HLMP-HL71 [AVAGO]
5mm Standard Oval Red and Amber LEDs;型号: | HLMP-HL71 |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | 5mm Standard Oval Red and Amber LEDs |
文件: | 总13页 (文件大小:1032K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HLMP-HG70/71, HLMP-HL70/71
5mm Standard Oval Red and Amber LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifically
designed for full color/video and passenger information signs.
The oval shaped radiation pattern and high luminous intensity
ensure that these devices are excellent for wide field of view
outdoor applications where a wide viewing angle and
readability in sunlight are essential. The package epoxy
contains UV inhibitors to reduce the effects of long term
exposure to direct sunlight.
Well defined spatial radiation pattern
High brightness material
Available in Red and Amber
—
—
Red AlInGaP 626 nm
Amber AlInGaP 590 nm
Superior resistance to moisture
Standoff and non-standoff Package
Tinted and diffused
Typical viewing angle 40° × 100°
Applications
Gas Price Signs
Mono Color Signs – Marquees
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Package Dimensions
Package Dimensions
Package Drawing A
1.02
0.040
3.80
0.150
0.50 0.10
0.020
MAX.
0.004SQ. TYP.
0.70
0.028
MAX.
5.20
0.204
2.54
0.10
CATHODE
LEAD
1.00
0.039
MIN.
7.00
0.275
25.00
0.984
MIN.
Package Drawing B
MEASURED AT BASE OF LENS.
0.50 0.10
10.80 0.50
0.425 0.020
1.30 0.20
0.051 0.008
0.004 SQ TYP.
3.80 0.20
0.150 0.008
0.020
5.20 0.20
0.205 0.008
CATHODE LEAD
2.54 0.30
7.00 0.20
24.00
MIN.
1.00
0.10 0.012
0.276 0.008
0.945
1.02
MIN.
MAX.
0.039
0.040
NOTE
1. All dimensions in millimeters (inches).
2. Tolerance is 0.20 mm unless otherwise specified.
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Device Selection Guide
Device Selection Guide
Luminous Intensity Iv (mcd)
at 20 mAb,c,d
Color and Dominant
Wavelength d (nm)
Typical Viewing
Angle (°)e
Package
Drawing
Part Number
Standoff
Typa
Min
Max
HLMP-HG70-VX0DD
HLMP-HL70-XZ0DD
HLMP-HL71-XZ0DD
Red 626
1150
1660
1660
1990
2900
2900
No
No
Yes
40 × 100
A
A
B
Amber 590
Amber 590
a.
b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
c. The optical axis is closely aligned with the package mechanical axis.
d. Tolerance for each bin limit is 15%.
e. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
Dominant wavelength,d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Part Numbering System
HLMP – H x xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Standoff/Non Standoff
70 : Without Standoff
71 : With Standoff
Color
G: Red
L : Amber
Package
H: 5 mm Standard Oval 40° x 100°
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Absolute Maximum Ratings (T = 25 °C)
J
Absolute Maximum Ratings (TJ = 25 °C)
Parameter
DC Forward Currenta
Red/Amber
Unit
mA
50
100b
120
Peak Forward Current
mA
Power Dissipation
mW
°C
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
–40 to +100
–40 to +100
°C
°C
a.
Derate linearly as shown in Figure 4.
b. Duty Factor 30%, frequency 1 KHz.
Electrical/Optical Characteristics (TJ = 25 °C)
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
1.8
2.1
2.4
V
IF = 20 mA
IR = 100 μA
Red and Amber
Reverse Voltagea
Red and Amber
VR
5
V
Dominant Wavelengthb
d
nm
IF = 20 mA
618.0
584.50
626.0
590.0
630.0
594.5
Red
Amber
Peak Wavelength
Red
PEAK
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
634
594
Amber
Thermal Resistance
RJ-PIN
240
°C/W
lm/W
LED Junction-to-Pin
Luminous Efficacyc
V
Emitted Luminous Power/Emitted Radiant
Power
190
490
Red
Amber
Thermal Coefficient of d
nm/°C
IF = 20 mA
+25 °C ≤ TJ ≤ +100 °C
0.05
0.09
Red
Amber
a.
Indicates product final testing condition. Long term reverse bias is not recommended.
b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
c.
The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous
efficacy in lumens/watt.
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Electrical/Optical Characteristics (T = 25 °C)
J
Figure 1 Relative Intensity vs. Wavelength
Figure 2 Forward Current vs. Forward Voltage
1.0
100
80
60
40
20
0
0.8
Amber
Red
0.6
0.4
0.2
0.0
500
550
600
650
700
0
1
2
3
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 3 Relative Intensity vs. Forward Current
Figure 4 Maximum Forward Current vs. Ambient Temperature
60
50
40
30
20
10
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
0
20
40
60
80
100
DC FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - C
Figure 5 Radiation Pattern for RED – Major Axis
Figure 6 Radiation Pattern for RED – Minor Axis
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Electrical/Optical Characteristics (T = 25 °C)
J
Figure 7 Radiation Pattern for AMBER – Major Axis
Figure 8 Radiation Pattern for AMBER – Minor Axis
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 9 Relative Light Output vs. Junction Temperature
Figure 10 Forward Voltage Shift vs. Junction Temperature
10
0.6
Amber
Red
Amber
Red
0.5
0.4
0.3
0.2
0.1
0
1
-0.1
-0.2
-0.3
0.1
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
TJ - JUNCTION TEMPERATURE
TJ - JUNCTION TEMPERATURE
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Intensity Bin Limit Table (1.2: 1 lv Bin Ratio)
Intensity Bin Limit Table (1.2: 1 lv Bin
Ratio)
Red Color Range
Min Dom Max Dom
Chromaticity Coordinate
Intensity (mcd) at 20 mA
Bin
618.0
630.0
x
y
0.6872 0.6690 0.6890 0.7080
0.3126 0.3149 0.2943 0.2920
Min
Max
V
W
X
1150
1380
1660
1990
2400
1380
1660
1990
2400
2900
Tolerance for each bin limit is 0.5 nm.
Amber Color Bin Table
Y
Z
Min
Dom
Max
Dom
Bin
Chromaticity Coordinate
Tolerance for each bin limit is 15 %.
1
2
4
6
584.5
587.0
x
y
x
y
x
y
x
y
0.5420 0.5370 0.5530 0.5570
0.4580 0.4550 0.4400 0.4420
0.5570 0.5530 0.5670 0.5720
0.4420 0.4400 0.4250 0.4270
0.5720 0.5670 0.5820 0.5870
0.4270 0.4250 0.4110 0.4130
0.5870 0.5820 0.5950 0.6000
0.4130 0.4110 0.3980 0.3990
VF Bin Table (V at 20mA)
587.0
589.5
592.0
589.5
592.0
594.5
Bin ID
Min
Max
VD
VA
VB
1.8
2.0
2.2
2.0
2.2
2.4
NOTE
Tolerance for each bin limit is 0.5 nm.
1. Tolerance for each bin limit is 0.05V.
2. V binning only applicable to Red color.
NOTE All bin categories are established for
classification of products. Products may not
be available in all bin categories. Please
contact your Avago representative for further
information.
F
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Avago Color Bin on CIE 1931 Chromaticity Diagram
soldering iron tip closer than 1.59 mm might damage
the LED.
Avago Color Bin on CIE 1931 Chromaticity
Diagram
1.59 mm
0.480
0.460
1
0.440
Amber
2
ESD precaution must be properly applied on the soldering
station and personnel to prevent ESD damage to the LED
component that is ESD sensitive. Refer to Avago
application note AN 1142 for details. The soldering iron
used should have a grounded tip to ensure that
electrostatic charge is properly grounded.
0.420
0.400
0.380
0.360
0.340
0.320
0.300
0.280
4
6
Recommended soldering condition follows.
Manual Solder
b
Wave Solderinga,
Dipping
Pre-heat temperature 105 °C Max.
—
Red
Preheat time
60 s Max
260 °C Max.
5 s Max.
—
Peak temperature
Dwell time
260 °C Max.
5 s Max
0.500
0.550
0.600
0.650
0.700
0.750
0.800
a.
The above conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
X
b. It is recommended to use only bottom preheaters to reduce thermal
stress experienced by the LED.
Precautions
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. The customer is advised to perform a daily check on
the soldering profile to ensure that it always conforms to
the recommended soldering conditions.
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on the PC board.
For better control, it is recommended to use the proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
NOTE
1. PCBs with different size and design (component
density) will have different heat mass (heat
capacity). This might cause a change in
If manual lead cutting is necessary, cut the leads after the
soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress due to
lead cutting from traveling into LED package. This is highly
recommended for hand solder operation, as the excess
lead length also acts as small heat sink.
temperature experienced by the board if the
same wave soldering setting is used. So, it is
recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a
high efficiency LED die with single wire bond as
shown on the next page. The customer is advised
to take extra precautions during wave soldering
to ensure that the maximum wave temperature
does not exceed 260 °C and the solder contact
time does not exceed 5 s. Over-stressing the LED
during soldering process might cause premature
failure to the LED due to delamination.
Soldering and Handling
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
The LED component may be effectively hand soldered to
PCB. However, it is only recommended under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source (soldering
iron’s tip) to the body is 1.59 mm. Soldering the LED using
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Avago Technologies LED Configuration
The recommended PC board plated through holes (PTH)
size for LED component leads follows.
Avago Technologies LED Configuration
LED component lead
size
Plated through hole
diameter
Diagonal
0.45 mm × 0.45 mm
(0.018 in. × 0.018 in.)
0.636 mm
(0.025 in.)
0.98 mm to 1.08 mm
(0.039 in. to 0.043 in.)
0.50 mm × 0.50 mm
(0.020 in. × 0.020 in.)
0.707 mm
(0.028 in.)
1.05 mm to 1.15 mm
(0.041 in. to 0.045 in.)
Anode
Over-sizing the PTH can lead to a twisted LED after
clinching. On the other hand, under-sizing the PTH can
cause difficulty when inserting the TH LED.
NOTE Electrical connection between the bottom
surface of the LED die and the lead frame is
achieved through conductive paste.
Application Precautions
Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on the LED. Non- metal material is
recommended because it will absorb less heat during the
wave soldering process.
1. The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated in
the data sheet. Constant current driving is recommended
to ensure consistent performance.
2. LEDs exhibit slightly different characteristics at different
drive currents that might result in larger performance
variation (i.e., intensity, wavelength, and forward voltage).
The user is recommended to set the application current as
close as possible to the test current to minimize these
variations.
NOTE To further assist the customer in designing he
jig accurately that fits the Avago
Technologies’ product, a 3D model of the
product is available upon request.
At elevated temperatures, the LED is more susceptible to
mechanical stress. Therefore, the PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of the alignment fixture or pallet.
If the PCB board contains both through hole (TH) LEDs and
other surface mount components, it is recommended that
surface mount components be soldered on the top side of
the PCB. If surface mount must be on the bottom side,
these components should be soldered using reflow
soldering prior to insertion of the TH LED.
3. The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When driving
the LED in matrix form, it is crucial to ensure that the
reverse bias voltage does not exceed the allowable limit of
the LED.
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Example of Wave Soldering Temperature Profile for TH LED
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
4.00 0.20
0.1575 0.008
TYP
Ø
A
A
12.70 0.30
0.50 0.0118
VIEW A - A
0.70 0.20
0.0276 0.0079
NOTE All dimensions in millimeters (inches).
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Packaging Box for Ammo Packs
Packaging Box for Ammo Packs
NOTE The dimensions for the ammo pack are applicable for the device with standoff and without standoff.
Avago Technologies
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HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Packaging Label
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
(1P) Item: Part Number
RoHS Compliant
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Avago Technologies
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Example:
Acronyms and Definition
BIN:
(i) Color bin only or VF bin only
—
—
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without VF
bin OR part number with VF bins and no color bin)
(ii) Color bin incorporate with VF Bin
BIN: 2VB, where:
—
OR
2 is color bin 2 only
VB is VF bin "VB"
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin and
VF bin)
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or
assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or
applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage,
expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago Technologies and the A logo are trademarks of Avago Technologies in the United
States and other countries. All other brand and product names may be trademarks of their
respective companies.
Data subject to change. Copyright © 2013–2016 Avago Technologies. All Rights Reserved.
AV02-3174EN – June 3, 2016
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