HLMP-1521-EU302 [AVAGO]
SINGLE COLOR LED;
| 型号： | HLMP-1521-EU302 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED |
| 文件： | 总9页 (文件大小：237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-132x Series, HLMP-142x Series,
HLMP-152x Series
T-1 (3 mm) High Intensity LED Lamps
Data Sheet
Description
Features
• High intensity
This family of T-1 lamps is specially designed for applica-
tions requiring higher on-axis intensity than is achiev-
able with a standard lamp. The light generated is focused
to a narrow beam to achieve this effect.
• Choice of 3 bright colors
High Efficiency Red
Yellow
High Performance Green
Package Dimensions
• Popular T-1 diameter package
• Selected minimum intensities
• Narrow viewing angle
• General purpose leads
• Reliable and rugged
3.17 (.125)
Ø
2.67 (.105)
3.43 (.135)
2.92 (.115)
• Available on tape and reel
4.70 (.185)
4.19 (.165)
• For more information, please refer to Tape and Reel
Option data sheet
1.14 (.045)
0.51 (.020)
6.35 (.250)
5.58 (.220)
Selection Guide
Luminous Intensity
Iv (mcd) @ 10 mA
Package
Description
0.65 (0.026) max.
Part Number
Color
Min.
8.6
8.6
9.2
Max.
HLMP-1321
Tinted,
Non-diffused
–
–
–
High Efficiency
Red
HLMP-1321-G00xx
HLMP-1420
24.1(.95) min.
Microtinted,
Non-diffused
Yellow
Green
HLMP-1421
Tinted,
Non-diffused
9.2
9.2
6.7
–
–
–
HLMP-1421-F00xx
HLMP-1520
1.52 (.060)
1.02 (.040)
Microtinted,
Non-diffused
HLMP-1521
Tinted,
Non-diffused
6.7
6.7
–
–
HLMP-1521-E00xx
(0.022) 0.55
(0.016) 0.40
SQ. TYP.
2.79 (.110)
2.29 (.090)
Notes:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 1 mm (0.40") down the leads.
3. For PCB hole recommendations, see the Precautions section.
Part Numbering System
HLMP - 1 x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads
A2: Right Angle Housing, Even Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Options
20: Untinted or Microtinted, Non-diffused
21: Tinted, Non-diffused
Color Options
3: GaP HER
4: GaP Yellow
5: GaP Green
Package Options
1: T-1 (3 mm)
Absolute Maximum Ratings at TA = 25°C
Parameter
Red
Yellow
Green
Units
mA
mA
mA
mW
V
Peak Forward Current
90
60
90
Average Forward Current[1]
DC Current[2]
Power Dissipation[3]
25
20
25
30
20
30
135
85
135
Reverse Voltage (IR = 100 µA)
Transient Forward Current[4] (10 µsec Pulse)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
5
5
5
500
500
500
mA
°C
110
110
110
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-20 to +100
-40 to +100
°C
Notes:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute
Maximum Ratings.
2
Electrical Characteristics at TA = 25°C
Device
HLMP-
Symbol
Description
Min.
Typ.
Max.
Units Test Conditions
IV
Luminous Intensity
1320
1321
8.6
8.6
30
30
mcd
IF = 10 mA
(Figure 3)
1420
1421
9.2
9.2
15
15
mcd
mcd
Deg.
IF = 10 mA
(Figure 8)
1520
1521
6.7
6.7
22
22
IF = 10 mA
(Figure 3)
2q1/2
Including Angle Between
Half Luminous Intensity
Points
All
45
IF = 10 mA
See Note 1
(Figures 6, 11, 16, 21)
lPEAK
Peak Wavelength
132x
635
nm
Measurement
at Peak (Figure 1)
142X
152X
583
565
Dl1/2
Spectral Line Halfwidth
Dominant Wavelength
Speed of Response
Capacitance
132x
40
nm
nm
ns
142X
152X
36
28
ld
132x
626
See Note 2 (Figure 1)
142X
152X
585
569
ts
132x
90
142X
152X
90
500
C
132x
11
pF
VF = 0; f = 1 MHz
142X
152X
15
18
RqJ-PIN
Thermal Resistance
Forward Voltage
All
290
°C/W
V
Junction to
Cathode Lead
VF
132x
1.9
2.4
IF = 10 mA
142X
152X
2.0
2.1
2.4
2.7
VR
Reverse Breakdown Voltage
Luminous Efficacy
All
5.0
V
IR = 100 µA
hV
132x
145
lumens See Note 3
watt
142X
152X
500
595
Notes:
1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of
the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lv/hv, where lv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
3
Figure 1. Relative intensity vs. wavelength.
T-1 High Efficiency Red Non-Diffused
90
80
70
60
50
40
30
20
10
0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
1.0
2.0
3.0
4.0
5.0
0
5
10
15
20
25
30
0
10 20 30 40 50 60 70 80 90
IPEAK – PEAK CURRENT PER LED – mA
VF – FORWARD VOLTAGE – V
IDC – DC CURRENT PER LED – mA
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. peak LED current.
0°
6
5
4
10°
20°
1.0
.8
30°
40°
50°
60°
3
2
.6
.4
70°
80°
.2
NON-DIFFUSED
0° 20° 40°
1
1.0
90°
10
100
1,000
10,000
60°
80°
100°
tp – PULSE DURATION – µs
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).
Figure 6. Relative luminous intensity vs. angular displacement.
4
T-1 Yellow Non-Diffused
60
50
40
30
20
10
0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
2.5
2.0
1.5
1.0
0.5
0
T
= 25°
A
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
10
20
30
40
50
60
0
5
10
15
20
VF – FORWARD VOLTAGE – V
IPEAK – PEAK CURRENT – mA
IF – FORWARD CURRENT – mA
Figure 7. Forward current vs. forward voltage
characteristics.
Figure 8. Relative luminous intensity vs.
forward current.
Figure 9. Relative efficiency (luminous intensity
per unit current) vs. peak current.
0°
10°
20°
6
5
4
1.0
.8
30°
40°
50°
60°
.6
3
2
.4
70°
80°
.2
NON-DIFFUSED
0° 20° 40°
90°
1
1.0
60°
80°
100°
10
100
1,000
10,000
tp – PULSE DURATION – µs
Figure 10. Maximum tolerable peak current vs.
pulse duration. (IDCMAX as per MAX ratings).
Figure 11. Relative luminous intensity vs. angular displacement.
5
T-1 Green Non-Diffused
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
90
80
70
60
50
40
30
20
10
0
0
5
10 15 20
25 30 35 40
0
10 20 30 40 50 60 70 80 90 100
IPEAK – PEAK CURRENT PER LED – mA
1.0
2.0
3.0
4.0
5.0
IPEAK – PEAK CURRENT PER LED – mA
VF – FORWARD VOLTAGE – V
Figure 12. Forward current vs. forward voltage
characteristics.
Figure 13. Relative luminous intensity vs.
forward current.
Figure 14. Relative efficiency (luminous inten-
sity per unit current) vs. peak LED current.
6
5
4
0°
10°
20°
1.0
.8
30°
40°
50°
60°
3
2
.6
.4
70°
80°
.2
NON-DIFFUSED
0° 20° 40°
1
1.0
90°
10
100
1,000
10,000
60°
80°
100°
tp – PULSE DURATION – µs
Figure 15. Maximum tolerable peak current vs.
pulse duration. (IDCMAX as per MAX ratings).
Figure 16. Relative luminous intensity vs. angular displacement.
6
Intensity Bin Limits
Intensity Bin Limits
Intensity Range (mcd)
Intensity Range (mcd)
Color
Bin
G
H
I
Min.
Max.
Color
Bin
E
Min.
Max.
9.7
15.5
7.6
12.0
15.5
24.8
F
12.0
19.1
24.8
39.6
G
H
I
19.1
30.7
J
39.6
63.4
30.7
49.1
K
L
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
16.6
49.1
78.5
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
10.3
J
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
M
N
O
P
K
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
L
M
N
O
P
Green
Red
Q
R
S
Q
R
T
U
V
W
X
Y
Z
F
S
T
U
V
W
Maximum tolerance for each bin limit is ± 1ꢀ8%
G
H
I
16.6
26.5
26.5
42.3
42.3
67.7
J
67.7
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
K
L
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
M
N
O
P
Yellow
Q
R
S
T
U
V
W
7
Color Categories
Lambda (nm)
Color
Category #
Min.
Max.
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
6
5
4
3
2
1
3
2
4
5
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
Green
Yellow
Maximum tolerance for each bin limit is ± ±%. nm%
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
A1
A2
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, minimum increment 1800 pcs/bag
Tape & Reel, straight leads, minimum increment 1800 pcs/bag
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
8
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
LED Component
Lead Size
Plated Through
-Hole Diameter
Diagonal
Manual Solder
Lead size (typ.) 0.45 × 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave Soldering
105°C Max.
30 sec Max.
250°C Max.
3 sec Max.
Dipping
(0.018 × 0.018 in.) (0.025 in)
Pre-heat Temperature
Pre-heat Time
–
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
–
Peak Temperature
Dwell Time
260°C Max.
5 sec Max.
Lead size (typ.) 0.50 × 0.50 mm
0.707 mm
1.05 to 1.15 mm
(0.041 to 0.045 in)
(0.020 × 0.020 in.) (0.028 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information
on soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
50
30
SOLDER: SN63; FLUX: RMA
PREHEAT
20 30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
10
40
50
TIME – SECONDS
Figure 17. Recommended wave soldering profile.
60
70
80
90 100
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries%
Data subject to change% Copyright © 2±±.-2±13 Avago Technologies% All rights reserved% Obsoletes .9ꢀ9-42.3EN
AV±2-1±6ꢀEN - July 24, 2±13
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