HLMP-AB61-RU0ZZ [AVAGO]
Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs; 精密光学性能红，绿，蓝5毫米迷你椭圆形LED灯
| 型号： | HLMP-AB61-RU0ZZ |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs |
| 文件： | 总12页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-AD61, HLMP-AM61 and HLMP-AB61
Precision Optical Performance Red, Green and Blue
5mm Mini Oval LEDs
Data Sheet
Features
Description
• Well defined spatial radiation pattern
• High brightness material
• Available in red, green and blue color.
Red AlInGaP 630mm
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and passenger
information signs. The oval shaped radiation pattern
and high luminous intensity ensure that these devices
are excellent for wide field of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched
radiation patterns ensuring consistent color mixing in
full color applications, message uniformity across the
viewing angle of the sign. High efficiency LED material
is used in these lamps: Aluminum Indium Gallium
Phosphide (AlInGaP II) for red and Indium Gallium
Nitride for blue and green. Each lamp is made with an
advanced optical grade epoxy offering superior high
temperature and high moisture resistance in outdoor
applications.
Green InGaN 525nm
Blue InGaN 470nm
• Superior resistance to moisture
• Standoff package
Applications
• Full color signs
• Commercial outdoor advertising.
Package Dimensions
ꢀ4.00
11.50 0.ꢀ
0.453 .01
0.945
1.0
MIN.
0.038
Measured at base of lens
8.70 0.ꢀ0
0.34ꢀ .008
1.50 0.15
3.80 0.ꢀ0
0.0591 0.00ꢁ
0.150 .008
CATHODE LEAD
ꢀ.54 0.3
5.ꢀ 0.ꢀ
0.100 0.01ꢀ
0.ꢀ05 .008
0.50 0.10
0.0ꢀ0 0.004
0.8
0.03ꢀ
MAX. Epoxy Meniscus
NOTES:
Dimensions in Millimeters (Inches)
For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode.
Caution: InGaN devices are Class 1C HBM ESD Sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Luminous Intensity Iv
(mcd) at 20 mA
Min
Luminous Intensity Iv
(mcd) at 20 mA
Max
Color and Dominant
Wavelength λd (nm) Typ
Part Number
HLMP-AD61-X1TZZ
HLMP-AM61-Z30ZZ
HLMP-AB61-RU0ZZ
Red 630
1660
2400
550
3500
5040
1150
Green 525
Blue 470
Tolerance for each intensity limit is ꢀ5ꢁ.
Notes:
ꢀ. The luminous intensity is measured on the mechanical axis of the lamp package
Part Numbering System
HLMP - A x 61 x x x x x
Packaging Option
ZZ: Flexi Ammo-packs
Color Bin Selection
0: Open distribution
T: Red Color, Vf maximum =2.6V
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
B: Blue 470
D: Red 630
M: Green 525
Package
A: 5mm Mini Oval 30° x 70°
ꢀ
Absolute Maximum Rating (T = 25°C)
A
Parameter
Red
Blue and Green
30
Unit
mA
mA
mW
V
[1]
DC Forward Current
50
Peak Forward Current
Power Dissipation
100[2]
100[3]
130
116
Reverse Voltage
5 (IR = 100 µA)
130
5 (IR = 10 µA)
110
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +100
-40 to +120
-40 to +85
-40 to +100
°C
°C
Notes:
ꢀ. Derate linearly as shown in Figure 4 and Figure 8
2. Duty Factor 30ꢁ, frequency ꢀKHz
3. Duty Factor ꢀ0ꢁ, frequency ꢀKHz
Electrical / Optical Characteristics (T = 25°C)
A
Parameter
Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Green
Blue
VF
V
IF = 20 mA
2.0
2.8
2.8
2.3
3.3
3.2
2.6[1]
3.8
3.8
Reverse Voltage
Red
Green & blue
VR
V
5
5
IF = 100 µA
IF = 10 µA
Dominant Wavelength
IF = 20 mA
λD
Red
Green
Blue
622
520
460
630
525
470
634
540
480
Peak Wavelength
λPEAK
Red
Green
Blue
639
516
464
nm
nm
Peak of Wavelength of Spectral Distribution at IF 20
mA
=
Spectral Half width
Red
Green
Blue
∆λ1/2
17
32
23
Wavelength Width at Spectral Distribution ½ Power
Point at ,IF = 20 mA
Thermal Resistance,
RθJ-PIN
240
°C/W LED Junction-to-pin
[3]
Luminous Efficacy
ηV
Red
Green
Blue
155
520
75
lm/W Emitted Luminous Power/Emitted Radiant Power
Notes:
ꢀ. For option –xxTxx, the VF maximum is 2.6V, refer to Vf bin table
2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
3. The radiant intensity, I in watts per steradian, may be found from the equation I = I /η where I is the luminous intensity in candelas
e
e
V
V
V
and η is the luminous efficacy in lumens/watt
V
4. Forward voltage allowable tolerance is 0.05V
5. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead. For InGaN blue and Green, thermal resistance applied to LED
junction to anode lead
3
AlInGaP Red
60
50
40
30
20
10
0
1.0
RθJ-A=585°C/W
RθJ-A=630°C/W
0.5
0
0
20
40
60
80
100
550
600
650
700
o
WAVELENGTH – nm
TA - AMBIENT TEMPERATURE -
C
Figure 1. Relative Intensity vs Wavelength
Figure 2. Maximum Forward Current vs Ambient Temperature
50
40
30
20
10
0
2.5
2.0
1.5
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
10
20
30
40
50
FORWARD CURRENT - mA
VF - FORWARD VOLTAGE - V
Figure 3. Forward Current vs Forward Voltage
Figure 4. Relative Intensity vsForward Current
4
InGaN Blue and Green
1.00
35
30
25
20
15
10
5
0.80
GREEN
BLUE
0.60
0.40
0.20
0
0
350 400 450 500 550 600 650
1
3
0
2
4
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 5. Relative Intensity vs Wavelength
Figure 6. Forward Current vs Forward Voltage
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
35
30
RθJ-A=630°C/W
25
20
15
10
5
0
0
20
40
60
80
100
0
5
10
15
20
25
30
T
A - AMBIENT TEMPERATURE - oC
DC FORWARD CURRENT - mA
Figure 7. Relative Intensity vs Forward Current
Figure 8. Maximum Forward Current vs Ambient Temperature
5
10
8
6
4
GREEN
2
0
BLUE
-2
-4
0
5
10
15
20
25
30
FORWARD CURRENT - mA
Figure 9. Relative dominant wavelength vs Forward Current
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Radiation pattern-Major Axis
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Radiation pattern-Minor Axis
ꢁ
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Green Color Bin Table
Min
Max
Intensity (mcd) at 20 mA
Bin Dom Dom Xmin Ymin Xmax Ymax
Bin
Q
R
Min
460
Max
550
1
2
3
4
5
520.0 524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
550
660
524.0 528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
S
660
800
T
800
960
528.0 532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
U
V
960
1150
1380
1660
1990
2400
2900
3500
4200
5040
1150
1380
1660
1990
2400
2900
3500
4200
532.0 536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
W
X
536.0 540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Y
Z
Tolerance for each bin limit is 0.5nm
1
2
3
Blue Color Bin Table
Tolerance for each bin limit is ꢀ5ꢁ
Min
Max
Bin Dom Dom Xmin Ymin Xmax Ymax
VF bin Table (V at 20mA)
1
2
3
4
5
460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
Bin ID
VA
Min.
2.0
Max.
2.2
464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
VB
2.2
2.4
468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
VC
2.4
2.6
Tolerance for each bin limit is 0.05
472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
Red Color Range
476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Min Dom Max Dom Xmin Ymin Xmax Ymax
622
634
0.6904 0.3094 0.6945 0.2888
0.6726 0.3106 0.7135 0.2865
Tolerance for each bin limit is 0.5nm
Note:
Tolerance for each bin limit is 0.5 nm
ꢀ. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
1
2
3
4
Green
0.600
0.400
0.200
0.000
Red
5
Blue
3
1
0.000
0.100
0.200
0.300
0.400
X
0.500
0.600
0.700
0.800
8
Precautions
Avago Technologies LED configuration
Lead Forming:
• The leads of an LED lamp may be preformed or cut
to length prior to insertion and soldering into PC
board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling
to the LED chip die attach and wirebond.
InGaN Device
AlInGaP Device
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to length
rather that doing it manually.
Note: Electrical connection between bottom surface of LED die
and the leadframe material through conductive paste or solder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Soldering Condition:
• Care must be taken during PCB assembly and solder-
ing process to prevent damage to LED component.
Note: In order to further assist customer in designing jig
accurately that fit Avago Technologies’ product, 3D model of the
product is available upon request.
• The closest manual soldering distance of the
soldering heat source (soldering iron’s tip) to the
body is ꢀ.59mm. Soldering the LED closer than
ꢀ.59mm might damage the LED.
• At elevated temperature, the LED is more
susceptible to mechanical stress. Therefore, PCB
must be allowed to cool down to room temperature
prior to handling, which includes removal of jigs,
fixtures or pallet.
1.59mm
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
• Recommended PC board plated through holes size
for LED component leads.
Pre-heat temperature 105 °C Max.
-
-
LED component
Lead size
Diagonal
Plated through
hole diameter
Preheat time
Peak temperature
Dwell time
30 sec Max
0.457 x 0.457mm
(0.018 x 0.018inch) (0.025 inch) (0.038 to 0.042 inch)
0.646 mm
0.976 to 1.078 mm
250 °C Max. 260 °C Max.
3 sec Max. 5 sec Max
0.508 x 0.508mm 0.718 mm 1.049 to 1.150mm
(0.020 x 0.020inch) (0.028 inch) (0.041 to 0.045 inch)
• Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
Note: Refer to application note ANꢀ027 for more information
on soldering LED components.
Note:
ꢀ. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again prior to loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding recommendation of 250 ° C. Over-stressing the
LED during soldering process might cause premature failure
to the LED due to delamination.
9
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
FLUXING
PREHEAT SETTING = 150
SOLDER WAVE TEMPERATURE = 245
AIR KNIFE AIR TEMPERATURE = 390
°C (100°C PCB)
°
C
°
C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER
96.5%Sn; 3.0%Ag; 0.5% Cu
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME - SECONDS
10
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & - ZZ and regardless standoff or non-standoff
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
ꢀꢀ
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0420EN
AV01-0606EN - October 20, 2006
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