HLMP-EG55-HJ000 [AVAGO]
T-1 3/4 SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-EG55-HJ000 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 光电 |
| 文件： | 总10页 (文件大小：206K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EL55/EG55/EL57/EH57/ED57
3
T-1 / (5 mm) Precision Optical Performance AlInGaP
4
LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs pro- • Well defined and smooth spatial radiation patterns
vide superior light output for excellent readability in sun-
light and are extremely reliable. AlInGaP LED technology
provides extremely stable light output over long periods
• Wide viewing angle
• Tinted diffused lamp
of time. Precision Optical Performance lamps utilize the
aluminum indium gallium phosphide (AlInGaP) technol-
ogy.
• High luminous output
• Colors:
590/592 nm Amber
617 nm Reddish-Orange
626/630 nm Red
3
These LED lamps are tinted, diffused, T-1 / packages
4
incorporating second generation optics producing well
defined radiation patterns at specific viewing cone an-
gles.
• High operating temperature: T
=+130°C
JLED
• Superior resistance to moisture
There are two families of amber, red, and red-orange
lamps; AlInGaP and the higher performance AlInGaP II.
Applications
• Traffic management:
Variable message signs
Traffic management signs
The high maximum LED junction temperature limit of
+130°C enables high temperature operation in bright
sunlight conditions.
• Commercial indoor/outdoor advertising:
These lamps are available in two package options to give
the designer flexibility with device mounting.
Signs
Marquees
Passenger information
Benefits
• Automotive:
• Viewing angles match traffic management sign
Exterior and interior lights
requirements
• Colors meet automotive specifications
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
Part Numbering System
HLMP xx - x x x xx
-
x
x
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
Color Bin Selections
0: No color bin limitation
K: Amber color bins 2 and 4 only
L: Amber Color Bins 4 and 6 only
Maximum Intensity Bin
Minimum Intensity Bin
Viewing Angle & Lead Stand Offs
55: 55 deg without lead stand offs; AlInGaP
57: 55 deg without lead stand offs; AlInGaP II
Color
D: 630 nm Red
G: 626 nm Red
H: 617 nm Red-Orange
L: 590/592 Amber
Package
E: 5 mm Round
Device Selection Guide for AlInGaP
Color and Dominant Wavelength Luminous Intensity Iv
Luminous Intensity Iv
(mcd) at 20 mA Max.
[3]
[1,2]
[1,2]
Part Number
ld (nm) Typ.
(mcd) at 20 mA Min.
HLMP-EL55-GK0DD
HLMP-EL55-GHKDD
HLMP-EL55-HJKxx
HLMP-EL55-JKLDD
HLMP-EL55-LP000
HLMP-EG55-GK0DD
HLMP-EG55-HJ0xx
HLMP-EG55-JK0xx
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Red 626
140
140
180
240
400
140
180
240
400
240
310
400
1150
400
310
400
Red 626
Red 626
Device Selection Guide for AlInGaPII
Color and Dominant Wavelength Luminous Intensity Iv
Luminous Intensity Iv
(mcd) at 20 mA Max.
[3]
[1,2]
[1,2]
Part Number
ld (nm) Typ.
(mcd) at 20 mA Min.
HLMP-EL57-LP0xx
HLMP-EH57-LP000
HLMP-ED57-LP0xx
HLMP-ED57-LPT00
Amber 592
400
400
400
400
1150
1150
1150
1150
Red-Orange 617
Red 630
Red 630
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, l , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
2
Package Dimensions
5.00 0.20
(0.197 0.008)
1.14 0.20
(0.045 0.008)
8.71 0.20
(0.343 0.008
2.35 (0.093)
MAX.
31.60
MIN.
0.70 (0.028)
MAX.
(1.244)
CATHODE
LEAD
0.50 0.10
(0.020 0.004)
SQ. TYP.
1.00
MIN.
(0.039)
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
3
Absolute Maximum Ratings at T = 25°C
A
DC Forward Current[1,2,3] ....................................................................................................... 50 mA
Peak Pulsed Forward Current[2,3] .........................................................................................100 mA
Average Forward Current[3] .................................................................................................... 30 mA
Reverse Voltage (IR = 100 µA).......................................................................................................... 5 V
LED Junction Temperature......................................................................................................... 130°C
Operating Temperature ..........................................................................................–40°C to +100°C
Storage Temperature ...............................................................................................–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended.
For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Please contact your Avago Technologies sales representative about operating currents below 10 mA.
Electrical/Optical Characteristics at T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
V
IF = 20 mA
Amber (ld = 590 nm)
Amber (ld = 592 nm)
Red-Orange (ld = 617 nm)
Red (ld = 626 nm)
2.02
2.15
2.08
1.90
2.00
2.4
2.4
2.4
2.4
2.4
Red (ld = 630 nm)
Reverse Voltage
VR
5
20
V
IR = 100 µA
Peak Wavelength
lPEAK
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Amber (ld = 590 nm)
Amber (ld = 592 nm)
Red-Orange (ld = 617 nm)
Red (ld = 626 nm)
592
594
623
635
639
Red (ld = 630 nm)
Spectral Halfwidth
∆l1/2
17
nm
ns
Wavelength Width at Spectral
Distribution 1/2 Power Point at
IF = 20 mA
Speed of Response
τs
20
Exponential Time
Constant, e-t/τ
s
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RθJ-PIN
240
°C/W
lm/W
LED Junction-to-Cathode Lead
Luminous Efficacy[1]
Amber (ld = 590 nm)
Amber (ld = 592 nm)
Red-Orange (ld = 617 nm)
Red (ld = 626 nm)
ηv
Emitted Luminous Power/Emitted
Radiant Power
480
500
235
150
155
Red (ld = 630 nm)
Note:
1. The radiant intensity, I , in watts per steradian, may be found from the equation I = I /η , where I is the luminous intensity in candelas and η
e
e
v
v
v
v
is the luminous efficacy in lumens/watt.
4
1.0
RED-ORANGE
RED
AMBER
0.5
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. peak wavelength.
100
90
3.0
2.5
2.0
1.5
1.0
0.5
50
40
30
20
10
80
70
RθJA = 585 C/W
RθJA = 780 C/W
60
RED
50
40
AMBER
30
20
10
0
0
0
0
20
40
60
80
100
1.0
1.5
2.0
2.5
3.0
0
20
40
60
TA – AMBIENT TEMPERATURE – C
VF – FORWARD VOLTAGE – V
IF – DC FORWARD CURRENT – mA
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs.
forward current.
Figure 4. Maximum forward current vs. ambient
temperature. Derating based on TJMAX = 130°C.
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
θ – ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative spatial radiation pattern for 55° viewing angle lamps.
5
Intensity Bin Limits
(mcd at 20 mA)
Amber Color Bin Limits
(nm at 20 mA)
Bin Name
Min.
Max.
180
240
310
400
520
680
880
1150
Bin Name
Min.
Max.
G
H
J
140
180
240
310
400
520
680
880
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
K
L
Tolerance for each bin limit is 0.5 nm.
M
N
P
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
Tolerance for each bin limit is 15ꢀ.
6
Note:
Precautions:
Lead Forming:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder opera-
tion, as the excess lead length also acts as small heat
sink.
Avago Technologies LED configuration
Soldering and Handling:
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to the LED component.
CATHODE
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under un-
avoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal mate-
rial is recommended as it will absorb less heat during
wave soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
• ESD precaution must be properly applied on the sol-
dering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The sol-
dering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommend-
ed that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be sol-
dered using reflow soldering prior to insertion the TH
LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
• Recommended PC board plated through holes (PTH)
[1, 2]
size for LED component leads.
Pre-heat temperature
Preheat time
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
-
LED component
lead size
Plated through
hole diameter
-
Diagonal
Peak temperature
Dwell time
260 °C Max.
5 sec Max
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH
can cause difficulty inserting the TH LED.
• Wave soldering parameters must be set and main-
tained according to the recommended tempera-
ture and dwell time. Customer is advised to perform
daily check on the soldering profile to ensure that
it is always conforming to recommended soldering
conditions.
7
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
LAMINAR WAVE
HOT AIR KNIFE
Sn63 (Leaded solder alloy)
TURBULENT WAVE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin ꢀux
Solder bath temperature:
245°C 5°C (maximum peaꢁ
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
suꢂciently cooled to room
temperature before exerting
mechanical force.
PREHEAT
0
90
100
30
40
80
10
20
60
70
50
TIME (SECONDS)
Ammo Pack Drawing
6.35 1.30
(0.25 0.0512)
12.70 1.00
(0.50 0.0394)
CATHODE
20.50 1.00
(0.807 0.039)
9.125 0.625
(0.3593 0.0246)
18.00 0.50
(0.7087 0.0197)
A
A
4.00 0.20
(0.1575 0.008)
12.70 0.30
(0.50 0.0118)
∅
TYP.
VIEW A–A
0.70 0.20
(0.0276 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
8
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
O
+
N
G
L
A
O
S
A
C
V
N
E
E
I
D
A
H
O
G
O
A
E
D
O
C
H
T
A
E
–
T
C
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
O
M
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
9
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color
bin and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4364EN
AV02-1541EN - July 18, 2014
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