HLMP-CW37-UV000 [AVAGO]

T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2;
HLMP-CW37-UV000
型号: HLMP-CW37-UV000
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2

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中文:  中文翻译
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HLMP - CWxx  
T-1 ¾ (5mm) Extra Bright Precision Optical Performance  
White LED Lamps  
Data Sheet  
HLMP-CW11, HLMP-CW12, HLMP-CW26,  
HLMP-CW27, HLMP-CW36, HLMP-CW37  
Description  
Features  
These high intensity white LED lamps are based on In-  
GaN material technology. A blue LED die is coated by  
phosphor to produce white. The typical resulting color is  
described by the coordinates x = 0.31, y = 0.31 using the  
1931 CIE Chromaticity Diagram.  
Well defined spatial radiation pattern  
High luminous white emission  
Viewing angle: 15°, 23° and 30°  
Standoff or non-standoff leads  
Superior resistance to moisture  
These T-1 ¾ lamps are untinted, non-diffused, and incor-  
porate precise optics which produce well-defined spatial  
radiation patterns at specific viewing cone angle.  
Applications  
Electronic signs and signals  
Small area illumination  
Legend backlighting  
General purpose indicators  
Benefit  
Reduced power consumption, higher reliability, and  
increased optical/mechanical design flexibility  
compared to incandescent bulbs and other  
alternative white light sources.  
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and pro-  
cessing. Refer to Application Note AN-1142 for additional details.  
Package Dimensions  
Package Dimension A  
Package Dimension B  
5.ꢀꢀ ꢀ.ꢁꢀ  
(ꢀ.197 ꢀ.ꢀꢀ08  
5.ꢀꢀ ꢀ.ꢁꢀ  
(ꢀ.197 ꢀ.ꢀꢀ08  
1.14 ꢀ.ꢁꢀ  
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08  
0.71 ꢀ.ꢁꢀ  
(ꢀ.343 ꢀ.ꢀꢀ08  
0.71 ꢀ.ꢁꢀ  
(ꢀ.343 ꢀ.ꢀꢀ08  
DIMENSION H  
ꢁ.35 (ꢀ.ꢀ938  
MAX.  
1.14 ꢀ.ꢁꢀ  
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08  
ꢀ.7ꢀ (ꢀ.ꢀꢁ08  
MAX.  
31.6ꢀ  
(1.ꢁ448  
MIN.  
1.5ꢀ ꢀ.15  
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68  
31.6ꢀ  
(1.ꢁ448  
MIN.  
ꢀ.7ꢀ (ꢀ.ꢀꢁ08  
CATHODE  
LEAD  
MAX.  
CATHODE  
LEAD  
ꢀ.5ꢀ ꢀ.1ꢀ  
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48  
SQ. TYP.  
1.ꢀꢀ  
(ꢀ.ꢀ398  
MIN.  
ꢀ.5ꢀ ꢀ.1ꢀ  
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48  
SQ. TYP.  
1.ꢀꢀ  
(ꢀ.ꢀ398  
MIN.  
5.0ꢀ ꢀ.ꢁꢀ  
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08  
CATHODE  
FLAT  
5.0ꢀ ꢀ.ꢁꢀ  
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08  
ꢁ.54 ꢀ.30  
(ꢀ.1ꢀꢀ ꢀ.ꢀ158  
CATHODE  
FLAT  
ꢁ.54 ꢀ.30  
(ꢀ.1ꢀꢀ ꢀ.ꢀ158  
Part Numbering System  
H L M P - CW XX - X X X XX  
Mechanical Option  
ꢀꢀ: Bulk  
DD: Ammo Pack Straight Leads  
Color Bin Options  
ꢀ: Full color bin distribution  
B: Color bin ꢁ & 3 only  
Maximum Intensity Bin  
ꢀ: No maximum intensity bin limit  
Others: Refer to Device Selection Guide  
Minimum Intensity Bin  
Refer to Device Selection Guide  
Viewing Angle and Standoff Option  
11: 15˚ without standoff  
1ꢁ: 15˚ with standoff  
ꢁ6: ꢁ3˚ without standoff  
ꢁ7: ꢁ3˚ with standoff  
36: 3ꢀ˚ without standoff  
37: 3ꢀ˚ with standoff  
Device Selection Guide  
Part Number  
Typical Viewing Angle, Intensity (mcd) at 20 mA Standoff Package Dimension  
2θ ½ (Degree)  
Min.  
5500  
7200  
7200  
9300  
5500  
7200  
7200  
7200  
9300  
9300  
3200  
4200  
4200  
5500  
3200  
3200  
4200  
4200  
5500  
2500  
3200  
3200  
4200  
4200  
2500  
3200  
3200  
4200  
4200  
Max.  
16000  
21000  
12000  
16000  
16000  
21000  
12000  
12000  
16000  
16000  
9300  
HLMP-CW11-WZ0xx  
HLMP-CW11-X10xx  
HLMP-CW11-XY0xx  
HLMP-CW11-YZ0xx  
HLMP-CW12-WZ0xx  
HLMP-CW12-X10xx  
HLMP-CW12-XY0xx  
HLMP-CW12-XYBxx  
HLMP-CW12-YZ0xx  
HLMP-CW12-YZBxx  
HLMP-CW26-UX0xx  
HLMP-CW26-VW0xx  
HLMP-CW26-VY0xx  
HLMP-CW26-WX0xx  
HLMP-CW27-UX0xx  
HLMP-CW27-UX2xx  
HLMP-CW27-VW0xx  
HLMP-CW27-VY0xx  
HLMP-CW27-WX0xx  
HLMP-CW36-TW0xx  
HLMP-CW36-UV0xx  
HLMP-CW36-UVBxx  
HLMP-CW36-VW0xx  
HLMP-CW36-VWBxx  
HLMP-CW37-TW0xx  
HLMP-CW37-UV0xx  
HLMP-CW37-UVBxx  
HLMP-CW37-VW0xx  
HLMP-CW37-VWBxx  
Notes:  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
23  
23  
23  
23  
23  
23  
23  
23  
23  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
No  
No  
No  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
No  
No  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
No  
No  
No  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
A
A
A
A
B
B
B
B
B
B
A
A
A
A
B
7200  
12000  
9300  
9300  
9300  
B
7200  
B
12000  
9300  
7200  
B
B
A
A
A
A
A
B
5500  
5500  
7200  
7200  
7200  
5500  
B
5500  
B
7200  
7200  
B
B
1. Tolerance for luminous intensity measurement is +/- 15%  
2. The luminous intensity is measured on the mechanical axis of the lamp package.  
3. The optical axis is closely aligned with the package mechanical axis.  
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without  
proper safety equipment.  
5. 2θ½ is the off-axis angle where the luminous intensity is ½ the on axis intensity.  
6. Part numbers in BOLD are recommended for new designs.  
Absolute Maximum Rating at TA = 25 °C  
Parameters  
DC forward current[1]  
Peak pulsed forward current[2]  
Value  
30  
Unit  
mA  
mA  
mW  
°C  
100  
Power dissipation  
105  
LED junction temperature  
Operating temperature range  
Storage temperature range  
110  
-40 to +85  
-40 to +100  
°C  
°C  
Notes:  
1. Derate linearly as shown in figure 2.  
2. Duty factor 10%, frequency 1KHz  
Electrical / Optical Characteristics TA = 25 °C  
Parameters  
Symbol Min  
Typ  
Max  
Units  
Test Condition  
Forward voltage  
VF  
3.2  
4.0  
V
IF = 20 mA  
Reverse Voltage [1]  
VR  
5.0  
V
IR = 10 mA  
Thermal resistance  
Chromaticity Coordinates [2]  
RθJ-PIN  
240  
0.31  
0.31  
70  
°C/W  
LED Junction to anode lead  
IF = 20 mA  
X
Y
C
Capacitance  
VF=0, f=1MHz  
Notes:  
1. The reverse voltage of the product is equivalent to the forward  
voltage of the protective chip at IR = 10 µA  
2. The chromaticity coordinates are derived from the CIE 1931  
Chromaticity Diagram and represent the perceived color of the  
device.  
1.ꢀ  
35  
3ꢀ  
ꢁ5  
ꢁꢀ  
15  
1ꢀ  
5
1.5  
1.ꢁ  
ꢀ.9  
ꢀ.6  
ꢀ.3  
ꢀ.0  
ꢀ.6  
ꢀ.4  
ꢀ.ꢁ  
ꢀ.ꢀ  
Rθ  
J-A  
= 505˚C/W  
Rθ  
= 70ꢀ˚C/W  
J-A  
30ꢀ  
40ꢀ  
50ꢀ  
60ꢀ  
70ꢀ  
1ꢀ  
ꢁꢀ  
3ꢀ  
1ꢀꢀ  
ꢁꢀ  
4ꢀ  
6ꢀ  
0ꢀ  
WAVELENGTH - nm  
FORWARD CURRENT - mA  
AMBIENT TEMPERATURE - ˚C  
Figure 2. Forward Current vs. Ambient  
Temperature  
Figure 3. Relative Intensity vs. DC Forward  
Current  
Figure 1. Relative intensity vs. Wavelength  
ꢀ.ꢀꢁ5  
ꢀ.ꢀꢁꢀ  
ꢀ.ꢀ15  
ꢀ.ꢀ1ꢀ  
ꢀ.ꢀꢀ5  
ꢀ.ꢀꢀꢀ  
-ꢀ.ꢀꢀ5  
-ꢀ.ꢀ1ꢀ  
3ꢀ  
ꢁ5  
ꢁꢀ  
15  
1mA  
5mA  
1ꢀmA  
1ꢀ  
5
ꢁꢀmA  
3ꢀmA  
-ꢀ.ꢀꢀ5 ꢀ.ꢀꢀꢀ  
ꢁ.ꢀ ꢁ.ꢁ ꢁ.4 ꢁ.6 ꢁ.0 3.ꢀ 3.ꢁ 3.4 3.6  
VF - FORWARD VOLTAGE - VOLTS  
ꢀ.ꢀꢀ5  
ꢀ.ꢀ1ꢀ ꢀ.ꢀ15  
X-COORDINATES  
Figure 5. Forward Current vs. Forward Voltage  
Figure 4. Chromaticity shift vs. Current  
*Note: (x,y) values @ 20mA reference to (0,0)  
1
ꢀ.5  
-9ꢀ  
-6ꢀ  
-3ꢀ  
3ꢀ  
6ꢀ  
9ꢀ  
ANGULAR DISPLACEMENT (˚8  
Figure 6. Spatial Radiation Pattern for CW1x  
1
ꢀ.5  
-9ꢀ  
-6ꢀ  
-3ꢀ  
3ꢀ  
6ꢀ  
9ꢀ  
ANGULAR DISPLACEMENT (˚8  
Figure 7. Spatial Radiation Pattern for CW2x  
1
ꢀ.5  
-9ꢀ  
-6ꢀ  
-3ꢀ  
ANGULAR DISPLACEMENT (˚8  
Figure 8. Spatial Radiation Pattern for CW3x  
3ꢀ  
6ꢀ  
9ꢀ  
Intensity Bin Limit Table  
Color Bin Limit Table  
Bin  
Intensity (mcd) at 20 mA  
Rank  
Limits (Chromaticity Coordinates)  
Min  
Max  
1
X
Y
X
Y
X
Y
X
Y
0.330  
0.360  
0.287  
0.295  
0.264  
0.267  
0.283  
0.305  
0.330  
0.318  
0.296  
0.276  
0.280  
0.248  
0.287  
0.295  
0.356  
0.351  
0.330  
0.318  
0.296  
0.276  
0.330  
0.339  
0.361  
0.385  
0.330  
0.339  
0.283  
0.305  
0.330  
0.360  
Q
R
S
1150  
1500  
1900  
2500  
3200  
4200  
5500  
7200  
9300  
12000  
16000  
1500  
1900  
2500  
3200  
4200  
5500  
7200  
9300  
12000  
16000  
21000  
2
3
4
T
U
V
W
X
Y
Z
1
Tolerance for each bin limit is 0.01  
Note:  
1. Bin categories are established for classification of products. Products  
may not be available in all bin categories. Please contact your  
Avago Technologies representative for information on currently  
available bins.  
Tolerance for each bin limit is 15%  
Color Bin Limits with Respect to CIE 1931  
Chromaticity Diagram  
ꢀ.4ꢀ  
ꢀ.35  
1
4
BLACK  
BODY  
CURVE  
ꢀ.3ꢀ  
3
ꢀ.ꢁ5  
ꢀ.ꢁꢀ  
ꢀ.ꢁ6  
ꢀ.3ꢀ  
ꢀ.34  
ꢀ.30  
X-COORDINATE  
Precautions:  
Lead Forming:  
The leads of an LED lamp may be preformed or cut to  
If necessary, use fixture to hold the LED component  
in proper orientation with respect to the PCB during  
soldering process.  
length prior to insertion and soldering into PC board.  
If lead forming is required before soldering, care  
must be taken to avoid any excessive mechanical  
stress induced to LED package. Otherwise, cut the  
leads of LED to length after soldering process at room  
temperature. The solder joint formed will absorb the  
mechanical stress of the lead cutting from traveling  
to the LED chip die attach and wirebond.  
Proper handling is imperative to avoid excessive  
thermal stresses to LED components when heated.  
Therefore, the soldered PCB must be allowed to cool  
to room temperature, 25°C before handling.  
Special attention must be given to board fabrication,  
solder masking, surface plating and lead holes size  
and component orientation to assure solderability.  
Recommended PC board plated through holes size  
for LED component leads.  
It is recommended that tooling made to precisely  
form and cut the leads to length rather than rely  
upon hand operation.  
LED component  
Diagonal  
Plated through  
hole diameter  
0.976 to 1.078 mm  
(0.038 to 0.042 inch)  
Soldering Condition:  
ead size  
Care must be taken during PCB assembly and  
soldering process to prevent damage to LED  
component.  
The closest LED is allowed to solder on board is  
1.59mm below the body (encapsulant epoxy) for  
those parts without standoff.  
0.457 x 0.457mm  
(0.018 x 0.018inch)  
0.646 mm  
(0.025 inch)  
0.508 x 0.508mm  
(0.020 x 0.020inch)  
0.718 mm  
(0.028 inch)  
1.049 to 1.150mm  
(0.041 to 0.045 inch)  
Note: Refer to application note AN1027 for more information on  
Recommended soldering condition:  
soldering LED components.  
Wave Soldering Manual Solder  
Dipping  
Pre-heat  
temperature  
105 °C Max.  
-
Preheat time  
30 sec Max  
-
Peak temperature 250 °C Max.  
Dwell time 3 sec Max.  
260 °C Max.  
5 sec Max  
Recommended Wave Soldering Profile  
LAMINAR WAVE  
HOT AIR KNIFE  
TURBULENT WAVE  
ꢁ5ꢀ  
ꢁꢀꢀ  
15ꢀ  
BOTTOM SIDE  
OF PC BOARD  
TOP SIDE OF  
PC BOARD  
FLUXING  
CONVEYOR SPEED = 1.03 M/MIN (6 FT/MIN8  
PREHEAT SETTING = 15ꢀ C (1ꢀꢀ C PCB8  
SOLDER WAVE TEMPERATURE = ꢁ45 C  
AIR KNIFE AIR TEMPERATURE = 39ꢀ C  
AIR KNIFE DISTANCE = 1.91 mm (ꢀ.ꢁ5 IN.8  
AIR KNIFE ANGLE = 4ꢀ  
1ꢀꢀ  
SOLDER: SN63; FLUX: RMA  
5ꢀ  
3ꢀ  
NOTE: ALLOW FOR BOARDS TO BE  
SUFFICIENTLY COOLED BEFORE  
EXERTING MECHANICAL FORCE.  
PREHEAT  
1ꢀ  
ꢁꢀ  
3ꢀ  
4ꢀ  
5ꢀ  
6ꢀ  
7ꢀ  
0ꢀ  
9ꢀ  
1ꢀꢀ  
TIME - SECONDS  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.  
5989-4117EN - April 19, 2006  

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