HLMP-AD87-RU000 [AVAGO]
Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs; 精密光学性能红，绿，蓝5毫米迷你椭圆形LED灯
| 型号： | HLMP-AD87-RU000 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs |
| 文件： | 总12页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-AD85, HLMP-AD87, HLMP-AM86,
HLMP-AM87, HLMP-AB86, HLMP-AB87
Precision Optical Performance �eꢀ ꢁreen anꢀ ꢂlꢃe
5mm Mini Oval ꢄꢅꢆs
Data Sheet
Description
Features
•ꢀ Wellꢀdefinedꢀspatialꢀradiationꢀpattern
•ꢀ Highꢀbrightnessꢀmaterial
•ꢀ Availableꢀinꢀred,ꢀgreenꢀandꢀblueꢀcolor
Theseꢀ Precisionꢀ Opticalꢀ Performanceꢀ Ovalꢀ LEDsꢀ areꢀ
specificallyꢀ designedꢀ forꢀ fullꢀ color/videoꢀ andꢀ passengerꢀ
informationꢀsigns.ꢀꢀTheꢀovalꢀshapedꢀradiationꢀpatternꢀandꢀ
highꢀluminousꢀintensityꢀensureꢀtheseꢀdevicesꢀareꢀexcellentꢀ
forꢀwideꢀfieldꢀofꢀviewꢀoutdoorꢀapplicationsꢀwhereꢀaꢀwideꢀ
viewingꢀ angleꢀ andꢀ readabilityꢀ inꢀ sunlightꢀ areꢀ essential.ꢀ
Theseꢀ lampsꢀ haveꢀ veryꢀ smooth,ꢀ matchedꢀ radiationꢀ
patternsꢀensuringꢀconsistentꢀcolorꢀmixingꢀinꢀfullꢀcolorꢀap-
plications,ꢀmessageꢀuniformityꢀacrossꢀtheꢀviewingꢀangleꢀ
ofꢀtheꢀsign.ꢀꢀHighꢀefficiencyꢀLEDꢀmaterialꢀisꢀusedꢀinꢀtheseꢀ
ꢀ
ꢀ
ꢀ
-ꢀꢀRedꢀAlInGaPꢀ630nm
-ꢀꢀGreenꢀInGaꢀ�ꢁ�nm
-ꢀꢀꢂlueꢀInGaꢀꢃꢄ0nm
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture
•ꢀ Tintedꢀandꢀdiffused
lamps:ꢀAluminiumꢀIndiumꢀGalliumꢀPhosphideꢀ(AlInGaP)ꢀforꢀ Benefits
redꢀandꢀIndiumꢀGalliumꢀitrideꢀ(InGa)ꢀforꢀblueꢀandꢀgreen.ꢀ
•ꢀ Viewingꢀangleꢀdesignedꢀforꢀwideꢀfieldꢀofꢀviewꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
Eachꢀlampꢀisꢀmadeꢀwithꢀanꢀadvanceꢀopticalꢀgradeꢀepoxyꢀ
offeringꢀ superiorꢀ highꢀ temperatureꢀ andꢀ highꢀ moistureꢀ
resistanceꢀinꢀoutdoorꢀapplications.
applications
•ꢀ Superiorꢀperformanceꢀforꢀoutdoorꢀenvironments.
Applications
•ꢀ Fullꢀcolorꢀsigns
TheꢀpackageꢀepoxyꢀcontainsꢀbothꢀUV-AꢀandꢀUV-ꢂꢀinhibi-
torsꢀtoꢀreduceꢀtheꢀeffectsꢀofꢀlongꢀtermꢀexposureꢀtoꢀdirectꢀ
sunlight.
•ꢀ Commercialꢀoutdoorꢀadvertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
A
ꢀ4.±±MIN.
±.945
Measured at base of lens
1.±MIN.
±.±38
8.7±±±.ꢀ±
.34ꢀ±.±±8
3.8±±±.ꢀ±
.15±±.±±8
CATHODE LEAD
NOTE 1
ꢀ.54±±.3
5.ꢀ±±±.ꢀ
±.1±±±±.±1ꢀ
.ꢀ±5±.±±8
±.4±±.1
±.±16±±.±±
±.5±±±.1±
±.±ꢀ±±±.±±4
±.8MAX. Epoxy Meniscus
.±16.
ꢀ4.±±
±.945
B
11.5±±±.ꢀ±
±.453±.±±8
Measured at base of lens
1.±MIN.
±.±38
8.7±±±.ꢀ±
±.34ꢀ±.±±8
3.8±±.ꢀ
1.ꢀ5±±.ꢀ±
±.±49±±.±±8
.15±±.±±8
CATHODE LEAD
ꢀ.54±±.3
5.ꢀ±±±.ꢀ±
±.ꢀ±5±.±±8
±.1±±±±.±1ꢀ
±.4±±±.1±
±.±16±±.±±
±.5±±±.1±
±.±ꢀ±±±.±±4
±.8MAX. Epoxy
±.±3ꢀ
OTES:
DimensionsꢀinꢀMillimetersꢀ(Inches)
ForꢀꢂlueꢀandꢀGreenꢀifꢀheat-sinkingꢀapplicationꢀisꢀrequired,ꢀtheꢀterminalꢀforꢀheatꢀsinkꢀisꢀanode.
ꢁ
Device Selection Guide
Luminous
Intensity Iv
(cd) at 20mA
Typ. Dominant
Wavelength
Package
Part Number
Color ld (nm)
Min.
1.�0
1.�0
ꢁ.�0
ꢁ.�0
0.�ꢁ
0.�ꢁ
Max.
Lens Type
Standoffs Drawing
HLMP-AD8�-RU0xx
HLMP-AD8ꢄ-RU0xx
HLMP-AM86-TW0xx
HLMP-AM8ꢄ-TW0xx
HLMP-Aꢂ86-MQ0xx
HLMP-Aꢂ8ꢄ-MQ0xx
otes:
Red
Red
630
630
ꢃ.ꢁ0
ꢃ.ꢁ0
ꢄ.ꢁ0
ꢄ.ꢁ0
1.�0
1.�0
Tinted,ꢀdiffused o
Tinted,ꢀdiffused Yes
Tinted,ꢀdiffused o
Tinted,ꢀdiffused Yes
Tinted,ꢀdiffused o
Tinted,ꢀdiffused Yesꢀ
A
ꢂ
A
ꢂ
A
ꢂ
Greenꢀ �ꢁ�
Green �ꢁ�
ꢂlueꢀ
ꢂlue
ꢃꢄ0
ꢃꢄ0
1.ꢀ Toleranceꢀforꢀluminousꢀintensityꢀmeasurementꢀisꢀ 1�%
ꢁ.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
3.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
ꢃ.ꢀ Theꢀdominantꢀwavelengthꢀλ ꢀisꢀderivedꢀfromꢀtheꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
�.ꢀ LEDꢀlightꢀoutputꢀisꢀbrightꢀenoughꢀtoꢀcauseꢀinjuriesꢀtoꢀtheꢀeyes.ꢀꢀPrecautionsꢀmustꢀbeꢀtakenꢀtoꢀpreventꢀlookingꢀdirectlyꢀatꢀtheꢀLEDꢀwithoutꢀproperꢀ
safetyꢀequipment.
Part Numbering System
H L M P - x x 8x - x
x x xx
Mechanical Option
±±: Bulk
DD: Ammo Pack
ZZ: Flexi-Bin, Ammo pack
Color Bin Options
±: Full color bin distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: Blue 47±nm
M: Green 5ꢀ5nm
D: Red 63±nm
Package
A: 5mm Mini Oval
3
o
Absolute Maximum Rating at T = 25 C
A
Parameters
DCꢀforwardꢀcurrentꢀ[1]
Blue and Green
30
Red
�0
Unit
mA
Peakꢀpulsedꢀforwardꢀcurrentꢀ
Powerꢀdissipation
100ꢀ[ꢁ]
116
100ꢀ[3]
1ꢁ0
mA
mW
LEDꢀjunctionꢀtemperature
Operatingꢀtemperatureꢀrange
Storageꢀtemperatureꢀrange
130
130
oC
oC
oC
-ꢃ0ꢀtoꢀ+8�
-ꢃ0ꢀtoꢀ+100
-ꢃ0ꢀtoꢀ+100
-ꢃ0ꢀtoꢀ+1ꢁ0
otes:
1.ꢀ Derateꢀlinearlyꢀasꢀshownꢀinꢀfigureꢀ3ꢀandꢀfigureꢀꢄ.
ꢁ.ꢀ Dutyꢀfactorꢀ10%,ꢀfrequencyꢀ1KHz.
3.ꢀ Dutyꢀfactorꢀ30%,ꢀfrequencyꢀ1KHz.
o
Electrical/Optical Characteristics T = 25 C
A
Value
Symbol Min.
Parameters
Typ.
Max.
Units
Test Condition
Forwardꢀvoltage
ꢀꢀꢀꢀRedꢀ
ꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢂlue
ReverseꢀVoltage
ꢀꢀꢀꢀRedꢀ
VF
VR
ꢁ.0
ꢁ.8
ꢁ.8
ꢁ.ꢁ0
3.3
3.ꢁ
ꢁ.ꢃ0
3.8�
3.8�
V
IFꢀ=ꢀꢁ0ꢀmA
ꢀ
�.0
�.0
�.0
V
IRꢀ=ꢀ100ꢀmA
IRꢀ=ꢀ10ꢀmA
IRꢀ=ꢀ10ꢀmA
ꢀꢀꢀꢀGreenꢀ
ꢀꢀꢀꢀꢂlue
Thermalꢀresistanceꢀ[1]
Dominantꢀwavelengthꢀ[ꢁ,ꢀ3]
ꢀꢀꢀꢀRed
ꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢂlue
RqJ-PI
ꢁꢃ0
oC/W
nm
LEDꢀJunction-to-pin
ld
6ꢁꢁ
�ꢁ0
ꢃ60
630
�ꢁ�
ꢃꢄ0
63ꢃ
�ꢃ0
ꢃ80
IFꢀ=ꢀꢁ0ꢀmA
Peakꢀwavelength
ꢀꢀꢀꢀRedꢀ
ꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢂlue
Spectralꢀhalfꢀwidth
ꢀꢀꢀꢀRed
ꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢂlue
LuminousꢀEfficacyꢀ[ꢃ]
ꢀꢀꢀꢀRed
ꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢂlue
LuminousꢀFlux
ꢀꢀꢀꢀꢀRed
ꢀꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢀꢂlue
lPEAK
Dl1/ꢁ
hv
639
�16
ꢃ6ꢃ
nm
nm
Peakꢀofꢀwavelengthꢀofꢀspectralꢀ
distributionꢀatꢀIFꢀ=ꢀꢁ0ꢀmA
Wavelengthꢀwidthꢀatꢀspectralꢀ
distributionꢀ1/ꢁꢀpowerꢀpointꢀatꢀIFꢀ
=ꢀꢁ0ꢀmA
1ꢄ
3ꢁ
ꢁ3
1��
�ꢁ0
ꢄ�
lm/W
mlm
Emittedꢀluminousꢀpower/Emittedꢀ
radiantꢀpower
jV
1300
3000
600
IFꢀ=ꢀꢁ0ꢀmA
LuminousꢀEfficiencyꢀ[�]
ꢀꢀꢀꢀꢀRed
ꢀꢀꢀꢀꢀGreen
ꢀꢀꢀꢀꢀꢂlue
otes:
he
30
�0
10
lm/W
LuminousꢀFlux/ElectricalꢀPower
IFꢀ=ꢀꢁ0ꢀmA
1.ꢀ ForꢀAlInGaPꢀRed,ꢀtheꢀthermalꢀresistanceꢀappliedꢀtoꢀLEDꢀjunctionꢀtoꢀcathodeꢀlead.ꢀForꢀInGaꢀꢂlueꢀandꢀGreen,ꢀtheꢀthermalꢀresistanceꢀappliedꢀtoꢀLEDꢀ
junctionꢀtoꢀanodeꢀlead.
ꢁ.ꢀ Theꢀdominantꢀwavelengthꢀλ ꢀisꢀderivedꢀfromꢀtheꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
3.ꢀ Toleranceꢀforꢀeachꢀcolorꢀbinꢀlimitꢀisꢀ 0.�ꢀnm
ꢃ.ꢀ Theꢀradiantꢀintensity,ꢀIeꢀinꢀwatts/steradian,ꢀmayꢀbeꢀfoundꢀfromꢀtheꢀequationꢀIeꢀ=ꢀIv/η ,ꢀwhereꢀIvꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelasꢀandꢀη ꢀisꢀtheꢀ
v
v
luminousꢀefficacyꢀinꢀlumens/watt.
�.ꢀ h ꢀ=ꢀj ꢀ/ꢀI ꢀꢀxꢀV ꢀ,ꢀwhereꢀj ꢀꢀisꢀtheꢀemittedꢀluminousꢀflux,ꢀIFꢀꢀisꢀelectricalꢀforwardꢀcurrentꢀandꢀVFꢀꢀisꢀtheꢀforwardꢀvoltage.
e
V
F
F
V
ꢃ
AlInGaP Red
1.±
5±
4±
3±
ꢀ±
1±
±
±.5
±
±
±.5
1.±
1.5
ꢀ.±
ꢀ.5
3.±
55±
6±±
65±
7±±
V
- FORWARD VOLTAGE - V
WAVELENGTH – nm
F
Figure 1. Relative intensity vs. wavelength
Figure 2. Forward current vs. forward voltage
ꢀ.5
ꢀ.±
1.5
1.±
±.5
±
60
50
40
30
20
10
0
±
1±
ꢀ±
3±
4±
5±
0
20
40
60
80
100
TA- AMBIENT TEMPERATURE - o
C
FORWARD CURRENT - mA
Figure 4. Relative luminous intensity vs. forward
current
Figure 3. Forward current vs. ambient temperature
InGaN Blue and Green
1.±±
35
3±
ꢀ5
ꢀ±
15
1±
5
35
30
25
20
15
10
5
±.8±
GREEN
BLUE
±.6±
±.4±
±.ꢀ±
±
0
±
35± 4±± 45±
5±± 55± 6±± 65±
0
20
40
60
80
100
±
1
ꢀ
3
4
WAVELENGTH - nm
T
A
– AMBIENT TEMPERATURE – °C
FORWARD VOLTAGE - V
Figure 7. Forward Current vs. Ambient Tempera-
ture.
Figure 5. Relative Intensity vs. Wavelength
Figure 6. Forward current vs. forward voltage.
�
1.6
1.4
1.ꢀ
1.±
±.8
±.6
±.4
±.ꢀ
±
1.±ꢀ±
1.±15
1.±1±
1.±±5
1.±±±
±.995
GREEN
BLUE
±
1±
ꢀ±
3±
±
5
1±
15
ꢀ±
ꢀ5
3±
FORWARD CURRENT, mA
DC FORWARD CURRENT - mA
Figure 8. Relative intensity vs. forward current
Figure 9.Relative dominant wavelength vs. DC forward current
1
±.5
±
-9±
-6±
-3±
±
3±
6±
9±
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Spatial radiation pattern for RGB – major axis
1
±.5
±
-9±
-6±
-3±
±
3±
6±
9±
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Spatial radiation pattern for RGB – minor axis
6
Intensity Bin Limit Table
Blue Color Bin Table
Intensityꢀ(mcd)ꢀatꢀꢁ0ꢀmA
Bin
Min Dom Max Dom Xmin
Ymin
Xmax
Ymax
ꢂin
Min
Max
1
ꢃ60.0
ꢃ6ꢃ.0
ꢃ68.0
ꢃꢄꢁ.0
ꢃꢄ6.0
ꢃ6ꢃ.0
ꢃ68.0
ꢃꢄꢁ.0
ꢃꢄ6.0
ꢃ80.0
0.1ꢃꢃ0
0.1818
0.13ꢄꢃ
0.1ꢄ66
0.1ꢁ91
0.1699
0.118ꢄ
0.1616
0.1063
0.1�1ꢄ
0.0ꢁ9ꢄ 0.1ꢄ66 0.0966
0.090ꢃ 0.13ꢄꢃ 0.03ꢄꢃ
0.03ꢄꢃ 0.1699 0.106ꢁ
0.0966 0.1ꢁ91 0.0ꢃ9�
0.0ꢃ9� 0.1616 0.1ꢁ09
0.106ꢁ 0.118ꢄ 0.06ꢄ1
0.06ꢄ1 0.1�1ꢄ 0.1ꢃꢁ3
0.1ꢁ09 0.1063 0.09ꢃ�
0.09ꢃ� 0.139ꢄ 0.1ꢄꢁ8
0.1ꢃꢁ3 0.0913 0.13ꢁꢄ
M
P
�ꢁ0
680
680
880
ꢁ
3
ꢃ
�
880
11�0
1�00
1900
ꢁ�00
3ꢁ00
ꢃꢁ00
��00
ꢄꢁ00
Q
R
11�0
1�00
1900
ꢁ�00
3ꢁ00
ꢃꢁ00
��00
S
T
U
V
W
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ 0.�ꢀnm
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ1�%
Green Color Bin Table
Bin
Min Dom Max Dom Xmin
Ymin
Xmax
Ymax
1
�ꢁ0.0
�ꢁꢃ.0
�ꢁ8.0
�3ꢁ.0
�36.0
�ꢁꢃ.0
�ꢁ8.0
�3ꢁ.0
�36.0
�ꢃ0.0
0.0ꢄꢃ3 0.8338 0.18�6 0.6��6
0.16�0 0.6�86 0.1060 0.8ꢁ9ꢁ
0.1060 0.8ꢁ9ꢁ 0.ꢁ068 0.6ꢃ63
0.18�6 0.6��6 0.138ꢄ 0.81ꢃ8
0.138ꢄ 0.81ꢃ8 0.ꢁꢁꢄ3 0.63ꢃꢃ
0.ꢁ068 0.6ꢃ63 0.1ꢄ0ꢁ 0.ꢄ96�
0.1ꢄ0ꢁ 0.ꢄ96� 0.ꢁꢃ69 0.6ꢁ13
0.ꢁꢁꢄ3 0.63ꢃꢃ 0.ꢁ003 0.ꢄꢄ6ꢃ
0.ꢁ003 0.ꢄꢄ6ꢃ 0.ꢁ6�9 0.60ꢄ0
0.ꢁꢃ69 0.6ꢁ13 0.ꢁꢁ96 0.ꢄ�ꢃ3
ꢁ
3
ꢃ
�
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ 0.�ꢀnm
Red Color Bin Table
Bin
Min Dom
Max Dom Xmin
Ymin
Xmax
Ymax
6ꢁꢁ
63ꢃ
0.690ꢃ 0.309ꢃ 0.69ꢃ� 0.ꢁ888
0.6ꢄꢁ6 0.3106 0.ꢄ13� 0.ꢁ86�
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.�ꢀnm
ꢄ
Avago Color Bin on CIE 1931 Chromaticity Diagram.
1.000
0.800
1
2
Green
3
4
5
0.600
0.400
Red
0.200
0.000
5
Blue
4
3
2
1
0.000
0.100
0.200
0.300
0.400
X
0.500
0.600
0.700
0.800
10
GREEN
1
RED
BLUE
0.1
-40
-20
0
20
40
60
80
100
120
TJ - JUNCTION TEMPERATURE - °C
8
ote:ꢀ
Precautions:
1.ꢀ PCꢂꢀ withꢀ differentꢀ sizeꢀ andꢀ designꢀ (componentꢀ density)ꢀ willꢀ haveꢀ
differentꢀheatꢀmassꢀ(heatꢀcapacity).ꢀThisꢀmightꢀcauseꢀaꢀchangeꢀinꢀtem-
peratureꢀexperiencedꢀbyꢀtheꢀboardꢀifꢀsameꢀwaveꢀsolderingꢀsettingꢀisꢀ
used.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀprofileꢀagainꢀ
beforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCꢂ.
Lead Forming:
•ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
ꢁ.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLEDꢀareꢀusingꢀhighꢀefficiencyꢀ
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀtakeꢀextraꢀprecautionꢀduringꢀwaveꢀsolderingꢀtoꢀensureꢀthatꢀtheꢀ
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀꢁ�0°Cꢀandꢀtheꢀsolderꢀ
contactꢀtimeꢀdoesꢀnotꢀexceedingꢀ3sec.ꢀOver-stressingꢀtheꢀLEDꢀduringꢀ
solderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLEDꢀdueꢀtoꢀ
delamination.
•ꢀ Forꢀbetterꢀcontrol,ꢀitꢀisꢀrecommendedꢀtoꢀuseꢀproperꢀtoolꢀ
toꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀlengthꢀ
ratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀaꢀ
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ
dueꢀtoꢀleadꢀcuttingꢀfromꢀtravelingꢀintoꢀLEDꢀpackage.ꢀ
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀoperation,ꢀ
asꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀsink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ CareꢀmustꢀbeꢀtakenꢀduringꢀPCꢂꢀassemblyꢀandꢀsolderingꢀ
processꢀtoꢀpreventꢀdamageꢀtoꢀtheꢀLEDꢀcomponent.ꢀ
•ꢀ LEDꢀcomponentꢀmayꢀbeꢀeffectivelyꢀhandꢀsolderedꢀtoꢀ
PCꢂ.ꢀHowever,ꢀitꢀisꢀonlyꢀrecommendedꢀunderꢀunavoid-
ableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀmanualꢀ
solderingꢀ distanceꢀ ofꢀ theꢀ solderingꢀ heatꢀ sourceꢀ (sol-
deringꢀiron’sꢀtip)ꢀtoꢀtheꢀbodyꢀisꢀ1.�9mm.ꢀSolderingꢀtheꢀ
LEDꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ1.�9mmꢀmightꢀ
damageꢀtheꢀLED.
CATHODE
ANODE
AlInGaP Device
InGaN Device
ꢀ
ote:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀalignmentꢀfixtureꢀthatꢀisꢀbeingꢀappliedꢀduringꢀwaveꢀ
solderingꢀshouldꢀbeꢀlooselyꢀfittedꢀandꢀshouldꢀnotꢀapplyꢀ
weightꢀorꢀforceꢀonꢀLED.ꢀonꢀmetalꢀmaterialꢀisꢀrecom-
mendedꢀasꢀitꢀwillꢀabsorbꢀlessꢀheatꢀduringꢀwaveꢀsolder-
ingꢀprocess.
1.�9mm
•ꢀ ESDꢀprecautionꢀmustꢀbeꢀproperlyꢀappliedꢀonꢀtheꢀsolder-
ingꢀstationꢀandꢀpersonnelꢀtoꢀpreventꢀESDꢀdamageꢀtoꢀtheꢀ
LEDꢀcomponentꢀthatꢀisꢀESDꢀsensitive.ꢀDoꢀreferꢀtoꢀAvagoꢀ
applicationꢀnoteꢀAꢀ11ꢃꢁꢀforꢀdetails.ꢀTheꢀsolderingꢀironꢀ
usedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀensureꢀelectrostaticꢀ
chargeꢀisꢀproperlyꢀgrounded.
•ꢀ Atꢀ elevatedꢀ temperature,ꢀ LEDꢀ isꢀ moreꢀ susceptibleꢀ toꢀ
mechanicalꢀstress.ꢀTherefore,ꢀPCꢂꢀmustꢀallowedꢀtoꢀcoolꢀ
downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ whichꢀ
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
•ꢀ IfꢀPCꢂꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ
thatꢀsurfaceꢀmountꢀcomponentsꢀbeꢀsolderedꢀonꢀtheꢀtopꢀ
sideꢀofꢀtheꢀPCꢂ.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀbot-
tomꢀside,ꢀtheseꢀcomponentsꢀshouldꢀbeꢀsolderedꢀusingꢀ
reflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.
•ꢀ Recommendedꢀsolderingꢀcondition:
Wave
Manual Solder
Dipping
Soldering [1, 2]
Pre-heat temperatꢃre
Preheat time
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
-
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
-
sizeꢀforꢀLEDꢀcomponentꢀleads.
Peak temperatꢃre
ꢆwell time
260 °C Max.
5 sec Max
LED component
lead size
Plated through
hole diameter
Diagonal
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
ote:ꢀ
1)ꢀ Aboveꢀconditionsꢀrefersꢀtoꢀmeasurementꢀwithꢀthermocoupleꢀmountedꢀ
atꢀtheꢀbottomꢀofꢀPCꢂ.
ꢁ)ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ
thermalꢀstressꢀexperiencedꢀbyꢀLED.
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
•ꢀ Waveꢀsolderingꢀparametersꢀmustꢀbeꢀsetꢀandꢀmaintainedꢀ
accordingꢀtoꢀtheꢀrecommendedꢀtemperatureꢀandꢀdwellꢀ
time.ꢀCustomerꢀisꢀadvisedꢀtoꢀperformꢀdailyꢀcheckꢀonꢀtheꢀ
solderingꢀprofileꢀtoꢀensureꢀthatꢀitꢀisꢀalwaysꢀconformingꢀ
toꢀrecommendedꢀsolderingꢀconditions.
•ꢀ Over-sizingꢀtheꢀPTHꢀcanꢀleadꢀtoꢀtwistedꢀLEDꢀafterꢀclinch-
ing.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀcauseꢀ
difficultyꢀinsertingꢀtheꢀTHꢀLED.
9
ReferꢀtoꢀapplicationꢀnoteꢀA�33ꢃꢀforꢀmoreꢀinformationꢀaboutꢀsolderingꢀandꢀhandlingꢀofꢀhighꢀbrightnessꢀTHꢀLEDꢀlamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
A
4.00 ± 0.20
(0.1575 ± 0.008)
12.70 ± 0.30
(0.50 ± 0.0118)
∅
TYP.
VIEW A–A
0.70 ± 0.20
(0.0276 ± 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: Theꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ–ZZꢀandꢀregardlessꢀofꢀstandoffꢀorꢀnon-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
+
A
AVAGO
TECHNOLOGIES
ANODE
–
CATHODE
ANODE LEAD LEAVES
THE BOX FIRST.
C
MOTHER LABEL
Note: ForꢀInGaꢀdevice,ꢀtheꢀammoꢀpackꢀpackagingꢀboxꢀcontainsꢀESDꢀlogo.
Packaging Label
(i)ꢀ AvagoꢀMotherꢀLabel:ꢀ(Availableꢀonꢀpackagingꢀboxꢀofꢀammoꢀpackꢀandꢀshippingꢀbox)
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN
(Q) QTY: Quantity
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID
BIN: Refer to below information
REV:
DeptID:
Made In: Country of Origin
11
(ii)ꢀAvagoꢀꢂabyꢀLabelꢀ(Onlyꢀavailableꢀonꢀbulkꢀpackaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
ꢂI:ꢀ
Example:
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀwithꢀcolorꢀbinsꢀbutꢀwithoutꢀ
VFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀcolorꢀbin)
ꢀ
ꢂI:ꢀꢁꢀ(representꢀcolorꢀbinꢀꢁꢀonly)
ꢀ
ꢂI:ꢀVꢂꢀ(representꢀVFꢀbinꢀ“Vꢂ”ꢀonly)
ORꢀꢀꢀꢀꢀꢀꢀꢀꢀ
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀꢂin
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀꢂin
ꢀ
ꢀ
ꢀ
ꢀ
ꢂI:ꢀꢁVꢂꢀꢀ
(Applicableꢀforꢀpartꢀnumberꢀthatꢀhaveꢀbothꢀcolorꢀbinꢀ
andꢀVFꢀbin)
ꢀ
ꢀ
Vꢂ:ꢀVFꢀbinꢀ“Vꢂ”
ꢁ:ꢀꢀColorꢀbinꢀꢁꢀonly
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS
PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For proꢀꢃct information anꢀ a complete list of ꢀistribꢃtors please go to oꢃr web site: www.avagotech.com
Avago Avago Technologies anꢀ the A logo are traꢀemarks of Avago Technologies Pte. in the Uniteꢀ States anꢀ other coꢃntries.
ꢆata sꢃbject to change. Copyright © 2006 Avago Technologies Pte. All rights reserveꢀ. Obsoletes AV01-0304ꢅN
AV02-0388ꢅN - Jꢃly 11 2007
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