HLMP-CE34-Y1CDD [AVAGO]
T-1 ¾ (5mm) Extra Bright Cyan LEDs; T-1 ¾ （5毫米）超亮LED灯青色
| 型号： | HLMP-CE34-Y1CDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 ¾ (5mm) Extra Bright Cyan LEDs |
| 文件： | 总9页 (文件大小：225K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CExx
T-1 ¾ (5mm) Extra Bright Cyan LEDs
Data Sheet
Description
Features
The high intensity Cyan LEDs are based on the most
efficient and cost effective InGaN material technol-
ogy. The 505nm typical dominant wavelength is most
suitable for traffic signal application. These LED lamps
are untinted, non-diffused, T-1¾ packages incorporating
second generation optics which produce well-defined
spatial radiation patterns at specific viewing cone angles.
ꢀ Viewing Angle: 15°, 23° and 30°
ꢀ Well defined spatial radiation pattern
ꢀ High brightness material
ꢀ Superior resistance to moisture
ꢀ Package options:
– Stand-off and Non Stand-off Leads
ꢀ Untinted and non diffused
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture resis-
tance in outdoor sign and signals applications.
Applications
ꢀ Traffic signals
Package Dimensions
A: Non stand-off
1.0 0.ꢀ0
0.039 0.00ꢁ
5.ꢁ0 0.ꢀ0
0.ꢀꢀꢁ 0.00ꢁ
Ø
Dimension A
0.50 0.ꢀ0
.0ꢀ0 .00ꢁ
sq. typ.
ꢀ.540 0.ꢀ
0.100 0.00ꢁ
5.00 0.ꢀ0
0.197 0.00ꢁ
Note 1
Cathode
1.00
.039
min
ꢀ5.40
0.901
cathode
flat
min
B: Stand-off
1.0 0.ꢀ0
5.ꢁ0 0.ꢀ0
0.ꢀꢀꢁ 0.00ꢁ
0.039 0.00ꢁ
Ø
1.30 0.15
0.051 0.00ꢂ
Dimension A
0.50 0.ꢀ0
.0ꢀ0 .00ꢁ
sq. typ.
ꢀ.540 0.ꢀ
0.100 0.00ꢁ
5.00 0.ꢀ0
0.197 0.00ꢁ
Note 1
Cathode
1.00
.039
Dimension d
min
cathode
flat
ꢀ5.40
0.901
min
Package
15°
Dimension A
Dimension d
13.00 0.20 mm
Notes:
1. Measured above flange.
2. All dimensions in millimeters (inches).
8.70 0.20 mm
8.65 0.20 mm
8.65 0.20 mm
23°
30°
12.25 0.20 mm
12.05 0.20 mm
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Luminous Intensity
Luminous Intensity
Part Number
Iv (mcd) at ꢀ0 mA Min.
Iv (mcd) at ꢀ0 mA Max.
Stand-Off
No
HLMP-CE13-35CDD
HLMP-CE13-35QDD
HLMP-CE22-Z2CDD
HLMP-CE22-Z2QDD
HLMP-CE34-Y1CDD
HLMP-CE34-Y1QDD
HLMP-CE14-35CDD
HLMP-CE14-35QDD
HLMP-CE25-Z2CDD
HLMP-CE25-Z2QDD
HLMP-CE35-Y1CDD
HLMP-CE35-Y1QDD
27000
27000
12000
12000
9300
59000
59000
27000
27000
21000
21000
59000
59000
27000
27000
21000
21000
No
No
No
No
9300
No
27000
27000
12000
12000
9300
Yes
Yes
Yes
Yes
Yes
Yes
9300
Tolerance for each intensity limit is 15ꢀ.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. Tolerance for each intensity limit is 15ꢀ.
3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
Part Numbering System
HLMP-C E xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
C: Color bin 3 & 4
Q: Color bin 7 & 8
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Stands-offs
13: 15° without stand-off
14: 15° with stand-off
22: 23° without stand-off
25: 23° with stand-off
34: 30° without stand-off
35: 30° with stand-off
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
T = ꢀ5°C
J
Parameter
Value
30
Unit
mA
mA
mW
DC Forward Current [1]
Peak Forward Current
Power Dissipation
100 [2]
107
Reverse Voltage
Not recommended for reverse bias
Operating Temperature Range
Storage Temperature Range
-40 to +85
-40 to +85
°C
°C
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty Factor 10ꢀ, frequency 1KHz.
Electrical / Optical Characteristics
T = ꢀ5°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
2.8
3.2
3.5
V
IF = 20 mA
Dominant Wavelength[1]
Peak Wavelength
ꢁd
505
501
30
nm
nm
IF = 20 mA
ꢁPEAK
ꢂꢁ1/2
RꢃJ-PIN
ꢄV
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Halfwidth
Thermal Resistance
Luminous Efficacy [2]
Wavelength width at spectral distri-
bution ½ power point at IF = 20 mA
240
326
°C/W
lm/W
LED Junction-to-Cathode Lead
Emitted Luminous Power/Emitted
Radiant Power
Luminous Flux
ꢅV
ꢄe
2.1
34
lm
IF = 20 mA
Luminous Efficiency [3]
lm/W
Emitted Luminous Flux/Electrical
Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant
wavelength is 0.5nm.
2. The radiant intensity, I in watts per steradian, may be found from the equation I = I /η where I is the luminous intensity in candelas and ꢄ is
e
e
V
V
V
V
the luminous efficacy in lumens/watt.
3.
ꢄ ꢅ / I x V where ꢅ is the emitted luminous flux, I is electrical forward current and V is the forward voltage.
e =ꢆ V F F V F F
3
30
ꢀ5
ꢀ0
15
10
5
1
0.9
0.ꢁ
0.7
0.ꢂ
0.5
0.4
0.3
0.ꢀ
0.1
0
0
400
450
500
550
ꢂ00
ꢂ50
700
0
1
ꢀ
3
4
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
Figure ꢀ. Forward Current vs Forward Voltage
1.4
1.ꢀ
1
1ꢂ
14
1ꢀ
10
ꢁ
0.ꢁ
0.ꢂ
0.4
0.ꢀ
0
ꢂ
4
ꢀ
0
-ꢀ
-4
0
5
10
15
ꢀ0
ꢀ5
30
0
5
10
15
ꢀ0
ꢀ5
30
DC FORWARD CURRENT - mA
FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
Figure 4. Relative Dominant Wavelength vs Forward Current
35
30
ꢀ5
ꢀ0
15
10
5
1
0.ꢁ
0.ꢂ
0.4
0.ꢀ
0
0
0
ꢀ0
40
ꢂ0
ꢁ0
100
-90
-ꢂ0
-30
0
30
ꢂ0
90
TA - AMBIENT TEMPERATURE - °C
ANGULAR DISPLACEMENT - DEG
Figure 5. Maximum Forward Current vs Ambient Temperature
Figure ꢂ. Representative Spatial Radiation Pattern – 15° Lamps
4
1
0.ꢁ
0.ꢂ
0.4
0.ꢀ
0
1
0.ꢁ
0.ꢂ
0.4
0.ꢀ
0
-90
-ꢂ0
-30
0
30
ꢂ0
90
-90
-ꢂ0
-30
0
30
ꢂ0
90
ANGULAR DISPLACEMENT - DEG
ANGULAR DISPLACEMENT - DEG
Figure 7. Representative Spatial Radiation Pattern – ꢀ3° Lamps
Figure ꢁ. Representative Spatial Radiation Pattern – 30° Lamps
Relative Light Output vs Junction Temperature
10
1
0.1
-40
-ꢀ0
0
ꢀ0
40
ꢂ0
ꢁ0
100
TJ - JUNCTION TEMPERATURE - °C
Intensity Bin Limit Table (1.3: 1 Iv Bin Ratio)
Intensity (mcd) at ꢀ0 mA
Cyan Color Bin Limits
Bin
3
Min
500
505
498
503
Max
505
510
503
508
Bin
Y
Min
Max
9300
12000
16000
21000
27000
35000
45000
59000
4
Z
12000
16000
21000
27000
35000
45000
7
1
8
2
Tolerance for each bin limit is 0.5nm.
3
4
5
Tolerance for each bin limit is 15ꢀ
5
Precautions:
Lead Forming:
ꢀ The leads of an LED lamp may be preformed or cut to
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave soldering
to ensure that the maximum wave temperature does not exceed
260°C and the solder contact time does not exceeding 5sec. Over-
stressing the LED during soldering process might cause premature
failure to the LED due to delamination.
length prior to insertion and soldering on PC board.
ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED Configuration
Soldering and Handling:
ꢀ Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
1.59 mm
ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
ꢀ ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
ꢀ Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
ꢀ Recommended PC board plated through holes (PTH)
[1, ꢀ]
size for LED component leads.
Pre-heat temperature 105°C Max.
-
LED component
lead size
Plated through
hole diameter
Preheat time
Peak temperature
Dwell time
Note:
60 sec Max
260°C Max.
5 sec Max.
-
Diagonal
260°C Max.
5 sec Max
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
ꢀ Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
6
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
ꢀꢂ0°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
105°C Max
(maximum peak temperature = 260°C)
Dwell time: 3 sec - 5 sec
(maximum = 5 sec)
ꢂ0 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
1ꢀ.70 1.00
0.50 0.0394
ꢂ.35 1.30
0.ꢀ5 0.051ꢀ
CATHODE
ꢀ0.50 1.00
0.ꢁ07 0.039
9.1ꢀ5 0.ꢂꢀ5
0.3593 0.0ꢀ4ꢂ
1ꢁ.00 0.50
0.70ꢁ7 0.0197
4.00 0.ꢀ0TYP.
0.1575 0.00ꢁ
ø
A
A
1ꢀ.70 0.30
0.50 0.011ꢁ
VIEW A-A
0.70 0.ꢀ0
0.0ꢀ7ꢂ 0.0079
Note: All dimensions are in milimeters (inches).
7
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
(1P) Item: Part Number
RoHS Compliant
e3
max temp 260C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
8
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1823EN - January 20, 2010
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