HLMP-EG35-TW0DD [AVAGO]
T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps;
| 型号： | HLMP-EG35-TW0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps |
| 文件： | 总11页 (文件大小：462K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EGxx, HLMP-ELxx and HLMP-EHxx
T-ꢀ¾ (5mm) Extra High Brightness AlInGaP LED Lamps
Data Sheet
Description
Features
Theseꢀ Precisionꢀ Opticalꢀ Performanceꢀ AlInGaPꢀ LEDsꢀ •ꢀ Viewingꢀangle:ꢀ15°,ꢀ23°,ꢀ30°
provideꢀsuperiorꢀlightꢀoutputꢀforꢀexcellentꢀreadabilityꢀinꢀ
sunlightꢀ andꢀ areꢀ extremelyꢀ reliable.ꢀ AlInGaPꢀ LEDꢀ tech-
nologyꢀprovidesꢀextremelyꢀstableꢀlightꢀoutputꢀoverꢀlongꢀ
periodsꢀ ofꢀ time.ꢀ Precisionꢀ Opticalꢀ Performanceꢀ lampsꢀ
utilizeꢀtheꢀaluminumꢀindiumꢀgalliumꢀphosphideꢀ(AlInGaP)ꢀ
technology.ꢀ
•ꢀ Highꢀluminousꢀoutput
•ꢀ Colors:
ꢀ
ꢀ
ꢀ
590nmꢀAmber
615nmꢀRed-Orange
626nmꢀRed
•ꢀ Packageꢀoptions:
Theseꢀ LEDꢀ lampsꢀ areꢀ untinted,ꢀT-1¾ꢀ packagesꢀ incorpo-
ratingꢀsecondꢀgenerationꢀopticsꢀproducingꢀwellꢀdefinedꢀ
spatialꢀradiationꢀpatternsꢀatꢀspecificꢀviewingꢀconeꢀangles.
ꢀ
Withꢀorꢀwithoutꢀleadꢀstandoff
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture
•ꢀ Untintedꢀnon-diffusedꢀforꢀ15°ꢀandꢀ30°ꢀlamps
•ꢀ Untintedꢀdiffusedꢀforꢀ23°ꢀlamps
Theseꢀ lampsꢀ areꢀ madeꢀ withꢀ anꢀ advancedꢀ opticalꢀ gradeꢀ
epoxyꢀ offeringꢀ superiorꢀ highꢀ temperatureꢀ andꢀ highꢀ
moistureꢀ resistanceꢀ performanceꢀ inꢀ outdoorꢀ signalꢀ andꢀ
signꢀ application.ꢀ Theꢀ maximumꢀ LEDꢀ junctionꢀ tempera-
tureꢀlimitꢀofꢀ+130°Cꢀenablesꢀhighꢀtemperatureꢀoperationꢀ
inꢀ brightꢀ sunlightꢀ conditions.ꢀ Theꢀ epoxyꢀ containsꢀ bothꢀ
uv-aꢀ andꢀ uv-bꢀ inhibitorsꢀ toꢀ reduceꢀ theꢀ effectsꢀ ofꢀ longꢀ
termꢀexposureꢀtoꢀdirectꢀsunlight.
Applications
•ꢀꢀ Trafficꢀmanagement:
-ꢀ Trafficꢀsignals
-ꢀ Pedestrianꢀsignals
-ꢀ Workꢀzoneꢀwarningꢀlights
-ꢀ Variableꢀmessageꢀsigns
•ꢀꢀ Commercialꢀoutdoorꢀadvertising
-ꢀ Signs
Benefits
•ꢀꢀ Superiorꢀperformanceꢀforꢀoutdoorꢀenvironments
•ꢀꢀ Suitableꢀforꢀauto-insertionꢀontoꢀPCꢀboard
-ꢀ Marquees
ꢀ
Package Dimension
A
B
5.00 ± 0.20
5.00 ± 0.20
(0.197 ±� 0.008)
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ±� 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
31.60
(1.244)
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
SQ. TYP.
1.00
MIN.
1.00
MIN.
(0.039)
(0.039)
5.80 ± 0.20
5.80 ± 0.20
(0.228 ± 0.008)
(0.228 ± 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 ± 0.38
2.54 ± 0.38
(0.100 ± 0.015)
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
PART NO.
d
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
HLMP-XX13
HLMP-XX23
HLMP-XX37
12.42 ± 0.25
(0.489 ± 0.010)
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
11.59 ± 0.25
(0.446 ± 0.010)
- LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
11.96 ± 0.25
(0.471 ± 0.010)
- LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/0.889 (0.038/0.035).
4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
5. FOR IDENTIFICATION OF POLARITY AFTER THE LEADS ARE TRIMMED OFF, PLEASE REFER TO THE ILLUSTRATION BELOW:
CATHODE
ANODE
7. MAJOR HEAT PATH IS THROUGH THE ANODE LEAD
ꢁ
Device Selection Guide
Luminous Intensity
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with
Standoffs on Leads
(Outline Drawing B)
[1,2,5]
Iv (mcd)
@ 20mA
Typical Viewing
Angle 2θ½ (Deg)
Color and Dominant
Wavelength (nm), Typ.
[4]
[3]
Min.
Max.
15°
Amberꢀ590
HLMP-EL12-VY0DD
HLMP-EL12-XYKDD
HLMP-EH12-VY0DD
HLMP-EG12-VY0DD
HLMP-EG12-WX0DD
HLMP-EL22-UXKDD
HLMP-EL22-UX0DD
HLMP-EL22-VWKDD
HLMP-EH22-TW0DD
HLMP-EG22-UX0DD
HLMP-EG22-VW0DD
HLMP-EL35-TW0DD
HLMP-EL35-TWKDD
HLMP-EL35-UVKDD
HLMP-EH35-SV0DD
HLMP-EG35-TW0DD
HLMP-EG35-UV0DD
HLMP-EL13-VY0DD
4200
7200
4200
4200
5500
3200
3200
4200
2500
3200
4200
2500
2500
3200
1900
2500
3200
12000
12000
12000
12000
9300
9300
9300
7200
7200
9300
7200
7200
7200
5500
5500
7200
5500
Red-Orangeꢀ615
Redꢀ626
HLMP-EH13-VY0DD
HLMP-EG13-VY0DD
23°
Amberꢀ590
HLMP-EL23-UXKDD
HLMP-EL23-UX0DD
Red-Orangeꢀ615
Redꢀ626
HLMP-EH23-TW0DD
HLMP-EG23-UX0DD
30°
Amberꢀ590
HLMP-EL37-TW0DD
HLMP-EL37-TWKDD
Red-Orangeꢀ615
Redꢀ626
HLMP-EH37-SV0DD
HLMP-EG37-TW0DD
Notes:
1.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
2.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
3.ꢀ Dominantꢀwavelength,ꢀλd,ꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
4.ꢀ θ½ꢀisꢀtheꢀoff-axisꢀangleꢀwhereꢀtheꢀluminousꢀintensityꢀisꢀhalfꢀtheꢀon-axisꢀintensity.ꢀ
5.ꢀ Toleranceꢀforꢀeachꢀintensityꢀbinꢀlimitꢀisꢀ ꢀ15%.
ꢂ
Part Numbering System
HLMP – E x x x - x x x x x
Mechanical Options
00 : Bulk Packaging
DD : Ammo Pack
YY : Flexi-Bin; Bulk Packaging
ZZ : Flexi-Bin; Ammo Pack
Color Bin Selections
0 : Full color distribution
2 : Amber color bin 2 only
4 : Amber color bin 4 only
K : Amber color bin 2 and 4 only
Z : Special Vf Bin Range
Maximum Intensity Bin
0 : No maximum intensity bin limitation
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
12 : 15 deg without lead standoffs
13 : 15 deg with lead standoffs
22 : 23 deg without lead standoffs
23 : 23 deg with lead standoffs
35 : 30 deg without lead standoffs
37 : 30 deg with lead standoffs
Color
G : 626nm Red
H : 615nm Red-Orange
L : 590nm Amber
Note:ꢀPleaseꢀreferꢀtoꢀABꢀ5337ꢀforꢀcompleteꢀinformationꢀonꢀpartꢀnumberingꢀsystem.
Absolute Maximum Ratings at T = 25°C
A
DCꢀForwardꢀCurrentꢀ[1]
50ꢀmA
PeakꢀPulsedꢀForwardꢀCurrent
AverageꢀForwardꢀCurrent
ReverseꢀVoltageꢀ(Irꢀ=ꢀ100ꢀµA)ꢀ
OperatingꢀTemperatureꢀ
StorageꢀTemperatureꢀ
100ꢀmA
30ꢀmA
5ꢀV
–40°Cꢀtoꢀ+100°C
–40°Cꢀtoꢀ+100°C
Notes:
1.ꢀ DerateꢀlinearlyꢀasꢀshownꢀinꢀFigureꢀ4.
ꢃ
Electrical/ Optical Characteristics at T = 25ºC
A
Parameter
Symbol
Minimum Average Maximum Units
Test Condition
ForwardꢀVoltageꢀ
Amber
Red
IFꢀ=ꢀ20mA
2.20
2.10
2.00
VF
1.80
2.40
V
Red-Orange
PeakꢀWavelength
Amberꢀ
Red
Red-Orange
DominantꢀWavelengthꢀ[1]
Amberꢀ
Red
Red-Orange
IFꢀ=ꢀ20mA
IFꢀ=ꢀ20mA
590
626
615
λPEAK
nm
nm
584.5
620.0
612.0
594.5
630.0
621.7
λd
VR
ReverseꢀVoltage
SpectralꢀHalfwidth
Capacitanceꢀ
5
V
IRꢀ=ꢀ100μA
Dλ
½
17
nm
pF
IFꢀ=ꢀ20ꢀmA
C
40
VFꢀ=ꢀ0,ꢀfꢀ=ꢀ1ꢀMHz
LEDꢀJunction-to-AnodeꢀLead
ThermalꢀResistance
RθJ-PIN
240
ºC/W
LuminousꢀEfficacyꢀ[2]
Amberꢀ
Red
EmittedꢀLuminousꢀFlux/Emittedꢀ
RadiantꢀFlux
480
150
260
hV
lm/W
Red-Orange
LuminousꢀFlux
jV
he
1300
30
mlm
IFꢀ=ꢀ20mA
LuminousꢀEfficiencyꢀ[3]
lm/W
EmittedꢀLuminousꢀFlux/ꢀElectricalꢀ
Power
Notes:
1.ꢀ Theꢀdominantꢀwavelength,ꢀλdꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀreferencedꢀtoꢀIlluminantꢀE.ꢀToleranceꢀforꢀeachꢀcolorꢀofꢀdominantꢀ
wavelengthꢀisꢀ+/-ꢀ0.5nm.
2.ꢀ Theꢀradiantꢀintensity,ꢀIeꢀinꢀwattsꢀperꢀsteradian,ꢀmaybeꢀfoundꢀfromꢀtheꢀequationꢀIeꢀ=ꢀIvꢀ/ꢀηVꢀwhereꢀIvꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelaꢀandꢀηVꢀisꢀ
theꢀluminousꢀefficacyꢀinꢀlumens/watt.
3.ꢀ h ꢀ=ꢀj ꢀ/ꢀI ꢀꢀxꢀV ,ꢀwhereꢀj ꢀꢀisꢀtheꢀemittedꢀluminousꢀflux,ꢀI ꢀisꢀelectricalꢀforwardꢀcurrentꢀandꢀV ꢀisꢀtheꢀforwardꢀvoltage.
e
V
F
F
V
F
F
Figure 1. Relative intensity vs. peak wavelength
5
60
50
40
30
20
10
2.5
Red
2
Red-Orange
Amber
1.5
1
0.5
0
0
0
0.5
1
1.5
2
2.5
3
0
10
20
30
40
50
FORWARD VOLTAGE - V
DC FORWARD CURRENT - mA
Figure 2. Forward current vs. forward voltage
Figure 3. Relative luminous intensity vs. forward current
55
50
45
40
35
30
25
20
15
10
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
20
40
60
80
100
120
-90
-60
-30
0
30
60
90
TA - AMBIENT TEMPERATURE - ºC
ANGULAR DISPLACEMENT - DEGREES
Figure 4. Maximum forward current vs. ambient temperature
Figure 5. Representative spatial radiation pattern for 15° viewing angle
lamps
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT -DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Representative spatial radiation pattern for 23° viewing angle
lamps
Figure 7. Representative spatial radiation pattern for 30° viewing angle
lamps
ꢄ
10
1
Amber
Red
Red-Orange
0.1
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE - °C
Figure 8. Relative light output vs. junction temperature
Intensity Bin Limits (mcd at 20mA)
Forward Voltage Bin Limits (V at 20mA)
Bin Name
Minimum
1500
Maximum
1900
Bin Name
VD
Minimum
1.8
Maximum
2.0
R
S
1900
2500
VA
2.0
2.2
T
2500
3200
VB
2.2
2.4
U
V
W
X
Y
Z
1
3200
4200
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.05V
4200
5500
Amber Color Bin Limits (nm at 20mA)
5500
7200
Bin Name
Minimum
584.5
Maximum
587.0
7200
9300
1
2
4
6
9300
12000
16000
21000
27000
587.0
589.5
12000
16000
21000
589.5
592.0
592.0
594.5
2
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5nm
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ15%
Note:ꢀ Binꢀ categoriesꢀ areꢀ establishedꢀ forꢀ classificationꢀ ofꢀ products.ꢀ
Productsꢀmayꢀnotꢀavailableꢀinꢀallꢀbinꢀcategories.
ꢅ
Precautions:
Lead Forming:
Note:ꢀ
1.ꢀ PCBꢀ withꢀ differentꢀ sizeꢀ andꢀ designꢀ (componentꢀ density)ꢀ willꢀ haveꢀ
differentꢀ heatꢀ massꢀ (heatꢀ capacity).ꢀThisꢀ mightꢀ causeꢀ aꢀ changeꢀ inꢀ
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ
settingꢀisꢀused.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.
2.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLEDꢀareꢀusingꢀhighꢀefficiencyꢀ
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀtakeꢀextraꢀprecautionꢀduringꢀwaveꢀsolderingꢀtoꢀensureꢀthatꢀtheꢀ
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀsolderꢀ
contactꢀ timeꢀ doesꢀ notꢀ exceedingꢀ 3sec.ꢀ Over-stressingꢀ theꢀ LEDꢀ
duringꢀsolderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLEDꢀ
dueꢀtoꢀdelamination.
•ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
•ꢀ Forꢀ betterꢀ control,ꢀ itꢀ isꢀ recommendedꢀ toꢀ useꢀ properꢀ
toolꢀtoꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀ
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀaꢀ
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ
dueꢀtoꢀleadꢀcuttingꢀfromꢀtravelingꢀintoꢀLEDꢀpackage.ꢀ
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀoperation,ꢀ
asꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀsink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ Careꢀ mustꢀ beꢀ takenꢀ duringꢀ PCBꢀ assemblyꢀ andꢀ
solderingꢀ processꢀ toꢀ preventꢀ damageꢀ toꢀ theꢀ LEDꢀ
component.ꢀ
•ꢀ LEDꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ
toꢀ PCB.ꢀ However,ꢀ itꢀ isꢀ onlyꢀ recommendedꢀ underꢀ
unavoidableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀ
manualꢀ solderingꢀ distanceꢀ ofꢀ theꢀ solderingꢀ heatꢀ
sourceꢀ (solderingꢀ iron’sꢀ tip)ꢀ toꢀ theꢀ bodyꢀ isꢀ 1.59mm.ꢀ
SolderingꢀtheꢀLEDꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ
1.59mmꢀmightꢀdamageꢀtheꢀLED.
Anode
ꢀ
Note:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ
waveꢀ solderingꢀ shouldꢀ beꢀ looselyꢀ fittedꢀ andꢀ shouldꢀ
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLED.ꢀNonꢀmetalꢀmaterialꢀ
isꢀ recommendedꢀ asꢀ itꢀ willꢀ absorbꢀ lessꢀ heatꢀ duringꢀ
waveꢀsolderingꢀprocess.
1.59mm
ꢀ
Note:ꢀInꢀorderꢀtoꢀfurtherꢀassistꢀcustomerꢀinꢀdesigningꢀjigꢀaccuratelyꢀ
thatꢀ fitꢀ AvagoꢀTechnologies’ꢀ product,ꢀ 3Dꢀ modelꢀ ofꢀ theꢀ productꢀ isꢀ
availableꢀuponꢀrequest.
•ꢀ ESDꢀ precautionꢀ mustꢀ beꢀ properlyꢀ appliedꢀ onꢀ theꢀ
solderingꢀ stationꢀ andꢀ personnelꢀ toꢀ preventꢀ ESDꢀ
damageꢀtoꢀtheꢀLEDꢀcomponentꢀthatꢀisꢀESDꢀsensitive.ꢀ
DoꢀreferꢀtoꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀ
Theꢀsolderingꢀironꢀusedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀ
ensureꢀelectrostaticꢀchargeꢀisꢀproperlyꢀgrounded.
•ꢀ Atꢀ elevatedꢀ temperature,ꢀ LEDꢀ isꢀ moreꢀ susceptibleꢀ toꢀ
mechanicalꢀstress.ꢀTherefore,ꢀPCBꢀmustꢀallowedꢀtoꢀcoolꢀ
downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ whichꢀ
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
•ꢀ Recommendedꢀsolderingꢀcondition:
•ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ
thatꢀ surfaceꢀ mountꢀ componentsꢀ beꢀ solderedꢀ onꢀ theꢀ
topꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀ
bottomꢀ side,ꢀ theseꢀ componentsꢀ shouldꢀ beꢀ solderedꢀ
usingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.
Wave
Soldering
Manual Solder
Dipping
[1, 2]
Pre-heatꢀtemperature 105ꢀ°CꢀMax.
-
Preheatꢀtime
Peakꢀtemperature
Dwellꢀtime
60ꢀsecꢀMax
250ꢀ°CꢀMax.
3ꢀsecꢀMax.
-
260ꢀ°CꢀMax.
5ꢀsecꢀMax
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
sizeꢀforꢀLEDꢀcomponentꢀleads.
Note:ꢀ
LED component
lead size
Plated through
hole diameter
1.ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.
2.ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ
thermalꢀstressꢀexperiencedꢀbyꢀLED.
Diagonal
0.45ꢀxꢀ0.45ꢀmm
0.636ꢀmm
0.98ꢀtoꢀ1.08ꢀmm
(0.039ꢀtoꢀ0.043ꢀinch)
(0.018xꢀ0.018ꢀinch) (0.025ꢀinch)
0.50ꢀxꢀ0.50ꢀmm 0.707ꢀmm
(0.020xꢀ0.020ꢀinch) (0.028ꢀinch)
1.05ꢀtoꢀ1.15ꢀmm
(0.041ꢀtoꢀ0.045ꢀinch)
•ꢀ Waveꢀ solderingꢀ parametersꢀ mustꢀ beꢀ setꢀ andꢀ
maintainedꢀ accordingꢀ toꢀ theꢀ recommendedꢀ
temperatureꢀ andꢀ dwellꢀ time.ꢀ Customerꢀ isꢀ advisedꢀ
toꢀ performꢀ dailyꢀ checkꢀ onꢀ theꢀ solderingꢀ profileꢀ toꢀ
ensureꢀthatꢀitꢀisꢀalwaysꢀconformingꢀtoꢀrecommendedꢀ
solderingꢀconditions.
•ꢀ Over-sizingꢀ theꢀ PTHꢀ canꢀ leadꢀ toꢀ twistedꢀ LEDꢀ afterꢀ
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀ
causeꢀdifficultyꢀinsertingꢀtheꢀTHꢀLED
ꢆ
Recommended Wave Soldering Profile
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
PREHEAT
30
0
90
100
40
80
10
20
60
70
50
TIME (MINUTES)
Figure 9. Recommended Wave Soldering Profile
Ammo Packs Drawing
Note:ꢀTheꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ-ZZꢀandꢀregardlessꢀstandoffꢀorꢀnon-standoff
Figure 10. Dimension for ammo pack
ꢇ
Packaging Box for Ammo Packs
Note:ꢀTheꢀdimensionꢀforꢀammoꢀpackꢀisꢀapplicableꢀforꢀtheꢀdeviceꢀwithꢀstandoffꢀandꢀwithoutꢀstandoff.
Figure 11. The arrangement of unit in ammo pack
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
ꢀ0
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢀ
Example:ꢀ
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(Applicableꢀ forꢀ partꢀ numberꢀ withꢀ colorꢀ binsꢀ butꢀ
withoutꢀVFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀ
colorꢀbin)
ꢀ
ꢀ
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin
ORꢀ
ꢀ
ꢀ
ꢀ
BIN:ꢀ2VB
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin
VB:ꢀVFꢀbinꢀ“VB”
(Applicableꢀ forꢀ partꢀ numberꢀ thatꢀ haveꢀ bothꢀ colorꢀ
binꢀandꢀVFꢀbin)
2:ꢀꢀColorꢀbinꢀ2ꢀonly
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © ꢁ005-ꢁ00ꢇ Avago Technologies. All rights reserved.
AV0ꢁ-00ꢆꢄEN - January ꢀ5, ꢁ00ꢇ
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