HLMP-EG55-JK000 [AVAGO]
T-1 3/4 SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-EG55-JK000 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 光电 |
| 文件： | 总10页 (文件大小：331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EL55/EG55/EL57/EH57/ED57
3
T-1 / (5 mm) Precision Optical Performance AlInGaP
4
LED Lamps
Data Sheet
Description
Features
TheseꢀPrecisionꢀOpticalꢀPerformanceꢀAlInGaPꢀLꢁꢂsꢀpro- •ꢀ Wellꢀdefinedꢀandꢀsmoothꢀspatialꢀradiationꢀpatterns
videꢀsuperiorꢀlightꢀoutputꢀforꢀexcellentꢀreadabilityꢀinꢀsun-
lightꢀandꢀareꢀextremelyꢀreliable.ꢀAlInGaPꢀLꢁꢂꢀtechnologyꢀ
providesꢀextremelyꢀstableꢀlightꢀoutputꢀoverꢀlongꢀperiodsꢀ
•ꢀ Wideꢀviewingꢀangle
•ꢀ Tintedꢀdiffusedꢀlamp
ofꢀtime.ꢀPrecisionꢀOpticalꢀPerformanceꢀlampsꢀutilizeꢀtheꢀ •ꢀ Highꢀluminousꢀoutput
aluminumꢀindiumꢀgalliumꢀphosphideꢀ(AlInGaP)ꢀtechnol-
ogy.
•ꢀ Colors:ꢀ
ꢀꢀꢀꢀꢀꢀꢀ590/592ꢀnmꢀAmberꢀ
ꢀꢀꢀꢀꢀꢀꢀ617ꢀnmꢀReddish-Orangeꢀ
ꢀꢀꢀꢀꢀꢀꢀ626/630ꢀnmꢀRed
3
Theseꢀ Lꢁꢂꢀ lampsꢀ areꢀ tinted,ꢀ diffused,ꢀ T-1 / ꢀ packagesꢀ
4
incorporatingꢀsecondꢀgenerationꢀopticsꢀproducingꢀwellꢀ
definedꢀradiationꢀpatternsꢀatꢀspecificꢀviewingꢀconeꢀan-
gles.
•ꢀ Highꢀoperatingꢀtemperature:ꢀT
ꢀ=ꢀ+130°C
JLꢁꢂ
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture
Thereꢀ areꢀ twoꢀ familiesꢀ ofꢀ amber,ꢀ red,ꢀ andꢀ red-orangeꢀ
lamps;ꢀAlInGaPꢀandꢀtheꢀhigherꢀperformanceꢀAlInGaPꢀII.ꢀ
Applications
•ꢀ Trafficꢀmanagement:ꢀꢀ ꢀ
ꢀꢀꢀꢀꢀꢀVariableꢀmessageꢀsignsꢀ
ꢀꢀꢀꢀꢀꢀTrafficꢀmanagementꢀsigns
Theꢀ highꢀ maximumꢀ Lꢁꢂꢀ junctionꢀ temperatureꢀ limitꢀ ofꢀ
+130°Cꢀ enablesꢀ highꢀ temperatureꢀ operationꢀ inꢀ brightꢀ
sunlightꢀconditions.ꢀ
•ꢀ Commercialꢀindoor/outdoorꢀadvertising:ꢀꢀ
ꢀꢀꢀꢀꢀꢀꢀSignsꢀ
Theseꢀlampsꢀareꢀavailableꢀinꢀtwoꢀpackageꢀoptionsꢀtoꢀgiveꢀ
theꢀdesignerꢀflexibilityꢀwithꢀdeviceꢀmounting.
ꢀꢀꢀꢀꢀꢀꢀMarqueesꢀ
ꢀꢀꢀꢀꢀꢀꢀPassengerꢀinformation
Benefits
•ꢀ Automotive:ꢀ
•ꢀ Viewingꢀanglesꢀmatchꢀtrafficꢀmanagementꢀsignꢀ
ꢀꢀꢀꢀꢀꢀꢀꢁxteriorꢀandꢀinteriorꢀlights
requirements
•ꢀ Colorsꢀmeetꢀautomotiveꢀspecifications
•ꢀ Superiorꢀperformanceꢀinꢀoutdoorꢀenvironments
•ꢀ SuitableꢀforꢀautoinsertionꢀontoꢀPCꢀboards
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00:ꢀBulkꢀPackaging
ꢂꢂ:ꢀAmmoꢀPack
Color Bin Selections
0:ꢀNoꢀcolorꢀbinꢀlimitation
K:ꢀAmberꢀcolorꢀbinsꢀ2ꢀandꢀ4ꢀonly
L:ꢀAmberꢀColorꢀBinsꢀ4ꢀandꢀ6ꢀonly
Maximum Intensity Bin
Minimum Intensity Bin
Viewing Angle & Lead Stand Offs
55:ꢀ55ꢀdegꢀwithoutꢀleadꢀstandꢀoffs;ꢀAlInGaP
57:ꢀ55ꢀdegꢀwithoutꢀleadꢀstandꢀoffs;ꢀAlInGaPꢀII
Color
ꢂ:ꢀ630ꢀnmꢀRed
G:ꢀ626ꢀnmꢀRed
H:ꢀ617ꢀnmꢀRed-Orange
L:ꢀ590/592ꢀAmber
Package
ꢁ:ꢀ5ꢀmmꢀRound
Device Selection Guide for AlInGaP
Color and Dominant Wavelength Luminous Intensity Iv
Luminous Intensity Iv
(mcd) at 20 mA Max.
[3]
[1,2]
[1,2]
Part Number
ld (nm) Typ.
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Amberꢀ590
Redꢀ626
(mcd) at 20 mA Min.
HLMP-ꢁL55-GK0ꢂꢂ
HLMP-ꢁL55-GHKꢂꢂ
HLMP-ꢁL55-HJKxx
HLMP-ꢁL55-JKLꢂꢂ
HLMP-ꢁL55-LP000
HLMP-ꢁG55-GK0ꢂꢂ
HLMP-ꢁG55-HJ0xx
HLMP-ꢁG55-JK0xx
140
140
180
240
400
140
180
240
400
240
310
400
1150
400
310
400
Redꢀ626
Redꢀ626
Device Selection Guide for AlInGaPII
Color and Dominant Wavelength Luminous Intensity Iv
Luminous Intensity Iv
(mcd) at 20 mA Max.
[3]
[1,2]
[1,2]
Part Number
ld (nm) Typ.
(mcd) at 20 mA Min.
HLMP-ꢁL57-LP0xx
HLMP-ꢁH57-LP000
HLMP-ꢁꢂ57-LP0xx
HLMP-ꢁꢂ57-LPT00
Amberꢀ592
400
400
400
400
1150
1150
1150
1150
Red-Orangeꢀ617
Redꢀ630
Redꢀ630
Notes:
1.ꢀTheꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
2.ꢀTheꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
3.ꢀTheꢀdominantꢀwavelength,ꢀl ,ꢀisꢀderivedꢀfromꢀtheꢀCIꢁꢀChromaticityꢀꢂiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
2
Package Dimensions
5.00 0.20
(0.197 0.008)
1.14 0.20
(0.045 0.008)
8.71 0.20
(0.343 0.008
2.35 (0.093)
MAX.
31.60
MIN.
0.70 (0.028)
MAX.
(1.244)
CATHODE
LEAD
0.50 0.10
(0.020 0.004)
SQ. TYP.
1.00
MIN.
(0.039)
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
3
Absolute Maximum Ratings at T = 25°C
A
ꢂCꢀForwardꢀCurrent[1,2,3]ꢀꢀꢀꢀꢀ....................................................................................................... 50ꢀmA
PeakꢀPulsedꢀForwardꢀCurrent[2,3]ꢀꢀ.........................................................................................100ꢀmA
AverageꢀForwardꢀCurrent[3]ꢀꢀꢀ.................................................................................................... 30ꢀmA
ReverseꢀVoltageꢀ(IRꢀ=ꢀ100ꢀµA)ꢀ.......................................................................................................... 5ꢀV
LꢁꢂꢀJunctionꢀTemperatureꢀ......................................................................................................... 130°C
OperatingꢀTemperatureꢀ..........................................................................................–40°Cꢀtoꢀ+100°C
StorageꢀTemperatureꢀ...............................................................................................–40°Cꢀtoꢀ+100°C
Notes:
1.ꢀꢂerateꢀlinearlyꢀasꢀshownꢀinꢀFigureꢀ4.
2.ꢀForꢀlongꢀtermꢀperformanceꢀwithꢀminimalꢀlightꢀoutputꢀdegradation,ꢀdriveꢀcurrentsꢀbetweenꢀ10ꢀmAꢀandꢀ30ꢀmAꢀareꢀrecommended.ꢀꢀ
Forꢀmoreꢀinformationꢀonꢀrecommendedꢀdriveꢀconditions,ꢀpleaseꢀreferꢀtoꢀApplicationꢀBriefꢀI-024ꢀ(5966-3087ꢁ).
3.ꢀPleaseꢀcontactꢀyourꢀAvagoꢀTechnologiesꢀsalesꢀrepresentativeꢀaboutꢀoperatingꢀcurrentsꢀbelowꢀ10ꢀmA.
Electrical/Optical Characteristics at T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
ForwardꢀVoltageꢀ
VFꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ590ꢀnm)ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Red-Orangeꢀ(ldꢀ=ꢀ617ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ626ꢀnm)ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
2.02ꢀ
2.15ꢀ
2.08ꢀ
1.90ꢀ
2.00ꢀ
2.4ꢀ
2.4ꢀ
2.4ꢀ
2.4ꢀ
2.4
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
ReverseꢀVoltageꢀ
VRꢀ
5ꢀ
20ꢀ
ꢀ
Vꢀ
IRꢀ=ꢀ100ꢀµA
PeakꢀWavelengthꢀ
l
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
PꢁAKꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
ꢀ
PeakꢀofꢀWavelengthꢀofꢀSpectralꢀꢀ
ꢂistributionꢀatꢀIFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ590ꢀnm)ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Red-Orangeꢀ(ldꢀ=ꢀ617ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ626ꢀnm)ꢀ
592ꢀ
594ꢀ
623ꢀ
635ꢀ
639
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
SpectralꢀHalfwidthꢀ
ꢀ
ꢀ
∆l1/2ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
17ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
ꢀ
ꢀ
WavelengthꢀWidthꢀatꢀSpectralꢀꢀ
ꢂistributionꢀ1/2ꢀPowerꢀPointꢀatꢀ
IFꢀ=ꢀ20ꢀmA
SpeedꢀofꢀResponseꢀ
ꢀ
τsꢀ
ꢀ
ꢀ
ꢀ
20ꢀ
ꢀ
ꢀ
ꢀ
nsꢀ
ꢀ
ꢁxponentialꢀTimeꢀ
Constant,ꢀe-t/τ
s
Capacitanceꢀ
Cꢀ
ꢀ
ꢀ
40ꢀ
ꢀ
ꢀ
pFꢀ
VFꢀ=ꢀ0,ꢀfꢀ=ꢀ1ꢀMHz
ThermalꢀResistanceꢀ
Luminousꢀꢁfficacy[1]ꢀ
RθJ-PINꢀ
240ꢀ
°C/Wꢀ
LꢁꢂꢀJunction-to-CathodeꢀLead
ηvꢀ
ꢀ
ꢀ
ꢀ
lm/Wꢀ
ꢀ
ꢁmittedꢀLuminousꢀPower/ꢁmittedꢀ
RadiantꢀPowerꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Amberꢀ(ldꢀ=ꢀ590ꢀnm)ꢀ
Amberꢀ(ldꢀ=ꢀ592ꢀnm)ꢀ
Red-Orangeꢀ(ldꢀ=ꢀ617ꢀnm)ꢀ
Redꢀ(ldꢀ=ꢀ626ꢀnm)ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
480ꢀ
500ꢀ
235ꢀ
150ꢀ
155
Redꢀ(ldꢀ=ꢀ630ꢀnm)ꢀ
Note:
1.ꢀTheꢀradiantꢀintensity,ꢀI ,ꢀinꢀwattsꢀperꢀsteradian,ꢀmayꢀbeꢀfoundꢀfromꢀtheꢀequationꢀI ꢀ=ꢀI /η ,ꢀwhereꢀI ꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelasꢀandꢀη ꢀ
e
e
v
v
v
v
isꢀtheꢀluminousꢀefficacyꢀinꢀlumens/watt.
4
1.0
RED-ORANGE
RED
AMBER
0.5
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. peak wavelength.
3.0
2.5
2.0
1.5
1.0
100
90
50
40
30
20
80
70
Rθ = 585° C/W
JA
60
RED
50
Rθ = 780° C/W
JA
40
AMBER
30
20
10
0
0.5
0
10
0
1.0
0
20
40
60
0
20
40
60
80
100
1.5
2.0
2.5
3.0
I
– DC FORWARD CURRENT – mA
T
– AMBIENT TEMPERATURE – °C
V
– FORWARD VOLTAGE – V
F
A
F
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs.
forward current.
Figure 4. Maximum forward current vs. ambient
temperature. Derating based on TJMAX = 130°C.
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
θ – ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative spatial radiation pattern for 55° viewing angle lamps.
5
Intensity Bin Limits
(mcd at 20 mA)
Amber Color Bin Limits
(nm at 20 mA)
Bin Name
Min.
Max.
180
240
310
400
520
680
880
1150
Bin Name
Min.
Max.
Gꢀ
Hꢀ
Jꢀ
140ꢀ
180ꢀ
240ꢀ
310ꢀ
400ꢀ
520ꢀ
680ꢀ
880ꢀ
1ꢀ
2ꢀ
4ꢀ
6ꢀ
584.5ꢀ
587.0ꢀ
589.5ꢀ
592.0ꢀ
587.0
589.5
592.0ꢀ
594.5
Kꢀ
Lꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
ꢀ
Mꢀ
Nꢀ
Pꢀ
Note:
1.ꢀ Binꢀcategoriesꢀareꢀestablishedꢀforꢀclassifi-
cationꢀofꢀproducts.ꢀProductsꢀmayꢀnotꢀbeꢀ
availableꢀinꢀallꢀbinꢀcategories.ꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ15%.
ꢀ
6
Note:ꢀ
Precautions:
Lead Forming:
1.ꢀ PCBꢀwithꢀdifferentꢀsizeꢀandꢀdesignꢀ(componentꢀdensity)ꢀwillꢀhaveꢀ
differentꢀheatꢀmassꢀ(heatꢀcapacity).ꢀThisꢀmightꢀcauseꢀaꢀchangeꢀinꢀ
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ
settingꢀisꢀused.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.
2.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLꢁꢂꢀareꢀusingꢀhighꢀefficiencyꢀ
Lꢁꢂꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀtakeꢀextraꢀprecautionꢀduringꢀwaveꢀsolderingꢀtoꢀensureꢀthatꢀtheꢀ
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀsolderꢀ
contactꢀ timeꢀ doesꢀ notꢀ exceedingꢀ 3sec.ꢀ Over-stressingꢀ theꢀ Lꢁꢂꢀ
duringꢀsolderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLꢁꢂꢀ
dueꢀtoꢀdelamination.
•ꢀ TheꢀleadsꢀofꢀanꢀLꢁꢂꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
•ꢀ Forꢀbetterꢀcontrol,ꢀitꢀisꢀrecommendedꢀtoꢀuseꢀproperꢀ
toolꢀtoꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀ
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀaꢀ
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ
dueꢀtoꢀleadꢀcuttingꢀfromꢀtravelingꢀintoꢀLꢁꢂꢀpackage.ꢀ
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀopera-
tion,ꢀasꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀ
sink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ CareꢀmustꢀbeꢀtakenꢀduringꢀPCBꢀassemblyꢀandꢀsolderingꢀ
processꢀtoꢀpreventꢀdamageꢀtoꢀtheꢀLꢁꢂꢀcomponent.ꢀ
CATHODE
•ꢀ Lꢁꢂꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ
toꢀPCB.ꢀHowever,ꢀitꢀisꢀonlyꢀrecommendedꢀunderꢀun-
avoidableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀ
manualꢀ solderingꢀ distanceꢀ ofꢀ theꢀ solderingꢀ heatꢀ
sourceꢀ (solderingꢀ iron’sꢀ tip)ꢀ toꢀ theꢀ bodyꢀ isꢀ 1.59mm.ꢀ
ꢀ
Note:ꢀꢁlectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLꢁꢂꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ
waveꢀsolderingꢀshouldꢀbeꢀlooselyꢀfittedꢀandꢀshouldꢀ
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLꢁꢂ.ꢀNonꢀmetalꢀmate-
rialꢀisꢀrecommendedꢀasꢀitꢀwillꢀabsorbꢀlessꢀheatꢀduringꢀ
waveꢀsolderingꢀprocess.
1.59mm
•ꢀ Atꢀelevatedꢀtemperature,ꢀLꢁꢂꢀisꢀmoreꢀsusceptibleꢀtoꢀ
mechanicalꢀ stress.ꢀ Therefore,ꢀ PCBꢀ mustꢀ allowedꢀ toꢀ
coolꢀ downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ
whichꢀincludesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
SolderingꢀtheꢀLꢁꢂꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ
1.59mmꢀmightꢀdamageꢀtheꢀLꢁꢂ.
•ꢀ ꢁSꢂꢀprecautionꢀmustꢀbeꢀproperlyꢀappliedꢀonꢀtheꢀsol-
deringꢀstationꢀandꢀpersonnelꢀtoꢀpreventꢀꢁSꢂꢀdamageꢀ
toꢀtheꢀLꢁꢂꢀcomponentꢀthatꢀisꢀꢁSꢂꢀsensitive.ꢀꢂoꢀreferꢀ
toꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀTheꢀsol-
deringꢀironꢀusedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀensureꢀ
electrostaticꢀchargeꢀisꢀproperlyꢀgrounded.
•ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLꢁꢂꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommend-
edꢀthatꢀsurfaceꢀmountꢀcomponentsꢀbeꢀsolderedꢀonꢀ
theꢀtopꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀ
onꢀtheꢀbottomꢀside,ꢀtheseꢀcomponentsꢀshouldꢀbeꢀsol-
deredꢀusingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀ
Lꢁꢂ.
•ꢀ Recommendedꢀsolderingꢀcondition:
Wave
Soldering
Manual Solder
Dipping
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
[1, 2]
sizeꢀforꢀLꢁꢂꢀcomponentꢀleads.
Pre-heatꢀtemperature
Preheatꢀtime
105ꢀ°CꢀMax.
60ꢀsecꢀMax
250ꢀ°CꢀMax.
3ꢀsecꢀMax.
-
LED component
lead size
Plated through
hole diameter
-
Diagonal
Peakꢀtemperature
ꢂwellꢀtime
260ꢀ°CꢀMax.
5ꢀsecꢀMax
0.45ꢀxꢀ0.45ꢀmm
0.636ꢀmm
0.98ꢀtoꢀ1.08ꢀmm
(0.018xꢀ0.018ꢀinch) (0.025ꢀinch) (0.039ꢀtoꢀ0.043ꢀinch)
0.50ꢀxꢀ0.50ꢀmm 0.707ꢀmm 1.05ꢀtoꢀ1.15ꢀmm
(0.020xꢀ0.020ꢀinch) (0.028ꢀinch) (0.041ꢀtoꢀ0.045ꢀinch)
Note:ꢀ
1)ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.
2)ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ
thermalꢀstressꢀexperiencedꢀbyꢀLꢁꢂ.
•ꢀ Over-sizingꢀtheꢀPTHꢀcanꢀleadꢀtoꢀtwistedꢀLꢁꢂꢀafterꢀ
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀ
canꢀcauseꢀdifficultyꢀinsertingꢀtheꢀTHꢀLꢁꢂ.
•ꢀ Waveꢀ solderingꢀ parametersꢀ mustꢀ beꢀ setꢀ andꢀ main-
tainedꢀ accordingꢀ toꢀ theꢀ recommendedꢀ tempera-
tureꢀandꢀdwellꢀtime.ꢀCustomerꢀisꢀadvisedꢀtoꢀperformꢀ
dailyꢀ checkꢀ onꢀ theꢀ solderingꢀ profileꢀ toꢀ ensureꢀ thatꢀ
itꢀ isꢀ alwaysꢀ conformingꢀ toꢀ recommendedꢀ solderingꢀ
conditions.
7
ReferꢀtoꢀapplicationꢀnoteꢀAN5334ꢀforꢀmoreꢀinformationꢀaboutꢀsolderingꢀandꢀhandlingꢀofꢀhighꢀbrightnessꢀTHꢀLꢁꢂꢀlamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Pack Drawing
6.35 1.30
(0.25 0.0512)
12.70 1.00
(0.50 0.0394)
CATHODE
20.50 1.00
(0.807 0.039)
9.125 0.625
(0.3593 0.0246)
18.00 0.50
(0.7087 0.0197)
A
A
4.00 0.20
(0.1575 0.008)
12.70 0.30
(0.50 0.0118)
∅
TYP.
VIEW A–A
0.70 0.20
(0.0276 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
8
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
O
+
N
G
L
A
O
S
E
A
C
V
N
E
I
D
A
H
O
G
O
A
E
D
O
C
H
T
A
E
T
–
C
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
O
M
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
9
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢀ
ꢁxample:ꢀ
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(Applicableꢀ forꢀ partꢀ numberꢀ withꢀ colorꢀ binsꢀ butꢀ
withoutꢀVFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀ
noꢀcolorꢀbin)
ꢀ
ꢀ
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin
ORꢀ
ꢀ
ꢀ
ꢀ
BIN:ꢀ2VB
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin
VB:ꢀVFꢀbinꢀ“VB”
(Applicableꢀforꢀpartꢀnumberꢀthatꢀhaveꢀbothꢀcolorꢀ
binꢀandꢀVFꢀbin)
2:ꢀꢀColorꢀbinꢀ2ꢀonly
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4364EN
AV02-1541EN - January 20, 2009
相关型号：
©2020 ICPDF网 联系我们和版权申明