HLMP-CW23 [AVAGO]
T-13/4 Precision Optical Performance White LED Lamps; T- 13/4精密光学性能的白光LED灯
| 型号： | HLMP-CW23 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-13/4 Precision Optical Performance White LED Lamps |
| 文件： | 总11页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CWxx
3
T-1 / PrecisionOpticalPerformance
4
White LED Lamps
DataSheet
HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24,
HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72
Description
Features
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated by
a phosphor to produce white. The typical resulting color
is described by the coordinates x = 0.32, y = 0.32 using
the 1931 CIE Chromaticity Diagram.
• Highly luminous white emission
• 15°, 23°, 30°, and 70°viewing angle
Applications
• Electronic signs and signals
• Small area illumination
• Legend backlighting
• General purpose indicators
3⁄
These T-1 4 lamps are untinted, nondiffused, and
incorporatepreciseopticsproducingwelldefinedspatial
radiation patterns at specific viewing cone angle.
Benefit
• Reduced power consumption, higher reliability, and
increased optical/mechanical design flexibility
compared to incandescent bulbs and other alternative
white light sources
CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling
and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Min. Luminous Intensity
Iv (mcd) @ 20 mA
Viewing Angle
Typ.
Part Number
Min.
2500
2500
3200
4200
4200
4200
4200
4200
1500
2500
4200
1900
1900
2500
1900
2500
880
Max.
7200
7200
5500
7200
12000
12000
12000
12000
-
Standoff Leads
No
Package Dimension
HLMP-CW15-TW0xx
HLMP-CW15-TW0xx
HLMP-CW15-UV0xx
HLMP-CW15-VWBxx
HLMP-CW15-VY0xx
HLMP-CW15-VYBxx
HLMP-CW15-VYGxx
HLMP-CW15-VYKxx
HLMP-CW16-R00xx
HLMP-CW16-TW0xx
HLMP-CW16-VY0xx
HLMP-CW23-SV0xx
HLMP-CW23-SVKxx
HLMP-CW23-TW0xx
HLMP-CW24-SV0xx
HLMP-CW24-TW0xx
HLMP-CW30-PS0xx
HLMP-CW30-RU0xx
HLMP-CW30-STBxx
HLMP-CW30-SV0xx
HLMP-CW31-M00xx
HLMP-CW31-PS0xx
HLMP-CW31-SV0xx
HLMP-CW70-LMBxx
HLMP-CW70-LP0xx
HLMP-CW72-LP0xx
15°
15°
15°
15°
15°
15°
15°
15°
15°
15°
15°
23°
23°
23°
23°
23°
30°
30°
30°
30°
30°
30°
30°
70º
70º
70º
A
A
A
A
A
A
A
A
B
B
B
A
A
A
B
B
A
A
A
A
B
B
B
A
A
B
No
No
No
No
No
No
No
Yes
Yes
Yes
No
7200
12000
5500
5500
7200
5500
7200
2500
4200
3200
5500
-
No
No
Yes
Yes
No
1500
1900
1900
520
No
No
No
Yes
Yes
Yes
No
880
2500
5500
680
1900
400
400
1150
1150
No
400
Yes
Tolerance for each intensity limit is ±15%.
2
5.00 ± 0.20
(0.197 ± 0.008)
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
31.60
(1.244)
MIN.
31.60
MIN.
0.70 (0.028)
(1.244)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
1.00
MIN.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
(0.039)
1.00
MIN.
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
2.54 ± 0.38
(0.100 ± 0.015)
PACKAGE DIMENSION A
PACKAGE DIMENSION B
NOTES:
HLMP-CW16
HLMP-CW24
HLMP-CW31
HLMP-CW72
d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25 d = 12.52 ± 0.25
(0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) (0.493 ± 0.010)
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
3
Part Numbering System
HLMP – CWxx - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Option
0: Full color bin distribution
B: Color bins 2 & 3
G: Color bins 2, 3 & 4
K: Color bins 2 & 4
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle and Standoff Option
15: 15°without standoffs
16: 15°with standoffs
23: 23°without standoffs
24: 23°with standoffs
30: 30°without standoffs
31: 30°with standoffs
70: 50°without standoffs
72: 50°with standoffs
4
Absolute Maximum Ratings
T = 25˚C
A
Parameter
Value
Units
mA
mA
mW
V
[1]
DC Forward Current
30
[2]
Peak Forward Current
Power Dissipation
100
111
Reverse Voltage (I = 10 µA)
5
R
o
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
110
C
o
–40 to +80
–40 to +100
C
o
C
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty factor 10%, 1 kHz.
ElectricalCharacteristics
T = 25°C
A
Forward Voltage,
V (V) @ I = 20 mA
Reverse Breakdown,
Capacitance, C (pF),
V = 0, f = 1 MHz
F
Thermal Resistance
Rθ (°C/W)
V (V) @ I = 10 µA
F
F
R
R
J-PIN
Typ.
Max.
Min.
Typ.
Typ.
3.2
3.7
5
70
240
Optical Characteristics
T = 25°C
A
Typical Chromaticity
Coordinates
Viewing Angle
[1]
[2]
2θ Degrees
1/2
Part Number
X
Y
Typ.
HLMP-CW3x-xxxxx
HLMP-CW2x-xxxxx
HLMP-CW1x-xxxxx
HLMP-CW7x-xxxxx
Notes:
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
30
23
15
50
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
1
2. θ is the off-axis angle where the luminous intensity is ⁄ the peak intensity.
1/2
2
5
1.0
0.8
0.6
0.4
0.2
0
35
30
25
20
15
10
1.5
1.2
0.9
0.6
0.3
0
5
0
380
480
580
680
780
0
1
2
3
4
0
10
20
30
FORWARD VOLTAGE – V
FORWARD CURRENT – mA
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength
Figure 2. Forward current vs. forward voltage
Figure 3. Relative lv vs. forward current
35
30
25
20
15
10
0.025
0.020
1 mA
0.015
5 mA
10 mA
0.010
0.005
0
15 mA
20 mA
25 mA
5
0
-0.005
-0.010
30 mA
0
20
40
60
80
100
-0.004
-0.002
0
0.002
0.004
X-COORDINATES
T – AMBIENT TEMPERATURE – °C
A
(X,Y) VALUES @ 20 mA REFERENCE TO (0,0)
Figure 4. Chromaticity shift vs. current
Figure 5. Maximum forward current vs. temperature
1
0.5
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6a. CW1x spatial radiation pattern
6
1
0.5
0
-90
-60
-30
0
30
60
60
60
90
90
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6b. CW2x spatial radiation pattern
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW3x spatial radiation pattern
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW7x spatial radiation pattern
7
IntensityBinLimits
(mcd at 20 mA)
Color Bin Limit Table
Rank
Limits (Chromaticity Coordinates)
Bin
L
Min.
400
Max.
520
1
x
y
0.330
0.360
0.330
0.318
0.356
0.351
0.361
0.385
M
N
P
520
680
2
3
4
x
y
0.287
0.295
0.296
0.276
0.330
0.318
0.330
0.339
680
880
x
y
0.264
0.267
0.280
0.248
0.296
0.276
0.283
0.305
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
Q
R
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
x
y
0.283
0.305
0.287
0.295
0.330
0.339
0.330
0.360
S
Tolerance for each bin limit is ± 0.01.
T
Note:
Bin categories are established for classification of products. Products may not be available in all bin
categories. Please contact your Avago representative for information on currently available bins.
U
V
W
X
Color Bin Limits with Respect to CIE
1931 Chromaticity Diagram
Y
Z
0.40
Tolerance for each bin limit is ± 15%.
0.35
1
4
BLACK
BODY
CURVE
2
0.30
0.25
0.20
3
0.26
0.30
0.34
0.38
X-COORDINATE
Relative Light Output vs. Junction Temperature
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
80
100
120
T
– JUNCTION TEMPERATURE – °C
J
8
2. Avago Technologies' high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is
advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature is not exceeding 250°C.
Overstressing the LED during soldering process might cause
premature failure to the LED due to delamination.
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced into the LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
Avago Technologies LED Configuration
• For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
CATHODE
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
InGaN Device
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is 1.59 mm.
SolderingtheLEDcloserthan1.59mmmightdamagethe
LED.
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
1.59 mm
• If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
• Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
260 °C Max.
5 sec Max.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
checkonthesolderingprofiletoensurethatthesoldering
profile is always conforming to recommended soldering
condition.
Diagonal
0.457 x 0.457 mm
0.646 mm
0.976 to 1.078 mm
(0.038 to 0.042 inch)
(0.018 x 0.018 inch) (0.025 inch)
0.508 x 0.508 mm 0.718 mm
(0.020 x 0.020 inch) (0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Notes:
• Over sizing of plated through hole can lead to twisting or
improper LED placement during auto insertion. Under
sizing plated through hole can lead to mechanical stress
on the epoxy lens during clinching.
1. PCB with different size and design (component density) will have
different head mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to recalibrate the soldering
profile again before loading a new type of PCB.
Note: Refer to Application Note AN1027 for more information on
soldering LED components.
9
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TOP SIDE
OF PC BOARD
200
BOTTOM SIDE
OF PC BOARD
150
FLUXING
CONVEYOR SPEED = 1.83 M/ MIN (6 FT/ MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
100
LEAD SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
A
4.00 ± 0.20
(0.1575 ± 0.008)
12.70 ± 0.30
(0.50 ± 0.0118)
TYP.
VIEW A–A
0.70 ± 0.20
(0.0276 ± 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
Packaging Box Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
+
A
C
AVAGO
TECHNOLOGIES
ANODE
–
CATHODE
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
O
M
Note: For InGaN device, the ammo pack
packaging box contains ESD logo.
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4125EN
AV02-0214EN April 2, 2007
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