminal device:  
pins 1, 2, 3, and 4 shorted together and pins  
5, 6, 7, and 8 shorted together.  
4. The tPLH propagation delay is measured  
from the 50% point on the leading edge of  
the input pulse to the 1.3 V point on the  
leading edge of the output pulse. The tPHL  
propagation delay is measured from the  
0
5
1.0  
V
T
= 4.5 V  
V
I
= 4.5 V  
CC  
= 25 °C  
V
I
= 4.5 V  
CC  
= 0 mA  
CC  
= 5 mA  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
-1  
-2  
-3  
-4  
A
F
F
4
3
V
= 6.4 mA  
O
V
= 2.7 V  
O
I
= -2.6 mA  
OH  
2
1
0
-5  
-6  
V
= 2.4 V  
O
-7  
-8  
I
= 6.4 mA  
0.5  
OL  
0.1  
0
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
0
1.0  
1.5  
2.0  
T
– TEMPERATURE – °C  
T
– TEMPERATURE – °C  
I
– INPUT CURRENT – mA  
A
A
F
Figure 1. Typical logic low output voltage vs.  
temperature.  
Figure 2. Typical logic high output current vs.  
temperature.  
Figure 3. Output voltage vs. forward input  
current.  
V
CC  
PULSE GEN.  
t
= t = 5 ns  
r
f
OUTPUT V  
MONITORING  
NODE  
f = 100 kHz  
10 % DUTY  
CYCLE  
O
5 V  
HCPL-2200  
V
V
= 5 V  
O
1
2
3
4
8
7
6
5
CC  
619  
D
1
I
F
INPUT  
MONITORING  
NODE  
D
D
D
2
3
4
C
15 pF  
=
2
GND  
5 kΩ  
1000  
R
1
C
=
1
T
= 25 °C  
120 pF  
A
100  
10  
I
F
+
THE PROBE AND JIG CAPACITANCES  
ARE INCLUDED IN C AND  
V
F
C
.
1
2
R
2.15 k1.10 k681 Ω  
1.0  
I
I
(ON) 1.6 mA 3 mA  
5 mA  
F
0.1  
0.01  
ALL DIODES ARE 1N916 OR 1N3064.  
I
(ON)  
F
INPUT I  
F
50 % I (ON)  
F
0 mA  
0.001  
1.1  
1.2  
1.3  
1.4  
1.5  
t
t
PHL  
PLH  
V
– FORWARD VOLTAGE – V  
V
F
OH  
OUTPUT  
1.3 V  
V
O
V
OL  
Figure 4. Typical input diode forward  
characteristic.  
Figure 5. Test circuit for t , t , t , and t .  
PLH PHL  
r
f
10  
250  
C = 15 pF INCLUDING PROBE  
V
= 5 V  
L
CC  
PULSE  
GENERATOR  
AND JIG CAPACITANCES  
.
C1 (120 pF) PEAKING  
CAPACITOR IS USED.  
SEE FIGURE 5.  
I
(mA)  
5
3
F
+5 V  
V
Z
= 50  
CC  
O
200  
150  
t
= t = 5 ns  
r
f
1.6  
V
HCPL-2200  
V
O
S1  
1.6  
3
5
1
2
3
4
8
7
6
5
CC  
619 Ω  
D
t
1
PHL  
I
F
D
2
100  
50  
C
L
5 kΩ  
D
3
t
PLH  
GND  
INPUT V  
D
4
C
-60 -40 -20  
0
20 40 60 80 100  
MONITORING  
NODE  
T
– TEMPERATURE – °C  
A
S2  
D
ARE 1N916 OR 1N3064.  
1-4  
Figure 6. Typical propagation delays vs.  
temperature.  
3.0 V  
INPUT  
1.3 V  
0 V  
V
E
t
t
PLZ  
PZL  
S1 AND  
S2 CLOSED  
0.5 V  
0.5 V  
OUTPUT  
S1 CLOSED  
S2 OPEN  
1.3 V  
V
O
V
V
OL  
OH  
t
PZH  
OUTPUT  
1.3 V  
0 V  
1.5 V  
V
O
S1 OPEN  
S2 CLOSED  
S1 AND  
S2 CLOSED  
t
PHZ  
Figure 7. Test circuit for t , t , t , and t  
.
PZL  
PHZ PZH PLZ  
100  
200  
120  
V
20 V  
C
= 15 pF  
CC  
V
C
= 5 V  
= 15 pF  
L
CC  
2
C
= 15 pF  
L
V
CC  
100  
80  
80  
60  
40  
150  
100  
4.5 V  
20 V  
t
PHZ  
t
PLZ  
PZL  
4.5 V  
20 V  
60  
t
t
r
4.5 V  
40  
t
20 V  
50  
0
20  
0
4.5 V  
20  
0
t
PZH  
f
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
T
– TEMPERATURE – °C  
T
– TEMPERATURE – °C  
T
– TEMPERATURE – °C  
A
A
A
Figure 8. Typical logic low enable  
propagation delay vs. temperature.  
Figure 9. Typical logic high enable  
propagation delay vs. temperature.  
Figure 10. Typical rise, fall time vs.  
temperature.  
11  
V
CC  
HCPL-2219 OPTION 060 ONLY  
(mW)  
HCPL-2200  
V
800  
700  
600  
500  
400  
300  
200  
100  
0
P
OUTPUT V  
MONITORING  
NODE  
S
1
2
3
4
8
7
6
5
O
CC  
A
B
I
(mA)  
S
R
IN  
0.1 µF  
BYPASS  
V
FF  
GND  
V
CM  
+
PULSE GENERATOR  
50 V  
SWITCH AT A: I = 1.6 mA  
V
0
25 50 75 100 125 150 175 200  
– CASE TEMPERATURE – °C  
CM  
0 V  
T
S
F
V
OH  
V
(MIN.)*  
O
Figure 12. Thermal derating curve,  
dependence of safety limiting value with case  
temperature per IEC/ EN/ DIN EN 60747-5-2.  
OUTPUT  
SWITCH AT B: I = 0 mA  
F
V
O
V
(MAX.)*  
O
V
OL  
* SEE NOTE 6.  
Figure 11. Test circuit for common mode transient immunity and typical waveforms.  
V
CC1  
(+5 V)  
V
CC2  
120 pF (OPTIONAL*)  
HCPL-2200  
(4.5 TO 20 V)  
V
V
CC2  
CC1  
(+5 V)  
120 pF  
(+5 V)  
HCPL-2200  
1.1  
DATA  
OUTPUT  
k  
1.1  
k  
R
L
V
CC  
1
2
3
4
8
7
6
5
V
1
2
3
4
8
7
6
5
CC  
DATA  
OUTPUT  
CMOS  
UP TO 16  
LSTTL  
LOADS  
OR 4 TTL  
LOADS  
DATA  
INPUT  
DATA  
INPUT  
TTL OR  
LSTTL  
GND  
TTL OR  
LSTTL  
GND  
TOTEM  
TOTEM  
POLE  
OUTPUT  
GATE  
POLE  
OUTPUT  
GATE  
V
5 V  
10 V  
15 V  
20 V  
R
L
CC2  
2
1.1 K  
2.37 K  
3.83 K  
5.11 K  
1
1
2
Figure 13. Recommended LSTTL to LSTTL circuit.  
Figure 14. LSTTL to CMOS interface circuit.  
V
(+5 V)  
CC  
120 pF (OPTIONAL*)  
HCPL-2200  
1.1  
k  
HCPL-2200  
V
(+5 V)  
CC1  
1.1 k  
V
V
CC  
CC  
1
2
3
4
8
7
6
5
1
2
3
4
8
DATA  
INPUT  
7
6
5
4.7 kΩ  
D1  
DATA  
INPUT  
TTL OR  
LSTTL  
TTL OR  
LSTTL  
GND  
GND  
OPEN  
COLLECTOR  
GATE  
D1 (1N4150) REQUIRED FOR  
ACTIVE PULL-UP DRIVER.  
Figure 15. Recommended LED drive circuit.  
Figure 16. Series LED drive with open collector gate (4.7 kresistor  
dhunts I from the LED).  
OH  
*The 120 pF capacitor may be omitted in applications where 500 ns propagation delay is sufficient.  
12  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2124EN  
AV01-0557EN July 5, 2007  

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