HLMP-CM37-XYC00 [AVAGO]
T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps; T- 13/4 ( 5毫米)的超明亮的精密光学性能的InGaN LED灯型号: | HLMP-CM37-XYC00 |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps |
文件: | 总11页 (文件大小:237K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HLMP-Cxxx
T-13/4 (5 mm) Extra Bright Precision Optical
Performance InGaN LED Lamps
Data Sheet
HLMP-CB11, HLMP-CB12, HLMP-CM11,
HLMP-CM12, HLMP-CE11, HLMP-CE12,
HLMP-CB26, HLMP-CB27, HLMP-CM26,
HLMP-CM27, HLMP-CE26, HLMP-CE27,
HLMP-CB36, HLMP-CB37, HLMP-CM36,
HLMP-CM37, HLMP-CE36, HLMP-CE37
Description
Features
These high intensity blue, green, and cyan LEDs are
based on the most efficient and cost effective InGaN
material technology. The 470 nm typical dominant
wavelength for blue and 525 nm typical wavelength for
green is well suited to color mixing in full color signs.
The 505 nm typical dominant wavelength for cyan is
suitable for traffic signal application.
• Well defined spatial radiation pattern
• High luminous output
• Available in blue, green, and cyan color
• Viewing angle: 15°, 23° and 30°
• Standoff or non-standoff leads
• Superior resistance to moisture
These LED lamps are untinted, non-diffused, T-13/4
packages incorporating second generation optics which
producewell-definedspatialradiationpatternsatspecific
viewing cone angles.
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicator
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture
resistance in outdoor signal and sign applications. The
high maximum LED junction temperature limit of +110°C
enables high temperature operation in bright sunlight
conditions.
CAUTION: Devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and
processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package A
2.35ꢀ(0.093)
MAX.
5.80ꢀ±ꢀ0.20
∅
(0.228ꢀ±ꢀ0.008)
1.14ꢀ±ꢀ0.20
(0.045ꢀ±ꢀ0.008)
0.70ꢀ(0.028)
MAX.
4.90ꢀ±ꢀ0.20
(0.193ꢀ±ꢀ0.008)
2.54ꢀ±ꢀ0.38
(0.100ꢀ±ꢀ0.015)
ꢀCATHODE
LEAD
8.61ꢀ±ꢀ0.20
(0.339ꢀ±ꢀ0.008)
ꢀCATHODE
FLAT
31.60
(1.244)
MIN.
Package B
5.80ꢀ±ꢀ0.20
∅
(0.228ꢀ±ꢀ0.008)
1.14ꢀ±ꢀ0.20
(0.045ꢀ±ꢀ0.008)
1.50ꢀ±ꢀ0.15
(0.059ꢀ±ꢀ0.006)
0.50ꢀ±ꢀ0.10
(0.020ꢀ±ꢀ0.004)
SQ.ꢀTYP.
0.70ꢀ(0.028)
MAX.
4.90ꢀ±ꢀ0.20
(0.192ꢀ±ꢀ0.008)
2.54ꢀ±ꢀ0.38
(0.100ꢀ±ꢀ0.015)
NOTEꢀ1
ꢀCATHODE
LEAD
8.61ꢀ±ꢀ0.20
(0.339ꢀ±ꢀ0.008)
ꢀCATHODE
FLAT
1.00
(0.039)
MIN.
DIMENSIONꢀH
31.60
(1.244)
MIN.
DIMENSIONꢀH:
15°ꢀ=ꢀ10.80ꢀ±ꢀ0.25ꢀmmꢀ(0.425ꢀ±ꢀ0.01ꢀINCH)
23°ꢀ=ꢀ10.00ꢀ±ꢀ0.25ꢀmmꢀ(0.394ꢀ±ꢀ0.01ꢀINCH)
30°ꢀ=ꢀ11.27ꢀ±ꢀ0.25ꢀmmꢀ(0.444ꢀ±ꢀ0.01ꢀINCH)
NOTES:
1.ꢀMEASUREDꢀJUSTꢀABOVEꢀFLANGE.
2.ꢀALLꢀDIMENSIONSꢀAREꢀINꢀMILLIMETERSꢀ(INCHES).
3.ꢀEPOXYꢀMENISCUSꢀMAYꢀEXTENDꢀABOUTꢀ1ꢀmmꢀ(0.040")ꢀDOWNꢀTHEꢀLEADS.
4.ꢀIFꢀHEATꢀSINKINGꢀAPPLICATIONꢀISꢀREQUIRED,ꢀTHEꢀTERMINALꢀFORꢀHEATꢀSINKꢀISꢀANODE.
ꢀ
Device Selection Guide
ꢀ
ꢀ
Typicalꢀ
Intensityꢀ(cd)ꢀatꢀ20ꢀmA
ꢀ
ꢀ
ViewingꢀAngle,ꢀ
ꢀ
ꢀ
Packageꢀ
PartꢀNumberꢀ
Colorꢀ
Blueꢂ
Blueꢂ
Blueꢂ
Greenꢂ
Greenꢂ
Greenꢂ
Cyanꢂ
Cyanꢂ
Blueꢂ
Blueꢂ
Blueꢂ
Greenꢂ
Greenꢂ
Greenꢂ
Cyanꢂ
Cyanꢂ
Blueꢂ
Blueꢂ
Blueꢂ
Blueꢂ
Greenꢂ
Greenꢂ
Greenꢂ
Greenꢂ
Greenꢂ
Cyanꢂ
Cyanꢂ
2q1/2ꢀꢀ(Degree)ꢀ Min.ꢀ
Max.ꢀ
7.ꢀꢂ
Standoffꢀ
Noꢂ
Dimensionꢀ Lens
HLMP-CB11-TW0xxꢂ
HLMP-CB11-UVBxxꢂ
HLMP-CB1ꢀ-TW0xxꢂ
HLMP-CM11-Yꢀ0xxꢂ
HLMP-CM11-Z1Cxxꢂ
HLMP-CM1ꢀ-Yꢀ0xxꢂ
HLMP-CE11-X10xxꢂ
HLMP-CE1ꢀ-X10xxꢂ
HLMP-CBꢀ6-SV0xxꢂ
HLMP-CBꢀ6-TUDxxꢂ
HLMP-CBꢀ7-SV0xxꢂ
HLMP-CMꢀ6-X10xxꢂ
HLMP-CMꢀ6-YZCxxꢂ
HLMP-CMꢀ7-X10xxꢂ
HLMP-CEꢀ6-WZ0xxꢂ
HLMP-CEꢀ7-WZ0xxꢂ
HLMP-CBꢁ6-QT0xxꢂ
HLMP-CBꢁ6-RSBxxꢂ
HLMP-CBꢁ7-RU0xxꢂ
HLMP-CBꢁ7-RSDxxꢂ
HLMP-CMꢁ6-X10xxꢂ
HLMP-CMꢁ6-XYCxxꢂ
HLMP-CMꢁ7-X10xxꢂ
HLMP-CMꢁ7-XYCxxꢂ
HLMP-CMꢁ7-XYDxxꢂ
HLMP-CEꢁ6-WZ0xxꢂ
HLMP-CEꢁ7-WZ0xxꢂ
15ꢂ
15ꢂ
15ꢂ
15ꢂ
15ꢂ
15ꢂ
15ꢂ
15ꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢀꢁꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢁ0ꢂ
ꢀ.5ꢂ
ꢁ.ꢀꢂ
ꢀ.5ꢂ
9.ꢁꢂ
1ꢀ.0ꢂ
9.ꢁꢂ
7.ꢀꢂ
7.ꢀꢂ
1.9ꢂ
ꢀ.5ꢂ
1.9ꢂ
7.ꢀꢂ
9.ꢁꢂ
7.ꢀꢂ
5.5ꢂ
5.5ꢂ
1.15ꢂ
1.5ꢂ
1.5ꢂ
1.5ꢂ
7.ꢀꢂ
7.ꢀꢂ
7.ꢀꢂ
7.ꢀꢂ
7.ꢀꢂ
5.5ꢂ
5.5ꢂ
Aꢂ
Aꢂ
Bꢂ
Aꢂ
Aꢂ
Bꢂ
Aꢂ
Bꢂ
Aꢂ
Aꢂ
Bꢂ
Aꢂ
Aꢂ
Bꢂ
Aꢂ
Bꢂ
Aꢂ
Aꢂ
Bꢂ
Bꢂ
Aꢂ
Aꢂ
Bꢂ
Bꢂ
Bꢂ
Aꢂ
Bꢂ
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
5.5ꢂ
Noꢂ
7.ꢀꢂ
Yesꢂꢂ
Noꢂ
ꢀ7.0ꢂ
ꢀ1.0ꢂ
ꢀ7.0ꢂ
ꢀ1.0ꢂ
ꢀ1.0ꢂ
5.5ꢂ
Noꢂ
Yesꢂꢂ
Noꢂ
Yesꢂꢂ
Noꢂ
4.ꢀꢂ
Noꢂ
5.5ꢂ
Yesꢂꢂ
Noꢂ
ꢀ1.0ꢂ
16.0ꢂ
ꢀ1.0ꢂ
16.0ꢂ
16.0ꢂ
ꢁ.ꢀꢂ
Noꢂ
Yesꢂꢂ
Noꢂ
Yesꢂꢂ
Noꢂ
ꢀ.5ꢂ
Noꢂ
4.ꢀꢂ
Yesꢂꢂ
Yesꢂ
Noꢂ
ꢀ.5ꢂ
ꢀ1.0ꢂ
1ꢀ.0ꢂ
ꢀ1.0ꢂ
1ꢀ.0ꢂ
1ꢀ.0ꢂ
16.0ꢂ
16.0ꢂ
Noꢂ
Yesꢂꢂ
Yesꢂ
Yesꢂ
Noꢂ
Yesꢂ
Notes:
1.ꢂ Toleranceꢂforꢂluminousꢂintensityꢂmeasurementꢂisꢂ 15ꢃ.
ꢀ.ꢂ Theꢂluminousꢂintensityꢂisꢂmeasuredꢂonꢂtheꢂmechanicalꢂaxisꢂofꢂtheꢂlampꢂpackage.
ꢁ.ꢂ Theꢂopticalꢂaxisꢂisꢂcloselyꢂalignedꢂwithꢂtheꢂpackageꢂmechanicalꢂaxis.
4.ꢂ LEDꢂlightꢂoutputꢂisꢂbrightꢂenoughꢂtoꢂcauseꢂinjuriesꢂtoꢂtheꢂeyes.ꢂPrecautionsꢂmustꢂbeꢂtakenꢂtoꢂpreventꢂlookingꢂdirectlyꢂatꢂtheꢂLEDꢂwithoutꢂproperꢂsafetyꢂ
equipment.
5.ꢂ ꢂꢀq1/ꢀꢂisꢂtheꢂoff-axisꢂangleꢂwhereꢂtheꢂluminousꢂintensityꢂisꢂ1/ꢀꢂtheꢂon-axisꢂintensity.
ꢁ
Part Numbering System
HLMPꢀ -ꢀ ꢀxꢀ xꢀ xxꢀ - ꢀ xꢀ xꢀ xꢀ xx
ꢀ
MechanicalꢀOptions
00: Bulk
DD: Ammo Pack
ColorꢀBinꢀOptions
0: Full Color Bin Distribution
B: Color Bin 2 and 3
C: Color Bin 3 and 4
D: Color Bin 4 and 5
MaximumꢀIntensityꢀBin
0: No Maximum Intensity Bin Limitation
Others: Refer to Device Selection Guide
MinimumꢀIntensityꢀBin
Refer to Device Selection Guide
ViewingꢀIntensityꢀBin
11: 15° Without Standoff
12: 15° With Standoff
26: 23° Without Standoff
27: 23° With Standoff
36: 30° Without standoff
37: 30° With Standoff
Color
B: Blue 470 nm
M: Green 525 nm
E: Cyan 505 nm
Package
C:T-13/4 (5 mm) Round Lamp
4
Absolute Maximum Rating at TA = 25°C
Parametersꢀ
DCꢂForwardꢂCurrentꢂ[1]
PeakꢂPulsedꢂForwardꢂCurrent[ꢀ]ꢂ
Valueꢀ
ꢁ0ꢂ
Unit
mA
mA
mW
°C
°C
°C
ꢂ
100ꢂ
PowerꢂDissipationꢂ
116ꢂ
LEDꢂJunctionꢂTemperatureꢂ
OperatingꢂTemperatureꢂRangeꢂ
StorageꢂTemperatureꢂRangeꢂ
1ꢁ0ꢂ
–40ꢂtoꢂ+85ꢂ
–40ꢂtoꢂ+100ꢂ
Notes:
1.ꢂ DerateꢂlinearlyꢂasꢂshownꢂinꢂFigureꢂꢀ.
ꢀ.ꢂ Dutyꢂfactorꢂ10ꢃ,ꢂfrequencyꢂ1ꢂKHz.
Electrical/Optical Characteristics
TA = 25oC
ꢀ
ꢀ
ꢀ
Blueꢀꢀ
ꢀ
Greenꢀ
ꢀ
Cyanꢀ
Parametersꢀ
ForwardꢂVoltageꢂ
ReverseꢂVoltage[1]ꢂ
Symbolꢀ Min.ꢀ Typ.ꢀ Max.ꢀ Min.ꢀ Typ.ꢀ Max.ꢀ Min.ꢀTyp.ꢀꢀMax.ꢀ Unitsꢀ TestꢀCondition
VFꢂ
VRꢂ
ꢂ
ꢁ.ꢀꢂ ꢁ.85ꢂ
ꢂ
ꢁ.ꢁꢂ ꢁ.85ꢂ
ꢂ
ꢁ.ꢀꢂ ꢁ.85ꢂ Vꢂ
IFꢂ=ꢂꢀ0ꢂmA
IRꢂ=ꢂ10ꢂµA
5.0ꢂ
ꢂ
ꢂ
5.0ꢂ
ꢂ
ꢂ
5.0ꢂ ꢂ Vꢂ
ꢂ
ThermalꢂResistanceꢂ RqJ-PINꢂ
ꢂ
ꢂ
ꢀ40ꢂ ꢂ
ꢂ
ꢂ
ꢀ40ꢂ ꢂ
ꢂ
ꢂ
ꢀ40ꢂ ꢂ
oC/Wꢂ LEDꢂJunctionꢂtoꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
AnodeꢂLead
IFꢂ=ꢂꢀ0ꢂmAꢂ
Dominantꢂ
ldꢂ
460ꢂ 470ꢂ 480ꢂ
5ꢀ0ꢂ 5ꢀ5ꢂ 540ꢂ
490ꢂ 505ꢂ 508ꢂ
nmꢂ
Wavelength[ꢀ]
PeakꢂWavelengthꢂ
l
PEAKꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
464ꢂ ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
516ꢂ ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
501ꢂ ꢂ
nmꢂ
PeakꢂofꢂWavelengthꢂ
ofꢂSpectralꢂDistribu-ꢂ
tionꢂatꢂIFꢂ=ꢂꢀ0ꢂmA
WavelengthꢂWidthꢂ
atꢂSpectralꢂDistribu-ꢂ
tionꢂPowerꢂPointꢂ
atꢂIFꢂ=ꢂꢀ0ꢂmA
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
SpectralꢂHalfꢂWidthꢂ Dl1/ꢀꢂ
ꢀꢁꢂ
ꢁꢀꢂ
ꢁ0ꢂ
nmꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
LuminousꢂEfficacy[ꢁ]ꢂ hvꢂ
74ꢂ
484ꢂ ꢂ
ꢁ19ꢂ ꢂ
lm/Wꢂ EmittedꢂLuminousꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
ꢂ
Power/Emittedꢂ
RadiantꢂPower
Notes:
1.ꢂ TheꢂreverseꢂvoltageꢂofꢂtheꢂproductꢂisꢂequivalentꢂtoꢂtheꢂforwardꢂvoltageꢂofꢂtheꢂprotectiveꢂchipꢂatꢂIRꢂ=ꢂ10ꢂµA.
ꢀ.ꢂ Theꢂdominantꢂwavelength,ꢂld,ꢂisꢂderivedꢂfromꢂtheꢂChromaticityꢂDiagramꢂandꢂrepresentsꢂtheꢂcolorꢂofꢂtheꢂlamp.
ꢁ.ꢂ Theꢂradiantꢂintensity,ꢂIeꢂinꢂwatts/steradian,ꢂmayꢂbeꢂfoundꢂfromꢂtheꢂequationꢂIeꢂ=ꢂIv/hv,ꢂwhereꢂIvꢂisꢂtheꢂluminousꢂintensityꢂinꢂcandelasꢂandꢂhvꢂisꢂtheꢂlumi-
nousꢂefficacyꢂinꢂlumens/watt.
5
1.0
0.8
0.6
0.4
35
30
25
20
15
10
5
CYAN
GREEN
BLUE
Rθ ꢀ=ꢀ780ꢀ°C/W
J-A
0.2
0
0
380
430
480
530
580
630
680
0
10 20 30 40 50 60 70 80 90
WAVELENGTHꢀ–ꢀnm
T ꢀ–ꢀAMBIENTꢀTEMPERATUREꢀ–ꢀ°C
A
Figure 2. Forward current vs. ambient temperature
Figure 1. Relative intensity vs. wavelength
35
30
25
20
15
10
5
1.035
1.030
CYAN
1.025
1.020
GREEN
1.015
1.010
1.005
BLUE
1.000
0.995
0.990
0
0
1.0
2.0
3.0
4.0
0
5
10
15
20
25
30
FORWARDꢀVOLTAGEꢀ–ꢀV
DCꢀFORWARDꢀCURRENTꢀ–ꢀmA
Figure 3. Forward current vs. forward voltage
Figure 4. Relative dominant wavelength vs. DC forward current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
DCꢀꢀFORWARDꢀCURRENTꢀ–ꢀmA
Figure 5. Relative intensity vs. DC forward current
6
1
0.5
0
-90
-60
-30
0
30
60
60
60
90
90
90
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES
Figure 6. Spatial radiation pattern for Cx11 and Cx12
1
0.5
0
-90
-60
-30
0
30
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES
Figure 7. Spatial radiation pattern for Cx26 and Cx27
1
0.5
0
-90
-60
-30
0
30
ANGULARꢀDISPLACEMENTꢀ–ꢀDEGREES
Figure 8. Spatial radiation pattern for Cx36 and Cx37
7
Intensity Bin Limit Table
Blue Color Bin Table
ꢀ
Intensityꢀ(mcd)ꢀatꢀ20ꢀmA
Binꢀ
MinꢀDomꢀ
MaxꢀDomꢀ
Xminꢀ
Yminꢀ
Xmaxꢀ
0.1766ꢂ
0.1ꢁ74ꢂ
0.1699ꢂ
0.1ꢀ91ꢂ
0.1616ꢂ
0.1187ꢂ
0.1517ꢂ
0.106ꢁꢂ
0.1ꢁ97ꢂ
0.091ꢁꢂ
Ymax
Binꢀ
Nꢂ
Pꢂ
Qꢂ
Rꢂ
Sꢂ
Tꢂ
Minꢀ
Maxꢀ
880ꢂ
1ꢂ
ꢂ
460.0ꢂ
464.0ꢂ
0.1440ꢂ
0.1818ꢂ
0.1ꢁ74ꢂ
0.1766ꢂ
0.1ꢀ91ꢂ
0.1699ꢂ
0.1187ꢂ
0.1616ꢂ
0.106ꢁꢂ
0.1517ꢂ
0.0ꢀ97ꢂ
0.0904ꢂ
0.0ꢁ74ꢂ
0.0966ꢂ
0.0495ꢂ
0.106ꢀꢂ
0.0671ꢂ
0.1ꢀ09ꢂ
0.0945ꢂ
0.14ꢀꢁꢂ
0.0966
0.0ꢁ74
0.106ꢀ
0.0495
0.1ꢀ09
0.0671
0.14ꢀꢁ
0.0945
0.17ꢀ8
0.1ꢁꢀ7
680ꢂ
ꢂ
ꢂ
880ꢂ
1150ꢂ
1500ꢂ
1900ꢂ
ꢀ500ꢂ
ꢁꢀ00ꢂ
4ꢀ00ꢂ
5500ꢂ
7ꢀ00ꢂ
9ꢁ00ꢂ
1ꢀ000ꢂ
16000ꢂ
ꢀ1000ꢂ
ꢀꢂ
ꢂ
464.0ꢂ
468.0ꢂ
1150ꢂ
1500ꢂ
1900ꢂ
ꢀ500ꢂ
ꢁꢀ00ꢂ
4ꢀ00ꢂ
5500ꢂ
7ꢀ00ꢂ
9ꢁ00ꢂ
1ꢀ000ꢂ
16000ꢂ
ꢂ
ꢂ
ꢁꢂ
ꢂ
468.0ꢂ
47ꢀ.0ꢂ
ꢂ
ꢂ
4ꢂ
ꢂ
47ꢀ.0ꢂ
476.0ꢂ
Uꢂ
Vꢂ
Wꢂ
Xꢂ
Yꢂ
ꢂ
ꢂ
5ꢂ
ꢂ
476.0ꢂ
ꢂ
480.0ꢂ
ꢂ
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.
Zꢂ
1ꢂ
Green Color Bin Table
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 15ꢃ.
Binꢀ
MinꢀDomꢀ
MaxꢀDomꢀ
Xminꢀ
Yminꢀ
Xmaxꢀ
0.1856ꢂ
0.1060ꢂ
0.ꢀ068ꢂ
0.1ꢁ87ꢂ
0.ꢀꢀ7ꢁꢂ
0.170ꢀꢂ
0.ꢀ469ꢂ
0.ꢀ00ꢁꢂ
0.ꢀ659ꢂ
0.ꢀꢀ96ꢂ
Ymax
1ꢂ
ꢂ
5ꢀ0.0ꢂ
5ꢀ4.0ꢂ
0.074ꢁꢂ
0.1650ꢂ
0.1060ꢂ
0.1856ꢂ
0.1ꢁ87ꢂ
0.ꢀ068ꢂ
0.170ꢀꢂ
0.ꢀꢀ7ꢁꢂ
0.ꢀ00ꢁꢂ
0.ꢀ469ꢂ
0.8ꢁꢁ8ꢂ
0.6586ꢂ
0.8ꢀ9ꢀꢂ
0.6556ꢂ
0.8148ꢂ
0.646ꢁꢂ
0.7965ꢂ
0.6ꢁ44ꢂ
0.7764ꢂ
0.6ꢀ1ꢁꢂ
0.6556
0.8ꢀ9ꢀ
0.646ꢁ
0.8148
0.6ꢁ44
0.7965
0.6ꢀ1ꢁ
0.7764
0.6070
0.754ꢁ
ꢂ
ꢂ
ꢀꢂ
ꢂ
5ꢀ4.0ꢂ
5ꢀ8.0ꢂ
ꢂ
ꢂ
ꢁꢂ
ꢂ
5ꢀ8.0ꢂ
5ꢁꢀ.0ꢂ
ꢂ
ꢂ
4ꢂ
ꢂ
5ꢁꢀ.0ꢂ
5ꢁ6.0ꢂ
ꢂ
ꢂ
5ꢂ
ꢂ
5ꢁ6.0ꢂ
ꢂ
540.0ꢂ
ꢂ
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.
Cyan Color Bin Table
Binꢀ
MinꢀDomꢀ
MaxꢀDomꢀ
Xminꢀ
Yminꢀ
Xmaxꢀ
0.1164ꢂ
0.0ꢀꢁ5ꢂ
0.1057ꢂ
0.008ꢀꢂ
0.10ꢀ7ꢂ
0.00ꢁ9ꢂ
0.1097ꢂ
0.01ꢁ9ꢂ
0.10ꢀ8ꢂ
0.0040ꢂ
0.1056ꢂ
0.0080ꢂ
Ymax
1ꢂ
ꢂ
490.0ꢂ
495.0ꢂ
0.0454ꢂ
0.1ꢁ18ꢂ
0.0ꢁ45ꢂ
0.1164ꢂ
0.008ꢀꢂ
0.1057ꢂ
0.00ꢁ9ꢂ
0.10ꢀ7ꢂ
0.01ꢁꢀꢂ
0.109ꢀꢂ
0.0040ꢂ
0.10ꢀ8ꢂ
0.ꢀ945ꢂ
0.ꢁ06ꢂ
0.ꢁ889
0.41ꢀ7
0.4769
0.5ꢁ84
0.5584
0.6548
0.6ꢀ51
0.750ꢀ
0.5ꢀ7ꢁ
0.6104
0.6007
0.715ꢁ
ꢂ
ꢂ
ꢀꢂ
ꢂ
495.0ꢂ
500.0ꢂ
0.41ꢀ7ꢂ
0.ꢁ889ꢂ
0.5ꢁ84ꢂ
0.4769ꢂ
0.6548ꢂ
0.5584ꢂ
0.488ꢀꢂ
0.4417ꢂ
0.6104ꢂ
0.5ꢀ7ꢁꢂ
ꢂ
ꢂ
ꢁꢂ
ꢂ
500.0ꢂ
505.0ꢂ
ꢂ
ꢂ
4ꢂ
ꢂ
505.0ꢂ
510.0ꢂ
ꢂ
ꢂ
7ꢂ
ꢂ
498.0ꢂ
50ꢁ.0ꢂ
ꢂ
ꢂ
8ꢂ
ꢂ
50ꢁ.0ꢂ
ꢂ
508.0ꢂ
ꢂ
Toleranceꢂforꢂeachꢂbinꢂlimitꢂisꢂ 0.5ꢂnm.
8
Avago Technologies LED Configuration
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress in-
duced into the LED package. Otherwise, cut the leads
to applicable length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress, due to lead cutting, from traveling
to the LED chip die attach and wirebond.
ANODE
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
InGaN Device
Note:Electrical connection between bottom surface of LED die and the lead frame material
through conductive paste of solder.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59 mm.Soldering the LED closer than 1.59 mm might
damage the LED.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
1.59ꢀmm
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
ꢀ
ꢀ
ManualꢀSolderꢀꢀ
LEDꢀComponentꢀꢀ
LeadꢀSizeꢀ
ꢀ
PlatedꢀThroughꢀꢀꢀ
HoleꢀDiameter
ꢀ
WaveꢀSolderingꢀ Dipping
Pre-heatꢂTemperatureꢂ 105ꢂ°CꢂMax.ꢂ
–
–
Diagonalꢀ
0.646ꢂmmꢂ
(0.0ꢀ5ꢂinch)ꢂ
0.718ꢂmmꢂ
(0.0ꢀ8ꢂinch)ꢂ
Pre-heatꢂTimeꢂ
PeakꢂTemperatureꢂ
DwellꢂTimeꢂ
ꢁ0ꢂsecꢂMax.ꢂ
ꢀ50ꢂ°CꢂMax.ꢂ
ꢁꢂsecꢂMax.ꢂ
0.457ꢂxꢂ0.457ꢂmmꢂ
(0.018ꢂxꢂ0.018ꢂinch)ꢂ
0.508ꢂxꢂ0.508ꢂmmꢂ
(0.0ꢀ0ꢂxꢂ0.0ꢀ0ꢂinch)ꢂ
0.976ꢂtoꢂ1.078ꢂmmꢂ
(0.0ꢁ8ꢂtoꢂ0.04ꢀꢂinch)
1.049ꢂtoꢂ1.150ꢂmm
(0.041ꢂtoꢂ0.045ꢂinch)
ꢀ60ꢂ°CꢂMax.
5ꢂsecꢂMax.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile is always conforming to recommended
soldering condition.
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion.Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
ꢀ
Notes:
Note: Refer to application note AN1027 for more information on soldering LED
components.
1. PCB with different size and design (component density) will have different heat
mass (heat capacity). This might cause a change in temperature experienced by the
board if samewave soldering setting is used. So, it is recommended to recalibrate
the soldering profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single
wire bond, as shown below. Customer is advised to take extra precaution during
wave soldering to ensure that the maximum wave temperature does not exceed 250°C.
Over-stressing the LED during soldering process might cause premature failure to the
LED due to delamination.
9
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
150
FLUXING
100
SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Ammo Packs Drawing
6.35ꢀ±ꢀ1.30
(0.25ꢀ±ꢀ0.0512)
12.70ꢀ±ꢀ1.00
(0.50ꢀ±ꢀ0.0394)
CATHODE
20.50ꢀ±ꢀ1.00
(0.807ꢀ±ꢀ0.039)
9.125ꢀ±ꢀ0.625
(0.3593ꢀ±ꢀ0.0246)
18.00ꢀ±ꢀ0.50
(0.7087ꢀ±ꢀ0.0197)
A
A
4.00ꢀ±ꢀ0.20
(0.1575ꢀ±ꢀ0.008)
12.70ꢀ±ꢀ0.30
(0.50ꢀ±ꢀ0.0118)
∅
TYP.
VIEWꢀA–A
0.70ꢀ±ꢀ0.20
(0.0276ꢀ±ꢀ0.0079)
ALLꢀDIMENSIONSꢀINꢀMILLIMETERSꢀ(INCHES).
NOTE:ꢀTHEꢀAMMO-PACKSꢀDRAWINGꢀISꢀAPPLICABLEꢀFORꢀPACKAGINGꢀOPTIONꢀ-DDꢀ&ꢀ-ZZꢀANDꢀREGARDLESSꢀOFꢀSTANDOFFꢀORꢀNON-STANDOFF.
10
Packaging Box for Ammo Packs
LABELꢀON
THISꢀSIDE
OFꢀBOX.
FROMꢀLEFTꢀSIDEꢀOFꢀBOX,
ADHESIVEꢀTAPEꢀMUSTꢀBE
FACINGꢀUPWARD.
+
A
AVAGO
TECHNOLOGIES
ANODE
E
–
CATHOD
ANODEꢀLEADꢀLEAVES
THEꢀBOXꢀFIRST.
C
MOTHERꢀLABEL
NOTE:ꢀ
FORꢀInGaNꢀDEVICE,ꢀTHEꢀAMMOꢀPACKꢀPACKAGINGꢀBOXꢀCONTAINSꢀESDꢀLOGO.
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change.Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4115EN
AV02-0367EN March 6, 2008
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