HCPL-2611 [AVAGO]

High CMR, High Speed TTL Compatible Optocouplers; 高CMR ,高速TTL兼容光电耦合器
HCPL-2611
型号: HCPL-2611
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

High CMR, High Speed TTL Compatible Optocouplers
高CMR ,高速TTL兼容光电耦合器

光电 输出元件
文件: 总22页 (文件大小:241K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600,  
HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661,  
HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661  
High CMR, High Speed TTL Compatible Optocouplers  
Data Sheet  
Lead (Pb) Free  
RoHS 6 fully  
compliant  
RoHS 6 fully compliant options available;  
-xxxE denotes a lead-free product  
Description  
Features  
ꢀꢁ 15 kV/μs minimum Common Mode Rejection (CMR)  
at VCM = 1KV for HCNW2611, HCPL-2611, HCPL-4661,  
HCPL-0611, HCPL-0661  
ꢀꢁ High speed: 10 MBd typical  
ꢀꢁ LSTTL/TTL compatible  
The 6N137, HCPL-26XX/06XX/4661, HCNW137/26X1 are  
optically coupled gates that combine a GaAsP light emit-  
ting diode and an integrated high gain photo detector.  
An enable input allows the detector to be strobed. The  
output of the detector IC is an open collector Schottky-  
clamped transistor. The internal shield provides a guar-  
anteed common mode transient immunity specification  
up to 15,000 V/μs at Vcm=1000V.  
ꢀꢁ Low input current capability: 5 mA  
ꢀꢁ Guaranteed ac and dc performance over temperature:  
-40°C to +85°C  
Thisuniquedesignprovidesmaximumacanddccircuitiso-  
lation while achievingTTL compatibility.The optocoupler  
ac and dc operational parameters are guaranteed from -  
40°C to +85°C allowing troublefree system performance.  
ꢀꢁ Available in 8-Pin DIP, SOIC-8, widebody packages  
ꢀꢁ Strobable output (single channel products only)  
ꢀꢁ Safety approval  
UL recognized - 3750 V rms for 1 minute and 5000  
Vrms* for 1 minute per UL1577 CSA approved  
IEC/EN/DIN EN 60747-5-2 approved with  
Functional Diagram  
V
IORM = 560 V peak for 06xx Option 060  
6N137, HCPL-2601/2611  
HCPL-0600/0601/0611  
HCPL-2630/2631/4661  
HCPL-0630/0631/0661  
VIORM = 630 V peak for 6N137/26xx Option 060  
VIORM =1414 V peak for HCNW137/26X1  
1
2
V
V
V
ANODE  
CATHODE  
CATHODE  
ANODE  
1
2
V
V
8
7
8
7
NC  
CC  
CC  
O1  
O2  
1
1
ꢀꢁ MIL-PRF-38534 hermetic version available  
(HCPL-56XX/66XX)  
ANODE  
E
V
CATHODE  
NC  
3
4
6
5
3
4
6
5
O
2
2
Applications  
GND  
GND  
SHIELD  
SHIELD  
ꢀꢁ Isolated line receiver  
ꢀꢁ Computer-peripheral interfaces  
ꢀꢁ Microprocessor system interfaces  
ꢀꢁ Digital isolation for A/D, D/A conversion  
ꢀꢁ Switching power supply  
ꢀꢁ Instrument input/output isolation  
ꢀꢁ Ground loop elimination  
TRUTH TABLE  
TRUTH TABLE  
(POSITIVE LOGIC)  
(POSITIVE LOGIC)  
LED ENABLE OUTPUT  
LED OUTPUT  
ON  
OFF  
ON  
OFF  
ON  
OFF  
H
H
L
L
NC  
NC  
L
H
H
H
L
ON  
L
OFF  
H
H
ꢀꢁ Pulse transformer replacement  
ꢀꢁ Power transistor isolation in motor drives  
ꢀꢁ Isolation of high speed logic systems  
A 0.1 F bypass capacitor must be connected between pins 5 and 8.  
*5000 V rms/1 Minute rating is for HCNW137/26X1 and Option 020  
(6N137, HCPL-2601/11/30/31, HCPL-4661) products only.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly  
of this component to prevent damage and/or degradation which may be induced by ESD.  
The6N137,HCPL-26XX,HCPL-06XX,HCPL-4661,HCNW137,  
and HCNW26X1 are suitable for high speed logic interfac-  
ing, input/output buffering, as line receivers in environ-  
ments that conventional line receivers cannot tolerate  
and are recommended for use in extremely high ground  
or induced noise environments.  
Selection Guide  
Widebody  
(400 Mil)  
Minimum CMR  
8-Pin DIP (300 Mil)  
Small-Outline SO-8  
Hermetic  
Input  
On-  
Current Output  
(mA)  
Single  
and Dual  
Channel  
Packages  
Single  
Channel  
Package  
Dual  
Channel  
Package  
Single  
Channel  
Package  
Dual  
Channel  
Package  
Single  
Channel  
Package  
dV/dt  
(V/μs)  
V
(V)  
CM  
Enable  
YES  
YES  
NO  
1000  
10  
5
5
6N137  
5,000  
1,000  
HCPL-0600  
HCPL-0601  
HCPL-0611  
HCNW137  
HCNW2601  
HCNW2611  
HCPL-2630  
HCPL-2631  
HCPL-4661  
HCPL-0630  
HCPL-0631  
HCPL-0661  
10,000  
15,000  
1,000  
1,000  
YES  
NO  
HCPL-2601  
HCPL-2611  
YES  
NO  
1,000  
3, 500  
1,000  
50  
300  
50  
YES  
YES  
YES  
NO  
HCPL-2602[1]  
HCPL-2612[1]  
HCPL-261A[1]  
3
HCPL-061A[1]  
HCPL-061N[1]  
HCPL-263A[1]  
HCPL-263N[1]  
HCPL-063A[1]  
HCPL-063N[1]  
1,000[2]  
1,000  
1,000  
50  
YES  
HCPL-261N[1]  
NO  
[3]  
12.5  
HCPL-193X[1]  
HCPL-56XX[1]  
HCPL-66XX[1]  
Notes:  
1. Technical data are on separate Avago publications.  
2. 15 kV/μs with VCM = 1 kV can be achieved using Avago application circuit.  
3. Enable is available for single channel products only, except for HCPL-193X devices.  
2
Ordering Information  
HCPL-xxxx is UL Recognized with 3750 Vrms for 1 minute per UL1577.  
HCNWxxxx is UL Rcognized with 5000 Vrms for 1 minute per UL1577.  
Option  
UL 5000 Vrms/  
1 Minute  
Part  
RoHS  
Non RoHS  
Surface Gull Tape &  
IEC/EN/DIN  
Number  
Compliant Compliant  
Package  
Mount Wing  
Reel  
Rating  
EN 60747-5-2 Quantity  
-000E  
-300E  
-500E  
-020E  
-320E  
-520E  
-060E  
-560E  
-000E  
-300E  
-500E  
-020E  
-320E  
-520E  
-060E  
-360E  
-000E  
-300E  
-500E  
-020E  
-320E  
-520E  
-060E  
-360E  
-560E  
-000E  
-300E  
-500E  
-020E  
-320E  
-520E  
-000E  
-300E  
-500E  
-020E  
-320E  
-520E  
No option  
#300  
50 per tube  
X
X
X
X
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
50 per tube  
50 per tube  
1000 per reel  
#500  
X
#020  
X
X
X
6N137  
300mil  
DIP-8  
#320  
X
X
X
X
#520  
X
X
#060  
X
X
-560  
X
X
No option  
#300  
X
X
X
X
#500  
X
X
#020  
X
X
X
300mil  
DIP-8  
HCPL-2601  
#320  
X
X
X
X
#520  
#060  
X
X
-
X
X
No option  
#300  
X
X
X
X
#500  
X
X
X
X
X
X
X
#020  
X
X
X
HCPL-2611  
300mil  
DIP-8  
#320  
X
X
X
X
#520  
#060  
X
X
X
#360  
X
X
X
X
#560  
No option  
#300  
X
X
X
X
#500  
HCPL-2630  
300mil  
DIP-8  
#020  
X
X
X
#320  
X
X
X
X
-520  
No option  
#300  
X
X
X
X
#500  
HCPL-2631  
HCPL-4661  
300mil  
DIP-8  
#020  
X
X
X
#320  
X
X
X
X
#520  
3
Option  
UL 5000 Vrms/  
1 Minute  
Part  
RoHS  
Non RoHS  
Surface Gull Tape &  
IEC/EN/DIN  
Number  
Compliant Compliant  
Package  
Mount Wing  
Reel  
Rating  
EN 60747-5-2 Quantity  
-000E  
-500E  
-060E  
-560E  
-000E  
-500E  
No option  
#500  
X
X
X
X
X
X
100 per tube  
HCPL-0600  
HCPL-0601  
HCPL-0611  
X
1500 per reel  
100 per tube  
1500 per reel  
100 per tube  
1500 per reel  
SO-8  
#060  
X
X
#560  
X
HCPL-0630  
HCPL-0631  
HCPL-0661  
No option  
#500  
SO-8  
X
-000E  
-300E  
-500E  
No option  
#300  
X
X
X
X
X
X
42 per tube  
42 per tube  
750 per reel  
HCNW137  
HCNW2601  
HCNW2611  
400 mil  
DIP-8  
X
X
X
X
#500  
X
To order, choose a part number from the part number column and combine with the desired option from the option  
column to form an order entry. Combination of Option 020 and Option 060 is not available.  
Example 1:  
HCPL-2611-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packag  
ing with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.  
Example 2:  
HCPL-2630 to order product of 300mil DIP package in tube packaging and non RoHS compliant.  
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.  
Notes:  
The notation ‘#XXXis used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE.  
Schematic  
HCPL-2630/2631/4661  
HCPL-0630/0631/0661  
6N137, HCPL-2601/2611  
I
CC  
I
HCPL-0600/0601/0611  
V
V
CC  
O1  
8
7
HCNW137, HCNW2601/2611  
I
F
1
+
I
I
F1  
CC  
V
V
O1  
CC  
O
8
6
2+  
I
O
V
F1  
2
V
F
SHIELD  
3
3
GND  
I
F2  
5
I
O2  
SHIELD  
I
V
E
7
E
O2  
6
5
V
V
F2  
USE OF A 0.1 μF BYPASS CAPACITOR CONNECTED  
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 5).  
+
4
GND  
SHIELD  
4
Package Outline Drawings  
8-pin DIP Package** (6N137, HCPL-2601/11/30/31, HCPL-4661)  
7.62 0.25  
(0.300 0.010)  
9.65 0.25  
(0.380 0.010)  
8
1
7
6
5
6.35 0.25  
(0.250 0.010)  
TYPE NUMBER  
OPTION CODE*  
DATE CODE  
A XXXXZ  
YYWW  
U R  
UL  
2
3
4
RECOGNITION  
1.78 (0.070) MAX.  
1.19 (0.047) MAX.  
+ 0.076  
- 0.051  
0.254  
5° TYP.  
+ 0.003)  
- 0.002)  
3.56 0.13  
(0.140 0.005)  
(0.010  
4.70 (0.185) MAX.  
0.51 (0.020) MIN.  
2.92 (0.115) MIN.  
DIMENSIONS IN MILLIMETERS AND (INCHES).  
1.080 0.320  
(0.043 0.013)  
0.65 (0.025) MAX.  
*MARKING CODE LETTER FOR OPTION NUMBERS  
"L" = OPTION 020  
"V" = OPTION 060  
OPTION NUMBERS 300 AND 500 NOT MARKED.  
2.54 0.25  
(0.100 0.010)  
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.  
**JEDEC Registered Data (for 6N137 only).  
8-pin DIP Package with Gull Wing Surface Mount Option 300  
(6N137, HCPL-2601/11/30/31, HCPL-4661)  
LAND PATTERN RECOMMENDATION  
1.016 (0.040)  
9.65 0.25  
(0.380 0.010)  
6
5
8
1
7
6.350 0.25  
(0.250 0.010)  
10.9 (0.430)  
2
3
4
2.0 (0.080)  
1.27 (0.050)  
9.65 0.25  
1.780  
(0.070)  
MAX.  
(0.380 0.010)  
1.19  
(0.047)  
MAX.  
7.62 0.25  
(0.300 0.010)  
+ 0.076  
0.254  
- 0.051  
3.56 0.13  
(0.140 0.005)  
+ 0.003)  
- 0.002)  
(0.010  
1.080 0.320  
(0.043 0.013)  
0.635 0.25  
(0.025 0.010)  
12° NOM.  
0.635 0.130  
(0.025 0.005)  
2.54  
(0.100)  
BSC  
DIMENSIONS IN MILLIMETERS (INCHES).  
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).  
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.  
5
Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61)  
LAND PATTERN RECOMMENDATION  
8
1
7
2
6
5
4
5.994 0.203  
(0.236 0.008)  
XXX  
YWW  
3.937 0.127  
(0.155 0.005)  
7.49 (0.295)  
TYPE NUMBER  
(LAST 3 DIGITS)  
DATE CODE  
3
1.9 (0.075)  
PIN ONE  
0.406 0.076  
(0.016 0.003)  
1.270  
(0.050)  
BSC  
0.64 (0.025)  
0.432  
(0.017)  
*
7°  
5.080 0.127  
(0.200 0.005)  
45° X  
3.175 0.127  
(0.125 0.005)  
0 ~ 7°  
0.228 0.025  
(0.009 0.001)  
1.524  
(0.060)  
0.203 0.102  
(0.008 0.004)  
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)  
5.207 0.254 (0.205 0.010)  
*
0.305  
(0.012)  
MIN.  
DIMENSIONS IN MILLIMETERS (INCHES).  
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.  
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.  
8-Pin Widebody DIP Package (HCNW137, HCNW2601/11)  
11.ꢀꢀ  
MAX.  
11.23 ꢀ.15  
(ꢀ.442 ꢀ.ꢀꢀ6ꢁ  
(ꢀ.433ꢁ  
9.ꢀꢀ ꢀ.15  
(ꢀ.354 ꢀ.ꢀꢀ6ꢁ  
7
6
5
8
TYPE NUMBER  
DATE CODE  
A
HCNWXXXX  
YYWW  
1
3
2
4
1ꢀ.16 (ꢀ.4ꢀꢀꢁ  
TYP.  
1.55  
(ꢀ.ꢀ61ꢁ  
MAX.  
7° TYP.  
+ ꢀ.ꢀ76  
- ꢀ.ꢀꢀ51  
ꢀ.254  
+ ꢀ.ꢀꢀ3ꢁ  
- ꢀ.ꢀꢀ2ꢁ  
(ꢀ.ꢀ1ꢀ  
5.1ꢀ  
(ꢀ.2ꢀ1ꢁ  
MAX.  
3.1ꢀ (ꢀ.122ꢁ  
3.9ꢀ (ꢀ.154ꢁ  
ꢀ.51 (ꢀ.ꢀ21ꢁ MIN.  
2.54 (ꢀ.1ꢀꢀꢁ  
TYP.  
1.8ꢀ ꢀ.15  
(ꢀ.ꢀ71 ꢀ.ꢀꢀ6ꢁ  
ꢀ.4ꢀ (ꢀ.ꢀ16ꢁ  
ꢀ.56 (ꢀ.ꢀ22ꢁ  
DIMENSIONS IN MILLIMETERS (INCHESꢁ.  
NOTE: FLOATING LEAD PROTRUSION IS ꢀ.25 mm (1ꢀ milsꢁ MAX.  
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300  
(HCNW137, HCNW2601/11)  
11.23 ꢀ.15  
(ꢀ.442 ꢀ.ꢀꢀ6ꢁ  
LAND PATTERN RECOMMENDATION  
7
6
5
8
9.ꢀꢀ ꢀ.15  
(ꢀ.354 ꢀ.ꢀꢀ6ꢁ  
13.56  
(ꢀ.534ꢁ  
1
3
2
4
2.29  
(ꢀ.ꢀ9ꢁ  
1.3  
(ꢀ.ꢀ51ꢁ  
12.3ꢀ ꢀ.3ꢀ  
1.55  
(ꢀ.ꢀ61ꢁ  
MAX.  
(ꢀ.484 ꢀ.ꢀ12ꢁ  
11.ꢀꢀ  
MAX.  
(ꢀ.433ꢁ  
4.ꢀꢀ  
MAX.  
(ꢀ.158ꢁ  
1.8ꢀ ꢀ.15  
(ꢀ.ꢀ71 ꢀ.ꢀꢀ6ꢁ  
1.ꢀꢀ ꢀ.15  
(ꢀ.ꢀ39 ꢀ.ꢀꢀ6ꢁ  
.75 ꢀ.25  
(ꢀ.ꢀ3ꢀ ꢀ.ꢀ1ꢀꢁ  
+ ꢀ.ꢀ76  
- ꢀ.ꢀꢀ51  
2.54  
.254  
(ꢀ.1ꢀꢀꢁ  
+ ꢀ.ꢀꢀ3ꢁ  
- ꢀ.ꢀꢀ2ꢁ  
BSC  
(ꢀ.ꢀ1ꢀ  
DIMENSIONS IN MILLIMETERS (INCHESꢁ.  
7° NOM.  
LEAD COPLANARITY = ꢀ.1ꢀ mm (ꢀ.ꢀꢀ4 INCHESꢁ.  
NOTE: FLOATING LEAD PROTRUSION IS ꢀ.25 mm (1ꢀ milsꢁ MAX.  
Solder Reflow Temperature Profile  
300  
PREHEATING RATE 3 °C + 1 °C/0.5 °C/SEC.  
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.  
PEAK  
TEMP.  
245 °C  
PEAK  
TEMP.  
240 °C  
PEAK  
TEMP.  
230 °C  
200  
100  
0
2.5 C 0.5 °C/SEC.  
SOLDERING  
30  
TIME  
160 °C  
150 °C  
140 °C  
SEC.  
200 °C  
30  
SEC.  
3 °C + 1 °C/0.5 °C  
PREHEATING TIME  
150 °C, 90 + 30 SEC.  
50 SEC.  
TIGHT  
TYPICAL  
ROOM  
TEMPERATURE  
LOOSE  
0
50  
100  
150  
200  
250  
TIME (SECONDS)  
NOTE: NON-HALIDE FLUX SHOULD BE USED.  
7
Recommended Pb-free IR Profile  
TIMEWITHIN 5 °C of ACTUAL  
PEAK TEMPERATURE  
tp  
15 SEC.  
* 260 +0/-5 °C  
Tp  
TL  
217 °C  
NOTES:  
RAMP-UP  
3 °C/SEC. MAX.  
RAMP-DOWN  
6 °C/SEC. MAX.  
THETIME FROM 25 °C to PEAK  
TEMPERATURE = 8 MINUTES MAX.  
Tsmax = 200 °C, Tsmin = 150 °C  
150 - 200 °C  
Tsmax  
Tsmin  
NOTE: NON-HALIDE FLUX SHOULD BE USED.  
ts  
tL  
PREHEAT  
60 to 180 SEC.  
60 to 150 SEC.  
* RECOMMENDED PEAK TEMPERATURE FOR  
WIDEBODY 400mils PACKAGE IS 245 °C  
25  
t 25 °C to PEAK  
TIME  
Regulatory Information  
The 6N137, HCPL-26XX/06XX/46XX, and HCNW137/26XX have been approved by the following organizations:  
UL  
IEC/EN/DIN EN 60747-5-2  
Recognized under UL 1577, Component Recognition  
Program, File E55361.  
Approved under  
IEC 60747-5-2:1997 + A1:2002  
EN 60747-5-2:2001 + A1:2002  
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01  
(Option 060 and HCNW only)  
CSA  
Approved under CSA Component Acceptance Notice  
#5, File CA 88324.  
Insulation and Safety Related Specifications  
8-pin DIP  
Widebody  
(400 Mil)  
Value  
(300 Mil)  
Value  
SO-8  
Value  
Parameter  
Symbol  
Units Conditions  
Minimum External  
Air Gap (External  
Clearance)  
L(101)  
7.1  
7.4  
4.9  
9.6  
mm  
mm  
mm  
Measured from input terminals  
to output terminals, shortest  
distance through air.  
Minimum External  
Tracking (External  
Creepage)  
L(102)  
4.8  
10.0  
1.0  
Measured from input terminals  
to output terminals, shortest  
distance path along body.  
Minimum Internal  
Plastic Gap  
(Internal Clearance)  
0.08  
0.08  
Through insulation distance,  
conductor to conductor, usually  
the direct distance between the  
photoemitter and photodetector  
inside the optocoupler cavity.  
Minimum Internal  
Tracking (Internal  
Creepage)  
NA  
200  
IIIa  
NA  
200  
IIIa  
4.0  
200  
IIIa  
mm  
Measured from input terminals  
to output terminals, along  
internal cavity.  
Tracking Resistance  
(Comparative  
Tracking Index)  
CTI  
Volts  
DIN IEC 112/VDE 0303 Part 1  
Isolation Group  
Material Group  
(DIN VDE 0110, 1/89, Table 1)  
Option 300 - surface mount classification is Class A in accordance with CECC 00802.  
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics  
(HCPL-06xx Option 060 Only)  
Description  
Symbol  
Characteristic  
Units  
Installation classification per DIN VDE 0110/1.89, Table 1  
for rated mains voltage ≤ 150 V rms  
I-IV  
I-III  
for rated mains voltage ≤ 300 V rms  
for rated mains voltage ≤ 600 V rms  
Climatic Classification  
I-III  
55/85/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Maximum Working Insulation Voltage  
V
567  
Vpeak  
Vpeak  
IORM  
Input to Output Test Voltage, Method b*  
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,  
Partial Discharge < 5 pC  
VPR  
VPR  
1063  
851  
Input to Output Test Voltage, Method a*  
VIORM x 1.5 = VPR, Type and Sample Test,  
tm = 60 sec, Partial Discharge < 5 pC  
Vpeak  
Highest Allowable Overvoltage  
(Transient Overvoltage, tini = 10 sec)  
VIOTM  
6000  
Vpeak  
Safety Limiting Values  
(Maximum values allowed in the event of a failure)  
Case Temperature  
Input Current**  
TS  
IS,INPUT  
PS,OUTPUT  
150  
150  
600  
°C  
mA  
mW  
Output Power**  
Insulation Resistance at TS, V = 500 V  
RS  
≥109  
IO  
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a  
detailed description.  
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-  
tion.  
9
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics  
(HCPL-26xx; 46xx; 6N13x Option 060 Only)  
Description  
Symbol  
Characteristic  
Units  
Installation classification per DIN VDE 0110/1.89, Table 1  
for rated mains voltage ≤ 300 V rms  
I-IV  
I-III  
for rated mains voltage ≤ 450 V rms  
Climatic Classification  
55/85/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Maximum Working Insulation Voltage  
V
630  
Vpeak  
Vpeak  
IORM  
Input to Output Test Voltage, Method b*  
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,  
Partial Discharge < 5 pC  
VPR  
VPR  
1181  
945  
Input to Output Test Voltage, Method a*  
V
IORM x 1.5 = VPR, Type and sample test,  
Vpeak  
tm = 60 sec, Partial Discharge < 5 pC  
Highest Allowable Overvoltage*  
(Transient Overvoltage, tini = 10 sec)  
VIOTM  
6000  
Vpeak  
Safety Limiting Values  
(Maximum values allowed in the event of a failure,  
also see Figure 16, Thermal Derating curve.)  
Case Temperature  
Input Current  
Output Power  
TS  
IS,INPUT  
PS,OUTPUT  
175  
230  
600  
°C  
mA  
mW  
Insulation Resistance at TS, V = 500 V  
RS  
≥109  
IO  
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a  
detailed description.  
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-  
tion.  
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW137/2601/2611 Only)  
Description  
Symbol  
Characteristic  
Units  
Installation classification per DIN VDE 0110/1.89, Table 1  
for rated mains voltage ≤600 V rms  
I-IV  
I-III  
for rated mains voltage ≤1000 V rms  
Climatic Classification (DIN IEC 68 part 1)  
Pollution Degree (DIN VDE 0110/1.89)  
Maximum Working Insulation Voltage  
55/100/21  
2
V
1414  
Vpeak  
Vpeak  
IORM  
Input to Output Test Voltage, Method b*  
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,  
Partial Discharge < 5 pC  
VPR  
VPR  
2651  
2121  
8000  
Input to Output Test Voltage, Method a*  
V
IORM x 1.5 = VPR, Type and sample test,  
Vpeak  
tm = 60 sec, Partial Discharge < 5 pC  
Highest Allowable Overvoltage*  
(Transient Overvoltage, tini = 10 sec)  
VIOTM  
Vpeak  
Safety Limiting Values  
(Maximum values allowed in the event of a failure,  
also see Figure 16, Thermal Derating curve.)  
Case Temperature  
Input Current  
Output Power  
TS  
IS,INPUT  
PS,OUTPUT  
150  
400  
700  
°C  
mA  
mW  
Insulation Resistance at TS, V = 500 V  
RS  
≥109  
IO  
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a  
detailed description.  
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-  
tion.  
10  
Absolute Maximum Ratings* (No Derating Required up to 85°C)  
Parameter  
Symbol  
Package**  
Min.  
-55  
-40  
Max.  
125  
85  
Units  
°C  
Note  
Storage Temperature  
Operating Temperature†  
Average Forward Input Current  
TS  
T
°C  
A
IF  
Single 8-Pin DIP  
Single SO-8  
Widebody  
20  
mA  
2
Dual 8-Pin DIP  
Dual SO-8  
15  
1, 3  
1
Reverse Input Voltage  
Input Power Dissipation  
VR  
PI  
8-Pin DIP, SO-8  
Widebody  
5
3
V
Widebody  
40  
7
mW  
V
Supply Voltage  
V
CC  
(1 Minute Maximum)  
Enable Input Voltage (Not to  
Exceed VCC by more than  
500 mV)  
VE  
Single 8-Pin DIP  
Single SO-8  
Widebody  
V + 0.5  
V
CC  
Enable Input Current  
IE  
IO  
5
50  
7
mA  
mA  
V
Output Collector Current  
Output Collector Voltage  
1
1
VO  
PO  
Output Collector Power  
Dissipation  
Single 8-Pin DIP  
Single SO-8  
Widebody  
85  
mW  
Dual 8-Pin DIP  
Dual SO-8  
60  
1, 4  
Lead Solder Temperature  
(Through Hole Parts Only)  
TLS  
8-Pin DIP  
260°C for 10 sec.,  
1.6 mm below seating plane  
Widebody  
260°C for 10 sec.,  
up to seating plane  
Solder Reflow Temperature  
Profile (Surface Mount Parts Only)  
SO-8 and  
Option 300  
See Package Outline  
Drawings section  
*JEDEC Registered Data (for 6N137 only).  
**Ratings apply to all devices except otherwise noted in the Package column.  
†0°C to 70°C on JEDEC Registration.  
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
0
Max.  
250  
15  
Units  
μA  
mA  
V
Input Current, Low Level  
Input Current, High Level[1]  
Power Supply Voltage  
Low Level Enable Voltage†  
High Level Enable Voltage†  
Operating Temperature  
Fan Out (at RL = 1 kΩ)[1]  
Output Pull-up Resistor  
IFL*  
IFH**  
5
V
4.5  
0
5.5  
CC  
VEL  
VEH  
TA  
0.8  
V
2.0  
-40  
V
V
CC  
85  
5
°C  
N
TTL Loads  
RL  
330  
4 k  
*The off condition can also be guaranteed by ensuring that VFL ≤0.8 volts.  
**The initial switching threshold is 5 mA or less. It is recommended that 6.3 mA to 10 mA be used for best performance and to permit at least a 20%  
LED degradation guardband.  
†For single channel products only.  
11  
Electrical Specifications  
Over recommended temperature (TA = -40°C to +85°C) unless otherwise specified. All Typicals at VCC = 5 V, TA = 25°C.  
All enable test conditions apply to single channel products only. See note 5.  
Parameter  
Sym.  
Package  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
Fig.  
Note  
High Level Output  
Current  
IOH*  
All  
5.5  
100  
μA  
V = 5.5 V, VE = 2.0 V,  
1
1, 6,  
19  
CC  
V = 5.5 V, IF = 250 mA  
O
Input Threshold  
Current  
ITH  
Single Channel  
Widebody  
2.0  
5.0  
0.6  
mA  
V
V = 5.5 V, VE = 2.0 V,  
2, 3  
19  
1, 19  
7
CC  
VO = 0.6 V,  
Dual Channel  
2.5  
IOL (Sinking) = 13 mA  
Low Level Output  
Voltage  
VOL*  
8-Pin DIP  
SO-8  
0.35  
VCC = 5.5 V, VE = 2.0 V,  
IF = 5 mA,  
2, 3,  
4, 5  
Widebody  
0.4  
IOL (Sinking) = 13 mA  
High Level Supply  
Current  
ICCH  
Single Channel  
7.0  
6.5  
10  
10.0*  
15  
mA  
VE = 0.5 V  
VE = VCC  
Both  
V = 5.5 V  
CC  
IF = 0 mA  
Dual Channel  
Channels  
Low Level Supply  
Current  
ICCL  
Single Channel  
Dual Channel  
9.0  
8.5  
13  
13.0*  
21  
mA  
VE = 0.5 V  
VE = VCC  
Both  
V = 5.5 V  
8
CC  
IF = 10 mA  
Channels  
High Level Enable  
Current  
IEH  
IEL*  
VEH  
VEL  
VF  
Single Channel  
-0.7  
-0.9  
-1.6  
-1.6  
mA  
mA  
V
VCC = 5.5 V, V = 2.0 V  
E
Low Level Enable  
Current  
VCC = 5.5 V, V = 0.5 V  
9
E
High Level Enable  
Voltage  
2.0  
19  
Low Level Enable  
Voltage  
0.8  
V
Input Forward  
Voltage  
8-Pin DIP  
SO-8  
1.4  
1.3  
1.5  
1.75*  
1.80  
1.85  
2.05  
V
TA = 25°C  
TA = 25°C  
IF = 10 mA  
6, 7  
1
Widebody  
1.25  
1.2  
1.64  
Input Reverse  
Breakdown  
Voltage  
BV *  
8-Pin DIP  
SO-8  
5
V
IR = 10 ꢀA  
1
1
1
R
Widebody  
3
IR = 100 μA, TA = 25°C  
Input Diode  
Temperature  
Coefficient  
DV /  
8-Pin DIP  
SO-8  
-1.6  
mV/°C IF = 10 mA  
7
F
∆T  
A
Widebody  
-1.9  
60  
Input Capacitance  
CIN  
8-Pin DIP  
SO-8  
pF  
f = 1 MHz, VF = 0 V  
Widebody  
70  
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to +70°C. HP specifies -40°C to +85°C.  
12  
Switching Specifications (AC)  
Over Recommended Temperature (T = -40°C to +85°C), VCC = 5 V, IF = 7.5 mA unless otherwise specified.  
A
All Typicals at T = 25°C, VCC = 5 V.  
A
Parameter  
Sym.  
Package**  
Min. Typ. Max.  
Units  
Test Conditions  
Fig.  
Note  
Propagation Delay  
Time to High  
tPLH  
20  
48  
75*  
100  
ns  
T = 25°C  
RL = 350  
CL = 15 pF  
8, 9, 1, 10,  
A
10  
19  
Output Level  
Propagation Delay  
Time to Low  
Output Level  
tPHL  
25  
50  
75*  
100  
ns  
ns  
T = 25°C  
1, 11,  
19  
A
Pulse Width  
Distortion  
|tPHL - tPLH  
|
8-Pin DIP  
SO-8  
Widebody  
3.5  
35  
8, 9, 13, 19  
10,  
11  
40  
40  
Propagation Delay  
Skew  
tPSK  
tr  
ns  
ns  
ns  
ns  
12, 13,  
19  
Output Rise  
Time (10-90%)  
24  
10  
30  
12  
12  
1, 19  
1, 19  
14  
Output Fall  
Time (90-10%)  
tf  
Propagation Delay  
Time of Enable  
from VEH to VEL  
tELH  
Single Channel  
Single Channel  
RL = 350 ,  
CL = 15 pF,  
VEL = 0 V, VEH = 3 V  
13,  
14  
Propagation Delay  
Time of Enable  
from VEL to VEH  
tEHL  
20  
ns  
15  
*JEDEC registered data for the 6N137.  
**Ratings apply to all devices except otherwise noted in the Package column.  
Parameter  
Sym.  
Device  
Min.  
Typ.  
Units  
Test Conditions  
Fig.  
Note  
Logic High  
Common  
Mode  
Transient  
Immunity  
|CMH| 6N137  
1,000 10,000 V/μs |V | = 10 V  
VCC = 5 V, IF = 0 mA,  
VO(MIN) = 2 V,  
15  
1, 16,  
18, 19  
CM  
HCPL-2630  
HCPL-0600/0630  
HCNW137  
HCPL-2601/2631 10,000 15,000  
HCPL-0601/0631  
HCNW2601  
5,000 10,000  
|VCM| = 1 kV  
|VCM| = 1 kV  
|VCM| = 1 kV  
RL = 350 , T = 25°C  
A
HCPL-2611/4661 15,000 25,000  
HCPL-0611/0661  
HCNW2611  
Logic Low  
Common  
Mode  
Transient  
Immunity  
|CML| 6N137  
HCPL-2630  
1,000 10,000 V/μs |V | = 10 V  
VCC = 5 V, IF = 7.5 mA,  
VO(MAX) = 0.8 V,  
15  
1, 17,  
18, 19  
CM  
5,000 10,000  
|V | = 1 kV  
CM  
HCPL-0600/0630  
HCNW137  
HCPL-2601/2631 10,000 15,000  
HCPL-0601/0631  
HCNW2601  
HCPL-2611/4661 15,000 25,000  
HCPL-0611/0661  
RL = 350 , T = 25°C  
A
|VCM| = 1 kV  
|VCM| = 1 kV  
HCNW2611  
13  
Package Characteristics  
All Typicals at T = 25°C.  
A
Parameter  
Sym.  
Package  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
45% RH, t = 5 s,  
I-O = 3 kV dc, T = 25°C  
Fig.  
Note  
Input-Output  
Insulation  
II-O*  
VISO  
Single 8-Pin DIP  
Single SO-8  
1
A  
20, 21  
V
A
Input-Output  
Momentary With-  
stand Voltage**  
8-Pin DIP, SO-8  
Widebody  
OPT 020†  
3750  
5000  
5000  
V rms RH ≤ 50%, t = 1 min,  
20, 21  
20, 22  
T = 25°C  
A
Input-Output  
Resistance  
RI-O  
8-Pin DIP, SO-8  
Widebody  
1012  
1013  
VI-O = 500 V dc  
1, 20,  
23  
1012  
1011  
T = 25°C  
A
T = 100°C  
A
Input-Output  
Capacitance  
CI-O  
II-I  
8-Pin DIP, SO-8  
Widebody  
0.6  
0.5  
pF  
f = 1 MHz, T = 25°C  
1, 20,  
23  
A
0.6  
Input-Input  
Insulation  
Dual Channel  
0.005  
A  
RH ≤ 45%, t = 5 s,  
24  
V = 500 V  
I-I  
Leakage Current  
Resistance  
(Input-Input)  
RI-I  
CI-I  
Dual Channel  
1011  
24  
24  
Capacitance  
(Input-Input)  
Dual 8-Pin DIP  
Dual SO-8  
0.03  
0.25  
pF  
f = 1 MHz  
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to 70°C. Avago specifies -40°C to 85°C.  
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous volt-  
age rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment  
level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”  
†For 6N137, HCPL-2601/2611/2630/2631/4661 only.  
Notes:  
1. Each channel.  
2. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 20 mA.  
3. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 15 mA.  
4. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package.  
5. Bypassing of the power supply line is required, with a 0.1 μF ceramic disc capacitor adjacent to each optocoupler as illustrated in Figure 17. Total  
lead length between both ends of the capacitor and the isolator pins should not exceed 20 mm.  
6. The JEDEC registration for the 6N137 specifies a maximum IOH of 250 μA. Avago guarantees a maximum IOH of 100 A.  
7. The JEDEC registration for the 6N137 specifies a maximum ICCH of 15 mA. Avago guarantees a maximum ICCH of 10 mA.  
8. The JEDEC registration for the 6N137 specifies a maximum ICCL of 18 mA. Avago guarantees a maximum ICCL of 13 mA.  
9. The JEDEC registration for the 6N137 specifies a maximum IEL of –2.0 mA. Avago guarantees a maximum IEL of -1.6 mA.  
10. The tPLH propagation delay is measured from the 3.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the  
output pulse.  
11. The tPHL propagation delay is measured from the 3.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the  
output pulse.  
12. tPSK is equal to the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature and specified test conditions.  
13. See application section titledPropagation Delay, Pulse-Width Distortion and Propagation Delay Skewfor more information.  
14. The tELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V point on the rising edge  
of the output pulse.  
15. The tEHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point on the falling edge  
of the output pulse.  
16. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2.0 V).  
17. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO < 0.8 V).  
18. For sinusoidal voltages, (|dVCM | / dt)max = fCMVCM(p-p).  
19. No external pull up is required for a high logic state on the enable input. If the VE pin is not used, tying VE to VCC will result in improved CMR  
performance. For single channel products only.  
20. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.  
21. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 Vrms for one second (leakage detection  
current limit, II-O ≤ 5 A). This test is performed before the 100% production test for partial discharge (Method b) shown in the IEC/EN/DIN EN 60747-  
5-2 Insulation Characteristics Table, if applicable.  
22. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 Vrms for one second (leakage detection  
current limit, II-O ≤ 5 A). This test is performed before the 100% production test for partial discharge (Method b) shown in the IEC/EN/DIN EN 60747-  
5-2 Insulation Characteristics Table, if applicable.  
23. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. For dual channel products only.  
24. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel products only  
14  
8-PIN DIP, SO-8  
WIDEBODY  
6
6
15  
1ꢀ  
V
T
= 5 V  
V
= 5 V  
CC  
= 25 °C  
CC  
T = 25 °C  
A
V
V
V
= 5.5 V  
= 5.5 V  
= 2.ꢀ V*  
= 25ꢀ μA  
CC  
O
E
A
5
4
3
2
5
4
3
2
I
F
* FOR SINGLE  
CHANNEL  
PRODUCTS  
ONLY  
R
= 35ꢀ Ω  
= 1 KΩ  
R
= 35ꢀ Ω  
= 1 KΩ  
L
L
R
R
L
L
5
R
= 4 KΩ  
R = 4 KΩ  
L
L
1
1
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ 6ꢀ 8ꢀ 1ꢀꢀ  
1
2
3
4
6
1
2
3
4
6
5
5
T
– TEMPERATURE – °C  
I
– FORWARD INPUT CURRENT – mA  
I – FORWARD INPUT CURRENT – mA  
F
A
F
Figure 1. Typical high level output current vs.  
temperature.  
Figure 2. Typical output voltage vs. forward input current.  
WIDEBODY  
6
8-PIN DIP, SO-8  
6
V
V
= 5.ꢀ V  
V
V
= 5.ꢀ V  
CC  
= ꢀ.6 V  
CC  
= ꢀ.6 V  
O
O
5
4
3
2
5
4
3
2
R
= 35ꢀ Ω  
L
R
= 1 KΩ  
R
= 35ꢀ Ω  
= 4 KΩ  
L
L
R
= 1 KΩ  
L
1
1
R
R
= 4 KΩ  
L
L
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
6ꢀ  
6ꢀ  
T
– TEMPERATURE – °C  
T
– TEMPERATURE – °C  
A
A
Figure 3. Typical input threshold current vs. temperature.  
15  
8-PIN DIP, SO-8  
WIDEBODY  
.8  
.7  
.8  
.7  
7ꢀ  
6ꢀ  
5ꢀ  
V
V
I
= 5.5 V * FOR SINGLE  
V
V
I
= 5.5 V  
V
V
V
= 5.ꢀ V  
= 2.ꢀ V*  
= ꢀ.6 V  
* FOR SINGLE  
CHANNEL  
PRODUCTS ONLY  
CC  
E
F
CC  
E
F
CC  
E
OL  
= 2.ꢀ V*  
= 5.ꢀ mA  
CHANNEL  
PRODUCTS ONLY  
= 2.ꢀ V  
= 5.ꢀ mA  
.6  
.5  
.4  
.3  
.2  
.6  
.5  
.4  
.3  
.2  
I
= 16 mA  
O
I
= 1ꢀ-15 mA  
F
I
= 16 mA  
I
= 12.8 mA  
O
O
I
= 12.8 mA  
= 6.4 mA  
O
I
I
= 9.6 mA  
I = 6.4 mA  
O
O
I
= 9.6 mA  
O
I
= 5.ꢀ mA  
F
4ꢀ  
2ꢀ  
O
.1  
.1  
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
6ꢀ  
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
6ꢀ  
6ꢀ  
T
– TEMPERATURE – °C  
T – TEMPERATURE – °C  
A
T
– TEMPERATURE – °C  
A
A
Figure 4. Typical low level output voltage vs. temperature.  
Figure 5. Typical low level output current vs.  
temperature.  
8-PIN DIP, SO-8  
WIDEBODY  
1ꢀꢀꢀ  
1000  
T
A
= 25 o  
C
T
= 25 °C  
A
1ꢀꢀ  
1ꢀ  
100  
10  
I
I
+
F
F
F
+
F
V
V
-
1.ꢀ  
1.0  
.1  
.ꢀ1  
0.1  
0.01  
.ꢀꢀ1  
0.001  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
V
– FORWARD VOLTAGE – V  
V
- FORWARD VOLTAGE - V  
F
F
Figure 6. Typical input diode forward characteristic.  
WIDEBODY  
8-PIN DIP, SO-8  
-2.3  
-2.4  
-2.2  
-2.ꢀ  
-1.8  
-1.6  
-2.2  
-2.1  
-2.ꢀ  
-1.9  
-1.8  
-1.4  
-1.2  
.1  
1
1ꢀ  
1ꢀꢀ  
.1  
1
1ꢀ  
1ꢀꢀ  
I
– PULSE INPUT CURRENT – mA  
I
– PULSE INPUT CURRENT – mA  
F
F
Figure 7. Typical temperature coefficient of forward voltage vs. input current.  
16  
PULSE GEN.  
= 5ꢀ Ω  
Z
f
O
t
= t = 5 ns  
r
SINGLE CHANNEL  
DUAL CHANNEL  
V
+5 V  
+5 V  
I
F
I
F
PULSE GEN.  
V
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
CC  
CC  
Z
= 5ꢀ Ω  
O
R
L
t
= t = 5 ns  
f
r
INPUT  
MONITORING  
NODE  
OUTPUT V  
O
MONITORING  
NODE  
.1μF  
BYPASS  
R
L
.1μF  
BYPASS  
OUTPUT V  
MONITORING  
NODE  
INPUT  
MONITORING  
NODE  
O
*C  
L
R
C *  
L
M
R
M
GND  
GND  
*C IS APPROXIMATELY 15 pF WHICH INCLUDES  
L
PROBE AND STRAY WIRING CAPACITANCE.  
I
= 7.5ꢀ mA  
= 3.75 mA  
F
INPUT  
I
I
F
F
t
t
PHL  
PLH  
OUTPUT  
V
O
1.5 V  
Figure 8. Test circuit for tPHL and tPLH  
.
1ꢀꢀ  
1ꢀ5  
9ꢀ  
V
I
= 5.ꢀ V  
V
A
= 5.ꢀ V  
CC  
= 7.5 mA  
CC  
T
= 25°C  
F
t
, R = 4 KΩ  
L
8ꢀ  
t
, R = 4 KΩ  
PLH  
PLH  
L
t
, R = 35ꢀ Ω  
L
PHL  
1 KΩ  
4 KΩ  
6ꢀ  
4ꢀ  
75  
6ꢀ  
t
, R = 35ꢀ Ω  
L
PLH  
t
, R = 1 KΩ  
L
PLH  
t
, R = 1 KΩ  
L
PLH  
t
, R = 35ꢀ Ω  
L
PLH  
45  
3ꢀ  
2ꢀ  
t
, R = 35ꢀ Ω  
PHL  
L
1 KΩ  
4 KΩ  
5
7
9
11  
13  
15  
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ  
8ꢀ 1ꢀꢀ  
6ꢀ  
I
– PULSE INPUT CURRENT – mA  
T
– TEMPERATURE – °C  
F
A
Figure 9. Typical propagation delay vs. tem-  
perature.  
Figure 10. Typical propagation delay vs. pulse  
input current.  
40  
V
I
= 5.ꢀ V  
t
t
CC  
= 7.5 mA  
RISE  
FALL  
R
= 4 kΩ  
L
F
30  
20  
10  
0
V
I
= 5.0 V  
CC  
= 7.5 mA  
R
= 4 kΩ  
= 1 kΩ  
3ꢀꢀ  
29ꢀ  
6ꢀ  
F
L
R
= 350Ω  
L
R
L
4ꢀ  
R
R
= 35ꢀ Ω  
L
2ꢀ  
R
= 1 kΩ  
L
= 35ꢀ Ω, 1 kΩ, 4 kΩ  
2ꢀ 4ꢀ 6ꢀ 8ꢀ 1ꢀꢀ  
L
-10  
-60  
-40 -20  
0
20 40  
80 100  
-6ꢀ -4ꢀ -2ꢀ  
60  
- TEMPERATURE - oC  
T
– TEMPERATURE – °C  
A
T
A
Figure 11. Typical pulse width distortion vs.  
temperature.  
Figure 12. Typical rise and fall time vs. tempera-  
ture.  
17  
PULSE GEN.  
= 5ꢀ Ω  
Z
f
O
t
= t = 5 ns  
r
INPUT V  
E
MONITORING NODE  
+5 V  
V
3.ꢀ V  
1.5 V  
1
2
3
4
8
7
6
5
CC  
INPUT  
V
7.5 mA  
E
.1 μF  
BYPASS  
R
L
I
F
t
t
EHL  
ELH  
OUTPUT V  
MONITORING  
NODE  
O
OUTPUT  
V
O
1.5 V  
*C  
L
GND  
*C IS APPROXIMATELY 15 pF WHICH INCLUDES  
L
PROBE AND STRAY WIRING CAPACITANCE.  
Figure 13. Test circuit for tEHL and tELH.  
12ꢀ  
V
V
V
= 5.ꢀ V  
= 3.ꢀ V  
= ꢀ V  
CC  
EH  
EL  
I
= 7.5 mA  
F
9ꢀ  
6ꢀ  
t
, R = 4 kΩ  
L
ELH  
t
, R = 1 kΩ  
ELH  
L
3ꢀ  
t
, R = 35ꢀ Ω  
ELH  
L
t
, R = 35ꢀ Ω, 1 kΩ, 4 kΩ  
EHL  
L
-6ꢀ -4ꢀ -2ꢀ  
2ꢀ 4ꢀ 6ꢀ 8ꢀ 1ꢀꢀ  
T
– TEMPERATURE – °C  
A
Figure 14. Typical enable propagation delay vs.  
temperature.  
I
F
SINGLE CHANNEL  
DUAL CHANNEL  
B
I
F
V
1
2
3
4
8
7
6
5
+5 V  
V
CC  
1
2
3
4
8
+5 V  
CC  
A
R
B
A
L
OUTPUT V  
MONITORING  
NODE  
.1 μF  
BYPASS  
O
R
7
6
5
L
V
FF  
OUTPUT V  
MONITORING  
NODE  
O
V
FF  
.1 μF  
BYPASS  
GND  
GND  
V
CM  
V
CM  
+
+
PULSE  
GENERATOR  
= 5ꢀ Ω  
PULSE  
GENERATOR  
= 5ꢀ Ω  
Z
Z
O
O
V
(PEAKꢁ  
CM  
V
CM  
ꢀ V  
5 V  
SWITCH AT A: I = ꢀ mA  
F
CM  
H
V
O
V
(MIN.ꢁ  
O
SWITCH AT B: I = 7.5 mA  
F
V
(MAX.ꢁ  
O
V
O
.5 V  
CM  
L
Figure 15. Test circuit for common mode transient immunity and typical waveforms.  
18  
HCNWXXXX  
(mWꢁ  
HCPL-2611 OPTION ꢀ6ꢀ  
8ꢀꢀ  
7ꢀꢀ  
6ꢀꢀ  
5ꢀꢀ  
4ꢀꢀ  
3ꢀꢀ  
2ꢀꢀ  
1ꢀꢀ  
P
P
I
(mWꢁ  
S
S
I
(mAꢁ  
(mAꢁ  
S
S
8ꢀꢀ  
7ꢀꢀ  
6ꢀꢀ  
5ꢀꢀ  
4ꢀꢀ  
3ꢀꢀ  
2ꢀꢀ  
1ꢀꢀ  
25  
5ꢀ 75 1ꢀꢀ 125 15ꢀ 175  
25 5ꢀ 75 1ꢀꢀ 125 15ꢀ 175 2ꢀꢀ  
– CASE TEMPERATURE – °C  
T
– CASE TEMPERATURE – °C  
T
S
S
Figure 16. Thermal derating curve, dependence of safety limiting value with case temperature  
per IEC/EN/DIN EN 60747-5-2.  
GND BUS (BACKꢁ  
V
BUS (FRONTꢁ  
NC  
CC  
ENABLE  
OUTPUT  
.1μF  
NC  
1ꢀ mm MAX.  
(SEE NOTE 5ꢁ  
SINGLE CHANNEL  
DEVICE ILLUSTRATED.  
Figure 17. Recommended printed circuit board layout.  
19  
SINGLE CHANNEL DEVICE  
5 V  
5 V  
8
6
V
CC1  
V
CC2  
39ꢀ Ω  
47ꢀ Ω  
I
F
+
2
3
D1*  
V
.1 μF  
BYPASS  
F
5
GND 1  
GND 2  
SHIELD  
V
E
7
1
2
*DIODE D1 (1N916 OR EQUIVALENTꢁ IS NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT.  
DUAL CHANNEL DEVICE  
CHANNEL 1 SHOWN  
5 V  
5 V  
8
7
V
CC1  
V
CC2  
39ꢀ Ω  
47ꢀ Ω  
I
F
+
1
2
D1*  
V
.1 μF  
BYPASS  
F
5
GND 1  
GND 2  
SHIELD  
1
2
Figure 18. Recommended TTL/LSTTL to TTL/LSTTL interface circuit.  
20  
Propagation Delay, Pulse-Width Distortion and Propagation  
Delay Skew  
puts of a group of optocouplers are switched either ON  
or OFF at the same time, tPSK is the difference between  
the shortest propagation delay, either tPLH or tPHL, and the  
Propagation delay is a figure of merit which describes  
how quickly a logic signal propagates through a sys-  
tem. The propagation delay from low to high (tPLH) is the  
amount of time required for an input signal to propagate  
to the output, causing the output to change from low to  
high. Similarly, the propagation delay from high to low  
(tPHL) is the amount of time required for the input signal  
to propagate to the output causing the output to change  
from high to low (see Figure8).  
longest propagation delay, either tPLH or tPHL  
.
As mentioned earlier, tPSK can determine the maximum  
parallel data transmission rate. Figure 20 is the timing  
diagram of a typical parallel data application with both  
the clock and the data lines being sent through opto-  
couplers. The figure shows data and clock signals at the  
inputs and outputs of the optocouplers. To obtain the  
maximum data transmission rate, both edges of the  
clock signal are being used to clock the data; if only one  
edge were used, the clock signal would need to be twice  
as fast.  
Pulse-width distortion (PWD) results when tPLH and tPHL  
differ in value. PWD is defined as the difference be-  
tween tPLH and tPHL and often determines the maximum  
data rate capability of a transmission system. PWD can  
be expressed in percent by dividing the PWD (in ns) by  
the minimum pulse width (in ns) being transmitted. Typi-  
cally, PWD on the order of 20-30% of the minimum pulse  
width is tolerable; the exact figure depends on the par-  
ticular application (RS232, RS422, T-l, etc.).  
Propagation delay skew represents the uncertainty of  
where an edge might be after being sent through an  
optocoupler. Figure 20 shows that there will be uncer-  
tainty in both the data and the clock lines. It is important  
that these two areas of uncertainty not overlap, other-  
wise the clock signal might arrive before all of the data  
outputs have settled, or some of the data outputs may  
start to change before the clock signal has arrived. From  
these considerations, the absolute minimum pulse width  
that can be sent through optocouplers in a parallel appli-  
cation is twice tPSK. A cautious design should use a slightly  
longer pulse width to ensure that any additional uncer-  
tainty in the rest of the circuit does not cause a problem.  
Propagation delay skew, tPSK, is an important parameter to  
consider in parallel data applications where synchroniza-  
tion of signals on parallel data lines is a concern. If the  
parallel data is being sent through a group of optocou-  
plers, differences in propagation delays will cause the  
data to arrive at the outputs of the optocouplers at differ-  
ent times. If this difference in propagation delays is large  
enough, it will determine the maximum rate at which  
parallel data can be sent through the optocouplers.  
The tPSK specified optocouplers offer the advantages of  
guaranteed specifications for propagation delays, pulse-  
width distortion and propagation delay skew over the  
recommended temperature, input current, and power  
supply ranges.  
Propagation delay skew is defined as the difference be-  
tween the minimum and maximum propagation delays,  
either tPLH or tPHL, for any given group of optocouplers  
which are operating under the same conditions (i.e., the  
same drive current, supply voltage, output load, and op-  
erating temperature). As illustrated in Figure 19, if the in-  
DATA  
INPUTS  
CLOCK  
I
F
5ꢀ%  
1.5 V  
V
O
DATA  
I
5ꢀ%  
F
OUTPUTS  
t
PSK  
V
1.5 V  
CLOCK  
O
t
PSK  
t
PSK  
Figure 19. Illustration of propagation delay skew - tPSK.  
Figure 20. Parallel data transmission example.  
21  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2005-2010 Avago Technologies Limited. All rights reserved. Obsoletes AV02-0170EN  
AV02-0940EN - March 29, 2010  

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