HLMP-CW37-UV000 [AVAGO]
T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2;![HLMP-CW37-UV000](http://pdffile.icpdf.com/pdf2/p00235/img/icpdf/HLMP-CW26-UX_1376150_icpdf.jpg)
型号: | HLMP-CW37-UV000 |
厂家: | ![]() |
描述: | T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY WHITE, 5mm, PLASTIC PACKAGE-2 |
文件: | 总8页 (文件大小:140K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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HLMP - CWxx
T-1 ¾ (5mm) Extra Bright Precision Optical Performance
White LED Lamps
Data Sheet
HLMP-CW11, HLMP-CW12, HLMP-CW26,
HLMP-CW27, HLMP-CW36, HLMP-CW37
Description
Features
These high intensity white LED lamps are based on In-
GaN material technology. A blue LED die is coated by
phosphor to produce white. The typical resulting color is
described by the coordinates x = 0.31, y = 0.31 using the
1931 CIE Chromaticity Diagram.
• Well defined spatial radiation pattern
• High luminous white emission
• Viewing angle: 15°, 23° and 30°
• Standoff or non-standoff leads
• Superior resistance to moisture
These T-1 ¾ lamps are untinted, non-diffused, and incor-
porate precise optics which produce well-defined spatial
radiation patterns at specific viewing cone angle.
Applications
• Electronic signs and signals
• Small area illumination
• Legend backlighting
• General purpose indicators
Benefit
• Reduced power consumption, higher reliability, and
increased optical/mechanical design flexibility
compared to incandescent bulbs and other
alternative white light sources.
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and pro-
cessing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Dimension A
Package Dimension B
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
DIMENSION H
ꢁ.35 (ꢀ.ꢀ938
MAX.
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
31.6ꢀ
(1.ꢁ448
MIN.
1.5ꢀ ꢀ.15
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68
31.6ꢀ
(1.ꢁ448
MIN.
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
CATHODE
LEAD
MAX.
CATHODE
LEAD
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
1.ꢀꢀ
(ꢀ.ꢀ398
MIN.
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
1.ꢀꢀ
(ꢀ.ꢀ398
MIN.
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
CATHODE
FLAT
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
CATHODE
FLAT
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
Part Numbering System
H L M P - CW XX - X X X XX
Mechanical Option
ꢀꢀ: Bulk
DD: Ammo Pack Straight Leads
Color Bin Options
ꢀ: Full color bin distribution
B: Color bin ꢁ & 3 only
Maximum Intensity Bin
ꢀ: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Option
11: 15˚ without standoff
1ꢁ: 15˚ with standoff
ꢁ6: ꢁ3˚ without standoff
ꢁ7: ꢁ3˚ with standoff
36: 3ꢀ˚ without standoff
37: 3ꢀ˚ with standoff
Device Selection Guide
Part Number
Typical Viewing Angle, Intensity (mcd) at 20 mA Standoff Package Dimension
2θ ½ (Degree)
Min.
5500
7200
7200
9300
5500
7200
7200
7200
9300
9300
3200
4200
4200
5500
3200
3200
4200
4200
5500
2500
3200
3200
4200
4200
2500
3200
3200
4200
4200
Max.
16000
21000
12000
16000
16000
21000
12000
12000
16000
16000
9300
HLMP-CW11-WZ0xx
HLMP-CW11-X10xx
HLMP-CW11-XY0xx
HLMP-CW11-YZ0xx
HLMP-CW12-WZ0xx
HLMP-CW12-X10xx
HLMP-CW12-XY0xx
HLMP-CW12-XYBxx
HLMP-CW12-YZ0xx
HLMP-CW12-YZBxx
HLMP-CW26-UX0xx
HLMP-CW26-VW0xx
HLMP-CW26-VY0xx
HLMP-CW26-WX0xx
HLMP-CW27-UX0xx
HLMP-CW27-UX2xx
HLMP-CW27-VW0xx
HLMP-CW27-VY0xx
HLMP-CW27-WX0xx
HLMP-CW36-TW0xx
HLMP-CW36-UV0xx
HLMP-CW36-UVBxx
HLMP-CW36-VW0xx
HLMP-CW36-VWBxx
HLMP-CW37-TW0xx
HLMP-CW37-UV0xx
HLMP-CW37-UVBxx
HLMP-CW37-VW0xx
HLMP-CW37-VWBxx
Notes:
15
15
15
15
15
15
15
15
15
15
23
23
23
23
23
23
23
23
23
30
30
30
30
30
30
30
30
30
30
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
A
A
A
A
B
B
B
B
B
B
A
A
A
A
B
7200
12000
9300
9300
9300
B
7200
B
12000
9300
7200
B
B
A
A
A
A
A
B
5500
5500
7200
7200
7200
5500
B
5500
B
7200
7200
B
B
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without
proper safety equipment.
5. 2θ½ is the off-axis angle where the luminous intensity is ½ the on axis intensity.
6. Part numbers in BOLD are recommended for new designs.
Absolute Maximum Rating at TA = 25 °C
Parameters
DC forward current[1]
Peak pulsed forward current[2]
Value
30
Unit
mA
mA
mW
°C
100
Power dissipation
105
LED junction temperature
Operating temperature range
Storage temperature range
110
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in figure 2.
2. Duty factor 10%, frequency 1KHz
Electrical / Optical Characteristics TA = 25 °C
Parameters
Symbol Min
Typ
Max
Units
Test Condition
Forward voltage
VF
3.2
4.0
V
IF = 20 mA
Reverse Voltage [1]
VR
5.0
V
IR = 10 mA
Thermal resistance
Chromaticity Coordinates [2]
RθJ-PIN
240
0.31
0.31
70
°C/W
LED Junction to anode lead
IF = 20 mA
X
Y
C
Capacitance
VF=0, f=1MHz
Notes:
1. The reverse voltage of the product is equivalent to the forward
voltage of the protective chip at IR = 10 µA
2. The chromaticity coordinates are derived from the CIE 1931
Chromaticity Diagram and represent the perceived color of the
device.
1.ꢀ
35
3ꢀ
ꢁ5
ꢁꢀ
15
1ꢀ
5
1.5
1.ꢁ
ꢀ.9
ꢀ.6
ꢀ.3
ꢀ.0
ꢀ.6
ꢀ.4
ꢀ.ꢁ
ꢀ.ꢀ
Rθ
J-A
= 505˚C/W
Rθ
= 70ꢀ˚C/W
J-A
ꢀ
ꢀ
30ꢀ
40ꢀ
50ꢀ
60ꢀ
70ꢀ
ꢀ
1ꢀ
ꢁꢀ
3ꢀ
1ꢀꢀ
ꢀ
ꢁꢀ
4ꢀ
6ꢀ
0ꢀ
WAVELENGTH - nm
FORWARD CURRENT - mA
AMBIENT TEMPERATURE - ˚C
Figure 2. Forward Current vs. Ambient
Temperature
Figure 3. Relative Intensity vs. DC Forward
Current
Figure 1. Relative intensity vs. Wavelength
ꢀ.ꢀꢁ5
ꢀ.ꢀꢁꢀ
ꢀ.ꢀ15
ꢀ.ꢀ1ꢀ
ꢀ.ꢀꢀ5
ꢀ.ꢀꢀꢀ
-ꢀ.ꢀꢀ5
-ꢀ.ꢀ1ꢀ
3ꢀ
ꢁ5
ꢁꢀ
15
1mA
5mA
1ꢀmA
1ꢀ
5
ꢁꢀmA
3ꢀmA
-ꢀ.ꢀꢀ5 ꢀ.ꢀꢀꢀ
ꢀ
ꢁ.ꢀ ꢁ.ꢁ ꢁ.4 ꢁ.6 ꢁ.0 3.ꢀ 3.ꢁ 3.4 3.6
VF - FORWARD VOLTAGE - VOLTS
ꢀ.ꢀꢀ5
ꢀ.ꢀ1ꢀ ꢀ.ꢀ15
X-COORDINATES
Figure 5. Forward Current vs. Forward Voltage
Figure 4. Chromaticity shift vs. Current
*Note: (x,y) values @ 20mA reference to (0,0)
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (˚8
Figure 6. Spatial Radiation Pattern for CW1x
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (˚8
Figure 7. Spatial Radiation Pattern for CW2x
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ANGULAR DISPLACEMENT (˚8
Figure 8. Spatial Radiation Pattern for CW3x
ꢀ
3ꢀ
6ꢀ
9ꢀ
Intensity Bin Limit Table
Color Bin Limit Table
Bin
Intensity (mcd) at 20 mA
Rank
Limits (Chromaticity Coordinates)
Min
Max
1
X
Y
X
Y
X
Y
X
Y
0.330
0.360
0.287
0.295
0.264
0.267
0.283
0.305
0.330
0.318
0.296
0.276
0.280
0.248
0.287
0.295
0.356
0.351
0.330
0.318
0.296
0.276
0.330
0.339
0.361
0.385
0.330
0.339
0.283
0.305
0.330
0.360
Q
R
S
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
2
3
4
T
U
V
W
X
Y
Z
1
Tolerance for each bin limit is 0.01
Note:
1. Bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact your
Avago Technologies representative for information on currently
available bins.
Tolerance for each bin limit is 15%
Color Bin Limits with Respect to CIE 1931
Chromaticity Diagram
ꢀ.4ꢀ
ꢀ.35
1
4
BLACK
BODY
CURVE
ꢁ
ꢀ.3ꢀ
3
ꢀ.ꢁ5
ꢀ.ꢁꢀ
ꢀ.ꢁ6
ꢀ.3ꢀ
ꢀ.34
ꢀ.30
X-COORDINATE
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
•
•
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
length prior to insertion and soldering into PC board.
•
If lead forming is required before soldering, care
must be taken to avoid any excessive mechanical
stress induced to LED package. Otherwise, cut the
leads of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling
to the LED chip die attach and wirebond.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Recommended PC board plated through holes size
for LED component leads.
•
•
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely
upon hand operation.
LED component
Diagonal
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
Soldering Condition:
ead size
•
•
•
Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for
those parts without standoff.
0.457 x 0.457mm
(0.018 x 0.018inch)
0.646 mm
(0.025 inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
0.718 mm
(0.028 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
Recommended soldering condition:
soldering LED components.
Wave Soldering Manual Solder
Dipping
Pre-heat
temperature
105 °C Max.
-
Preheat time
30 sec Max
-
Peak temperature 250 °C Max.
Dwell time 3 sec Max.
260 °C Max.
5 sec Max
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
ꢁ5ꢀ
ꢁꢀꢀ
15ꢀ
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
FLUXING
CONVEYOR SPEED = 1.03 M/MIN (6 FT/MIN8
PREHEAT SETTING = 15ꢀ C (1ꢀꢀ C PCB8
SOLDER WAVE TEMPERATURE = ꢁ45 C
AIR KNIFE AIR TEMPERATURE = 39ꢀ C
AIR KNIFE DISTANCE = 1.91 mm (ꢀ.ꢁ5 IN.8
AIR KNIFE ANGLE = 4ꢀ
1ꢀꢀ
SOLDER: SN63; FLUX: RMA
5ꢀ
3ꢀ
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
ꢀ
1ꢀ
ꢁꢀ
3ꢀ
4ꢀ
5ꢀ
6ꢀ
7ꢀ
0ꢀ
9ꢀ
1ꢀꢀ
TIME - SECONDS
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-4117EN - April 19, 2006
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