HLMP-BL06-QRKDD [AVAGO]
5mm mini Oval Precision Optical Performance AlInGaP Lamps; 5毫米迷你椭圆形精密光学性能的AlInGaP灯
| 型号： | HLMP-BL06-QRKDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 5mm mini Oval Precision Optical Performance AlInGaP Lamps |
| 文件： | 总12页 (文件大小：379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-ADxx/AGxx/ALxx/BDxx/BGxx/BLxx
5mm mini Oval Precision Optical Performance
AlInGaP Lamps
Data Sheet
Description
Features
TheseꢀPrecisionꢀOpticalꢀPerformanceꢀOvalꢀLEDsꢀareꢀspe- •ꢀ Wellꢀdefinedꢀspatialꢀradiationꢀpattern
cificallyꢀdesignedꢀforꢀfullꢀcolor/videoꢀandꢀpassengerꢀinfor-
mationꢀsigns.ꢀTheꢀovalꢀshapedꢀradiationꢀpatternꢀ(35°ꢀxꢀ70°)ꢀ
•ꢀ Viewingꢀangles:ꢀꢀ
Majorꢀaxisꢀ70°ꢀ
andꢀ highꢀ luminousꢀ intensityꢀ ensureꢀ thatꢀ theseꢀ devicesꢀ
Minorꢀaxisꢀ35°
areꢀ excellentꢀforꢀ wideꢀ fieldꢀ ofꢀ viewꢀoutdoorꢀ applicationꢀ
•ꢀ Highꢀluminousꢀoutput
whereꢀaꢀwideꢀviewingꢀangleꢀandꢀreadabilityꢀinꢀsunlightꢀ
areꢀ essential.ꢀ Theseꢀ lampsꢀ haveꢀ veryꢀ smooth,ꢀ matchedꢀ •ꢀ RedꢀandꢀAmberꢀintensityꢀareꢀavailableꢀfor:ꢀ
radiationꢀpatternsꢀensuringꢀconsistentꢀcolorꢀmixingꢀinꢀfullꢀ
colorꢀapplications,ꢀmessageꢀuniformityꢀacrossꢀtheꢀviewingꢀ
angleꢀofꢀtheꢀsign.
AlInGaPꢀ(Bright)ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
ꢀAlInGaPꢀIIꢀ(Brightest)
•ꢀ Colors:ꢀ
626ꢀnmꢀredꢀ
Highꢀ efficiencyꢀ LEDꢀ materialꢀ isꢀ usedꢀ inꢀ theseꢀ lamps:ꢀ
AluminumꢀIndiumꢀGalliumꢀPhosphideꢀ(AlInGaP)ꢀforꢀamberꢀ
andꢀred.ꢀEachꢀlampꢀisꢀmadeꢀwithꢀanꢀadvanceꢀopticalꢀgradeꢀ
epoxyꢀ offeringꢀ superiorꢀ highꢀ temperatureꢀ andꢀ highꢀ
moistureꢀresistanceꢀinꢀoutdoorꢀapplications.ꢀTheꢀpackageꢀ
epoxyꢀcontainsꢀbothꢀꢀUV-AꢀandꢀUV-Bꢀinhibitorsꢀtoꢀreduceꢀ
theꢀeffectsꢀofꢀlongꢀtermꢀexposureꢀtoꢀdirectꢀsunlight.
630ꢀnmꢀredꢀ
590ꢀnmꢀamberꢀ
592ꢀnmꢀamber
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture
•ꢀ UVꢀresistantꢀepoxy
Applications
Designersꢀcanꢀselectꢀparallelꢀorꢀperpendicularꢀorientation.ꢀ
Bothꢀlampsꢀareꢀavailableꢀinꢀtintedꢀversion.
•ꢀ Fullꢀcolor/videoꢀsigns
Benefits
•ꢀ Viewingꢀ angleꢀ designedꢀ forꢀ wideꢀ fieldꢀ ofꢀ viewꢀ
application
•ꢀ Superiorꢀperformanceꢀinꢀoutdoorꢀenvironments
Table 1. Device Selection Guide for AlInGaP II
Luminous
Color and Dominant Intensity
Luminous
Intensity
Iv (mcd)
Wavelength
ld (nm) Typ.
Iv (mcd)
at 20 mA Min.
Leadframe
Orientation
Package
Drawing
Part Number
at 20 mA Max.
Stand-Off
No
HLMP-AD06-NSTxx
HLMP-AD06-P00xx
HLMP-AD06-P0Txx
HLMP-AD06-PQ0xx
HLMP-AD06-RSTxx
HLMP-AD06-STTxx
HLMP-AD16-P00xx
HLMP-AD16-QTTxx
HLMP-AD16-RS0xx
HLMP-AD16-RSTxx
HLMP-AD16-RUTxx
HLMP-AD16-ST0xx
HLMP-AD16-STTxx
HLMP-AL16-RSRxx
HLMP-AL16-RSKxx
HLMP-BD06-L00xx
HLMP-BD06-P00xx
HLMP-BD06-RS0xx
HLMP-BD06-RSTxx
HLMP-BD06-STTxx
HLMP-BD16-NP0xx
HLMP-BD16-QRTxx
HLMP-BD16-RU0xx
HLMP-BD16-RUTxx
HLMP-BD16-ST0xx
HLMP-BD16-STTxx
HLMP-BL06-N00xx
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Amberꢀ592
Amberꢀ592
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Redꢀ630
Amberꢀ592
680
2500
Parallel
A
A
A
A
A
A
B
B
B
B
B
B
B
B
B
C
C
C
C
C
D
D
D
D
D
D
C
880
No
Parallel
880
No
Parallel
880
1500
2500
3200
No
Parallel
1500
1900
880
No
Parallel
No
Parallel
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Parallel
1150
1500
1500
1500
1900
1900
1500
1500
400
3200
2500
2500
4200
3200
3200
2500
2500
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Parallel
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
880
No
1500
1500
1900
680
2500
2500
3200
1150
1900
4200
4200
3200
3200
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
No
1150
1500
1500
1900
1900
680
2
Table 2. Device Selection Guide for AlInGaP
Luminous
Color and Dominant Intensity
Luminous
Intensity
Iv (mcd)
Wavelength
ld (nm) Typ.
Iv (mcd)
at 20 mA Min.
Leadframe
Orientation
Package
Drawing
Part Number
at 20 mA Max.
Stand-Off
No
HLMP-AG01-K00xx
HLMP-AL01-L00xx
HLMP-AL01-LP0xx
HLMP-AL01-N00xx
HLMP-AL01-NR0xx
HLMP-AL01-PQKxx
HLMP-AL11-NR0xx
HLMP-BG01-LM0xx
HLMP-BG01-MN0xx
HLMP-BL01-NR0xx
HLMP-BL11-KN0xx
HLMP-BL11-NR0xx
Redꢀ626
310
400
400
680
680
880
880
400
520
680
310
680
Parallel
A
A
A
A
A
A
B
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Redꢀ626
No
Parallel
1150
No
Parallel
No
Parallel
1900
1150
1900
520
No
Parallel
No
Parallel
Yes
No
Parallel
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
C
C
C
D
D
Redꢀ626
680
No
Redꢀ626
1900
880
No
Redꢀ626
Yes
Yes
Redꢀ626
1900
3
Part Numbering System
HLMPꢀ-ꢀXꢀXꢀXꢀXꢀ-ꢀXꢀXꢀXꢀ XX
Mechanical Options
00:ꢀBulkꢀPackaging
DD:ꢀAmmoꢀPack
YY:ꢀFlexi-Bin;ꢀBulkꢀPackaging
ZZ:ꢀFlexi-Bin;ꢀAmmoꢀPack
Color Bin
0:ꢀNoꢀColorꢀBinꢀLimitation
B:ꢀColorꢀbinꢀ2ꢀandꢀ3ꢀonly
K:ꢀColorꢀbinsꢀ2ꢀandꢀ4ꢀonly
R:ꢀColorꢀBinsꢀ1,ꢀ2,ꢀ4,ꢀandꢀ6ꢀwithꢀVFꢀmaxꢀofꢀ2.6ꢀV
S:ꢀColorꢀbinsꢀ2ꢀandꢀ4ꢀwithꢀVFꢀmaxꢀofꢀ2.6ꢀV
T:ꢀRedꢀColorꢀwithꢀV ꢀmaxꢀofꢀ2.6ꢀV
F
Maximum Intensity Bin
0:ꢀNoꢀIvꢀBinꢀLimitation
Minimum Intensity Bin
Tint Option
1ꢀorꢀ6:ꢀMatchingꢀColorꢀTints
Standoff Option
0:ꢀWithout
1:ꢀWith
Color
D:ꢀ630ꢀnmꢀRed
G:ꢀ626ꢀnmꢀRed
L:ꢀ590ꢀorꢀ592ꢀnmꢀAmber
Package
A:ꢀ5ꢀmmꢀMiniꢀOval,ꢀParallel
B:ꢀ5ꢀmmꢀMiniꢀOval,ꢀPerpendicular
Note:ꢀPleaseꢀreferꢀtoꢀABꢀ5337ꢀforꢀcompleteꢀinformationꢀonꢀpartꢀnumberingꢀsystem.
4
Package Dimensions
ꢁ.71 0.ꢀ0
(0.343 0.00ꢁ8
0.50 0.10
(0.0ꢀ0 0.0048
SQ. TYP.
ꢀ.54 0.3ꢁ
(0.100 0.0158
5.00 0.ꢀ0
(0.197 0.00ꢁ8
0.70 (0.0ꢀꢁ8
MAX.
A
1.00
(0.0398
CATHODE
MIN.
LEAD
31.60
MIN.
(1.ꢀ448
1.50 0.15
(0.059 0.0068
ꢁ.71 0.ꢀ0
(0.343 0.00ꢁ8
0.50 0.10
(0.0ꢀ0 0.0048
SQ. TYP.
ꢀ.54 0.3ꢁ
(0.100 0.0158
5.00 0.ꢀ0
(0.197 0.00ꢁ8
0.70 (0.0ꢀꢁ8
MAX.
B
+ 0.13
11.70
1.00
(0.0398
CATHODE
LEAD
– 0.0ꢁ
MIN.
+ 0.005
– 0.003
0.461
(
)
31.60
MIN.
(1.ꢀ448
ꢁ.71 0.ꢀ0
(0.343 0.00ꢁ8
0.50 0.10
(0.0ꢀ0 0.0048
SQ. TYP.
ꢀ.54 0.3ꢁ
(0.100 0.0158
5.00 0.ꢀ0
(0.197 0.00ꢁ8
0.70 (0.0ꢀꢁ8
MAX.
C
1.00
(0.0398
CATHODE
LEAD
MIN.
31.60
MIN.
(1.ꢀ448
1.50 0.15
(0.059 0.0068
ꢁ.71 0.ꢀ0
(0.343 0.00ꢁ8
0.50 0.10
(0.0ꢀ0 0.0048
SQ. TYP.
ꢀ.54 0.3ꢁ
(0.100 0.0158
5.00 0.ꢀ0
(0.197 0.00ꢁ8
0.70 (0.0ꢀꢁ8
MAX.
D
1.00
CATHODE
LEAD
MIN.
(0.0398
31.60
MIN.
(1.ꢀ448
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY
MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).
– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.
5
Absolute Maximum Ratings at T = 25˚C
A
Parameter
DCꢀForwardꢀCurrent[1]
Red and Amber
50ꢀmA
ꢀ
PeakꢀPulsedꢀForwardꢀCurrent[2]
AverageꢀForwardꢀCurrentꢀ
ReverseꢀVoltageꢀ(IRꢀ=ꢀ100ꢀµA)ꢀ
PowerꢀDissipationꢀ
ꢀ
100ꢀmA
30ꢀmA
5ꢀV
120ꢀmW
LEDꢀJunctionꢀTemperatureꢀ
OperatingꢀTemperatureꢀRangeꢀ
StorageꢀTemperatureꢀRangeꢀ
Notes:ꢀꢀ
130°C
–40°Cꢀtoꢀ+100°C
–40°Cꢀtoꢀ+100°C
1.ꢀ Derateꢀlinearlyꢀasꢀshownꢀinꢀfigureꢀ4.ꢀꢀꢀ
2.ꢀ DutyꢀFactorꢀ30%,ꢀFrequencyꢀ1kHz.
Electrical/Optical Characteristics at T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
TypicalꢀViewingꢀAngleꢀ
ꢀ
ꢀ
Majorꢀ
Minorꢀ
2q1/2ꢀ
ꢀ
ꢀ
ꢀ
70ꢀ
35
ꢀ
degꢀ
ForwardꢀVoltageꢀ
VFꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Redꢀ(ldꢀ=ꢀ626ꢀnm)ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
2.0ꢀ
ꢀ
2.2ꢀ
2.3ꢀ
2.0ꢀ
ꢀ
2.4ꢀ
ꢀ
2.4ꢀ
2.6ꢀ
2.4ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
ꢀ ꢀ
ꢀ ꢀ
ꢀ ꢀ
ꢀ ꢀ
ꢀ ꢀ
ꢀ ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Optionꢀxx0xxꢀ
OptionꢀxxTxxꢀ
Amberꢀ(ldꢀ=ꢀ590ꢀnm)ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
ꢀ
ꢀ
Optionꢀxx0xxꢀ
2.2ꢀ
2.3ꢀ
2.4ꢀ
2.6
OptionꢀxxRxx,ꢀxxSxxꢀ
ReverseꢀVoltageꢀ
Amber,ꢀRedꢀ
ꢀ
ꢀ
5ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
ꢀ
ꢀ
VRꢀ
20ꢀ
IRꢀ=ꢀ100ꢀµA
PeakꢀWavelengthꢀ
ꢀ
l
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
PeakꢀofꢀWavelengthꢀofꢀ
SpectralꢀDistributionꢀ
atꢀIFꢀ=ꢀ20ꢀmA
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
peakꢀ
594ꢀ
639ꢀ
nmꢀ
ꢀ
SpectralꢀHalfwidthꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
WavelengthꢀWidthꢀatꢀ
SpectralꢀDistributionꢀ1/2ꢀ
PowerꢀPointꢀatꢀꢀIFꢀ=ꢀ20ꢀmA
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
∆l1/2ꢀ
ꢀ
17ꢀ
17ꢀ
nmꢀ
ꢀ
Capacitanceꢀ
Amber,ꢀRedꢀ
ꢀ
Cꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
VFꢀ=ꢀ0,ꢀFꢀ=ꢀ1ꢀMHzꢀ
ꢀ
40ꢀ
pF
LuminousꢀEfficacyꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
EmittedꢀLuminousꢀ
Power/EmittedꢀRadiantꢀ
PowerꢀatꢀIFꢀ=ꢀ20ꢀmA
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
hvꢀ
ꢀ
500ꢀ
155ꢀ
lm/Wꢀ
ꢀ
ThermalꢀResistanceꢀ
RQJ-PINꢀ
ꢀ
ꢀ
ꢀ
240ꢀ
ꢀ
ꢀ
ꢀ
°C/Wꢀ
ꢀ
LEDꢀJunction-to-ꢀ
CathodeꢀLead
ꢀ
ꢀ
ꢀ
Notes:
1.ꢀ 2q ꢀisꢀtheꢀoff-axisꢀangleꢀwhereꢀtheꢀluminousꢀintensityꢀisꢀ1/2ꢀtheꢀon-axisꢀintensity.
1/2
2.ꢀ Theꢀradiantꢀintensity,ꢀI ꢀinꢀwattsꢀperꢀsteradian,ꢀmayꢀbeꢀfoundꢀfromꢀtheꢀequationꢀI ꢀ=ꢀI /h ꢀwhereꢀI ꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelasꢀandꢀh ꢀisꢀ
e
e
v
v
v
v
ꢀtheꢀluminousꢀefficacyꢀinꢀlumens/watt.
3.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
4.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
5.ꢀ Theꢀdominantꢀwavelength,ꢀl ,ꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
6.ꢀ ForꢀOptionsꢀ-xxRxx,ꢀ-xxSxxꢀandꢀ-xxTxx,ꢀmax.ꢀforwardꢀvoltageꢀ(Vf)ꢀisꢀ2.6ꢀV.ꢀReferꢀtoꢀVfꢀbinꢀtable.
6
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
AMBER
RED
0
500
550
600
650
700
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength.
70
50
40
30
60
RED
50
40
AMBER
30
ꢀ0
10
0
ꢀ0
10
0
AMBER
RED
1.0
1.5
ꢀ.0
ꢀ.5
3.0
0
0.5
1.0
1.5
ꢀ.0
ꢀ.5
3.0
V
– FORWARD VOLTAGE – V
FORWARD VOLTAGE – V
F
Figure 2a. Amber, red forward current vs.
forward voltage.
Figure 2b. Forward current vs. forward voltage
for option -xxTxx red, and option
-xxRxx and -xxSxx amber.
ꢀ.5
50
40
ꢀ.0
RED
Rθ = 5ꢁ5° C/W
JA
1.5
30
ꢀ0
AMBER
Rθ = 7ꢁ0° C/W
JA
1.0
0.5
0
10
0
0
ꢀ0
40
60
ꢁ0
100
0
10
ꢀ0
30
40
50
T
– AMBIENT TEMPERATURE – °C
FORWARD CURRENT – mA
A
Figure 3. Amber, red relative luminous intensity
vs. forward current.
Figure 4. Amber, red maximum forward current
vs. ambient temperature.
7
100
90
ꢁ0
70
60
50
40
30
ꢀ0
100
90
ꢁ0
70
60
50
40
30
ꢀ0
10
0
10
0
50
40
30
ꢀ0
10
0
-10
-ꢀ0
-30
-40
-50
50
40
30
ꢀ0
10
0
-10
-ꢀ0
-30
-40
-50
VERTICAL ANGULAR DISPLACEMENT – DEGREES
HORIZONTAL ANGULAR DISPLACEMENT – DEGREES
Figure 5. Spatial radiation pattern – 35 x 70 degree lamps.
[2,3]
Intensity Bin Limits (mcd at 20 mA)
Vf Bin Table
Bin Name
Kꢀ
Lꢀ
Min.
310ꢀ
Max.
400
Bin Id
VAꢀ
Min.
2.0ꢀ
2.2ꢀ
2.4ꢀ
Max.
2.2
400ꢀ
520
VBꢀ
2.4
Mꢀ
Nꢀ
Pꢀ
Qꢀ
Rꢀ
Sꢀ
520ꢀ
680
VCꢀ
2.6
Notes:
680ꢀ
880
1.ꢀ Allꢀ binꢀ categoriesꢀ areꢀ establishedꢀ forꢀ classificationꢀ ofꢀ products.ꢀ
Productsꢀmayꢀnotꢀbeꢀavailableꢀinꢀallꢀbinꢀcategories.ꢀPleaseꢀcontactꢀ
yourꢀAvagoꢀrepresentativeꢀforꢀfurtherꢀinformation.
2.ꢀ Vfꢀbinꢀtableꢀonlyꢀavailableꢀforꢀthoseꢀnumbersꢀwithꢀoptionsꢀ-xxRxx,ꢀ
-xxSxx,ꢀ-xxTxx.
880ꢀ
1150
1500
1900
2500
3200
4200
1150ꢀ
1500ꢀ
1900ꢀ
2500ꢀ
3200ꢀ
3.ꢀ Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.05V
Tꢀ
Uꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ 15%.
Amber Color Bin Limits (nm at 20 mA)
Bin Name
Min.
Max.
1ꢀ
2ꢀ
4ꢀ
6ꢀ
584.5ꢀ
587.0ꢀ
589.5ꢀ
592.0ꢀ
587.0
589.5
592.0
594.5
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
8
Note:ꢀ
Precautions:
Lead Forming:
1.ꢀ PCBꢀ withꢀ differentꢀ sizeꢀ andꢀ designꢀ (componentꢀ density)ꢀ willꢀ haveꢀ
differentꢀ heatꢀ massꢀ (heatꢀ capacity).ꢀThisꢀ mightꢀ causeꢀ aꢀ changeꢀ inꢀ
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ
settingꢀisꢀused.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.
•ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
2.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLEDꢀareꢀusingꢀhighꢀefficiencyꢀ
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀtakeꢀextraꢀprecautionꢀduringꢀwaveꢀsolderingꢀtoꢀensureꢀthatꢀtheꢀ
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀsolderꢀ
contactꢀtimeꢀdoesꢀnotꢀexceedingꢀ3sec.ꢀOver-stressingꢀtheꢀLEDꢀduringꢀ
solderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLEDꢀdueꢀtoꢀ
delamination.
•ꢀ Forꢀ betterꢀ control,ꢀ itꢀ isꢀ recommendedꢀ toꢀ useꢀ properꢀ
toolꢀtoꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀ
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀaꢀ
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ
dueꢀtoꢀleadꢀcuttingꢀfromꢀtravelingꢀintoꢀLEDꢀpackage.ꢀ
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀoperation,ꢀ
asꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀsink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ CareꢀmustꢀbeꢀtakenꢀduringꢀPCBꢀassemblyꢀandꢀsolderingꢀ
processꢀtoꢀpreventꢀdamageꢀtoꢀtheꢀLEDꢀcomponent.ꢀ
•ꢀ LEDꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ
toꢀ PCB.ꢀ However,ꢀ itꢀ isꢀ onlyꢀ recommendedꢀ underꢀ
unavoidableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀ
manualꢀsolderingꢀdistanceꢀofꢀtheꢀsolderingꢀheatꢀsourceꢀ
(solderingꢀiron’sꢀtip)ꢀtoꢀtheꢀbodyꢀisꢀ1.59mm.ꢀSolderingꢀ
theꢀLEDꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ1.59mmꢀ
mightꢀdamageꢀtheꢀLED.
CATHODE
ꢀ
Note:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ
waveꢀ solderingꢀ shouldꢀ beꢀ looselyꢀ fittedꢀ andꢀ shouldꢀ
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLED.ꢀNonꢀmetalꢀmaterialꢀ
isꢀrecommendedꢀasꢀitꢀwillꢀabsorbꢀlessꢀheatꢀduringꢀwaveꢀ
solderingꢀprocess.
1.59mm
•ꢀ Atꢀ elevatedꢀ temperature,ꢀ LEDꢀ isꢀ moreꢀ susceptibleꢀ toꢀ
mechanicalꢀstress.ꢀTherefore,ꢀPCBꢀmustꢀallowedꢀtoꢀcoolꢀ
downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ whichꢀ
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
•ꢀ ESDꢀ precautionꢀ mustꢀ beꢀ properlyꢀ appliedꢀ onꢀ theꢀ
solderingꢀ stationꢀ andꢀ personnelꢀ toꢀ preventꢀ ESDꢀ
damageꢀtoꢀtheꢀLEDꢀcomponentꢀthatꢀisꢀESDꢀsensitive.ꢀ
DoꢀreferꢀtoꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀ
Theꢀsolderingꢀironꢀusedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀ
ensureꢀelectrostaticꢀchargeꢀisꢀproperlyꢀgrounded.
•ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ
thatꢀ surfaceꢀ mountꢀ componentsꢀ beꢀ solderedꢀ onꢀ theꢀ
topꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀ
bottomꢀ side,ꢀ theseꢀ componentsꢀ shouldꢀ beꢀ solderedꢀ
usingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.
•ꢀ Recommendedꢀsolderingꢀcondition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
Pre-heatꢀtemperature
Preheatꢀtime
105ꢀ°CꢀMax.
60ꢀsecꢀMax
250ꢀ°CꢀMax.
3ꢀsecꢀMax.
-
sizeꢀforꢀLEDꢀcomponentꢀleads.
-
LED component
lead size
Plated through
hole diameter
Peakꢀtemperature
Dwellꢀtime
260ꢀ°CꢀMax.
5ꢀsecꢀMax
Diagonal
0.45ꢀxꢀ0.45ꢀmm
(0.018xꢀ0.018ꢀinch) (0.025ꢀinch) (0.039ꢀtoꢀ0.043ꢀinch)
0.636ꢀmm
0.98ꢀtoꢀ1.08ꢀmm
Note:ꢀ
1)ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.
2)ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ
thermalꢀstressꢀexperiencedꢀbyꢀLED.
0.50ꢀxꢀ0.50ꢀmm 0.707ꢀmm 1.05ꢀtoꢀ1.15ꢀmm
(0.020xꢀ0.020ꢀinch) (0.028ꢀinch) (0.041ꢀtoꢀ0.045ꢀinch)
•ꢀ Waveꢀsolderingꢀparametersꢀmustꢀbeꢀsetꢀandꢀmaintainedꢀ
accordingꢀtoꢀtheꢀrecommendedꢀtemperatureꢀandꢀdwellꢀ
time.ꢀCustomerꢀisꢀadvisedꢀtoꢀperformꢀdailyꢀcheckꢀonꢀtheꢀ
solderingꢀprofileꢀtoꢀensureꢀthatꢀitꢀisꢀalwaysꢀconformingꢀ
toꢀrecommendedꢀsolderingꢀconditions.
•ꢀ Over-sizingꢀ theꢀ PTHꢀ canꢀ leadꢀ toꢀ twistedꢀ LEDꢀ afterꢀ
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀ
causeꢀdifficultyꢀinsertingꢀtheꢀTHꢀLED.
9
ReferꢀtoꢀapplicationꢀnoteꢀAN5334ꢀforꢀmoreꢀinformationꢀaboutꢀsolderingꢀandꢀhandlingꢀofꢀhighꢀbrightnessꢀTHꢀLEDꢀlamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
Note: Theꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ–ZZꢀandꢀregardlessꢀofꢀstandoffꢀorꢀnon-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
O
O
S
+
N
G
L
E
I
A
O
A
E
V
N
G
D
O
A
H
A
E
D
O
H
–
T
C
A
C
E
T
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
C
O
M
Note: ForꢀInGaNꢀdevice,ꢀtheꢀammoꢀpackꢀpackagingꢀboxꢀcontainsꢀESDꢀlogo.
Packaging Label
(i)ꢀ AvagoꢀMotherꢀLabel:ꢀ(Availableꢀonꢀpackagingꢀboxꢀofꢀammoꢀpackꢀandꢀshippingꢀbox)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
11
(ii)ꢀAvagoꢀBabyꢀLabelꢀ(Onlyꢀavailableꢀonꢀbulkꢀpackaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢀ
Example:
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
ꢀ
ꢀ
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)
ꢀ
(Applicableꢀ forꢀ partꢀ numberꢀ withꢀ colorꢀ binsꢀ butꢀ
withoutꢀVFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀ
colorꢀbin)
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin
ORꢀꢀꢀꢀꢀꢀꢀꢀꢀ
ꢀ
ꢀ
ꢀ
BIN:ꢀ2VBꢀꢀ
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin
ꢀ
ꢀ
VB:ꢀVFꢀbinꢀ“VB”
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀthatꢀhaveꢀbothꢀcolorꢀbinꢀ
andꢀVFꢀbin)
2:ꢀꢀColorꢀbinꢀ2ꢀonly
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF
A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL
RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-1903EN
AV02-1542EN - September 16, 2008
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