HLMP-D150 [AVAGO]
T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps; T- 13/4 （ 5毫米）的，T - 1 （ 3毫米），低电流，双异质结的AlGaAs红色LED灯
| 型号： | HLMP-D150 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps |
| 文件： | 总9页 (文件大小：316K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-D150, HLMP-D155, HLMP-K150 and HLMP-K155
T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
Description
Features
These solid state LED lamps utilize double heterojunction • Minimum luminous intensity specified at 1 mA
(DH) AlGaAs/GaAs material technology. This LED material
has outstanding light output efficiency at very low drive
currents. The color is deep red at the dominant wave-
• High light output at low currents
• Wide viewing angle
length of 637 nanometres. These lamps are ideally suited
for use in applications where high light output is required
with minimum power output.
• Outstanding material efficiency
• Low power/low forward voltage
• CMOS/MOS compatible
• TTL compatible
• Deep red color
Applications
• Low power circuits
• Battery powered equipment
• Telecommunication indicators
Package Dimensions
3.17 (.125)
2.67 (.105)
5.08 (0.200)
4.57 (0.180)
Ø
3.43 (.135)
2.92 (.115)
9.19 (0.362)
8.43 (0.332)
4.70 (.185)
4.19 (.165)
0.89 (0.035)
0.64 (0.025)
1.14 (.045)
0.51 (.020)
6.35 (.250)
5.58 (.220)
0.65 (0.026) MAX.
CATHODE
25.40 (1.00)
MINIMUM
0.65 (0.026) max.
24.1(.95) min.
0.55 (0.022)
SQ. TYP.
0.40 (0.016)
1.27(0.050)
NOM.
1.52 (.060)
1.02 (.040)
6.10 (0.240)
5.59 (0.220)
(0.022) 0.55
SQ. TYP.
(0.016) 0.40
2.79 (.110)
2.29 (.090)
2.54 (0.100) NOM.
A
B
C
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
Selection Guide
Luminous Intensity
Iv (mcd) at 1 mA
[1]
1/2
Degree
2θ
Package
Outline
Package Description
Device HLMP-
D150
Min.
1.3
1.3
5.4
5.4
1.3
1.3
1.3
2.1
2.1
Typ.
3.0
Max.
–
T-1 3/4 Red Tinted Diffused
65
A
A
B
B
C
C
C
C
C
D150-C00xx
D155
3.0
–
65
T-1 3/4 Red Untinted Non-diffused
T-1 Red Tinted Diffused
10.0
10.0
2.0
–
24
D155-F00xx
K150
–
24
–
60
K150-C00xx
K150-CD0xx
K155
2.0
–
60
3.0
4.2
–
60
T-1 Red Untinted Non-diffused
Note:
3.0
45
K155-D00xx
3.0
–
45
1
1. θ is the off axis angle from lamp centerline where the luminous intensity is
/
2
the on-axis value.
1/2
Part Numbering System
HLMP - x 1 xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
DD, DH: Ammo Pack
Color Bin Options
0: Full color bin distribution
Maximum Iv Bin Options
0: Open (No max. limit)
Others: Please refer to the Iv bin table
Minimum Iv Bin Options
Please refer to the Iv bin table
Lens Option
50: Tinted, Diffused
55: Untinted, Nondiffused
Package Options
D: T-13/4 (5 mm)
K: T-1 (3 mm)
2
Absolute Maximum Ratings at T = 25°C
A
Parameter
Value
Peak Forward Current[1]
Average Forward Current
DC Current[2]
300 mA
20 mA
30 mA
Power Dissipation
87 mW
5 V
Reverse Voltage (IR = 100 μA)
Transient Forward Current (10 μs Pulse)[3]
LED Junction Temperature
Operating Temperature Range
500 mA
110°C
-20 to +100°C
-40 to +100°C
Storage Temperature Range
Notes:
1. Maximum I
at f = 1 kHz, DF = 6.7%.
PEAK
2. Derate linearly as shown in Figure 4.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at T = 25°C
A
Symbol
VF
Description
Min.
Typ.
1.6
Max.
Unit
V
Test Condition
IF = 1 mA
Forward Voltage
1.8
VR
Reverse Breakdown Voltage
Peak Wavelength
5.0
15.0
645
637
20
V
IR = 100 μA
λp
nm
nm
nm
Measurement at Peak
Note 1
λd
Dominant Wavelength
Spectral Line Halfwidth
Δλ1/2
Wavelength width at spectral
distribution 1/2 power point.
τS
Speed of Response
Capacitance
30
30
ns
Exponential Time Constant, e-t/TS
VF = 0, f = 1 MHz
C
pF
RθJ-PIN
Thermal Resistance
260[3]
210[4]
290[5]
°C/W
Junction to Cathode Lead
ηV
Luminous Efficacy
80
Im/W
Note 2
Notes:
1. The dominant wavelength, λ , is derived from the CIE chromaticity diagram and represents the color of the device.
d
2. The radiant intensity, I , in watts per steradian, may be found from the equation I = l /η , where I is the luminous intensity in candelas and η is
e
e
V
V
V
V
luminous efficacy in lumens/watt.
3. HLMP-D150.
4. HLMP-D155.
5. HLMP-K150/-K155.
3
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs. dc forward current.
Figure 4. Maximum forward dc current vs. ambient temperature.
Derating based on TJ Max. = 110 °C.
Figure 5. Relative luminous intensity vs. angular displacement.
HLMP-D150.
Figure 6. Relative luminous intensity vs. angular displacement.
HLMP-K150.
4
Figure 8. Relative luminous intensity vs. angular displacement.
HLMP-K155.
Figure 7. Relative luminous intensity vs. angular displacement.
HLMP-D155.
Intensity Bin Limits
Intensity Range (mcd)
Color
Bin
C
D
E
Min.
Max.
Red
1.5
2.4
2.4
3.8
3.8
6.1
F
6.1
9.7
G
H
I
9.7
15.5
15.5
24.8
24.8
39.6
J
39.6
63.4
K
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
Note: Maximum tolerance for each bin limit is ± 18%.
5
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
A1
A2
B1
B2
DD
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1
Tape & Reel, straight leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-13/4, Right Angle Housing, even leads, minimum increment 500 pcs/bag
Ammo Pack, straight leads with minimum 2K increment
DH
Ammo Pack, straight leads with minimum 2K increment
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
6
Precautions:
Lead Forming:
•ꢀ The leads of an LED lamp may be preformed or cut to
•ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
length prior to insertion and soldering on PC board.
•ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
•ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Soldering and Handling:
•ꢀ Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
•ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
•ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
•ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
•ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•ꢀ ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
•ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
•ꢀ Recommended soldering condition:
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave
Soldering
Manual Solder
Dipping
[1],[2]
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Pre-heat Temperature 105°C Max.
–
Pre-heat Time
60 sec Max.
250°C Max.
3 sec Max.
–
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Peak Temperature
260°C Max.
5 sec Max.
Dwell Time
Note:
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
•ꢀ Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
7
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
8
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5898-4249EN
AV02-1562EN - June 19, 2013
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