HLMP-HB74 [AVAGO]
Well defined spatial radiation pattern;
| 型号： | HLMP-HB74 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Well defined spatial radiation pattern |
| 文件： | 总15页 (文件大小：985K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Red, Green, and Blue
5mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
Well defined spatial radiation pattern
High brightness material
Available in red, green and blue color
specifically designed for full color/video and passenger
information signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent for
wide field of view outdoor applications where a wide viewing
angle and readability in sunlight are essential. The package
epoxy contains UV inhibitor to reduce the effects of long term
exposure to direct sunlight.
—
—
—
Red AlInGaP 626 nm
Green InGaN 530 nm
Blue InGaN 470 nm
Superior resistance to moisture
Standoff and non-standoff Package
Tinted and diffused
Applications
Typical viewing angle 40° × 100°
Full Color Signs
CAUTION
InGaN devices are Class 1C HBM ESD sensitive
per JEDEC Standard. Please observe appropriate
precautions during handling and processing.
Refer to Application Note AN-1142 for additional
details.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Package Dimensions
Package Dimensions
Package Drawing A
MEASURED AT BASE OF LENS.
1.02
0.040
MAX.
0.50 0.10
0.020 0.004
3.80
0.150
SQ. TYP.
0.70
0.028
MAX.
5.20
0.204
CATHODE LEAD
1.00
0.039
2.54
0.10
MIN.
7.00
0.275
25.00
0.984
MIN.
Package Drawing B
1.30 0.20
MEASURED AT BASE OF LENS.
0.50 0.10
0.020 0.004
SQ TYP.
10.80 0.50
0.425 0.020
0.051 0.008
3.80 0.20
0.150 0.008
0.70
MAX. Refer to Note 1
0.028
5.20 0.20
0.205 0.008
CATHODE LEAD
1.00
0.039
MIN.
2.54 0.30
0.10 0.012
7.00 0.20
24.00
0.945
MIN.
0.276 0.008
1.02
0.040
MAX.
NOTE
1. This dimension does not apply to the Red LED.
2. All dimensions are in millimeters (inches).
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Device Selection Guide
Device Selection Guide
Luminous Intensity Iv (mcd)
at 20 mAb,c,d
Color and Dominant
Wavelength d (nm)
Typical Viewing
Angle (°)e
Package
Drawing
Part Number
Standoff
Typa
Min
Max
HLMP-HG74-XY0DD
HLMP-HG75-XY0DD
HLMP-HM74-34BDD
HLMP-HM75-34BDD
HLMP-HM74-34CDD
HLMP-HM75-34CDD
HLMP-HB74-UVBDD
HLMP-HB75-UVBDD
HLMP-HB74-UVCDD
HLMP-HB75-UVCDD
Red 626
1660
1660
4200
4200
4200
4200
960
2400
2400
6050
6050
6050
6050
1380
1380
1380
1380
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
40 × 100
A
B
A
B
A
B
A
B
A
B
Red 626
Green 530
Green 530
Green 530
Green 530
Blue 470
Blue 470
Blue 470
Blue 470
960
960
960
a.
b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
c. The optical axis is closely aligned with the package mechanical axis.
d. Tolerance for each bin limit is 15%.
Dominant wavelength,d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
e.
½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Part Numbering System
Part Numbering System
HLMP – H x xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
B : Color Bin 2 & 3
C : Color Bin 3 & 4
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Standoff/Non Standoff
74: Non Standoff
75: Standoff
Color
G : Red
M: Green
B : Blue
Package
H: 5 mm Standard Oval 40° x 100°
Absolute Maximum Ratings at TJ = 25 °C
Parameter
DC Forward Currenta
Red
Green/Blue
Unit
mA
50
30
100b
120
100c
114
Peak Forward Current
mA
Power Dissipation
mW
°C
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
110
–40 to +100
–40 to +85
°C
–40 to +100
°C
a. Derate linearly as shown in Figure 4 and Figure 8.
b. Duty Factor 30%, frequency 1 KHz.
c.
Duty Factor 10%, frequency 1 KHz.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Electrical/Optical Characteristics at T = 25 °C
J
Electrical/Optical Characteristics at TJ = 25 °C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
V
IF = 20 mA
Red
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
Green
Blue
Reverse Voltagea
Red
VR
V
5
5
IR = 100 μA
IR = 10 μA
Green and Blue
Dominant Wavelengthb
d
nm
IF = 20 mA
618
523
464
626
530
470
630
535
476
Red
Green
Blue
Peak Wavelength
PEAK
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Red
634
521
464
Green
Blue
Thermal Resistance
RJ-PIN
240
°C/W
lm/W
LED Junction-to-Pin
Luminous Efficacyc
V
Emitted Luminous Power/Emitted Radiant
Power
218
538
65
Red
Green
Blue
a.
Indicates product final testing condition. Long term reverse bias is not recommended.
b. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
c.
The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous
efficacy in lumens/watt.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
AlInGaP Red
AlInGaP Red
Figure 1 Relative Intensity vs. Wavelength
Figure 2 Forward Current vs. Forward Voltage
1
0.8
0.6
0.4
0.2
0
100
80
60
40
20
0
550
600
650
700
0
1
2
3
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 3 Relative Intensity vs. Forward Current
Figure 4 Maximum Forward Current vs. Ambient Temperature
60
50
40
30
20
10
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
0
20
40
60
80
100
DC FORWARD CURRENT-mA
TA - AMBIENT TEMPERATURE - °C
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
InGaN Green and Blue
InGaN Green and Blue
Figure 5 Relative Intensity vs. Wavelength
Figure 6 Forward Current vs. Forward Voltage
1.0
100
BLUE
0.9
0.8
0.7
80
60
40
20
0
GREEN
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
0
1
2
3
4
5
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 7 Relative Intensity vs. Forward Current
Figure 8 Maximum Forward Current vs. Ambient Temperature
35
30
25
20
15
10
5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Green
Blue
80
0
0
20
40
60
80
100
0
20
40
60
100
120
TA - AMBIENT TEMPERATURE - °C
FORWARD CURRENT-mA
Figure 9 Relative Dominant Wavelength vs. Forward Current
6
4
2
0
Blue
-2
-4
Green
-6
-8
0
20
40
60
80
100
120
FORWARD CURRENT-mA
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
InGaN Green and Blue
Figure 10 Radiation Pattern – Major Axis
Figure 11 Radiation Pattern – Minor Axis
1.0
0.8
1.0
0.8
0.6
Red
Green
Blue
0.6
0.4
0.2
0.0
0.4
Red
0.2
Green
Blue
0.0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT (°)
ANGULAR DISPLACEMENT (°)
Figure 12 Relative Light Output vs. Junction Temperature
Figure 13 Forward Voltage Shift vs. Junction Temperature
0.5
10
Green
Red
Blue
Green
0.4
Red
0.3
Blue
0.2
0.1
0
1
-0.1
-0.2
-0.3
-0.4
0.1
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20 40
60 80 100 120 140
TJ -JUNCTION TEMPERATURE
TJ -JUNCTION TEMPERATURE
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Intensity Bin Limit Table (1.2: 1 lv Bin Ratio)
Intensity Bin Limit Table (1.2: 1 lv Bin
Ratio)
Green Color Bin Table
Min
Dom
Max
Dom
Bin
Chromaticity Coordinate
Intensity (mcd) at 20 mA
Bin
2
523
527
531
527
531
535
x
y
x
y
x
y
0.0979 0.1450 0.1711 0.1305
0.8316 0.7319 0.7218 0.8189
0.1305 0.1711 0.1967 0.1625
0.8189 0.7218 0.7077 0.8012
0.1625 0.1967 0.2210 0.1929
0.8012 0.7077 0.6920 0.7816
Min
Max
U
V
W
X
Y
Z
1
960
1150
1380
1660
1990
2400
2900
3500
4200
5040
6050
3
4
1150
1380
1660
1990
2400
2900
3500
4200
5040
Tolerance for each bin limit is 0.5 nm.
2
Blue Color Bin Table
3
4
Min
Dom
Max
Dom
Bin
Chromaticity Coordinate
Tolerance for each bin limit is 15 %.
2
464
468
472
468
472
476
x
y
x
y
x
y
0.1374 0.1766 0.1699 0.1291
0.0374 0.0966 0.1062 0.0495
0.1291 0.1699 0.1616 0.1187
0.0495 0.1062 0.1209 0.0671
0.1187 0.1616 0.1517 0.1063
0.0671 0.1209 0.1423 0.0945
VF Bin Table (V at 20mA)
3
4
Bin ID
Min
Max
VD
VA
VB
1.8
2.0
2.2
2.0
2.2
2.4
Tolerance for each bin limit is 0.5 nm.
NOTE All bin categories are established for
classification of products. Products may not
be available in all bin categories. Please
contact your Avago representative for further
information.
NOTE
Tolerance for each bin limit is 0.05V.
V binning only applicable to Red color.
F
Red Color Range
Min Dom Max Dom
618.0
630.0
x
y
0.6872 0.6690 0.6890 0.7080
0.3126 0.3149 0.2943 0.2920
Tolerance for each bin limit is 0.5 nm.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Avago Color Bin on CIE 1931 Chromaticity Diagram
soldering iron tip closer than 1.59 mm might damage the
LED.
Avago Color Bin on CIE 1931 Chromaticity
Diagram
1.59 mm
1.000
0.800
ESD precaution must be properly applied on the soldering
station and personnel to prevent ESD damage to the LED
component that is ESD sensitive. Refer to Avago
application note AN 1142 for details. The soldering iron
used should have a grounded tip to ensure that
electrostatic charge is properly grounded.
Green 2 3
4
0.600
Recommended soldering condition follows.
0.400
Manual Solder
b
Wave Solderinga,
Dipping
Red
0.200
Blue
Pre-heat temperature 105 °C Max.
—
Preheat time
60 s Max
260 °C Max.
5 s Max.
—
4
3
2
Peak temperature
Dwell time
260 °C Max.
5 s Max
0.000
0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800
X
a.
The above conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
b. It is recommended to use only bottom preheaters to reduce thermal
stress experienced by the LED.
Precautions
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. The customer is advised to perform a daily check on
the soldering profile to ensure that it always conforms to
the recommended soldering conditions.
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on the PC board.
For better control, it is recommended to use the proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
NOTE
1. PCBs with different size and design (component
density) will have different heat mass (heat
capacity). This might cause a change in
If manual lead cutting is necessary, cut the leads after the
soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress due to
lead cutting from traveling into LED package. This is highly
recommended for hand solder operation, as the excess
lead length also acts as small heat sink.
temperature experienced by the board if the
same wave soldering setting is used. So, it is
recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a
high efficiency LED die with single wire bond as
shown on the next page. The customer is advised
to take extra precautions during wave soldering
to ensure that the maximum wave temperature
does not exceed 260 °C and the solder contact
time does not exceed 5 s. Over-stressing the LED
during soldering process might cause premature
failure to the LED due to delamination.
Soldering and Handling
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
The LED component may be effectively hand soldered to
PCB. However, it is only recommended under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source (soldering
iron’s tip) to the body is 1.59 mm. Soldering the LED using
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Avago Technologies LED Configuration
The recommended PC board plated through holes (PTH)
size for LED component leads follows.
Avago Technologies LED Configuration
LED component lead
size
Plated through hole
diameter
Diagonal
0.45 mm × 0.45 mm
(0.018 in. × 0.018 in.)
0.636 mm
(0.025 in.)
0.98 mm to 1.08 mm
(0.039 in. to 0.043 in.)
0.50 mm × 0.50 mm
(0.020 in. × 0.020 in.)
0.707 mm
(0.028 in.)
1.05 mm to 1.15 mm
(0.041 in. to 0.045 in.)
CATHODE
ANODE
Over-sizing the PTH can lead to a twisted LED after
clinching. On the other hand under-sizing the PTH can
cause difficulty when inserting the TH LED.
AlInGaP Device
InGaN Device
Refer to application note AN4334 for more information
about soldering and handling of high brightness TH LED
lamps.
Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on the LED. Non-metal material is
recommended because it will absorb less heat during
wave soldering process.
At elevated temperatures, the LED is more susceptible to
mechanical stress. Therefore, the PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of the alignment fixture or pallet.
If the PCB board contains both through hole (TH) LEDs and
other surface mount components, it is recommended that
surface mount components be soldered on the top side of
the PCB. If surface mount must be on the bottom side,
these components should be soldered using reflow
soldering prior to insertion of the TH LED.
Application Precautions
1. The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated in
the data sheet. Constant current driving is recommended
to ensure consistent performance.
2. LEDs exhibit slightly different characteristics at different
drive currents that might result in larger performance
variation (i.e., intensity, wavelength, and forward voltage).
The user is recommended to set the application current as
close as possible to the test current to minimize these
variations.
3. The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When driving
the LED in matrix form, it is crucial to ensure that the
reverse bias voltage does not exceed the allowable limit of
the LED.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Example of Wave Soldering Temperature Profile for TH LED
Example of Wave Soldering Temperature Profile for TH LED
260° C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255° C 5° C
(maximum peak temperature = 260° C)
105° C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5 sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
4.00 0.20
0.1575 0.008
Ø
TYP
A
A
12.70 0.30
0.50 0.0118
VIEW A-A
0.70 0.20
0.0276 0.0079
NOTE All dimensions in millimeters (inches).
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Packaging Box for Ammo Packs
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE For the InGaN device, the ammo pack packaging box contains the ESD logo.
Avago Technologies
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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Data Sheet
Packaging Label
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
(1P) Item: Part Number
RoHS Compliant
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Avago Technologies
- 14 -
Example:
Acronyms and Definition
BIN:
(i) Color bin only or VF bin only
—
—
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without VF
bin OR part number with VF bins and no color bin)
(ii) Color bin incorporate with VF Bin
BIN: 2VB, where:
—
OR
2 is color bin 2 only
VB is VF bin "VB"
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin and
VF bin)
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or
assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or
applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage,
expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago Technologies and the A logo are trademarks of Avago Technologies in the United
States and other countries. All other brand and product names may be trademarks of their
respective companies.
Data subject to change. Copyright © 2012–2016 Avago Technologies. All Rights Reserved.
AV02-2725EN – June 20, 2016
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