HLMP-CW39-SV000 [AVAGO]
T-1 3/4 SINGLE COLOR LED, WHITE, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-CW39-SV000 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, WHITE, 5mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总8页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HLMP-CW18, HLMP-CW19,
HLMP-CW28, HLMP-CW29,
HLMP-CW38, HLMP-CW39
T-1 3/ 4 Precision Optical
Performance White LED
Data Sheet
These T-1 3/4 lamps
Features
incorporate precise optics
producing well-defined spatial
radiation patterns at specific
viewing cone angle.
• Highly Luminous White Emission
o
o
o
• 15 , 23 , and 30 viewing angle
Description
• New InGaN flip chip die technology
with protective diode.
These Super Bright Precision
Optical Performance LED lamps
are based on flip chip InGaN
material, which is the brightest
and most efficient technology
for LEDs. A blue LED die is
coated by a phosphor to pro-
duce white.
Benefit
• ESD class 3
• Reduced Power Consumption,
Higher Reliability, and Increased
Optical/ Mechanical Design
Flexibility Compared to
Incandescent Bulbs and Other
Alternative White Light Sources
Applications
• Electronic Signs and Signals
• Small Area Illumination
• Legend Backlighting
• General Purpose Indicators
Package Dimension A
2.35 max
.093
ø5.80
.228±
±
.008
0.20
1.14±
0.20
0.50
.020±
±
.004
0.10 sq. typ.
0.70 max
.028
.045±
.008
5.00
.197
±
±
0.20 note# 1
.008
2.54
.100
±
±
0.38
.015
cathode
lead
1.00 min
.039
8.71
.343±
±
.008
0.20
cathode
flat
31.60 min
1.244
Package Dimension B
1.14
.045±
±
.008
0.20
NOTES:
1. MEASURED JUST ABOVE FLANGE.
1.50±0.15
.059±.006
0.70 max
.028
8.71
.343±
±
.008
0.20
ø5.80
±
0.20
.228
±
.008
0.50
.020±
±
.004
0.10 sq. typ.
2.54
.100
±
±
0.38
.015
5.00
.197
±0.20
note# 1
±
.008
cathode
lead
1.00 min
.039
Dimension H
Refer to Table1
cathode
flat
31.60 min
1.244
Dimension H:
23 & 30 Degree = 12.67 +/ - 0.25 mm (0.499 +/ - 0.01 inch)
15 Degree = 12.93 +/ - 0.25 mm (0.509 +/ - 0.01 inch)
Notes :
1. All dimensions are in milimetres / inches.
2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
Device Selection Guide
Part Number
Iv (cd) @ 20mA
Package
Dimension
Typ. Viewing Angle
Standoff Leads
Min.
4.20
4.20
2.50
2.50
1.90
1.90
Typ.
6.40
6.40
3.80
3.80
3.00
3.00
HLMP-CW18-VY0xx
HLMP-CW19-VY0xx
HLMP-CW28-TW0xx
HLMP-CW29-TW0xx
15°
15°
23°
23°
30°
30°
No
Yes
No
Yes
No
Yes
A
B
A
B
A
B
HLMP-CW38-SV0xx
HLMP-CW39-SV0xx
Notes:
1. Tolerance for luminous intensity measurement is +/ - 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED with unprotected eyes.
Part Numbering System
L M P - C WXX - X X X XX
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full color bin distribution
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle
18: 15 without standoffs
19: 15˚ with standoffs
28: 23˚ without standoffs
29: 23˚ with standoffs
38: 30 ˚ without standoffs
39: 30 ˚ with standoffs
Color Options
W: White
Package Options
C: T-1 3/ 4
2
Absolute Maximum Ratings (T = 25°C)
A
Parameter
Value
30
Units
mA
mA
mA
mW
°C
[1]
DC Forward Current
[2]
Peak Forward Current
100
Average Forward Current
Power Dissipation
30
120
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, 1 KHz
o
Electrical/ Optical Characteristics (T = 25 C)
A
Parameters
Symbol
Minimum Typical
Maximum Units
Test Condition
I = 20 mA
Forward voltage
Capacitance
V
3.4
53
4.0
V
F
F
C
pF
V =0, f=1 MHz
F
[1]
Reverse Voltage
V
0.6
240
V
I = 10 mA
R
R
o
Thermal resistance
Rq
C/ W
LED Junction to cathode lead
J-PIN
1/ 2
[2]
Viewing Angle
2q
Degree
I = 20 mA
F
CW18/ CW19
CW28/ CW29
CW38/ CW39
15
23
30
[3]
Chromaticity Coordinate
X
Y
0.31
0.32
I = 20 mA
F
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 m
2. 2q1/ 2 is the off-axis angle where the luminous intensity is ½ the on axis intensity
3. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
4. The radiant intensity, Ie in watts/ steradian, may be found from the equation Ie = Iv/ hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/ watt.
3
1.0
0.8
0.6
0.4
0.2
0.0
30
20
10
0
0
1
2
3
4
380
480
580
680
780
Wavelength (nm)
Forward Voltage (V)
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
1.5
1.2
0.9
0.6
0.3
0.0
35
30
RΘJ-A = 585˚ C/ W
25
20
15
10
5
RΘJ-A = 780˚ C/ W
0
0
10
20
30
0
20
40
60
80
100
DC Forward Current (mA)
Ambient Temperature (C)
Figure 3. Relative Iv vs. Forward Current
Figure 4. Maximum Fwd Current vs Temperature
0.34
1 mA
5 mA
10 mA
0.32
20 mA
30 mA
0.30
0.305
0.310
X Coordinate
0.315
0.320
Figure 5. Chromaticity Coordinates Changes over Forward Current
4
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.5
0.0
-90
-60
-30
0
30
60
90
-90 -70 -50 -30 -10 10
30
50
70
90
Angular Displacement
Angular Displacement (Degree)
Figure 6a. CW1x Spatial Radiation Pattern
Figure 6b. CW2x Spatial Radiation Pattern
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
90
Angular Displacement
Figure 6c. CW3x Spatial Radiation Pattern
5
Intensity Bin Limit Table
Color Bin Limit Tables
Rank
Intensity (mcd) at 20 mA
Limits
Bin
(Chromaticity Coordinates)
Min
1900
2500
3200
4200
5500
7200
9300
Max
2500
3200
4200
5500
7200
9300
12000
1
2
3
4
x
y
0.330
0.360
0.330
0.318
0.356
0.351
0.361
0.385
S
T
x
y
0.287
0. 295
0.296
0.276
0.330
0.318
0.330
0.339
U
V
W
X
Y
x
y
0.264
0.267
0.280
0.248
0.296
0.276
0.283
0.305
x
y
0.283
0.305
0.287
0.295
0.330
0.339
0.330
0.360
Tolerance for each bin limit is ±0.01
Tolerance for each bin limit is ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
bin categories. Please contact your Agilent representative for information on currently available
Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram
0.40
0.35
1
4
2
Black BodyCurve
0.30
0.25
0.20
3
0.26
0.3
0.34
0.38
X-coordinate
6
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or
cut to length prior to insertion and soldering into
PC board.
• Wave soldering parameter must be set and
maintain according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering
profile to ensure the soldering profile used is
always conforming to recommended soldering
condition.
• If lead forming is required before soldering, care
must be taken to avoid any excessive mechanical
stress induced to LED package. Otherwise, cut the
leads of LED to length after soldering process at
room temperature. The solder joint formed will
absorb the mechanical stress of the lead cutting
from traveling to the LED chip die attach and
wirebond.
• If necessary, use fixture to hold the LED
component in proper orientation with respect to
the PCB during soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to
cool to room temperature, 25°C before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely
upon hand operation.
Soldering Condition:
• Special attention must be given to board
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Recommended PC board plated through holes
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for
those parts without standoff.
LED component
ead size
Plated through hole
diameter
Diagonal
• Recommended soldering condition:
0.457 x 0.457mm
0.646 mm
0.976 to 1.078 mm
Wave
Soldering
Manual Solder
Dipping
(0.018 x 0.018inch)
(0.025 inch)
(0.038 to 0.042 inch)
0.508 x 0.508mm
0.718 mm
1.049 to 1.150mm
Pre-heat temperature
Preheat time
105 °C Max.
30 sec Max
250 °C Max.
3 sec Max.
−
(0.020 x 0.020inch)
(0.028 inch)
(0.041 to 0.045 inch)
−
Note: Refer to application note AN1027 for more
information on soldering LED components.
Peak temperature
Dwell time
260 °C Max.
5 sec Max
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
FLUXING
CONVEYOR SPEED = 1.83 M/ MIN (6 FT/ MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
100
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME - SECONDS
7
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
Data subject to change.
Copyright 2005 Agilent Technologies, Inc.
October 27, 2005
Obsoletes 5989-0461EN
5989-4155EN
相关型号：
©2020 ICPDF网 联系我们和版权申明