HLMP-HM55-PQCXX [AVAGO]
5 mm Precision Optical Performance InGaN Oval LED Lamps; 5毫米精密光学性能的InGaN椭圆形LED灯
| 型号： | HLMP-HM55-PQCXX |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 5 mm Precision Optical Performance InGaN Oval LED Lamps |
| 文件： | 总12页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-HB55/HLMP-HM55/
HLMP-HB54/HLMP-HM54
5 mm Precision Optical Performance
InGaNOvalLEDLamps
DataSheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and
passenger information signs. The oval shaped
radiationpatternandhighluminousintensityensure
that this device is excellent for wide field of view
outdoor applications where a wide viewing angle
and readability in sunlight are essential. This lamp
hasverysmooth,matchedradiationpatternsensuring
consistent color mixing in full color applications,
message uniformity across the viewing angle of the
sign. High efficiency LED material is used in this
lamp: Indium Gallium Nitride for Blue and Green.
Each lamp is made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance in outdoor applications. The
packageepoxycontainsbothUV-aandUV-binhibitors
to reduce the effects of long term exposure to direct
sunlight. These lamps are available in two package
options (standoff and without standoff) to give
designer flexibility with device mounting.
• Well-defined spatial radiation pattern
• High brightness material
– Blue InGaN 470 nm
– Green InGaN 525 nm
Applications
• Full color signs
• Commercial outdoor advertising
Benefits
• Viewing angle designed for wide field of view appli-
cations
• Superior performance for outdoor environments
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions
during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Drawing A
NOTE: MEASURED JUST ABOVE FLANGE.
3.80
(0.150)
1.50
(0.059)
MAX.
0.50 ± 0.10
(0.019 ± 0.003)
0.70
MAX.
2.54
(0.10)
5.20
(0.204)
CATHODE
LEAD
1.00
(0.039)
MIN.
7.00
(0.275)
25.00
MIN.
(0.984)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
Package Drawing B
NOTE: MEASURED JUST ABOVE FLANGE.
10.85 ± 0.50
(0.427 ± 0.019)
3.80
(0.150)
0.50 ± 0.10
(0.019 ± 0.003)
1.20
(0.047)
2.54
(0.10)
5.20
(0.204)
CATHODE
LEAD
1.50
MAX.
(0.059)
1.00
(0.039)
MIN.
7.00
(0.275)
25.00
MIN.
(0.984)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
2
Device Selection Guide
Color and
Dominant
Wavelength λ
(nm)Typ.
Luminous
Intensity Iv
(mcd)at
Luminous
Intensity Iv
(mcd)at
Leads with
Standoff
Package
Drawing
Tinting
Type
d
Part Number
20 mA Min.
20 mA Max.
HLMP-HB54-FJ0xx
HLMP-HB55-HJCxx
Blue 470
Blue 470
110
180
310
310
No
A
B
Blue
Blue
Yes
HLMP-HB55-JKCxx
HLMP-HM54-MQ0xx
HLMP-HM55-MQ0xx
HLMP-HM55-NPCxx
Blue 470
240
520
520
680
880
400
Yes
No
B
A
B
B
B
Blue
Green 525
Green 525
Green 525
Green 525
1500
1500
1150
1500
Green
Green
Green
Green
Yes
Yes
Yes
HLMP-HM55-PQCxx
Notes:
1 The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the Chromaticity Diagram and represents the color of the lamp.
d
Part Numbering System
HLMP-X X XX – X X X XX
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
Color Bin Selections
0: No color bin limitation
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: 470 nm Blue
M: 525 nm Green
Package
H: 5 mm Oval 40° x 100°
3
Absolute Maximum Ratings at T = 25°C
A
Parameter
Value
[1]
DC Forward Current
30 mA
100 mA
117 mW
[2]
Peak Pulsed Forward Current
Power Dissipation
Reverse Voltage
5 V (I = 10 µA)
R
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130°C
–40°C to +80°C
–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 3.
2. Duty factor 10%, Frequency 1kHz
Electrical / Optical Characteristics Table
T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
I = 20 mA
Forward Voltage
Blue (λ = 470 nm)
V
F
3.2
3.2
3.7
3.9
V
d
F
Green (λ = 525 nm)
d
Reverse Voltage
Capacitance
V
R
5
I = 10 µA
R
Blue (λ = 470 nm)
C
40
pF
V = 0, f = 1 MHz
F
d
Green (λ = 525 nm)
d
Thermal Resistance
Rθ
240
°C/ W
deg
LED Junction-to-Cathode Lead
J-PIN
Viewing Angle
Major Axis
2θ
1/ 2
100
40
Minor Axis
Peak Wavelength
Blue (λ = 470 nm)
λ
467
520
nm
Peak of Wavelength of Spectral
d
P
Green (λ = 525 nm)
Distribution at I = 20 mA
d
F
Spectral Halfwidth
Blue (λ = 470 nm)
∆λ
24
35
nm
Wavelength Width at Spectral
d
1/ 2
Green (λ = 525 nm)
Distribution Power Point at I = 20 mA
d
F
Luminous Efficacy
Blue (λ = 470 nm)
η
75
520
lm/W
Emitted luminous power/ Emitted
radiant power
d
v
Green (λ = 525 nm)
d
Notes:
1. 2θ is the off-axis angle where the luminous intensity is / 2 the on axis intensity.
1
1/ 2
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ ηv where Iv is the luminous intensity in candelas and ηv
is the luminous efficacy in lumens/ watt.
4
1.0
0.8
0.6
0.4
BLUE
GREEN
0.2
0
400
450
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
35
30
25
20
15
10
5
0
0
5
10
15
20
25
30
0
10 20 30 40 50 60 70 80 90
FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
Figure 2. Relative luminous intensity vs.
forward current.
Figure 3. Forward current vs. ambient temperature.
30
25
20
15
10
5
1.035
1.030
1.025
GREEN
1.020
1.015
1.010
1.005
BLUE
1.000
0.995
0.990
0.985
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
FORWARD VOLTAGE – V
0
5
10
15
20
25
30
FORWARD CURRENT – mA
Figure 4. Forward current vs. forward voltage.
Figure 5. Relative dominant wavelength vs.
forward current.
5
1.0
0.5
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 6. Spatial radiation pattern – minor axis.
1.0
0.5
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 7. Spatial radiation pattern – major axis.
Intensity Bin Limits
(mcd @ 20 mA)
Bin Name
Min.
110
140
180
240
310
400
520
680
880
1150
1500
Max.
140
F
G
H
J
180
240
310
K
L
M
N
P
400
520
680
880
1150
1500
1900
Q
R
Tolerance will be ±15% of these limits.
6
Green Color Bin Table
Bin
Min. Dom.
Max. Dom.
Xmin.
0.0743
0.1650
0.1060
0.1856
0.1387
0.2068
0.1702
0.2273
0.2003
0.2469
Ymin.
0.8338
0.6586
0.8292
0.6556
0.8148
0.6463
0.7965
0.6344
0.7764
0.6213
Xmax.
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
Ymax.
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
1
520.0
524.0
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is ± 0.5 nm
Blue Color Bin Table
Bin
Min. Dom.
Max. Dom.
Xmin.
0.1440
0.1818
0.1374
0.1766
0.1291
0.1699
0.1187
0.1616
0.1063
0.1517
Ymin.
0.0297
0.0904
0.0374
0.0966
0.0495
0.1062
0.0671
0.1209
0.0945
0.1423
Xmax.
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
Ymax.
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
1
460.0
464.0
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
7
Avago Color Bin on CIE Chromaticity Diagram
CIE 1931 – Chromaticity Diagram
1.000
0.800
1
2
3
4
5
Green
0.600
0.400
0.200
0.000
Y
Blue
5
4
3
2
1
0.000
0.200
0.400
X
0.600
0.800
8
Relative Light Output vs. Junction Temperature
1.2
1.0
BLUE
GREEN
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
80
T
– JUNCTION TEMPERATURE – °C
J
Precautions:
Lead Forming
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodicallycheckonthesolderingprofiletoensurethe
soldering profile used is always conforming to
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
recommended soldering condition.
Notes:
1. PCB with different size and design (component density)
will have different heat mass (heat capacity). This might
cause a change in temperature experienced by the board if
same wave soldering setting is used. So, it is recommended
to recalibrate the soldering profile again before loading a
new type of PCB.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
2. Avago Technologies' high brightness LED are using high
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
is not exceeding 250°C. Overstressing the LED during
soldering process might cause premature failure to the LED
due to delamination.
Soldering Conditions
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to LED component.
• TheclosestLEDisallowedtosolderonboardis1.59mm
below the body (encapsulant epoxy) for those parts
without standoff.
• Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
260 °C Max.
5 sec Max.
9
Avago Technologies LED Configuration
CATHODE
Note: Electrical connection between bottom surface of LED die
and the lead frame material through conductive paste of solder.
• Ifnecessary,usefixturetoholdtheLEDcomponent • Recommended PC board plated through hole sizes for
in proper orientation with respect to the PCB
during soldering process.
LED component leads:
LED Component
Plated Through
Hole Diameter
Lead Size
Diagonal
• At elevated temperature, the LED is more
susceptible to mechanical stress. Therefore, PCB 0.457 x 0.457 mm
must be allowed to cool down to room temperature (0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
prior to handling, which includes removal of jigs,
fixtures or pallet.
0.508 x 0.508 mm
0.718 mm
1.049 to 1.150 mm
(0.041 to 0.045 inch)
(0.020 x 0.020 inch)
(0.028 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
• Specialattentionmustbegiventoboardfabrication,
solder masking, surface platting and lead holes
size and component orientation to assure the
solderability.
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can
lead to mechanical stress on the epoxy lens during
clinching.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
FLUXING
CONVEYOR SPEED = 1.83 M/ MIN (6 FT/ MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEAD SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
20 30
0
10
40
50
60
70
80
90
100
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
10
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.025)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
A
4.00 ± 0.20
(0.1575 ± 0.0079)
12.70 ± 0.30
(0.50 ± 0.0118)
TYP.
VIEW A–A
0.70 ± 0.20
(0.0276 ± 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff.
Packaging Box Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARDS.
+
A
AVAGO
ANODE
–
CATHODE
TECHNOLOGIES
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
C
O
M
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
11
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR
DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS
SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL
LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4145EN
AV02-0206EN March 20, 2007
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