HLMP-CB36-RSBDD [AVAGO]

T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps; T- 13/4 ( 5毫米)的超明亮的精密光学性能的InGaN LED灯
HLMP-CB36-RSBDD
型号: HLMP-CB36-RSBDD
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps
T- 13/4 ( 5毫米)的超明亮的精密光学性能的InGaN LED灯

光电
文件: 总11页 (文件大小:237K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HLMP-Cxxx  
T-13/4 (5 mm) Extra Bright Precision Optical  
Performance InGaN LED Lamps  
Data Sheet  
HLMP-CB11, HLMP-CB12, HLMP-CM11,  
HLMP-CM12, HLMP-CE11, HLMP-CE12,  
HLMP-CB26, HLMP-CB27, HLMP-CM26,  
HLMP-CM27, HLMP-CE26, HLMP-CE27,  
HLMP-CB36, HLMP-CB37, HLMP-CM36,  
HLMP-CM37, HLMP-CE36, HLMP-CE37  
Description  
Features  
These high intensity blue, green, and cyan LEDs are  
based on the most efficient and cost effective InGaN  
material technology. The 470 nm typical dominant  
wavelength for blue and 525 nm typical wavelength for  
green is well suited to color mixing in full color signs.  
The 505 nm typical dominant wavelength for cyan is  
suitable for traffic signal application.  
Well defined spatial radiation pattern  
• High luminous output  
• Available in blue, green, and cyan color  
• Viewing angle: 15°, 23° and 30°  
• Standoff or non-standoff leads  
• Superior resistance to moisture  
These LED lamps are untinted, non-diffused, T-13/4  
packages incorporating second generation optics which  
producewell-definedspatialradiationpatternsatspecific  
viewing cone angles.  
Applications  
Traffic signals  
• Commercial outdoor advertising  
• Front panel backlighting  
• Front panel indicator  
These lamps are made with an advanced optical grade  
epoxy, offering superior temperature and moisture  
resistance in outdoor signal and sign applications. The  
high maximum LED junction temperature limit of +110°C  
enables high temperature operation in bright sunlight  
conditions.  
CAUTION: Devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and  
processing. Refer to Application Note AN-1142 for additional details.  
Package Dimensions  
Package A  
2.35ꢀ(0.093)  
MAX.  
5.80ꢀ±ꢀ0.20  
(0.228ꢀ±ꢀ0.008)  
1.14ꢀ±ꢀ0.20  
(0.045ꢀ±ꢀ0.008)  
0.70ꢀ(0.028)  
MAX.  
4.90ꢀ±ꢀ0.20  
(0.193ꢀ±ꢀ0.008)  
2.54ꢀ±ꢀ0.38  
(0.100ꢀ±ꢀ0.015)  
ꢀCATHODE  
LEAD  
8.61ꢀ±ꢀ0.20  
(0.339ꢀ±ꢀ0.008)  
ꢀCATHODE  
FLAT  
31.60  
(1.244)  
MIN.  
Package B  
5.80ꢀ±ꢀ0.20  
(0.228ꢀ±ꢀ0.008)  
1.14ꢀ±ꢀ0.20  
(0.045ꢀ±ꢀ0.008)  
1.50ꢀ±ꢀ0.15  
(0.059ꢀ±ꢀ0.006)  
0.50ꢀ±ꢀ0.10  
(0.020ꢀ±ꢀ0.004)  
SQ.ꢀTYP.  
0.70ꢀ(0.028)  
MAX.  
4.90ꢀ±ꢀ0.20  
(0.192ꢀ±ꢀ0.008)  
2.54ꢀ±ꢀ0.38  
(0.100ꢀ±ꢀ0.015)  
NOTEꢀ1  
ꢀCATHODE  
LEAD  
8.61ꢀ±ꢀ0.20  
(0.339ꢀ±ꢀ0.008)  
ꢀCATHODE  
FLAT  
1.00  
(0.039)  
MIN.  
DIMENSIONꢀH  
31.60  
(1.244)  
MIN.  
DIMENSIONꢀH:  
15°ꢀ=ꢀ10.80ꢀ±ꢀ0.25ꢀmmꢀ(0.425ꢀ±ꢀ0.01ꢀINCH)  
23°ꢀ=ꢀ10.00ꢀ±ꢀ0.25ꢀmmꢀ(0.394ꢀ±ꢀ0.01ꢀINCH)  
30°ꢀ=ꢀ11.27ꢀ±ꢀ0.25ꢀmmꢀ(0.444ꢀ±ꢀ0.01ꢀINCH)  
NOTES:  
1.ꢀMEASUREDꢀJUSTꢀABOVEꢀFLANGE.  
2.ꢀALLꢀDIMENSIONSꢀAREꢀINꢀMILLIMETERSꢀ(INCHES).  
3.ꢀEPOXYꢀMENISCUSꢀMAYꢀEXTENDꢀABOUTꢀ1ꢀmmꢀ(0.040")ꢀDOWNꢀTHEꢀLEADS.  
4.ꢀIFꢀHEATꢀSINKINGꢀAPPLICATIONꢀISꢀREQUIRED,ꢀTHEꢀTERMINALꢀFORꢀHEATꢀSINKꢀISꢀANODE.  
Device Selection Guide  
Typicalꢀ  
Intensityꢀ(cd)ꢀatꢀ20ꢀmA  
ViewingꢀAngle,ꢀ  
Packageꢀ  
PartꢀNumberꢀ  
Colorꢀ  
Blueꢂ  
Blueꢂ  
Blueꢂ  
Greenꢂ  
Greenꢂ  
Greenꢂ  
Cyanꢂ  
Cyanꢂ  
Blueꢂ  
Blueꢂ  
Blueꢂ  
Greenꢂ  
Greenꢂ  
Greenꢂ  
Cyanꢂ  
Cyanꢂ  
Blueꢂ  
Blueꢂ  
Blueꢂ  
Blueꢂ  
Greenꢂ  
Greenꢂ  
Greenꢂ  
Greenꢂ  
Greenꢂ  
Cyanꢂ  
Cyanꢂ  
2q1/2ꢀꢀ(Degree)ꢀ Min.ꢀ  
Max.ꢀ  
7.ꢀꢂ  
Standoffꢀ  
Noꢂ  
Dimensionꢀ Lens  
HLMP-CB11-TW0xxꢂ  
HLMP-CB11-UVBxxꢂ  
HLMP-CB1ꢀ-TW0xxꢂ  
HLMP-CM11-Yꢀ0xxꢂ  
HLMP-CM11-Z1Cxxꢂ  
HLMP-CM1ꢀ-Yꢀ0xxꢂ  
HLMP-CE11-X10xxꢂ  
HLMP-CE1ꢀ-X10xxꢂ  
HLMP-CBꢀ6-SV0xxꢂ  
HLMP-CBꢀ6-TUDxxꢂ  
HLMP-CBꢀ7-SV0xxꢂ  
HLMP-CMꢀ6-X10xxꢂ  
HLMP-CMꢀ6-YZCxxꢂ  
HLMP-CMꢀ7-X10xxꢂ  
HLMP-CEꢀ6-WZ0xxꢂ  
HLMP-CEꢀ7-WZ0xxꢂ  
HLMP-CBꢁ6-QT0xxꢂ  
HLMP-CBꢁ6-RSBxxꢂ  
HLMP-CBꢁ7-RU0xxꢂ  
HLMP-CBꢁ7-RSDxxꢂ  
HLMP-CMꢁ6-X10xxꢂ  
HLMP-CMꢁ6-XYCxxꢂ  
HLMP-CMꢁ7-X10xxꢂ  
HLMP-CMꢁ7-XYCxxꢂ  
HLMP-CMꢁ7-XYDxxꢂ  
HLMP-CEꢁ6-WZ0xxꢂ  
HLMP-CEꢁ7-WZ0xxꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
15ꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢀꢁꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢁ0ꢂ  
ꢀ.5ꢂ  
ꢁ.ꢀꢂ  
ꢀ.5ꢂ  
9.ꢁꢂ  
1ꢀ.0ꢂ  
9.ꢁꢂ  
7.ꢀꢂ  
7.ꢀꢂ  
1.9ꢂ  
ꢀ.5ꢂ  
1.9ꢂ  
7.ꢀꢂ  
9.ꢁꢂ  
7.ꢀꢂ  
5.5ꢂ  
5.5ꢂ  
1.15ꢂ  
1.5ꢂ  
1.5ꢂ  
1.5ꢂ  
7.ꢀꢂ  
7.ꢀꢂ  
7.ꢀꢂ  
7.ꢀꢂ  
7.ꢀꢂ  
5.5ꢂ  
5.5ꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Bꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Bꢂ  
Aꢂ  
Aꢂ  
Bꢂ  
Bꢂ  
Bꢂ  
Aꢂ  
Bꢂ  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
Clear  
5.5ꢂ  
Noꢂ  
7.ꢀꢂ  
Yesꢂꢂ  
Noꢂ  
ꢀ7.0ꢂ  
ꢀ1.0ꢂ  
ꢀ7.0ꢂ  
ꢀ1.0ꢂ  
ꢀ1.0ꢂ  
5.5ꢂ  
Noꢂ  
Yesꢂꢂ  
Noꢂ  
Yesꢂꢂ  
Noꢂ  
4.ꢀꢂ  
Noꢂ  
5.5ꢂ  
Yesꢂꢂ  
Noꢂ  
ꢀ1.0ꢂ  
16.0ꢂ  
ꢀ1.0ꢂ  
16.0ꢂ  
16.0ꢂ  
ꢁ.ꢀꢂ  
Noꢂ  
Yesꢂꢂ  
Noꢂ  
Yesꢂꢂ  
Noꢂ  
ꢀ.5ꢂ  
Noꢂ  
4.ꢀꢂ  
Yesꢂꢂ  
Yesꢂ  
Noꢂ  
ꢀ.5ꢂ  
ꢀ1.0ꢂ  
1ꢀ.0ꢂ  
ꢀ1.0ꢂ  
1ꢀ.0ꢂ  
1ꢀ.0ꢂ  
16.0ꢂ  
16.0ꢂ  
Noꢂ  
Yesꢂꢂ  
Yesꢂ  
Yesꢂ  
Noꢂ  
Yesꢂ  
Notes:  
1.ꢂ Toleranceꢂforꢂluminousꢂintensityꢂmeasurementꢂisꢂ 15ꢃ.  
ꢀ.ꢂ Theꢂluminousꢂintensityꢂisꢂmeasuredꢂonꢂtheꢂmechanicalꢂaxisꢂofꢂtheꢂlampꢂpackage.  
ꢁ.ꢂ Theꢂopticalꢂaxisꢂisꢂcloselyꢂalignedꢂwithꢂtheꢂpackageꢂmechanicalꢂaxis.  
4.ꢂ LEDꢂlightꢂoutputꢂisꢂbrightꢂenoughꢂtoꢂcauseꢂinjuriesꢂtoꢂtheꢂeyes.ꢂPrecautionsꢂmustꢂbeꢂtakenꢂtoꢂpreventꢂlookingꢂdirectlyꢂatꢂtheꢂLEDꢂwithoutꢂproperꢂsafetyꢂ  
equipment.  
5.ꢂ ꢂꢀq1/ꢀꢂisꢂtheꢂoff-axisꢂangleꢂwhereꢂtheꢂluminousꢂintensityꢂisꢂ1/ꢀꢂtheon-axisꢂintensity.  
Part Numbering System  
HLMPꢀ -ꢀ ꢀxꢀ xꢀ xxꢀ - ꢀ xꢀ xꢀ xꢀ xx  
MechanicalꢀOptions  
00: Bulk  
DD: Ammo Pack  
ColorꢀBinꢀOptions  
0: Full Color Bin Distribution  
B: Color Bin 2 and 3  
C: Color Bin 3 and 4  
D: Color Bin 4 and 5  
MaximumꢀIntensityꢀBin  
0: No Maximum Intensity Bin Limitation  
Others: Refer to Device Selection Guide  
MinimumꢀIntensityꢀBin  
Refer to Device Selection Guide  
ViewingꢀIntensityꢀBin  
11: 15° Without Standoff  
12: 15° With Standoff  
26: 23° Without Standoff  
27: 23° With Standoff  
36: 30° Without standoff  
37: 30° With Standoff  
Color  
B: Blue 470 nm  
M: Green 525 nm  
E: Cyan 505 nm  
Package  
C:T-13/4 (5 mm) Round Lamp  
4
Absolute Maximum Rating at TA = 25°C  
Parametersꢀ  
DCꢂForwardꢂCurrentꢂ[1]  
PeakꢂPulsedꢂForwardꢂCurrent[ꢀ]ꢂ  
Valueꢀ  
ꢁ0ꢂ  
Unit  
mA  
mA  
mW  
°C  
°C  
°C  
100ꢂ  
PowerꢂDissipationꢂ  
116ꢂ  
LEDꢂJunctionꢂTemperatureꢂ  
OperatingꢂTemperatureꢂRangeꢂ  
StorageꢂTemperatureꢂRangeꢂ  
1ꢁ0ꢂ  
–40ꢂtoꢂ+85ꢂ  
–40ꢂtoꢂ+100ꢂ  
Notes:  
1.ꢂ DerateꢂlinearlyꢂasꢂshownꢂinꢂFigureꢂꢀ.  
ꢀ.ꢂ Dutyꢂfactorꢂ10ꢃ,ꢂfrequencyꢂ1ꢂKHz.  
Electrical/Optical Characteristics  
TA = 25oC  
Blueꢀꢀ  
Greenꢀ  
Cyanꢀ  
Parametersꢀ  
ForwardꢂVoltageꢂ  
ReverseꢂVoltage[1]ꢂ  
Symbolꢀ Min.ꢀ Typ.ꢀ Max.ꢀ Min.ꢀ Typ.ꢀ Max.ꢀ Min.ꢀTyp.ꢀMax.ꢀ Unitsꢀ TestꢀCondition  
VFꢂ  
VRꢂ  
ꢁ.ꢀꢂ ꢁ.85ꢂ  
ꢁ.ꢁꢂ ꢁ.85ꢂ  
ꢁ.ꢀꢂ ꢁ.85ꢂ Vꢂ  
IFꢂ=ꢂꢀ0ꢂmA  
IRꢂ=ꢂ10ꢂµA  
5.0ꢂ  
5.0ꢂ  
5.0ꢂ ꢂ Vꢂ  
ThermalꢂResistanceꢂ RqJ-PINꢂ  
ꢀ40ꢂ ꢂ  
ꢀ40ꢂ ꢂ  
ꢀ40ꢂ ꢂ  
oC/Wꢂ LEDꢂJunctionꢂtoꢂ  
AnodeꢂLead  
IFꢂ=ꢂꢀ0ꢂmAꢂ  
Dominantꢂ  
ldꢂ  
460ꢂ 470ꢂ 480ꢂ  
5ꢀ0ꢂ 5ꢀ5ꢂ 540ꢂ  
490ꢂ 505ꢂ 508ꢂ  
nmꢂ  
Wavelength[ꢀ]  
PeakꢂWavelengthꢂ  
l
PEAKꢂ  
464ꢂ ꢂ  
516ꢂ ꢂ  
501ꢂ ꢂ  
nmꢂ  
PeakꢂofꢂWavelengthꢂ  
ofꢂSpectralꢂDistribu-ꢂ  
tionꢂatꢂIFꢂ=ꢂꢀ0ꢂmA  
WavelengthꢂWidthꢂ  
atꢂSpectralꢂDistribu-ꢂ  
tionꢂPowerꢂPointꢂ  
atꢂIFꢂ=ꢂꢀ0ꢂmA  
SpectralꢂHalfꢂWidthꢂ Dl1/ꢀꢂ  
ꢀꢁꢂ  
ꢁꢀꢂ  
ꢁ0ꢂ  
nmꢂ  
LuminousꢂEfficacy[ꢁ]hvꢂ  
74ꢂ  
484ꢂ ꢂ  
ꢁ19ꢂ ꢂ  
lm/Wꢂ EmittedꢂLuminousꢂ  
Power/Emittedꢂ  
RadiantꢂPower  
Notes:  
1.ꢂ TheꢂreverseꢂvoltageꢂofꢂtheꢂproductꢂisꢂequivalentꢂtoꢂtheꢂforwardꢂvoltageꢂofꢂtheꢂprotectiveꢂchipꢂatꢂIRꢂ=ꢂ10ꢂµA.  
ꢀ.ꢂ Theꢂdominantꢂwavelength,ꢂld,ꢂisꢂderivedꢂfromꢂtheꢂChromaticityꢂDiagramꢂandꢂrepresentsꢂtheꢂcolorꢂofꢂtheꢂlamp.  
ꢁ.ꢂ Theꢂradiantꢂintensity,ꢂIeꢂinꢂwatts/steradian,ꢂmayꢂbeꢂfoundꢂfromꢂtheꢂequationꢂIeꢂ=ꢂIv/hv,ꢂwhereꢂIvꢂisꢂtheꢂluminousꢂintensityꢂinꢂcandelasꢂandꢂhvꢂisꢂtheꢂlumi-  
nousꢂefficacyꢂinꢂlumens/watt.  
5
1.0  
0.8  
0.6  
0.4  
35  
30  
25  
20  
15  
10  
5
CYAN  
GREEN  
BLUE  
Rθ ꢀ=ꢀ780ꢀ°C/W  
J-A  
0.2  
0
0
380  
430  
480  
530  
580  
630  
680  
0
10 20 30 40 50 60 70 80 90  
WAVELENGTHꢀ–ꢀnm  
T ꢀ–ꢀAMBIENTꢀTEMPERATUREꢀ–ꢀ°C  
A
Figure 2. Forward current vs. ambient temperature  
Figure 1. Relative intensity vs. wavelength  
35  
30  
25  
20  
15  
10  
5
1.035  
1.030  
CYAN  
1.025  
1.020  
GREEN  
1.015  
1.010  
1.005  
BLUE  
1.000  
0.995  
0.990  
0
0
1.0  
2.0  
3.0  
4.0  
0
5
10  
15  
20  
25  
30  
FORWARDꢀVOLTAGEꢀ–ꢀV  
DCꢀFORWARDꢀCURRENTꢀ–ꢀmA  
Figure 3. Forward current vs. forward voltage  
Figure 4. Relative dominant wavelength vs. DC forward current  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0
5
10  
15  
20  
25  
30  
DCꢀꢀFORWARDꢀCURRENTꢀ–ꢀmA  
Figure 5. Relative intensity vs. DC forward current  
6
1
0.5  
0
-90  
-60  
-30  
0
30  
60  
60  
60  
90  
90  
90  
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES  
Figure 6. Spatial radiation pattern for Cx11 and Cx12  
1
0.5  
0
-90  
-60  
-30  
0
30  
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES  
Figure 7. Spatial radiation pattern for Cx26 and Cx27  
1
0.5  
0
-90  
-60  
-30  
0
30  
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES  
Figure 8. Spatial radiation pattern for Cx36 and Cx37  
7
Intensity Bin Limit Table  
Blue Color Bin Table  
Intensityꢀ(mcd)ꢀatꢀ20ꢀmA  
Binꢀ  
MinꢀDomꢀ  
MaxꢀDomꢀ  
Xminꢀ  
Yminꢀ  
Xmaxꢀ  
0.1766ꢂ  
0.1ꢁ74ꢂ  
0.1699ꢂ  
0.1ꢀ91ꢂ  
0.1616ꢂ  
0.1187ꢂ  
0.1517ꢂ  
0.106ꢁꢂ  
0.1ꢁ97ꢂ  
0.091ꢁꢂ  
Ymax  
Binꢀ  
Nꢂ  
Pꢂ  
Qꢂ  
Rꢂ  
Sꢂ  
Tꢂ  
Minꢀ  
Maxꢀ  
880ꢂ  
1ꢂ  
460.0ꢂ  
464.0ꢂ  
0.1440ꢂ  
0.1818ꢂ  
0.1ꢁ74ꢂ  
0.1766ꢂ  
0.1ꢀ91ꢂ  
0.1699ꢂ  
0.1187ꢂ  
0.1616ꢂ  
0.106ꢁꢂ  
0.1517ꢂ  
0.0ꢀ97ꢂ  
0.0904ꢂ  
0.0ꢁ74ꢂ  
0.0966ꢂ  
0.0495ꢂ  
0.106ꢀꢂ  
0.0671ꢂ  
0.1ꢀ09ꢂ  
0.0945ꢂ  
0.14ꢀꢁꢂ  
0.0966  
0.0ꢁ74  
0.106ꢀ  
0.0495  
0.1ꢀ09  
0.0671  
0.14ꢀꢁ  
0.0945  
0.17ꢀ8  
0.1ꢁꢀ7  
680ꢂ  
880ꢂ  
1150ꢂ  
1500ꢂ  
1900ꢂ  
ꢀ500ꢂ  
ꢁꢀ00ꢂ  
4ꢀ00ꢂ  
5500ꢂ  
7ꢀ00ꢂ  
9ꢁ00ꢂ  
1ꢀ000ꢂ  
16000ꢂ  
ꢀ1000ꢂ  
ꢀꢂ  
464.0ꢂ  
468.0ꢂ  
1150ꢂ  
1500ꢂ  
1900ꢂ  
ꢀ500ꢂ  
ꢁꢀ00ꢂ  
4ꢀ00ꢂ  
5500ꢂ  
7ꢀ00ꢂ  
9ꢁ00ꢂ  
1ꢀ000ꢂ  
16000ꢂ  
ꢁꢂ  
468.0ꢂ  
47ꢀ.0ꢂ  
4ꢂ  
47ꢀ.0ꢂ  
476.0ꢂ  
Uꢂ  
Vꢂ  
Wꢂ  
Xꢂ  
Yꢂ  
5ꢂ  
476.0ꢂ  
480.0ꢂ  
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.  
Zꢂ  
1ꢂ  
Green Color Bin Table  
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 15ꢃ.  
Binꢀ  
MinꢀDomꢀ  
MaxꢀDomꢀ  
Xminꢀ  
Yminꢀ  
Xmaxꢀ  
0.1856ꢂ  
0.1060ꢂ  
0.ꢀ068ꢂ  
0.1ꢁ87ꢂ  
0.ꢀꢀ7ꢁꢂ  
0.170ꢀꢂ  
0.ꢀ469ꢂ  
0.ꢀ00ꢁꢂ  
0.ꢀ659ꢂ  
0.ꢀꢀ96ꢂ  
Ymax  
1ꢂ  
5ꢀ0.0ꢂ  
5ꢀ4.0ꢂ  
0.074ꢁꢂ  
0.1650ꢂ  
0.1060ꢂ  
0.1856ꢂ  
0.1ꢁ87ꢂ  
0.ꢀ068ꢂ  
0.170ꢀꢂ  
0.ꢀꢀ7ꢁꢂ  
0.ꢀ00ꢁꢂ  
0.ꢀ469ꢂ  
0.8ꢁꢁ8ꢂ  
0.6586ꢂ  
0.8ꢀ9ꢀꢂ  
0.6556ꢂ  
0.8148ꢂ  
0.646ꢁꢂ  
0.7965ꢂ  
0.6ꢁ44ꢂ  
0.7764ꢂ  
0.6ꢀ1ꢁꢂ  
0.6556  
0.8ꢀ9ꢀ  
0.646ꢁ  
0.8148  
0.6ꢁ44  
0.7965  
0.6ꢀ1ꢁ  
0.7764  
0.6070  
0.754ꢁ  
ꢀꢂ  
5ꢀ4.0ꢂ  
5ꢀ8.0ꢂ  
ꢁꢂ  
5ꢀ8.0ꢂ  
5ꢁꢀ.0ꢂ  
4ꢂ  
5ꢁꢀ.0ꢂ  
5ꢁ6.0ꢂ  
5ꢂ  
5ꢁ6.0ꢂ  
540.0ꢂ  
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.  
Cyan Color Bin Table  
Binꢀ  
MinꢀDomꢀ  
MaxꢀDomꢀ  
Xminꢀ  
Yminꢀ  
Xmaxꢀ  
0.1164ꢂ  
0.0ꢀꢁ5ꢂ  
0.1057ꢂ  
0.008ꢀꢂ  
0.10ꢀ7ꢂ  
0.00ꢁ9ꢂ  
0.1097ꢂ  
0.01ꢁ9ꢂ  
0.10ꢀ8ꢂ  
0.0040ꢂ  
0.1056ꢂ  
0.0080ꢂ  
Ymax  
1ꢂ  
490.0ꢂ  
495.0ꢂ  
0.0454ꢂ  
0.1ꢁ18ꢂ  
0.0ꢁ45ꢂ  
0.1164ꢂ  
0.008ꢀꢂ  
0.1057ꢂ  
0.00ꢁ9ꢂ  
0.10ꢀ7ꢂ  
0.01ꢁꢀꢂ  
0.109ꢀꢂ  
0.0040ꢂ  
0.10ꢀ8ꢂ  
0.ꢀ945ꢂ  
0.ꢁ06ꢂ  
0.ꢁ889  
0.41ꢀ7  
0.4769  
0.5ꢁ84  
0.5584  
0.6548  
0.6ꢀ51  
0.750ꢀ  
0.5ꢀ7ꢁ  
0.6104  
0.6007  
0.715ꢁ  
ꢀꢂ  
495.0ꢂ  
500.0ꢂ  
0.41ꢀ7ꢂ  
0.ꢁ889ꢂ  
0.5ꢁ84ꢂ  
0.4769ꢂ  
0.6548ꢂ  
0.5584ꢂ  
0.488ꢀꢂ  
0.4417ꢂ  
0.6104ꢂ  
0.5ꢀ7ꢁꢂ  
ꢁꢂ  
500.0ꢂ  
505.0ꢂ  
4ꢂ  
505.0ꢂ  
510.0ꢂ  
7ꢂ  
498.0ꢂ  
50ꢁ.0ꢂ  
8ꢂ  
50ꢁ.0ꢂ  
508.0ꢂ  
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.  
8
Avago Technologies LED Configuration  
Precautions  
Lead Forming  
• The leads of an LED lamp may be preformed or cut to  
length prior to insertion and soldering on PC board.  
• If lead forming is required before soldering, care must  
be taken to avoid any excessive mechanical stress in-  
duced into the LED package. Otherwise, cut the leads  
to applicable length after soldering process at room  
temperature. The solder joint formed will absorb the  
mechanical stress, due to lead cutting, from traveling  
to the LED chip die attach and wirebond.  
ANODE  
• For better control, it is recommended to use proper  
tool to precisely form and cut the leads to applicable  
length rather than doing it manually.  
InGaN Device  
Note:Electrical connection between bottom surface of LED die and the lead frame material  
through conductive paste of solder.  
Soldering Conditions  
• Care must be taken during PCB assembly and soldering  
process to prevent damage to LED component.  
• If necessary, use fixture to hold the LED component  
in proper orientation with respect to the PCB during  
soldering process.  
• The closest manual soldering distance of the soldering  
heat source (soldering iron’s tip) to the body is  
1.59 mm.Soldering the LED closer than 1.59 mm might  
damage the LED.  
• At elevated temperature, the LED is more susceptible  
to mechanical stress. Therefore, PCB must be allowed  
to cool down to room temperature prior to handling,  
which includes removal of jigs, fixtures or pallet.  
1.59ꢀmm  
• Special attention must be given to board fabrication,  
solder masking, surface plating and lead holes size  
and component orientation to assure solderability.  
• Recommended PC board plated through hole sizes for  
LED component leads:  
• Recommended soldering conditions:  
ManualꢀSolderꢀꢀ  
LEDꢀComponentꢀꢀ  
LeadꢀSizeꢀ  
PlatedꢀThroughꢀꢀꢀ  
HoleꢀDiameter  
WaveꢀSolderingꢀ Dipping  
Pre-heatꢂTemperatureꢂ 105ꢂ°CꢂMax.ꢂ  
Diagonalꢀ  
0.646ꢂmmꢂ  
(0.0ꢀ5ꢂinch)ꢂ  
0.718ꢂmmꢂ  
(0.0ꢀ8ꢂinch)ꢂ  
Pre-heatꢂTimeꢂ  
PeakꢂTemperatureꢂ  
DwellꢂTimeꢂ  
ꢁ0ꢂsecꢂMax.ꢂ  
ꢀ50ꢂ°CꢂMax.ꢂ  
ꢁꢂsecꢂMax.ꢂ  
0.457ꢂxꢂ0.457ꢂmmꢂ  
(0.018ꢂxꢂ0.018ꢂinch)ꢂ  
0.508ꢂxꢂ0.508ꢂmmꢂ  
(0.0ꢀ0ꢂxꢂ0.0ꢀ0ꢂinch)ꢂ  
0.976ꢂtoꢂ1.078ꢂmmꢂ  
(0.0ꢁ8ꢂtoꢂ0.04ꢀꢂinch)  
1.049ꢂtoꢂ1.150ꢂmm  
(0.041ꢂtoꢂ0.045ꢂinch)  
ꢀ60ꢂ°CꢂMax.  
5ꢂsecꢂMax.  
• Wave soldering parameter must be set and maintained  
according to recommended temperature and dwell  
time in the solder wave. Customer is advised to daily  
check on the soldering profile to ensure the soldering  
profile is always conforming to recommended  
soldering condition.  
• Over sizing of plated through hole can lead to  
twisting or improper LED placement during auto  
insertion.Under sizing plated through hole can lead to  
mechanical stress on the epoxy lens during clinching.  
Notes:  
Note: Refer to application note AN1027 for more information on soldering LED  
components.  
1. PCB with different size and design (component density) will have different heat  
mass (heat capacity). This might cause a change in temperature experienced by the  
board if samewave soldering setting is used. So, it is recommended to recalibrate  
the soldering profile again before loading a new type of PCB.  
2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single  
wire bond, as shown below. Customer is advised to take extra precaution during  
wave soldering to ensure that the maximum wave temperature does not exceed 250°C.  
Over-stressing the LED during soldering process might cause premature failure to the  
LED due to delamination.  
9
Recommended Wave Soldering Profile  
LAMINAR WAVE  
HOT AIR KNIFE  
TURBULENT WAVE  
250  
BOTTOM SIDE  
OF PC BOARD  
TOP SIDE OF  
PC BOARD  
200  
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)  
PREHEAT SETTING = 150°C (100°C PCB)  
SOLDER WAVE TEMPERATURE = 245°C ± 5°C  
AIR KNIFE AIR TEMPERATURE = 390°C  
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)  
AIR KNIFE ANGLE = 40°  
150  
FLUXING  
100  
SOLDER: SN63; FLUX: RMA  
LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu  
50  
30  
NOTE: ALLOW FOR BOARDS TO BE  
SUFFICIENTLY COOLED BEFORE  
EXERTING MECHANICAL FORCE.  
PREHEAT  
0
10 20 30 40 50 60 70 80 90 100  
TIME – SECONDS  
Ammo Packs Drawing  
6.35ꢀ±ꢀ1.30  
(0.25ꢀ±ꢀ0.0512)  
12.70ꢀ±ꢀ1.00  
(0.50ꢀ±ꢀ0.0394)  
CATHODE  
20.50ꢀ±ꢀ1.00  
(0.807ꢀ±ꢀ0.039)  
9.125ꢀ±ꢀ0.625  
(0.3593ꢀ±ꢀ0.0246)  
18.00ꢀ±ꢀ0.50  
(0.7087ꢀ±ꢀ0.0197)  
A
A
4.00ꢀ±ꢀ0.20  
(0.1575ꢀ±ꢀ0.008)  
12.70ꢀ±ꢀ0.30  
(0.50ꢀ±ꢀ0.0118)  
TYP.  
VIEWꢀA–A  
0.70ꢀ±ꢀ0.20  
(0.0276ꢀ±ꢀ0.0079)  
ALLꢀDIMENSIONSꢀINꢀMILLIMETERSꢀ(INCHES).  
NOTE:ꢀTHEꢀAMMO-PACKSꢀDRAWINGꢀISꢀAPPLICABLEꢀFORꢀPACKAGINGꢀOPTIONꢀ-DDꢀ&ꢀ-ZZꢀANDꢀREGARDLESSꢀOFꢀSTANDOFFꢀORꢀNON-STANDOFF.  
10  
Packaging Box for Ammo Packs  
LABELꢀON  
THISꢀSIDE  
OFꢀBOX.  
FROMꢀLEFTꢀSIDEꢀOFꢀBOX,  
ADHESIVEꢀTAPEꢀMUSTꢀBE  
FACINGꢀUPWARD.  
+
A
AVAGO  
TECHNOLOGIES  
ANODE  
E
CATHOD  
ANODEꢀLEADꢀLEAVES  
THEꢀBOXꢀFIRST.  
C
MOTHERꢀLABEL  
NOTE:ꢀ  
FORꢀInGaNꢀDEVICE,ꢀTHEꢀAMMOꢀPACKꢀPACKAGINGꢀBOXꢀCONTAINSꢀESDꢀLOGO.  
DISCLAIMER  
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR  
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT  
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY  
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS  
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change.Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4115EN  
AV02-0367EN March 6, 2008  

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