HLMP-HD57-PQ0DD [AVAGO]
SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-HD57-PQ0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, RED, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 |
| 文件： | 总8页 (文件大小：362K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-HD57
5 mm Standard Oval
Precision Optical Performance Red LED
Data Sheet
Description
Features
This Precision Optical Performance Oval LED is specifi-
cally designed for Full Color/Video and Passenger Infor-
mation Signs. The Oval shaped radiation pattern and high
luminous intensity ensure that this device is excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
This lamp has very smooth, matched radiation patterns
ensuring consistent color mixing in full color applica-
tions, message uniformity across the viewing angle of
the sign. High efficiency LED material is used in this lamp:
Aluminium Indium Gallium Phosphide (AlInGaP) for Red
Color. The higher performance AlInGaP II is used.
• Well defined spatial radiation pattern
• High brightness material
• Red AlInGaP 630 nm
• Tinted and diffused
• Typical viewing angle 40°x100°
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments
Applications
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
• Full color signs
• Commercial outdoor advertising
Package Dimensions
1.02
(0.040)
MAX.
10.85 ± 0.50
(0.427 ± 0.019)
NOTE:
MEASURED AT BASE OF LENS.
1.50 ± 0.15
(0.059 ± 0.006)
3.80
(0.150)
0.50 ± 0.10
(0.020 ± 0.004)
0.70
(0.028)
SQ. TYP.
MAX.
2.54
(0.10)
5.20
(0.204)
7.00
(0.275)
24.00
MIN.
(0.945)
1.00
(0.039)
MIN.
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
Device Selection Guide
Color and
Dominant
Wavelength
Luminous
Intensity
Iv (mcd) at
20 mA Min.
Luminous
Intensity
Iv (mcd) at
20 mA Max.
Tinting
Type
Part Number
λ (nm) Typ.
d
HLMP-HD57-NR0xx
Red 630
680
1900
Red
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
ꢀ. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the Chromaticity Diagram and represents the color of the lamp.
d
4. Tolerance for luminous intensity is 15ꢁ.
Part Numbering System
H L M P - x x x x - x x x x x
Mechanical Options
00: Bulk Packaging
zz: Flexi-bin; Ammo Packs
Color Bin Selections
0: No Color Bin Limitation
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D: 630 nm Red
Package
H: 5 mm Oval 40º x 100º
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Ratings at T = 25˚C
A
Parameter
Value
DC Forward Current[1]
Peak Pulsed Forward Current [ꢀ]
Average Forward Current
Power Dissipation
50 mA
100 mA
30 mA
1ꢀ0 mW
Reverse Voltage
5 V (IR = 100 µA)
130˚C
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Notes:
–40˚C to +100˚C
–40˚C to +100˚C
1. Derate linearly as shown in Figure 3.
ꢀ. Duty Factor 30ꢁ, Frequency 1 KHz.
ꢀ
Electrical/Optical Characteristics
T = 25˚C
Parameter
Forward Voltage
Reverse Voltage
Capacitance
A
Symbol
VF
Min.
Typ.
ꢀ.ꢀ
Max.
ꢀ.4
Units
V
Test Conditions
IF = ꢀ0 mA
VR
5
IR = 100 µA
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RθJ-PIN
ꢀ40
˚C/W
LED Junction-to-Cathode
Lead
Dominant Wavelength [1]
Peak Wavelength
λd
λp
6ꢀꢀ
630
639
634
nm
nm
IF = ꢀ0 mA
Peak of Wavelength of
Spectral Distribution at
IF = ꢀ0 mA
Spectral Halfwidth
∆λ1/ꢀ
17
nm
Wavelength Width at
Spectral Distribution
1
/ Power
ꢀ
Point at IF = ꢀ0 mA
Luminous Efficacy [ꢀ]
ηv
155
lm/W
Emitted luminous power/
Emitted radiant power
IF = ꢀ0 mA
Luminous Flux
Luminous Efficiency [3]
jV
1300
30
mlm
ηe
lm/W
Luminous Flux/Electrical Power
IF = ꢀ0 mA
Notes:
1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
ꢀ. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/η where Iv is the luminous intensity in candelas and η is
v
v
the luminous efficacy in lumens/watt.
= j / I x V , where j is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
3.
η
e
V
F
F
V
1.0
0.5
0
2.5
2.0
1.5
1.0
0.5
0
60
50
40
30
20
10
0
0
10
20
30
40
50
550
600
650
700
0
20
40
60
80
100
TA- AMBIENT TEMPERATURE - o
C
WAVELENGTH – nm
FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
Figure 2. Relative luminous intensity vs.
forward current.
Figure 3. Forward current vs. ambient
temperature.
3
50
40
30
20
10
0
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
-90
-70
-50
-30
-10
10
30
50
70
90
V
– FORWARD VOLTAGE – V
F
ANGLE – DEGREES
Figure 4. Forward current vs. forward voltage.
Figure 5. Spatial radiation pattern-minor axis.
1.0
Intensity Bin Limits
(mcd at 20 mA)
Bin Name
Min.
Max.
N
P
Q
R
680
880
1150
1500
880
1150
1500
1900
0.5
Tolerance will be 15ꢁ of these limits.
0
-90
Note:
-70
-50
-30
-10
10
30
50
70
90
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
ANGLE – DEGREES
Figure 6. Spatial radiation pattern-major axis.
10
1
0.1
-40
-20
0
20
40
60
80
100
120
TJ - JUNCTION TEMPERATURE - °C
Figure 7. Relative Light Output vs Junction Temperature
4
Note:
Precautions:
Lead Forming:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
ꢀ. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed ꢀ50°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
CATHODE
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 114ꢀ for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
• Recommended PC board plated through holes (PTH)
Pre-heat temperature
Preheat time
105 °C Max.
60 sec Max
ꢀ50 °C Max.
3 sec Max.
-
size for LED component leads.
-
LED component
lead size
Plated through
hole diameter
Peak temperature
Dwell time
ꢀ60 °C Max.
5 sec Max
Diagonal
0.45 x 0.45 mm
(0.018x 0.018 inch) (0.0ꢀ5 inch) (0.039 to 0.043 inch)
0.636 mm
0.98 to 1.08 mm
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
ꢀ) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.0ꢀ0x 0.0ꢀ0 inch) (0.0ꢀ8 inch) (0.041 to 0.045 inch)
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
5
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.025)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
A
4.00 ± 0.20
(0.1575 ± 0.0079)
12.70 ± 0.30
(0.50 ± 0.0118)
�
TYP.
VIEW A-A
0.70 ± 0.20
(0.0276 ± 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff.
6
Packaging Box for Ammo Packs
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
7
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: ꢀ (represent color bin ꢀ only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: ꢀVB
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
ꢀ: Color bin ꢀ only
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4176EN
AV02-0387EN - September 2, 2008
相关型号：
HLMP-HG63-U10DD
Single Color LED, Red, Tinted Diffused, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
AVAGO
©2020 ICPDF网 联系我们和版权申明